SN74LS174N3 [TI]
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR; HEX路/四路D型触发器与Clear型号: | SN74LS174N3 |
厂家: | TEXAS INSTRUMENTS |
描述: | HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR |
文件: | 总13页 (文件大小:403K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
Copyright 2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54174, SN54175, SN54LS174, SN54LS175, SN54S174, SN54S175,
SN74174, SN74175, SN74LS174, SN74LS175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54174, SN54175, SN74174, SN74175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS174, SN54LS175, SN74LS174, SN74LS175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54S174, SN54S175, SN74S174, SN74S175
HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
SDLS068A – DECEMBER 1972 – REVISED OCTOBER 2001
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CFP
Drawing
JM38510/01702BEA
JM38510/01702BFA
JM38510/07105BEA
JM38510/07105BFA
JM38510/07106BEA
JM38510/30106B2A
JM38510/30106BEA
JM38510/30106BFA
JM38510/30107B2A
JM38510/30107BEA
JM38510/30107BFA
JM38510/30107SEA
JM38510/30107SFA
SN54175J
OBSOLETE
OBSOLETE
ACTIVE
J
W
J
16
16
16
16
16
20
16
16
20
16
16
16
16
16
16
16
16
16
16
16
16
16
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
CDIP
CFP
1
1
1
1
1
1
1
1
1
1
1
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
ACTIVE
W
J
ACTIVE
CDIP
LCCC
CDIP
CFP
A42 SNPB
ACTIVE
FK
J
POST-PLATE N / A for Pkg Type
ACTIVE
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
ACTIVE
W
FK
J
ACTIVE
LCCC
CDIP
CFP
POST-PLATE N / A for Pkg Type
ACTIVE
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
ACTIVE
W
J
ACTIVE
CDIP
CFP
A42 SNPB
A42
ACTIVE
W
J
OBSOLETE
ACTIVE
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
PDIP
PDIP
SOIC
Call TI
SN54LS174J
J
1
1
1
1
A42 SNPB
A42 SNPB
A42 SNPB
A42 SNPB
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Call TI
SN54LS175J
ACTIVE
J
SN54S174J
ACTIVE
J
SN54S175J
ACTIVE
J
SN74174N
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
N
N
N
D
SN74175N
Call TI
Call TI
SN74175N3
Call TI
Call TI
SN74LS174D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS174DE4
SN74LS174DG4
SN74LS174DR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS174DRE4
SN74LS174DRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS174J
SN74LS174N
OBSOLETE
ACTIVE
CDIP
PDIP
J
16
16
TBD
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS174N3
SN74LS174NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS174NSR
SN74LS174NSRE4
SN74LS174NSRG4
ACTIVE
ACTIVE
ACTIVE
SO
SO
SO
NS
NS
NS
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
SN74LS175D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS175DE4
SN74LS175DG4
SN74LS175DR
SN74LS175DRE4
SN74LS175DRG4
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LS175J
SN74LS175N
OBSOLETE
ACTIVE
CDIP
PDIP
J
16
16
TBD
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS175N3
SN74LS175NE4
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS175NSR
SN74LS175NSRE4
SN74LS175NSRG4
ACTIVE
ACTIVE
ACTIVE
SO
SO
SO
NS
NS
NS
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S174J
SN74S174N
OBSOLETE
ACTIVE
CDIP
PDIP
J
16
16
TBD
Call TI
Call TI
N
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74S174N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
SN74S174NE4
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74S174NSR
SN74S174NSRE4
SN74S174NSRG4
SN74S175D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
D
16
16
16
16
16
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S175DE4
SN74S175DG4
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74S175DR
SN74S175N
OBSOLETE
ACTIVE
SOIC
PDIP
D
N
16
16
TBD
Call TI
Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74S175N3
OBSOLETE
ACTIVE
PDIP
PDIP
N
N
16
16
TBD
Call TI
Call TI
SN74S175NE4
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SN74S175NSR
ACTIVE
SO
NS
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
SN74S175NSRE4
SN74S175NSRG4
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SO
NS
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
NS
16
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54175J
SNJ54175W
OBSOLETE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
CFP
J
W
FK
J
16
16
20
16
16
20
16
16
20
16
16
20
16
16
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
SNJ54LS174FK
SNJ54LS174J
SNJ54LS174W
SNJ54LS175FK
SNJ54LS175J
SNJ54LS175W
SNJ54S174FK
SNJ54S174J
LCCC
CDIP
CFP
1
1
1
1
1
1
1
1
1
1
1
1
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
FK
J
LCCC
CDIP
CFP
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
W
FK
J
LCCC
CDIP
CFP
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
SNJ54S174W
SNJ54S175FK
SNJ54S175J
W
FK
J
LCCC
CDIP
CFP
POST-PLATE N / A for Pkg Type
A42 SNPB
A42
N / A for Pkg Type
N / A for Pkg Type
SNJ54S175W
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
330
(mm)
16
SN74LS174DR
SN74LS174NSR
SN74LS175DR
SN74LS175NSR
SN74S174NSR
SN74S175NSR
D
16
16
16
16
16
16
FMX
MLA
FMX
MLA
MLA
MLA
6.5
8.2
6.5
8.2
8.2
8.2
10.3
10.5
10.3
10.5
10.5
10.5
12.1
2.5
2
16
16
16
16
16
16
Q1
Q1
Q1
Q1
Q1
Q1
NS
D
16
12
2
16
12.1
2.5
NS
NS
NS
16
12
12
12
16
2.5
16
2.5
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN74LS174DR
SN74LS174NSR
SN74LS175DR
SN74LS175NSR
SN74S174NSR
SN74S175NSR
D
16
16
16
16
16
16
FMX
MLA
FMX
MLA
MLA
MLA
342.9
342.9
342.9
342.9
342.9
342.9
336.6
336.6
336.6
336.6
336.6
336.6
28.58
28.58
28.58
28.58
28.58
28.58
NS
D
NS
NS
NS
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jun-2007
Pack Materials-Page 3
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Copyright © 2007, Texas Instruments Incorporated
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