SN74LV175ADG4 [TI]

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR; 翻两番D型触发器与Clear
SN74LV175ADG4
型号: SN74LV175ADG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
翻两番D型触发器与Clear

触发器 锁存器 逻辑集成电路 光电二极管
文件: 总17页 (文件大小:512K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢂ ꢈꢉ ꢀꢁꢇ ꢃꢄꢅ ꢆꢇ ꢂꢈ  
ꢊ ꢋꢈꢌꢍ ꢋꢎꢄ ꢏ ꢌꢐꢑ ꢒꢎ ꢏ ꢓ ꢄ ꢔꢎ ꢐ ꢓꢄꢕ ꢎ ꢀ  
ꢖ ꢔꢑꢗ ꢘ ꢄꢏ ꢈꢍ  
SCLS400G − APRIL 1998 − REVISED APRIL 2005  
SN54LV175A . . . J OR W PACKAGE  
SN74LV175A . . . D, DB, DGV, NS, OR PW PACKAGE  
(TOP VIEW)  
D
D
D
D
D
D
D
2-V to 5.5-V V  
Operation  
CC  
Max t of 7.5 ns at 5 V  
pd  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
OLP  
CC  
= 3.3 V, T = 25°C  
CLR  
1Q  
1Q  
1D  
2D  
2Q  
2Q  
GND  
V
CC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
A
4Q  
4Q  
4D  
3D  
3Q  
3Q  
CLK  
Typical V  
>2.3 V at V  
(Output V  
Undershoot)  
OHV  
CC  
OH  
= 3.3 V, T = 25°C  
A
Support Mixed-Mode Voltage Operation on  
All Ports  
Contain Four Flip-Flops With Double-Rail  
Outputs  
Applications Include:  
− Buffer/Storage Registers  
− Shift Registers  
SN54LV175A . . . FK PACKAGE  
(TOP VIEW)  
− Pattern Generators  
D
D
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
3
2 1 20 19  
18 4Q  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
1Q  
1D  
NC  
2D  
2Q  
4
5
6
7
8
17  
4D  
NC  
3D  
3Q  
16  
15  
14  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
9 10 11 12 13  
The ’LV175A devices are quadruple D-type  
flip-flops designed for 2-V to 5.5-V V  
operation.  
CC  
NC − No internal connection  
These devices have a direct clear (CLR) input and  
feature complementary outputs from each  
flip-flop.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
Tube of 40  
SN74LV175AD  
SOIC − D  
LV175A  
Reel of 2500  
Reel of 2000  
Reel of 2000  
Tube of 90  
SN74LV175ADR  
SN74LV175ANSR  
SN74LV175ADBR  
SN74LV175APW  
SN74LV175APWR  
SN74LV175APWT  
SN74LV175ADGVR  
SNJ54LV175AJ  
SOP − NS  
74LV175A  
LV175A  
SSOP − DB  
−40°C to 85°C  
Reel of 2000  
Reel of 250  
Reel of 2000  
Tube of 25  
TSSOP − PW  
LV175A  
TVSOP − DGV  
CDIP − J  
LV175A  
SNJ54LV175AJ  
SNJ54LV175AW  
SNJ54LV175AFK  
−55°C to 125°C  
CFP − W  
Tube of 150  
Tube of 55  
SNJ54LV175AW  
SNJ54LV175AFK  
LCCC − FK  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design  
guidelines are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2005, Texas Instruments Incorporated  
ꢋ ꢁ ꢄꢏꢀꢀ ꢕ ꢑꢗ ꢏꢍꢖ ꢔꢀ ꢏ ꢁ ꢕꢑꢏꢌ ꢙꢚ ꢛꢜ ꢝꢞꢟ ꢠꢡꢢ ꢣꢙ ꢟꢞ ꢣꢙꢤ ꢛꢣꢜ ꢎꢍ ꢕ ꢌ ꢋ ꢘꢑ ꢔꢕ ꢁ  
ꢧꢤ ꢦ ꢤ ꢡ ꢢ ꢙ ꢢ ꢦ ꢜ ꢪ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢂꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆ ꢇꢂ ꢈ  
ꢊꢋ ꢈ ꢌꢍ ꢋ ꢎꢄ ꢏ ꢌ ꢐꢑꢒ ꢎ ꢏ ꢓꢄ ꢔ ꢎ ꢐꢓꢄꢕ ꢎ ꢀ  
ꢖꢔ ꢑ ꢗ ꢘ ꢄ ꢏꢈ ꢍ  
SCLS400G − APRIL 1998 − REVISED APRIL 2005  
description/ordering information (continued)  
Information at the data (D) inputs meeting the setup time requirements is transferred to the outputs on the  
positive-going edge of the clock (CLK) pulse.  
Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the  
positive-going edge of CLK. When CLK is at either the high or low level, the D input has no effect at the output.  
FUNCTION TABLE  
(each flip-flop)  
INPUTS  
OUTPUTS  
CLR  
L
CLK  
X
D
X
H
L
Q
L
Q
H
L
H
H
L
H
H
H
L
X
Q
Q
0
0
logic diagram (positive logic)  
1
CLR  
9
4
CLK  
1D  
2
3
1D  
C1  
1Q  
1Q  
R
To Three Other Channels  
Pin numbers shown are for the D, DB, DGV, J, NS, PW, and W packages.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢂ ꢈꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢇ ꢂꢈ  
ꢊ ꢋꢈꢌꢍ ꢋꢎꢄ ꢏ ꢌꢐꢑ ꢒꢎ ꢏ ꢓ ꢄꢔ ꢎ ꢐꢓ ꢄꢕ ꢎꢀ  
ꢖ ꢔꢑ ꢗ ꢘ ꢄꢏ ꢈꢍ  
SCLS400G − APRIL 1998 − REVISED APRIL 2005  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the high-impedance  
or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
O
O
Output voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
O
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA  
Continuous current through V  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Package thermal impedance, θ (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W  
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
2. This value is limited to 5.5 V maximum.  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢂꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆ ꢇꢂ ꢈ  
ꢊꢋ ꢈ ꢌꢍ ꢋ ꢎꢄ ꢏ ꢌ ꢐꢑꢒ ꢎ ꢏ ꢓꢄ ꢔ ꢎ ꢐꢓꢄꢕ ꢎ ꢀ  
ꢖꢔ ꢑ ꢗ ꢘ ꢄ ꢏꢈ ꢍ  
SCLS400G − APRIL 1998 − REVISED APRIL 2005  
recommended operating conditions (see Note 4)  
SN54LV175A  
SN74LV175A  
UNIT  
MIN  
2
MAX  
MIN  
2
MAX  
V
V
Supply voltage  
5.5  
5.5  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
1.5  
1.5  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2 V  
V
V
V
× 0.7  
V
V
V
× 0.7  
CC  
CC  
CC  
CC  
CC  
CC  
High-level input voltage  
V
V
IH  
× 0.7  
× 0.7  
× 0.7  
× 0.7  
0.5  
0.5  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
V
V
V
× 0.3  
× 0.3  
× 0.3  
V
V
V
× 0.3  
× 0.3  
× 0.3  
CC  
CC  
CC  
CC  
CC  
CC  
V
IL  
Low-level input voltage  
V
V
Input voltage  
0
0
5.5  
0
0
5.5  
V
V
I
Output voltage  
V
V
O
CC  
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
−50  
−2  
−50  
−2  
−6  
−12  
50  
2
µA  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2 V  
I
High-level output current  
Low-level output current  
OH  
OL  
−6  
mA  
−12  
50  
µA  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
= 2.3 V to 2.7 V  
= 3 V to 3.6 V  
= 4.5 V to 5.5 V  
2
I
6
6
mA  
12  
12  
200  
100  
20  
85  
200  
100  
20  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
T
−55  
125  
−40  
°C  
A
NOTE 4: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
SN54LV175A  
SN74LV175A  
PARAMETER  
TEST CONDITIONS  
UNIT  
V
CC  
MIN  
−0.1  
2
TYP  
MAX  
MIN  
−0.1  
2
TYP  
MAX  
I
I
I
I
I
I
I
I
= −50 µA  
2 V to 5.5 V  
2.3 V  
V
CC  
V
CC  
OH  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
= −2 mA  
= −6 mA  
= −12 mA  
= 50 µA  
= 2 mA  
V
V
V
OH  
3 V  
2.48  
3.8  
2.48  
3.8  
4.5 V  
2 V to 5.5 V  
2.3 V  
0.1  
0.4  
0.44  
0.55  
1
0.1  
0.4  
0.44  
0.55  
1
V
OL  
= 6 mA  
3 V  
= 12 mA  
4.5 V  
I
I
I
V = 5.5 V or GND  
0 to 5.5 V  
5.5 V  
µA  
µA  
µA  
pF  
I
I
V = V  
CC  
or GND,  
I = 0  
O
20  
20  
CC  
off  
I
V or V = 0 to 5.5 V  
0
5
5
I
O
C
V = V  
or GND  
3.3 V  
1.4  
1.4  
i
I
CC  
ꢝ ꢢ ꢜ ꢛ ꢮ ꢣ ꢧꢚ ꢤ ꢜ ꢢ ꢞꢥ ꢝꢢ ꢯ ꢢ ꢩ ꢞꢧ ꢡꢢ ꢣ ꢙꢪ ꢘ ꢚꢤ ꢦꢤ ꢟꢙ ꢢꢦ ꢛꢜ ꢙꢛ ꢟ ꢝꢤ ꢙꢤ ꢤꢣ ꢝ ꢞꢙ ꢚꢢꢦ  
ꢟ ꢚ ꢤ ꢣ ꢮꢢ ꢞꢦ ꢝꢛ ꢜ ꢟ ꢞꢣ ꢙꢛ ꢣꢠ ꢢ ꢙ ꢚꢢ ꢜ ꢢ ꢧꢦ ꢞ ꢝꢠꢟ ꢙꢜ ꢬ ꢛꢙꢚ ꢞꢠꢙ ꢣꢞꢙ ꢛꢟꢢ ꢪ  
ꢢꢜ  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢂ ꢈꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢇ ꢂꢈ  
ꢊ ꢋꢈꢌꢍ ꢋꢎꢄ ꢏ ꢌꢐꢑ ꢒꢎ ꢏ ꢓ ꢄꢔ ꢎ ꢐꢓ ꢄꢕ ꢎꢀ  
ꢖ ꢔꢑ ꢗ ꢘ ꢄꢏ ꢈꢍ  
SCLS400G − APRIL 1998 − REVISED APRIL 2005  
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 2.5 V 0.2 V  
CC  
T
= 25°C  
SN54LV175A SN74LV175A  
A
UNIT  
MIN  
6
MAX  
MIN  
6
MAX  
MIN  
6
MAX  
CLR low  
t
Pulse duration  
ns  
w
CLK high or low  
Data  
6.5  
7
7
7
7.5  
7.5  
1
7.5  
7.5  
1
t
t
ns  
ns  
Setup time before CLK↑  
su  
CLR inactive  
7
Hold time, data after CLK↑  
0.5  
h
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 3.3 V 0.3 V  
CC  
T
= 25°C  
SN54LV175A SN74LV175A  
A
UNIT  
MIN  
5
MAX  
MIN  
5
MAX  
MIN  
5
MAX  
CLR low  
t
Pulse duration  
ns  
w
CLK high or low  
Data  
5
5
5
5
5
5
t
t
ns  
ns  
Setup time before CLK↑  
su  
CLR inactive  
5
5
5
Hold time, data after CLK↑  
1
1
1
h
timing requirements over recommended operating free-air temperature range, V  
(unless otherwise noted) (see Figure 1)  
= 5 V 0.5 V  
CC  
T
= 25°C  
SN54LV175A SN74LV175A  
A
UNIT  
MIN  
5
MAX  
MIN  
5
MAX  
MIN  
5
MAX  
CLR low  
t
Pulse duration  
ns  
w
CLK high or low  
Data  
5
5
5
4
4
4
t
t
ns  
ns  
Setup time before CLK↑  
su  
CLR inactive  
5
5
5
Hold time, data after CLK↑  
1
1
1
h
switching characteristics over recommended operating free-air temperature range,  
V
= 2.5 V 0.2 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
105*  
80  
SN54LV175A SN74LV175A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
50*  
40  
MAX  
MIN  
45*  
35  
1*  
MAX  
MIN  
45  
35  
1
MAX  
C
C
= 15 pF  
= 50 pF  
L
L
f
t
max  
CLR  
CLK  
CLR  
CLK  
Any  
Any  
Any  
Any  
7.9* 16.6*  
9.3* 18.8*  
20*  
22*  
25.5  
27  
20  
22  
C
= 15 pF  
pd  
L
1*  
1
10.4  
12  
21.6  
23.3  
2
1
1
25.5  
27  
t
t
C
C
= 50 pF  
= 50 pF  
ns  
ns  
pd  
L
L
1
1
2
sk(o)  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
ꢝꢢ ꢜ ꢛ ꢮꢣ ꢧꢚ ꢤ ꢜ ꢢ ꢞꢥ ꢝꢢ ꢯ ꢢ ꢩꢞ ꢧꢡꢢ ꢣꢙꢪ ꢘ ꢚꢤ ꢦꢤ ꢟꢙ ꢢꢦ ꢛꢜ ꢙꢛ ꢟ ꢝꢤ ꢙꢤ ꢤꢣ ꢝ ꢞꢙ ꢚꢢꢦ  
ꢟ ꢚꢤ ꢣ ꢮꢢ ꢞꢦ ꢝꢛ ꢜ ꢟ ꢞꢣ ꢙꢛ ꢣꢠꢢ ꢙ ꢚꢢ ꢜ ꢢ ꢧꢦ ꢞꢝ ꢠꢟꢙ ꢜ ꢬ ꢛꢙꢚ ꢞꢠꢙ ꢣꢞꢙ ꢛꢟꢢ ꢪ  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢂꢈ ꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆ ꢇꢂ ꢈ  
ꢊꢋ ꢈ ꢌꢍ ꢋ ꢎꢄ ꢏ ꢌ ꢐꢑꢒ ꢎ ꢏ ꢓꢄ ꢔ ꢎ ꢐꢓꢄꢕ ꢎ ꢀ  
ꢖꢔ ꢑ ꢗ ꢘ ꢄ ꢏꢈ ꢍ  
SCLS400G − APRIL 1998 − REVISED APRIL 2005  
switching characteristics over recommended operating free-air temperature range,  
V
= 3.3 V 0.3 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
SN54LV175A SN74LV175A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
90*  
50  
MAX  
MIN  
75*  
45  
MAX  
MIN  
75  
45  
1
MAX  
C
C
= 15 pF  
= 50 pF  
155*  
120  
L
L
f
t
max  
CLR  
CLK  
CLR  
CLK  
Any  
Any  
Any  
Any  
5.5* 10.1*  
6.5* 11.5*  
1*  
12*  
12  
13.5  
15.5  
17  
C
= 15 pF  
pd  
L
1* 13.5*  
1
7.4  
8.4  
13.6  
15  
1
1
15.5  
17  
1
t
t
C
C
= 50 pF  
= 50 pF  
ns  
ns  
pd  
L
L
1
1.5  
1.5  
sk(o)  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
switching characteristics over recommended operating free-air temperature range,  
V
= 5 V 0.5 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
215*  
165  
3.7*  
4.6*  
5.3  
SN54LV175A SN74LV175A  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
150*  
85  
MAX  
MIN  
125*  
75  
1*  
MAX  
MIN  
125  
75  
1
MAX  
C
C
= 15 pF  
= 50 pF  
L
L
f
t
max  
CLR  
CLK  
CLR  
CLK  
Any  
Any  
Any  
Any  
6.4*  
7.3*  
8.4  
9.3  
1
7.5*  
8.5*  
9.5  
7.5  
8.5  
9.5  
10.5  
1
C
= 15 pF  
pd  
L
1*  
1
1
1
t
t
C
C
= 50 pF  
= 50 pF  
ns  
ns  
pd  
L
L
6
1
10.5  
1
sk(o)  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
noise characteristics, V  
= 3.3 V, C = 50 pF, T = 25°C (see Note 5)  
CC  
L
A
SN74LV175A  
PARAMETER  
UNIT  
MIN  
TYP  
0.3  
−0.3  
3
MAX  
V
V
V
V
V
Quiet output, maximum dynamic V  
0.8  
V
V
V
V
V
OL(P)  
OL(V)  
OH(V)  
IH(D)  
IL(D)  
OL  
Quiet output, minimum dynamic V  
Quiet output, minimum dynamic V  
High-level dynamic input voltage  
Low-level dynamic input voltage  
−0.8  
OL  
OH  
2.31  
0.99  
NOTE 5: Characteristics are for surface-mount packages only.  
operating characteristics, T = 25°C  
A
PARAMETER  
TEST CONDITIONS  
= 50 pF, f = 10 MHz  
L
V
TYP  
13.6  
14.5  
UNIT  
CC  
3.3 V  
C
Power dissipation capacitance  
C
pF  
pd  
5 V  
ꢝ ꢢ ꢜ ꢛ ꢮ ꢣ ꢧꢚ ꢤ ꢜ ꢢ ꢞꢥ ꢝꢢ ꢯ ꢢ ꢩ ꢞꢧ ꢡꢢ ꢣ ꢙꢪ ꢘ ꢚꢤ ꢦꢤ ꢟꢙ ꢢꢦ ꢛꢜ ꢙꢛ ꢟ ꢝꢤ ꢙꢤ ꢤꢣ ꢝ ꢞꢙ ꢚꢢꢦ  
ꢟ ꢚ ꢤ ꢣ ꢮꢢ ꢞꢦ ꢝꢛ ꢜ ꢟ ꢞꢣ ꢙꢛ ꢣꢠ ꢢ ꢙ ꢚꢢ ꢜ ꢢ ꢧꢦ ꢞ ꢝꢠꢟ ꢙꢜ ꢬ ꢛꢙꢚ ꢞꢠꢙ ꢣꢞꢙ ꢛꢟꢢ ꢪ  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅꢆ ꢇ ꢂ ꢈꢉ ꢀꢁ ꢇꢃ ꢄꢅ ꢆꢇ ꢂꢈ  
ꢊ ꢋꢈꢌꢍ ꢋꢎꢄ ꢏ ꢌꢐꢑ ꢒꢎ ꢏ ꢓ ꢄꢔ ꢎ ꢐꢓ ꢄꢕ ꢎꢀ  
ꢖ ꢔꢑ ꢗ ꢘ ꢄꢏ ꢈꢍ  
SCLS400G − APRIL 1998 − REVISED APRIL 2005  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Open  
S1  
R
= 1 kΩ  
L
TEST  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
GND  
t
t
/t  
Open  
PLH PHL  
/t  
C
C
L
t
V
CC  
L
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
V
CC  
Timing Input  
50% V  
CC  
0 V  
t
w
t
h
t
V
su  
CC  
V
CC  
50% V  
CC  
50% V  
CC  
Input  
Input  
Data Input  
50% V  
CC  
50% V  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
CC  
CC  
Output  
Control  
50% V  
CC  
50% V  
50% V  
CC  
50% V  
CC  
CC  
0 V  
0 V  
t
t
t
t
t
PLZ  
PLH  
PHL  
PZL  
Output  
Waveform 1  
V
V  
OH  
CC  
In-Phase  
Output  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
V
OL  
+ 0.3 V  
S1 at V  
(see Note B)  
CC  
V
OL  
OL  
t
PHL  
PLH  
t
t
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
OH  
Out-of-Phase  
Output  
V
OH  
− 0.3 V  
50% V  
CC  
50% V  
50% V  
CC  
CC  
0 V  
V
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
D. The outputs are measured one at a time, with one input transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
PLH  
are the same as t  
.
dis  
PLZ  
PZL  
PHL  
PHZ  
PZH  
are the same as t  
.
en  
are the same as t .  
pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
SN74LV175AD  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV175ADBR  
SN74LV175ADBRE4  
SN74LV175ADBRG4  
SN74LV175ADE4  
SSOP  
SSOP  
SSOP  
SOIC  
DB  
DB  
DB  
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV175ADG4  
SN74LV175ADGVR  
SN74LV175ADGVRE4  
SN74LV175ADGVRG4  
SN74LV175ADR  
SOIC  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TVSOP  
TVSOP  
TVSOP  
SOIC  
DGV  
DGV  
DGV  
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV175ADRE4  
SN74LV175ADRG4  
SN74LV175ANSR  
SN74LV175ANSRE4  
SN74LV175ANSRG4  
SN74LV175APW  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV175APWE4  
SN74LV175APWG4  
SN74LV175APWR  
SN74LV175APWRE4  
SN74LV175APWRG4  
SN74LV175APWT  
SN74LV175APWTE4  
SN74LV175APWTG4  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
TAPE AND REEL BOX INFORMATION  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
330  
330  
330  
330  
(mm)  
16  
SN74LV175ADBR  
SN74LV175ADGVR  
SN74LV175ADR  
DB  
DGV  
D
16  
16  
16  
16  
16  
SITE 41  
SITE 41  
SITE 27  
SITE 41  
SITE 41  
8.2  
6.8  
6.5  
8.2  
7.0  
6.6  
4.0  
2.5  
1.6  
2.1  
2.5  
1.6  
12  
8
16  
16  
16  
16  
12  
Q1  
Q1  
Q1  
Q1  
Q1  
12  
16  
10.3  
10.5  
5.6  
8
SN74LV175ANSR  
SN74LV175APWR  
NS  
16  
12  
8
PW  
12  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
SN74LV175ADBR  
SN74LV175ADGVR  
SN74LV175ADR  
DB  
DGV  
D
16  
16  
16  
16  
16  
SITE 41  
SITE 41  
SITE 27  
SITE 41  
SITE 41  
346.0  
346.0  
342.9  
346.0  
346.0  
346.0  
346.0  
336.6  
346.0  
346.0  
33.0  
29.0  
28.58  
33.0  
29.0  
SN74LV175ANSR  
SN74LV175APWR  
NS  
PW  
Pack Materials-Page 2  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

相关型号:

SN74LV175ADGV

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ADGVR

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ADGVRE4

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ADGVRG4

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ADR

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ADRE4

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ADRG4

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ANS

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ANSE4

LV/LV-A/LVX/H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, PLASTIC, SOP-16
TI

SN74LV175ANSR

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ANSRE4

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI

SN74LV175ANSRG4

QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
TI