SN74BCT757NE4 [TI]
BCT/FBT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDIP20, 0.300 INCH, PLASTIC, DIP-20;
| 型号： | SN74BCT757NE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | BCT/FBT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDIP20, 0.300 INCH, PLASTIC, DIP-20 驱动 输入元件 信息通信管理 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总10页 (文件大小：400K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃꢄ ꢅꢆ ꢂꢇ ꢂ
ꢈ ꢅꢆꢉꢊꢋꢄ ꢌꢍ ꢍꢎ ꢏꢐ ꢑ ꢏꢒ ꢓ ꢎꢏ
ꢔ ꢒꢆ ꢕꢋ ꢈꢖ ꢎꢁꢗꢅꢈ ꢊ ꢊ ꢎꢅꢆꢈ ꢏꢋꢈ ꢌ ꢆꢖ ꢌꢆ ꢀ
SCBS041D − NOVEMBER 1989 − REVISED NOVEMBER 1993
DW OR N PACKAGE
(TOP VIEW)
• BiCMOS Design Significantly Reduces I
CCZ
• ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model (C = 200 pF,
R = 0)
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
2OE
1Y1
2A4
1Y2
2A3
1Y3
• Open-Collector Outputs Drive Bus Lines
or Buffer Memory Address Registers
• Package Options Include Plastic
Small-Outline (DW) Packages and Standard
Plastic 300-mil DIPs (N)
13 2A2
12 1Y4
description
11
2A1
This octal buffer and line driver is designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters.
This
device
provides
complementary output-enable (OE and OE)
inputs and noninverting outputs.
The SN74BCT757 is characterized for operation
from 0°C to 70°C.
FUNCTION TABLES
INPUTS
OUTPUT
1Y
1OE
1A
X
H
L
L
H
L
L
H
H
INPUTS
OUTPUT
2Y
2OE
L
2A
X
H
L
H
L
H
H
H
ꢖ
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ꢨ
Copyright 1993, Texas Instruments Incorporated
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ꢟ ꢣ ꢠ ꢟꢘ ꢙꢭ ꢛꢚ ꢞ ꢦꢦ ꢤꢞ ꢜ ꢞ ꢝ ꢣ ꢟ ꢣ ꢜ ꢠ ꢨ
ꢜ
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ꢭ
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2−1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
ꢀꢁ ꢂ ꢃꢄ ꢅ ꢆ ꢂꢇꢂ
ꢈꢅ ꢆꢉ ꢊꢋ ꢄ ꢌꢍ ꢍꢎ ꢏꢐ ꢑꢏ ꢒ ꢓꢎ ꢏ
ꢔꢒ ꢆ ꢕ ꢋꢈ ꢖꢎꢁꢗꢅ ꢈꢊ ꢊꢎ ꢅꢆꢈ ꢏꢋ ꢈ ꢌꢆꢖ ꢌꢆꢀ
SCBS041D − NOVEMBER 1989 − REVISED NOVEMBER 1993
†
logic symbol
logic diagram (positive logic)
1
1
1OE
EN
1OE
2
4
6
8
18
16
14
12
18
16
2
1Y1
1Y2
1Y3
1Y4
1A1
1A1
1A2
1A3
1A4
1Y1
1Y2
1Y3
1Y4
4
1A2
14
12
6
1A3
19
2OE
EN
8
1A4
11
13
15
17
9
7
5
3
2A1
2A2
2A3
2A4
2Y1
2Y2
2Y3
2Y4
19
2OE
9
7
11
2Y1
2Y2
2A1
†
This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
13
2A2
5
3
15
2A3
2Y3
2Y4
17
2A4
‡
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
Input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I
Input current range, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA to 5 mA
I
Voltage range applied to any output in the disabled or power-off state, V . . . . . . . . . . . . . . . −0.5 V to 5.5 V
O
Voltage range applied to any output in the high state, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V
Current into any output in the low state, I
Operating free-air temperature range
O
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
O
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2−2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
ꢀꢁꢂ ꢃꢄ ꢅꢆ ꢂꢇ ꢂ
ꢈ ꢅꢆꢉꢊꢋꢄ ꢌꢍ ꢍꢎꢏ ꢐ ꢑꢏ ꢒ ꢓꢎ ꢏ
ꢔ ꢒꢆ ꢕꢋ ꢈꢖ ꢎꢁꢗꢅꢈ ꢊ ꢊ ꢎꢅꢆꢈ ꢏꢋꢈ ꢌ ꢆꢖ ꢌꢆ ꢀ
SCBS041D − NOVEMBER 1989 − REVISED NOVEMBER 1993
recommended operating conditions (see Note 1)
MIN NOM
MAX
UNIT
V
V
V
V
V
Supply voltage
4.5
2
5
5.5
CC
High-level input voltage
Low-level input voltage
High-level output voltage
Input clamp current
V
IH
0.8
5.5
−18
64
V
IL
V
OH
I
I
mA
mA
°C
IK
Low-level output current
Operating free-air temperature
OL
T
A
0
70
NOTE 1: Unused or floating inputs must be held high or low.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
PARAMETER
TEST CONDITIONS
I = −18 mA
MIN TYP
MAX
−1.2
0.55
0.1
20
UNIT
V
V
V
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 4.5 V,
= 4.5 V,
= 5.5 V,
= 5.5 V,
= 5.5 V,
= 4.5 V,
IK
I
I
= 64 mA
0.42
V
OL
OL
V = 7 V
I
I
I
I
mA
µA
mA
mA
I
I
V = 2.7 V
I
IH
V = 0.5 V
I
−1
IL
V
OH
= 5.5 V
0.1
34
OH
Outputs high
Outputs low
77
I
V
CC
= 5.5 V,
Outputs open
mA
CC
OE and OE inactive
10
C
C
V
V
= 5 V,
= 5 V,
V = 2.5 V or 0.5 V
6
4
pF
pF
i
CC
I
V
O
= 2.5 V or 0.5 V
o
CC
†
All typical values are at V
= 5 V, T = 25°C.
A
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C = 50 pF (unless otherwise noted) (see Note 2)
L
V
T
= 5 V,
= 25°C
CC
A
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
MAX
UNIT
MIN
6.9
2.4
11
TYP
8.3
MAX
9.6
t
t
t
t
t
t
6.6
2
10.1
6.6
19.7
6.9
18
PLH
PHL
PLH
PHL
PLH
PHL
A
Y
Y
Y
ns
ns
ns
4.2
6
14.8
4.6
17.9
6.2
10.8
2.6
10
2OE
1OE
2.9
11.4
4.4
13.9
6.1
16.1
7.8
4
8.5
NOTE 2: Load circuits and voltage waveforms are shown in Section 1.
2−3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
2−4
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74BCT757DW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74BCT757DWE4
SN74BCT757DWG4
SN74BCT757DWR
SN74BCT757DWRE4
SN74BCT757DWRG4
SN74BCT757N
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
DW
DW
DW
DW
DW
N
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74BCT757NE4
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74BCT757DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC DW 20
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 41.0
SN74BCT757DWR
2000
Pack Materials-Page 2
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