SN74LVCH162244A_14 [TI]

16-Bit Buffer/Driver with 3-State Outputs;
SN74LVCH162244A_14
型号: SN74LVCH162244A_14
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-Bit Buffer/Driver with 3-State Outputs

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中文:  中文翻译
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SN74LVCH162244A  
16-BIT BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS545KOCTOBER 1995REVISED MARCH 2005  
FEATURES  
DL, DGG, OR DGV PACKAGE  
(TOP VIEW)  
Member of the Texas Instruments Widebus™  
Family  
1
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
1OE  
1Y1  
1Y2  
GND  
1Y3  
1Y4  
2OE  
1A1  
1A2  
GND  
1A3  
1A4  
Operates From 1.65 V to 3.6 V  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4.4 ns at 3.3 V  
2
3
4
Output Ports Have Equivalent 26-Series  
Resistors, So No External Resistors Are  
Required  
5
6
7
V
CC  
V
CC  
Typical VOLP (Output Ground Bounce) < 0.8 V  
at VCC = 3.3 V, TA = 25°C  
8
2Y1  
2Y2  
GND  
2Y3  
2Y4  
3Y1  
3Y2  
GND  
3Y3  
3Y4  
2A1  
2A2  
GND  
2A3  
2A4  
3A1  
3A2  
GND  
3A3  
3A4  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Typical VOHV (Output VOH Undershoot) > 2 V  
at VCC = 3.3 V, TA = 25°C  
Ioff Supports Partial-Power-Down Mode  
Operation  
Supports Mixed-Mode Signal Operation on All  
Ports (5-V Input/Output Voltage With  
3.3-V VCC  
)
Bus Hold on Data Inputs Eliminates the Need  
for External Pullup/Pulldown Resistors  
V
CC  
V
CC  
4Y1  
4Y2  
GND  
4Y3  
4Y4  
4OE  
4A1  
4A2  
GND  
4A3  
4A4  
3OE  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This 16-bit buffer/driver is designed for 1.65-V to 3.6-V VCC operation.  
The SN74LVCH162244A is designed specifically to improve both the performance and density of 3-state memory  
address drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as four 4-bit  
buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable  
(OE) inputs.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74LVCH162244ADL  
TOP-SIDE MARKING  
Tube  
SSOP – DL  
LVCH162244A  
Tape and reel  
SN74LVCH162244ADLR  
SN74LVCH162244AGR  
SN74LVCH162244AVR  
–40°C to 85°C  
TSSOP – DGG  
TVSOP – DGV  
Tape and reel  
Tape and reel  
LVCH162244A  
LN2244A  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1995–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LVCH162244A  
16-BIT BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS545KOCTOBER 1995REVISED MARCH 2005  
DESCRIPTION/ORDERING INFORMATION (CONTINUED)  
The outputs, which are designed to sink up to 12 mA, include equivalent 26-resistors to reduce overshoot and  
undershoot.  
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators  
in a mixed 3.3-V/5-V system environment.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors  
with the bus-hold circuitry is not recommended.  
FUNCTION TABLE  
(EACH 4-BIT BUFFER)  
INPUTS  
OUTPUT  
Y
OE  
L
A
H
L
H
L
L
H
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
25  
1OE  
1A1  
3OE  
47  
2
3
5
6
36  
35  
33  
32  
13  
14  
16  
17  
1Y1  
1Y2  
1Y3  
1Y4  
3A1  
3A2  
3A3  
3A4  
3Y1  
3Y2  
3Y3  
3Y4  
46  
44  
43  
1A2  
1A3  
1A4  
48  
41  
24  
30  
2OE  
2A1  
4OE  
4A1  
8
9
19  
20  
22  
23  
2Y1  
2Y2  
2Y3  
2Y4  
4Y1  
4Y2  
4Y3  
4Y4  
40  
38  
37  
29  
27  
26  
2A2  
2A3  
2A4  
4A2  
4A3  
4A4  
11  
12  
2
SN74LVCH162244A  
16-BIT BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS545KOCTOBER 1995REVISED MARCH 2005  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
MAX  
6.5  
UNIT  
V
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Voltage range applied to any output in the high or low state(2)(3)  
6.5  
V
VO  
VO  
IIK  
6.5  
V
VCC + 0.5  
–50  
V
Input clamp current  
VI < 0  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
–50  
Continuous output current  
Continuous current through each VCC or GND  
±50  
±100  
70  
DGG package  
DGV package  
DL package  
θJA  
Package thermal impedance(4)  
58  
°C/W  
°C  
63  
Tstg  
Storage temperature range  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCC is provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
Recommended Operating Conditions(1)  
MIN  
MAX UNIT  
Operating  
1.65  
3.6  
V
VCC Supply voltage  
Data retention only  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
1.5  
0.65 × VCC  
VIH  
High-level input voltage  
1.7  
2
V
0.35 × VCC  
0.7  
VIL  
Low-level input voltage  
V
0.8  
5.5  
VCC  
5.5  
–2  
–4  
–8  
–12  
2
VI  
Input voltage  
0
0
0
V
V
High or low state  
3-state  
VO  
Output voltage  
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 3 V  
IOH  
High-level output current  
Low-level output current  
mA  
mA  
VCC = 1.65 V  
VCC = 2.3 V  
VCC = 2.7 V  
VCC = 3 V  
4
IOL  
8
12  
10  
85  
t/v Input transition rise or fall rate  
TA Operating free-air temperature  
ns/V  
–40  
°C  
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
SN74LVCH162244A  
16-BIT BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS545KOCTOBER 1995REVISED MARCH 2005  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
1.65 V to 3.6 V  
1.65 V  
2.3 V  
MIN TYP(1)  
VCC – 0.2  
MAX UNIT  
IOH = –100 µA  
IOH = –2 mA  
1.2  
1.7  
2.2  
2.4  
2
IOH = –4 mA  
VOH  
2.7 V  
V
IOH = –6 mA  
IOH = –8 mA  
IOH = –12 mA  
IOL = 100 µA  
IOL = 2 mA  
3 V  
2.7 V  
3 V  
2
1.65 V to 3.6 V  
1.65 V  
2.3 V  
0.2  
0.45  
0.7  
IOL = 4 mA  
VOL  
2.7 V  
0.4  
0.55  
0.6  
V
IOL = 6 mA  
3 V  
IOL = 8 mA  
2.7 V  
IOL = 12 mA  
VI = 0 to 5.5 V  
VI = 0.58 V  
3 V  
0.8  
II  
3.6 V  
±5  
µA  
µA  
(2)  
(2)  
1.65 V  
1.65 V  
2.3 V  
VI = 1.07 V  
VI = 0.7 V  
45  
–45  
75  
II(hold)  
VI = 1.7 V  
2.3 V  
VI = 0.8 V  
3 V  
VI = 2 V  
3 V  
–75  
VI = 0 to 3.6 V(3)  
VI or VO = 5.5 V  
VO = 0 to 5.5 V  
VI = VCC or GND  
3.6 V  
±500  
±10  
±10  
20  
Ioff  
0
µA  
µA  
IOZ  
3.6 V  
ICC  
IO = 0  
3.6 V  
µA  
3.6 V VI 5.5 V(4)  
20  
ICC  
Ci  
One input at VCC – 0.6 V, Other inputs at VCC or GND  
VI = VCC or GND  
2.7 V to 3.6 V  
3.3 V  
500  
µA  
pF  
pF  
5.5  
6
Co  
VO = VCC or GND  
3.3 V  
(1) All typical values are at VCC = 3.3 V, TA = 25°C.  
(2) This information was not available at the time of publication.  
(3) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to  
another.  
(4) This applies in the disabled state only.  
Switching Characteristics  
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)  
VCC = 1.8 V  
± 0.15 V  
VCC = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 2.7 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
1
MAX  
MIN  
1
MAX  
MIN  
1
MAX  
MIN  
1.1  
1
MAX  
tpd  
ten  
tdis  
A
Y
Y
Y
10.2  
14.8  
12.3  
6.4  
8.2  
7.1  
5.6  
6.9  
6.8  
4.4  
5.5  
6.3  
ns  
ns  
ns  
OE  
OE  
1
1
1
1
1
1
1.8  
4
SN74LVCH162244A  
16-BIT BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS545KOCTOBER 1995REVISED MARCH 2005  
Operating Characteristics  
TA = 25°C  
VCC = 1.8 V  
VCC = 2.5 V  
VCC = 3.3 V  
TEST  
CONDITIONS  
PARAMETER  
UNIT  
TYP  
TYP  
TYP  
35  
4
(1)  
(1)  
Outputs enabled  
Outputs disabled  
Power dissipation capacitance  
per buffer/driver  
Cpd  
f = 10 MHz  
pF  
(1)  
(1)  
(1) This information was not available at the time of publication.  
5
SN74LVCH162244A  
16-BIT BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS545KOCTOBER 1995REVISED MARCH 2005  
PARAMETER MEASUREMENT INFORMATION  
V
LOAD  
S1  
Open  
R
L
From Output  
Under Test  
TEST  
/t  
S1  
GND  
t
t
Open  
PLH PHL  
C
L
t
/t  
V
R
L
PLZ PZL  
LOAD  
GND  
(see Note A)  
/t  
PHZ PZH  
LOAD CIRCUIT  
INPUTS  
V
CC  
V
M
V
LOAD  
C
L
R
L
V
V
I
t /t  
r f  
1.8 V ± 0.15 V  
2.5 V ± 0.2 V  
2.7 V  
V
V
2.7 V  
2.7 V  
2 ns  
2 ns  
2.5 ns  
2.5 ns  
V
/2  
/2  
2 × V  
2 × V  
6 V  
6 V  
30 pF  
30 pF  
50 pF  
50 pF  
1 k  
500 Ω  
500 Ω  
500 Ω  
0.15 V  
0.15 V  
0.3 V  
CC  
CC  
CC  
V
CC  
CC  
CC  
1.5 V  
1.5 V  
3.3 V ± 0.3 V  
0.3 V  
V
I
Timing Input  
Data Input  
V
M
0 V  
t
w
t
t
h
su  
V
I
V
I
Input  
V
M
V
M
V
M
V
M
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
I
V
I
Output  
Control  
V
M
V
M
Input  
V
M
V
M
0 V  
0 V  
t
t
t
t
t
PHL  
PZL  
PLZ  
PLH  
Output  
Waveform 1  
V
V
OH  
V
V
/2  
LOAD  
V
V
V
M
M
Output  
V
V
M
S1 at V  
LOAD  
V
OL  
+ V  
OL  
(see Note B)  
OL  
t
PHL  
PLH  
t
t
PHZ  
PZH  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
V
OH  
V
− V  
V
M
OH  
M
Output  
M
0 V  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PHL pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuit and Voltage Waveforms  
6
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Feb-2006  
PACKAGING INFORMATION  
Orderable Device  
74LVCH162244ADLG4  
74LVCH162244ADLRG4  
74LVCH162244AGRE4  
74LVCH162244AVRE4  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SSOP  
DL  
48  
48  
48  
48  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
TSSOP  
TVSOP  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DGG  
DGV  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LVCH162244ADGGR OBSOLETE TSSOP  
SN74LVCH162244ADGVR OBSOLETE TVSOP  
DGG  
DGV  
DL  
48  
48  
48  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
SN74LVCH162244ADL  
SN74LVCH162244ADLR  
SN74LVCH162244AGR  
SN74LVCH162244AVR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
DL  
48  
48  
48  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TVSOP  
DGG  
DGV  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001  
DL (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0.025 (0,635)  
48  
0.0135 (0,343)  
0.008 (0,203)  
0.005 (0,13)  
M
25  
0.010 (0,25)  
0.005 (0,13)  
0.299 (7,59)  
0.291 (7,39)  
0.420 (10,67)  
0.395 (10,03)  
Gage Plane  
0.010 (0,25)  
0°ā8°  
1
24  
0.040 (1,02)  
0.020 (0,51)  
A
Seating Plane  
0.004 (0,10)  
0.008 (0,20) MIN  
PINS **  
0.110 (2,79) MAX  
28  
48  
0.630  
56  
DIM  
0.380  
(9,65)  
0.730  
A MAX  
A MIN  
(16,00) (18,54)  
0.370  
(9,40)  
0.620  
0.720  
(15,75) (18,29)  
4040048/E 12/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MO-118  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
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and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
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dsp.ti.com  
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www.ti.com/digitalcontrol  
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Microcontrollers  
power.ti.com  
Optical Networking  
Security  
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Copyright 2006, Texas Instruments Incorporated  

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