SN74CBTLV3251DRG4 [TI]
LOW-VOLTAGE 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER; 低电压1 -OF- 8的FET用/解复用器
| 型号： | SN74CBTLV3251DRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LOW-VOLTAGE 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER |
| 文件： | 总17页 (文件大小：739K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢉꢊ ꢋꢌ
ꢇꢍ ꢎꢏꢈꢍ ꢇꢆꢐꢑ ꢒ ꢌ ꢏꢍ ꢓꢏ ꢔ ꢓ ꢒꢆ ꢕ ꢖꢇꢆ ꢗꢘ ꢇꢒ ꢙꢒꢚꢛ ꢜꢒꢕ ꢖꢇꢆꢗ ꢘ ꢇꢒ ꢙꢒ ꢚ
SCDS054I − MARCH 1998 − REVISED OCTOBER 2003
D
D
D
5-Ω Switch Connection Between Two Ports
Rail-to-Rail Switching on Data I/O Ports
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
I
Supports Partial-Power-Down Mode
off
Operation
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
V
B4
B3
B2
B1
A
NC
OE
GND
1
2
3
4
5
6
7
8
16
CC
15 B5
14 B6
13 B7
12 B8
1
16
B3
B2
B1
A
NC
OE
15
14
13
12
11
10
2
3
4
5
6
7
B5
B6
B7
B8
S0
S1
11
10
9
S0
S1
S2
8
9
NC − No internal connection
NC − No internal connection
description/ordering information
The SN74CBTLV3251 device is a 1-of-8 high-speed FET multiplexer/demultiplexer. The low on-state resistance
of the switch allows connections to be made with minimal propagation delay.
The select inputs (S0, S1, S2) control the data flow. The FET multiplexers/demultiplexers are disabled when
the output-enable (OE) input is high.
This device is fully specified for partial-power-down applications using I . The I feature ensures that
off
off
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to V
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
through a pullup
CC
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
QFN − RGY
SOIC − D
Tape and reel
SN74CBTLV3251RGYR
SN74CBTLV3251D
CL251
Tube
CBTLV3251
Tape and reel
SN74CBTLV3251DR
SN74CBTLV3251DBQR
SN74CBTLV3251PWR
SN74CBTLV3251DGVR
−40°C to 85°C
SSOP (QSOP) − DBQ Tape and reel
CL251
CL251
CL251
TSSOP − PW
TVSOP − DGV
Tape and reel
Tape and reel
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢘ
ꢘ
ꢚ
ꢍ
ꢬ
ꢜ
ꢧ
ꢖ
ꢄ
ꢥ
ꢆ
ꢦ
ꢗ
ꢠ
ꢍ
ꢞ
ꢁ
ꢟ
ꢜ
ꢐ
ꢆ
ꢐ
ꢝ
ꢞ
ꢨ
ꢟ
ꢠ
ꢦ
ꢡ
ꢢ
ꢣ
ꢣ
ꢤ
ꢤ
ꢝ
ꢝ
ꢠ
ꢠ
ꢞ
ꢞ
ꢝ
ꢥ
ꢥ
ꢩ
ꢦ
ꢧ
ꢡ
ꢡ
ꢨ
ꢨ
ꢞ
ꢤ
ꢣ
ꢢ
ꢥ
ꢥ
ꢠ
ꢟ
ꢩ
ꢆꢨ
ꢧ
ꢪ
ꢥ
ꢫ
ꢝ
ꢦ
ꢣ
ꢥ
ꢤ
ꢝ
ꢤ
ꢠ
ꢡ
ꢞ
ꢧ
ꢬ
ꢣ
ꢞ
ꢤ
ꢤ
ꢨ
ꢥ
ꢭ
Copyright 2003, Texas Instruments Incorporated
ꢡ
ꢠ
ꢦ
ꢤ
ꢠ
ꢡ
ꢢ
ꢤ
ꢠ
ꢥ
ꢩ
ꢝ
ꢟ
ꢝ
ꢦ
ꢨ
ꢡ
ꢤ
ꢮ
ꢤ
ꢨ
ꢡ
ꢠ
ꢟ
ꢯ
ꢣ
ꢗ
ꢞ
ꢢ
ꢨ
ꢥ
ꢤ
ꢣ
ꢞ
ꢬ
ꢣ
ꢡ
ꢬ
ꢰ
ꢣ
ꢤ ꢨ ꢥ ꢤꢝ ꢞꢲ ꢠꢟ ꢣ ꢫꢫ ꢩꢣ ꢡ ꢣ ꢢ ꢨ ꢤ ꢨ ꢡ ꢥ ꢭ
ꢡ
ꢡ
ꢣ
ꢞ
ꢤ
ꢱ
ꢭ
ꢘ
ꢡ
ꢠ
ꢬ
ꢧ
ꢦ
ꢤ
ꢝ
ꢠ
ꢞ
ꢩ
ꢡ
ꢠ
ꢦ
ꢨ
ꢥ
ꢥ
ꢝ
ꢞ
ꢲ
ꢬ
ꢠ
ꢨ
ꢥ
ꢞ
ꢠ
ꢤ
ꢞ
ꢨ
ꢦ
ꢨ
ꢥ
ꢥ
ꢣ
ꢡ
ꢝ
ꢫ
ꢱ
ꢝ
ꢞ
ꢦ
ꢫ
ꢧ
ꢬ
ꢨ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈꢉ ꢊ ꢋꢌ
ꢇ ꢍꢎꢏꢈ ꢍꢇꢆꢐ ꢑꢒ ꢌ ꢏꢍ ꢓꢏꢔ ꢓꢒ ꢆ ꢕꢖ ꢇꢆꢗ ꢘ ꢇ ꢒꢙꢒ ꢚꢛꢜ ꢒꢕ ꢖꢇꢆ ꢗꢘ ꢇꢒ ꢙꢒꢚ
SCDS054I − MARCH 1998 − REVISED OCTOBER 2003
FUNCTION TABLE
INPUTS
FUNCTION
OE
L
S2
S1
L
S0
L
L
L
A port = B1 port
A port = B2 port
A port = B3 port
A port = B4 port
A port = B5 port
A port = B6 port
A port = B7 port
A port = B8 port
Disconnect
L
L
H
L
L
L
H
H
L
L
L
H
L
L
H
H
H
H
X
L
L
H
L
L
H
H
X
L
H
X
H
logic diagram (positive logic)
5
4
3
A
B1
B2
SW
SW
2
SW
B3
B4
B5
1
SW
15
14
13
SW
SW
B6
B7
B8
SW
12
SW
11
S0
10
S1
9
S2
7
OE
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢉꢊ ꢋꢌ
ꢇꢍ ꢎꢏꢈꢍ ꢇꢆꢐꢑ ꢒ ꢌ ꢏꢍ ꢓꢏ ꢔ ꢓ ꢒꢆ ꢕ ꢖꢇꢆ ꢗꢘ ꢇꢒ ꢙꢒꢚꢛ ꢜꢒꢕ ꢖꢇꢆꢗ ꢘ ꢇꢒ ꢙꢒ ꢚ
SCDS054I − MARCH 1998 − REVISED OCTOBER 2003
simplified schematic, each FET switch
A
B
(OE)
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
I
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
K
I/O
Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
(see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
MIN
2.3
1.7
2
MAX
UNIT
V
V
Supply voltage
3.6
V
CC
V
CC
V
CC
V
CC
V
CC
= 2.3 V to 2.7 V
= 2.7 V to 3.6 V
= 2.3 V to 2.7 V
= 2.7 V to 3.6 V
High-level control input voltage
V
IH
0.7
0.8
85
V
IL
Low-level control input voltage
Operating free-air temperature
V
T
A
−40
°C
NOTE 4: All unused control inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢇꢈꢉ ꢊ ꢋꢌ
ꢇ ꢍꢎꢏꢈ ꢍꢇꢆꢐ ꢑꢒ ꢌ ꢏꢍ ꢓꢏꢔ ꢓꢒ ꢆ ꢕꢖ ꢇꢆꢗ ꢘ ꢇ ꢒꢙꢒ ꢚꢛꢜ ꢒꢕ ꢖꢇꢆ ꢗꢘ ꢇꢒ ꢙꢒꢚ
SCDS054I − MARCH 1998 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
PARAMETER
TEST CONDITIONS
I = −18 mA
MIN TYP
MAX
−1.2
1
UNIT
V
V
IK
V
V
V
V
V
= 3 V,
CC
CC
CC
CC
CC
I
I
I
I
= 3.6 V,
= 0,
V = V
I CC
or GND
µA
µA
µA
µA
pF
I
V or V = 0 to 3.6 V
20
off
I
O
= 3.6 V,
= 3.6 V,
I
O
= 0,
V = V
I CC
or GND
10
CC
‡
∆I
CC
Control inputs
One input at 3 V,
Other inputs at V
CC
or GND
300
C
Control inputs V = 3 V or 0
I
3
i
A port
40.5
6
C
V
O
= 3 V or 0,
pF
OE = V
CC
io(OFF)
B port
I = 64 mA
5
8
8
I
V = 0
I
V
= 2.3 V,
CC
I = 24 mA
I
5
TYP at V
CC
= 2.5 V
V = 1.7 V,
I
I = 15 mA
I
27
40
§
on
r
Ω
I = 64 mA
5
5
7
7
I
V = 0
I
V
CC
= 3 V
I = 24 mA
I
V = 2.4 V,
I
I = 15 mA
I
10
15
†
‡
§
All typical values are at V
CC
= 3.3 V (unless otherwise noted), T = 25°C.
This is the increase in supply current for each input that is at the specified voltage level, rather than V
A
or GND.
CC
Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined
by the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
V
= 2.5 V
V
= 3.3 V
CC
0.2 V
CC
0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN MAX
MIN MAX
¶
A or B
B or A
A
0.15
6.1
4.1
3.5
5.2
6.7
0.25
5.3
3.6
3.3
4.5
7.2
t
pd
ns
S
1
1
1
1
1
1
1
1
1
1
t
t
t
t
B
ns
ns
ns
ns
S
en
dis
en
dis
B
S
A or B
A or B
OE
OE
¶
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢇꢈ ꢉꢊ ꢋꢌ
ꢇꢍ ꢎꢏꢈꢍ ꢇꢆꢐꢑ ꢒ ꢌ ꢏꢍ ꢓꢏ ꢔ ꢓ ꢒꢆ ꢕ ꢖꢇꢆ ꢗꢘ ꢇꢒ ꢙꢒꢚꢛ ꢜꢒꢕ ꢖꢇꢆꢗ ꢘ ꢇꢒ ꢙꢒ ꢚ
SCDS054I − MARCH 1998 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
TEST
S1
S1
t
/t
Open
Open
R
PLH PHL
L
From Output
Under Test
t
/t
2 × V
CC
GND
PLZ PZL
GND
t
/t
PHZ PZH
C
L
R
L
(see Note A)
C
V
∆
R
V
CC
L
L
2.5 V 0.2 V
3.3 V 0.3 V
500 Ω
500 Ω
0.15 V
0.3 V
30 pF
50 pF
LOAD CIRCUIT
V
CC
Timing Input
V
CC
/2
0 V
t
w
t
t
h
su
V
CC
V
CC
V
CC
/2
V
CC
/2
Input
V
CC
/2
V
CC
/2
Data Input
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
V
CC
CC
Output
Control
V
CC
/2
V
CC
/2
V
CC
/2
V
/2
Input
CC
0 V
V
0 V
t
t
t
t
t
PZL
PLZ
+ V
PHL
PLH
Output
Waveform 1
V
V
OH
CC
V
V
/2
/2
V
CC
/2
V
CC
/2
/2
Output
CC
S1 at 2 × V
(see Note B)
CC
V
OL
∆
V
OL
OL
t
t
t
PHL
PLH
/2
PZH
PHZ
− V
Output
Waveform 2
S1 at GND
V
V
V
OH
OH
V
OH
∆
V
CC
V
CC
CC
Output
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A.
C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2 ns, t ≤ 2 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
.
PLZ
PZL
PLH
PHZ
PZH
PHL
dis
are the same as t
en
are the same as t .
pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
74CBTLV3251DBQRE4
74CBTLV3251DBQRG4
74CBTLV3251DGVRE4
74CBTLV3251DGVRG4
74CBTLV3251PWRE4
74CBTLV3251PWRG4
74CBTLV3251RGYRG4
SN74CBTLV3251D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP/
QSOP
DBQ
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
DBQ
DGV
DGV
PW
PW
RGY
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TVSOP
TVSOP
TSSOP
TSSOP
QFN
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CBTLV3251DBQR
SN74CBTLV3251DE4
SN74CBTLV3251DG4
SN74CBTLV3251DGVR
SN74CBTLV3251DR
SN74CBTLV3251DRE4
SN74CBTLV3251DRG4
SN74CBTLV3251PWR
SN74CBTLV3251RGYR
SSOP/
QSOP
DBQ
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TVSOP
SOIC
DGV
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
QFN
PW
RGY
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
180
(mm)
0
SN74CBTLV3251DBQR
SN74CBTLV3251DGVR
SN74CBTLV3251DR
DBQ
DGV
D
16
16
16
16
16
SITE 27
SITE 41
SITE 27
SITE 41
SITE 41
6.4
6.8
6.5
7.0
3.8
5.2
4.0
2.1
1.6
2.1
1.6
1.5
8
8
8
8
8
12
16
16
12
12
Q1
Q1
Q1
Q1
Q1
12
16
10.3
5.6
SN74CBTLV3251PWR
SN74CBTLV3251RGYR
PW
RGY
12
12
4.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74CBTLV3251DBQR
SN74CBTLV3251DGVR
SN74CBTLV3251DR
DBQ
DGV
D
16
16
16
16
16
SITE 27
SITE 41
SITE 27
SITE 41
SITE 41
342.9
346.0
342.9
346.0
190.0
336.6
346.0
336.6
346.0
212.7
20.64
29.0
28.58
29.0
SN74CBTLV3251PWR
SN74CBTLV3251RGYR
PW
RGY
31.75
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号：
SN74CBTLV3251DWR
CBTLV/3B SERIES, 1 LINE TO 8 LINE MULTIPLEXER AND DEMUX/DECODER, TRUE OUTPUT, PDSO16, PLASTIC, SOIC-16
TI
©2020 ICPDF网 联系我们和版权申明