SN74CBTH3383DBLE [TI]

CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, PDSO24, ssop-24;
SN74CBTH3383DBLE
型号: SN74CBTH3383DBLE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

CBT/FST/QS/5C/B SERIES, 10-BIT EXCHANGER, TRUE OUTPUT, PDSO24, ssop-24

光电二极管 输出元件 逻辑集成电路
文件: 总5页 (文件大小:79K)
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SN74CBTH3383  
10-BIT FET BUS-EXCHANGE SWITCH  
WITH BUS HOLD  
SCDS023G – MAY 1995 – REVISED OCTOBER 1998  
DB, DW, OR PW PACKAGE  
(TOP VIEW)  
Functionally Equivalent to QS3388  
5-Switch Connection Between Two Ports  
TTL-Compatible Input Levels  
V
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
BE  
1B1  
1A1  
1A2  
1B2  
2B1  
2A1  
2A2  
2B2  
3B1  
3A1  
GND  
CC  
5B2  
5A2  
5A1  
5B1  
4B2  
4A2  
4A1  
4B1  
2
Bus Hold on Data Inputs/Outputs  
Eliminates the Need for External  
Pullup/Pulldown Resistors  
3
4
5
Package Options Include Plastic  
Small-Outline (DW), Shrink Small-Outline  
(DB), and Thin Shrink Small-Outline (PW)  
Packages  
6
7
8
9
10  
11  
12  
15 3B2  
description  
3A2  
BX  
14  
13  
The SN74CBTH3383 provides ten bits of  
high-speed TTL-compatible bus switching or  
exchanging with bus hold on all I/Os. The low  
on-state resistance of the switch allows  
connection to be made with minimal propagation  
delay.  
The device operates as a 10-bit bus switch or a 5-bit bus exchanger, which provides swapping of the A and B  
pairs of signals. The bus-exchange function is selected when BE is low. The switches are open when BE is high.  
Active bus-hold circuitry is provided to hold unused or floating data inputs/outputs at a valid logic level.  
When the switch is turned off, the bus-hold circuit pulls all I/Os to V  
or to GND, depending on the last-known  
CC  
state of the pin. The bus-hold feature is active only when the SN74CBTH3383 I/Os are in the high-impedance  
state.  
The SN74CBTH3383 is characterized for operation from –40°C to 85°C.  
FUNCTION TABLE  
INPUTS  
INPUTS/OUTPUTS  
FUNCTION  
BE  
BX  
A1 PORT A2 PORT  
A1 port = B1 port  
A2 port = B2 port  
L
L
L
B1 port  
B2 port  
Z
B2 port  
B1 port  
Z
A2 port = B2 port  
A2 port = B1 port  
H
X
Disconnect  
All ports = bus hold  
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74CBTH3383  
10-BIT FET BUS-EXCHANGE SWITCH  
WITH BUS HOLD  
SCDS023G – MAY 1995 – REVISED OCTOBER 1998  
logic diagram (positive logic)  
3
2
5
1A1  
1B1  
1B2  
4
1A2  
21  
20  
23  
5A1  
5B1  
5B2  
22  
5A2  
1
BE  
13  
BX  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
to V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
DD  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA  
IK I/O  
Package thermal impedance, θ (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104°C/W  
JA  
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74CBTH3383  
10-BIT FET BUS-EXCHANGE SWITCH  
WITH BUS HOLD  
SCDS023G – MAY 1995 – REVISED OCTOBER 1998  
recommended operating conditions (see Note 3)  
MIN  
4
MAX  
UNIT  
V
V
V
V
Supply voltage  
5.5  
CC  
IH  
IL  
High-level control input voltage  
Low-level control input voltage  
Operating free-air temperature  
2
V
0.8  
85  
V
T
A
–40  
°C  
NOTE 3: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
TEST CONDITIONS  
I = –18 mA  
MIN TYP  
MAX  
–1.2  
±1  
UNIT  
V
V
V
V
V
V
V
V
V
V
= 4.5 V,  
= 5.5 V,  
= 4.5 V,  
= 4.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
= 5.5 V,  
IK  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
I
I
I
V = 5.5 V or GND  
I
µA  
µA  
µA  
µA  
µA  
µA  
mA  
pF  
I
V = 0.8 V  
I
100  
–100  
500  
BHL  
BHH  
§
I
V = 2 V  
I
I
V = 0 to 5.5 V  
I
BHLO  
#
I
V = 0 to 5.5 V  
I
–500  
BHHO  
CC  
I
I
O
= 0,  
V = V  
I
or GND  
3
CC  
||  
I  
Control inputs  
One input at 3.4 V,  
Other inputs at V  
or GND  
CC  
2.5  
CC  
C
C
Control inputs V = 3 V or 0  
3
6
i
I
V
O
= 3 V or 0,  
BE = V  
pF  
io(OFF)  
CC  
V
= 4 V,  
CC  
V = 2.4,  
I
I = 15 mA  
I
16  
22  
TYP at V  
= 4 V  
CC  
I = 64 mA  
I
5
5
7
7
r
on  
V = 0  
I
V
CC  
= 4.5 V,  
I = 30 mA  
I
V = 2.4 V,  
I
I = 15 mA  
I
10  
15  
All typical values are at V  
The bus hold circuit can sink at least the minimum low sustaining current at V max. I  
= 5 V (unless otherwise noted), T = 25°C.  
A
CC  
should be measured after lowering V to GND and  
BHL IN  
IL  
then raising it to V max.  
IL  
§
The bus hold circuit can source at least the minimum high sustaining current at V min. I  
should be measured after raising V to V  
IN  
and  
CC  
IH  
BHH  
then lowering it to V min.  
IH  
#
||  
An external driver must source at least I  
to switch this node from low to high.  
BHLO  
to switch this node from high to low.  
An external driver must sink at least I  
BHHO  
This is the increase in supply current for each input that is at the specified TTL voltage level rather than V  
or GND.  
CC  
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by  
the lowest voltage of the two (A or B) terminals.  
switching characteristics over recommended operating free-air temperature range, C = 50 pF  
L
(unless otherwise noted) (see Figure 1)  
V
= 5 V  
CC  
± 0.5 V  
V
= 4 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
CC  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
0.25  
9.2  
t
t
t
t
A or B  
BX  
B or A  
A or B  
A or B  
A or B  
0.35  
10.2  
9.6  
ns  
ns  
ns  
ns  
pd  
pd  
en  
dis  
1
1
1
BE  
8.6  
BE  
8.5  
7.5  
Thepropagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when  
driven by an ideal voltage source (zero output impedance).  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74CBTH3383  
10-BIT FET BUS-EXCHANGE SWITCH  
WITH BUS HOLD  
SCDS023G – MAY 1995 – REVISED OCTOBER 1998  
PARAMETER MEASUREMENT INFORMATION  
7 V  
Open  
TEST  
S1  
S1  
500 Ω  
t
pd  
/t  
Open  
7 V  
From Output  
Under Test  
t
GND  
PLZ PZL  
t
/t  
Open  
PHZ PZH  
C
= 50 pF  
L
500 Ω  
(see Note A)  
Output  
Control  
(low-level  
enabling)  
3 V  
0 V  
1.5 V  
1.5 V  
LOAD CIRCUIT  
t
t
PZL  
t
PLZ  
Output  
Waveform 1  
S1 at 7 V  
3.5 V  
3 V  
0 V  
1.5 V  
Input  
1.5 V  
1.5 V  
V
OL  
+ 0.3 V  
(see Note B)  
V
OL  
t
PHZ  
t
t
PHL  
PZH  
PLH  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
V
OH  
V
OH  
– 0.3 V  
0 V  
1.5 V  
Output  
1.5 V  
1.5 V  
OL  
VOLTAGE WAVEFORMS  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
C includes probe and jig capacitance.  
L
ENABLE AND DISABLE TIMES  
NOTES: A.  
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PHL  
are the same as t  
.
dis  
PLZ  
PZL  
PLH  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
Figure 1. Load Circuit and Voltage Waveforms  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1998, Texas Instruments Incorporated  

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