SN74SSTU32864ZKER [TI]

25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS; 25 - BIT与SSTL_18输入和输出的配置寄存缓冲器
SN74SSTU32864ZKER
型号: SN74SSTU32864ZKER
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

25-BIT CONFIGURABLE REGISTERED BUFFER WITH SSTL_18 INPUTS AND OUTPUTS
25 - BIT与SSTL_18输入和输出的配置寄存缓冲器

输出元件 输入元件
文件: 总18页 (文件大小:388K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 – MARCH 2003  
Member of the Texas Instruments  
Widebus+ Family  
Supports LVCMOS Switching Levels on the  
Control and RESET Inputs  
Pinout Optimizes DDR-II DIMM PCB Layout  
RESET Input Disables Differential Input  
Receivers, Resets All Registers, and  
Forces All Outputs Low  
Configurable as 25-Bit 1:1 or 14-Bit 1:2  
Registered Buffer  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Chip-Select Inputs Gate the Data Outputs  
from Changing State and Minimizes System  
Power Consumption  
ESD Protection Exceeds JESD 22  
– 5000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Output Edge-Control Circuitry Minimizes  
Switching Noise in an Unterminated Line  
– 1000-V Charged-Device Model (C101)  
Supports SSTL_18 Data Inputs  
Differential Clock (CLK and CLK) Inputs  
description/ordering information  
This 25-bit 1:1 or 14-bit 1:2 configurable registered buffer is designed for 1.7-V to 1.9-V V  
operation. In the  
CC  
1:1 pinout configuration, only one device per DIMM is required to drive nine SDRAM loads. In the 1:2 pinout  
configuration, two devices per DIMM are required to drive 18 SDRAM loads.  
All inputs are SSTL_18, except the LVCMOS reset (RESET) and LVCMOS control (Cn) inputs. All outputs are  
edge-controlled circuits optimized for unterminated DIMM loads and meet SSTL_18 specifications.  
The SN74SSTU32864 operates from a differential clock (CLK and CLK). Data are registered at the crossing  
of CLK going high and CLK going low.  
The C0 input controls the pinout configuration of the 1:2 pinout from register-A configuration (when low) to  
register-B configuration (when high). The C1 input controls the pinout configuration from 25-bit 1:1 (when low)  
to14-bit1:2(whenhigh). C0andC1shouldnotbeswitchedduringnormaloperation. Theyshouldbehard-wired  
to a valid low or high level to configure the register in the desired mode. In the 25-bit 1:1 pinout configuration,  
the A6, D6, and H6 terminals are driven low and should not be used.  
The device supports low-power standby operation. When RESET is low, the differential input receivers are  
disabled, and undriven (floating) data, clock, and reference voltage (V  
) inputs are allowed. In addition, when  
REF  
RESET is low, all registers are reset and all outputs are forced low. The LVCMOS RESET and Cn inputs always  
must be held at a valid logic high or low level.  
The two V  
pins (A3 and T3), are connected together internally by approximately 150 . However, it is  
REF  
necessary to connect only one of the two V  
should be terminated with a V  
pins to the external V  
power supply. An unused V  
pin  
REF  
REF  
REF  
coupling capacitor.  
REF  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
0°C to 70°C  
LFBGA – GKE  
Tape and reel SN74SSTU32864GKER  
SU864  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design  
guidelines are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus+ is a trademark of Texas Instruments.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
description/ordering information (continued)  
The device also supports low-power active operation by monitoring both system chip select (DCS and CSR)  
inputs and will gate the Qn outputs from changing states when both DCS and CSR inputs are high. If either DCS  
or CSR input is low, the Qn outputs function normally. The RESET input has priority over the DCS and CSR  
control and forces the output low. If the DCS control functionality is not desired, the CSR input can be hard-wired  
to ground, in which case, the setup-time requirement for DCS is the same as for the other D data inputs.  
To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in  
the low state during power up.  
GKE PACKAGE  
(TOP VIEW)  
terminal assignments for 1:1 register (C0 = 0, C1 = 0)  
1
D1 (DCKE)  
D2  
2
NC  
3
4
5
Q1 (QCKE)  
Q2  
6
1
2
3
4
5
6
A
B
C
D
E
F
V
V
DNU  
Q15  
Q16  
DNU  
Q17  
Q18  
C0  
REF  
CC  
D15  
GND  
GND  
A
B
C
D
D3  
D16  
V
V
Q3  
CC  
GND  
CC  
GND  
D4 (DODT)  
D5  
NC  
Q4 (QODT)  
Q5  
D17  
V
CC  
GND  
V
CC  
GND  
D6  
D18  
Q6  
E
F
G
H
J
G
H
J
NC  
RESET  
D7 (DCS)  
CSR  
D19  
V
V
C1  
CC  
GND  
CC  
GND  
CLK  
CLK  
D8  
Q7 (QCS)  
NC  
DNU  
NC  
V
CC  
V
CC  
K
L
GND  
GND  
Q8  
Q19  
Q20  
Q21  
Q22  
Q23  
Q24  
Q25  
D9  
D20  
V
CC  
V
CC  
Q9  
M
N
P
R
T
D10  
D21  
GND  
GND  
Q10  
K
L
D11  
D22  
V
CC  
GND  
V
CC  
GND  
Q11  
D12  
D23  
Q12  
M
N
P
R
T
D13  
D24  
V
CC  
V
V
Q13  
CC  
D14  
D25  
V
REF  
Q14  
CC  
Each pin name in parentheses indicates the DDR-II DIMM signal name.  
NC No internal connection  
DNU Do not use  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
logic diagram for 1:1 register configuration (positive logic)  
G2  
RESET  
H1  
J1  
CLK  
CLK  
A3, T3  
A1  
V
REF  
D1 (DCKE)  
D4 (DODT)  
D7 (DCS)  
CSR  
D
R
A5  
D5  
Q1 (QCKE)  
Q4 (QODT)  
CLK  
CLK  
CLK  
D1  
H2  
J2  
D
R
D
R
H5  
Q7 (QCS)  
One of 22 Channels  
B1  
D2  
CE  
D
R
B5  
Q2  
CLK  
To 21 Other Channels (D3, D5, D6, D8D25)  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
GKE PACKAGE  
(TOP VIEW)  
terminal assignments for 1:2 register A (C0 = 0, C1 = 1)  
1
2
3
4
5
6
1
2
3
4
5
6
Q1A  
(QCKEA)  
Q1B  
(QCKEB)  
A
D1 (DCKE)  
NC  
V
REF  
V
CC  
A
B
C
D
B
C
D2  
D3  
DNU  
DNU  
GND  
GND  
Q2A  
Q3A  
Q2B  
Q3B  
V
V
CC  
GND  
CC  
GND  
Q4A  
(QODTA)  
Q4B  
(QODTB)  
D
D4 (DODT)  
NC  
E
F
G
H
J
E
F
D5  
D6  
NC  
DNU  
DNU  
V
V
Q5A  
Q6A  
C1  
Q5B  
Q6B  
C0  
CC  
CC  
GND  
GND  
G
RESET  
V
CC  
V
CC  
Q7A  
(QCSA)  
Q7B  
(QCSB)  
H
CLK  
D7 (DCS)  
GND  
GND  
J
K
L
CLK  
D8  
CSR  
DNU  
DNU  
DNU  
DNU  
DNU  
DNU  
DNU  
V
CC  
GND  
V
CC  
GND  
NC  
NC  
K
L
Q8A  
Q8B  
D9  
V
CC  
GND  
V
CC  
GND  
Q9A  
Q9B  
M
N
P
R
T
M
N
P
R
T
D10  
D11  
D12  
D13  
D14  
Q10A  
Q11A  
Q12A  
Q13A  
Q14A  
Q10B  
Q11B  
Q12B  
Q13B  
Q14B  
V
CC  
GND  
V
CC  
GND  
V
CC  
V
V
CC  
V
REF  
CC  
Each pin name in parentheses indicates the DDR-II DIMM signal name.  
NC No internal connection  
DNU Do not use  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
logic diagram 1:2 register-A configuration (positive logic)  
G2  
RESET  
H1  
J1  
CLK  
CLK  
A3, T3  
A1  
V
REF  
D1 (DCKE)  
D4 (DODT)  
D7 (DCS)  
CSR  
A5  
A6  
Q1A (QCKEA)  
Q1B (QCKEB)  
D
R
CLK  
CLK  
CLK  
D1  
H2  
J2  
D5  
D6  
Q4A (QODTA)  
Q4B (QODTB)  
D
R
H5  
H6  
Q7A (QCSA)  
Q7B (QCSB)  
D
R
One of Eleven Channels  
B1  
D2  
B5  
B6  
CE  
Q2A  
Q2B  
D
R
CLK  
To 10 Other Channels (D3, D5, D6, D8D14)  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
GKE PACKAGE  
(TOP VIEW)  
terminal assignments for 1:2 register B (C0 = 1, C1 = 1)  
1
2
3
4
5
6
1
2
NC  
3
4
5
6
A
B
C
D
E
F
D1  
D2  
D3  
D4  
D5  
D6  
NC  
V
V
Q1A  
Q2A  
Q3A  
Q4A  
Q5A  
Q6A  
C1  
Q1B  
Q2B  
Q3B  
Q4B  
Q5B  
Q6B  
C0  
REF  
CC  
A
B
C
D
DNU  
DNU  
NC  
GND  
GND  
V
V
CC  
GND  
CC  
GND  
DNU  
DNU  
RESET  
V
V
CC  
GND  
CC  
GND  
E
F
G
H
J
G
V
V
CC  
GND  
CC  
GND  
Q7A  
(QCSA)  
Q7B  
H
CLK  
D7 (DCS)  
(QCSB)  
J
K
L
CLK  
D8  
CSR  
DNU  
DNU  
DNU  
V
V
NC  
Q8A  
Q9A  
Q10A  
NC  
Q8B  
Q9B  
Q10B  
CC  
GND  
CC  
GND  
K
L
D9  
V
CC  
GND  
V
CC  
GND  
M
D10  
M
N
P
R
T
D11  
(DODT)  
Q11A  
(QODTA)  
Q11B  
(QODTB)  
N
DNU  
V
V
CC  
CC  
P
R
D12  
D13  
DNU  
DNU  
GND  
GND  
Q12A  
Q13A  
Q12B  
Q13B  
V
CC  
V
CC  
D14  
(DCKE)  
Q14A  
(QCKEA)  
Q14B  
(QCKEB)  
T
DNU  
V
REF  
V
CC  
Each pin name in parentheses indicates the DDR-II DIMM signal name.  
NC No internal connection  
DNU Do not use  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
logic diagram 1:2 register-B configuration (positive logic)  
G2  
RESET  
H1  
J1  
CLK  
CLK  
A3, T3  
T1  
V
REF  
D14 (DCKE)  
D11 (DODT)  
D7 (DCS)  
CSR  
T5  
T6  
Q14A (QCKEA)  
Q14B (QCKEB)  
D
R
CLK  
CLK  
CLK  
N1  
H2  
J2  
N5  
N6  
Q11A (QODTA)  
Q11B (QODTB)  
D
R
H5  
H6  
Q7A (QCSA)  
Q7B (QCSB)  
D
R
One of Eleven Channels  
D1  
A1  
A5  
A6  
CE  
Q1A  
Q1B  
D
R
CLK  
To 10 Other Channels (D2D6, D8D10, D12D13)  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
TERMINAL FUNCTIONS  
ELECTRICAL  
CHARACTERISTICS  
TERMINAL NAME  
DESCRIPTION  
Ground  
Ground input  
GND  
Power-supply voltage  
Input reference voltage  
Positive master clock input  
Negative master clock input  
1.8 V nominal  
0.9 V nominal  
Differential input  
Differential input  
LVCMOS inputs  
V
V
CC  
REF  
CLK  
CLK  
Configuration control inputs Register A, Register B, 1:1, 1:2 select  
C0, C1  
Asynchronous reset input resets registers and disables V  
differential-input receivers  
data and clock  
REF  
LVCMOS input  
SSTL_18 inputs  
RESET  
Data inputs clocked in on the crossing of the rising edge of CLK and the falling edge of  
CLK  
D1D25  
Chip select inputs disables D1-D25 outputs switching when both inputs are high  
SSTL_18 inputs  
CSR, DCS  
DODT  
The outputs of this register bit will not be suspended by the DCS and CSR control.  
The outputs of this register bit will not be suspended by the DCS and CSR control.  
Data outputs that are suspended by the DCS and CSR control  
Data output that will not be suspended by the DCS and CSR control  
Data output that will not be suspended by the DCS and CSR control  
Data output that will not be suspended by the DCS and CSR control  
No internal connection  
SSTL_18 input  
SSTL_18 input  
DCKE  
1.8 V CMOS outputs  
1.8 V CMOS output  
1.8 V CMOS output  
1.8 V CMOS output  
Q1Q25  
QCS  
QODT  
QCKE  
NC  
Do not use inputs are in standby-equivalent mode, and outputs are driven low.  
DNU  
Data inputs = D2, D3, D5, D6, D8D25 when C0 = 0 and C1 = 0  
Data inputs = D2, D3 D5, D6, D8D14 when C0 = 0 and C1 = 1  
Data inputs = D1D6, D8D10, D12, D13 when C0 = 1 and C1 = 1.  
Data outputs = Q2, Q3, Q5, Q6, Q8Q25 when C0 = 0 and C1 = 0  
Data outputs = Q2, Q3 Q5, Q6, Q8Q14 when C0 = 0 and C1 = 1  
Data outputs = Q1Q6, Q8Q10, Q12, Q13 when C0 = 1 and C1 = 1.  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
FUNCTION TABLES  
INPUTS  
OUTPUT  
Qn  
RESET  
DCS  
CSR  
CLK  
CLK  
Dn  
H
L
X
L
L
H
H
H
H
H
L
X
X
L
H
L
H
L
X
L
H
H
H
H
X
Q
Q
0
0
X
X
L or H  
X or  
L or H  
X or  
X
X or  
X or  
X or  
L
L
floating floating floating floating floating  
INPUTS  
OUTPUTS  
DCKE,  
DCS,  
QCKE,  
QCS,  
RESET  
CLK  
CLK  
DODT  
QODT  
H
H
H
H
L
H
L
L or H  
X or  
L or H  
X or  
X
Q
0
X or  
L
L
floating floating floating  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 2.5 V  
CC  
Input voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 2.5 V  
I
Output voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to V  
+ 0.5 V  
O
CC  
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
IK  
I
I
CC  
Output clamp current, I  
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
Continuous current through each V  
Package thermal impedance, θ (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36°C/W  
Storage temperature range, T  
O
O
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA  
CC  
JA  
stg  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditionsis not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. This value is limited to 2.5 V maximum.  
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
recommended operating conditions (see Note 4)  
MIN  
1.7  
NOM  
MAX  
1.9  
UNIT  
V
V
V
V
V
V
V
V
V
V
V
V
Supply voltage  
CC  
REF  
I
Reference voltage  
0.49 × V  
0
0.5 × V  
0.51 × V  
CC  
V
CC  
CC  
Input voltage  
V
CC  
V
AC high-level input voltage  
AC low-level input voltage  
DC high-level input voltage  
DC low-level input voltage  
High-level input voltage  
Low-level input voltage  
Common-mode input voltage range  
Peak-to-peak input voltage  
High-level output current  
Low-level output current  
Operating free-air temperature  
Data inputs, CSR  
Data inputs, CSR  
Data inputs, CSR  
Data inputs, CSR  
RESET, Cn  
V
V
+250 mV  
+125 mV  
V
IH  
REF  
V
V
250 mV  
125 mV  
V
IL  
REF  
V
IH  
REF  
V
IL  
REF  
0.65 × V  
V
IH  
CC  
RESET, Cn  
0.35 × V  
V
IL  
CC  
CLK, CLK  
0.675  
1.125  
V
ICR  
I(PP)  
CLK, CLK  
600  
mV  
I
I
8  
8
OH  
mA  
OL  
T
A
0
70  
C
NOTE 4: The RESET and Cn inputs of the device must be held at valid logic voltage levels (not floating) to ensure proper device operation. The  
differential inputs must not be floating unless RESET is low. Refer to the TI application report, Implications of Slow or Floating CMOS  
Inputs, literature number SCBA004.  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
PARAMETER  
TEST CONDITIONS  
V
MIN TYP  
0.2  
MAX  
UNIT  
CC  
I
I
I
I
= 100 µA  
= 6 mA  
= 100 µA  
= 6 mA  
1.7 V to 1.9 V  
1.7 V  
V
OH  
OH  
OL  
OL  
CC  
1.2  
V
V
V
OH  
1.7 V to 1.9 V  
1.7 V  
0.2  
0.5  
±5  
V
OL  
I
I
All inputs  
V = V  
or GND  
1.9 V  
µA  
µA  
I
I
CC  
RESET = GND  
RESET = V , V = V  
Static standby  
100  
40  
I
I
= 0  
= 0  
1.9 V  
CC  
O
Static operating  
or V  
or V  
mA  
CC  
I
IH(AC)  
IH(AC)  
IL(AC)  
IL(AC)  
Dynamic operating RESET = V , V = V  
clock only  
,
µA/  
MHz  
CC  
I
28  
18  
CLK and CLK switching 50% duty cycle  
Dynamic operating –  
per each data input,  
1:1 configuration  
µA/  
clock  
RESET = V , V = V  
CC  
or V  
IL(AC)  
,
I
IH(AC)  
I
1.8 V  
CCD  
O
CLK and CLK switching 50% duty cycle,  
MHz/  
D input  
One data input switching at one-half clock  
frequency, 50% duty cycle  
Dynamic operating –  
per each data input,  
1:2 configuration  
36  
27  
Chip-select-enabled  
low-power active  
mode clock only  
RESET = V , V = V  
CC  
or V  
,
µA/  
MHz  
I
IH(AC)  
IL(AC)  
CLK and CLK switching 50% duty cycle  
Chip-select-enabled  
low-power active  
mode –  
2
2
I
I
O
= 0  
1.8 V  
CCDLP  
µA/  
clock  
MHz/  
D input  
RESET = V , V = V  
CC  
or V  
IL(AC)  
,
I
IH(AC)  
1:1 configuration  
CLK and CLK switching 50% duty cycle,  
One data input switching at one-half clock  
frequency, 50% duty cycle  
Chip-select-enabled  
low-power active  
mode –  
1:2 configuration  
Data inputs, CSR  
CLK, CLK  
V = V  
I
± 250 mV  
2.5  
2
3
3.5  
3
REF  
= 0.9 V, V  
C
V
ICR  
= 600 mV  
pF  
1.8 V  
i
I(PP)  
or GND  
RESET  
V = V  
I
2.5  
CC  
All typical values are at V  
= 1.8 V, T = 25°C.  
CC  
A
Each V  
REF  
pin (A3 or T3) should be tested independently, with the other (untested) pin open.  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 1 and Note 5)  
MIN  
MAX  
UNIT  
MHz  
ns  
f
t
t
t
Clock frequency  
500  
clock  
Pulse duration, CLK, CLK high or low  
Differential inputs active time (see Note 6)  
Differential inputs inactive time (see Note 7)  
1
w
10  
15  
ns  
act  
ns  
inact  
0.7  
0.5  
0.5  
0.5  
DCS before CLK, CLK, CSR high; CSR before CLK, CLK, DCS high  
t
Setup time  
Hold time  
ns  
ns  
DCS before CLK, CLK, CSR low  
su  
h
DODT, DCKE, and Data before CLK, CLK↓  
DCS, DODT, DCKE, and Data after CLK, CLK↓  
t
NOTES: 5. All input slew rates are 1 V/ns ±20%.  
6.  
7.  
V
V
low.  
must be held at a valid input level and data inputs must be held low for a minimum time of t  
, data, and clock inputs must be held at valid voltage levels (not floating) for a minimum time of t  
max, after RESET is taken high.  
REF  
REF  
act  
max, after RESET is taken  
inact  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
switching characteristics over recommended operating free-air temperature range (unless  
otherwise noted) (see Figure 1)  
V
= 1.8 V  
CC  
± 0.1 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN  
500  
1.4  
MAX  
f
t
t
MHz  
ns  
max  
CLK and CLK  
CLK and CLK  
RESET  
Q
Q
Q
2.5  
2.7  
3
pdm  
ns  
pdmss  
t
ns  
RPHL  
Includes 350-ps test-load transmission-line delay  
output slew rates over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 2)  
V = 1.8 V  
CC  
± 0.1 V  
PARAMETER  
FROM  
TO  
UNIT  
MIN  
MAX  
dV/dt_r  
dV/dt_f  
20%  
80%  
80%  
20%  
1.9  
4.9  
V/ns  
V/ns  
V/ns  
1.9  
4.9  
1
§
dV/dt_∆  
80% or 20%  
20% or 80%  
§
Difference between dV/dt_r (rising edge rate) and dV/dt_f (falling edge rate)  
12  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Z
= 50 Ω,  
= 350 ps  
O
Test  
Point  
DUT  
CLK  
t
D
R
= 1 kΩ  
L
Output  
Test Point  
Out  
Clock Inputs  
R
= 100 Ω  
L
C
= 30 pF  
L
Z
t
= 50 Ω,  
= 350 ps  
O
D
CLK  
R = 1 kΩ  
L
(see Note A)  
Test  
Point  
Z
= 50 Ω,  
= 350 ps  
O
t
D
LOAD CIRCUIT  
t
w
V
V
IH  
V
REF  
V
V
Input  
REF  
V
IL  
LVCMOS  
RESET  
Input  
CC  
V
/2  
V
/2  
CC  
CC  
VOLTAGE WAVEFORMS  
PULSE DURATION  
0 V  
V
I(PP)  
t
t
act  
inact  
Timing  
Inputs  
V
ICR  
ICR  
I
I
(operating)  
I
CC  
CC  
90%  
(see  
Note B)  
10%  
(standby)  
CC  
t
t
PLH  
PHL  
VOLTAGE AND CURRENT WAVEFORMS  
INPUTS ACTIVE AND INACTIVE TIMES  
V
OH  
OL  
Output  
V
TT  
V
TT  
V
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
V
I(PP)  
V
V
IH  
Timing  
Inputs  
LVCMOS  
RESET  
Input  
V
ICR  
V
CC  
/2  
IL  
t
PHL  
t
t
h
su  
V
V
V
OH  
IH  
V
REF  
Input  
V
REF  
Output  
V
TT  
V
OL  
IL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
NOTES: A.  
B.  
C
includes probe and jig capacitance.  
tested with clock and data inputs held at V  
L
I
or GND, and I = 0 mA.  
CC  
CC O  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 ,  
O
input slew rate = 1 V/ns ±20% (unless otherwise noted).  
D. The outputs are measured one at a time with one transition per measurement.  
E.  
F.  
G.  
H.  
I.  
V
V
V
V
= V /2  
REF  
IH  
IL  
CC  
= V  
= V  
+ 250 mV (ac voltage levels) for differential inputs. V = V  
250 mV (ac voltage levels) for differential inputs. V = GND for LVCMOS input.  
for LVCMOS input.  
CC  
REF  
REF  
IH  
IL  
= 600 mV  
and t  
I(PP)  
t
are the same as t  
.
pd  
PLH  
PHL  
Figure 1. Load Circuit and Voltage Waveforms  
13  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN74SSTU32864  
25-BIT CONFIGURABLE REGISTERED BUFFER  
WITH SSTL_18 INPUTS AND OUTPUTS  
SCES434 MARCH 2003  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
DUT  
R
= 50 Ω  
L
V
V
OH  
Out  
Test Point  
80%  
C
= 5 pF  
Output  
L
20%  
(see Note A)  
OL  
dV_f  
dt_f  
VOLTAGE WAVEFORMS  
LOAD CIRCUIT  
HIGH-TO-LOW SLEW-RATE MEASUREMENT  
HIGH-TO-LOW SLEW-RATE MEASUREMENT  
DUT  
Out  
dt_r  
dV_r  
Test Point  
= 50 Ω  
V
OH  
80%  
C
= 5 pF  
L
Output  
R
L
(see Note A)  
20%  
V
OL  
LOAD CIRCUIT  
LOW-TO-HIGH SLEW-RATE MEASUREMENT  
VOLTAGE WAVEFORMS  
LOW-TO-HIGH SLEW-RATE MEASUREMENT  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. All input pulses are supplied by generators having the following characteristics:  
PRR 10 MHz, Z = 50 , input slew rate = 1 V/ns ± 20% (unless otherwise specified).  
O
Figure 2. Output Slew-Rate Measurement Information  
14  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SN74SSTU32864GKER  
SN74SSTU32864ZKER  
ACTIVE  
ACTIVE  
LFBGA  
LFBGA  
GKE  
96  
96  
1000  
TBD  
/
/
Level-3-220C-168 HR  
Level-3-250C-1WEEK  
ZKE  
1000 Green (RoHS &  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
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and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
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Copyright 2005, Texas Instruments Incorporated  

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