SN74LVTH16543-EP [TI]
3.3-V ABT 16-BIT REGISTERED TRANSCEIVER 3-STATE OUTPUTS; 3.3 -V ABT 16位寄存收发器3态输出
| 型号： | SN74LVTH16543-EP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3.3-V ABT 16-BIT REGISTERED TRANSCEIVER 3-STATE OUTPUTS |
| 文件： | 总12页 (文件大小：304K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74LVTH16543-EP
3.3-V ABT 16-BIT REGISTERED TRANSCEIVER
3-STATE OUTPUTS
www.ti.com
SCBS785B–NOVEMBER 2003–REVISED JUNE 2006
FEATURES
DGG OR DL PACKAGE
(TOP VIEW)
•
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
1OEAB
1LEAB
1CEAB
GND
1OEBA
1LEBA
1CEBA
GND
2
•
Enhanced Diminishing Manufacturing
Sources (DMS) Support
3
4
•
•
•
Enhanced Product-Change Notification
5
1A1
1A2
1B1
1B2
(1)
Qualification Pedigree
6
Member of the Texas Instruments Widebus™
Family
7
V
CC
V
CC
8
1A3
1A4
1A5
GND
1A6
1A7
1A8
2A1
2A2
2A3
GND
2A4
2A5
2A6
1B3
1B4
1B5
GND
1B6
1B7
1B8
2B1
2B2
2B3
GND
2B4
2B5
2B6
9
•
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V Operation
and Low Static-Power Dissipation
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
•
•
•
•
•
•
•
•
•
Supports Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V VCC
)
Supports Unregulated Battery Operation
Down to 2.7 V
Ioff and Power-Up 3-State Support Hot
Insertion
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
V
CC
V
CC
2A7
2A8
GND
2CEAB
2LEAB
2OEAB
2B7
2B8
GND
2CEBA
2LEBA
2OEBA
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The SN74LVTH16543 is a 16-bit registered transceiver designed for low-voltage (3.3-V) VCC operation, but with
the capability to provide a TTL interface to a 5-V system environment. This device can be used as two 8-bit
transceivers or one 16-bit transceiver. Separate latch-enable (LEAB or LEBA) and output-enable (OEAB or
OEBA) inputs are provided for each register to permit independent control in either direction of data flow.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVTH16543-EP
3.3-V ABT 16-BIT REGISTERED TRANSCEIVER
3-STATE OUTPUTS
www.ti.com
SCBS785B–NOVEMBER 2003–REVISED JUNE 2006
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The A-to-B enable (CEAB) input must be low to enter data from A or to output data from B. If CEAB is low and
LEAB is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB puts the A latches
in the storage mode. With CEAB and OEAB both low, the 3-state B outputs are active and reflect the data
present at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA, LEBA, and
OEBA inputs.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
ORDERING INFORMATION
TA
PACKAGE(1)
Tape and reel
Tape and reel
ORDERABLE PART NUMBER
CLVTH16543IDGGREP
CLVTH16543MDLREP
TOP-SIDE MARKING
LH16543EP
LH16543MEP
–40°C to 85°C
–55°C to 125°C
TSSOP – DGG
SSOP – DL
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE(1)
(each 8-bit section)
INPUTS
OUTPUT
B
CEAB
LEAB
OEAB
A
X
X
X
L
H
X
L
L
L
X
X
H
L
X
H
L
Z
Z
(2)
B0
L
L
L
L
H
H
(1) A-to-B data flow is shown; B-to-A flow control is the same, except
that it uses CEBA, LEBA, and OEBA.
(2) Output level before the indicated steady-state input conditions were
established
2
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SN74LVTH16543-EP
3.3-V ABT 16-BIT REGISTERED TRANSCEIVER
3-STATE OUTPUTS
www.ti.com
SCBS785B–NOVEMBER 2003–REVISED JUNE 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
56
54
1OEBA
1CEBA
55
1
1LEBA
1OEAB
3
2
1CEAB
1LEAB
C1
1D
5
1A1
52
1B1
C1
1D
To Seven Other Channels
29
31
2OEBA
2CEBA
30
28
2LEBA
2OEAB
26
27
2CEAB
2LEAB
C1
1D
15
2A1
42
2B1
C1
1D
To Seven Other Channels
3
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SN74LVTH16543-EP
3.3-V ABT 16-BIT REGISTERED TRANSCEIVER
3-STATE OUTPUTS
www.ti.com
SCBS785B–NOVEMBER 2003–REVISED JUNE 2006
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
MAX
4.6
UNIT
VCC Supply voltage range
V
VI
Input voltage range(2)
7
7
V
VO
VO
IO
Voltage range applied to any output in the high-impedance or power-off state(2)
Voltage range applied to any output in the high state(2)
Current into any output in the low state
V
VCC + 0.5
128
V
mA
mA
mA
mA
IO
Current into any output in the high state(3)
64
IIK
IOK
Input clamp current
Output clamp current
VI < 0
–50
VO < 0
–50
DGG package
DL package
81
θJA
Package thermal impedance(4)
Storage temperature range(5)
°C/W
°C
73.5
150
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) This current flows only when the output is in the high state and VO > VCC
.
(4) The package thermal impedance is calculated in accordance with JESD 51.
(5) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
Recommended Operating Conditions(1)
MIN
2.7
2
MAX UNIT
VCC
VIH
Supply voltage
3.6
V
V
High-level input voltage
Low-level input voltage
Input voltage
VIL
0.8
5.5
–32
64
V
VI
V
IOH
High-level output current
Low-level output current
Input transition rise or fall rate
Power-up ramp rate
mA
mA
IOL
∆t/∆v
∆t/∆VCC
Outputs enabled
10 ns/V
200
–40
–55
µs/V
I temp
85
TA
Operating free-air temperature
°C
M temp
125
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SN74LVTH16543-EP
3.3-V ABT 16-BIT REGISTERED TRANSCEIVER
3-STATE OUTPUTS
www.ti.com
SCBS785B–NOVEMBER 2003–REVISED JUNE 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
II = –18 mA
MIN TYP(1)
MAX
UNIT
VIK
VCC = 2.7 V,
–1.2
V
VCC = 2.7 V to 3.6 V,
VCC = 2.7 V,
IOH = –100 µA
IOH = –8 mA
VCC – 0.2
VOH
2.4
2
V
V
VCC = 3 V,
IOH = –32 mA
IOL = 100 µA
0.2
0.5
0.4
0.5
0.55
±1
VCC = 2.7 V
IOL = 24 mA
VOL
IOL = 16 mA
VCC = 3 V
IOL = 32 mA
IOL = 64 mA (I temp)
VI = VCC or GND
VI = 5.5 V
VCC = 3.6 V,
Control
inputs
VCC = 0 or 3.6 V,
10
VI = 5.5 V (I temp)
VI = 5.5 V (M temp)
VI = VCC
20
II
µA
100
1
A or B port(2) VCC = 3.6 V
VI = 0
–5
VI or VO = 0 to 4.5 V (I temp)
VI or VO = 0 to 4.5 V (M temp)
VI = 0.8 V
±100
±550
Ioff
VCC = 0
µA
µA
75
VCC = 3 V
II(hold) A or B port
VI = 2 V
–75
VCC = 3.6 V,(3)
VI = 0 to 3.6 V
±500
±100
±100
0.19
5
IOZPU
IOZPD
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don't care
VCC = 1.5 to 0 V, VO = 0.5 V to 3 V, OE = don't care
Outputs high
µA
µA
(4)
ICC
VCC = 3.6 V, IO = 0, VI = VCC or GND
Outputs low
mA
Outputs disabled
0.19
VCC = 3 V to 3.6 V, One input at VCC – 0.6 V,
Other inputs at VCC or GND
∆ICC
0.2
mA
Ci
VI = 3 V or 0
VO = 3 V or 0
4
pF
pF
Cio
10
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
(2) Unused pins at VCC or GND
(3) This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
5
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SN74LVTH16543-EP
3.3-V ABT 16-BIT REGISTERED TRANSCEIVER
3-STATE OUTPUTS
www.ti.com
SCBS785B–NOVEMBER 2003–REVISED JUNE 2006
Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
M TEMP
I TEMP
VCC = 3.3 V
± 0.3 V
MIN MAX MIN MAX
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
VCC = 2.7 V UNIT
MIN MAX MIN MAX
tw Pulse duration, LEAB or LEBA low
A or B before LEAB↑ OR LEBA↑
3.3
0.7
1.2
0.5
1.1
1.5
1.2
1.7
1.6
3.3
0.9
1.9
0.8
1.9
1.0
1.5
1.1
1.9
3.3
0.5
0.8
0
3.3
0.5
1.3
0
ns
ns
Data high
Data low
Data high
Data low
Data high
Data low
Data high
Data low
tsu Setup time
A or B before CEAB↑ or CEBA↑
A or B before LEAB↑ OR LEBA↑
A or B before CEAB↑ or CEBA↑
0.6
1.5
1.2
1.7
1.6
1.1
0.7
1.3
0.9
1.8
th Hold time
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
M TEMP
VCC = 3.3 V
± 0.3 V
MIN
I TEMP
VCC = 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
VCC = 2.7 V
VCC = 2.7 V
UNIT
MAX
4.7
5.4
7.3
6.9
6.5
6.7
5.7
5.1
6.5
6.4
5.3
5.1
MIN
MAX
MIN TYP(1)
MAX
3.2
3.2
3.9
3.9
4.3
4.3
4.7
4.4
4.5
4.5
4.9
4.7
MIN
MAX
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
tPZH
tPZL
tPHZ
tPLZ
1.2
1.2
1.3
1.3
1.3
1.3
2
6.5
6.5
7.8
7.8
7.4
7.4
7.2
6.9
7.6
7.6
7.4
6.9
1.2
1.2
1.3
1.3
1.3
1.3
2
2.3
2.1
2.5
2.3
2.8
2.8
3.5
3.3
3
3.7
3.7
4.9
4.9
5.4
5.4
5.2
4.5
5.6
5.6
5.4
4.9
A or B
LE
B or A
A or B
A or B
A or B
A or B
A or B
ns
ns
ns
ns
ns
ns
OE
OE
2
2
1.3
1.3
2
1.3
1.3
2
CE
3
3.6
3.5
CE
2
2
(1) All typical values are at VCC = 3.3 V, TA = 25°C.
6
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SN74LVTH16543-EP
3.3-V ABT 16-BIT REGISTERED TRANSCEIVER
3-STATE OUTPUTS
www.ti.com
SCBS785B–NOVEMBER 2003–REVISED JUNE 2006
PARAMETER MEASUREMENT INFORMATION
6 V
Open
GND
TEST
/t
S1
S1
500 Ω
From Output
Under Test
t
Open
6 V
PLH PHL
t
/t
PLZ PZL
C = 50 pF
(see Note A)
t
/t
GND
L
PHZ PZH
500 Ω
2.7 V
0 V
Timing Input
Data Input
1.5 V
LOAD CIRCUIT
t
w
t
t
h
su
2.7 V
2.7 V
0 V
Input
1.5 V
1.5 V
1.5 V
1.5 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
0 V
2.7 V
0 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
Input
t
t
t
PHL
t
t
PLH
PZL
PLZ
Output
Waveform 1
S1 at 6 V
V
V
3 V
OH
1.5 V
1.5 V
1.5 V
1.5 V
t
Output
V
+ 0.3 V
OL
V
OL
(see Note B)
OL
t
t
PZH
PHZ
PHL
PLH
Output
Waveform 2
S1 at GND
V
V
V
OH
OH
V
− 0.3 V
OH
1.5 V
1.5 V
Output
≈0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
7
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
CLVTH16543IDGGREP
CLVTH16543MDLREP
V62/04715-01XE
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
56
56
56
56
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
TSSOP
SSOP
DL
DGG
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/04715-02YE
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVTH16543-EP :
Catalog: SN74LVTH16543
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
CLVTH16543IDGGREP TSSOP
CLVTH16543MDLREP SSOP
DGG
DL
56
56
2000
1000
330.0
330.0
24.4
32.4
8.6
15.6
1.8
3.1
12.0
16.0
24.0
32.0
Q1
Q1
11.35
18.67
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CLVTH16543IDGGREP
CLVTH16543MDLREP
TSSOP
SSOP
DGG
DL
56
56
2000
1000
346.0
346.0
346.0
346.0
41.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
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