SN74LVT245BDBR [TI]
3.3-V ABT OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS; 具有三态输出的3.3V ABT八路总线收发器
| 型号： | SN74LVT245BDBR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3.3-V ABT OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS |
| 文件： | 总15页 (文件大小：490K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇꢃ ꢈꢉ
ꢋꢊ ꢌꢅ ꢍꢉꢆ ꢎ ꢏꢆꢍꢄ ꢉꢐꢀ ꢆ ꢑꢍꢁ ꢀꢏ ꢒ ꢓꢅ ꢒ ꢑ
ꢔ ꢓꢆ ꢕ ꢊ ꢌꢀꢆꢍꢆ ꢒ ꢎ ꢐꢆ ꢖꢐ ꢆꢀ
ꢊ
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
D
Supports Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
D
D
D
I
and Power-Up 3-State Support Hot
off
Insertion
3.3-V V
)
CC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D
D
Supports Unregulated Battery Operation
Down to 2.7 V
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
= 3.3 V, T = 25°C
A
− 1000-V Charged-Device Model (C101)
DB, DW, NS, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DIR
A1
V
CC
OE
B1
B2
B3
B4
B5
B6
B7
B8
1
20
A2
19
18
17
16
15
14
13
12
2
3
4
5
6
7
8
9
A1
A2
A3
A4
A5
A6
A7
A8
OE
B1
B2
B3
B4
B5
B6
B7
A3
A4
A5
A6
A7
A8
GND
10
11
description/ordering information
This octal bus transceiver is designed specifically for low-voltage (3.3-V) V
to provide a TTL interface to a 5-V system environment.
operation, but with the capability
CC
The SN74LVT245B is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are
effectively isolated.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
QFN − RGY
SOIC − DW
Tape and reel
Tube
SN74LVT245BRGYR
SN74LVT245BDW
SN74LVT245BDWR
SN74LVT245BNSR
SN74LVT245BDBR
SN74LVT245BPW
SN74LVT245BPWR
SN74LVT245BGQNR
SN74LVT245BZQNR
LX245B
LVT245B
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
LVT245B
LX245B
SSOP − DB
−40°C to 85°C
TSSOP − PW
LX245B
LX245B
Tape and reel
VFBGA − GQN
Tape and reel
VFBGA − ZQN (Pb-free)
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢃ ꢈꢉ
ꢊꢋ ꢊꢌꢅ ꢍ ꢉ ꢆ ꢎꢏ ꢆꢍꢄ ꢉꢐ ꢀ ꢆꢑ ꢍꢁ ꢀꢏ ꢒꢓ ꢅ ꢒ ꢑ
ꢔꢓ ꢆ ꢕ ꢊ ꢌꢀꢆꢍꢆ ꢒ ꢎꢐꢆ ꢖꢐ ꢆꢀ
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
description/ordering information (continued)
To ensure the high-impedance state during power up or power down, OE should be tied to V
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
through a pullup
CC
This device is fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry
off
off
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
GQN OR ZQN PACKAGE
(TOP VIEW)
terminal assignments
1
2
3
4
1
A1
2
3
4
A
B
C
D
E
A
B
C
D
E
DIR
B2
A4
B6
A8
V
OE
B1
B3
B5
B7
CC
A3
A2
B4
A6
B8
A5
A7
GND
FUNCTION TABLE
INPUTS
OPERATION
OE
L
DIR
L
B data to A bus
A data to B bus
Isolation
L
H
H
X
logic diagram (positive logic)
1
2
DIR
19
18
OE
A1
B1
To Seven Other Channels
Pin numbers shown are for the DB, DW, NS, PW, and RGY packages.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇꢃ ꢈꢉ
ꢊ ꢋꢊ ꢌꢅ ꢍꢉꢆ ꢎ ꢏꢆꢍꢄ ꢉꢐꢀ ꢆ ꢑꢍꢁ ꢀꢏ ꢒ ꢓꢅ ꢒ ꢑ
ꢔ ꢓꢆ ꢕ ꢊ ꢌꢀꢆꢍꢆ ꢒ ꢎ ꢐꢆ ꢖꢐ ꢆꢀ
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I
Voltage range applied to any output in the high-impedance
or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
O
Voltage range applied to any output in the high state, V (see Note 1) . . . . . . . . . . . . . −0.5 V to V
+ 0.5 V
O
CC
Current into any output in the low state, I
Current into any output in the high state, I (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
O
O
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
IK
OK
I
Output clamp current, I
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
O
Package thermal impedance, θ (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
JA
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): GQN/ZQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and V > V
.
CC
O
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 5)
MIN
2.7
2
MAX
UNIT
V
V
V
V
V
Supply voltage
3.6
CC
High-level input voltage
Low-level input voltage
Input voltage
V
IH
0.8
5.5
−32
64
V
IL
V
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Power-up ramp rate
mA
mA
ns/V
µs/V
°C
OH
OL
I
∆t/∆v
∆t/∆V
Outputs enabled
10
200
−40
CC
T
A
Operating free-air temperature
85
NOTE 5: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢃ ꢈꢉ
ꢊꢋ ꢊꢌꢅ ꢍ ꢉ ꢆ ꢎꢏ ꢆꢍꢄ ꢉꢐ ꢀ ꢆꢑ ꢍꢁ ꢀꢏ ꢒꢓ ꢅ ꢒ ꢑ
ꢔꢓ ꢆ ꢕ ꢊ ꢌꢀꢆꢍꢆ ꢒ ꢎꢐꢆ ꢖꢐ ꢆꢀ
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
TYP
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
V
V
V
V
V
= 2.7 V,
I = −18 mA
−1.2
V
IK
CC
CC
CC
CC
I
= 2.7 V to 3.6 V,
= 2.7 V,
I
I
I
I
I
I
I
I
= −100 µA
= −8 mA
= −32 mA
= 100 µA
= 24 mA
= 16 mA
= 32 mA
= 64 mA
V
−0.2
OH
OH
OH
OL
OL
OL
OL
OL
CC
2.4
2
V
OH
V
V
= 3 V,
0.2
0.5
0.4
0.5
0.55
1
V
= 2.7 V
CC
CC
V
OL
V
= 3 V
V
V
= 3.6 V,
V = V or GND
I CC
CC
Control inputs
= 0 or 3.6 V,
V = 5.5 V
I
10
CC
V = 5.5 V
I
20
I
I
µA
‡
V = V
1
V
CC
= 3.6 V
A or B ports
I
CC
V = 0
I
−5
I
I
I
I
V
CC
V
CC
V
CC
V
CC
= 0,
V or V = 0 to 4.5 V
100
5
µA
µA
µA
µA
off
I
O
= 3.6 V,
= 3.6 V,
V
= 3 V
OZH
OZL
O
O
V
= 0.5 V
−5
= 0 to 1.5 V, V = 0.5 V to 3 V, OE = don’t care
O
100
OZPU
V
= 1.5 V to 0, V = 0.5 V to 3 V, OE = don’t care
O
100
0.19
5
µA
I
CC
OZPD
Outputs high
V
I
= 3.6 V,
CC
O
Outputs low
= 0,
I
mA
CC
V = V
or GND
I
CC
Outputs disabled
0.19
V
= 3 V to 3.6 V, One input at V − 0.6 V,
CC
CC
Other inputs at V
§
0.2
mA
∆I
CC
or GND
CC
C
C
V = 3 V or 0
4
9
pF
pF
i
I
V
O
= 3 V or 0
io
†
‡
§
All typical values are at V
= 3.3 V, T = 25°C.
A
CC
CC
Unused terminals are at V or GND.
This is the increase in supply current for each input that is at the specified TTL-voltage level, rather than V
or GND.
CC
switching characteristics over recommended operating free-air temperature range, C = 50 pF
L
(unless otherwise noted) (see Figure 1)
V
= 3.3 V
CC
0.3 V
V
= 2.7 V
CC
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
†
MIN TYP
MAX
3.5
3.5
5.5
5.5
5.9
5
MIN
MAX
4
t
t
t
t
t
t
1.2
1.2
1.3
1.7
2.2
2.2
2.3
2.1
3.2
3.4
3.5
3.4
PLH
PHL
PZH
PZL
PHZ
PLZ
A or B
OE
B or A
A or B
A or B
ns
ns
ns
4
7.1
6.5
6.5
5.1
OE
†
All typical values are at V
CC
= 3.3 V, T = 25°C.
A
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇꢃ ꢈꢉ
ꢊ ꢋꢊ ꢌꢅ ꢍꢉꢆ ꢎ ꢏꢆꢍꢄ ꢉꢐꢀ ꢆ ꢑꢍꢁ ꢀꢏ ꢒ ꢓꢅ ꢒ ꢑ
ꢔ ꢓꢆ ꢕ ꢊ ꢌꢀꢆꢍꢆ ꢒ ꢎ ꢐꢆ ꢖꢐ ꢆꢀ
SCES004H − JANUARY 1995 − REVISED SEPTEMBER 2003
PARAMETER MEASUREMENT INFORMATION
6 V
TEST
S1
S1
Open
GND
500 Ω
From Output
Under Test
t
/t
PLH PHL
Open
6 V
t
/t
PLZ PZL
C
= 50 pF
t
/t
GND
L
PHZ PZH
500 Ω
(see Note A)
2.7 V
0 V
LOAD CIRCUIT
Timing Input
Data Input
1.5 V
t
w
t
t
h
su
2.7 V
0 V
2.7 V
0 V
Input
1.5 V
1.5 V
1.5 V
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
0 V
2.7 V
0 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
Input
t
t
PLZ
PZL
t
t
t
PHL
PLH
PHL
Output
Waveform 1
S1 at 6 V
3 V
V
V
OH
1.5 V
1.5 V
1.5 V
1.5 V
t
Output
V
V
+ 0.3 V
OL
V
OL
OL
(see Note B)
t
t
PZH
PHZ
PLH
Output
Waveform 2
S1 at GND
V
OH
V
V
OH
− 0.3 V
OH
1.5 V
1.5 V
Output
≈0 V
OL
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SSOP
SSOP
Drawing
SN74LVT245BDBLE
SN74LVT245BDBR
OBSOLETE
ACTIVE
DB
20
20
TBD
Call TI
Call TI
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVT245BDBRE4
SN74LVT245BDW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DB
DW
DW
DW
DW
DW
DW
GQN
20
20
20
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVT245BDWE4
SN74LVT245BDWG4
SN74LVT245BDWR
SN74LVT245BDWRE4
SN74LVT245BDWRG4
SN74LVT245BGQNR
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVT245BNSR
SN74LVT245BNSRE4
SN74LVT245BPW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
NS
PW
PW
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVT245BPWE4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVT245BPWLE
SN74LVT245BPWR
OBSOLETE TSSOP
PW
PW
20
20
TBD
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
QFN
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVT245BPWRE4
SN74LVT245BPWRG4
SN74LVT245BRGYR
SN74LVT245BRGYRG4
SN74LVT245BZQNR
PW
PW
20
20
20
20
20
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RGY
RGY
ZQN
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
QFN
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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