SN74AC245DWRG4 [TI]
Octal Bus Transceivers With 3-State Outputs 20-SOIC -40 to 85;
| 型号： | SN74AC245DWRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Octal Bus Transceivers With 3-State Outputs 20-SOIC -40 to 85 光电二极管 逻辑集成电路 |
| 文件： | 总18页 (文件大小：702K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003
SN54AC245 . . . J OR W PACKAGE
SN74AC245 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
D
2-V to 6-V V
Operation
CC
Inputs Accept Voltages to 6 V
Max t of 7 ns at 5 V
pd
DIR
A1
A2
A3
A4
A5
A6
A7
V
CC
19 OE
1
2
3
4
5
6
7
8
9
10
20
description/ordering information
18
17
16
15
14
13
12
11
B1
B2
B3
B4
B5
B6
B7
B8
The ’AC245 octal bus transceivers are designed
for asynchronous two-way communication
between data buses. The control-function
implementation minimizes external timing
requirements.
When the output-enable (OE) is low, the device
passes noninverted data from the A bus to the B
bus or from the B bus to the A bus, depending on
the logic level at the direction control (DIR) input.
A high on OE disables the device so that the buses
are effectively isolated.
A8
GND
SN54AC245 . . . FK PACKAGE
(TOP VIEW)
To ensure the high-impedance state during power
up or power down, OE should be tied to V
CC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
3
2
1
20 19
18
B1
B2
B3
A3
A4
A5
A6
A7
4
5
6
7
8
17
16
15 B4
14 B5
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube
SN74AC245N
SN74AC245N
Tube
SN74AC245DW
SN74AC245DWR
SN74AC245NSR
SN74AC245DBR
SN74AC245PW
SN74AC245PWR
SNJ54AC245J
SOIC − DW
AC245
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
AC245
AC245
−40°C to 85°C
SSOP − DB
TSSOP − PW
AC245
Tape and reel
Tube
CDIP − J
CFP − W
LCCC − FK
SNJ54AC245J
SNJ54AC245W
SNJ54AC245FK
Tube
SNJ54AC245W
SNJ54AC245FK
−55°C to 125°C
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
ꢉ ꢙ ꢤ ꢜ ꢛꢧ ꢢꢡ ꢟꢠ ꢡꢛ ꢝꢤ ꢦꢘ ꢞꢙ ꢟ ꢟꢛ ꢮꢐ ꢋꢕ ꢖꢎ ꢯ ꢕꢔꢰꢂ ꢔꢂꢇ ꢞꢦꢦ ꢤꢞ ꢜ ꢞ ꢝꢣ ꢟꢣꢜ ꢠ ꢞ ꢜ ꢣ ꢟꢣ ꢠꢟꢣ ꢧ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆꢃ ꢂꢇ ꢀꢁ ꢈ ꢃ ꢄꢅꢆ ꢃ ꢂ
ꢉꢅ ꢊꢄ ꢋ ꢌ ꢍ ꢀ ꢊ ꢎꢄ ꢁꢀ ꢅꢏ ꢐ ꢑꢏ ꢎꢀ
ꢒꢐ ꢊ ꢓ ꢔ ꢕꢀꢊꢄꢊ ꢏ ꢉꢍꢊ ꢖꢍ ꢊꢀ
SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003
FUNCTION TABLE
INPUTS
OPERATION
DIR
OE
L
L
H
L
H
X
B data to A bus
A data to B bus
Isolation
logic diagram (positive logic)
1
DIR
19
18
OE
B1
2
A1
To Seven Other Channels
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
I
CC
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003
recommended operating conditions (see Note 3)
SN54AC245
SN74AC245
UNIT
MIN
2
MAX
MIN
2
MAX
V
V
Supply voltage
6
6
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 3 V
2.1
2.1
= 4.5 V
= 5.5 V
= 3 V
3.15
3.85
3.15
3.85
High-level input voltage
V
V
IH
0.9
1.35
1.65
0.9
1.35
1.65
= 4.5 V
= 5.5 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
0
0
V
V
V
V
I
CC
CC
Output voltage
O
CC
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 3 V
−12
−24
−24
12
−12
−24
−24
12
= 4.5 V
= 5.5 V
= 3 V
I
High-level output current
Low-level output current
mA
mA
OH
= 4.5 V
= 5.5 V
24
24
I
OL
24
24
Dt/Dv
Input transition rise or fall rate
Operating free-air temperature
8
8
ns/V
T
A
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢉꢅ ꢊꢄ ꢋ ꢌ ꢍ ꢀ ꢊ ꢎꢄ ꢁꢀ ꢅꢏ ꢐ ꢑꢏ ꢎꢀ
ꢒꢐ ꢊ ꢓ ꢔ ꢕꢀꢊꢄꢊ ꢏ ꢉꢍꢊ ꢖꢍ ꢊꢀ
SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
SN54AC245
SN74AC245
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
2.9
TYP
MAX
MIN
2.9
4.4
5.4
2.4
3.7
4.7
3.85
MAX
MIN
2.9
MAX
3 V
4.5 V
5.5 V
3 V
4.4
4.4
I
= −50 mA
OH
5.4
5.4
I
I
= −12 mA
= −24 mA
2.56
3.86
4.86
2.46
3.76
4.76
OH
V
OH
V
4.5 V
5.5 V
5.5 V
5.5 V
3 V
OH
†
†
I
I
= −50 mA
OH
= −75 mA
3.85
OH
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
4.5 V
5.5 V
3 V
I
= 50 mA
OL
0.1
0.1
0.1
I
I
= 12 mA
= 24 mA
0.36
0.36
0.36
0.5
0.44
0.44
0.44
OL
V
OL
V
4.5 V
5.5 V
5.5 V
5.5 V
0.5
OL
0.5
†
†
I
I
= 50 mA
1.65
OL
= 75 mA
1.65
1
OL
‡
A or B ports
0.1
0.1
1
1
I
V = V
CC
or GND
or GND,
5.5 V
5.5 V
mA
mA
I
I
OE or DIR
1
V
= V
CC
V (OE) = V or V
IL IH
O
I
I
I
0.5
4
10
80
5
OZ
V = V
or GND,
or GND
I = 0
O
5.5 V
5 V
40
mA
pF
pF
CC
I
CC
C
C
V = V
4.5
15
i
I
CC
V
= V
or GND
5 V
io
O CC
†
‡
Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
For I/O ports, the parameter I includes the input leakage current.
OZ
switching characteristics over recommended operating free-air temperature range,
= 3.3 V " 0.3 V (unless otherwise noted) (see Figure 1)
V
CC
T = 25°C
A
SN54AC245
SN74AC245
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
1.5
1.5
2.5
2.5
2
TYP
5
MAX
8.5
MIN
1
MAX
11.5
10
MIN
1
MAX
9
t
t
PLH
PHL
PZH
A or B
OE
B or A
A or B
A or B
5
8.5
1
1
9
t
7
11.5
12
1
13.5
14.5
13.5
14
2
12.5
13.5
12.5
13
ns
t
7.5
6.5
7
1
2
PZL
t
12
1
1
PHZ
ns
OE
t
2
11.5
1
1.5
PLZ
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCAS461F − FEBRUARY 1995 − REVISED OCTOBER 2003
switching characteristics over recommended operating free-air temperature range,
= 5 V " 5 V (unless otherwise noted) (see Figure 1)
V
CC
T
A
= 25°C
TYP
3.5
SN54AC245
SN74AC245
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
6.5
6
MIN
1
MAX
8.5
MIN
1
MAX
7
t
t
PLH
PHL
PZH
A or B
OE
B or A
A or B
A or B
3.5
1
7.5
1
7
t
5
8.5
9
1
10
1
9
ns
t
5.5
1
10.5
10.5
10.5
1
9.5
10
10
PZL
t
5.5
9
1
1
PHZ
ns
OE
t
5.5
9
1
1
PLZ
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per transceiver
C
= 50 pF,
L
f = 1 MHz
45
pF
pd
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
S1
S1
t
/t
Open
500 Ω
Open
PLH PHL
From Output
Under Test
t
/t
2 × V
CC
PLZ PZL
t
/t
Open
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
LOAD CIRCUIT
50%
Output
Control
(low-level
enabling)
V
CC
V
50% V
CC
50% V
CC
CC
Input
50%
0 V
0 V
PHL
t
t
PLZ
PZL
t
t
PLH
Output
Waveform 1
≈V
CC
V
OH
50% V
CC
In-Phase
Output
V
OL
+ 0.3 V
S1 at 2 × V
(see Note B)
50% V
CC
50% V
CC
CC
V
OL
V
OL
t
t
PZH
PHZ
− 0.3 V
t
t
PLH
PHL
Output
Waveform 2
S1 at Open
(see Note B)
V
OH
V
OH
V
OH
Out-of-Phase
Output
50% V
CC
50% V
CC
50% V
CC
≈0 V
V
OL
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
C includes probe and jig capacitance.
L
NOTES: A.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t v 2.5 ns, t v 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CFP
Drawing
5962-87758012A
5962-8775801RA
5962-8775801SA
5962-8775801VRA
5962-8775801VSA
SN74AC245DBLE
SN74AC245DBR
ACTIVE
ACTIVE
FK
J
20
20
20
20
20
20
20
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
ACTIVE
W
J
Call TI
A42
ACTIVE
CDIP
CFP
ACTIVE
W
DB
DB
Call TI
Call TI
OBSOLETE
ACTIVE
SSOP
SSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AC245DBRE4
SN74AC245DBRG4
SN74AC245DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
DB
DB
DW
DW
DW
DW
DW
DW
N
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AC245DWE4
SN74AC245DWG4
SN74AC245DWR
SN74AC245DWRE4
SN74AC245DWRG4
SN74AC245N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74AC245NE4
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74AC245NSR
SN74AC245NSRE4
SN74AC245NSRG4
SN74AC245PW
NS
NS
NS
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AC245PWE4
SN74AC245PWG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AC245PWLE
SN74AC245PWR
OBSOLETE TSSOP
PW
PW
20
20
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
LCCC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74AC245PWRE4
SN74AC245PWRG4
SNJ54AC245FK
PW
PW
FK
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1
TBD
POST-PLATE N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
SNJ54AC245J
SNJ54AC245W
ACTIVE
ACTIVE
J
20
20
1
1
TBD
TBD
A42
N / A for Pkg Type
N / A for Pkg Type
W
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54AC245, SN54AC245-SP, SN74AC245 :
Enhanced Product: SN74AC245-EP
•
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74AC245DBR
SN74AC245DWR
SN74AC245NSR
SN74AC245PWR
SSOP
SOIC
SO
DB
DW
NS
20
20
20
20
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
24.4
24.4
16.4
8.2
10.8
8.2
7.5
13.0
13.0
7.1
2.5
2.7
2.5
1.6
12.0
12.0
12.0
8.0
16.0
24.0
24.0
16.0
Q1
Q1
Q1
Q1
TSSOP
PW
6.95
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AC245DBR
SN74AC245DWR
SN74AC245NSR
SN74AC245PWR
SSOP
SOIC
SO
DB
DW
NS
20
20
20
20
2000
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
41.0
41.0
33.0
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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