SN74HC04QPWRQ1 [TI]
HEX INVERTER; 六反相器
| 型号： | SN74HC04QPWRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | HEX INVERTER |
| 文件： | 总7页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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ꢄꢊꢋ ꢌꢁ ꢍꢊ ꢎ ꢏꢊ ꢎ
SCLS583 − MAY 2004
PW PACKAGE
(TOP VIEW)
D
Qualification in Accordance With
AEC-Q100
†
D
Qualified for Automotive Applications
1A
1Y
V
CC
1
2
3
4
5
6
7
14
13
12
11
D
Customer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
6A
6Y
5A
2A
2Y
D
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
3A
10 5Y
9
8
3Y
4A
4Y
GND
Low Power Consumption, 20-µA Max I
Typical t = 8 ns
pd
4-mA Output Drive at 5 V
CC
Low Input Current of 1 µA Max
†
Contact factory for details. Q100 qualification data available on
request.
description/ordering information
The SN74HC04 device contains six independent inverters. It performs the Boolean function Y = A in positive
logic.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
−40°C to 85°C
−40°C to 125°C
TSSOP − PW
TSSOP − PW
Tape and reel SN74HC04IPWRQ1
Tape and reel SN74HC04QPWRQ1
HC04I
HC04Q
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
logic diagram (positive logic)
A
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢄ ꢊꢋ ꢌ ꢁ ꢍꢊꢎ ꢏ ꢊꢎ
SCLS583 − MAY 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
CC
I
Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
IK
I
CC
Output clamp current, I
(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Continuous current through V
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package thermal impedance, θ (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
JA
stg
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN NOM
MAX
UNIT
V
Supply voltage
2
1.5
5
6
V
CC
IH
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 2 V
= 4.5 V
= 6 V
3.15
4.2
V
High-level input voltage
V
V
= 2 V
0.5
1.35
1.8
= 4.5 V
= 6 V
V
IL
Low-level input voltage
V
V
Input voltage
0
0
V
V
V
V
I
CC
Output voltage
O
CC
V
V
V
= 2 V
1000
500
400
85
CC
CC
CC
= 4.5 V
= 6 V
∆t/∆v
Input transition rise/fall time
ns
I-suffix device
Q-suffix device
−40
−40
T
A
Operating free-air temperature
°C
125
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS583 − MAY 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
= 25°C
SN74HC04Q
SN74HC04I
A
PARAMETER
TEST CONDITIONS
V
UNIT
CC
MIN
TYP
MAX
MIN
1.9
4.4
5.9
3.7
5.2
MAX
MIN
1.9
MAX
2 V
4.5 V
6 V
1.9 1.998
4.4 4.499
5.9 5.999
4.4
I
= −20 µA
OH
5.9
V
V
V = V or V
IH
V
OH
I
IL
I
I
= −4 mA
4.5 V
6 V
3.98
5.48
4.3
5.8
3.84
5.34
OH
= −5.2 mA
OH
2 V
0.002
0.001
0.001
0.17
0.15
0.1
0.1
0.1
0.1
0.26
0.26
100
2
0.1
0.1
0.1
0.1
4.5 V
6 V
I
= 20 µA
OL
0.1
0.1
V = V or V
V
OL
I
IH
IL
I
I
= 4 mA
4.5 V
6 V
0.4
0.33
0.33
1000
20
OL
= 5.2 mA
0.4
OL
I
I
V = V
or 0
6 V
1000
40
nA
µA
pF
I
I
CC
V = V
or 0,
I
O
= 0
6 V
CC
I
CC
C
2 V to 6 V
3
10
10
10
i
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
T = 25°C
A
SN74HC04Q
SN74HC04I
MIN MAX
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
V
UNIT
CC
MIN
TYP
45
9
MAX
95
MIN
MAX
145
29
2 V
4.5 V
6 V
120
24
20
95
19
16
19
t
t
A
Y
Y
ns
pd
8
16
25
2 V
38
8
75
110
22
4.5 V
6 V
15
ns
t
6
13
19
operating characteristics, T = 25°C
A
PARAMETER
TEST CONDITIONS
TYP
UNIT
C
Power dissipation capacitance per inverter
No load
20
pF
pd
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SCLS583 − MAY 2004
PARAMETER MEASUREMENT INFORMATION
V
CC
From Output
Under Test
Test
Point
Input
50%
50%
0 V
C
= 50 pF
L
t
t
PLH
PHL
90%
(see Note A)
V
V
OH
In-Phase
Output
90%
t
50%
10%
50%
10%
LOAD CIRCUIT
OL
t
r
f
f
t
t
PLH
PHL
90%
V
CC
V
V
90%
t
90%
OH
Input
50%
10%
50%
10%
90%
t
Out-of-Phase
Output
50%
10%
50%
10%
0 V
OL
t
r
f
t
r
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.
C includes probe and test-fixture capacitance.
L
O
r
f
C. The outputs are measured one at a time, with one input transition per measurement.
D. and t are the same as t
t
.
PLH
PHL pd
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
29-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SN74HC04IPWRQ1
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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www.ti.com/wireless
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