SN74AXC4T774 [TI]
具有三态输出和独立方向控制输入的 4 位双电源总线收发器;型号: | SN74AXC4T774 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有三态输出和独立方向控制输入的 4 位双电源总线收发器 总线收发器 |
文件: | 总39页 (文件大小:2415K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74AXC4T774
ZHCSK02B –JULY 2019 –REVISED MAY 2021
具有独立方向控制、可配置电压转换和三态输出功能的SN74AXC4T774 4 位双
电源总线收发器
SN74AXC4T774 器件旨在实现数据总线间的异步通
信。根据方向控制输入 (DIRx) 的逻辑电平,该器件将
1 特性
• 完全可配置的双轨设计可允许各个端口在0.65V 至
3.6V 的电源电压范围内运行
• 工作温度范围为–40°C 至+125°C
• 独立方向控制引脚,支持可配置的升降压转换
• 无干扰电源时序
数据从 A 总线传输至 B 总线,或者将数据从 B 总线传
输至A 总线。输出使能输入 (OE) 用于禁用输出,从而
有效隔离总线。SN74AXC4T774 器件旨在使控制引脚
(DIRx 和OE)以VCCA 为基准。
为了确保电平转换器I/O 在上电或断电期间处于高阻抗
状态,OE 引脚应通过上拉电阻器连接至VCCA。
• 从1.8V 转换到3.3V 时,支持高达310Mbps 的转
换速率
• VCC 隔离特性
该器件完全符合使用 Ioff 电流的部分断电应用的规范要
求。当器件断电时,Ioff 保护电路可确保不从输入、输
出或偏置到特定电压的组合I/O 获取多余电流,也不向
其提供多余电流。
– 如果任何一个VCC 输入低于100mV,则所有
I/O 输出均禁用且处于高阻抗状态
• Ioff 支持局部断电模式运行
• 兼容AVC 系列电平转换器
• 闩锁性能超过100mA,符合JESD 78 II 类规范
• ESD 保护性能超过JESD 22 规范要求
VCC 隔离特性能确保当 VCCA 或 VCCB 低于 100mV
时,可通过禁用 I/O 端口的输出来将其设为高阻抗状
态。
– 8000V 人体放电模型
– 1000V 充电器件模型
无干扰电源时序使电源轨能以任何顺序打开或关断,从
而提供强大的电源时序性能。
2 应用
器件信息
封装(1)
• 企业与通信
• 工业
封装尺寸(标称值)
5.00mm x 4.40mm
2.50mm x 3.50mm
2.60mm x 1.80mm
器件型号
SN74AXC4T774PW
TSSOP (16)
• 个人电子产品
• 无线基础设施
• 楼宇自动化
• 销售终端
SN74AXC4T774BQB WQFN (16)
SN74AXC4T774RSV UQFN (16)
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
3 说明
One of Four Transceivers
SN74AXC4T774 是一款使用两个独立可配置电源轨的
四位同相总线收发器。当 VCCA 和 VCCB 电源电压低至
0.65V 时,该器件可正常工作。A 端口用于跟踪
VCCA,可支持 0.65V 至 3.6V 范围内的任何电源电
压。B 端口用于跟踪 VCCB,同样支持 0.65V 至 3.6V
范围内的任何电源电压。此外,SN74AXC4T774 还与
单电源系统兼容。
VCCA
VCCB
DIRx
OE
Bx
Ax
功能方框图
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SCES898
SN74AXC4T774
ZHCSK02B –JULY 2019 –REVISED MAY 2021
www.ti.com.cn
Table of Contents
7.1 Load Circuit and Voltage Waveforms........................16
8 Detailed Description......................................................18
8.1 Overview...................................................................18
8.2 Functional Block Diagram.........................................18
8.3 Feature Description...................................................18
8.4 Device Functional Modes..........................................19
9 Application and Implementation..................................20
9.1 Application Information............................................. 20
9.2 Typical Application.................................................... 20
10 Power Supply Recommendations..............................22
11 Layout...........................................................................22
11.1 Layout Guidelines................................................... 22
11.2 Layout Example...................................................... 22
12 Device and Documentation Support..........................23
12.1 Related Documentation.......................................... 23
12.2 接收文档更新通知................................................... 23
12.3 支持资源..................................................................23
12.4 Trademarks.............................................................23
12.5 Electrostatic Discharge Caution..............................23
12.6 Glossary..................................................................23
13 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................5
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics.............................................6
6.6 Switching Characteristics, VCCA = 0.7 ± 0.05 V.......... 7
6.7 Switching Characteristics, VCCA = 0.8 ± 0.04 V.......... 7
6.8 Switching Characteristics, VCCA = 0.9 ± 0.045 V........ 8
6.9 Switching Characteristics, VCCA = 1.2 ± 0.1 V............ 9
6.10 Switching Characteristics, VCCA = 1.5 ± 0.1 V.......... 9
6.11 Switching Characteristics, VCCA = 1.8 ± 0.15 V...... 10
6.12 Switching Characteristics, VCCA = 2.5 ± 0.2 V........ 11
6.13 Switching Characteristics, VCCA = 3.3 ± 0.3 V........ 11
6.14 Operating Characteristics: TA = 25°C..................... 13
6.15 Typical Characteristics............................................15
7 Parameter Measurement Information..........................16
Information.................................................................... 23
4 Revision History
Changes from Revision A (July 2020) to Revision B (May 2021)
Page
• Updated the Serial Peripheral Interface (SPI) Application figure in the Typical Application section.................20
Changes from Revision * (July 2019) to Revision A (July 2020)
Page
• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1
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5 Pin Configuration and Functions
DIR1
DIR2
A1
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCCA
VCCB
B1
2
DIR2
A1
15 VCCB
3
4
5
6
7
14 B1
13 B2
12 B3
11 B4
10 GND
A2
A2
B2
Thermal
Pad
A3
A3
B3
A4
A4
B4
DIR3
DIR3
DIR4
GND
OE
图5-2. BQB Package 16-Pin WQFN Transparent
图5-1. PW Package 16-Pin TSSOP Top View
Top View
16 15 14 13
1
2
3
4
12
B1
A1
A2
A3
A4
11 B2
10
B3
B4
9
5
6
7
8
图5-3. RSV Package 16-Pin UQFN Transparent Top View
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
PW
3
RSV
1
BQB
3
A1
A2
A3
A4
B1
B2
B3
B4
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Input/output A1. Referenced to VCCA
Input/output A2. Referenced to VCCA
Input/output A3. Referenced to VCCA
Input/output A4. Referenced to VCCA
Input/output B1. Referenced to VCCB
Input/output B2. Referenced to VCCB
Input/output B3. Referenced to VCCB
Input/output B4. Referenced to VCCB
.
.
.
.
.
.
.
.
4
2
4
5
3
5
6
4
6
14
13
12
11
12
11
10
9
14
13
12
11
Direction-control input for port 1. Referenced to
VCCA
DIR1
DIR2
DIR3
DIR4
1
2
7
8
15
16
5
1
2
7
8
I
I
I
I
.
Direction-control input for port 2. Referenced to
VCCA
.
Direction-control input for port 3. Referenced to
VCCA
.
Direction-control input for port 4. Referenced to
VCCA
6
.
Tri-state output enable. Pull OE high to place all
OE
9
7
8
9
I
outputs in tri-state mode. Referenced to VCCA
.
GND
VCCA
10
16
10
16
Ground
—
—
A-port power supply voltage. 0.65 V ≤VCCA
3.6 V
≤
≤
14
B-port power supply voltage. 0.65 V ≤VCCB
VCCB
15
13
15
—
3.6 V
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–50
MAX UNIT
VCCA Supply voltage A
VCCB Supply voltage B
4.2
4.2
V
V
I/O Ports (A Port)
I/O Ports (B Port)
Control Inputs
A Port
4.2
VI
Input Voltage(2)
4.2
V
4.2
4.2
VO
VO
Voltage applied to any output in the high-impedance or power-off state(2)
Voltage applied to any output in the high or low state(2) (3)
V
V
B Port
4.2
A Port
VCCA + 0.2
VCCB + 0.2
B Port
IIK
IOK
IO
Input clamp current
VI < 0
mA
mA
Output clamp current
VO < 0
–50
Continuous output current
Continuous current through VCC or GND
Junction Temperature
50 mA
100 mA
150 °C
150 °C
–50
–100
Tj
Tstg
Storage temperature
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 4.2 V maximum if the output current rating is observed.
6.2 ESD Ratings
VALUE
±8000
±1000
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN
0.65
MAX UNIT
VCCA
VCCB
Supply voltage A
Supply voltage B
3.6
3.6
V
V
0.65
VCCI = 0.65 V - 0.75 V
VCCI = 0.76 V - 1 V
VCCI = 1.1 V - 1.95 V
VCCI = 2.3 V - 2.7 V
VCCI = 3 V - 3.6 V
VCCI x 0.70
VCCI x 0.70
VCCI x 0.65
1.6
Data Inputs
2
VIH
High-level input voltage
VCCA = 0.65 V - 0.75 V
VCCA = 0.76 V - 1 V
VCCA = 1.1 V - 1.95 V
VCCA = 2.3 V - 2.7 V
VCCA = 3 V - 3.6 V
VCCI = 0.65 V - 0.75 V
VCCI = 0.76 V - 1 V
VCCI = 1.1 V - 1.95 V
VCCI = 2.3 V - 2.7 V
VCCI = 3 V - 3.6 V
VCCA x 0.70
VCCA x 0.70
VCCA x 0.65
1.6
Control Inputs(DIRx,
OE), Referenced to VCCA
2
VCCI x 0.30
VCCI x 0.30
VCCI x 0.35
0.7
Data Inputs
0.8
VIL
Low-level input voltage
V
VCCA = 0.65 V - 0.75 V
VCCA = 0.76 V - 1 V
VCCA = 1.1 V - 1.95 V
VCCA = 2.3 V - 2.7 V
VCCA = 3 V - 3.6 V
VCCA x 0.30
VCCA x 0.30
VCCA x 0.35
0.7
Control Inputs(DIRx,
OE), Referenced to VCCA
0.8
VI
Input voltage (1)
Output voltage
0
0
0
3.6
V
V
Active State
Tri-State
VCCO
VO
3.6
Δt/Δv(2)
Input transition rise and fall time
Operating free-air temperature
10 ns/V
125 °C
TA
–40
(1) VCCI is the VCC associated with the input port.VCCO is the VCC associated with the output port.
(2) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, SCBA004.
6.4 Thermal Information
SN74AXC4T774
THERMAL METRIC(1)
PW (TSSOP)
16 PINS
118.2
48.6
RSV (UQFN)
16 PINS
130.8
69.1
BQB (WQFN)
16 PINS
73.7
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
70.9
64.5
59.9
43.5
YJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
7.3
3.9
4.9
YJB
63.9
58.3
43.5
RθJC(bottom)
NA
NA
21.2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted) (1) (2)
Operating free-air temperature (TA)
PARAMETER
TEST CONDITIONS
VCCA
VCCB
-40°C to 85°C
MIN TYP(4)
-40°C to 125°C
UNIT
MAX
MIN TYP(4)
MAX
VCCO
–0.1
VCCO
–0.1
IOH = -100 µA
0.7 V - 3.6 V
0.7 V - 3.6 V
IOH = -50 µA
IOH = -200 µA
IOH = -500 µA
0.65 V
0.76 V
0.85 V
1.1 V
0.65 V
0.76 V
0.85 V
1.1 V
0.55
0.58
0.65
0.85
1.05
1.2
0.55
0.58
0.65
0.85
1.05
1.2
High-level output
voltage
VOH
VI = VIH
V
IOH = -3 mA
IOH = -6 mA
IOH = -8 mA
IOH = -9 mA
IOH = -12 mA
IOL = 100 µA
IOL = 50 µA
IOL = 200 µA
IOL = 500 µA
IOL = 3 mA
IOL = 6 mA
IOL = 8 mA
IOL = 9 mA
IOL = 12 mA
1.4 V
1.4 V
1.65 V
2.3 V
1.65 V
2.3 V
1.75
2.3
1.75
2.3
3 V
3 V
0.7 V - 3.6 V
0.65 V
0.76 V
0.85 V
1.1 V
0.7 V - 3.6 V
0.65 V
0.76 V
0.85 V
1.1 V
0.1
0.1
0.1
0.1
0.18
0.2
0.18
0.2
Low-level output
voltage
VOL
VI = VIL
0.25
0.35
0.45
0.55
0.7
0.25
0.35
0.45
0.55
0.7
V
1.4 V
1.4 V
1.65 V
2.3 V
1.65 V
2.3 V
3 V
3 V
Control inputs (DIRx, OE):VI =
VCCA or GND
0.65 V- 3.6 V
0.65 V- 3.6 V
0.65 V- 3.6 V
0.65 V- 3.6 V
0.5
4
1
8
µA
µA
–0.5
–4
–1
–8
Input leakage
current
II
Data Inputs (Ax, Bx),VI = VCCI
or GND
A Port: VI or VO = 0 V - 3.6 V 0 V
0 V - 3.6 V
0 V
4
4
8
8
–4
–4
–8
–8
Partial power
down current
Ioff
µA
µA
B Port: VI or VO = 0 V - 3.6 V 0 V - 3.6 V
Tri-state output A or B Port, VI = VCCI or GND,
IOZ
3.6 V
3.6 V
4
8
–4
–8
current (3)
VO = VCCO or GND, OE = VIH
0.65 V- 3.6 V
0 V
0.65 V- 3.6 V
3.6 V
15
27
VCCA supply
current
VI = VCCI
IO = 0
ICCA
µA
µA
–2
–12
or GND
3.6 V
0 V
10
15
10
18
27
18
0.65 V- 3.6 V
0 V
0.65 V- 3.6 V
3.6 V
VCCB supply
current
VI = VCCI
IO = 0
ICCB
or GND
3.6 V
0 V
–2
–12
ICCA
ICCB
+
Combined
supply current
VI = VCCI
IO = 0
0.65 V- 3.6 V
3.3 V
0.65 V- 3.6 V
3.3 V
21
40
µA
pF
pF
or GND
Control Input
Capacitance
Ci
VI = 3.3 V or GND
4.5
6.5
4.5
6.5
Data I/O
Capacitance
OE = VCCA, VO = 1.65V DC +1
MHz -16 dBm sine wave
Cio
3.3 V
3.3 V
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) All typical data is taken at 25°C.
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6.6 Switching Characteristics, VCCA = 0.7 ± 0.05 V
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
172
172
172
172
205
205
189
189
287
287
309
309
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
120
120
141
141
205
205
161
161
287
287
219
219
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
88
88
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
51
51
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
46
46
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
56
56
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
78
78
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
221
221
9
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
109
109
205
205
145
145
287
287
177
177
51
16
12
9
51
16
12
9
9
205
205
102
102
287
287
133
133
205
205
99
205
205
102
102
287
287
132
132
205
205
113
113
287
287
165
165
205
205
176
176
287
287
418
418
OE
OE
OE
OE
tdis Disable time
ns
ns
99
287
287
127
127
ten Enable time
6.7 Switching Characteristics, VCCA = 0.8 ± 0.04 V
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
141
141
120
120
114
114
156
156
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
96
96
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
73
73
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
39
39
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
29
29
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
28
28
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
29
29
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
40
40
9
A
B
B
A
A
B
Propagation
delay
tpd
ns
96
76
39
16
11
96
76
39
16
12
9
9
114
114
131
131
114
114
116
116
114
114
71
114
114
67
114
114
68
114
114
70
70
114
114
84
84
OE
OE
tdis Disable time
ns
71
67
68
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See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
161
161
258
258
0.5
0.5
0.5
0.5
161
161
174
174
0.5
0.5
0.5
0.5
161
161
137
137
0.5
0.5
0.5
0.5
161
161
90
0.5
0.5
0.5
0.5
161
161
73
0.5
0.5
0.5
0.5
161
161
71
0.5
0.5
0.5
0.5
161
161
77
0.5
0.5
0.5
0.5
161
161
106
106
OE
A
B
ten Enable time
ns
OE
90
73
71
77
6.8 Switching Characteristics, VCCA = 0.9 ± 0.045 V
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
109
109
88
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
76
76
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
60
60
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
33
33
33
33
83
83
51
51
94
94
70
74
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
23
23
16
16
83
83
46
46
94
94
52
54
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
21
21
11
12
83
83
46
46
94
94
45
47
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
21
21
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
24
24
9
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
73
60
88
73
60
9
9
83
83
83
83
83
46
46
94
94
43
43
83
83
54
54
94
94
51
51
OE
OE
OE
OE
83
83
83
tdis Disable time
ns
ns
138
138
94
112
112
94
97
97
94
94
94
94
ten Enable time
203
203
140
140
110
110
Copyright © 2021 Texas Instruments Incorporated
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6.9 Switching Characteristics, VCCA = 1.2 ± 0.1 V
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
50
50
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
39
39
39
39
28
29
95
95
39
40
87
87
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
33
33
33
33
28
29
78
79
39
40
70
70
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
20
20
20
20
28
29
33
34
39
40
51
55
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
14
14
15
15
28
29
26
27
39
40
38
42
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
12
12
11
12
28
29
25
26
39
40
33
36
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
10
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
12
12
7
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
51
51
8
7
28
28
29
23
24
39
40
26
28
28
29
26
26
39
40
25
26
OE
OE
OE
OE
29
tdis Disable time
ns
ns
123
124
39
40
ten Enable time
124
124
6.10 Switching Characteristics, VCCA = 1.5 ± 0.1 V
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V 1.5 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
)
PARAMETER
FROM
TO
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
16
16
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
16
16
29
29
19
20
91
92
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
16
16
23
23
19
20
74
75
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
15
15
14
14
19
20
29
30
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
11
11
11
11
19
20
22
23
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
10
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
10
6
A
B
B
A
A
B
Propagation
delay
tpd
ns
47
7
47
9
7
6
19
19
20
20
22
19
20
20
19
19
20
20
20
OE
OE
20
tdis Disable time
ns
120
120
Copyright © 2021 Texas Instruments Incorporated
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www.ti.com.cn
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
24
25
28
29
0.5
0.5
0.5
0.5
24
25
29
30
0.5
0.5
0.5
0.5
24
25
33
33
0.5
0.5
0.5
0.5
24
25
41
42
0.5
0.5
0.5
0.5
24
25
31
33
0.5
0.5
0.5
0.5
24
25
27
29
0.5
0.5
0.5
0.5
24
25
22
24
0.5
0.5
0.5
0.5
24
25
19
21
OE
A
B
ten Enable time
ns
OE
6.11 Switching Characteristics, VCCA = 1.8 ± 0.15 V
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V 1.5 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
)
PARAMETER
FROM
TO
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
12
12
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
11
12
28
28
17
18
90
90
19
20
20
22
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
11
12
21
21
17
18
73
74
19
20
20
22
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
11
12
12
12
17
18
28
29
19
20
32
34
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
9
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
7
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
7
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
56
10
10
17
18
21
22
19
20
27
29
8
6
5
56
9
7
6
17
17
18
19
20
19
20
24
26
17
18
16
17
19
20
20
22
17
18
18
18
19
20
18
19
OE
OE
OE
OE
18
tdis Disable time
ns
ns
117
119
19
20
ten Enable time
21
22
Copyright © 2021 Texas Instruments Incorporated
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6.12 Switching Characteristics, VCCA = 2.5 ± 0.2 V
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
10
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
10
30
30
13
14
89
89
14
16
14
15
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
9
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
7
7
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
7
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
A
B
B
A
A
B
A
B
Propagation
delay
tpd
ns
78
21
21
13
14
72
72
14
16
13
15
10
10
13
14
26
28
14
16
14
16
8
7
6
5
78
8
7
6
5
13
13
14
19
21
14
16
15
17
13
14
18
19
14
16
16
18
13
14
14
15
14
16
15
17
13
14
17
17
14
16
15
16
OE
OE
OE
OE
14
tdis Disable time
ns
ns
115
117
14
16
ten Enable time
15
16
6.13 Switching Characteristics, VCCA = 3.3 ± 0.3 V
See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
Test Condtions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V 1.5 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
)
PARAMETER
FROM
TO
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
10
10
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
9
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
9
9
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
8
8
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
6
6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
5
5
A
B
B
A
A
B
Propagation
delay
tpd
ns
221
221
16
40
40
16
16
89
89
24
24
16
16
72
72
12
12
16
16
26
27
10
10
16
16
19
20
7
6
5
7
6
5
16
16
17
18
16
16
14
14
16
16
16
16
OE
OE
16
tdis Disable time
ns
115
117
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See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
PARAMETER
FROM
TO
Test Condtions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V
MIN MAX MIN MAX MIN MAX MIN MAX
1.5 ± 0.1 V
MIN MAX
1.8 ± 0.15 V
MIN MAX
2.5 ± 0.2 V
MIN MAX
3.3 ± 0.3 V
MIN MAX
UNIT
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
0.5
0.5
0.5
0.5
12
13
13
14
0.5
0.5
0.5
0.5
12
13
12
12
0.5
0.5
0.5
0.5
12
13
11
12
0.5
0.5
0.5
0.5
12
13
11
12
0.5
0.5
0.5
0.5
12
13
11
12
0.5
0.5
0.5
0.5
12
13
12
13
0.5
0.5
0.5
0.5
12
13
12
13
0.5
0.5
0.5
0.5
12
13
12
13
OE
A
B
ten Enable time
ns
OE
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6.14 Operating Characteristics: TA = 25°C
PARAMETER
TEST CONDITIONS
VCCA
0.7 V
VCCB
0.7 V
MIN
TYP
2.4
MAX UNIT
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
2.3
2.2
Power Dissipation Capacitance CL = 0, RL = Open
per transceiver (A to B: outputs f = 1 MHz
2.2
pF
2.2
enabled)
trise = tfall = 1 ns
2.2
2.4
3.0
1.5
1.5
1.5
Power Dissipation Capacitance CL = 0, RL = Open
per transceiver (A to B: outputs f = 1 MHz
1.5
pF
pF
pF
1.5
disabled)
trise = tfall = 1 ns
1.5
1.6
2.0
CpdA
13.4
15.0
14.0
20.7
29.6
40.2
65.8
91.7
1.3
Power Dissipation Capacitance CL = 0, RL = Open
per transceiver (B to A: outputs f = 1 MHz
enabled)
trise = tfall = 1 ns
1.1
1.1
Power Dissipation Capacitance CL = 0, RL = Open
per transceiver (B to A: outputs f = 1 MHz
1.0
1.0
disabled)
trise = tfall = 1 ns
1.0
1.0
1.0
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MAX UNIT
PARAMETER
TEST CONDITIONS
VCCA
0.7 V
VCCB
0.7 V
MIN
TYP
13.4
13.8
14.9
20.6
29.6
40.3
66.2
92.5
1.3
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
0.7 V
0.8 V
0.9 V
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
Power Dissipation Capacitance CL = 0, RL = Open
per transceiver (A to B: outputs f = 1 MHz
enabled)
pF
pF
pF
pF
trise = tfall = 1 ns
1.2
1.1
Power Dissipation Capacitance CL = 0, RL = Open
per transceiver (A to B: outputs f = 1 MHz
disabled)
1.1
1.1
trise = tfall = 1 ns
1.1
1.1
1.1
CpdB
2.5
2.4
2.3
Power Dissipation Capacitance CL = 0, RL = Open
per transceiver (B to A: outputs f = 1 MHz
enabled)
2.2
2.3
trise = tfall = 1 ns
2.3
2.5
3.0
1.6
1.5
1.5
Power Dissipation Capacitance CL = 0, RL = Open
per transceiver (B to A: outputs f = 1 MHz
disabled)
1.5
1.5
trise = tfall = 1 ns
1.5
1.6
2.0
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6.15 Typical Characteristics
3.4
3.2
3
1.25
1.2
VCC = 1.8V
VCC = 2.5V
VCC = 3.3V
1.15
1.1
1.05
1
2.8
2.6
2.4
2.2
2
0.95
0.9
0.85
0.8
0.75
0.7
1.8
1.6
1.4
0.65
0.6
VCC = 0.7V
VCC = 1.2V
0.55
0
0.5
1
1.5
2
2.5
IOH (mA)
3
3.5
4
4.5
5
0
2
4
6
8
10
IOH (mA)
12
14
16
18
20
D001
D001
图6-2. Typical (TA=25°C) Output High Voltage (VOH
)
图6-1. Typical (TA=25°C) Output High Voltage (VOH
vs Source Current (IOH
)
vs Source Current (IOH
)
)
700
650
600
550
500
450
400
350
300
250
200
150
100
50
220
200
180
160
140
120
100
80
60
40
VCC = 1.8V
VCC = 2.5V
VCC = 3.3V
VCC = 0.7V
VCC = 1.2V
20
0
-50
0
0
2
4
6
8
10
IOL (mA)
12
14
16
18
20
0
0.5
1
1.5
2
2.5
IOL (mA)
3
3.5
4
4.5
5
D001
D001
图6-3. Typical (TA=25°C) Output High Voltage (VOL) 图6-4. Typical (TA=25°C) Output High Voltage (VOL
)
vs Sink Current (IOL
)
vs Sink Current (IOL)
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7 Parameter Measurement Information
7.1 Load Circuit and Voltage Waveforms
Unless otherwise noted, all input pulses are supplied by generators having the following characteristics:
• f = 1 MHz
• ZO = 50 Ω
• dv/dt ≤1 ns/V
Measurement Point
2 x VCCO
Open
GND
S1
RL
Output Pin
Under Test
(1)
CL
RL
A. CL includes probe and jig capacitance.
图7-1. Load Circuit
表7-1. Load Circuit Conditions
Parameter
VCCO
RL
CL
S1
VTP
N/A
N/A
N/A
Δt/
Δv
Input transition rise or fall rate
15 pF
15 pF
15 pF
Open
Open
Open
0.65 V –3.6 V
1.1 V –3.6 V
1 MΩ
2 kΩ
20 kΩ
tpd
Propagation (delay) time
0.65 V –0.95
V
15 pF
15 pF
15 pF
2 × VCCO
2 × VCCO
2 × VCCO
0.3 V
0.15 V
0.1 V
3 V –3.6 V
1.65 V –2.7 V
1.1 V –1.6 V
2 kΩ
2 kΩ
2 kΩ
ten, tdis Enable time, disable time
0.65 V –0.95
15 pF
2 × VCCO
0.1 V
20 kΩ
V
15 pF
15 pF
15 pF
GND
GND
GND
0.3 V
0.15 V
0.1 V
3 V –3.6 V
1.65 V –2.7 V
1.1 V –1.6 V
2 kΩ
2 kΩ
2 kΩ
ten, tdis Enable time, disable time
0.65 V –0.95
15 pF
GND
0.1 V
20 kΩ
V
(1)
VCCI
(1)
VCCI
Input A, B
100 kHz
VCCI / 2
VCCI / 2
Input A, B
500 ps/V œ 10 ns/V
0 V
VOH
0 V
VOH
(2)
tpd
tpd
(2)
Output B, A
Ensure Monotonic
Rising and Falling Edge
(2)
VOL
Output B, A
VCCI / 2
VCCI / 2
(2)
VOL
1. VCCI is the supply pin associated with the input port.
2. VOH and VOL are typical output voltage levels that occur
with specified RL, CL, and S1
1. VCCI is the supply pin associated with the input port.
2. VOH and VOL are typical output voltage levels that occur
with specified RL, CL, and S1
图7-3. Input Transition Rise or Fall Rate
图7-2. Propagation Delay
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VCCA
OE
VCCA / 2
VCCA / 2
GND
tdis
ten
(3)
VCCO
Output(1)
VCCO / 2
VOL + VTP
(4)
VOL
(4)
VOH
VOH - VTP
Output(2)
VCCO / 2
GND
A. Output waveform on the condition that input is driven to a valid Logic Low.
B. Output waveform on the condition that input is driven to a valid Logic High.
C. VCCO is the supply pin associated with the output port.
D. VOH and VOL are typical output voltage levels with specified RL, CL, and S1.
图7-4. Enable Time And Disable Time
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8 Detailed Description
8.1 Overview
The SN74AXC4T774 is a 4-bit, dual-supply noninverting bidirectional voltage level translation device. Ax pins
and control pins (DIRx and OE) are reference to VCCA logic levels, and Bx pins are referenced to VCCB logic
levels. The A port is able to accept I/O voltages ranging from 0.65 V to 3.6 V, while the B port can accept I/O
voltages from 0.65 V to 3.6 V. A high on DIR allows data transmission from A to B and a low on DIR allows data
transmission from B to A when OE is set to low. When OE is set to high, both Ax and Bx pins are in the high-
impedance state. See Device Functional Modes for a summary of the operation of the control logic.
8.2 Functional Block Diagram
One of Four Transceivers
VCCA
VCCB
DIRx
OE
Bx
Ax
8.3 Feature Description
8.3.1 Standard CMOS Inputs
Standard CMOS inputs are high impedance and are typically modeled as a resistor in parallel with the input
capacitance given in the Electrical Characteristics. The worst case resistance is calculated with the maximum
input voltage, given in the Absolute Maximum Ratings, and the maximum input leakage current, given in the
Electrical Characteristics, using ohm's law (R = V ÷ I).
Signals applied to the inputs need to have fast edge rates, as defined by Δt/Δv in Recommended Operating
Conditions to avoid excessive current consumption and oscillations. If a slow or noisy input signal is required, a
device with a Schmitt-trigger input should be used to condition the input signal prior to the standard CMOS input.
8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
A balanced output allows the device to sink and source similar currents. The high drive capability of this device
creates fast edges into light loads so routing and load conditions should be considered to prevent ringing.
Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without
being damaged. The electrical and thermal limits defined in the Absolute Maximum Ratings must be followed at
all times.
8.3.3 Partial Power Down (Ioff
)
The inputs and outputs for this device enter a high-impedance state when the device is powered down, inhibiting
current backflow into the device. The maximum leakage into or out of any input or output pin on the device is
specified by Ioff in the Electrical Characteristics.
8.3.4 VCC Isolation
The inputs and outputs for this device enter a high-impedance state when either supply is <100mV.
8.3.5 Over-voltage Tolerant Inputs
Input signals to this device can be driven above the supply voltage so long as they remain below the maximum
input voltage value specified in the Recommended Operating Conditions.
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8.3.6 Glitch-free Power Supply Sequencing
Either supply rail may be powered on or off in any order without producing a glitch on the I/Os (that is, where the
output erroneously transitions to VCC when it should be held low). Glitches of this nature can be misinterpreted
by a peripheral as a valid data bit, which could trigger a false device reset of the peripheral, a false device
configuration of the peripheral, or even a false data initialization by the peripheral. For more information
regarding the power up glitch performance of the AXC family of level translators, see the Glitch Free Power
Sequencing With AXC Level Translators application report
8.3.7 Negative Clamping Diodes
The inputs and outputs to this device have negative clamping diodes as depicted in 图8-1.
CAUTION
Voltages beyond the values specified in the Absolute Maximum Ratings table can cause damage to
the device. The input negative-voltage and output voltage ratings may be exceeded if the input and
output clamp-current ratings are observed.
VCC
Device
Input
Output
Logic
GND
-IIK
-IOK
图8-1. Electrical Placement of Clamping Diodes for Each Input and Output
8.3.8 Fully Configurable Dual-Rail Design
Both the VCCA and VCCB pins can be supplied at any voltage from 0.65 V to 3.6 V, making the device suitable for
translating between any of the voltage nodes (0.7 V, 0.8 V, 0.9 V, 1.2 V, 1.8 V, 2.5 V and 3.3 V).
8.3.9 Supports High-Speed Translation
The SN74AXC4T774 device can support high data-rate applications. The translated signal data rate can be up
to 310 Mbps when the signal is translated from 1.8 V to 3.3 V.
8.4 Device Functional Modes
表8-1. Function Table
(Each Transceiver)
Port Status
CONTROL INPUTS(1) (2)
OE DIR
OPERATION
A PORT
B PORT
Input (Hi-Z)
L
L
L
H
X
Output (Enabled)
Input (Hi-Z)
Input (Hi-Z)
B data to A bus
A data to B bus
Isolation
Output (Enabled)
Input (Hi-Z)
H
(1) Input circuits of the data I/Os are always active.
(2) Pins configured as inputs should not be left floating.
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9 Application and Implementation
Note
以下应用部分的信息不属于TI 组件规范,TI 不担保其准确性和完整性。客户应负责确定 TI 组件是否适
用于其应用。客户应验证并测试其设计,以确保系统功能。
9.1 Application Information
The SN74AXC4T774 device can be used in level-translation applications for interfacing devices or systems
operating at different interface voltages with one another. The SN74AXC4T774 device is ideal for use in
applications where a push-pull driver is connected to the data I/Os. The max data rate can be up to 310 Mbps
when device translates a signal from 1.8 V to 3.3 V.
One example application is shown in 图9-1, where the SN74AXC4T774 device is used to translate a low voltage
SPI signal from an SoC to a higher voltage signal to properly drive the inputs of a GPS module, and vice versa.
9.2 Typical Application
Pullup Resistors keep device disabled
during power up. OE inputs may also
be tied to GND to keep device enabled
0.7 V
3.3 V
0.1 µF
0.1 µF
VCCA
VCCB
DIR1
DIR3
DIR2
DIR4
GPS
Module
GPIO1
OE
SN74AXC4T774
SoC
CLK
SDI
SDO
CS
CLK
SDO
SDI
B1
B2
B3
B4
A1
A2
A3
A4
CS
GND
图9-1. Serial Peripheral Interface (SPI) Application
9.2.1 Design Requirements
For this design example, use the parameters listed in 表9-1.
表9-1. Design Parameters
DESIGN PARAMETERS
EXAMPLE VALUES
Input voltage range
0.65 V to 3.6 V
0.65 V to 3.6 V
Output voltage range
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9.2.2 Detailed Design Procedure
To begin the design process, determine the following:
• Input voltage range
– Use the supply voltage of the device that is driving the SN74AXC4T774 device to determine the input
voltage range. For a valid logic-high, the value must exceed the high-level input voltage (VIH) of the input
port. For a valid logic low the value must be less than the low-level input voltage (VIL) of the input port.
• Output voltage range
– Use the supply voltage of the device that the SN74AXC4T774 device is driving to determine the output
voltage range.
9.2.3 Application Curve
图9-2. Up Translation at 2.5 MHz (0.7 V to 3.3 V)
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10 Power Supply Recommendations
Always apply a ground reference to the GND pins first. This device is designed for glitch free power sequencing
without any supply sequencing requirements such as ramp order or ramp rate.
This device was designed with various power supply sequencing methods in mind to help prevent unintended
triggering of downstream devices. For more information regarding the power up glitch performance of the AXC
family of level translators, see the Glitch Free Power Sequencing With AXC Level Translators application report
11 Layout
11.1 Layout Guidelines
To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:
• Use bypass capacitors on the power supply pins and place them as close to the device as possible. A 0.1 µF
capacitor is recommended, but transient performance can be improved by having both 1 µF and 0.1 µF
capacitors in parallel as bypass capacitors.
• The high drive capability of this device creates fast edges into light loads so routing and load conditions
should be considered to prevent ringing.
11.2 Layout Example
Legend
Via to VCCA
Via to VCCB
A
B
G
Via to GND
Copper Traces
SN74AXC4T774RSV
0.1µF
G
G
A
0.1µF
16 15 14 13
B
CLK from SoC
1
2
3
4
12
11
10
9
CLK to Module
MOSI to Module
MISO from Module
SS to Module
B1
B2
B3
B4
A1
MOSI from SoC A2
MISO to SoC
A3
SS from SoC A4
5
6
7
8
G
G
图11-1. Layout Example
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12 Device and Documentation Support
12.1 Related Documentation
For related documentation see the following:
Texas Instruments, Implications of Slow or Floating CMOS Inputs application report
Texas Instruments, Power Sequencing for AXC Family of Devices application report
Texas Instruments, SN74AXC4T774 Evaluation Module Tool Folder
12.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
12.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更,恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务,TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021,德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
21-Apr-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
SN74AXC4T774BQBR
SN74AXC4T774PWR
SN74AXC4T774RSVR
ACTIVE
ACTIVE
ACTIVE
WQFN
TSSOP
UQFN
BQB
PW
16
16
16
3000 RoHS & Green
2000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
4T774
NIPDAU
SN4T774
1UXR
RSV
NIPDAUAG
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Apr-2021
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AXC4T774 :
Automotive : SN74AXC4T774-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74AXC4T774BQBR
SN74AXC4T774PWR
SN74AXC4T774RSVR
WQFN
TSSOP
UQFN
BQB
PW
16
16
16
3000
2000
3000
180.0
330.0
178.0
12.4
12.4
13.5
2.8
6.9
2.1
3.8
5.6
2.9
1.2
1.6
4.0
8.0
4.0
12.0
12.0
12.0
Q1
Q1
Q1
RSV
0.75
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jun-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74AXC4T774BQBR
SN74AXC4T774PWR
SN74AXC4T774RSVR
WQFN
TSSOP
UQFN
BQB
PW
16
16
16
3000
2000
3000
210.0
356.0
189.0
185.0
356.0
185.0
35.0
35.0
36.0
RSV
Pack Materials-Page 2
GENERIC PACKAGE VIEW
BQB 16
2.5 x 3.5, 0.5 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226161/A
www.ti.com
PACKAGE OUTLINE
WQFN - 0.8 mm max height
PLASTIC QUAD FLAT PACK-NO LEAD
BQB0016A
A
2.6
2.4
B
3.6
3.4
PIN 1 INDEX AREA
C
0.8
0.7
SEATING PLANE
0.08 C
1.1
0.9
0.05
0.00
(0.2) TYP
2X 0.5
8
9
10X 0.5
7
10
SYMM
2X
2.5
2.1
1.9
15
2
0.30
0.18
16X
0.5
0.3
16
1
PIN 1 ID
(OPTIONAL)
SYMM
16X
0.1
C A B
0.05
C
4224640/A 11/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
BQB0016A
PLASTIC QUAD FLAT PACK-NO LEAD
(2.3)
(1)
2X (0.5)
1
16
10X (0.5)
2
15
SYMM
2X
(2.5)
(2)
(3.3)
2X
(0.75)
10
7
16X (0.24)
16X (0.6)
(Ø0.2) VIA
TYP
9
8
SYMM
(R0.05) TYP
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
0.07 MIN
ALL AROUND
METAL
EXPOSED METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
EXPOSED METAL
NON-SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
4224640/A 11/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271)
.
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
WQFN - 0.8 mm max height
BQB0016A
PLASTIC QUAD FLAT PACK-NO LEAD
(2.3)
(0.95)
2X (0.5)
1
16
10X (0.5)
2
15
SYMM
2X
(2.5)
(1.79) (3.3)
10
7
16X (0.24)
16X (0.6)
EXPOSED METAL
9
8
SYMM
(R0.05) TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
85% PRINTED COVERAGE BY AREA
SCALE: 20X
4224640/A 11/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
RSV0016A
UQFN - 0.55 mm max height
S
C
A
L
E
5
.
0
0
0
ULTRA THIN QUAD FLATPACK - NO LEAD
1.85
1.75
A
B
PIN 1 INDEX AREA
2.65
2.55
C
0.55
0.45
SEATING PLANE
0.05 C
0.05
0.00
2X 1.2
SYMM
℄
(0.13) TYP
5
8
0.45
0.35
15X
4
9
SYMM
℄
2X 1.2
12X 0.4
1
0.25
16X
12
0.15
0.07
0.05
C A B
13
16
0.55
0.45
PIN 1 ID
(45° X 0.1)
4220314/C 02/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RSV0016A
UQFN - 0.55 mm max height
ULTRA THIN QUAD FLATPACK - NO LEAD
SYMM
℄
(0.7)
16
SEE SOLDER MASK
DETAIL
13
12
16X (0.2)
1
SYMM
℄
12X (0.4)
(2.4)
(R0.05) TYP
9
4
15X (0.6)
5
8
(1.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 25X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4220314/C 02/2020
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RSV0016A
UQFN - 0.55 mm max height
ULTRA THIN QUAD FLATPACK - NO LEAD
(0.7)
16
13
16X (0.2)
1
12
SYMM
℄
12X (0.4)
(2.4)
(R0.05) TYP
4
9
15X (0.6)
5
8
SYMM
℄
(1.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 25X
4220314/C 02/2020
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
4.55
NOTE 3
8
9
0.30
16X
4.5
4.3
NOTE 4
1.2 MAX
0.19
B
0.1
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
A
20
0 -8
DETAIL A
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
16
1
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
16
1
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务,TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023,德州仪器 (TI) 公司
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