SN74AUC2G241YZPR [TI]
DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS; 双缓冲/驱动器，具有三态输出
| 型号： | SN74AUC2G241YZPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS |
| 文件： | 总13页 (文件大小：263K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535A–DECEMBER 2003–REVISED MARCH 2005
FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
1
2
3
4
8
7
6
5
1OE
1A
2Y
V
CC
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
2OE
1Y
2A
GND
•
Ioff Supports Partial-Power-Down Mode
Operation
•
•
•
•
•
Sub-1-V Operable
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Max tpd of 1.9 ns at 1.8 V
Low Power Consumption, 10 µA at 1.8 V
±8-mA Output Drive at 1.8 V
4
3
2
1
5
6
7
8
GND
2Y
2A
1Y
1A
1OE
2OE
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
V
CC
•
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC
operation.
The SN74AUC2G241 is designed specifically to improve the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is
low or 2OE is high, the device passes data from the A inputs to the Y outputs. When 1OE is high or 2OE is low,
the outputs are in the high-impedance state.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
Tape and reel
Tape and reel
SN74AUC2G241YEPR
_ _ _U2_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74AUC2G241YZPR
–40°C to 85°C
SSOP – DCT
Tape and reel
Tape and reel
SN74AUC2G241DCTR
SN74AUC2G241DCUR
U41_ _ _
U2_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535A–DECEMBER 2003–REVISED MARCH 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is
determined by the current-sinking/current-sourcing capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of
Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
FUNCTION TABLES
INPUTS
1OE
OUTPUT
1Y
1A
H
L
L
H
L
L
H
X
Z
INPUTS
OUTPUT
2Y
2OE
H
2A
H
H
L
H
L
L
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1OE
6
3
2
1Y
2Y
1A
7
5
2OE
2A
2
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535A–DECEMBER 2003–REVISED MARCH 2005
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
3.6
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Output voltage range(2)
3.6
V
VO
VO
IIK
3.6
V
–0.5 VCC + 0.5
V
Input clamp current
VI < 0
–50
–50
±20
±100
220
227
102
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
Continuous output current
Continuous current through VCC or GND
DCT package
θJA
Package thermal impedance(3)
DCU package
°C/W
°C
YEP/YZP package
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
3
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535A–DECEMBER 2003–REVISED MARCH 2005
Recommended Operating Conditions(1)
MIN
0.8
MAX UNIT
VCC
Supply voltage
2.7
V
VCC = 0.8 V
VCC
VIH
High-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 0.8 V
0.65 × VCC
1.7
V
0
VIL
Low-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.35 × VCC
V
0.7
3.6
VCC
3.6
–0.7
–3
–5
–8
–9
0.7
3
VI
Input voltage
0
0
0
V
V
Active state
VO
Output voltage
3-state
VCC = 0.8 V
VCC = 1.1 V
IOH
High-level output current
Low-level output current
VCC = 1.4 V
mA
mA
VCC = 1.65 V
VCC = 2.3 V
VCC = 0.8 V
VCC = 1.1 V
IOL
VCC = 1.4 V
5
VCC = 1.65 V
VCC = 2.3 V
8
9
VCC = 0.8 V to 1.65 V(2)
VCC = 1.65 V to 1.95 V(3)
VCC = 2.3 V to 2.7 V(3)
20
20
20
85
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
ns/V
°C
TA
–40
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(2) The data was taken at CL = 15 pF, RL = 2 kΩ (see Figure 1).
(3) The data was taken at CL = 30 pF, RL = 500 Ω (see Figure 1).
4
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535A–DECEMBER 2003–REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN TYP(1) MAX UNIT
VCC – 0.1
IOH = –100 µA
IOH = –0.7 mA
IOH = –3 mA
IOH = –5 mA
IOH = –8 mA
IOH = –9 mA
IOL = 100 µA
IOL = 0.7 mA
IOL = 3 mA
0.8 V to 2.7 V
0.8 V
0.55
0.25
1.1 V
0.8
1
VOH
V
V
1.4 V
1.65 V
2.3 V
1.2
1.8
0.8 V to 2.7 V
0.8 V
0.2
1.1 V
0.3
0.4
VOL
IOL = 5 mA
1.4 V
IOL = 8 mA
1.65 V
2.3 V
0.45
0.6
IOL = 9 mA
II
All inputs
VI = VCC or GND
VI or VO = 2.7 V
0 to 2.7 V
0
±5
µA
µA
µA
µA
pF
pF
Ioff
IOZ
ICC
Ci
±10
±10
10
VO = VCC or GND
VI = VCC or GND,
VI = VCC or GND
VO = VCC or GND
2.7 V
IO = 0
0.8 V to 2.7 V
2.5 V
2.5
5.5
Co
2.5 V
(1) All typical values are at TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.2 V VCC = 1.5 V
± 0.1 V ± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 0.8 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
5.1
5.9
6.2
MIN MAX MIN MAX MIN TYP MAX MIN MAX
tpd
ten
tdis
A
Y
Y
Y
1
1.2
2.2
3.5
4.2
4.8
0.8
1
2.3
2.7
4.4
0.7
0.9
1
1.2
1.3
2.9
1.9
2
0.6
0.8
1.6
1.4
1.6
3.3
ns
ns
ns
OE or OE
OE or OE
2.5
4.2
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
TYP
1.6
1.7
2.3
MAX
2.5
MIN
0.8
1
MAX
1.8
2
tpd
ten
tdis
A
Y
Y
Y
0.9
1.1
1.9
ns
ns
ns
OE or OE
OE or OE
2.8
3.6
0.9
2.1
5
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535A–DECEMBER 2003–REVISED MARCH 2005
Operating Characteristics
TA = 25°C
VCC = 0.8 V
TYP
VCC = 1.2 V
TYP
VCC = 1.5 V
TYP
VCC = 1.8 V
TYP
VCC = 2.5 V
TEST
PARAMETER
UNIT
CONDITIONS
TYP
Power dissipation
capacitance
Cpd
f = 10 MHz
16
16
16
17
18
pF
6
SN74AUC2G241
DUAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES535A–DECEMBER 2003–REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
/t
PLH PHL
S1
Open
2 × V
S1
Open
GND
R
L
t
t
From Output
Under Test
t
/t
PLZ PZL
CC
/t
GND
PHZ PZH
C
L
R
L
(see Note A)
C
L
V
∆
R
L
V
CC
0.8 V
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
LOAD CIRCUIT
0.15 V
0.15 V
0.15 V
0.15 V
V
CC
Timing Input
V /2
CC
0 V
t
w
t
su
t
h
V
CC
V
CC
V /2
CC
V /2
CC
Input
V /2
CC
V /2
CC
Data Input
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
V
CC
/2
V
CC
/2
V /2
CC
V /2
CC
Input
0 V
V
0 V
t
t
t
PLZ
t
t
PHL
PZL
PLH
Output
Waveform 1
V
OH
CC
V
/2
/2
V
V
/2
/2
V
CC
/2
CC
CC
Output
S1 at 2 × V
V
OL
+ V
PHZ
CC
∆
V
OL
V
OL
(see Note B)
t
t
PZH
t
PHL
PLH
/2
Output
Waveform 2
S1 at GND
V
OH
V
OH
V
OH
- V
∆
V
CC
V
CC
CC
Output
≈0 V
V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, slew rate ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jun-2005
PACKAGING INFORMATION
Orderable Device
74AUC2G241DCURE4
SN74AUC2G241DCTR
SN74AUC2G241DCUR
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
US8
DCU
8
8
8
3000
3000
3000
Pb-Free
(RoHS)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
SM8
US8
DCT
DCU
Pb-Free
(RoHS)
Pb-Free
(RoHS)
SN74AUC2G241YEPR
SN74AUC2G241YZPR
ACTIVE
ACTIVE
WCSP
WCSP
YEP
YZP
8
8
3000
3000
TBD
SNPB
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Pb-Free
(RoHS)
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
M
0,13
0,65
8
5
0,15 NOM
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
0,25
1
4
0° – 8°
0,60
0,20
3,15
2,75
1,30 MAX
Seating Plane
0,10
0,10
0,00
4188781/C 09/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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