TCAN1043ATDRQ1 [TI]

具有唤醒/抑制/睡眠功能的汽车类 CAN FD 收发器 | D | 14 | -40 to 150;


型号：	TCAN1043ATDRQ1
厂家：	TEXAS INSTRUMENTS
描述：	具有唤醒/抑制/睡眠功能的汽车类 CAN FD 收发器 \| D \| 14 \| -40 to 150
文件：	总11页 (文件大小：1369K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TCAN1043A-Q1

www.ti.com

SLLSFD1 – JANUARY 2021

TCAN1043A-Q1 Low-Power Fault Protected CAN FD Transceiver with INH and WAKE

1 Features

3 Description

•

AEC Q100 qualified for automotive applications

Meets the requirements of ISO 11898-2:2016

physical layer standard

V_SUPoperating range: 4.5 V to 28 V

V_IOlevel shifting support for 1.8 V, 2.5 V, 3.3 V and

5 V MCUs

The TCAN1043A-Q1 (TCAN1043A) is a high speed

Controller Area Network (CAN) transceiver that meets

the physical layer requirements of the ISO

11898-2:2016 high speed CAN specification. The

device supports both classical CAN and CAN FD data

rates up to 8 megabits per second (Mbps).

•

Operating modes:

– Normal mode

– Silent mode

– Low-power standby mode

The TCAN1043A-Q1 allows for system-level

reductions in battery current consumption by

selectively enabling the various power supplies that

may be present on a node via the INH output pin. This

allows an ultra low-current sleep state in which power

is gated to all system components except for the

device, which remains in a low-power state while

monitoring the CAN bus. When a wake-up event is

detected, the device initiates node start-up by driving

INH output high.

– Low-power sleep mode

•

Predictable behavior when unpowered

– High-impedance CAN bus and logic terminals

(no load to operating bus or application)

– Power up/down glitch free operation on CAN

bus and RXD terminal

Protection features: ±58 V bus fault tolerant, 42 V

load dump support, IEC ESD protection, thermal

shutdown protection, TXD dominant state timeout,

undervoltage protection on the supply terminals

Expanded bus fault detection capabilities

Available in SOT (14) package, SOIC (14)

package, and leadless VSON (14) package with

Improved Automated Optical Inspection (AOI)

Capability

The TCAN1043A-Q1 includes internal logic level

translation via the V_IOterminal to allow for interfacing

directly to 1.8 V, 2.5 V, 3.3 V, or 5 V controllers. The

transceiver includes many protection and diagnostic

features including undervoltage detection, thermal

shutdown (TSD), driver dominant timeout (TXD DTO),

and ±58 V bus fault protection.

•

Device Information

PART NUMBER

PACKAGE⁽¹⁾

BODY SIZE (NOM)

4.20 mm x 2.00 mm

9.90 mm x 3.91 mm

4.50 mm x 3.00 mm

SOT (DYY)

2 Applications

TCAN1043A-Q1

SOIC (D)

•

Body electronics and lighting

Automotive gateway

Advanced driver assistance systems (ADAS)

Infotainment and cluster

Hybrid, electric & powertrain systems

Personal transport vehicles - Electric bike

Industrial transportation

VSON (DMT)

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

kΩ

V_IN

22 nF

V_BAT

33 kΩ

100 nF

100 kΩ

V_REG

V_SUP

5 V V_OUT

INH

WAKE

V_CC

V_IO

100 nF

V_IO

CANH

100 nF

V_DD

TCAN1043A

nSTB

nFAULT

GPIO

MCU

CANL

CAN FD

Controller

TXD

Optional:

Terminating

Node

RXD

Optional:

Filtering,

Transient and

ESD

Simplified Schematic

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

Submit Document Feedback

intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change

Product Folder Links: TCAN1043A-Q1

without notice.

TCAN1043A-Q1

SLLSFD1 – JANUARY 2021

www.ti.com

4 Pin Configuration and Functions

TXD

GND

V_CC

nSTB

CANH

CANL

TXD

nSTB

GND

CANH

CANL

V_CC

RXD

V_IO

RXD

V_IO

Thermal

Pad

V_SUP

WAKE

nFAULT

WAKE

nFAULT

INH

Not to scale

Figure 4-1. D and DYY Packages, 14 Pin (SOIC) and

(SOT), Top View

Figure 4-2. DMT Package, 14 Pin (VSON), Top View

PINS

TYPE

DESCRIPTION

NAME

TXD

GND

V_CC

NO.

Digital Input

GND

CAN transmit data input, integrated pull-up

Ground connection

Supply

5 V transceiver supply

RXD

V_IO

Digital Output

Supply

CAN receive data output, tri-state when V_IO< UV_IO

I/O supply voltage

Digital Input

Enable input for mode control, integrated pull-down

High Voltage

Output

INH

Inhibit pin to control system voltage regulators and supplies, high-voltage

Fault output, inverted logic

nFAULT

WAKE

V_SUP

Digital Output

High Voltage Input Local WAKE input terminal, high voltage

Supply

—

High-voltage supply from battery

No connect, not internally connected

CANL

Bus IO

Digital

Low-level CAN bus input/output line

CANH

nSTB

High-level CAN bus input/output line

Standby mode control input, integrated pull-down

Connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief

Thermal Pad

—

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Product Folder Links: TCAN1043A-Q1

TCAN1043A-Q1

SLLSFD1 – JANUARY 2021

www.ti.com

5 Device and Documentation Support

5.1 Documentation Support

5.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

5.3 Support Resources

TI E2E^™support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

5.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

5.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

5.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: TCAN1043A-Q1

PACKAGE OPTION ADDENDUM

www.ti.com

9-Mar-2021

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

DMT

Qty

(1)

(2)

(3)

(4/5)

(6)

PTCAN1043ADMTRQ1

PTCAN1043ADRQ1

PTCAN1043ADYYRQ1

TCAN1043ADMTRQ1

TCAN1043ADRQ1

ACTIVE

VSON

SOIC

3000

2500

3000

2500

3000

Non-RoHS &

Non-Green

Call TI

-40 to 150

ACTIVE

Non-RoHS &

Non-Green

Call TI

ACTIVE SOT-23-THN

DYY

DMT

Non-RoHS &

Non-Green

PREVIEW

VSON

SOIC

Non-RoHS &

Non-Green

Non-RoHS &

Non-Green

TCAN1043ADYYRQ1

PREVIEW SOT-23-THN

DYY

Non-RoHS &

Non-Green

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

9-Mar-2021

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

GENERIC PACKAGE VIEW

DMT 14

3 x 4.5, 0.65 mm pitch

VSON - 0.9 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4225088/A

www.ti.com

PACKAGE OUTLINE

SOT-23-THIN - 1.1 mm max height

PLASTIC SMALL OUTLINE

DYY0014A

3.36

3.16

SEATING PLANE

PIN 1 INDEX

AREA

0.1 C

12X 0.5

4.3

4.1

NOTE 3

0.31

0.11

14X

0.1

C A

1.1 MAX

2.1

1.9

0.2

0.08

TYP

SEE DETAIL A

0.25

GAUGE PLANE

0°- 8°

0.1

0.0

0.63

0.33

DETAIL A

TYP

4224643/A 11/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed

0.15 per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.50 per side.

www.ti.com

EXAMPLE BOARD LAYOUT

SOT-23-THIN - 1.1 mm max height

PLASTIC SMALL OUTLINE

DYY0014A

SYMM

14X (1.05)

14X (0.3)

SYMM

12X (0.5)

(R0.05) TYP

(3)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

METAL

SOLDER MASK

OPENING

NON- SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4224643/A 11/2018

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

EXAMPLE STENCIL DESIGN

SOT-23-THIN - 1.1 mm max height

PLASTIC SMALL OUTLINE

DYY0014A

SYMM

14X (1.05)

14X (0.3)

SYMM

12X (0.5)

(R0.05) TYP

(3)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 20X

4224643/A 11/2018

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

www.ti.com

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applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE

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TCAN1043ATDRQ1 [TI]

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