THS5651AIPWG4 [TI]
10-Bit, 125-MSPS Digital-to-Analog Converter (DAC) 28-TSSOP -40 to 85;![THS5651AIPWG4](http://pdffile.icpdf.com/pdf2/p00243/img/icpdf/THS5651AIPWR_1472307_icpdf.jpg)
型号: | THS5651AIPWG4 |
厂家: | ![]() |
描述: | 10-Bit, 125-MSPS Digital-to-Analog Converter (DAC) 28-TSSOP -40 to 85 光电二极管 转换器 |
文件: | 总33页 (文件大小:953K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
SOIC (DW) OR TSSOP (PW) PACKAGE
(TOP VIEW)
D
Member of the Pin-Compatible
CommsDAC Product Family
D
D
D
125 MSPS Update Rate
10-Bit Resolution
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
NC
NC
NC
NC
CLK
DV
DGND
2
DD
3
Superior Spurious Free Dynamic Range
Performance (SFDR) to Nyquist at 40 MHz
Output: 62 dBc
4
MODE
5
AV
DD
6
COMP2
IOUT1
IOUT2
AGND
COMP1
BIASJ
EXTIO
EXTLO
SLEEP
D
D
1 ns Setup/Hold Time
7
8
Differential Scalable Current Outputs: 2 mA
to 20 mA
9
10
11
12
13
14
D
On-Chip 1.2-V Reference
D
3 V and 5 V CMOS-Compatible Digital
Interface
D
D
Straight Binary or Twos Complement Input
Power Dissipation: 175 mW at 5 V, Sleep
Mode: 25 mW at 5 V
NC − No internal connection
D
Package: 28-Pin SOIC and TSSOP
description
The THS5651A is a 10-bit resolution digital-to-analog converter (DAC) specifically optimized for digital data
transmission in wired and wireless communication systems. The 10-bit DAC is a member of the CommsDAC
series of high-speed, low-power CMOS digital-to-analog converters. The CommsDAC family consists of pin
compatible 14-, 12-, 10-, and 8-bit DACs. All devices offer identical interface options, small outline package and
pinout. The THS5651A offers superior ac and dc performance while supporting update rates up to 125 MSPS.
The THS5651A operates from an analog supply of 4.5 V to 5.5 V. Its inherent low power dissipation of 175 mW
ensures that the device is well suited for portable and low-power applications. Lowering the full-scale current
output reduces the power dissipation without significantly degrading performance. The device features a
SLEEP mode, which reduces the standby power to approximately 25 mW, thereby optimizing the power
consumption for system needs.
The THS5651A is manufactured in Texas Instruments advanced high-speed mixed-signal CMOS process. A
current-source-array architecture combined with simultaneous switching shows excellent dynamic
performance. On-chip edge-triggered input latches and a 1.2 V temperature compensated bandgap reference
provide a complete monolithic DAC solution. The digital supply range of 3 V to 5.5 V supports 3 V and 5 V CMOS
logic families. Minimum data input setup and hold times allow for easy interfacing with external logic. The
THS5651A supports both a straight binary and twos complement input word format, enabling flexible interfacing
with digital signal processors.
The THS5651A provides a nominal full-scale differential output current of 20 mA and >300 kΩ output
impedance, supporting both single-ended and differential applications. The output current can be directly fed
to the load (e.g., external resistor load or transformer), with no additional external output buffer required. An
accurate on-chip reference and control amplifier allows the user to adjust this output current from 20 mA down
to 2 mA, with no significant degradation of performance. This reduces power consumption and provides 20 dB
gain range control capabilities. Alternatively, an external reference voltage and control amplifier may be applied
in applications using a multiplying DAC. The output voltage compliance range is 1.25 V.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
CommsDAC is a trademark of Texas Instruments Incorporated.
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Copyright 2002, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
description (continued)
The THS5651A is available in both a 28-pin SOIC and TSSOP package. The device is characterized for
operation over the industrial temperature range of −40°C to 85°C.
AVAILABLE OPTIONS
PACKAGE
T
A
28-TSSOP
(PW)
28-SOIC
(DW)
−40°C to 85°C
THS5651AIPW
THS5651AIDW
functional block diagram
AV
DD
C
1
SLEEP
COMP1
0.1 µF
0.1 µF
COMP2
EXTLO
EXTIO
1.2 V
REF
IOUT1
1 nF
−
+
R
R
Output
Current
Switches
50 Ω
LOAD
LOAD
Current
Source
Array
C
EXT
BIASJ
Control
AMP
0.1 µF
I
IOUT2
BIAS
R
BIAS
2 kΩ
DV
DD
50 Ω
Logic
D[9:0]
Control
MODE
CLK
DGND
AGND
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
AGND
AV
NO.
20
I
I
Analog ground return for the internal analog circuitry
Positive analog supply voltage (4.5 V to 5.5 V)
Full-scale output current bias
24
DD
BIASJ
CLK
18
O
I
28
External clock input. Input data latched on rising edge of the clock.
Compensation and decoupling node, requires a 0.1 µF capacitor to AV
Internal bias node, requires a 0.1 µF decoupling capacitor to AGND.
Data bits 0 through 9.
COMP1
COMP2
D[9:0]
19
I
.
DD
23
I
[1:10]
I
D9 is most significant data bit (MSB), D0 is least significant data bit (LSB).
Digital ground return for the internal digital logic circuitry
Positive digital supply voltage (3 V to 5.5 V)
DGND
26
27
17
I
I
DV
DD
EXTIO
I/O Used as external reference input when internal reference is disabled (i.e., EXTLO = AV ). Used as internal
DD
reference output when EXTLO = AGND, requires a 0.1 µF decoupling capacitor to AGND when used as reference
output
EXTLO
IOUT1
IOUT2
MODE
16
22
21
25
O
O
O
I
Internal reference ground. Connect to AV to disable the internal reference source
DD
DAC current output. Full scale when all input bits are set 1
Complementary DAC current output. Full scale when all input bits are 0
Mode select. Internal pulldown. Mode 0 is selected if this pin is left floating or connected to DGND. See
timing diagram.
NC
[11:14]
15
N
I
No connection
SLEEP
Asynchronous hardware power down input. Active High. Internal pulldown. Requires 5 µs to power down but 3 ms
to power up.
†
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, AV
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6.5 V
(see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6.5 V
DD
DD
DV
Voltage between AGND and DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 0.5 V
Supply voltage range, AV to DV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −6.5 V to 6.5 V
DD
DD
CLK, SLEEP, MODE (see Note 2) . . . . . . . . . . . . . . . . . . . . . . −0.3 V to DV
Digital input D9−D0 (see Note 2) . . . . . . . . . . . . . . . . . . . . . . −0.3 V to DV
IOUT1, IOUT2 (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1 V to AV
COMP1, COMP2 (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to AV
EXTIO, BIASJ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to AV
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
DD
DD
DD
DD
DD
EXTLO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 0.3 V
Peak input current (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak total input current (all inputs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 mA
Operating free-air temperature range, T : THS5651AI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
A
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Measured with respect to AGND.
2. Measured with respect to DGND.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
electrical characteristics over recommended operating free-air temperature range, AV
= 5 V,
DD
DV
= 5 V, IOUT = 20 mA (unless otherwise noted)
DD
FS
dc specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Resolution
10
Bits
†
DC accuracy
INL
Integral nonlinearity
−1
0.5
0.25
1
LSB
LSB
T
A
= −40°C to 85°C
DNL
Differential nonlinearity
−0.5
0.5
Monotonicity
Analog output
Monotonic
Offset error
0.02
2.3
%FSR
%FSR
Without internal reference
With internal reference
Gain error
1.3
‡
Full scale output current
2
20
mA
V
Output compliance range
Output resistance
AV
DD
= 5 V, IOUT
FS
= 20 mA
−1
1.25
300
5
kΩ
pF
Output capacitance
Reference output
Reference voltage
1.18
0.1
1.22
100
1.32
1.25
V
§
Reference output current
nA
Reference input
V
Input voltage range
Input resistance
V
EXTIO
1
1.3
MΩ
MHz
pF
¶
Small signal bandwidth
Input capacitance
Without C
COMP1
100
Temperature coefficients
Offset drift
0
40
Without internal reference
With internal reference
ppm of
FSR/°C
Gain drift
120
35
Reference voltage drift
Power supply
AV
Analog supply voltage
Digital supply voltage
Analog supply current
4.5
3
5
5.5
5.5
30
5
V
DD
DV
V
DD
25
3
mA
mA
mA
I
I
AVDD
Sleep mode supply current
Sleep mode
#
Digital supply current
5
6
DVDD
||
Power dissipation
AV
DD
= 5 V, DV
DD
= 5 V, IOUT
FS
= 20 mA
175
0.4
mW
AV
DD
Power supply rejection ratio
Operating range
%FSR/V
DV
0.025
DD
−40
85
°C
†
‡
§
¶
#
||
Measured at IOUT1 in virtual ground configuration.
Nominal full-scale current IOUT equals 32X the IBIAS current.
Use an external buffer amplifier with high impedance input to drive any external load.
Reference bandwidth is a function of external cap at COMP1 pin and signal level.
FS
Measured at f
Measured for 50 Ω R
= 50 MSPS and f = 1 MHz.
CLK
OUT
at IOUT1 and IOUT2, f
CLK
= 50 MSPS and f = 20 MHz.
OUT
LOAD
Specifications subject to change
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
electrical characteristics over recommended operating free-air temperature range, AV
= 5 V,
DD
DV
= 5 V, IOUT = 20 mA, differential transformer coupled output, 50 Ω doubly terminated load
DD
FS
(unless otherwise noted)
ac specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Analog output
DV
DV
= 4.5 V to 5.5 V
100
70
125
100
35
1
DD
DD
f
Maximum output update rate
MSPS
CLK
= 3 V to 3.6 V
†
t
t
Output settling time to 0.1%
ns
ns
s(DAC)
Output propagation delay
pd
‡
GE
Glitch energy
Worst case LSB transition (code 511 − code 512)
5
pV−s
ns
†
t
t
Output rise time 10% to 90%
1
r(IOUT)
†
Output fall time 90% to 10%
1
ns
f(IOUT)
IOUT
IOUT
= 20 mA
= 2 mA
15
10
FS
Output noise
pA/√HZ
FS
§
AC linearity
f
f
f
f
f
f
f
f
f
f
f
f
f
f
f
f
= 25 MSPS, f
= 50 MSPS, f
= 50 MSPS, f
= 1 MHz, T = 25°C
−72
−72
−70
−70
79
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
OUT
OUT
OUT
A
= 1 MHz, T = −40°C to 85°C
−64
A
THD
Total harmonic distortion
dBc
= 2 MHz, T = 25°C
A
= 100 MSPS, f
OUT
= 2 MHz, T = 25°C
A
= 25 MSPS, f
= 50 MSPS, f
= 50 MSPS, f
= 50 MSPS, f
= 50 MSPS, f
= 50 MSPS, f
= 1 MHz, T = 25°C
A
OUT
OUT
OUT
OUT
OUT
OUT
= 1 MHz, T = −40°C to 85°C
66
A
= 1 MHz, T = 25°C
77
75
71
58
69
61
62
82
81
78
A
= 2.51 MHz, T = 25°C
A
Spurious free dynamic range to
Nyquist
= 5.02 MHz, T = 25°C
dBc
A
= 20.2 MHz, T = 25°C
A
SFDR
= 100 MSPS, f
= 100 MSPS, f
= 100 MSPS, f
= 5.04 MHz, T = 25°C
A
OUT
OUT
OUT
= 20.2 MHz, T = 25°C
A
= 40.4 MHz, T = 25°C
A
= 50 MSPS, f
= 50 MSPS, f
= 1 MHz, T = 25°C,1 MHz span
OUT
A
Spurious free dynamic range
within a window
= 5.02 MHz, 2 MHz span
dBc
OUT
= 100 MSPS, f
= 5.04 MHz, 4 MHz span
OUT
†
‡
§
Measured single ended into 50 Ω load at IOUT1.
Single-ended output IOUT1, 50 Ω doubly terminated load.
Measured with a 50%/50% duty cycle (high/low percentage of the clock). Optimum ac linearity is obtained when limiting the duty cycle to a range
from 45%/55% to 55%/45%.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
electrical characteristics over recommended operating free-air temperature range, AV
= 5 V,
DD
DV
= 5 V, IOUT = 20 mA (unless otherwise noted)
DD
FS
digital specifications
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Interface
DV
DV
DV
DV
DV
DV
DV
DV
= 5 V
3.5
2.1
5
3.3
0
DD
DD
DD
DD
DD
DD
DD
DD
V
V
High-level input voltage
V
V
IH
= 3.3 V
= 5 V
1.3
0.9
15
10
15
10
5
Low-level input voltage
High-level input current
IL
= 3.3 V
0
MODE and SLEEP
All other digital pins
MODE and SLEEP
All other digital pins
= 3 V to 5.5 V
= 3 V to 5.5 V
= 3 V to 5.5 V
= 3 V to 5.5 V
−15
−10
−15
−10
1
I
IH
µA
I
IL
Low-level input current
Input capacitance
µA
C
pF
I
Timing
t
t
t
t
Input setup time
1
1
4
ns
ns
ns
clk
su(D)
Input hold time
h(D)
Input latch pulse high time
Digital delay time
w(LPH)
d(D)
1
Specifications subject to change
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓꢊ ꢔꢊ ꢀꢆꢕ ꢈꢀꢖ ꢈꢆꢗꢆꢕ ꢖ ꢔ ꢏꢖ ꢗ ꢘꢙ ꢚꢀ ꢙꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
†
TYPICAL CHARACTERISTICS
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 0 dBFS
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 5 MSPS
90
84
78
72
66
60
54
48
90
84
78
72
66
60
DV
= 5 V
DD
DV
= 5 V
DD
0 dBFS
f
= 5 MSPS
CLK
f
= 50 MSPS
CLK
−6 dBFS
f
= 100 MSPS
CLK
f
= 70 MSPS
CLK
−12 dBFS
f
= 125 MSPS
CLK
f
= 25 MSPS
CLK
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
F
out
− Output Frequency − MHz
F
out
− Output Frequency − MHz
Figure 1
Figure 2
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 25 MSPS
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 50 MSPS
90
84
78
72
66
60
78
72
66
60
54
48
DV
= 5 V
DD
DV
= 5 V
−6 dBFS
DD
0 dBFS
−12 dBFS
−6 dBFS
0 dBFS
−12 dBFS
0
2
4
6
8
10
12
0
5
F
10
15
20
25
F
out
− Output Frequency − MHz
− Output Frequency − MHz
out
Figure 3
Figure 4
† AV
DD
= 5 V, IOUT
noted.)
= 20 mA, differential transformer coupled output, 50 Ω doubly terminated load, T = 25°C (unless otherwise
FS
A
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
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ꢃ
ꢄ
ꢃ
ꢅ
ꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓ ꢊꢔ ꢊꢀꢆ ꢕ ꢈꢀꢖꢈꢆ ꢗ ꢆꢕ ꢖꢔ ꢏꢖ ꢗꢘ ꢙ ꢚꢀꢙ ꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
†
TYPICAL CHARACTERISTICS
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 70 MSPS
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 100 MSPS
78
72
66
60
54
48
78
72
66
60
54
48
DV
= 5 V
DV
= 5 V
DD
DD
−6 dBFS
−12 dBFS
−6 dBFS
−12 dBFS
0 dBFS
0 dBFS
0
10
20
30
40
0
10
20
30
40
50
F
out
− Output Frequency − MHz
F
out
− Output Frequency − MHz
Figure 5
Figure 6
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 0 dBFS
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 125 MSPS
90
84
78
72
66
60
54
48
42
78
72
66
60
54
48
DV
= 3.3 V
DD
DV
= 5 V
DD
f
= 5 MSPS
CLK
f
= 50 MSPS
CLK
−6 dBFS
−12 dBFS
f
= 70 MSPS
CLK
0 dBFS
f
= 25 MSPS
CLK
f
= 100 MSPS
CLK
0
10
20
30
40
0
10
20
30
40
50
F
out
− Output Frequency − MHz
F
out
− Output Frequency − MHz
Figure 7
Figure 8
† AV
= 5 V, IOUT
= 20 mA, differential transformer coupled output, 50 Ω doubly terminated load, T = 25°C (unless otherwise
DD
FS
A
noted.)
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
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ꢃ
ꢄ
ꢃ
ꢅ
ꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓꢊ ꢔꢊ ꢀꢆꢕ ꢈꢀꢖ ꢈꢆꢗꢆꢕ ꢖ ꢔ ꢏꢖ ꢗ ꢘꢙ ꢚꢀ ꢙꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
†
TYPICAL CHARACTERISTICS
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 5 MSPS
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 25 MSPS
90
84
78
72
66
60
84
78
72
66
60
54
DV
= 3.3 V
DD
DV
= 3.3 V
DD
−6 dBFS
0 dBFS
−6 dBFS
−12 dBFS
−12 dBFS
0 dBFS
0.0
0.5
1.0
1.5
2.0
0
2
4
6
8
10
F
out
− Output Frequency − MHz
F
out
− Output Frequency − MHz
Figure 9
Figure 10
SPURIOUS FREE DYNAMIC RANGE
vs
SPURIOUS FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY AT 70 MSPS
OUTPUT FREQUENCY AT 50 MSPS
78
72
66
60
54
48
78
72
66
60
54
48
DV
= 3.3 V
DV
= 3.3 V
DD
DD
−6 dBFS
−12 dBFS
−6 dBFS
−12 dBFS
0 dBFS
0 dBFS
0
10
20
30
40
0
5
F
10
15
20
25
F
out
− Output Frequency − MHz
− Output Frequency − MHz
out
Figure 11
Figure 12
† AV
= 5 V, IOUT
= 20 mA, differential transformer coupled output, 50 Ω doubly terminated load, T = 25°C (unless otherwise
DD
FS
A
noted.)
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢅ ꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓ ꢊꢔ ꢊꢀꢆ ꢕ ꢈꢀꢖꢈꢆ ꢗ ꢆꢕ ꢖꢔ ꢏꢖ ꢗꢘ ꢙ ꢚꢀꢙ ꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
†
TYPICAL CHARACTERISTICS
SPURIOUS FREE DYNAMIC RANGE
vs
SPURIOUS FREE DYNAMIC RANGE
vs
A
AT F
= F
/11
OUT
OUT
CLOCK
A
AT F
= F
5
OUT
OUT
CLOCK/
84
78
72
66
60
54
48
84
78
72
66
60
54
48
DV
= 5 V
DD
DV
= 5 V
DD
5 MHz @ 25 MSPS
2.27 MHz @ 25 MSPS
14 MHz @ 70 MSPS
9.1 MHz @
100 MSPS
6.36 MHz @
70 MSPS
10 MHz @ 50 MSPS
4.55 MHz @
50 MSPS
20 MHz @ 100 MSPS
−27 −24 −21 −18 −15 −12 −9 −6 −3
0
−27 −24 −21 −18 −15 −12 −9 −6 −3
0
A
− dBFS
out
A
− dBFS
out
Figure 13
Figure 14
DUAL TONE SPURIOUS FREE DYNAMIC RANGE
vs
TOTAL HARMONIC DISTORTION
vs
A
AT F
= F
7
CLOCK FREQUENCY AT F
= 2 MHZ
OUT
OUT
CLOCK/
OUT
84
78
72
66
60
54
48
−66
DV
= 5 V
DD
DV
= 5 V
DD
0.675/0.725 MHz @ 5 MSPS
3.38/3.63 MHz @ 25 MSPS
6.75/7.25 MHz @ 50 MSPS
−72
4th Harmonic
3rd Harmonic
2nd Harmonic
−78
9.67/10.43 MHz @
−84
70 MSPS
13.5/14.5 MHz @ 100 MSPS
−90
−27 −24 −21 −18 −15 −12 −9 −6 −3
0
0
20
F
40
60
80
100
120
A
− dBFS
− Clock Frequency − MSPS
out
clock
Figure 15
Figure 16
† AV
DD
= 5 V, IOUT
noted.)
= 20 mA, differential transformer coupled output, 50 Ω doubly terminated load, T = 25°C (unless otherwise
FS
A
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢅꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓꢊ ꢔꢊ ꢀꢆꢕ ꢈꢀꢖ ꢈꢆꢗꢆꢕ ꢖ ꢔ ꢏꢖ ꢗ ꢘꢙ ꢚꢀ ꢙꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
†
TYPICAL CHARACTERISTICS
SPURIOUS FREE DYNAMIC RANGE
SPURIOUS FREE DYNAMIC RANGE
vs
vs
FULL-SCALE OUTPUT CURRENT AT 100 MSPS
OUTPUT FREQUENCY AT 100 MSPS
84
78
72
66
60
54
48
42
84
78
72
66
60
54
48
42
DV
= 5 V
DD
DV
= 5 V
DD
F
= 2.5 MHz
DIFF @ −6 dBFS
out
F
= 10 MHz
out
DIFF @ 0 dBFS
F
out
= 40 MHz
F
= 28.6 MHz
out
IOUT1 @ 0 dBFS
IOUT1 @ −6 dBFS
0
5
10 15 20 25 30 35 40 45 50
2
4
6
8
10 12 14 16 18 20
F
out
− Output Frequency − MHz
IOUT
− Full-Scale Output Current − mA
FS
Figure 17
Figure 18
SPURIOUS FREE DYNAMIC RANGE
vs
TEMPERATURE AT 70 MSPS
84
78
72
66
60
54
48
DV
= 5 V
DD
F
= 2 MHz
out
F
= 10 MHz
out
F
= 25 MHz
60
out
−40
−20
0
20
40
80
T
A
− Temperature − °C
Figure 19
† AV
= 5 V, IOUT
= 20 mA, differential transformer coupled output, 50 Ω doubly terminated load, T = 25°C (unless otherwise
DD
FS
A
noted.)
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢃ
ꢅ
ꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓ ꢊꢔ ꢊꢀꢆ ꢕ ꢈꢀꢖꢈꢆ ꢗ ꢆꢕ ꢖꢔ ꢏꢖ ꢗꢘ ꢙ ꢚꢀꢙ ꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
†
TYPICAL CHARACTERISTICS
INTEGRAL NONLINEARITY
0.1
−0.0
−0.1
−0.2
−0.3
0
128
256
384
512
640
768
896
1024
Code
Figure 20
DIFFERENTIAL NONLINEARITY
0.2
0.1
0.0
−0.1
−0.2
0
128
256
384
512
640
768
896
1024
Code
Figure 21
SINGLE-TONE OUTPUT SPECTRUM
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
F
F
DV
= 5 MHz at
out
= 50 MSPS,
= 5 V
clock
DD
0
5
10
15
20
25
f − Frequency − MHz
Figure 22
† AV
DD
= 5 V, IOUT
noted.)
= 20 mA, differential transformer coupled output, 50 Ω doubly terminated load, T = 25°C (unless otherwise
FS
A
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢅꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓꢊ ꢔꢊ ꢀꢆꢕ ꢈꢀꢖ ꢈꢆꢗꢆꢕ ꢖ ꢔ ꢏꢖ ꢗ ꢘꢙ ꢚꢀ ꢙꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
†
TYPICAL CHARACTERISTICS
SINGLE-TONE OUTPUT SPECTRUM
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
F
F
DV
= 10 MHz at
out
= 100 MSPS,
= 5 V
clock
DD
0
10
20
30
40
50
f − Frequency − MHz
Figure 23
DUAL-TONE OUTPUT SPECTRUM
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
F
F
F
= 100 MSPS
clock
out1
out2
= 13.2 MHz,
= 14.2 MHz,
= 5 V
DV
DD
0
10
20
30
40
50
f − Frequency − MHz
Figure 24
FOUR-TONE OUTPUT SPECTRUM
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
F
F
F
F
F
= 50 MSPS
clock
= 6.25 MHz,
= 6.75 MHz,
= 7.25 MHz,
= 7.75 MHz,
= 5 V
out1
out2
out3
out4
DV
DD
0
5
10
15
20
25
f − Frequency − MHz
Figure 25
† AV
DD
= 5 V, IOUT
= 20 mA, differential transformer coupled output, 50 Ω doubly terminated load, T = 25°C (unless otherwise noted.)
FS
A
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢅ ꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓ ꢊꢔ ꢊꢀꢆ ꢕ ꢈꢀꢖꢈꢆ ꢗ ꢆꢕ ꢖꢔ ꢏꢖ ꢗꢘ ꢙ ꢚꢀꢙ ꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
†
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
FULL-SCALE OUTPUT CURRENT
DIGITAL SUPPLY CURRENT
vs
RATIO (Fclock/Fout) AT DV
= 5 V
DD
30
25
20
15
10
5
25
20
15
10
5
DV
= 5 V
100 MSPS
DD
70 MSPS
50 MSPS
25 MSPS
5 MSPS
0
0
2
4
6
8
10 12 14 16 18 20
0.0
0.1
0.2
0.3
0.4
0.5
IOUT
FS
− Full-Scale Output Current − mA
Ratio − (Fclock/Fout)
Figure 26
Figure 27
DIGITAL SUPPLY CURRENT
vs
RATIO (Fclock/Fout) AT DV
= 3.3 V
DD
10
8
70 MSPS
50 MSPS
6
4
25 MSPS
5 MSPS
0.4
2
0
0.0
0.1
0.2
0.3
0.5
Ratio − (Fclock/Fout)
Figure 28
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢃ
ꢅ
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ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓꢊ ꢔꢊ ꢀꢆꢕ ꢈꢀꢖ ꢈꢆꢗꢆꢕ ꢖ ꢔ ꢏꢖ ꢗ ꢘꢙ ꢚꢀ ꢙꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
The THS5651A architecture is based on current steering, combining high update rates with low power
consumption. The CMOS device consists of a segmented array of PMOS transistor current sources, which are
capable of delivering a full-scale current up to 20 mA. High-speed differential current switches direct the current
of each current source to either one of the output nodes, IOUT1 or IOUT2. The complementary output currents
thus enable differential operation, canceling out common mode noise sources (on-chip and PCB noise), dc
offsets, even order distortion components, and increase signal output power by a factor of two. Major
advantages of the segmented architecture are minimum glitch energy, excellent DNL, and very good dynamic
performance. The DAC’s high output impedance of >300 kΩ and fast switching result in excellent dynamic
linearity (spurious free dynamic range SFDR).
The full-scale output current is set using an external resistor R
voltage reference source (1.2 V) and control amplifier. The current I
internally to provide a full-scale output current equal to 32 times I
from 20 mA down to 2 mA.
in combination with an on-chip bandgap
BIAS
through resistor R
. The full-scale current can be adjusted
is mirrored
BIAS
BIAS
BIAS
data interface and timing
The THS5651A comprises separate analog and digital supplies, i.e. AV
and DV . The digital supply voltage
DD
DD
can be set from 5.5 V down to 3 V, thus enabling flexible interfacing with external logic. The THS5651A provides
two operating modes, as shown in Table 1. Mode 0 (mode pin connected to DGND) supports a straight binary
input data word format, whereas mode 1 (mode pin connected to DV ) sets a twos complement input
DD
configuration.
Figure 29 shows the timing diagram. Internal edge-triggered flip-flops latch the input word on the rising edge
of the input clock. The THS5651A provides for minimum setup and hold times (> 1 ns), allowing for noncritical
external interface timing. Conversion latency is one clock cycle for both modes. The clock duty cycle can be
chosen arbitrarily under the timing constraints listed in the digital specifications table. However, a 50% duty cycle
will give optimum dynamic performance. Figure 30 shows a schematic of the equivalent digital inputs of the
THS5651A, valid for pins D9−D0, SLEEP, and CLK. The digital inputs are CMOS-compatible with logic
thresholds of DV /2 20%. Since the THS5651A is capable of being updated up to 100 MSPS, the quality of
DD
the clock and data input signals are important in achieving the optimum performance. The drivers of the digital
data interface circuitry should be specified to meet the minimum setup and hold times of the THS5651A, as well
as its required min/max input logic level thresholds. Typically, the selection of the slowest logic family that
satisfies the above conditions will result in the lowest data feed-through and noise. Additionally, operating the
THS5651A with reduced logic swings and a corresponding digital supply (DV ) will reduce data feed-through.
DD
Note that the update rate is limited to 70 MSPS for a digital supply voltage DV
of 3 V to 3.6 V.
DD
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢃ
ꢅ
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ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓ ꢊꢔ ꢊꢀꢆ ꢕ ꢈꢀꢖꢈꢆ ꢗ ꢆꢕ ꢖꢔ ꢏꢖ ꢗꢘ ꢙ ꢚꢀꢙ ꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
D[9:0]
Valid Data
t
s(DAC)
t
pd
0.1%
50%
DAC
90%
10%
Output
0.1%
r(IOUT)
(IOUT1 or
IOUT2)
t
t
h(D)
t
su(D)
t
d(D)
1/f
CLK
CLK
50%
50%
50%
50%
50%
50%
t
w(LPH)
Figure 29. Timing Diagram
Table 1. Input Interface Modes
MODE 0
MODE 1
MODE PIN CONNECTED TO
DV
FUNCTION/MODE
MODE PIN CONNECTED TO
DGND
DD
Input code format
Binary
Twos complement
DV
DD
External
Digital in
Internal
Digital in
Figure 30. Digital Equivalent Input
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
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ꢄ
ꢃ
ꢅ
ꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓꢊ ꢔꢊ ꢀꢆꢕ ꢈꢀꢖ ꢈꢆꢗꢆꢕ ꢖ ꢔ ꢏꢖ ꢗ ꢘꢙ ꢚꢀ ꢙꢚ
ꢐ
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ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
DAC transfer function
The THS5651A delivers complementary output currents IOUT1 and IOUT2. Output current IOUT1 equals the
approximate full-scale output current when all input bits are set high in mode 0 (straight binary input), i.e. the
binary input word has the decimal representation 1023. For mode 1, the MSB is inverted (twos complement input
format). Full-scale output current will flow through terminal IOUT2 when all input bits are set low (mode 0,
straight binary input). The relation between IOUT1 and IOUT2 can thus be expressed as:
IOUT1 + IOUT * IOUT2
FS
where IOUT is the full-scale output current. The output currents can be expressed as:
FS
CODE
1024
IOUT1 + IOUT
FS
(1023 * CODE)
IOUT2 + IOUT
FS
1024
where CODE is the decimal representation of the DAC data input word. Output currents IOUT1 and IOUT2 drive
resistor loads R or a transformer with equivalent input load resistance R . This would translate into
LOAD
LOAD
single-ended voltages VOUT1 and VOUT2 at terminal IOUT1 and IOUT2, respectively, of:
CODE
1024
VOUT1 + IOUT1 R
VOUT2 + IOUT2 R
+
+
IOUT R
LOAD
FS
LOAD
(1023–CODE)
1024
IOUT R
LOAD
FS
LOAD
The differential output voltage VOUT
can thus be expressed as:
DIFF
(2CODE–1023)
VOUT
+ VOUT1–VOUT2 +
IOUT R
DIFF
FS
LOAD
1024
The latter equation shows that applying the differential output will result in doubling of the signal power delivered
to the load. Since the output currents of IOUT1 and IOUT2 are complementary, they become additive when
processed differentially. Care should be taken not to exceed the compliance voltages at node IOUT1 and
IOUT2, which would lead to increased signal distortion.
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
reference operation
The THS5651A comprises a bandgap reference and control amplifier for biasing the full-scale output current.
The full-scale output current is set by applying an external resistor R
. The bias current I
through resistor
BIAS
BIAS
R
is defined by the on-chip bandgap reference voltage and control amplifier. The full-scale output current
BIAS
equals 32 times this bias current. The full-scale output current IOUT can thus be expressed as:
FS
32 V
EXTIO
IOUT + 32 I
+
FS
BIAS
R
BIAS
where V
is the voltage at terminal EXTIO. The bandgap reference voltage delivers an accurate voltage
EXTIO
of 1.2 V. This reference is active when terminal EXTLO is connected to AGND. An external decoupling capacitor
of 0.1 µF should be connected externally to terminal EXTIO for compensation. The bandgap reference
C
EXT
can additionally be used for external reference operation. In that case, an external buffer with high impedance
input should be applied in order to limit the bandgap load current to a maximum of 100 nA. The internal reference
can be disabled and overridden by an external reference by connecting EXTLO to AV . Capacitor C
hence be omitted. Terminal EXTIO thus serves as either input or output node.
may
DD
EXT
The full-scale output current can be adjusted from 20 mA down to 2 mA by varying resistor R
or changing
BIAS
the externally applied reference voltage. The internal control amplifier has a wide input range, supporting the
full-scale output current range of 20 dB. The bandwidth of the internal control amplifier is defined by the internal
1 nF compensation capacitor at pin COMP1 and the external compensation capacitor C1. The relatively weak
internal control amplifier may be overridden by an externally applied amplifier with sufficient drive for the internal
1 nF load, as shown in Figure 31. This provides the user with more flexibility and higher bandwidths, which are
specifically attractive for gain control and multiplying DAC applications. Pin SLEEP should be connected to
AGND or left disconnected when an external control amplifier is used.
EXT Reference
Voltage
External
Control AMP
−
THS4041
+
AGND
SLEEP
1 nF
AV
DD
COMP1
AV
DD
AVDD
1.2 V
REF
Current Source Array
EXTLO
EXTIO
BIASJ
−
REF AMP
+
Internal
Control AMP
R
EXT
IOUT1 or IOUT2
Figure 31. Bypassing the Internal Reference and Control Amplifier
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
analog current outputs
Figure 32 shows a simplified schematic of the current source array output with corresponding switches.
Differential PMOS switches direct the current of each individual PMOS current source to either the positive
output node IOUT1 or its complementary negative output node IOUT2. The output impedance is determined
by the stack of the current sources and differential switches, and is typically >300 kΩ in parallel with an output
capacitance of 5 pF.
Output nodes IOUT1 and IOUT2 have a negative compliance voltage of −1 V, determined by the CMOS process.
Beyond this value, transistor breakdown may occur, resulting in reduced reliability of the THS5651A device. The
positive output compliance depends on the full-scale output current IOUT and positive supply voltage AV
.
FS
DD
The positive output compliance equals 1.25 V for AV
= 5 V and IOUT = 20 mA. Exceeding the positive
DD
FS
compliance voltage adversely affects distortion performance and integral nonlinearity. The optimum distortion
performance for a single-ended or differential output is achieved when the maximum full-scale signal at IOUT1
and IOUT2 does not exceed 0.5 V (e.g. when applying a 50-Ω doubly terminated load for 20 mA full-scale output
current). Applications requiring the THS5651A output (i.e., OUT1 and/or OUT2) to extend its output compliance
should size R
accordingly.
LOAD
AV
DD
Current
Sources
Switches
IOUT1
IOUT2
Current Source Array
R
R
LOAD
LOAD
Figure 32. Equivalent Analog Current Output
Figure 33(a) shows the typical differential output configuration with two external matched resistor loads. The
nominal resistor load of 50 Ω will give a differential output swing of 2 V when applying a 20-mA full-scale output
PP
current. The output impedance of the THS5651A depends slightly on the output voltage at nodes IOUT1 and
IOUT2. Consequently, for optimum dc integral nonlinearity, the configuration of Figure 33(b) should be chosen.
In this I−V configuration, terminal IOUT1 is kept at virtual ground by the inverting operational amplifier. The
complementary output should be connected to ground to provide a dc current path for the current sources
switched to IOUT2. Note that the INL/DNL specifications for the THS5651A are measured with IOUT1
maintained at virtual ground. The amplifier’s maximum output swing and the DAC’s full-scale output current
determine the value of the feedback resistor R . Capacitor C filters the steep edges of the THS5651A current
FB
FB
output, thereby reducing the operational amplifier slew-rate requirements. In this configuration, the op amp
should operate on a dual supply voltage due to its positive and negative output swing. Node IOUT1 should be
selected if a single-ended unipolar output is desirable.
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
C
FB
R
FB
50 Ω
+)
100 Ω
−
+
IOUT1
IOUT2
IOUT1
IOUT2
+)
VOUT
−)
VOUT
−)
THS4001
THS4011
50 Ω
(a)
(b)
Figure 33. Differential and Single-Ended Output Configuration
The THS5651A can be easily configured to drive a doubly terminated 50-Ω cable. Figure 34(a) shows the
single-ended output configuration, where the output current IOUT1 flows into an equivalent load resistance of
25 Ω. Node IOUT2 should be connected to ground or terminated with a resistor of 25 Ω. Differential-to-single
conversion (e.g., for measurement purposes) can be performed using a properly selected RF transformer, as
shown in Figure 34(b). This configuration provides maximum rejection of common-mode noise sources and
even order distortion components, thereby doubling the power to the output. The center tap on the primary side
of the transformer is connected to AGND, enabling a dc current flow for both IOUT1 and IOUT2. Note that the
ac performance of the THS5651A is optimum and specified using this differential transformer coupled output,
limiting the voltage swing at IOUT1 and IOUT2 to 0.5 V.
50 Ω
1:1
50 Ω
VOUT
VOUT
IOUT1
IOUT2
IOUT1
IOUT2
100 Ω
50 Ω
50 Ω
50 Ω
25 Ω
(a)
(b)
Figure 34. Driving a Doubly Terminated 50 Ω Cable
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
sleep mode
The THS5651A features a power-down mode that turns off the output current and reduces the supply current
to less than 5 mA over the analog supply range of 4.5 V to 5.5 V and temperature range. The power-down mode
is activated by applying a logic level 1 to the SLEEP pin (e.g., by connecting pin SLEEP to AVDD). An internal
pulldown circuit at node SLEEP ensures that the THS5651A is enabled if the input is left disconnected.
Power-up and power-down activation times depend on the value of external capacitor at node SLEEP. For a
nominal capacitor value of 0.1 µF power down takes less than 5 µs, and approximately 3 ms to power back up.
The SLEEP mode should not be used when an external control amplifier is used, as shown in Figure 22.
definitions of specifications and terminology
integral nonlinearity (INL)
The relative accuracy or integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum
deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale
errors.
differential nonlinearity (DNL)
The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the
measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage
changes in the same direction (or remains constant) as a change in the digital input code.
offset error
Offset error is defined as the deviation of the output current from the ideal of zero at a digital input value of 0.
gain error
Gain error is the error in slope of the DAC transfer function.
signal-to-noise ratio + distortion (S/N+D or SINAD)
S/N+D or SINAD is the ratio of the rms value of the output signal to the rms sum of all other spectral components
below the Nyquist frequency, including harmonics but excluding dc. The value for S/N+D is expressed in
decibels.
spurious free dynamic range (SFDR)
SFDR is the difference between the rms value of the output signal and the rms value of the largest spurious
signal within a specified bandwidth. The value for SFDR is expressed in decibels.
total harmonic distortion (THD)
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the fundamental signal
and is expressed in decibels.
output compliance range
The maximum and minimum allowable voltage of the output of the DAC, beyond which either saturation of the
output stage or breakdown may occur.
settling time
The time required for the output to settle within a specified error band.
glitch energy
The time integral of the analog value of the glitch transient.
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
offset drift
The change in offset error versus temperature from the ambient temperature (T = 25°C) in ppm of full-scale
A
range per °C.
gain drift
The change in gain error versus temperature from the ambient temperature (T = 25°C) in ppm of full-scale
A
range per °C.
reference voltage drift
The change in reference voltage error versus temperature from the ambient temperature (T = 25°C) in ppm
A
of full-scale range per °C.
THS5651A evaluation board
An evaluation module (EVM) board for the THS5651A digital-to-analog converter is available for evaluation.
This board allows the user the flexibility to operate the THS5651A in various configurations. Possible output
configurations include transformer coupled, resistor terminated, and inverting/noninverting amplifier outputs.
The digital inputs are designed to interface with the TMS320 C5000 or C6000 family of DSPs or to be driven
directly from various pattern generators with the onboard option to add a resistor network for proper load
termination.
See the THS56x1 Evaluation Module User’s Guide for more details (SLAU032).
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ꢓꢊ ꢔꢊ ꢀꢆꢕ ꢈꢀꢖ ꢈꢆꢗꢆꢕ ꢖ ꢔ ꢯꢏꢖ ꢗꢘ ꢙꢚ ꢀ ꢙꢚ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
•
23
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
Figure 36. Board Layout, Layer 1
Figure 37. Board Layout, Layer 2
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
Figure 38. Board Layout, Layer 3
Figure 39. Board Layout, Layer 4
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
Figure 40. Board Layout, Layer 5
Table 2. Bill of Materials
QTY
3
REF. DES
C1, C22, C31
PART NUMBER
1206ZC105KAT2A
DESCRIPTION
MFG.
Ceramic, 1 µF, 10 V, X7R, 10%
6.3 V, 4.7 µF, tantalum
AVX
4
C18, C19, C28, C35
C15, C24, C4
C25, C32
ECSTOJY475
ECSTOJY106
Panasonic
Panasonic
3
6.3 V, 10 µF, tantalum
0
Ceramic, not installed, 50 V, X7R, 10%
Ceramic, 0.01 µF, 50 V, X7R, 10%
Ceramic, 0.1 µF, 50 V, X7R, 10%
6
C14, C2, C20, C26, C29, C33 12065C103KAT2A
AVX
AVX
17
C10, C11, C12, C13, C16,
C17, C21, C23, C27, C3, C30,
C34, C5, C6, C7, C8, C9
12065C104KAT2A
2
4
1
1
D1, D2
AND/AND5GA or equivalent
27-43-037447
Green LED, 1206 size SM chip LED
Fair-Rite SM beads #27-037447
34-Pin header for IDC
FB1, FB2, FB3, FB4
FairRite
Samtec
Lumberg
J1
J2
TSW-117-07-L-D or equivalent
KRMZ2 or equivalent
2 Terminal screw connector,
2TERM_CON
1
1
3
0
3
1
4
J3
TSW-112-07-L-S or equivalent
KRMZ3 or equivalent
142-0701-206 or equivalent
142-0701-206 or equivalent
DO1608C-472
Single row 12-pin header
Samtec
J4
3 Terminal screw connector
Lumberg
J5, J6, J7
J8, J9
PCB Mount SMA jack, SMA_PCB_MT
PCB Mount SMA jack, not installed
DO1608C-series, DS1608C-472
1206 Chip resistor, 1.5K, 1/4 W, 1%
Johnson Components
Johnson Components
Coil Craft
L1, L2, L3
R1
1206
R10, R11, R4, R5
CTS/CTS766-163-(R)330-G-TR 8 Element isolated resistor pack, 33 Ω
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
APPLICATION INFORMATION
Table 2. Bill of Materials (Continued)
QTY
4
REF. DES
R12, R19, R7, R9
PART NUMBER
DESCRIPTION
MFG.
1206
1206
1206 Chip resistor, 33 Ω, 1/4 W, 1%
1206 Chip resistor, 0 Ω, 1/4 W, 1%
4 mm SM Pot, 5K
5
R13, R17. R2, R21, R8
1
R14
3214W-1-502 E or equivalent
Bourns
1
R15
1206
1206 Chip resistor, 2.94K, 1/4 W, 1%
1206 Chip resistor, 3K, 1/4 W, 1%
1206 Chip resistor, 49.94K, 1/4 W, 1%
1206 Chip resistor, 10K, 1/4 W, 1%
1206 Chip resistor, 10K, 1/4 W, 1%
1206 Chip resistor, 100K, 1/4 W, 1%
1206 Chip resistor, TBD, 1/4 W, 1%
1206 Chip resistor, 750K, 1/4 W, 1%
RF Transformer, T1-1T-KK81
1
R16
1206
3
R18, R24, R29
1206
3
R20, R3, R6
1206
1
R22
1206
1
R23
1206
1
R25
1206
4
R26, R27, R28, R30
1206
1
T1
T1-1T-KK81
SN74LVT245BDW
MiniCircuits
TI
2
U1, U2
Octal bus transceiver, 3-state,
SN74LVT245B
1
1
U3
U4
SN74AHCT1G00DBVR/
SN74AHC1G00DBVR
Single gate NAND, SN74AHC1G00
TI
TI
SN74AHCT1G32DBVR/
SN74AHCC1G32DBVR
Single 2 input positive or gate,
SN74AHC1G32
THS5641A
THS5651A
THS5661A
THS5671A
SN74ALVC08
LT1004D
THS5641AIDW
DAC, 3−5.5 V, 8 Bit, 100 MSPS
DAC, 3−5.5 V, 10 Bit, 125 MSPS
DAC, 3−5.5 V, 12 Bit, 125 MSPS
DAC, 3−5.5 V, 14 Bit, 125 MSPS
Quad AND gate
TI
TI
TI
TI
TI
TI
THS5651AIDW
THS5661AIDW
THS5647AIDW
1
1
0
1
4
3
2
SN74ALVC08D
LT1004CD-1-2/LT1004ID-1-2
AD1580BRT
Precision 1.2 V reference
NOT INSTALLED
THS3001
Precision voltage reference, not installed
THS3001 high-speed op amp
2 position jumper_.1’’ spacing, W2
3 position jumper_.1’’ spacing, W3
THS3001CD/THS2001ID
TSW-102-07-L-S or equivalent
TSW-102-07-L-S or equivalent
TSW-102-07-L-S or equivalent
TI
W2
Samtec
Samtec
Samtec
W3
2X3_JUMPER
6-Pin header dual row, 0.025×0.1,
2X3_JUMPER
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SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
MECHANICAL DATA
DW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
16 PINS SHOWN
0.050 (1,27)
16
0.020 (0,51)
0.010 (0,25)
M
0.014 (0,35)
9
0.419 (10,65)
0.400 (10,15)
0.010 (0,25) NOM
0.299 (7,59)
0.291 (7,39)
Gage Plane
0.010 (0,25)
1
8
0°−ā8°
0.050 (1,27)
0.016 (0,40)
A
Seating Plane
0.004 (0,10)
0.012 (0,30)
0.004 (0,10)
0.104 (2,65) MAX
PINS **
16
18
20
24
28
0.710
DIM
0.410
0.462
0.510
0.610
A MAX
A MIN
(10,41) (11,73) (12,95) (15,49) (18,03)
0.400
0.453
0.500
0.600
0.700
(10,16) (11,51) (12,70) (15,24) (17,78)
4040000/E 08/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-013
28
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃ ꢄꢃ ꢅꢆ
ꢅ
ꢇ
ꢈ
ꢉ
ꢊ
ꢀ
ꢋ
ꢅ
ꢌ
ꢃ
ꢍ
ꢂ
ꢎ
ꢂ
ꢋ
ꢏ
ꢓꢊ ꢔꢊ ꢀꢆꢕ ꢈꢀꢖ ꢈꢆꢗꢆꢕ ꢖ ꢔ ꢏꢖ ꢗ ꢘꢙ ꢚꢀ ꢙꢚ
ꢐ
ꢑ
ꢑ
ꢒ
ꢓ
ꢆ
ꢏ
SLAS260A − FEBRUARY 2000 − REVISED SEPTEMBER 2002
MECHANICAL DATA
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°−ā8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
A MAX
A MIN
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
29
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
3-Apr-2009
PACKAGING INFORMATION
Orderable Device
THS5651AIDW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
28
28
28
28
28
28
28
28
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
THS5651AIDWG4
THS5651AIDWR
THS5651AIDWRG4
THS5651AIPW
SOIC
SOIC
DW
DW
DW
PW
PW
PW
PW
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
THS5651AIPWG4
THS5651AIPWR
THS5651AIPWRG4
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
THS5651AIDWR
THS5651AIPWR
SOIC
DW
PW
28
28
1000
2000
330.0
330.0
32.4
16.4
11.35
6.9
18.67
10.2
3.1
1.8
16.0
12.0
32.0
16.0
Q1
Q1
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
THS5651AIDWR
THS5651AIPWR
SOIC
DW
PW
28
28
1000
2000
346.0
346.0
346.0
346.0
49.0
33.0
TSSOP
Pack Materials-Page 2
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
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Applications
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interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
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