SN74LVC1G66DCKRE4 [TI]
SINGLE BILATERAL ANALOG SWITCH; 单双边模拟开关型号: | SN74LVC1G66DCKRE4 |
厂家: | TEXAS INSTRUMENTS |
描述: | SINGLE BILATERAL ANALOG SWITCH |
文件: | 总20页 (文件大小:687K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
FEATURES
•
Available in the Texas Instruments
NanoFree™ Package
•
•
•
Low On-State Resistance, Typically ≈5.5 Ω
(VCC = 4.5 V)
•
•
•
•
•
•
1.65-V to 5.5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 0.8 ns at 3.3 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
High On-Off Output Voltage Ratio
High Degree of Linearity
1000-V Charged-Device Model (C101)
High Speed, Typically 0.5 ns
(VCC = 3 V, CL = 50 pF)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
3
4
C
GND
B
1
2
3
5
A
B
V
CC
A
B
V
CC
1
2
3
5
1
2
3
5
4
A
B
V
CC
2
1
5
V
A
CC
4
GND
C
4
GND
C
C
GND
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This single analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G66 can handle both analog and digital signals. The device permits signals with amplitudes of
up to 5.5 V (peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
_ _ _C6_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Reel of 3000
SN74LVC1G66YZPR
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 4000
SN74LVC1G66DBVR
SN74LVC1G66DBVT
SN74LVC1G66DCKR
SN74LVC1G66DCKT
SN74LVC1G66DRLR
SOT (SOT-23) – DBV
C66_
C6_
–40°C to 85°C
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
FUNCTION TABLE
CONTROL
INPUT
(C)
SWITCH
L
OFF
ON
H
LOGIC DIAGRAM (POSITIVE LOGIC)
1
4
2
B
A
C
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
MAX
6.5
6.5
UNIT
VCC
VI
Supply voltage range(2)
Input voltage range(2)(3)
V
V
VI/O
IIK
Switch I/O voltage range(2)(3)(4)
Control input clamp current
I/O port diode current
–0.5 VCC + 0.5
V
VI < 0
–50
±50
±50
±100
206
252
142
132
mA
mA
mA
mA
IIOK
IT
VI/O < 0 or VI/O > VCC
VI/O < 0 to VCC
On-state switch current
Continuous current through VCC or GND
DBV package
DCK package
DRL package
YZP package
θJA
Package thermal impedance(5)
°C/W
°C
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) This value is limited to 5.5 V maximum.
(5) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
Recommended Operating Conditions(1)
MIN
1.65
MAX UNIT
VCC
VI/O
Supply voltage
I/O port voltage
5.5
V
V
0
VCC
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
V
CC × 0.65
V
CC × 0.7
CC × 0.7
CC × 0.7
VIH
High-level input voltage, control input
V
V
V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
V
CC × 0.35
V
CC × 0.3
CC × 0.3
CC × 0.3
5.5
VIL
VI
Low-level input voltage, control input
Control input voltage
V
V
V
V
VCC = 4.5 V to 5.5 V
0
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
20
20
∆t/∆v
TA
Input transition rise/fall time
Operating free-air temperature
ns/V
°C
10
VCC = 4.5 V to 5.5 V
10
–40
85
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IS = 4 mA
VCC
1.65 V
2.3 V
3 V
MIN TYP(1)
MAX UNIT
12
9
30
VI = VCC or GND,
VC = VIH
IS = 8 mA
IS = 24 mA
IS = 32 mA
IS = 4 mA
IS = 8 mA
IS = 24 mA
IS = 32 mA
20
Ω
ron
On-state switch resistance
(see Figure 1 and
Figure 2)
7.5
5.5
74.5
20
15
4.5 V
1.65 V
2.3 V
3 V
10
120
VI = VCC or GND,
VC = VIH
(see Figure 1 and
Figure 2)
30
Ω
ron(p)
Peak on resistance
11.5
7.5
20
4.5 V
15
VI = VCC and VO = GND or
±1
Off-state switch leakage
current
IS(off)
VI = GND and VO = VCC
,
5.5 V
µA
±0.1(1)
VC = VIL (see Figure 3)
±1
µA
On-state switch leakage
current
VI = VCC or GND, VC = VIH, VO = Open
(see Figure 4)
IS(on)
5.5 V
5.5 V
5.5 V
±0.1(1)
±1
µA
II
Control input current
Supply current
VC = VCC or GND
±0.1(1)
10
µA
ICC
VC = VCC or GND
VC = VCC – 0.6 V
1(1)
∆ICC
Supply current change
5.5 V
5 V
500
µA
Cic
Control input capacitance
2
6
pF
Switch input/output
capacitance
Cio(off)
Cio(on)
5 V
5 V
pF
pF
Switch input/output
capacitance
13
(1) TA = 25°C
3
Submit Documentation Feedback
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 5)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
FROM
(INPUT)
TO
(OUTPUT)
± 0.5 V
MIN MAX
0.6
PARAMETER
UNIT
MIN
MAX MIN
MAX MIN
1.2
MAX
0.8
5
(1)
tpd
A or B
B or A
A or B
A or B
2
12
10
ns
ns
ns
(2)
ten
C
C
2.5
2.2
1.9
1.4
6.5
6.9
1.8
2
1.5
1.4
4.2
5
(3)
tdis
6.5
(1) tPLH and tPHL are the same as tpd. The propagation delay is the calculated RC time constant of the typical on-state resistance of the
switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
(2) tPZL and tPZH are the same as ten
.
(3) tPLZ and tPHZ are the same as tdis
.
Analog Switch Characteristics
TA = 25°C
FROM
PARAMETER
TO
(OUTPUT)
TEST
CONDITIONS
VCC
TYP UNIT
(INPUT)
1.65 V
2.3 V
3 V
35
120
175
CL = 50 pF, RL = 600 Ω,
fin = sine wave
(see Figure 6)
Frequency response(1)
A or B
4.5 V
1.65 V
2.3 V
3 V
195
MHz
>300
B or A
A or B
B or A
(switch ON)
CL = 5 pF, RL = 50 Ω,
fin = sine wave
(see Figure 6)
>300
>300
>300
35
4.5 V
1.65 V
2.3 V
3 V
CL = 50 pF, RL = 600 Ω,
fin = 1 MHz (square wave)
(see Figure 7)
50
Crosstalk
(control input to signal output)
C
mV
70
4.5 V
1.65 V
2.3 V
3 V
100
–58
–58
–58
CL = 50 pF, RL = 600 Ω,
fin = 1 MHz (sine wave)
(see Figure 8)
Feedthrough attenuation(2)
A or B
4.5 V
1.65 V
2.3 V
3 V
–58
dB
(switch OFF)
–42
CL = 5 pF, RL = 50 Ω,
fin = 1 MHz (sine wave)
(see Figure 8)
–42
–42
4.5 V
1.65 V
2.3 V
3 V
–42
0.1
CL = 50 pF, RL = 10 kΩ,
fin = 1 kHz (sine wave)
(see Figure 9)
0.025
0.015
4.5 V
1.65 V
2.3 V
3 V
0.01
%
Sine-wave distortion
A or B
B or A
0.15
CL = 50 pF, RL = 10 kΩ,
fin = 10 kHz (sine wave)
(see Figure 9)
0.025
0.015
0.01
4.5 V
(1) Adjust fin voltage to obtain 0 dBm at output. Increase fin frequency until dB meter reads –3 dB.
(2) Adjust fin voltage to obtain 0 dBm at input.
4
Submit Documentation Feedback
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
Operating Characteristics
TA = 25°C
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TEST
CONDITIONS
PARAMETER
UNIT
TYP
TYP
TYP
Cpd
Power dissipation capacitance
f = 10 MHz
8
9
9
11
pF
5
Submit Documentation Feedback
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
V
CC
V
CC
B or A
A or B
V = V or GND
V
I
CC
O
C
V
IH
V
C
(ON)
GND
I
S
VI * VO
W
ron
+
IS
V
V − V
I
O
Figure 1. On-State Resistance Test Circuit
100
V
CC
= 1.65 V
V
CC
= 2.3 V
V
CC
= 3.0 V
10
V
CC
= 4.5 V
1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
V
IN
− V
Figure 2. Typical ron as a Function of Input Voltage (VI) for VI = 0 to VCC
6
Submit Documentation Feedback
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
V
CC
V
CC
B or A
A or B
V
I
A
V
V
O
C
IL
V
C
(OFF)
GND
Condition 1: V = GND, V = V
CC
I
O
Condition 2: V = V , V = GND
I
CC
O
Figure 3. Off-State Switch Leakage-Current Test Circuit
V
CC
CC
V
B or A
A or B
A
V = V or GND
V
O
I
CC
V
O
= Open
C
V
IH
V
C
(ON)
GND
Figure 4. On-State Switch Leakage-Current Test Circuit
7
Submit Documentation Feedback
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
V
LOAD
S1
Open
R
L
From Output
Under Test
TEST
/t
S1
GND
t
t
Open
PLH PHL
C
L
t
/t
V
R
L
PLZ PZL
LOAD
GND
(see Note A)
/t
PHZ PZH
LOAD CIRCUIT
INPUTS
V
CC
V
M
V
LOAD
C
L
R
L
V
∆
V
I
t /t
r f
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
V
CC
V
CC
V
CC
V
CC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
V
/2
CC
/2
CC
/2
CC
/2
CC
2 × V
2 × V
2 × V
2 × V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
CC
CC
CC
CC
V
V
V
0.3 V
V
I
Timing Input
Data Input
V
M
0 V
t
w
t
t
h
su
V
I
V
I
Input
V
M
V
M
V
M
V
M
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
I
V
I
Output
Control
V
M
V
M
Input
V
M
V
M
0 V
0 V
t
t
t
t
t
PHL
PZL
PLZ
PLH
Output
Waveform 1
V
V
OH
V
V
/2
LOAD
V
V
V
M
M
Output
V
V
M
S1 at V
LOAD
V
OL
+ V
∆
OL
(see Note B)
OL
t
PHL
PLH
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
V
OH
V
OH
V
− V
∆
V
M
OH
M
Output
M
≈0 V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 5. Load Circuit and Voltage Waveforms
8
Submit Documentation Feedback
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
V
CC
V
CC
0.1 µF
B or A
A or B
C
V
O
R
L
C
L
V
IH
50 Ω
f
in
V
C
(ON)
GND
V /2
CC
R /C : 600 Ω/50 pF
L
L
R /C : 50 Ω/5 pF
L
L
Figure 6. Frequency Response (Switch ON)
V
CC
CC
V
R
in
600 Ω
B or A
A or B
C
V /2
CC
V
O
R
L
C
L
600 Ω
50 pF
V
C
GND
V /2
CC
50 Ω
Figure 7. Crosstalk (Control Input – Switch Output)
9
Submit Documentation Feedback
SN74LVC1G66
SINGLE BILATERAL ANALOG SWITCH
www.ti.com
SCES323L–JUNE 2001–REVISED JANUARY 2007
PARAMETER MEASUREMENT INFORMATION
V
CC
V
CC
0.1 µF
50 Ω
B or A
A or B
C
V
O
C
L
R
L
R
L
V
IL
V
C
f
in
(OFF)
GND
V /2
CC
V /2
CC
R /C : 600 Ω/50 pF
L
L
R /C : 50 Ω/5 pF
L
L
Figure 8. Feedthrough (Switch OFF)
V
CC
CC
V
10 µF
10 µF
B or A
A or B
C
V
O
C
L
R
10 kΩ
L
V
IH
50 pF
600 Ω
V
C
f
in
(ON)
GND
V /2
CC
V
CC
V
CC
V
CC
V
CC
= 1.65 V, V = 1.4 V
I P-P
= 2.3 V, V = 2 V
I
P-P
P-P
P-P
= 3 V, V = 2.5 V
I
= 4.5 V, V = 4 V
I
Figure 9. Sine-Wave Distortion
10
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2008
PACKAGING INFORMATION
Orderable Device
SN74LVC1G66DBVR
SN74LVC1G66DBVRE4
SN74LVC1G66DBVRG4
SN74LVC1G66DBVT
SN74LVC1G66DBVTE4
SN74LVC1G66DBVTG4
SN74LVC1G66DCKR
SN74LVC1G66DCKRE4
SN74LVC1G66DCKRG4
SN74LVC1G66DCKT
SN74LVC1G66DCKTE4
SN74LVC1G66DCKTG4
SN74LVC1G66DRLR
SN74LVC1G66DRLRG4
SN74LVC1G66YZPR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
DCK
DRL
DRL
YZP
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2008
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC1G66 :
Automotive: SN74LVC1G66-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Sep-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74LVC1G66DBVR
SN74LVC1G66DBVT
SN74LVC1G66DCKR
SN74LVC1G66DCKR
SN74LVC1G66DCKT
SN74LVC1G66DRLR
SN74LVC1G66YZPR
SOT-23
SOT-23
SC70
DBV
DBV
DCK
DCK
DCK
DRL
YZP
5
5
5
5
5
5
5
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
9.2
9.2
9.2
9.2
9.2
9.2
8.4
3.23
3.23
2.24
2.24
2.24
1.78
1.02
3.17
3.17
2.34
2.34
2.34
1.78
1.52
1.37
1.37
1.22
1.22
1.22
0.69
0.63
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q1
3000
3000
250
SC70
SC70
SOT
4000
3000
DSBGA
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Sep-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN74LVC1G66DBVR
SN74LVC1G66DBVT
SN74LVC1G66DCKR
SN74LVC1G66DCKR
SN74LVC1G66DCKT
SN74LVC1G66DRLR
SN74LVC1G66YZPR
SOT-23
SOT-23
SC70
DBV
DBV
DCK
DCK
DCK
DRL
YZP
5
5
5
5
5
5
5
3000
250
202.0
202.0
205.0
202.0
202.0
202.0
220.0
201.0
201.0
200.0
201.0
201.0
201.0
220.0
28.0
28.0
33.0
28.0
28.0
28.0
34.0
3000
3000
250
SC70
SC70
SOT
4000
3000
DSBGA
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号:
SN74LVC1G66DCKTE4
1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5, GREEN, PLASTIC, SC-70, 5 PIN
ROCHESTER
©2020 ICPDF网 联系我们和版权申明