SN74ABT16241ADGGR [TI]

暂无描述;


型号：	SN74ABT16241ADGGR
厂家：	TEXAS INSTRUMENTS
描述：	暂无描述驱动器输出元件
文件：	总8页 (文件大小：138K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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ꢇ ꢈ ꢊꢅꢋ ꢆꢌ ꢅꢍꢎ ꢎꢏ ꢐꢑ ꢒ ꢐꢋ ꢓ ꢏ ꢐ

ꢔ ꢋꢆ ꢕꢌ ꢖ ꢊꢀꢆꢄꢆ ꢏꢌ ꢗꢍ ꢆꢘ ꢍꢆ ꢀ

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SCBS347 − MAY 1994

DL PACKAGE

(TOP VIEW)

• Member of the Texas Instruments

Widebus  Family

• State-of-the-Art EPIC-ΙΙB  BiCMOS Design

1OE

1Y1

1Y2

GND

1Y3

1Y4

2OE

1A1

1A2

GND

1A3

1A4

Significantly Reduces Power Dissipation

• Typical V

(Output Ground Bounce)

OLP

< 1 V at V

= 5 V, T = 25°C

• Distributed V

and GND Pin Configuration

Minimizes High-Speed Switching Noise

• Flow-Through Architecture Optimizes

PCB Layout

2Y1

2Y2

GND

2Y3

2Y4

3Y1

3Y2

GND

3Y3

3Y4

2A1

2A2

GND

2A3

2A4

3A1

3A2

GND

3A3

3A4

• High-Drive Outputs (−32-mA I

64-mA I

)

• Packaged in Plastic 300-mil Shrink

Small-Outline (SSOP) Packages

description

The SN74ABT16241 is a 16-bit buffer and line

driver designed specifically to improve both the

performance and density of 3-state memory

address drivers, clock drivers, and bus-oriented

receivers and transmitters. The device can be

used as four 4-bit buffers, two 8-bit buffers, or one

16-bit buffer. This device provides true outputs

and complementary output-enable (OE and OE)

inputs.

4Y1

4Y2

GND

4Y3

4Y4

4A1

4A2

GND

4A3

4A4

3OE

4OE

To ensure the high-impedance state during power

up or power down, OE should be tied to V

through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of

the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined

by the current-sourcing capability of the driver.

The SN74ABT16241 is available in TI’s shrink small-outline package (DL), which provides twice the I/O pin

count and functionality of standard small-outline packages in the same printed-circuit-board area.

The SN74ABT16241 is characterized for operation from −40°C to 85°C.

FUNCTION TABLE

INPUTS

OUTPUTS

1Y, 4Y

OUTPUTS

2Y, 3Y

1A, 4A

1OE, 4OE

2OE, 3OE

2A, 3A

Widebus and EPIC-ΙΙB are trademarks of Texas Instruments Incorporated.

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2−1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443

ꢀꢁ ꢂ ꢃꢄ ꢅ ꢆ ꢇꢈꢉ ꢃ ꢇ

ꢇ ꢈꢊ ꢅꢋ ꢆ ꢌ ꢅ ꢍꢎ ꢎꢏ ꢐꢑ ꢒꢐ ꢋ ꢓꢏ ꢐ

ꢔꢋ ꢆ ꢕ ꢌꢖ ꢊꢀ ꢆꢄꢆꢏ ꢌ ꢗ ꢍꢆ ꢘꢍꢆ ꢀ

ꢀꢘ ꢋꢙꢏ ꢌꢋꢑ ꢗ ꢌ ꢚꢗ ꢒ ꢏ ꢛ

SCBS347 − MAY 1994

logic diagram (positive logic)

3OE

3A1

3A2

1OE

3Y1

3Y2

3Y3

3Y4

1Y1

1Y2

1Y3

1Y4

1A1

1A2

1A3

3A3

3A4

4OE

4A1

4A2

4A3

4A4

1A4

2OE

4Y1

4Y2

4Y3

4Y4

2Y1

2Y2

2Y3

2Y4

2A1

2A2

2A3

2A4

SPICE block diagram

Node 6

Node 199

Node 100

Node 1

Node 2

Node 4

Node 5

ABT16241IN

ABT16241OUT

SPICE FUNCTION TABLE

NODE

OPERATION

Input

Output

Hi-Z

2−2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

^{POST OFFICE BOX 1443}• HOUSTON, TEXAS 77251−1443

ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢉꢃꢇ

ꢇ ꢈ ꢊꢅꢋ ꢆꢌ ꢅꢍꢎ ꢎ ꢏꢐ ꢑ ꢒꢐ ꢋ ꢓꢏ ꢐ

ꢔ ꢋꢆ ꢕꢌ ꢖ ꢊꢀꢆꢄꢆ ꢏꢌ ꢗ ꢍꢆ ꢘꢍ ꢆꢀ

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SCBS347 − MAY 1994

SPICE netlist

ABT16241 SPICE I/O MODEL SUBCIRCUIT

ADVANCED BUS INTERFACE

ADVANCED SYSTEM LOGIC, TEXAS INSTRUMENTS

SUBCIRCUITS: ABT16241IN, ABT16241OUT

PACKAGE PARASITICS

.LIB ’PKGS.LIB’

PROCESS MODELS

SSOP48

.LIB ’EPIC2B.LIB’ NOMINAL_L13

.LIB ’EPIC2B.LIB’ STRONG_L13

.LIB ’EPIC2B.LIB’ WEAK_L13

* ABT16241 INPUT SUBCIRCUIT

NODES:

INPUT NODE

INTERNAL OUTPUT NODE

VCC

GND

199

.SUBCKT ABT16241IN

X_PKGIN

X_PKGVCC

X_PKGGND

100

1001

1199

1100

SSOP48_47

SSOP48_07

SSOP48_04

ABT16241__IN

199

100

1001

XABT16241IN

.ENDS ABT16241IN

1199 1100

* ABT16241 OUTPUT SUBCIRCUIT

NODES:

INTERNAL INPUT NODE

OUTPUT NODE

INTERNAL OE NODE

VCC

GND

.SUBCKT ABT16241OUT

X_PKGOUT

X_PKGVCC

X_PKGGND

199

100

1005

1199

1100

1005

SSOP48_02

SSOP48_07

SSOP48_04

199

100

XABT16241OUT

.ENDS ABT16241OUT

1199 1100 ABT16241__OUT

.SUBCKT ABT16241__IN

501

506

599

500

508

507

506

500

507

502

599

500

599

500

XP1

502

509

506

508

502

509

599

501

504

506

501

505

501

502

504

502

509

500

504

502

500

508

507

500

505

507

504

500

WP=200U

WP=20U

WP=85U

WP=50U

WN=220U

WN=20U

LP=0.8U

LN=0.8U

XP2

XP3

XP4

XN1

XN2

XN4

Q2_NPN

Q5_NPN

Q7_NPN

Q5_NPN

RMOS

Q_ESD1

Q_ESD

XR1

200

WR=4U

0.3P

0.2P

507

RES=6K

RESD1

RESD2

CBP

.ENDS ABT16241__IN

.SUBCKT ABT16241__OUT

601

699

621

605

699

605

608

602

699

600

603

699

600

XP1

605

601

613

618

607

603

601

603

612

601

WP=200U

WP=40U

WP=30U

WP=50U

WP=60U

WN=100U

LP=0.8U

LN=0.8U

XP4

XP5

XP10

XP11

XN1

2−3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

^{POST OFFICE BOX 1443}• HOUSTON, TEXAS 77251−1443

ꢀꢁ ꢂ ꢃꢄ ꢅ ꢆ ꢇꢈꢉ ꢃ ꢇ

ꢇ ꢈꢊ ꢅꢋ ꢆ ꢌ ꢅ ꢍꢎ ꢎꢏ ꢐꢑ ꢒꢐ ꢋ ꢓꢏ ꢐ

ꢔꢋ ꢆ ꢕ ꢌꢖ ꢊꢀ ꢆꢄꢆꢏ ꢌ ꢗ ꢍꢆ ꢘꢍꢆ ꢀ

ꢀꢘ ꢋꢙꢏ ꢌꢋꢑ ꢗ ꢌ ꢚꢗ ꢒ ꢏ ꢛ

SCBS347 − MAY 1994

SPICE netlist (continued)

XN2

606

608

613

602

621

601

619

620

613

616

602

614

615

613

699

606

607

614

616

619

670

671

604

671

673

608

674

675

612

609

622

610

611

602

619

609

603

621

603

622

619

604

601

615

608

613

614

615

614

617

605

606

605

617

618

603

671

670

604

612

673

602

609

611

609

601

603

610

600

607

600

621

620

602

600

602

600

615

616

613

600

WN=50U

WN=25U

WN=80U

WN=25U

WN=100U

WN=10U

WN=20U

WN=25U

WN=40U

200

LN=0.8U

XN3

XN4

XN6

XN7

XN8

XN9

XN10

XN11

XN12

QM1

Q9_NPN

Q11_NPN

Q4_NPN

Q2_NPN

D1_GDS

D9_GSD

RMOS

QM2

600

QM3

QD4

QDR1

156

4700

XR1

605

606

605

606

605

WR=6U

WR=4U

WR=6U

RES=1K

RES=3K

RES=1K

XR2

XR3

XR10

618

699

600

670

604

674

618

699

600

670

604

600

RMOS

WR=3U

WP=50U

WN=30U

WR=3U

WN=250U

800

RES=20K

LP=0.8U

LN=0.8U

RES=20K

RES=1.5K

LN=0.8U

XPVREF

XNVREF

XRVREF1

XRVREF2

XNCLAMP

DCLAMP1

DCLAMP2

XPNOR1

XPNOR2

XNNOR1

XNNOR2

XP_INV1

XN_INV1

XP_INV2

XN_INV2

XP_INV3

XN_INV3

XP_INV4

XN_INV4

CBP

D6_GSD

800

699

675

600

699

600

699

600

699

600

699

600

699

600

699

600

699

600

699

600

699

600

WP=30U

WN=6U

WP=20U

WN=10U

WP=15U

WN=5U

WP=4U

WN=4U

WP=4U

WN=4U

0.3P

LP=0.8U

LN=0.8U

LP=0.8U

LN=0.8U

LP=0.8U

LN=0.8U

LP=0.8U

LN=0.8U

LP=0.8U

LN=0.8U

.ENDS ABT16241__OUT

2−4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

^{POST OFFICE BOX 1443}• HOUSTON, TEXAS 77251−1443

PACKAGE OPTION ADDENDUM

www.ti.com

30-Mar-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

DGG

SN74ABT16241DGGR

SN74ABT16241DL

SN74ABT16241DLR

OBSOLETE TSSOP

TBD

Call TI

OBSOLETE

SSOP

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

no Sb/Br)

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

MECHANICAL DATA

MTSS003D – JANUARY 1995 – REVISED JANUARY 1998

DGG (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

48 PINS SHOWN

0,27

0,17

0,08

0,50

6,20

6,00

8,30

7,90

0,15 NOM

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

A MAX

12,60

12,40

14,10

13,90

17,10

16,90

A MIN

4040078/F 12/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001

DL (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

48 PINS SHOWN

0.025 (0,635)

0.0135 (0,343)

0.008 (0,203)

0.005 (0,13)

0.010 (0,25)

0.005 (0,13)

0.299 (7,59)

0.291 (7,39)

0.420 (10,67)

0.395 (10,03)

Gage Plane

0.010 (0,25)

0°–ā8°

0.040 (1,02)

0.020 (0,51)

Seating Plane

0.004 (0,10)

0.008 (0,20) MIN

PINS **

0.110 (2,79) MAX

0.630

DIM

0.380

(9,65)

0.730

A MAX

A MIN

(16,00) (18,54)

0.370

(9,40)

0.620

0.720

(15,75) (18,29)

4040048/E 12/01

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).

D. Falls within JEDEC MO-118

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SN74ABT16241ADGGR [TI]

相关型号：

SN74ABT16241ADGV

SN74ABT16241ADGVR

SN74ABT16241ADL

SN74ABT16241ADLR

SN74ABT16241ADLRG4

SN74ABT16241DGGR

SN74ABT16241DL

SN74ABT16241DLR

SN74ABT16244A

SN74ABT16244ADGG

SN74ABT16244ADGGR

SN74ABT16244ADGGRTR