SN54LVTH16244A_09 [TI]

3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS; 3.3 -V ABT 16位缓冲器/驱动器,具有三态输出
SN54LVTH16244A_09
型号: SN54LVTH16244A_09
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
3.3 -V ABT 16位缓冲器/驱动器,具有三态输出

驱动器 输出元件
文件: 总21页 (文件大小:649K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN54LVTH16244A, SN74LVTH16244A  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS142TMAY 1992REVISED NOVEMBER 2006  
FEATURES  
SN54LVTH16244A . . . WD PACKAGE  
SN74LVTH16244A . . . DGG, DGV, OR DL PACKAGE  
(TOP VIEW)  
Members of the Texas Instruments  
Widebus™ Family  
State-of-the-Art Advanced BiCMOS  
Technology (ABT) Design for 3.3-V  
Operation and Low Static-Power  
Dissipation  
1
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
1OE  
1Y1  
1Y2  
GND  
1Y3  
1Y4  
2OE  
1A1  
1A2  
GND  
1A3  
1A4  
2
3
4
Support Mixed-Mode Signal Operation  
(5-V Input and Output Voltages With  
5
6
3.3-V VCC  
)
7
V
CC  
V
CC  
Support Unregulated Battery Operation  
Down to 2.7 V  
8
2Y1  
2Y2  
GND  
2Y3  
2Y4  
3Y1  
3Y2  
GND  
3Y3  
3Y4  
2A1  
2A2  
GND  
2A3  
2A4  
3A1  
3A2  
GND  
3A3  
3A4  
9
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Ioff and Power-Up 3-State Support Hot  
Insertion  
Bus Hold on Data Inputs Eliminates the Need  
for External Pullup/Pulldown Resistors  
Latch-Up Performance Exceeds 500 mA  
Per JESD 17  
V
CC  
V
CC  
ESD Protection Exceeds JESD 22  
4Y1  
4Y2  
GND  
4Y3  
4Y4  
4OE  
4A1  
4A2  
GND  
4A3  
4A4  
3OE  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
DESCRIPTION/ORDERING INFORMATION  
The 'LVTH16244A devices are 16-bit buffers and line drivers designed for low-voltage (3.3-V) VCC operation, but  
with the capability to provide a TTL interface to a 5-V system environment. These devices can be used as four  
4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical  
active-low output-enable (OE) inputs.  
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown  
resistors with the bus-hold circuitry is not recommended.  
When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.  
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;  
the minimum value of the resistor is determined by the current-sinking capability of the driver.  
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry  
disables the outputs, preventing damaging current backflow through the devices when they are powered down.  
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1992–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN54LVTH16244A, SN74LVTH16244A  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS142TMAY 1992REVISED NOVEMBER 2006  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
FBGA – GRD  
SN74LVTH16244AGRDR  
SN74LVTH16244AZRDR  
SN74LVTH16244ADL  
Reel of 1000  
Tube of 25  
LL244A  
FBGA – ZRD (Pb-free)  
SN74LVTH16244ADLG4  
SN74LVTH16244ADLR  
74LVTH16244ADLRG4  
SN74LVTH16244ADGGR  
74LVTH16244ADGGRE4  
74LVTH16244ADGGRG4  
SN74LVTH16244ADGVR  
74LVTH16244ADGVRE4  
SN74LVTH16244AGQLR  
SN74LVTH16244AZQLR  
SNJ54LVTH16244AWD  
SSOP – DL  
LVTH16244A  
Reel of 1000  
–40°C to 85°C  
TSSOP – DGG  
TVSOP – DGV  
Reel of 2000  
Reel of 2000  
LVTH16244A  
LL244A  
VFBGA – GQL  
Reel of 1000  
Tube  
LL244A  
VFBGA – ZQL (Pb-free)  
–55°C to 125°C CFP – WD  
SNJ54LVTH16244AWD  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
2
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SN54LVTH16244A, SN74LVTH16244A  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS142TMAY 1992REVISED NOVEMBER 2006  
TERMINAL ASSIGNMENTS(1)  
(56-Ball GQL/ZQL Package)  
GQL OR ZQL PACKAGE  
(TOP VIEW)  
1 2 3 4 5  
6
1
2
3
4
5
6
A
B
C
D
E
F
1OE  
1Y2  
1Y4  
2Y2  
2Y4  
3Y1  
3Y3  
4Y1  
4Y3  
4OE  
NC  
NC  
NC  
NC  
2OE  
1A2  
1A4  
2A2  
2A4  
3A1  
3A3  
4A1  
4A3  
3OE  
A
B
C
D
E
F
G
H
J
1Y1  
1Y3  
2Y1  
2Y3  
3Y2  
3Y4  
4Y2  
4Y4  
NC  
GND  
VCC  
GND  
GND  
VCC  
GND  
1A1  
1A3  
2A1  
2A3  
3A2  
3A4  
4A2  
4A4  
NC  
G
H
J
GND  
VCC  
GND  
NC  
GND  
VCC  
GND  
NC  
K
blk  
blk  
blk  
K
(1) NC – No internal connection  
xxxxx  
xxxxx  
xxxxx  
TERMINAL ASSIGNMENTS(1)  
(54-Ball GRD/ZRD Package)  
GRD OR ZRD PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
1
2
3
4
5
6
A
B
C
D
E
F
1Y1  
1Y3  
2Y1  
2Y3  
3Y1  
3Y3  
4Y1  
4Y3  
4Y4  
NC  
1OE  
NC  
2OE  
NC  
NC  
1A1  
1A3  
2A1  
2A3  
3A1  
3A3  
4A1  
4A3  
4A4  
A
B
C
D
1Y2  
1Y4  
2Y2  
2Y4  
3Y2  
3Y4  
4Y2  
NC  
1A2  
1A4  
2A2  
2A4  
3A2  
3A4  
4A2  
NC  
VCC  
GND  
GND  
GND  
VCC  
NC  
VCC  
GND  
GND  
GND  
VCC  
NC  
E
F
G
H
J
G
H
J
4OE  
3OE  
(1) NC – No internal connection  
3
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SN54LVTH16244A, SN74LVTH16244A  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS142TMAY 1992REVISED NOVEMBER 2006  
FUNCTION TABLE  
(EACH 4-BIT BUFFER)  
INPUTS  
OUTPUT  
Y
OE  
L
A
H
L
H
L
L
H
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
25  
1OE  
1A1  
3OE  
47  
46  
2
3
5
6
36  
35  
33  
32  
13  
14  
16  
17  
1Y1  
1Y2  
1Y3  
1Y4  
3A1  
3A2  
3A3  
3A4  
3Y1  
3Y2  
3Y3  
3Y4  
1A2  
1A3  
1A4  
44  
43  
48  
41  
40  
24  
30  
29  
2OE  
2A1  
2A2  
2A3  
2A4  
4OE  
4A1  
4A2  
4A3  
4A4  
8
9
19  
20  
22  
23  
2Y1  
2Y2  
2Y3  
2Y4  
4Y1  
4Y2  
4Y3  
4Y4  
38  
37  
11  
12  
27  
26  
Pin numbers shown are for the DGG, DGV, DL, and WD packages.  
4
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SN54LVTH16244A, SN74LVTH16244A  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS142TMAY 1992REVISED NOVEMBER 2006  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
MAX  
UNIT  
V
VCC Supply voltage range  
4.6  
VI  
Input voltage range(2)  
7
V
VO  
VO  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high state(2)  
7
VCC + 0.5  
96  
V
V
V
SN54LVTH16244A  
Current into any output in the low state  
IO  
SN74LVTH16244A  
128  
48  
SN54LVTH16244A  
Current into any output in the high state(3)  
SN74LVTH16244A  
IO  
64  
IIK  
Input clamp current  
Output clamp current  
VI < 0  
–50  
–50  
70  
mA  
mA  
IOK  
VO < 0  
DGG package  
DGV package  
DL package  
GQL/ZQL package  
GRD/ZRD package  
58  
θJA  
Package thermal impedance(4)  
63  
°C/W  
42  
36  
Tstg  
Storage temperature range  
–65  
150  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
(3) The current flows only when the output is in the high state and VO > VCC  
.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
Recommended Operating Conditions(1)  
SN54LVTH16244A SN74LVTH16244A  
UNIT  
MIN  
2.7  
2
MAX  
MIN  
2.7  
2
MAX  
VCC  
VIH  
VIL  
Supply voltage  
3.6  
3.6  
V
V
High-level input voltage  
Low-level input voltage  
Input voltage  
0.8  
5.5  
–25  
48  
0.8  
5.5  
–32  
64  
V
VI  
V
IOH  
IOL  
High-level output current  
Low-level output current  
Input transition rise or fall rate  
mA  
mA  
ns/V  
µs/V  
°C  
t/v  
Outputs enabled  
10  
10  
t/VCC Power-up ramp rate  
TA Operating free-air temperature  
200  
–55  
200  
–40  
125  
85  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
5
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SN54LVTH16244A, SN74LVTH16244A  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS142TMAY 1992REVISED NOVEMBER 2006  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
SN54LVTH16244A  
SN74LVTH16244A  
MIN TYP(1)  
PARAMETER  
VIK  
TEST CONDITIONS  
UNIT  
MIN TYP(1)  
MAX  
MAX  
–1.2  
VCC = 2.7 V,  
II = –18 mA  
–1.2  
V
VCC = 2.7 V to 3.6 V, IOL = –100 µA  
VCC – 0.2  
VCC – 0.2  
VCC = 2.7 V,  
IOH = –8 mA  
IOH = –24 mA  
IOH = –32 mA  
IOL = 100 µA  
IOL = 24 mA  
IOL = 16 mA  
IOL = 32 mA  
IOL = 48 mA  
IOL = 64 mA  
VI = 5.5 V  
2.4  
2
2.4  
VOH  
V
V
VCC = 3 V  
2
0.2  
0.5  
0.2  
0.5  
0.4  
0.5  
VCC = 2.7 V  
VCC = 3 V  
0.4  
VOL  
0.5  
0.55  
0.55  
10  
VCC = 0 or 3.6 V,  
VCC = 3.6 V,  
50  
Control  
inputs  
VI = VCC or GND  
±1  
±1  
II  
µA  
VI = VCC  
1
1
–5  
Data  
inputs  
VCC = 3.6 V  
VCC = 0,  
VI = 0  
–5  
Ioff  
VI or VO = 0 to 4.5 V  
VI = 0.8 V  
VI = 2 V  
±100  
µA  
µA  
75  
75  
VCC = 3 V  
Data  
–75  
–75  
II(hold)  
inputs  
500  
– 750  
VCC = 3.6 V(2)  
,
VI = 0 to 3.6 V  
IOZH  
IOZL  
VCC = 3.6 V,  
VCC = 3.6 V,  
VO = 3 V  
5
5
µA  
µA  
VO = 0.5 V  
–5  
–5  
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,  
OE = don't care  
IOZPU  
IOZPD  
±100(3)  
±100(3)  
±100  
±100  
µA  
µA  
VCC = 1.5 V to 0, VO = 0.5 V to 3 V,  
OE = don't care  
Outputs high  
VCC = 3.6 V,  
0.19  
5
0.19  
5
ICC  
IO = 0,  
Outputs low  
mA  
mA  
VI = VCC or GND  
Outputs disabled  
0.19  
0.19  
VCC = 3 V to 3.6 V, One input at VCC – 0.6 V,  
Other inputs at VCC or GND  
(4)  
ICC  
0.2  
0.2  
Ci  
VI = 3 V or 0 V  
VO = 3 V or 0 V  
4
9
4
9
pF  
pF  
Co  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
(2) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to  
another.  
(3) On products compliant to MIL-PRF-38535, this parameter does not apply.  
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.  
6
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SN54LVTH16244A, SN74LVTH16244A  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS142TMAY 1992REVISED NOVEMBER 2006  
Switching Characteristics  
over recommended operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1 )  
SN54LVTH16244A  
VCC = 3.3 V  
SN74LVTH16244A  
VCC = 3.3 V  
± 0.3 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
VCC = 2.7 V  
VCC = 2.7 V  
UNIT  
± 0.3 V  
MIN  
1.1  
MAX  
4.4  
3.6  
4.6  
5.4  
5.7  
5
MIN MAX  
MIN TYP(1)  
MAX MIN  
MAX  
3.7  
3.7  
5
tPLH  
tPHL  
4.6  
3.9  
5.4  
6.2  
6.2  
4.7  
1.2  
1.2  
1.2  
1.2  
2.2  
2
2.3  
2
3.2  
3.2  
4
A
Y
Y
Y
ns  
ns  
ns  
ns  
1.1  
tPZH  
1.1  
2.6  
2.7  
3.3  
3.1  
OE  
OE  
tPZL  
1.1  
4
5
tPHZ  
1.6  
4.5  
4.2  
0.5  
0.5  
5
tPLZ  
1.2  
4.4  
tsk(LH)  
tsk(HL)  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
7
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SN54LVTH16244A, SN74LVTH16244A  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS142TMAY 1992REVISED NOVEMBER 2006  
PARAMETER MEASUREMENT INFORMATION  
6 V  
Open  
S1  
500 Ω  
TEST  
/t  
S1  
From Output  
Under Test  
GND  
t
t
t
Open  
6 V  
GND  
PLH PHL  
/t  
PLZ PZL  
C = 50 pF  
L
500 Ω  
/t  
PHZ PZH  
(see Note A)  
2.7 V  
0 V  
LOAD CIRCUIT  
Timing Input  
Data Input  
1.5 V  
t
w
t
t
h
su  
2.7 V  
0 V  
2.7 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
2.7 V  
0 V  
2.7 V  
0 V  
Output  
Control  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
t
t
PLZ  
PZL  
t
t
t
PHL  
PLH  
Output  
Waveform 1  
S1 at 6 V  
V
V
3 V  
OH  
Output  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
V
+ 0.3 V  
OL  
V
OL  
(see Note B)  
OL  
t
t
t
PZH  
PHZ  
PHL  
PLH  
Output  
Waveform 2  
S1 at GND  
V
V
V
OH  
OH  
V
− 0.3 V  
OH  
1.5 V  
VOLTAGE WAVEFORMS  
1.5 V  
Output  
0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
8
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PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
5962-9668501QXA  
5962-9668501VXA  
ACTIVE  
ACTIVE  
ACTIVE  
CFP  
WD  
48  
48  
48  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
CFP  
WD  
74LVTH16244ADGGRE4  
TSSOP  
DGG  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
74LVTH16244ADGGRG4  
74LVTH16244ADGVRE4  
74LVTH16244ADGVRG4  
74LVTH16244ADLRG4  
SN74LVTH16244ADGGR  
SN74LVTH16244ADGVR  
SN74LVTH16244ADL  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
NRND  
TSSOP  
TVSOP  
TVSOP  
SSOP  
DGG  
DGV  
DGV  
DL  
48  
48  
48  
48  
48  
48  
48  
48  
48  
56  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TVSOP  
SSOP  
DGG  
DGV  
DL  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVTH16244ADLG4  
SN74LVTH16244ADLR  
SN74LVTH16244AGQLR  
SSOP  
DL  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
BGA MI  
CROSTA  
R JUNI  
OR  
GQL  
1000  
TBD  
SNPB  
Level-1-240C-UNLIM  
Level-1-240C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
SN74LVTH16244AGRDR  
SN74LVTH16244AZQLR  
SN74LVTH16244AZRDR  
SNJ54LVTH16244AWD  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
BGA MI  
CROSTA  
R JUNI  
OR  
GRD  
ZQL  
ZRD  
WD  
54  
56  
54  
48  
1000  
TBD  
SNPB  
BGA MI  
CROSTA  
R JUNI  
OR  
1000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
SNAGCU  
A42  
BGA MI  
CROSTA  
R JUNI  
OR  
1000 Green (RoHS &  
no Sb/Br)  
CFP  
1
TBD  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN54LVTH16244A, SN54LVTH16244A-SP, SN74LVTH16244A :  
Enhanced Product: SN74LVTH16244A-EP  
NOTE: Qualified Version Definitions:  
Enhanced Product - Supports Defense, Aerospace and Medical Applications  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Aug-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LVTH16244ADGGR TSSOP  
SN74LVTH16244ADGVR TVSOP  
DGG  
DGV  
DL  
48  
48  
48  
56  
2000  
2000  
1000  
1000  
330.0  
330.0  
330.0  
330.0  
24.4  
16.4  
32.4  
16.4  
8.6  
7.1  
15.8  
10.2  
1.8  
1.6  
12.0  
12.0  
16.0  
8.0  
24.0  
16.0  
32.0  
16.0  
Q1  
Q1  
Q1  
Q1  
SN74LVTH16244ADLR  
SSOP  
11.35 16.2  
3.1  
SN74LVTH16244AGQLR BGA MI  
GQL  
4.8  
5.8  
4.8  
5.8  
7.3  
8.3  
7.3  
8.3  
1.45  
CROSTA  
R JUNI  
OR  
SN74LVTH16244AGRDR BGA MI  
GRD  
ZQL  
ZRD  
54  
56  
54  
1000  
1000  
1000  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
1.55  
1.45  
1.55  
8.0  
8.0  
8.0  
16.0  
16.0  
16.0  
Q1  
Q1  
Q1  
CROSTA  
R JUNI  
OR  
SN74LVTH16244AZQLR BGA MI  
CROSTA  
R JUNI  
OR  
SN74LVTH16244AZRDR BGA MI  
CROSTA  
R JUNI  
OR  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Aug-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
SN74LVTH16244ADGGR  
SN74LVTH16244ADGVR  
SN74LVTH16244ADLR  
TSSOP  
TVSOP  
SSOP  
DGG  
DGV  
DL  
48  
48  
48  
56  
2000  
2000  
1000  
1000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
41.0  
33.0  
49.0  
33.0  
SN74LVTH16244AGQLR BGA MICROSTAR  
JUNIOR  
GQL  
SN74LVTH16244AGRDR BGA MICROSTAR  
JUNIOR  
GRD  
ZQL  
ZRD  
54  
56  
54  
1000  
1000  
1000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
33.0  
SN74LVTH16244AZQLR BGA MICROSTAR  
JUNIOR  
SN74LVTH16244AZRDR BGA MICROSTAR  
JUNIOR  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001  
DL (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0.025 (0,635)  
48  
0.0135 (0,343)  
0.008 (0,203)  
0.005 (0,13)  
M
25  
0.010 (0,25)  
0.005 (0,13)  
0.299 (7,59)  
0.291 (7,39)  
0.420 (10,67)  
0.395 (10,03)  
Gage Plane  
0.010 (0,25)  
0°ā8°  
1
24  
0.040 (1,02)  
0.020 (0,51)  
A
Seating Plane  
0.004 (0,10)  
0.008 (0,20) MIN  
PINS **  
0.110 (2,79) MAX  
28  
48  
0.630  
56  
DIM  
0.380  
(9,65)  
0.730  
A MAX  
A MIN  
(16,00) (18,54)  
0.370  
(9,40)  
0.620  
0.720  
(15,75) (18,29)  
4040048/E 12/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MO-118  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MCFP010B – JANUARY 1995 – REVISED NOVEMBER 1997  
WD (R-GDFP-F**)  
CERAMIC DUAL FLATPACK  
48 LEADS SHOWN  
0.120 (3,05)  
0.075 (1,91)  
0.009 (0,23)  
0.004 (0,10)  
1.130 (28,70)  
0.870 (22,10)  
0.370 (9,40)  
0.250 (6,35)  
0.390 (9,91)  
0.370 (9,40)  
0.370 (9,40)  
0.250 (6,35)  
1
48  
0.025 (0,635)  
A
0.014 (0,36)  
0.008 (0,20)  
24  
25  
NO. OF  
LEADS**  
48  
56  
0.740  
0.640  
(16,26) (18,80)  
A MAX  
A MIN  
0.610 0.710  
(15,49) (18,03)  
4040176/D 10/97  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. This package can be hermetically sealed with a ceramic lid using glass frit.  
D. Index point is provided on cap for terminal identification only  
E. Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO-146AA  
GDFP1-F56 and JEDEC MO-146AB  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
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