TCAN1043A-Q1 [TI]
TCAN1043A-Q1 Low-Power Fault Protected CAN FD Transceiver with INH and WAKE;型号: | TCAN1043A-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | TCAN1043A-Q1 Low-Power Fault Protected CAN FD Transceiver with INH and WAKE |
文件: | 总11页 (文件大小:1369K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TCAN1043A-Q1
SLLSFD1 – JANUARY 2021
TCAN1043A-Q1 Low-Power Fault Protected CAN FD Transceiver with INH and WAKE
1 Features
3 Description
•
•
AEC Q100 qualified for automotive applications
Meets the requirements of ISO 11898-2:2016
physical layer standard
VSUP operating range: 4.5 V to 28 V
VIO level shifting support for 1.8 V, 2.5 V, 3.3 V and
5 V MCUs
The TCAN1043A-Q1 (TCAN1043A) is a high speed
Controller Area Network (CAN) transceiver that meets
the physical layer requirements of the ISO
11898-2:2016 high speed CAN specification. The
device supports both classical CAN and CAN FD data
rates up to 8 megabits per second (Mbps).
•
•
•
Operating modes:
– Normal mode
– Silent mode
– Low-power standby mode
The TCAN1043A-Q1 allows for system-level
reductions in battery current consumption by
selectively enabling the various power supplies that
may be present on a node via the INH output pin. This
allows an ultra low-current sleep state in which power
is gated to all system components except for the
device, which remains in a low-power state while
monitoring the CAN bus. When a wake-up event is
detected, the device initiates node start-up by driving
INH output high.
– Low-power sleep mode
•
•
Predictable behavior when unpowered
– High-impedance CAN bus and logic terminals
(no load to operating bus or application)
– Power up/down glitch free operation on CAN
bus and RXD terminal
Protection features: ±58 V bus fault tolerant, 42 V
load dump support, IEC ESD protection, thermal
shutdown protection, TXD dominant state timeout,
undervoltage protection on the supply terminals
Expanded bus fault detection capabilities
Available in SOT (14) package, SOIC (14)
package, and leadless VSON (14) package with
Improved Automated Optical Inspection (AOI)
Capability
The TCAN1043A-Q1 includes internal logic level
translation via the VIO terminal to allow for interfacing
directly to 1.8 V, 2.5 V, 3.3 V, or 5 V controllers. The
transceiver includes many protection and diagnostic
features including undervoltage detection, thermal
shutdown (TSD), driver dominant timeout (TXD DTO),
and ±58 V bus fault protection.
•
•
Device Information
PART NUMBER
PACKAGE(1)
BODY SIZE (NOM)
4.20 mm x 2.00 mm
9.90 mm x 3.91 mm
4.50 mm x 3.00 mm
SOT (DYY)
2 Applications
TCAN1043A-Q1
SOIC (D)
•
•
•
•
•
•
•
Body electronics and lighting
Automotive gateway
Advanced driver assistance systems (ADAS)
Infotainment and cluster
Hybrid, electric & powertrain systems
Personal transport vehicles - Electric bike
Industrial transportation
VSON (DMT)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
3
kΩ
EN
VIN
22 nF
VBAT
33 kΩ
100 nF
100 kΩ
VREG
VSUP
10
5 V VOUT
INH
WAKE
7
9
VCC
3
VIO
100 nF
VIO
CANH
5
13
100 nF
VDD
TCAN1043A
EN
nSTB
nFAULT
GPIO
GPIO
GPIO
6
14
8
MCU
CANL
12
1
4
CAN FD
Controller
TXD
Optional:
Terminating
Node
RXD
Optional:
Filtering,
Transient and
ESD
2
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change
without notice.
TCAN1043A-Q1
SLLSFD1 – JANUARY 2021
www.ti.com
4 Pin Configuration and Functions
TXD
GND
VCC
1
2
3
4
5
6
7
14
13
12
11
10
9
nSTB
CANH
CANL
NC
TXD
1
2
3
4
5
6
7
14
13
12
11
10
9
nSTB
GND
CANH
CANL
NC
VCC
RXD
VIO
RXD
VIO
Thermal
Pad
VSUP
VSUP
EN
WAKE
nFAULT
EN
WAKE
nFAULT
INH
8
INH
8
Not to scale
Not to scale
Figure 4-1. D and DYY Packages, 14 Pin (SOIC) and
(SOT), Top View
Figure 4-2. DMT Package, 14 Pin (VSON), Top View
PINS
TYPE
DESCRIPTION
NAME
TXD
GND
VCC
NO.
1
Digital Input
GND
CAN transmit data input, integrated pull-up
2
Ground connection
3
Supply
5 V transceiver supply
RXD
VIO
4
Digital Output
Supply
CAN receive data output, tri-state when VIO < UVIO
I/O supply voltage
5
EN
6
Digital Input
Enable input for mode control, integrated pull-down
High Voltage
Output
INH
7
Inhibit pin to control system voltage regulators and supplies, high-voltage
Fault output, inverted logic
nFAULT
WAKE
VSUP
8
Digital Output
9
High Voltage Input Local WAKE input terminal, high voltage
10
11
12
13
14
Supply
—
High-voltage supply from battery
NC
No connect, not internally connected
CANL
Bus IO
Bus IO
Digital
Low-level CAN bus input/output line
CANH
nSTB
High-level CAN bus input/output line
Standby mode control input, integrated pull-down
Connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief
Thermal Pad
—
Copyright © 2021 Texas Instruments Incorporated
2
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Product Folder Links: TCAN1043A-Q1
TCAN1043A-Q1
SLLSFD1 – JANUARY 2021
www.ti.com
5 Device and Documentation Support
5.1 Documentation Support
5.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
5.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TCAN1043A-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
DMT
D
Qty
(1)
(2)
(3)
(4/5)
(6)
PTCAN1043ADMTRQ1
PTCAN1043ADRQ1
PTCAN1043ADYYRQ1
TCAN1043ADMTRQ1
TCAN1043ADRQ1
ACTIVE
VSON
SOIC
14
14
14
14
14
14
3000
2500
3000
3000
2500
3000
Non-RoHS &
Non-Green
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
-40 to 150
ACTIVE
Non-RoHS &
Non-Green
Call TI
Call TI
Call TI
Call TI
Call TI
ACTIVE SOT-23-THN
DYY
DMT
D
Non-RoHS &
Non-Green
PREVIEW
PREVIEW
VSON
SOIC
Non-RoHS &
Non-Green
Non-RoHS &
Non-Green
TCAN1043ADYYRQ1
PREVIEW SOT-23-THN
DYY
Non-RoHS &
Non-Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2021
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
GENERIC PACKAGE VIEW
DMT 14
3 x 4.5, 0.65 mm pitch
VSON - 0.9 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225088/A
www.ti.com
PACKAGE OUTLINE
SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE
DYY0014A
C
3.36
3.16
SEATING PLANE
PIN 1 INDEX
AREA
A
0.1 C
12X 0.5
14
1
4.3
4.1
NOTE 3
2X
3
7
8
0.31
0.11
14X
0.1
C A
B
1.1 MAX
2.1
1.9
B
0.2
0.08
TYP
SEE DETAIL A
0.25
GAUGE PLANE
0°- 8°
0.1
0.0
0.63
0.33
DETAIL A
TYP
4224643/A 11/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed
0.15 per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.50 per side.
www.ti.com
EXAMPLE BOARD LAYOUT
SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE
DYY0014A
SYMM
14X (1.05)
1
14
14X (0.3)
SYMM
12X (0.5)
8
7
(R0.05) TYP
(3)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON- SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4224643/A 11/2018
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
SOT-23-THIN - 1.1 mm max height
PLASTIC SMALL OUTLINE
DYY0014A
SYMM
14X (1.05)
1
14
14X (0.3)
SYMM
12X (0.5)
8
7
(R0.05) TYP
(3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 20X
4224643/A 11/2018
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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