SN74LVC2G74-Q1_15 [TI]

SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET;
SN74LVC2G74-Q1_15
型号: SN74LVC2G74-Q1_15
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

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SN74LVC2G74-Q1  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES563BMARCH 2004REVISED AUGUST 2006  
FEATURES  
Qualification in Accordance With  
AEC-Q100  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
(1)  
Qualified for Automotive Applications  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Customer-Specific Configuration Control Can  
Be Supported Along With Major-Change  
Approval  
– 1000-V Charged-Device Model (C101)  
Supports 5-V VCC Operation  
DCU PACKAGE  
(TOP VIEW)  
Inputs Accept Voltages to 5.5 V  
Max tpd of 6.9 ns at 3.3 V  
VCC  
PRE  
CLR  
Q
1
2
3
4
8
7
6
5
CLK  
D
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
Q
Typical VOLP (Output Ground Bounce) <0.8 V  
GND  
at VCC = 3.3 V, TA = 25°C  
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
Ioff Supports Partial-Power-Down Mode  
Operation  
(1) Contact factory for details. Q100 qualification data available  
on request.  
DESCRIPTION/ORDERING INFORMATION  
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.  
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the  
other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time  
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs  
at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval,  
data at the D input can be changed without affecting the levels at the outputs.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
C74_  
–40°C to 125°C  
VSSOP – DCU Reel of 3000  
SN74LVC2G74QDCURQ1  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LVC2G74-Q1  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES563BMARCH 2004REVISED AUGUST 2006  
FUNCTION TABLE  
INPUTS  
OUTPUTS  
PRE  
L
CLR  
H
CLK  
X
D
X
X
X
H
L
Q
H
L
Q
L
H
L
X
H
H(1)  
L
L
X
H(1)  
H
H
H
L
H
H
L
H
H
H
L
X
Q0  
Q 0  
(1) This configuration is nonstable; that is, it does not persist when  
PRE or CLR returns to its inactive (high) level.  
LOGIC DIAGRAM (POSITIVE LOGIC)  
7
1
PRE  
CLK  
C
C
C
5
Q
TG  
C
C
C
C
2
6
D
TG  
TG  
TG  
3
Q
C
C
C
CLR  
2
Submit Documentation Feedback  
SN74LVC2G74-Q1  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES563BMARCH 2004REVISED AUGUST 2006  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX  
6.5  
UNIT  
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high or low state(2)(3)  
6.5  
V
VO  
VO  
IIK  
6.5  
–0.5 VCC + 0.5  
Input clamp current  
VI < 0  
–50  
–50  
IOK  
IO  
Output clamp current  
VO < 0  
mA  
Continuous output current  
Continuous current through VCC or GND  
Package thermal impedance(4)  
Storage temperature range  
±50  
±100  
227  
θJA  
°C/W  
°C  
Tstg  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCC is provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
3
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SN74LVC2G74-Q1  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES563BMARCH 2004REVISED AUGUST 2006  
Recommended Operating Conditions(1)  
MIN  
1.65  
MAX UNIT  
Operating  
5.5  
V
VCC  
Supply voltage  
Data retention only  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
1.5  
0.65 × VCC  
1.7  
VIH  
High-level input voltage  
V
2
VCC = 4.5 V to 5.5 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
0.7 × VCC  
0.35 × VCC  
0.7  
VIL  
Low-level input voltage  
V
0.8  
VCC = 4.5 V to 5.5 V  
0.3 × VCC  
5.5  
VCC  
–4  
VI  
Input voltage  
0
0
V
V
VO  
Output voltage  
VCC = 1.65 V  
VCC = 2.3 V  
–8  
IOH  
High-level output current  
Low-level output current  
–16  
–24  
–24  
4
mA  
mA  
VCC = 3 V  
VCC = 4.5 V  
VCC = 1.65 V  
VCC = 2.3 V  
8
IOL  
16  
VCC = 3 V  
24  
VCC = 4.5 V  
24  
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V  
VCC = 3.3 V ± 0.3 V  
VCC = 5 V ± 0.5 V  
20  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
10  
ns/V  
5
TA  
40  
125  
°C  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
4
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SN74LVC2G74-Q1  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES563BMARCH 2004REVISED AUGUST 2006  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
1.65 V to 5.5 V  
1.65 V  
2.3 V  
MIN TYP(1) MAX  
VCC – 0.1  
UNIT  
IOH = –100 µA  
IOH = –4 mA  
IOH = –8 mA  
IOH = –16 mA  
1.2  
1.85  
2.4  
VOH  
V
3 V  
3 V  
2.3  
IOH = –24 mA  
4.5 V  
3.8  
IOL = 100 µA  
IOL = 4 mA  
IOL = 8 mA  
IOL = 16 mA  
1.65 V to 5.5 V  
1.65 V  
2.3 V  
0.1  
0.45  
0.3  
VOL  
V
3 V  
0.4  
3 V  
0.55  
0.55  
IOL = 24 mA  
4.5 V  
Data or  
control inputs  
II  
VI = 5.5 V or GND  
0 to 5.5 V  
±5  
µA  
Ioff  
VI or VO = 5.5 V  
0
±10  
10  
µA  
µA  
µA  
pF  
ICC  
ICC  
Ci  
VI = 5.5 V or GND,  
IO = 0  
1.65 V to 5.5 V  
3 V to 5.5 V  
3.3 V  
One input at VCC – 0.6 V,  
VI = VCC or GND  
Other inputs at VCC or GND  
500  
5
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
Timing Requirements  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)  
VCC = 1.8 V  
VCC = 2.5 V  
VCC = 3.3 V  
VCC = 5 V  
± 0.15 V  
± 0.2 V  
± 0.3 V  
± 0.5 V  
UNIT  
MIN MAX MIN  
MAX  
MIN  
MAX  
120  
MIN MAX  
140  
fclock  
tw  
80  
120  
MHz  
ns  
CLK  
6.2  
6.2  
3.5  
2.5  
0
3.5  
3.5  
2.3  
2
3.5  
3.5  
1.9  
1.8  
0.5  
3.3  
Pulse duration  
PRE or CLR low  
Data  
3.3  
1.7  
tsu  
th  
Setup time before CLK↑  
ns  
ns  
PRE or CLR inactive  
1.6  
Hold time, data after CLK↑  
0.3  
0.8  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
80  
MAX MIN  
MAX MIN  
MAX MIN MAX  
fmax  
120  
2.2  
3
120  
2.2  
2.6  
1.7  
140  
MHz  
Q
Q
4.8  
6
14.4  
16  
8.1  
9.7  
9.5  
6.9  
7.2  
7.9  
1.4  
1.6  
1.6  
5.1  
5.4  
6.1  
CLK  
tpd  
ns  
PRE or CLR  
Q or Q  
4.4  
14.9  
2.3  
5
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SN74LVC2G74-Q1  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES563BMARCH 2004REVISED AUGUST 2006  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V  
VCC = 5 V  
PARAMETER  
TEST CONDITIONS  
UNIT  
TYP  
TYP  
TYP  
TYP  
Cpd  
Power dissipation capacitance  
f = 10 MHz  
35  
35  
37  
40  
pF  
6
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SN74LVC2G74-Q1  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES563BMARCH 2004REVISED AUGUST 2006  
PARAMETER MEASUREMENT INFORMATION  
VLOAD  
Open  
GND  
S1  
RL  
From Output  
Under Test  
TEST  
tPLH/tPHL  
tPLZ/tPZL  
tPHZ/tPZH  
S1  
Open  
VLOAD  
GND  
CL  
(see Note A)  
RL  
LOAD CIRCUIT  
VCC  
INPUTS  
VM  
VLOAD  
CL  
RL  
V∆  
VI  
tr/tf  
VCC  
VCC  
3 V  
VCC  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
3.3 V ± 0.3 V  
5 V ± 0.5 V  
2 ns  
2 ns  
2.5 ns  
2.5 ns  
VCC/2  
VCC/2  
1.5 V  
VCC/2  
2 × VCC  
2 × VCC  
6 V  
30 pF  
30 pF  
50 pF  
50 pF  
1 kΩ  
0.15 V  
0.15 V  
0.3 V  
500  
500 Ω  
500 Ω  
2 × VCC  
0.3 V  
VI  
Timing Input  
Data Input  
VM  
0 V  
tW  
tsu  
th  
VI  
VI  
Input  
VM  
VM  
VM  
VM  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
VI  
VI  
Output  
Control  
VM  
VM  
Input  
VM  
VM  
0 V  
0 V  
tPZL  
tPLZ  
tPLH  
tPHL  
VM  
Output  
Waveform 1  
S1 at VLOAD  
VOH  
VOL  
VLOAD/2  
VOL  
VM  
VM  
Output  
Output  
VOL + V∆  
(see Note B)  
tPHL  
tPLH  
tPZH  
tPHZ  
VOH  
VOL  
Output  
Waveform 2  
S1 at GND  
VOH  
VOH – V∆  
VM  
VM  
VM  
0 V  
(see Note B)  
VOLTAGE WAVEFORMS  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
ENABLE AND DISABLE TIMES  
INVERTING AND NONINVERTING OUTPUTS  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. CL includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators have the following characteristics: PRR 10 MHz, ZO = 50 .  
D. The outputs are measured one at a time, with one transition per measurement.  
E. tPLZ and tPHZ are the same as tdis.  
F. tPZL and tPZH are the same as ten.  
G. tPLH and tPHL are the same as tpd.  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
7
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PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Apr-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SN74LVC2G74QDCURQ1  
ACTIVE  
US8  
DCU  
8
3000  
Pb-Free  
(RoHS)  
NIPDAU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
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