SN74LVCH162244A_14 [TI]
16-Bit Buffer/Driver with 3-State Outputs;![SN74LVCH162244A_14](http://pdffile.icpdf.com/pdf1/p00099/img/icpdf/SN74LVCH162244ADGGR_531170_icpdf.jpg)
型号: | SN74LVCH162244A_14 |
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描述: | 16-Bit Buffer/Driver with 3-State Outputs |
文件: | 总11页 (文件大小:176K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SN74LVCH162244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS545K–OCTOBER 1995–REVISED MARCH 2005
FEATURES
DL, DGG, OR DGV PACKAGE
(TOP VIEW)
•
Member of the Texas Instruments Widebus™
Family
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1OE
1Y1
1Y2
GND
1Y3
1Y4
2OE
1A1
1A2
GND
1A3
1A4
•
•
•
•
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 4.4 ns at 3.3 V
2
3
4
Output Ports Have Equivalent 26-Ω Series
Resistors, So No External Resistors Are
Required
5
6
7
V
CC
V
CC
•
•
•
•
Typical VOLP (Output Ground Bounce) < 0.8 V
at VCC = 3.3 V, TA = 25°C
8
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Typical VOHV (Output VOH Undershoot) > 2 V
at VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With
3.3-V VCC
)
•
•
•
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
V
CC
V
CC
4Y1
4Y2
GND
4Y3
4Y4
4OE
4A1
4A2
GND
4A3
4A4
3OE
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This 16-bit buffer/driver is designed for 1.65-V to 3.6-V VCC operation.
The SN74LVCH162244A is designed specifically to improve both the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters. The device can be used as four 4-bit
buffers, two 8-bit buffers, or one 16-bit buffer. It provides true outputs and symmetrical active-low output-enable
(OE) inputs.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
SN74LVCH162244ADL
TOP-SIDE MARKING
Tube
SSOP – DL
LVCH162244A
Tape and reel
SN74LVCH162244ADLR
SN74LVCH162244AGR
SN74LVCH162244AVR
–40°C to 85°C
TSSOP – DGG
TVSOP – DGV
Tape and reel
Tape and reel
LVCH162244A
LN2244A
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1995–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVCH162244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS545K–OCTOBER 1995–REVISED MARCH 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The outputs, which are designed to sink up to 12 mA, include equivalent 26-Ω resistors to reduce overshoot and
undershoot.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
FUNCTION TABLE
(EACH 4-BIT BUFFER)
INPUTS
OUTPUT
Y
OE
L
A
H
L
H
L
L
H
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
1
25
1OE
1A1
3OE
47
2
3
5
6
36
35
33
32
13
14
16
17
1Y1
1Y2
1Y3
1Y4
3A1
3A2
3A3
3A4
3Y1
3Y2
3Y3
3Y4
46
44
43
1A2
1A3
1A4
48
41
24
30
2OE
2A1
4OE
4A1
8
9
19
20
22
23
2Y1
2Y2
2Y3
2Y4
4Y1
4Y2
4Y3
4Y4
40
38
37
29
27
26
2A2
2A3
2A4
4A2
4A3
4A4
11
12
2
SN74LVCH162244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS545K–OCTOBER 1995–REVISED MARCH 2005
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
MAX
6.5
UNIT
V
VCC
VI
Supply voltage range
Input voltage range(2)
Voltage range applied to any output in the high-impedance or power-off state(2)
Voltage range applied to any output in the high or low state(2)(3)
6.5
V
VO
VO
IIK
6.5
V
VCC + 0.5
–50
V
Input clamp current
VI < 0
mA
mA
mA
mA
IOK
IO
Output clamp current
VO < 0
–50
Continuous output current
Continuous current through each VCC or GND
±50
±100
70
DGG package
DGV package
DL package
θJA
Package thermal impedance(4)
58
°C/W
°C
63
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN
MAX UNIT
Operating
1.65
3.6
V
VCC Supply voltage
Data retention only
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
1.5
0.65 × VCC
VIH
High-level input voltage
1.7
2
V
0.35 × VCC
0.7
VIL
Low-level input voltage
V
0.8
5.5
VCC
5.5
–2
–4
–8
–12
2
VI
Input voltage
0
0
0
V
V
High or low state
3-state
VO
Output voltage
VCC = 1.65 V
VCC = 2.3 V
VCC = 2.7 V
VCC = 3 V
IOH
High-level output current
Low-level output current
mA
mA
VCC = 1.65 V
VCC = 2.3 V
VCC = 2.7 V
VCC = 3 V
4
IOL
8
12
10
85
∆t/∆v Input transition rise or fall rate
TA Operating free-air temperature
ns/V
–40
°C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74LVCH162244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS545K–OCTOBER 1995–REVISED MARCH 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
1.65 V to 3.6 V
1.65 V
2.3 V
MIN TYP(1)
VCC – 0.2
MAX UNIT
IOH = –100 µA
IOH = –2 mA
1.2
1.7
2.2
2.4
2
IOH = –4 mA
VOH
2.7 V
V
IOH = –6 mA
IOH = –8 mA
IOH = –12 mA
IOL = 100 µA
IOL = 2 mA
3 V
2.7 V
3 V
2
1.65 V to 3.6 V
1.65 V
2.3 V
0.2
0.45
0.7
IOL = 4 mA
VOL
2.7 V
0.4
0.55
0.6
V
IOL = 6 mA
3 V
IOL = 8 mA
2.7 V
IOL = 12 mA
VI = 0 to 5.5 V
VI = 0.58 V
3 V
0.8
II
3.6 V
±5
µA
µA
(2)
(2)
1.65 V
1.65 V
2.3 V
VI = 1.07 V
VI = 0.7 V
45
–45
75
II(hold)
VI = 1.7 V
2.3 V
VI = 0.8 V
3 V
VI = 2 V
3 V
–75
VI = 0 to 3.6 V(3)
VI or VO = 5.5 V
VO = 0 to 5.5 V
VI = VCC or GND
3.6 V
±500
±10
±10
20
Ioff
0
µA
µA
IOZ
3.6 V
ICC
IO = 0
3.6 V
µA
3.6 V ≤ VI ≤ 5.5 V(4)
20
∆ICC
Ci
One input at VCC – 0.6 V, Other inputs at VCC or GND
VI = VCC or GND
2.7 V to 3.6 V
3.3 V
500
µA
pF
pF
5.5
6
Co
VO = VCC or GND
3.3 V
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) This information was not available at the time of publication.
(3) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
(4) This applies in the disabled state only.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1
MAX
MIN
1
MAX
MIN
1
MAX
MIN
1.1
1
MAX
tpd
ten
tdis
A
Y
Y
Y
10.2
14.8
12.3
6.4
8.2
7.1
5.6
6.9
6.8
4.4
5.5
6.3
ns
ns
ns
OE
OE
1
1
1
1
1
1
1.8
4
SN74LVCH162244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS545K–OCTOBER 1995–REVISED MARCH 2005
Operating Characteristics
TA = 25°C
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TEST
CONDITIONS
PARAMETER
UNIT
TYP
TYP
TYP
35
4
(1)
(1)
Outputs enabled
Outputs disabled
Power dissipation capacitance
per buffer/driver
Cpd
f = 10 MHz
pF
(1)
(1)
(1) This information was not available at the time of publication.
5
SN74LVCH162244A
16-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS545K–OCTOBER 1995–REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
V
LOAD
S1
Open
R
L
From Output
Under Test
TEST
/t
S1
GND
t
t
Open
PLH PHL
C
L
t
/t
V
R
L
PLZ PZL
LOAD
GND
(see Note A)
/t
PHZ PZH
LOAD CIRCUIT
INPUTS
V
CC
V
M
V
LOAD
C
L
R
L
V
∆
V
I
t /t
r f
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
V
V
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
V
/2
/2
2 × V
2 × V
6 V
6 V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
CC
CC
CC
V
CC
CC
CC
1.5 V
1.5 V
3.3 V ± 0.3 V
0.3 V
V
I
Timing Input
Data Input
V
M
0 V
t
w
t
t
h
su
V
I
V
I
Input
V
M
V
M
V
M
V
M
0 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
V
I
V
I
Output
Control
V
M
V
M
Input
V
M
V
M
0 V
0 V
t
t
t
t
t
PHL
PZL
PLZ
PLH
Output
Waveform 1
V
V
OH
V
V
/2
LOAD
V
V
V
M
M
Output
V
V
M
S1 at V
LOAD
V
OL
+ V
∆
OL
(see Note B)
OL
t
PHL
PLH
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
V
OH
V
OH
V
− V
∆
V
M
OH
M
Output
M
≈0 V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
PHL pd
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
24-Feb-2006
PACKAGING INFORMATION
Orderable Device
74LVCH162244ADLG4
74LVCH162244ADLRG4
74LVCH162244AGRE4
74LVCH162244AVRE4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DL
48
48
48
48
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
TSSOP
TVSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DGV
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVCH162244ADGGR OBSOLETE TSSOP
SN74LVCH162244ADGVR OBSOLETE TVSOP
DGG
DGV
DL
48
48
48
TBD
TBD
Call TI
Call TI
Call TI
Call TI
SN74LVCH162244ADL
SN74LVCH162244ADLR
SN74LVCH162244AGR
SN74LVCH162244AVR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
48
48
48
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TVSOP
DGG
DGV
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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logic.ti.com
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