SN74AUC74RGYRG4 [TI]
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET; 双上升沿触发的D型触发器具有清零和预设
| 型号： | SN74AUC74RGYRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET |
| 文件： | 总12页 (文件大小：560K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74AUC74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
www.ti.com
SCES483A–AUGUST 2003–REVISED MARCH 2005
FEATURES
RGY PACKAGE
(TOP VIEW)
•
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
•
Ioff Supports Partial-Power-Down Mode
Operation
1
14
13
12
11
10
9
1D
1CLK
1PRE
1Q
2CLR
2D
2
3
4
5
6
•
•
•
•
•
Sub-1-V Operable
Max tpd of 1.8 ns at 1.8 V
2CLK
2PRE
2Q
Low Power Consumption, 10-µA Max ICC
±8-mA Output Drive at 1.8 V
1Q
7
8
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This dual positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed specifically
for 1.65-V to 1.95-V VCC operation.
A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs
at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval,
data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for
higher frequencies, the CLR input overrides the PRE input when they are both low.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 85°C
QFN – RGY
Tape and reel
SN74AUC74RGYR
MS74
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OUTPUTS
PRE
L
CLR
CLK
D
X
X
H
L
Q
H
L
Q
L
H
L
X
X
↑
X
H
H
H
H
H
H
L
L
H
↑
H
H
L
X
Q0
Q 0
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74AUC74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
www.ti.com
SCES483A–AUGUST 2003–REVISED MARCH 2005
LOGIC DIAGRAM, EACH FLIP-FLOP (POSITIVE LOGIC)
PRE
CLK
C
C
C
TG
C
C
C
C
D
TG
TG
TG
C
C
C
CLR
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Output voltage range(2)
3.6
3.6
3.6
V
VO
VO
IIK
V
–0.5 VCC + 0.5
V
Input clamp current
VI < 0
–50
–50
±20
±100
47
mA
mA
mA
mA
°C/W
°C
IOK
IO
Output clamp current
VO < 0
Continuous output current
Continuous current through VCC or GND
Package thermal impedance(3)
Storage temperature range
θJA
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-5.
2
SN74AUC74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
www.ti.com
SCES483A–AUGUST 2003–REVISED MARCH 2005
Recommended Operating Conditions(1)
MIN
0.8
MAX UNIT
VCC
Supply voltage
2.7
V
VCC = 0.8 V
VCC
VIH
High-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 0.8 V
0.65 × VCC
1.7
V
0
VIL
Low-level input voltage
VCC = 1.1 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.35 × VCC
V
0.7
3.6
VCC
–0.7
–3
–5
–8
–9
0.7
3
VI
Input voltage
0
0
V
V
VO
Output voltage
VCC = 0.8 V
VCC = 1.1 V
VCC = 1.4 V
VCC = 1.65 V
VCC = 2.3 V
VCC = 0.8 V
VCC = 1.1 V
VCC = 1.4 V
VCC = 1.65 V
VCC = 2.3 V
IOH
High-level output current
Low-level output current
mA
mA
IOL
5
8
9
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
20
85
ns/V
TA
–40
°C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
0.8 V to 2.7 V
0.8 V
MIN
TYP(1) MAX UNIT
IOH = –100 µA
IOH = –0.7 mA
IOH = –3 mA
IOH = –5 mA
IOH = –8 mA
IOH = –9 mA
IOL = 100 µA
IOL = 0.7 mA
IOL = 3 mA
VCC – 0.1
0.55
1.1 V
0.8
1
VOH
V
1.4 V
1.65 V
2.3 V
1.2
1.8
0.8 V to 2.7 V
0.8 V
0.2
0.25
1.1 V
0.3
V
VOL
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
2.3 V
0.45
0.6
IOL = 9 mA
II
VI = VCC or GND
VI or VO = 2.7 V
0 to 2.7 V
0
±5
±10
10
µA
µA
µA
Ioff
ICC
VI = VCC or GND,
VI = VCC or GND
VI = VCC or GND
IO = 0
0.8 V to 2.7 V
2.5 V
D inputs
2
Ci
pF
Control inputs
2.5 V
2.5
(1) All typical values are at TA = 25°C.
3
SN74AUC74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
www.ti.com
SCES483A–AUGUST 2003–REVISED MARCH 2005
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.2 V
± 0.1 V
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
VCC = 0.8 V
± 0.2 V
MIN MAX
350
UNIT
TYP
100
4.6
6.6
4.8
2.3
0
MIN MAX
MIN MAX
MIN
MAX
300
fclock
Clock frequency
Pulse duration
225
250
MHz
CLK high or low
CLR low
1.3
2
0.6
1.5
1.5
0.6
0
0.5
1.5
1.5
0.6
0
0.5
tw
1.5
ns
PRE low
1.8
1
1.5
Data
0.7
Setup time before
CLK↑
tsu
CLR inactive
PRE inactive
0
0.3
ns
ns
0
0
0
0.2
0.3
0.3
th
Hold time, data after CLK↑
2.1
0.3
0.3
0.3
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
VCC = 1.2 V VCC = 1.5 V
± 0.1 V ± 0.1 V
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 0.8 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
TYP
100
9.5
MIN MAX MIN MAX MIN TYP MAX MIN MAX
fmax
225
1.3
1.5
1.6
250
0.7
1.1
1.1
300
0.5
0.9
0.9
350
0.5
0.7
0.7
MHz
CLK
CLR
PRE
4
4.1
4.7
2.5
2.9
2.8
1.2
1.4
1.4
2.1
2.4
2.4
1.4
1.6
1.6
tpd
Q or Q
10.5
12
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN TYP MAX MIN MAX
fmax
300
1.2
1.3
1.3
350
1
MHz
CLK
CLR
PRE
1.9
2.1
2.1
2.8
3
2.2
2.4
2.5
tpd
Q or Q
1.1
1.1
ns
3.1
Operating Characteristics
TA = 25°C
VCC = 0.8 V VCC = 1.2 V VCC = 1.5 V VCC = 1.8 V VCC = 2.5 V
TEST
CONDITIONS
PARAMETER
UNIT
TYP
TYP
TYP
TYP
TYP
Power dissipation
capacitance
Cpd
f = 10 MHz
36
36
36
37
41
pF
4
SN74AUC74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
www.ti.com
SCES483A–AUGUST 2003–REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
/t
PLH PHL
S1
Open
2 × V
S1
Open
GND
R
L
t
t
From Output
Under Test
t
/t
PLZ PZL
CC
/t
GND
PHZ PZH
C
L
R
L
(see Note A)
C
L
V
∆
R
L
V
CC
0.8 V
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
LOAD CIRCUIT
0.15 V
0.15 V
0.15 V
0.15 V
V
CC
Timing Input
V /2
CC
0 V
t
w
t
su
t
h
V
CC
V
CC
V /2
CC
V /2
CC
Input
V /2
CC
V /2
CC
Data Input
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
V
CC
/2
V
CC
/2
V /2
CC
V /2
CC
Input
0 V
V
0 V
t
t
t
PLZ
t
t
PHL
PZL
PLH
Output
Waveform 1
V
OH
CC
V
/2
/2
V
V
/2
/2
V
CC
/2
CC
CC
Output
S1 at 2 × V
V
OL
+ V
PHZ
CC
∆
V
OL
V
OL
(see Note B)
t
t
PZH
t
PHL
PLH
/2
Output
Waveform 2
S1 at GND
V
OH
V
OH
V
OH
− V
∆
V
CC
V
CC
CC
Output
≈0 V
V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, slew rate ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2007
PACKAGING INFORMATION
Orderable Device
SN74AUC74RGYR
SN74AUC74RGYRG4
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
QFN
RGY
14
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
QFN
RGY
14
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
(mm)
SN74AUC74RGYR
RGY
14
SITE 41
180
12
3.85
3.85
1.35
8
12
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74AUC74RGYR
RGY
14
SITE 41
190.0
212.7
31.75
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明