TCA9555RGER_技术文档

TCA9555

www.ti.com .............................................................................................................................................................. SCPS200A–JULY 2009–REVISED JULY 2009

LOW VOLTAGE 16-BIT I²C AND SMBus I/O EXPANDER

WITH INTERRUPT OUTPUT AND CONFIGURATION REGISTERS

1

FEATURES

•

Low Standby-Current Consumption of

3 µA Max

I²C to Parallel Port Expander

Open-Drain Active-Low Interrupt Output

5-V Tolerant I/O Ports

•

Polarity Inversion Register

Latched Outputs With High-Current Drive

Capability for Directly Driving LEDs

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

ESD Protection Exceeds JESD 22

Compatible With Most Microcontrollers

400-kHz Fast I²C Bus

–

2000-V Human-Body Model (A114-A)

200-V Machine Model (A115-A)

Address by Three Hardware Address Pins for

Use of up to Eight Devices

1000-V Charged-Device Model (C101)

PW PACKAGE

(TOP VIEW)

RTW PACKAGE

(TOP VIEW)

1

24

23

22

21

20

19

18

17

16

15

14

13

INT

A1

V_CC

SDA

SCL

A0

2

24 23 22 21 20 19

3

A2

1

2

18

17

16

15

A0

P00

P01

P02

P03

P04

P05

4

P00

P01

P02

P03

P04

P05

P06

P07

GND

P17

P16

P15

P14

P13

5

Exposed

Center

Pad

P17

P16

P15

P14

P13

P12

P11

P10

3

4

6

7

5

6

14

13

8

9

7

8

9

10 11 12

10

11

12

The exposed center pad, if used, must be

connected as a secondary ground or left

electrically open.

DESCRIPTION/ORDERING INFORMATION

This 16-bit I/O expander for the two-line bidirectional bus (I²C) is designed for 1.65-V to 5.5-V V_CCoperation. It

provides general-purpose remote I/O expansion for most microcontroller families via the I²C interface [serial clock

(SCL), serial data (SDA)].

The TCA9555 consists of two 8-bit Configuration (input or output selection), Input Port, Output Port, and Polarity

Inversion (active high or active low operation) registers. At power on, the I/Os are configured as inputs. The

system master can enable the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for

each input or output is kept in the corresponding Input or Output register. The polarity of the Input Port register

can be inverted with the Polarity Inversion register. All registers can be read by the system master.

The system master can reset the TCA9555 in the event of a timeout or other improper operation by utilizing the

power-on reset feature, which puts the registers in their default state and initializes the I²C/SMBus state machine.

The TCA9555 open-drain interrupt (INT) output is activated when any input state differs from its corresponding

Input Port register state and is used to indicate to the system master that an input state has changed.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TCA9555

SCPS200A–JULY 2009–REVISED JULY 2009 .............................................................................................................................................................. www.ti.com

INT can be connected to the interrupt input of a microcontroller. By sending an interrupt signal on this line, the

remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via

the I²C bus. Thus, the TCA9555 can remain a simple slave device.

The device outputs (latched) have high-current drive capability for directly driving LEDs.

Although pin-to-pin and I²C-address is compatible with the PCF8575, software changes are required due to the

enhancements.

The TCA9555 is identical to the TCA9535, except for the inclusion of the internal I/O pullup resistor, which pulls

the I/O to a default high when configured as an input and undriven.

Three hardware pins (A0, A1, and A2) are used to program and vary the fixed I²C address and allow up to eight

devices to share the same I²C bus or SMBus. The fixed I²C address of the TCA9555 is the same as the

PCF8575, PCF8575C, and PCF8574, allowing up to eight of these devices in any combination to share the same

I²C bus or SMBus.

ORDERING INFORMATION⁽¹⁾

T_A

PACKAGE⁽²⁾

Reel of 2000

Reel of 3000

ORDERABLE PART NUMBER

TCA9555PWR

TOP-SIDE MARKING

PW555

TSSOP – PW

QFN – RTW

–40°C to 85°C

TCA9555RTWR

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

2

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TERMINAL FUNCTIONS

NO.

NAME

DESCRIPTION

TSSOP (PW)

QFN (RTW)

1

2

3

22

23

24

INT

A1

Interrupt output. Connect to V_CCthrough a pullup resistor.

Address input 1. Connect directly to V_CCor ground.

Address input 2. Connect directly to V_CCor ground.

A2

P-port input/output. Push-pull design structure. At power on, P00 is

configured as an input.

4

5

1

2

3

4

5

6

7

P00

P01

P02

P03

P04

P05

P06

P-port input/output. Push-pull design structure. At power on, P01 is

configured as an input.

P-port input/output. Push-pull design structure. At power on, P02 is

configured as an input.

6

P-port input/output. Push-pull design structure. At power on, P03 is

configured as an input.

7

P-port input/output. Push-pull design structure. At power on, P04 is

configured as an input.

8

P-port input/output. Push-pull design structure. At power on, P05 is

configured as an input.

9

P-port input/output. Push-pull design structure. At power on, P06 is

configured as an input.

10

P-port input/output. Push-pull design structure. At power on, P07 is

configured as an input.

11

12

13

8

9

P07

GND

P10

Ground

P-port input/output. Push-pull design structure. At power on, P10 is

configured as an input.

10

P-port input/output. Push-pull design structure. At power on, P11 is

configured as an input.

14

15

16

17

18

19

20

11

12

13

14

15

16

17

P11

P12

P13

P14

P15

P16

P17

P-port input/output. Push-pull design structure. At power on, P12 is

configured as an input.

P-port input/output. Push-pull design structure. At power on, P13 is

configured as an input.

P-port input/output. Push-pull design structure. At power on, P14 is

configured as an input.

P-port input/output. Push-pull design structure. At power on, P15 is

configured as an input.

P-port input/output. Push-pull design structure. At power on, P16 is

configured as an input.

P-port input/output. Push-pull design structure. At power on, P17 is

configured as an input.

21

22

23

24

18

19

20

21

A0

Address input 0. Connect directly to V_CCor ground.

Serial clock bus. Connect to V_CCthrough a pullup resistor.

Serial data bus. Connect to V_CCthrough a pullup resistor.

Supply voltage

SCL

SDA

V_CC

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LOGIC DIAGRAM (POSITIVE LOGIC)

TCA9555

1

Interrupt

Logic

INT

LP Filter

21

2

A0

A1

A2

P07-P00

P17-P10

3

22

23

SCL

SDA

2

Input

Filter

I C Bus

Control

Shift

I/O

16 Bits

Register

Port

Write Pulse

Read Pulse

24

12

V

Power-On

Reset

CC

GND

A. Pin numbers shown are for the PW package.

B. All I/Os are set to inputs at reset.

4

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SIMPLIFIED SCHEMATIC OF P-PORT I/Os

Data From

Output Port

Shift Register

Register Data

Configuration

Register

V

CC

Q1

Data From

Shift Register

D

Q

100 kW

FF

CLK

D

Q

Write Configuration

Pulse

Q

FF

CLK

I/O Pin

GND

Write Pulse

Output Port

Register

Q2

Input Port

Register

D

Q

Input Port

Register Data

FF

CLK

Read Pulse

Q

To INT

Data From

Shift Register

Polarity

Register Data

D

Q

FF

CLK

Write Polarity

Pulse

Polarity Inversion

Register

I/O Port

When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a high-impedance input. The input

voltage may be raised above V_CCto a maximum of 5.5 V.

If the I/O is configured as an output, Q1 or Q2 is enabled, depending on the state of the Output Port register. In

this case, there are low-impedance paths between the I/O pin and either V_CCor GND. The external voltage

applied to this I/O pin should not exceed the recommended levels for proper operation.

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I²C Interface

The bidirectional I²C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be

connected to a positive supply via a pullup resistor when connected to the output stages of a device. Data

transfer may be initiated only when the bus is not busy.

I²C communication with this device is initiated by a master sending a Start condition, a high-to-low transition on

the SDA input/output while the SCL input is high (see Figure 1). After the Start condition, the device address byte

is sent, MSB first, including the data direction bit (R/W). This device does not respond to the general call

address.

After receiving the valid address byte, this device responds with an ACK, a low on the SDA input/output during

the high of the ACK-related clock pulse. The address inputs (A0–A2) of the slave device must not be changed

between the Start and Stop conditions.

On the I²C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain

stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control

commands (Start or Stop) (see Figure 2).

A Stop condition, a low-to-high transition on the SDA input/output while the SCL input is high, is sent by the

master (see Figure 1).

Any number of data bytes can be transferred from the transmitter to the receiver between the Start and the Stop

conditions. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before

the receiver can send an ACK bit. The device that acknowledges must pull down the SDA line during the ACK

clock pulse so that the SDA line is stable low during the high pulse of the ACK-related clock period (see

Figure 3). When a slave receiver is addressed, it must generate an ACK after each byte is received. Similarly,

the master must generate an ACK after each byte that it receives from the slave transmitter. Setup and hold

times must be met to ensure proper operation.

A master receiver signals an end of data to the slave transmitter by not generating an acknowledge (NACK) after

the last byte has been clocked out of the slave. This is done by the master receiver by holding the SDA line high.

In this event, the transmitter must release the data line to enable the master to generate a Stop condition.

SDA

SCL

S

P

Start Condition

Stop Condition

Figure 1. Definition of Start and Stop Conditions

SDA

SCL

Data Line

Stable;

Data Valid

Change

of Data

Allowed

Figure 2. Bit Transfer

6

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Data Output

by Transmitter

NACK

Data Output

by Receiver

ACK

SCL From

1

2

8

9

Master

S

Start

Clock Pulse for

Condition

Acknowledgment

Figure 3. Acknowledgment on I²C Bus

Interface Definition

BIT

BYTE

7 (MSB)

6

5

4

3

2

1

0 (LSB)

I²C slave address

P0x I/O data bus

P1x I/O data bus

L

H

L

A2

A1

A0

R/W

P00

P10

P07

P17

P06

P16

P05

P15

P04

P14

P03

P13

P02

P12

P01

P11

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Device Address

Figure 4 shows the address byte of the TCA9555.

R/W

Slave Address

0

1

0

A2 A1 A0

Fixed

Programmable

Figure 4. TCA9555 Address

Address Reference

INPUTS

I²C BUS SLAVE ADDRESS

A2

L

A1

L

A0

L

32 (decimal), 20 (hexadecimal)

33 (decimal), 21 (hexadecimal)

34 (decimal), 22 (hexadecimal)

35 (decimal), 23 (hexadecimal)

36 (decimal), 24 (hexadecimal)

37 (decimal), 25 (hexadecimal)

38 (decimal), 26 (hexadecimal)

39 (decimal), 27 (hexadecimal)

L

H

L

H

L

H

L

H

L

H

L

H

The last bit of the slave address defines the operation (read or write) to be performed. A high (1) selects a read

operation, while a low (0) selects a write operation.

Control Register and Command Byte

Following the successful acknowledgment of the address byte, the bus master sends a command byte that is

stored in the control register in the TCA9555. Three bits of this data byte state the operation (read or write) and

the internal register (input, output, polarity inversion, or configuration) that will be affected. This register can be

written or read through the I²C bus. The command byte is sent only during a write transmission.

Once a command byte has been sent, the register that was addressed continues to be accessed by reads until a

new command byte has been sent.

0

B2 B1 B0

Figure 5. Control Register Bits

Command Byte

CONTROL REGISTER BITS

COMMAND

BYTE (HEX)

POWER-UP

DEFAULT

REGISTER

PROTOCOL

B2

B1

0

B0

0

1

0

1

0

1

0

1

0

1

0x00

0x01

0x02

0x03

0x04

0x05

0x06

0x07

Input Port 0

Input Port 1

Read byte

xxxx xxxx

1111 1111

0000 0000

1111 1111

0

Read byte

1

Output Port 0

Read/write byte

1

Output Port 1

0

Polarity Inversion Port 0

Polarity Inversion Port 1

Configuration Port 0

Configuration Port 1

0

1

8

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Register Descriptions

The Input Port registers (registers 0 and 1) reflect the incoming logic levels of the pins, regardless of whether the

pin is defined as an input or an output by the Configuration register. It only acts on read operation. Writes to

these registers have no effect. The default value, X, is determined by the externally applied logic level.

Before a read operation, a write transmission is sent with the command byte to indicate to the I²C device that the

Input Port register will be accessed next.

Registers 0 and 1 (Input Port Registers)

Bit

I0.7

X

I0.6

X

I0.5

X

I0.4

X

I0.3

X

I0.2

X

I0.1

X

I0.0

X

Default

Bit

I1.7

X

I1.6

X

I1.5

X

I1.4

X

I1.3

X

I1.2

X

I1.1

X

I1.0

X

Default

The Output Port registers (registers 2 and 3) show the outgoing logic levels of the pins defined as outputs by the

Configuration register. Bit values in this register have no effect on pins defined as inputs. In turn, reads from this

register reflect the value that is in the flip-flop controlling the output selection, not the actual pin value.

Registers 2 and 3 (Output Port Registers)

Bit

O0.7

1

O0.6

1

O0.5

1

O0.4

1

O0.3

1

O0.2

1

O0.1

1

O0.0

1

Default

Bit

O1.7

1

O1.6

1

O1.5

1

O1.4

1

O1.3

1

O1.2

1

O1.1

1

O1.0

1

Default

The Polarity Inversion registers (registers 4 and 5) allow polarity inversion of pins defined as inputs by the

Configuration register. If a bit in this register is set (written with 1), the corresponding port pin's polarity is

inverted. If a bit in this register is cleared (written with a 0), the corresponding port pin's original polarity is

retained.

Registers 4 and 5 (Polarity Inversion Registers)

Bit

N0.7

0

N0.6

0

N0.5

0

N0.4

0

N0.3

0

N0.2

0

N0.1

0

N0.0

0

Default

Bit

N1.7

0

N1.6

0

N1.5

0

N1.4

0

N1.3

0

N1.2

0

N1.1

0

N1.0

0

Default

The Configuration registers (registers 6 and 7) configure the directions of the I/O pins. If a bit in this register is

set to 1, the corresponding port pin is enabled as an input with a high-impedance output driver. If a bit in this

register is cleared to 0, the corresponding port pin is enabled as an output.

Registers 6 and 7 (Configuration Registers)

Bit

C0.7

1

C0.6

1

C0.5

1

C0.4

1

C0.3

1

C0.2

1

C0.1

1

C0.0

1

Default

Bit

C1.7

1

C1.6

1

C1.5

1

C1.4

1

C1.3

1

C1.2

1

C1.1

1

C1.0

1

Default

Power-On Reset

When power (from 0 V) is applied to V_CC, an internal power-on reset holds the TCA9555 in a reset condition until

V_CChas reached V_POR. At that point, the reset condition is released and the TCA9555 registers and I²C/SMBus

state machine initialize to their default states. After that, V_CCmust be lowered to below 0.2 V and then back up to

the operating voltage for a power-reset cycle.

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Interrupt (INT) Output

An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After time, t_iv, the

signal INT is valid. Resetting the interrupt circuit is achieved when data on the port is changed to the original

setting, data is read from the port that generated the interrupt or in a Stop event. Resetting occurs in the read

mode at the acknowledge (ACK) bit or not acknowledge (NACK) bit after the falling edge of the SCL signal.

Interrupts that occur during the ACK or NACK clock pulse can be lost (or be very short) due to the resetting of

the interrupt during this pulse. Each change of the I/Os after resetting is detected and is transmitted as INT.

Reading from or writing to another device does not affect the interrupt circuit, and a pin configured as an output

cannot cause an interrupt. Changing an I/O from an output to an input may cause a false interrupt to occur if the

state of the pin does not match the contents of the Input Port register. Because each 8-bit port is read

independently, the interrupt caused by port 0 is not cleared by a read of port 1, or vice versa.

INT has an open-drain structure and requires a pullup resistor to V_CC

.

Bus Transactions

Data is exchanged between the master and the TCA9555 through write and read commands.

Writes

Data is transmitted to the TCA9555 by sending the device address and setting the least-significant bit to a logic 0

(see Figure 4 for device address). The command byte is sent after the address and determines which register

receives the data that follows the command byte.

The eight registers within the TCA9555 are configured to operate as four register pairs. The four pairs are input

ports, output ports, polarity inversion ports, and configuration ports. After sending data to one register, the next

data byte is sent to the other register in the pair (see Figure 6 and Figure 7). For example, if the first byte is sent

to output port (register 3), the next byte is stored in Output Port 0 (register 2).

There is no limitation on the number of data bytes sent in one write transmission. In this way, each 8-bit register

may be updated independently of the other registers.

1

2

3

4

5

6

7

8

9

SCL

SDA

Command Byte

Data to Port 0

Data 0

Data to Port 1

Data 1

Slave Address

A

P

0.7

0.0

1.7

A

1.0

S

0

1

0

A2 A1 A0

0

A

0

1

0

A

R/W

Acknowledge

From Slave

Acknowledge

From Slave

Start Condition

Acknowledge

From Slave

Write to Port

Data Out from Port 0

t

pv

Data Valid

Data Out from Port 1

t

pv

Figure 6. Write to Output Port Registers

1

2

3

4

5

6

7

8

0

9

1

0

2

3

4

5

6

7

8

9

1

2

3

4

5

6

7

8

9

1

2

3

4

5

SCL

SDA

Slave Address

Command Byte

Data to Register

Data 0

Data to Register

Data1

MSB

LSB

MSB

LSB

S

0

1

0

A2 A1 A0

A

0

1

0

A

P

Acknowledge

From Slave

Acknowledge

From Slave

R/W

Acknowledge

From Slave

Start Condition

Figure 7. Write to Configuration Registers

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Reads

The bus master first must send the TCA9555 address with the least-significant bit set to a logic 0 (see Figure 4

for device address). The command byte is sent after the address and determines which register is accessed.

After a restart, the device address is sent again, but this time, the least-significant bit is set to a logic 1. Data

from the register defined by the command byte then is sent by the TCA9555 (see Figure 8 through Figure 10).

After a restart, the value of the register defined by the command byte matches the register being accessed when

the restart occurred. For example, if the command byte references Input Port 1 before the restart, and the restart

occurs when Input Port 0 is being read, the stored command byte changes to reference Input Port 0. The original

command byte is forgotten. If a subsequent restart occurs, Input Port 0 is read first. Data is clocked into the

register on the rising edge of the ACK clock pulse. After the first byte is read, additional bytes may be read, but

the data now reflect the information in the other register in the pair. For example, if Input Port 1 is read, the next

byte read is Input Port 0.

Data is clocked into the register on the rising edge of the ACK clock pulse. There is no limitation on the number

of data bytes received in one read transmission, but when the final byte is received, the bus master must not

acknowledge the data.

Data From Lower

or Upper Byte

Slave Address

of Register

Acknowledge

From Slave

Acknowledge

From Slave

Acknowledge

From Slave

Acknowledge

From Master

Data

Command Byte

S

0

1

0

A2 A1 A0

0

A

S

0

1

0

A2 A1 A0

1

A

MSB

LSB A

First Byte

R/W

At this moment, master transmitter

becomes master receiver, and

slave-receiver becomes

slave-transmitter.

Data From Upper

or Lower Byte

of Register

No Acknowledge

From Master

MSB

LSB NA

P

Data

Last Byte

Figure 8. Read From Register

1

2

3

4

5

6

7

8

9

SCL

SDA

I0.x

I1.x

I0.x

I1.x

3

S

0

1

0

A2 A1 A0

1

A

7

6

5

4

3

2

1

0

A

7

6

5

4

3

2

1

0

A

7

6

5

4

3

2

1

0

A

7

6

5

4

2

1

0

1

P

Acknowledge

From Slave

Acknowledge

From Master

Acknowledge

From Master

Acknowledge

From Master

R/W

No Acknowledge

From Master

Read From Port 0

Data Into Port 0

Read From Port 1

Data Into Port 1

INT

t

iv

t

ir

A. Transfer of data can be stopped at any time by a Stop condition. When this occurs, data present at the latest

acknowledge phase is valid (output mode). It is assumed that the command byte previously has been set to 00 (read

Input Port register).

B. This figure eliminates the command byte transfer, a restart, and slave address call between the initial slave address

call and actual data transfer from the P port (see Figure 8 for these details).

Figure 9. Read Input Port Register, Scenario 1

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TCA9555

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1

2

3

4

5

6

7

8

9

SCL

SDA

I0.x

I1.x

I0.x

I1.x

S

0

1

0

A2 A1 A0

1

A

00

A

10

A

03

A

1

P

12

Acknowledge

From Master

Acknowledge

From Master

Acknowledge

From Slave

Acknowledge

From Master

R/W

No Acknowledge

From Master

t

ps

t

ph

Read From Port 0

Data Into Port 0

Data 00

Data 01

Data 02

Data 03

t

ps

ph

Read From Port 1

11

12

Data

Data 10

Data

Data Into Port 1

INT

t

ir

t

iv

A. Transfer of data can be stopped at any time by a Stop condition. When this occurs, data present at the latest

acknowledge phase is valid (output mode). It is assumed that the command byte previously has been set to 00 (read

Input Port register).

B. This figure eliminates the command byte transfer, a restart, and slave address call between the initial slave address

call and actual data transfer from the P port (see Figure 8 for these details).

Figure 10. Read Input Port Register, Scenario 2

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ABSOLUTE MAXIMUM RATINGS⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

MIN

–0.5

MAX

6

UNIT

V

V_CC

V_I

Supply voltage range

Input voltage range⁽²⁾

Output voltage range⁽²⁾

6

V

V_O

I_IK

6

V

Input clamp current

V_I< 0

–20

±20

50

mA

I_OK

I_IOK

I_OL

I_OH

Output clamp current

V_O< 0

Input/output clamp current

Continuous output low current

Continuous output high current

Continuous current through GND

Continuous current through V_CC

V_O< 0 or V_O> V_CC

V_O= 0 to V_CC

–50

–250

160

88

I_CC

mA

PW package

θ_JA

Package thermal impedance, junction to free air⁽³⁾

Storage temperature range

°C/W

°C

RTW package

66

T_stg

–65

150

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3) The package thermal impedance is calculated in accordance with JESD 51-7.

RECOMMENDED OPERATING CONDITIONS

MIN

1.65

MAX

5.5

UNIT

V_CC

V_IH

Supply voltage

V

SCL, SDA

0.7 × V_CC

–0.5

5.5

High-level input voltage

V

A2–A0, P07–P00, P17–P10

SCL, SDA

5.5

0.3 × V_CC

–10

V_IL

Low-level input voltage

A2–A0, P07–P00, P17–P10

P07–P00, P17–P10

–0.5

I_OH

I_OL

T_A

High-level output current

Low-level output current

Operating free-air temperature

mA

°C

25

–40

85

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ELECTRICAL CHARACTERISTICS

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

I_I= –18 mA

V_CC

1.65 V to 5.5 V

1.65 V

MIN TYP⁽¹⁾

MAX UNIT

V_IK

Input diode clamp voltage

Power-on reset voltage

–1.2

1.5

1.2

1.8

2.6

4.1

1.8

1.7

2.5

4

V

V_POR

V_I= V_CCor GND, I_O= 0

1.65

V

2.3 V

I_OH= –8 mA

3 V

4.75 V

V_OH

P-port high-level output voltage⁽²⁾

V

1.65 V

2.3 V

I_OH= –10 mA

3 V

4.75 V

SDA

V_OL= 0.4 V

V_OL= 0.5 V

V_OL= 0.7 V

V_OL= 0.4 V

3

8

10

3

20

24

I_OL

P port⁽³⁾

1.65 V to 5.5 V

mA

INT

SCL, SDA

A2–A0

P port

±1

I_I

V_I= V_CCor GND

1.65 V to 5.5 V

µA

I_IH

I_IL

V_I= V_CC

1.65 V to 5.5 V

5.5 V

1

µA

V_I= GND

–100

200

75

100

30

3.6 V

V_I= V_CCor GND, I_O= 0,

I/O = inputs, f_SCL= 400 kHz, No load

Operating mode

µA

mA

µA

2.7 V

20

50

1.95 V

5.5 V

10

45

1.1

0.7

0.5

0.3

2.5

2

1.5

1.3

1

3.6 V

V_I= GND, I_O= 0, I/O = inputs,

f_SCL= 0 kHz, No load

I_CC

Low inputs

Standby mode

2.7 V

1.95 V

5.5 V

0.9

3

3.6 V

2.6

2.5

2.3

V_I= V_CC, I_O= 0, I/O = inputs,

f_SCL= 0 kHz, No load

High inputs

2.7 V

1.5

1.2

1.95 V

Additional current in standby

mode

One input at V_CC– 0.6 V,

Other inputs at V_CCor GND

ΔI_CC

1.65 V to 5.5 V

1.5

mA

pF

C_I

SCL

V_I= V_CCor GND

3

7

SDA

P port

C_io

V_IO= V_CCor GND

1.65 V to 5.5 V

pF

3.7

9.5

(1) All typical values are at nominal supply voltage (1.8-V, 2.5-V, 3.3-V, or 5-V V_CC) and T_A= 25°C.

(2) Each I/O must be externally limited to a maximum of 25 mA, and each octal (P07–P00 and P17–P10) must be limited to a maximum

current of 100 mA, for a device total of 200 mA.

(3) The total current sourced by all I/Os must be limited to 160 mA (80 mA for P07–P00 and 80 mA for P17–P10).

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I²C INTERFACE TIMING REQUIREMENTS

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 11)

MIN

0

MAX

UNIT

kHz

µs

f_scl

I²C clock frequency

I²C clock high time

I²C clock low time

400

t_sch

t_scl

0.6

1.3

µs

t_sp

I²C spike time

50

ns

t_sds

t_sdh

t_icr

I²C serial-data setup time

I²C serial-data hold time

I²C input rise time

I²C input fall time

I²C output fall time

I²C bus free time between Stop and Start

I²C Start or repeated Start condition setup

I²C Start or repeated Start condition hold

I²C Stop condition setup

Valid-data time

100

ns

0

20 + 0.1C_b

1.3

ns

300

ns

t_icf

ns

t_ocf

10-pF to 400-pF bus

ns

t_buf

µs

t_sts

0.6

µs

t_sth

0.6

µs

t_sps

t_vd(Data)

t_vd(ack)

C_b

0.6

µs

SCL low to SDA output valid

50

ns

Valid-data time of ACK condition

I²C bus capacitive load

ACK signal from SCL low to SDA (out) low

0.1

0.9

µs

400

pF

SWITCHING CHARACTERISTICS

over recommended operating free-air temperature range, C_L≤ 100 pF (unless otherwise noted) (see Figure 12 and Figure 13)

FROM

(INPUT)

TO

(OUTPUT)

PARAMETER

MIN

MAX UNIT

t_iv

Interrupt valid time

Interrupt reset delay time

Output data valid

P port

SCL

INT

4

µs

ns

µs

t_ir

t_pv

t_ps

t_ph

SCL

P port

SCL

200

Input data setup time

Input data hold time

P port

150

1

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TYPICAL CHARACTERISTICS

T_A= 25°C (unless otherwise noted)

SUPPLY CURRENT

vs

TEMPERATURE

STANDBY SUPPLY CURRENT

SUPPLY CURRENT

vs

SUPPLY VOLTAGE

vs

TEMPERATURE

55

50

45

40

35

30

25

20

15

10

5

70

60

50

40

30

20

10

0

30

25

20

15

10

5

SCL = V_CC

f_SCL= 400 kHz

I/Os Unloaded

V_CC= 5 V

f_SCL= 400 kHz

I/Os Unloaded

V_CC= 5 V

V_CC= 3.3 V

V_CC= 2.5 V

0

-50

-25

0

25

50

75

100

2.3

2.7

3.1

3.5

3.9

4.3

4.7

5.1

5.5

-50

-25

0

25

50

75

100

T_A– Free-Air Temperature – °C

V_CC– Supply Voltage – V

T_A– Free-Air Temperature – °C

I/O SINK CURRENT

vs

OUTPUT LOW VOLTAGE

I/O SINK CURRENT

vs

OUTPUT LOW VOLTAGE

I/O SINK CURRENT

vs

OUTPUT LOW VOLTAGE

30

25

20

15

10

5

50

45

40

35

30

25

20

15

10

5

40

35

30

25

20

15

10

5

V_CC= 5 V

V_CC= 3.3 V

V_CC= 2.5 V

T_A= –40°C

T_A= 25°C

T_A= 125°C

0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.0

0.1

0.2

0.3

0.4

0.5

0.6

V

_OL– Output Low Voltage – V

V_OL– Output Low Voltage – V

I/O OUTPUT LOW VOLTAGE

I/O SOURCE CURRENT

vs

OUTPUT HIGH VOLTAGE

I/O SOURCE CURRENT

vs

OUTPUT HIGH VOLTAGE

vs

TEMPERATURE

300

275

250

225

200

175

150

125

100

75

35

30

25

20

15

10

5

50

45

40

35

30

25

20

15

10

5

V_CC= 2.5 V, I_SINK= 10 mA

V_CC= 3.3 V

V_CC= 2.5 V

T_A= –40°C

T_A= 25°C

V_CC= 5 V, I_SINK= 10 mA

T_A= 125°C

V_CC= 2.5 V, I_SINK= 1 mA

V_CC= 5 V, I_SINK= 1 mA

T_A= 125°C

50

25

0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

-50

-25

0

25

50

75

100

(V_CC– V_OH) – V

T_A– Free-Air Temperature – °C

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TYPICAL CHARACTERISTICS (continued)

T_A= 25°C (unless otherwise noted)

I/O SOURCE CURRENT

vs

OUTPUT HIGH VOLTAGE

I/O HIGH VOLTAGE

vs

TEMPERATURE

SUPPLY CURRENT

vs

NUMBER OF I/Os HELD LOW

300

275

250

225

200

175

150

125

100

75

1200

1100

1000

900

800

700

600

500

400

300

200

100

0

75

70

65

60

55

50

45

40

35

30

25

20

15

10

5

V_CC= 5 V

V_CC= 2.5 V, I_OL= 10 mA

T_A= –40°C

T_A= 25°C

V_CC= 5 V, I_OL= 10 mA

T_A= 125°C

50

25

0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0

1

2

3

4

5

6

7

8

9

10 11 12 13 14 15 16

-50

-25

0

25

50

75

100

(V_CC– V_OH) – V

T_A– Free-Air Temperature – °C

Number of I/Os Held Low

OUTPUT HIGH VOLTAGE

vs

SUPPLY VOLTAGE

6

5

4

3

2

1

0

T_A= 25°C

I_OH= –8 mA

I_OH= –10 mA

2.3

2.7

3.1

3.5

3.9

4.3

4.7

5.1

5.5

V_CC– Supply Voltage – V

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PARAMETER MEASUREMENT INFORMATION

V

CC

R

L

= 1 kΩ

SDA

DUT

C

L

= 50 pF

SDA LOAD CONFIGURATION

Three Bytes for Complete

Device Programming

Stop

Condition Condition

(P) (S)

Start

Address

Bit 7

(MSB)

R/W

Bit 0

(LSB)

Data

Bit 07

(MSB)

Data

Bit 10 Condition

(LSB)

Stop

Address

Bit 6

Address

Bit 1

ACK

(A)

(P)

t

scl

t

sch

0.7 × V

0.3 × V

CC

SCL

SDA

CC

t

icr

t

sts

t

PHL

t

icf

t

buf

t

sp

PLH

0.7 × V

0.3 × V

CC

t

icf

t

icr

t

sdh

t

sps

t

sth

t

sds

Repeat

Start

Condition

Stop

Condition

Start or

Repeat

Start

Condition

VOLTAGE WAVEFORMS

BYTE

DESCRIPTION

2

1

I C address

2, 3

P-port data

A. C_Lincludes probe and jig capacitance.

B. All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z_O= 50 Ω, t_r/t_f≤ 30 ns.

C. All parameters and waveforms are not applicable to all devices.

Figure 11. I²C Interface Load Circuit and Voltage Waveforms

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PARAMETER MEASUREMENT INFORMATION (continued)

V

CC

R

L

= 4.7 kΩ

INT

DUT

C

L

= 100 pF

INTERRUPT LOAD CONFIGURATION

ACK

From Slave

ACK

From Slave

Start

Condition

16 Bits

(Two Data Bytes)

R/W

From Port

Slave Address (PCA9555)

Data From Port

Data 3

A2 A1 A0

S

0

1

0

1

A

Data 1

Data 2

A

1

P

1

2

3

4

5

6

7

8

A

t

ir

B

t

ir

INT

A

t

iv

t

sps

A

Data

Into

Port

Address

Data 1

Data 2

Data 3

0.7 × V

0.3 × V

CC

0.7 × V

0.3 × V

CC

SCL

INT

R/W

A

CC

t

iv

t

ir

0.7 × V

CC

Pn

0.3 × V

CC

View A−A

A. C_Lincludes probe and jig capacitance.

View B−B

B. All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z_O= 50 Ω, t_r/t_f≤ 30 ns.

C. All parameters and waveforms are not applicable to all devices.

Figure 12. Interrupt Load Circuit and Voltage Waveforms

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PARAMETER MEASUREMENT INFORMATION (continued)

Pn

DUT

C

L

= 100 pF

GND

P-PORT LOAD CONFIGURATION

0.7 × V

0.3 × V

CC

SCL

P00

A

P17

CC

Slave

ACK

SDA

Pn

t

pv

(see Note A)

Last Stable Bit

Unstable

Data

WRITE MODE (R/W = 0)

0.7 × V

0.3 × V

CC

SCL

Pn

P00

A

P17

CC

t

ps

t

ph

0.7 × V

0.3 × V

CC

READ MODE (R/W = 1)

A. C_Lincludes probe and jig capacitance.

B. t_pvis measured from 0.7 × V_CCon SCL to 50% I/O (Pn) output.

C. All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z_O= 50 Ω, t_r/t_f≤ 30 ns.

D. The outputs are measured one at a time, with one transition per measurement.

E. All parameters and waveforms are not applicable to all devices.

Figure 13. P-Port Load Circuit and Voltage Waveforms

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PARAMETER MEASUREMENT INFORMATION (continued)

V

CC

R

L

= 1 kΩ

Pn

SDA

DUT

C

L

= 50 pF

C = 100 pF

L

SDA LOAD CONFIGURATION

Start

P-PORT LOAD CONFIGURATION

SCL

ACK or Read Cycle

SDA

0.3 y V

CC

t

REC

RESET

V

/2

CC

t

REC

t

w

Pn

V

/2

t

RESET

A. C_Lincludes probe and jig capacitance.

B. All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z_O= 50 Ω, t_r/t_f≤ 30 ns.

C. The outputs are measured one at a time, with one transition per measurement.

D. I/Os are configured as inputs.

E. All parameters and waveforms are not applicable to all devices.

Figure 14. Reset Load Circuits and Voltage Waveforms

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APPLICATION INFORMATION

Figure 15 shows an application in which the TCA9555 can be used.

Subsystem 1

(e.g.,Temperature

Sensor)

INT

V

CC

(5 V)

Subsystem 2

(e.g., Counter)

24 Ω

2 kΩ

V

CC

10 kΩ 10 kΩ

V

CC

RESET

A

22

23

4

P00

SCL

SDA

INT

SCL

5

Master

P01

P02

P03

Controller

SDA

INT

6

7

1

GND

ENABLE

8

9

P04

P05

B

TCA9555

V

CC

10

Controlled Switch

(e.g., CBT Device)

P06

11

13

14

15

16

17

18

19

20

P07

P10

P11

P12

P13

P14

P15

P16

P17

3

A2

2

ALARM

A1

A0

Keypad

Subsystem 3

(e.g., Alarm)

21

GND

12

A. Device address is configured as 0100100 for this example.

B. P00, P02, and P03 are configured as outputs.

C. P01, P04–P07, and P10–P17 are configured as inputs.

D. Pin numbers shown are for the PW package.

Figure 15. Typical Application

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Minimizing I_CCWhen I/O Is Used to Control LED

When an I/O is used to control an LED, normally it is connected to V_CCthrough a resistor as shown in Figure 15.

Because the LED acts as a diode, when the LED is off, the I/O V_INis about 1.2 V less than V_CC. The ΔI_CC

parameter in Electrical Characteristics shows how I_CCincreases as V_INbecomes lower than V_CC. For

battery-powered applications, it is essential that the voltage of I/O pins is greater than or equal to V_CCwhen the

LED is off to minimize current consumption.

Figure 16 shows a high-value resistor in parallel with the LED. Figure 17 shows V_CCless than the LED supply

voltage by at least 1.2 V. Both of these methods maintain the I/O V_INat or above V_CCand prevent additional

supply current consumption when the LED is off.

V

CC

LED

100 kW

V

CC

Pn

Figure 16. High-Value Resistor in Parallel With LED

3.3 V

5 V

V

CC

LED

Pn

Figure 17. Device Supplied by Lower Voltage

Power-On Reset Requirements

In the event of a glitch or data corruption, TCA9555 can be reset to its default conditions by using the power-on

reset feature. Power-on reset requires that the device go through a power cycle to be completely reset. This

reset also happens when the device is powered on for the first time in an application.

The two types of power-on reset are shown in Figure 18 and Figure 19.

V

CC

Ramp-Up

Ramp-Down

Re-Ramp-Up

V

CC_TRR_GND

Time

Time to Re-Ramp

V

CC_RT

CC_FT

CC_RT

Figure 18. V_CCis Lowered Below 0.2 V or 0 V and Then Ramped Up to V_CC

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V

CC

Ramp-Down

Ramp-Up

V

CC_TRR_VPOR50

V

drops below POR levels

IN

Time

Time to Re-Ramp

V

CC_FT

CC_RT

Figure 19. V_CCis Lowered Below the POR Threshold, Then Ramped Back Up to V_CC

Table 1 specifies the performance of the power-on reset feature for TCA9555 for both types of power-on reset.

Table 1. RECOMMENDED SUPPLY SEQUENCING AND RAMP RATES⁽¹⁾

PARAMETER

MIN TYP

MAX UNIT

V_{CC_FT}

Fall rate

See Figure 18

See Figure 19

0.1

1

2000

ms

µs

V_{CC_RT}

Rise rate

V_{CC_TRR_GND}

V_{CC_TRR_POR50}

Time to re-ramp (when V_CCdrops to GND)

Time to re-ramp (when V_CCdrops to V_{POR_MIN}– 50 mV)

1

µs

Level that V_CCPcan glitch down to, but not cause a functional

disruption when V_{CCX_GW}= 1 µs

V_{CC_GH}

V_{CC_GW}

See Figure 20

1.2

10

V

Glitch width that will not cause a functional disruption when

V_{CCX_GH}= 0.5 × V_CCx

µs

V_PORF

V_PORR

Voltage trip point of POR on falling V_CC

Voltage trip point of POR on rising V_CC

0.7

V

1.4

(1) T_A= –40°C to 85°C (unless otherwise noted)

Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width

(V_{CC_GW}) and height (V_{CC_GH}) are dependent on each other. The bypass capacitance, source impedance, and

device impedance are factors that affect power-on reset performance. Figure 20 and Table 1 provide more

information on how to measure these specifications.

V

CC

V

CC_GH

Time

V

CC_GW

Figure 20. Glitch Width and Glitch Height

V_PORis critical to the power-on reset. V_PORis the voltage level at which the reset condition is released and all the

registers and the I²C/SMBus state machine are initialized to their default states. The value of V_PORdiffers based

on the V_CCbeing lowered to or from 0. Figure 21 and Table 1 provide more details on this specification.

24

Submit Documentation Feedback

Product Folder Link(s): TCA9555

TCA9555

www.ti.com .............................................................................................................................................................. SCPS200A–JULY 2009–REVISED JULY 2009

V

CC

V

POR

V

PORF

Time

POR

Time

Figure 21. V_POR

Submit Documentation Feedback

25

Product Folder Link(s): TCA9555

PACKAGE OPTION ADDENDUM

www.ti.com

17-Jul-2009

PACKAGING INFORMATION

Orderable Device

TCA9555PWR

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

TSSOP

PW

24

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TCA9555RTWR

QFN

RTW

24

3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

2-Jul-2009

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0 (mm)

B0 (mm)

K0 (mm)

P1

W

Pin1

Diameter Width

(mm) W1 (mm)

(mm) (mm) Quadrant

TCA9555PWR

TSSOP

QFN

PW

24

2000

3000

330.0

16.4

12.4

6.95

4.3

8.3

4.3

1.6

1.5

8.0

16.0

12.0

Q1

Q2

TCA9555RTWR

RTW

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

2-Jul-2009

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TCA9555PWR

TSSOP

QFN

PW

24

2000

3000

346.0

33.0

29.0

TCA9555RTWR

RTW

Pack Materials-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

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Applications

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Data Converters

DLP® Products

DSP

Clocks and Timers

Interface

www.ti.com/automotive

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www.ti.com/opticalnetwork

www.ti.com/security

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www.ti.com/video

dsp.ti.com

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interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

Logic

Power Mgmt

Microcontrollers

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Telephony

Video & Imaging

Wireless

RF/IF and ZigBee® Solutions www.ti.com/lprf

www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265


型号：	TCA9555RGER
厂家：	TEXAS INSTRUMENTS
描述：	具有中断、弱上拉和配置寄存器的 16 位 1.65V 至 5.5V I2C/SMBus I/O 扩展器 \| RGE \| 24 \| -40 to 85 控制器微控制器微控制器和处理器并行IO端口
文件：	总32页 (文件大小：717K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TCA9555RGER [TI]

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