THS7316_17 [TI]
3-Channel HDTV Video Amplifier With 5th-Order Filters and 6-dB Gain;
| 型号： | THS7316_17 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-Channel HDTV Video Amplifier With 5th-Order Filters and 6-dB Gain 电视 |
| 文件： | 总28页 (文件大小：814K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
THS7316
www.ti.com
SLOS521–MARCH 2007
th
3-Channel HDTV Video Amplifier With 5 -Order Filters and 6-dB Gain
FEATURES
DESCRIPTION
•
3 HDTV Video Amplifiers for Y'P'BP'R 720p and
1080i, G'B'R' (R'G'B'), VGA/SVGA/XGA
Fabricated using the Silicon-Germanium (SiGe)
BiCom-III process, the THS7316 is a low power
single-supply 3-V to 5-V, 3-channel integrated video
•
Integrated Low-Pass Filters
buffer. It incorporates
Butterworth filter which is useful as
a
5th-order modified
DAC
–
5th-Order 36-MHz (–3 dB) Butterworth Filter
a
–
–
–1 dB Passband Bandwidth at 31 MHz
30 dB Attenuation at 74 MHz
reconstruction filter or an ADC anti-aliasing filter. The
36-MHz filter is a perfect choice for HDTV video
which includes Y'P'BP'R 720p/1080i, G'B'R' (R'G'B'),
and VGA/SVGA/XGA signals.
•
Versatile Input Biasing
–
–
–
DC-Coupled With 140-mV Input Shift
AC-Coupled with Sync-Tip Clamp
Allows AC-Coupled With Biasing
As part of the THS7316 flexibility, the input can be
configured for ac or dc coupled inputs. The DC +
140-mV input offset shift to allow for a full sync
dynamic range at the output with 0-V input. The AC
coupled modes include a transparent sync-tip clamp
option for signals with sync such as Y’ or Green with
sync. AC-coupled biasing for P’B/P’R/Non-sync
channels can be achieved by adding an external
resistor.
•
•
•
Built-in 6-dB Gain (2V/V)
3-V to 5-V Single Supply Operation
Rail-to-Rail Output:
–
Output Swings Within 100 mV From the
Rails Allowing AC or DC Output Coupling
–
Supports Driving 2 Lines per Channel
The THS7316 is the perfect choice for all output
buffer applications. Its rail-to-rail output stage with
6-dB gain allows for both ac and dc line driving. The
ability to drive 2 video lines per channel, or 75-Ω
loads, allows for maximum flexibility as a video line
driver. The 18.3-mA total quiescent current makes it
an excellent choice for USB powered, portable, or
other power sensitive video applications.
•
•
•
Low 18.3-mA at 3.3-V Total Quiescent Current
Low Differential Gain/Phase of 0.1% / 0.1°
SOIC-8 Package
APPLICATIONS
•
•
•
Set Top Box Output Video Buffering
PVR/DVDR Output Buffering
USB/Portable Low Power Video Buffering
The THS7316 is available in
package that is RoHS compliant.
a
small SOIC-8
3.3 V
Y’ / G’ Out
75 W
DAC/
Y’ / G’
Encoder
75 W
75 W
75 W
THS7316
R
P’ / B’ Out
B
CH.1 IN
CH.2 IN
CH.3 IN
CH.1 OUT
CH.2 OUT
CH.3 OUT
GND
1
2
3
4
8
7
6
5
75 W
HDTV
720p/1080i
Y’P’ P’
P’ / B’
B
B
R
R
R
G’B’R’
VGA
V
S+
SVGA
XGA
P’ / R’ Out
R
P’ / R’
R
75 W
3.3 V
Figure 1. 3.3-V Single-Supply DC-Input/DC Output Coupled Video Line Driver
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
THS7316
www.ti.com
SLOS521–MARCH 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGING/ORDERING INFORMATION
PACKAGED DEVICES
THS7316D
PACKAGE TYPE(1)
TRANSPORT MEDIA, QUANTITY
Rails, 75
SOIC-8
THS7316DR
Tape and Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
5.5
UNIT
V
Supply voltage, VS+ to GND
VI
IO
Input voltage
– 0.4 V to VS+
±90
V
Output current
mA
Continuous power dissipation
See Dissipation Rating Table
TJ
Maximum junction temperature, any condition(2)
Maximum junction temperature, continuous operation, long term reliability(3)
Storage temperature range
150
125
°C
°C
°C
TJ
Tstg
–65 to 150
2000
HBM
ESD ratings
CDM
MM
1500
V
200
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
POWER RATING(1)
θJC
(°C/W)
θJA
(°C/W)
(TJ = 125°C)
PACKAGE
TA = 25°C
TA = 85°C
SOIC-8 (D)
16.8
130(2)
769 mW
308 mW
(1) Power rating is determined with a junction temperature of 125°C. This is the point where performance starts to degrade and long-term
reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C
for best performance and reliability.
(2) This data was taken with the JEDEC High-K test PCB. For the JEDEC low-K test PCB, the θJA is 196°C/W.
RECOMMENDED OPERATING CONDITIONS
MIN
3
MAX
5
UNIT
V
VS+
TA
Supply voltage
Ambient temperature
–40
85
°C
2
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SLOS521–MARCH 2007
FUNCTIONAL DIAGRAM
+Vs
140 mV
+
Level
Shift
gm
-
Channel 1
Input
Channel 1
Output
6dB
LPF
Sync-Tip
Clamp
(DC Restore)
5-Pole
36-MHz
800 kW
+Vs
140 mV
Level
Shift
+
gm
-
Channel 2
Input
Channel 2
Output
6dB
LPF
Sync-Tip
Clamp
(DC Restore)
5-Pole
36-MHz
800 kW
+Vs
140 mV
Level
Shift
+
gm
-
Channel 3
Input
Channel 3
Output
6dB
LPF
Sync-Tip
Clamp
(DC Restore)
5-Pole
36-MHz
800 kW
3 V to 5 V
PIN CONFIGURATION
SOIC-8 (D)
(TOP VIEW)
THS7316
CH.1 IN
CH.1 OUT
CH.2 OUT
CH.3 OUT
GND
1
2
3
4
8
7
6
5
CH.2 IN
CH.3 IN
V
S+
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
CH. 1 – INPUT
CH. 2 – INPUT
CH. 3 – INPUT
+Vs
NO. SOIC-8
1
2
3
4
5
6
7
8
I
I
Video Input – Channel 1
Video Input – Channel 2
Video Input – Channel 3
I
I
Positive Power Supply Pin – connect to 3 V to 5 V.
Ground Pin for all internal circuitry.
Video Output – Channel 3
GND
I
CH. 3 – OUTPUT
CH. 2 – OUTPUT
CH. 1 – OUTPUT
O
O
O
Video Output – Channel 2
Video Output – Channel 1
3
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SLOS521–MARCH 2007
ELECTRICAL CHARACTERISTICS VS+ = 3.3 V:
RL = 150 Ω to GND – Reference Figure 2 and Figure 3 (unless otherwise noted)
TYP
OVER TEMPERATURE
0°C to
70°C
–40°C to
85°C
MIN/
MAX/
TYP
PARAMETER
TEST CONDITIONS
25°C
25°C
UNITS
AC PERFORMANCE
(1)
Small-signal bandwidth (–3dB)
Large-signal bandwidth (–3dB)
–1 dB Passband bandwidth
Attenuation
VO – 0.2 VPP
36
36
31/43
31/43
30/44
30/44
30/44
30/44
MHz
MHz
MHz
dB
Min/Max
Min/Max
Typ
(1)
VO – 2 VPP
31
f = 27 MHz(2)
f = 74 MHz(2)
f = 100 kHz
0.3
30
–0.3/2.4
20
–0.35/2.4
19
–0.4/2.6
19
Min/Max
Min
With respect to 100 kHz
Group delay
dB
16.2
ns
Typ
Group delay variation
with respect to 100 kHz
f = 27 MHz
5.4
0.3
ns
ns
Typ
Channel-to-channel delay
Differential gain
Typ
Typ
NTSC / PAL
0.1 /
0.15%
Differential phase
NTSC / PAL
0.1 / 0.1
–70
67
°
Typ
Typ
Total harmonic distortion
Signal to noise ratio
f = 1 MHz; VO = 2 VPP
No Weighting, 100 kHz to 37.5 MHz
f = 1 MHz
dB
dB
dB
dB
Ω
Typ
Channel-to-channel crosstalk
AC Gain – All channels
Output Impedance
–61
6
Typ
5.7/6.3
5.65/6.35
200/380
5.65/6.35
190/390
Min/Max
Typ
f = 10 MHz
0.5
DC PERFORMANCE
Biased output voltage
Input voltage range
VI = 0 V
285
–0.1/1.46
360
210/370
mV
V
Min/Max
Typ
DC input, limited by output
VI = –0.1 V
Sync tip clamp charge current
Input resistance
µA
kΩ
pF
Typ
800
Typ
Input capacitance
2
Typ
OUTPUT CHARACTERISTICS
RL = 150 Ω to 1.65V
3.15
3.1
3.1
3.0
0.14
0.08
0.3
0.1
80
V
V
Typ
Min
Typ
Typ
Typ
Max
Typ
Typ
Typ
Typ
RL = 150 Ω to GND
2.85
0.17
2.75
0.2
2.75
0.21
High output voltage swing
Low output voltage swing
RL = 75 Ω to 1.65V
V
RL = 75 Ω to GND
V
RL = 150 Ω to 1.65V (VI = –0.15 V)
RL = 150 Ω to GND (VI = –0.15 V)
RL = 75 Ω to 1.65V (VI = –0.15 V)
RL = 75 Ω to GND (VI = –0.15 V)
RL = 10 Ω to 1.65V
V
V
V
V
Output current (sourcing)
Output current (sinking)
mA
mA
RL = 10 Ω to 1.65V
70
POWER SUPPLY
Maximum operating voltage
Minimum operating voltage
Maximum quiescent current
Minimum quiescent current
Power Supply Rejection (+PSRR)
3.3
3.3
5.5
2.85
22.5
14
5.5
2.85
23
5.5
V
Max
Min
Max
Min
Typ
2.85
23.4
13.1
V
VI = 0 V
VI = 0 V
18.3
18.3
52
mA
mA
dB
13.6
(1) The Min/Max values listed for this specification are specified by design and characterization only.
(2) 3.3-V Supply Filter specifications are specified by 100% testing at 5-V supply along with design and characterization only.
4
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SLOS521–MARCH 2007
ELECTRICAL CHARACTERISTICS VS+ = 5 V:
RL = 150Ω to GND – Reference Figure 2 and Figure 3 (unless otherwise noted)
TYP
OVER TEMPERATURE
0°C to
70°C
–40°C to
85°C
MIN/
MAX/
TYP
PARAMETER
TEST CONDITIONS
25°C
25°C
UNITS
AC PERFORMANCE
(1)
Small-signal bandwidth (–3dB)
Large-signal bandwidth (–3dB)
–1dB Passband bandwidth
Attenuation
VO – 0.2 VPP
36
36
31/43
31/43
30/44
30/44
30/44
30/44
MHz
MHz
MHz
dB
Min/Max
Min/Max
Typ
(1)
VO – 2 VPP
31
f = 27 MHz
f = 74 MHz
0.3
30
–0.3/2.4
20
–0.35/2.5
19
–0.4/2.6
19
Min/Max
Min
With respect to 100 kHz
Group delay
dB
f = 100 kHz
f = 27 MHz
16.1
ns
Typ
Group delay variation
with respect to 100kHz
5.4
0.3
ns
ns
Typ
Channel-to-channel delay
Differential gain
Typ
Typ
NTSC / PAL
0.1 /
0.15%
Differential phase
NTSC / PAL
0.1 / 0.1
–70
67
°
Typ
Typ
Total harmonic distortion
Signal to noise ratio
f = 1 MHz; VO = 2 VPP
No Weighting, 100 kHz to 37.5 MHz
f = 1 MHz
dB
dB
dB
dB
Ω
Typ
Channel-to-channel crosstalk
AC Gain – All channels
Output Impedance
–62
6
Typ
5.7/6.3
5.65/6.35
200/380
5.65/6.35
190/390
Min/Max
Typ
f = 10 MHz
0.5
DC PERFORMANCE
Biased output voltage
Input voltage range
VI = 0 V
290
–0.1/2.3
380
210/370
mV
V
Min/Max
Typ
Limited by output
VI = –0.1 V
Sync tip clamp charge current
Input resistance
µA
kΩ
pF
Typ
800
Typ
Input capacitance
2
Typ
OUTPUT CHARACTERISTICS
RL = 150 Ω to 2.5V
4.85
4.7
V
V
Typ
Min
Typ
Typ
Typ
Max
Typ
Typ
Typ
Typ
RL = 150 Ω to GND
4.2
4.1
4.1
High output voltage swing
Low output voltage swing
RL = 75 Ω to 2.5V
4.7
V
RL = 75 Ω to GND
4.5
V
RL = 150 Ω to 2.5V (VI = –0.15 V)
RL = 150 Ω to GND (VI = –0.15 V)
RL = 75 Ω to 2.5V (VI = –0.15 V)
RL = 75 Ω to GND (VI = –0.15 V)
RL = 10 Ω to 2.5 V
0.19
0.09
0.35
0.1
V
0.23
0.26
0.27
V
V
V
Output current (sourcing)
Output current (sinking)
90
mA
mA
RL = 10 Ω to 2.5 V
85
POWER SUPPLY
Maximum operating voltage
Minimum operating voltage
Maximum quiescent current
Minimum quiescent current
Power Supply Rejection (+PSRR)
5
5
5.5
2.85
23
5.5
2.85
25
5.5
2.85
26
V
Max
Min
Max
Min
Typ
V
VI = 0 V
VI = 0 V
19.3
19.3
52
mA
mA
dB
14.7
14.2
13.8
(1) The Min/Max values listed for this specification are specified by design and characterization only.
5
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SLOS521–MARCH 2007
DUT
RTERM
RLOAD
CH.1 OUT
1
2
3
4
8
7
6
5
CH.1 IN
CH.2 OUT
CH.3 OUT
GND
CH.2 IN
CH.3 IN
VS+
RLOAD
RTERM
RSOURCE
0.1 mF
VSOURCE
RLOAD
RTERM
+
100 mF
+VS
Figure 2. DC Coupled Input and Output Test Circuit
470 mF
+
CIN
DUT
RLOAD
RTERM
0.1 mF
CH.1 IN
CH.1 OUT
CIN
8
7
6
5
1
2
3
4
470 mF
+
CH.2 OUT
CH.2 IN
CH.3 IN
VS+
CH.3 OUT
GND
RLOAD
RTERM
RSOURCE
CIN
0.1 mF
470mF
+
0.1 mF
VSOURCE
RTERM
RLOAD
+
0.1 mF
100 mF
+VS
Figure 3. AC Coupled Input and Output Test Circuit
6
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TYPICAL CHARACTERISTICS
SMALL-SIGNAL GAIN vs FREQUENCY
PHASE vs FREQUENCY
10
0
45
0
−45
−10
−20
−30
−40
−90
R
= 150 W || 13 pF
= 75 W || 13 pF
L
−135
−180
−225
−270
−315
−360
R
L
V
V
= 3.3 V
S
- 200 mV
V
= 3.3 V
O
PP
S
−50
−60
V
O
= 200 mV
PP
R
= 150 W || 13 pF
L
0.1
1
10
100
1k
0.1
1
10
100
f − Frequency − MHz
f − Frequency − MHz
Figure 4.
Figure 5.
SMALL-SIGNAL GAIN vs FREQUENCY
GROUP DELAY vs FREQUENCY
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
25
20
15
10
R
= 150 W || 13 pF
L
R
= 75 W || 13 pF
L
V
V
= 3.3 V
S
= 200 mV
V
V
= 3.3 V
S
O
PP
= 200 mV
O
PP
R
= 150 W || 13 pF
L
1
10
100
0.1
1
10
100
f − Frequency − MHz
f − Frequency − MHz
Figure 6.
Figure 7.
SMALL-SIGNAL FREQUENCY RESPONSE vs
CAPACITIVE LOADING
LARGE-SIGNAL FREQUENCY RESPONSE
10
0
10
0
−10
−20
−10
−20
−30
−40
−50
−60
V
V
= 3.3 V
S
= 200 mV
O
PP
V
= 3.3 V
S
Load = 150 W || C
L
−30 Load = 150 W || 13 pF
V
= 0.2 V
PP
C
= 13 pF
O
L
−40
−50
−60
C
= 5 pF
L
V
= 2 V
PP
O
C
L
= 20 pF
100
1
10
100
1k
1
10
1k
f − Frequency − MHz
f − Frequency − MHz
Figure 8.
Figure 9.
7
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TYPICAL CHARACTERISTICS (continued)
2nd HARMONIC DISTORTION vs
OUTPUT VOLTAGE
3rd HARMONIC DISTORTION vs
OUTPUT VOLTAGE
-20
-20
V
= 3.3 V
V
= 3.3 V
S
S
F = 8 MHz
Load = 150 W || 13 pF
-30
-40
-50
-60
-70
-80
-30
-40
-50
-60
Load = 150 W || 13 pF
F = 8 MHz
F = 4 MHz
F = 16 MHz
F = 16 MHz
-70
-80
-90
F = 2 MHz
F = 1 MHz
2.5
-90
F = 4 MHz
F = 1 MHz
2
F = 2 MHz
1.5
-100
0.5
1
2
3
0.5
1
1.5
2.5
3
V
− Output Voltage − V
V
− Output Voltage − V
O
PP
O
PP
Figure 10.
Figure 11.
CROSSTALK vs FREQUENCY
SMALL-SIGNAL GAIN vs FREQUENCY
10
0
−30
−40
V
V
= 3.3 V
S
= 1 V
PP
O
R
= 150 W || 13 pF
L
−10
−20
−30
−40
−50
−60
−50
−60
−70
R
= 150 W || 13 pF
L
-
Ch.1 < > Ch.2
R
= 75 W || 13 pF
L
-
Ch.2 < > Ch.3
-
Ch.1 < > Ch.3
V
V
= 5 V
−80
−90
S
= 200 mV
O
PP
0.1
1
10
100
1k
0.1
1
10
100
1k
f − Frequency − MHz
f − Frequency − MHz
Figure 12.
Figure 13.
PHASE vs FREQUENCY
SMALL-SIGNAL GAIN vs FREQUENCY
45
0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
−45
R
= 150 W || 13 pF
−90
L
−135
−180
−225
−270
−315
−360
R
= 75 W || 13 pF
L
V
V
= 5 V
S
- 200 mV
V
V
= 5 V
O
PP
S
R
= 150 W || 13 pF
= 200 mV
L
O
PP
0.1
1
10
100
1
10
100
f − Frequency − MHz
f − Frequency − MHz
Figure 14.
Figure 15.
8
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TYPICAL CHARACTERISTICS (continued)
GROUP DELAY vs FREQUENCY
LARGE-SIGNAL FREQUENCY RESPONSE
25
20
10
0
−10
−20
V
= 5 V
S
−30 Load = 150 W || 13 pF
V
= 0.2 V
PP
O
15
−40
−50
−60
V
= 5 V
S
V
= 200 mV
O
PP
V
= 2 V
PP
O
R
= 150 W || 13 pF
L
10
0.1
1
10
100
1
10
100
1k
4.5
1k
f − Frequency − MHz
f − Frequency − MHz
Figure 16.
Figure 17.
SMALL-SIGNAL FREQUENCY RESPONSE vs
CAPACITIVE LOADING
2nd HARMONIC DISTORTION vs
OUTPUT VOLTAGE
10
0
-20
-30
-40
V
= 5 V
F = 8 MHz
S
Load = 150 W || 13 pF
−10
−20
−30
−40
−50
−60
F = 16 MHz
V
V
= 5 V
S
= 200 mV
-50
-60
O
PP
Load = 150 W || C
L
C
= 13 pF
L
-70
-80
-90
C
= 5 pF
L
F = 4 MHz
F = 1 MHz
3.5
PP
C
L
= 20 pF
100
F = 2 MHz
2.5
1
10
1k
0.5
1
1.5
2
3
4
f − Frequency − MHz
V
− Output Voltage − V
O
Figure 18.
Figure 19.
3rd HARMONIC DISTORTION vs
OUTPUT VOLTAGE
CROSSTALK vs FREQUENCY
-20
−30
V
V
= 5 V
V
= 5 V
S
S
F = 8 MHz
-30
-40
-50
-60
-70
-80
= 1 V
PP
Load = 150 W || 13 pF
O
−40
−50
−60
−70
R
= 150 W || 13 pF
L
F = 4 MHz
F = 16 MHz
-
Ch.1 < > Ch.2
-
Ch.2 < > Ch.3
F = 2 MHz
F = 1 MHz
-
Ch.1 < > Ch.3
−80
−90
-90
-100
0.1
1
10
100
0.5
1
1.5
2
2.5
3
3.5
PP
4
4.5
f − Frequency − MHz
V
− Output Voltage − V
O
Figure 20.
Figure 21.
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TYPICAL CHARACTERISTICS (continued)
QUIESCENT CURRENT vs TEMPERATURE
VOLTAGE GAIN vs TEMPERATURE
6.1
6.08
6.06
6.04
6.02
6
20
V
S
= 5 V
V
V
= 3.3 V
= 5 V
S
S
19.5
19
V
= 3.3 V
S
18.5
5.98
5.96
5.94
18
5.92
5.9
17.5
-40 -30 -20 -10
0
A
10 20 30 40 50 60 70 80 90
− Ambient Temperature − oC
-40 -30 -20 -10
0
A
10 20 30 40 50 60 70 80 90
− Ambient Temperature − oC
T
T
Figure 22.
Figure 23.
ATTENUATION at 27 MHz vs TEMPERATURE
ATTENUATION at 27 MHz vs TEMPERATURE
0.7
0.6
0.5
0.4
33
32
V
= 5 V
V
= 5 V
S
S
31
30
29
0.3
0.2
0.1
0
28
27
-40 -30 -20 -10
0
A
10 20 30 40 50 60 70 80 90
− Ambient Temperature − oC
-40 -30 -20 -10
0
A
10 20 30 40 50 60 70 80 90
− Ambient Temperature − oC
T
T
Figure 24.
Figure 25.
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APPLICATION INFORMATION
The THS7316 is targeted for standard definition video output buffer applications. Although it can be used for
numerous other applications, the needs and requirements of the video signal is an important design parameter
of the THS7316. Built on the Silicon Germanium (SiGe) BiCom-3 process, the THS7316 incorporates many
features not typically found in integrated video parts while consuming low power.
The THS7316 has the following features:
•
•
•
•
Single-Supply 3-V to 5-V operation with low total quiescent current of 18.3-mA at 3.3-V and 19.3-mA at 5-V.
Input configuration accepting DC + Level shift, AC Sync-Tip Clamp.
AC-Biasing is accomplished with the use of an external pull-up resistor to the positive power supply.
5th-Order Low Pass Filter for DAC reconstruction or ADC image rejection:
–
–
36-MHz for HDTV, Y'P'BP'R 720p/1080i, G'B'R' (R'G'B'), and Computer VGA/SVGA/XGA signals.
Can also be used for SDTV (480i, 576i, CVBS, S-Video), and EDTV (480p and 576p) signals if desired.
•
•
Internal fixed gain of 2 V/V (6 dB) buffer that can drive up to 2 video lines per channel with dc coupling or
traditional ac coupling.
Signal flow-through configuration using an 8-pin SOIC package that complies with the latest (RoHS
compatible) and Green manufacturing requirements.
OPERATING VOLTAGE
The THS7316 is designed to operate from 3-V to 5-V over a –40°C to 85°C temperature range. The impact on
performance over the entire temperature range is negligible due to the implementation of thin film resistors and
high quality – low temperature coefficient capacitors.
The power supply pins should have a 0.1-µF to 0.01-µF capacitor placed as close as possible to these pins.
Failure to do so may result in the THS7316 outputs ringing or have an oscillation. Additionally, a large capacitor,
such as 22 µF to 100 µF, should be placed on the power supply line to minimize interference with 50/60 Hz line
frequencies.
INPUT VOLTAGE
The THS7316 input range allows for an input signal range from –0.3 V to about (Vs+– 1.5 V). But, due to the
internal fixed gain of 2 V/V (6 dB) and the internal level shift of nominally 140-mV, the output is generally the
limiting factor for the allowable linear input range. For example, with a 5-V supply, the linear input range is from
–0.3 V to 3.5 V. However, due to the gain and level shift, the linear output range limits the allowable linear input
range to be from about –0.1 V to 2.3 V.
INPUT OVERVOLTAGE PROTECTION
The THS7316 is built using a high-speed complementary bipolar and CMOS process. The internal junction
breakdown voltages are low for these small geometry devices. These breakdowns are reflected in the Absolute
Maximum Ratings table. All input and output device pins are protected with internal ESD protection diodes to the
power supplies, as shown in Figure 26.
+ Vs
External
Input/
Output
Internal
Circuitry
Pin
Figure 26. Internal ESD Protection
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APPLICATION INFORMATION (continued)
These diodes provide moderate protection to input overdrive voltages above and below the supplies as well. The
protection diodes can typically support 30-mA of continuous current when overdriven.
TYPICAL CONFIGURATION and VIDEO TERMINOLOGY
A typical application circuit using the THS7316 as a video buffer is shown in Figure 27. It shows a DAC (or
encoder such as the THS8200) driving the three input channels of the THS7316. Although these channels show
HDTV Y'P'BP'R (sometimes labeled Y'C'BC'R) signals of a 720p or 1080i system, they can also be G'B'R' (R'G'B')
signals or other variations.
Note that the Y' term is used for the luma channels throughout this document rather than the more common
luminance (Y) term. The reason is to account for the definition of luminance as stipulated by the CIE –
International Commission on Illumination. Video departs from true luminance since a nonlinear term, gamma, is
added to the true RGB signals to form R'G'B' signals. These R'G'B' signals are then used to mathematically
create luma (Y'). Thus luminance (Y) is not maintained providing a difference in terminology.
This rationale is also used for the chroma (C') term. Chroma is derived from the non-linear R'G'B' terms and thus
it is nonlinear. Chominance (C) is derived from linear RGB giving the difference between chroma (C') and
chrominance (C). The color difference signals (P'B / P'R / U' / V') are also referenced this way to denote the
nonlinear (gamma corrected) signals.
R'G'B' (commonly mislabeled RGB) is also called G’B’R’ (again commonly mislabeled as GBR) in professional
video systems. The SMPTE component standard stipulates that the luma information is placed on the first
channel, the blue color difference is placed on the second channel, and the red color difference signal is placed
on the third channel. This is consistent with the Y'P'BP'R nomenclature. Because the luma channel (Y') carries
the sync information and the green channel (G') also carries the sync information, it makes logical sense that G'
be placed first in the system. Since the blue color difference channel (P'B) is next and the red color difference
channel (P'R) is last, then it also makes logical sense to place the B' signal on the second channel and the R'
signal on the third channel respectfully. Thus hardware compatibility is better achieved when using G'B'R' rather
than R'G'B'. Note that for many G'B'R' systems sync is embedded on all three channels, but may not always be
the case in all systems.
3.3 V
Y’ Out
330 mF
75 W
+
DAC/
Encoder
75 W
Y’
THS7316
R
R
P’ Out
B
CH.1 IN
CH.2 IN
CH.3 IN
CH.1 OUT
330 mF
+
1
2
3
4
8
7
6
5
75 W
HDTV
720p/1080i
Y’P’ P’
P’
CH.2 OUT
CH.3 OUT
GND
B
B
R
75 W
G’B’R’
VGA
V
S+
SVGA
XGA
P’ Out
R
P’
R
330 mF
0.1 mF
75 W
R
+
75 W
22 mF
3 V to 5 V
Figure 27. Typical HDTV Y'/P'B/P'R Inputs From DC-Coupled Encoder/DAC
With AC-Coupled Line Driving
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APPLICATION INFORMATION (continued)
INPUT MODE OF OPERATION – DC
The inputs to the THS7316 allows for both ac-coupled and dc-coupled inputs. Many DACs or Video Encoders
can be dc connected to the THS7316. One of the drawbacks to dc coupling is when 0-V is applied to the input.
Although the input of the THS7316 allows for a 0-V input signal with no issues, the output swing of a traditional
amplifier cannot yield a 0-V signal resulting in possible clipping. This is true for any single-supply amplifier due to
the limitations of the output transistors. Both CMOS and bipolar transistors cannot go to 0-V while sinking
current. This trait of a transistor is also the same reason why the highest output voltage is always less than the
power supply voltage when sourcing current.
This output clipping can reduce the sync amplitudes (both horizontal and vertical sync amplitudes) on the video
signal. A problem occurs if the receiver of this video signal uses an AGC loop to account for losses in the
transmission line. Some video AGC circuits derive gain from the horizontal sync amplitude. If clipping occurs on
the sync amplitude, then the AGC circuit can increase the gain too much – resulting in too much amplitude gain
correction. This may result in a picture with an overly bright display with too much color saturation.
It is good engineering design practice to ensure saturation/clipping does not take place. Transistors always take
a finite amount of time to come out of saturation. This saturation could possibly result in timing delays or other
aberrations on the signals.
To eliminate saturation/clipping problems, the THS7316 has a dc + 140-mV input shift feature. This feature takes
the input voltage and adds an internal +140-mV shift to the signal. Since the THS7316 also has a gain of 6 dB
(2 V/V), the resulting output with a 0-V applied input signal is about 280-mV. The THS7316 rail-to-rail output
stage can create this output level while connected to a typical video load. This ensures that no saturation /
clipping of the sync signals occur. This is a constant shift regardless of the input signal. For example, if a 1-V
input is applied, the output is at 2.28-V.
Because the internal gain is fixed at 6 dB, the gain dictates what the allowable linear input voltage range can be
without clipping concerns. For example, if the power supply is set to 3-V, the maximum output is about 2.9-V
while driving a significant amount of current. Thus, to avoid clipping, the allowable input is ((2.9 V / 2) – 0.14 V)
= 1.31 V. This is true for up to the maximum recommended 5-V power supply that allows about a ((4.9V / 2) –
0.14 V) = 2.31 V input range while avoiding clipping on the output.
The input impedance of the THS7316 in this mode of operation is dictated by the internal 800-kΩ pull-down
resistor. This is shown in Figure 28. Note that the internal voltage shift does not appear at the input pin, only the
output pin.
+ Vs
Internal
Circuitry
Input
+
-
kW
800
140 mV Level
Shifter
Figure 28. Equivalent DC Input Mode Circuit
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APPLICATION INFORMATION (continued)
INPUT MODE OF OPERATION – AC SYNC TIP CLAMP
Some video DACs or encoders are not referenced to ground but rather to the positive power supply. These
DACs typically only sink current rather than the more traditional current sourcing DAC where the resistor is
referenced to ground. The resulting video signals can be too high of a voltage for a dc-coupled video buffer to
function properly. To account for this scenario the THS7316 incorporates a sync-tip clamp circuit. This function
requires a capacitor (nominally 0.1 µF) to be in series with the input. Note that while the term sync-tip-clamp is
used throughout this document, it should be noted that the THS7316 is be better termed as a dc-restoration
circuit based on how this function is performed. This circuit is an active clamp circuit and not a passive diode
clamp function.
The input to the THS7316 has an internal control loop which sets the lowest input applied voltage to clamp at
ground (0-V). By setting the reference at 0-V, the THS7316 allows a dc-coupled input to also function. Hence,
the STC is considered transparent since it does not operate unless the input signal goes below ground. The
signal then goes through the same 140-mV level shifter resulting in an output voltage low level of 280-mV. If the
input signal tries to go below the 0-V, the internal control loop of the THS7316 will source up to 3-mA of current
to increase the input voltage level on the THS7316 input side of the coupling capacitor. As soon as the voltage
goes above the 0-V level, the loop stops sourcing current and becomes high impedance.
One of the concerns about the sync-tip-clamp level is how the clamp reacts to a sync edge that has
overshoot—common in VCR signals or reflections found in poor PCB layouts. Ideally the STC should not react
to the overshoot voltage of the input signal. Otherwise, this could result in clipping on the rest of the video signal
as it may raise the bias voltage too much.
To help minimize this input signal overshoot problem, the control loop in the THS7316 has an internal low-pass
filter as shown in Figure 29. This filter reduces the response time of the STC circuit. This delay is a function of
how far the voltage is below ground, but in general it is about a 80-ns delay. The effect of this filter is to slow
down the response of the control loop so as not to clamp on the input overshoot voltage, but rather the flat
portion of the sync signal.
As a result of this delay, the sync may have an apparent voltage shift. The amount of shift is dependant upon
the amount of droop in the signal as dictated by the input capacitor and the STC current flow. Because the sync
is primarily for timing purposes with syncing occurring on the edge of the sync signal, this shift is transparent in
most systems.
While this feature may not fully eliminate overshoot issues on the input signal for excessive overshoot and/or
ringing, the STC system should help minimize improper clamping levels. As an additional method to help
minimize this issue, an external capacitor (ex: 10 pF to 47 pF) to ground in parallel with the external termination
resistors can help filter overshoot problems.
It should be noted that this STC system is dynamic and does not rely upon timing in any way. It only depends on
the voltage appearing at the input pin at any given point in time. The STC filtering helps minimize level shift
problems associated with switching noises or very short spikes on the signal line. This helps ensure a very
robust STC system.
+Vs
+Vs
STC LPF
Comparator
Internal
Circuitry
+
-
Input
Pin
Input
+
-
0.1 mF
kW
800
140 mV Level
Shifter
Figure 29. Equivalent AC Sync Tip Clamp Input Circuit
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APPLICATION INFORMATION (continued)
When the AC Sync-Tip-Clamp (STC) operation is used, there must also be some finite amount of discharge bias
current. As previously described, if the input signal goes below the 0-V clamp level, the internal loop of the
THS7316 will source current to increase the voltage appearing at the input pin. As the difference between the
signal level and the 0-V reference level increases, the amount of source current increases
proportionally—supplying up to 3-mA of current. Thus the time to re-establish the proper STC voltage can be
fast. If the difference is small, then the source current is also small to account for minor voltage droop.
But, what happens if the input signal goes above the 0-V input level? The problem is the video signal is always
above this level, and must not be altered in any way. But if the Sync level of the input signal is above this 0-V
level, then the internal discharge (sink) current will discharge the ac-coupled bias signal to the proper 0-V level.
This discharge current must not be large enough to alter the video signal appreciably, or picture quality issues
may arise. This is often seen by looking at the tilt (aka droop) of a constant luma signal being applied and
looking at the resulting output level. The associated change in luma level from the beginning of the video line to
the end of the video line is the amount of line tilt (droop).
If the discharge current is small, the amount of tilt is low which is good. But, the amount of time for the system to
capture the sync signal could be too long. This is also termed hum rejection. Hum arises from the ac line voltage
frequency of 50-Hz or 60-Hz. The value of the discharge current and the ac-coupling capacitor combine to
dictate the hum rejection and the amount of line tilt.
To allow for both dc-coupling and ac-coupling in the same part, the THS7316 incorporates an 800-kΩ resistor to
ground. Although a true constant current sink is preferred over a resistor, there are significant issues when the
voltage is near ground. This can cause the current sink transistor to saturate and cause potential problems with
the signal. This resistor is large enough as to not impact a dc-coupled DAC termination. For discharging an
ac-coupled source, Ohm’s Law is used. If the video signal is 1 V, then there is 1 V / 800 kΩ = 1.25-µA of
discharge current. If more hum rejection is desired or there is a loss of sync occurring, then decrease the 0.1-µF
input coupling capacitor. A decrease from 0.1 µF to 0.047 µF increases the hum rejection by a factor of 2.1.
Alternatively an external pull-down resistor to ground may be added which decreases the overall resistance, and
ultimately increases the discharge current.
To ensure proper stability of the AC STC control loop, the source impedance must be less than 1-kΩ with the
input capacitor in place. Otherwise, there is a possibility of the control loop to ring and this ringing may appear
on the output of the THS7316. Because most DACs or encoders use resistors to establish the voltage, which
are typically less than 300-Ω, then meeting the <1-kΩ requirement is done. But, if the source impedance looking
from the THS7316 input perspective is high, then add a 1-kΩ resistor to GND to ensure proper operation of the
THS7316.
INPUT MODE OF OPERATION – AC BIAS
Sync tip clamps work well for signals that have horizontal and/or vertical syncs associated with them. But, some
video signals do not have a sync embedded within the signal – such as Chroma or the P’B and P’R channels of a
480i/480p/576i/576p signal; or the bottom of the sync is not the lowest possible level of the video signal – such
as the P’B and P’R channels of a 720p and 1080i signal. If ac-coupling of these signals is desired, then a dc bias
is required to properly set the dc operating point within the THS7316. This function is easily accomplished with
the THS7316 by adding an external pull-up resistor to the positive power supply as shown in Figure 30.
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APPLICATION INFORMATION (continued)
3.3 V
3.3 V
Internal
Circuitry
3.01 MW
Input
+
-
Input
Pin
Cin
800 kW
140 mV Level
Shifter
Figure 30. AC-Bias Input Mode Circuit Configuration
The dc voltage appearing at the input pin is approximately equal to:
800k
800k ) R
+ V ǒ Ǔ
V
DC
S
PU
(1)
The THS7316 allowable input range is approximately (+Vs – 1.5V) which allows for a wide input voltage range.
As such, the input dc-bias point is flexible with the output dc-bias point being the primary factor. For example, if
the output dc-bias point is desired to be 1.65-V on a 3.3-V supply, then the input dc-bias point should be (1.65 V
– 280 mV) /2 = 0.685 V. Thus, the pull-up resistor calculates to about 3.01-MΩ resulting in 0.693 V. If the input
dc-bias point is desired to be 0.685 V with a 5-V power supply, then the pull-up resistor calculates to about
5.1-MΩ.
The internal 800-kΩ resistor has approximately a ±20% variance. As such, the calculations should take this into
account. For the 0.693 V example above using an ideal 3.01-MΩ resistor, the input dc-bias voltage is about
0.693 V ±0.11 V.
One other issue that must be taken into account is that the dc-bias point is a function of the power supply. As
such, there may be an impact on power supply rejection (PSRR) on the system. To help reduce the impact, the
input capacitor combined with the pull-up resistance functions as a low-pass filter. Additionally, the time to
charge the capacitor to the final dc-bias point is also a function of the pull-up resistor and the input capacitor.
Lastly, the input capacitor forms a high-pass filter with the parallel impedance of the pull-up resistor and the
800-kΩ resistor. It is good to have this high pass filter at about 3-Hz to minimize any potential droop on a P'B,
P'R, or non-sync signals. A 0.1-µF input capacitor with a 3.01-MΩ pull-up resistor equates to about a 2.5-Hz
high-pass corner frequency.
This mode of operation is recommended for use with chroma (C'), P’B, P'R, U', V', and non-sync B' and/or R'
signals.
OUTPUT MODE OF OPERATION – DC COUPLED
The THS7316 incorporates a rail-to-rail output stage that can be used to drive the line directly without the need
for large ac-coupling capacitors as shown in Figure 31. This offers the best line tilt and field tilt (or droop)
performance since there is no ac-coupling occurring. Remember that if the input is ac-coupled, then the resulting
tilt due to the input ac-coupling is seen on the output regardless of the output coupling. The 80-mA output
current drive capability of the THS7316 was designed to drive two video lines per channel simultaneously –
essentially a 75-Ω load – while keeping the output dynamic range as wide as possible.
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APPLICATION INFORMATION (continued)
3.3 V
Y’ / G’ Out
75 W
DAC/
Encoder
75 W
Y’ / G’
P’B / B’
THS7316
R
R
P’ / B’ Out
B
75 W
CH.1 IN
CH.2 IN
CH.3 IN
CH.1 OUT
1
2
3
4
8
7
6
5
HDTV
720p/1080i
Y’P’ P’
CH.2 OUT
CH.3 OUT
GND
B
R
75 W
G’B’R’
VGA
V
S+
SVGA
XGA
P’R / R’ Out
P’ / R’
R
0.1 mF
75 W
R
+
75 W
22 mF
3 V to 5 V
Figure 31. Typical HDTV Y'P'BP'R / G'B'R' System with DC-Coupled Line Driving
One concern of dc-coupling is if the line is terminated to ground. If the ac-bias input configuration is used, the
output of the THS7316 will have a dc-bias on the output. With 2 lines terminated to ground, this creates a
dc-current path to exist which results in a slightly decreased high output voltage swing and resulting in an
increase in power dissipation of the THS7316. While the THS7316 was designed to operate with a junction
temperature of up to 125°C, care must be taken to ensure that the junction temperature does not exceed this
level or else long term reliability could suffer. Although this configuration only adds less then 10 mW of power
dissipation per channel, the overall low power dissipation of the THS7316 design minimizes potential thermal
issues even when using the SOIC package at high ambient temperatures.
Another concern of dc coupling is the blanking level voltage of the video signal. The EIA specification dictates
that the blanking level shall be 0 V ±1 V. While there is some question as to whether this voltage is at the output
of the amplifier or at the receiver, it is generally regarded to be measured at the receiver side of a system as the
rest of the specification voltage requirements are given with doubly terminated connections present. With the
rail-to-rail output swing capability, combined with the 140-mV input level shift, meeting this requirement is
accomplished. Thus, elimination of the large output ac-coupling capacitor can be done while still meeting the EIA
specification. This can save significant PCB area and costs.
Note that the THS7316 can drive the line with dc-coupling regardless of the input mode of operation. The only
requirement is to make sure the video line has proper termination in series with the output – typically 75-Ω. This
helps isolate capacitive loading effects from the THS7316 output. Failure to isolate capacitive loads may result in
instabilities with the output buffer potentially causing ringing or oscillations to appear. The stray capacitance
appearing directly at the THS7316 output pins should be kept below 20-pF.
OUTPUT MODE OF OPERATION – AC COUPLED
The most common method of coupling the video signal to the line is with the use of a large capacitor. This
capacitor is typically between 220-µF and 1000-µF, although 330-µF is common. This value of this capacitor
must be this large to minimize the line tilt (droop) and/or field tilt associated with ac-coupling as described
previously in this document. AC-coupling is done for several reasons, but the most common reason is to ensure
full inter-operability with the receiving video system. This ensures that regardless of the reference dc voltage
used on the transmit side, the receive side will re-establish the dc reference voltage to its own requirements, and
meets EIA specifications.
Like the dc-output mode of operation, each line should have a 75-Ω source termination resistor in series with the
ac-coupling capacitor. If 2 lines are to be driven, it is best to have each line use its own capacitor and resistor
rather than sharing these components as shown in Figure 32. This helps ensure line-to-line dc isolation and the
potential problems as stipulated previously. Using a single 1000-µF capacitor for 2-lines can be done, but there
is a chance for interference to be created between the two receivers.
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APPLICATION INFORMATION (continued)
Due to the edge rates and frequencies of operation, it is recommended – but not required – to place a 0.1-µF to
0.01-µF capacitor in parallel with the large 220-µF to 1000-µF capacitor. These large value capacitors are most
commonly aluminum electrolytic. These capacitors have significantly large ESR (equivalent series resistance),
and their impedance at high frequencies is large due to the associated inductances involved with the leads and
construction. The small 0.1-µF to 0.01-µF capacitors help pass these high frequency (>1 MHz) signals with
much lower impedance than the large capacitors.
Although it is common to use the same capacitor values for all the video lines, the frequency bandwidth of the
chroma signal in a S-Video system are not required to go as low – or as high of a frequency – as the luma
channels. Thus the capacitor values of the chroma line(s) can be smaller – such as 0.1-µF.
Y’
Out 1
330 mf
(Note A)
75 W
+
75 W
Y’
330 mf
Out 2
(Note A)
75 W
3.3 V
Y’
+
3.3 V
3.3V
3.3V
75 W
75 W
75 W
75 W
75 W
R
R
R
0.1 mF
P’B
Out 1
330 mf
(Note A)
DAC/
Encoder
3.3 V
3.3 V
75 W
75 W
75 W
75 W
THS7314
+
3.01 MW
0.1 mF
CH.1 IN
CH.2 IN
CH.3 IN
CH.1 OUT
1
2
3
4
8
7
6
5
CH.2 OUT
CH.3 OUT
GND
HDTV
720p/1080i
Y’P’ P’
P’B
P’R
P’B
Out 2
330 mf
(Note A)
+
3.01 MW
0.1 mF
B
R
V
S+
G’B’R’
0.1 mF
P’R
Out 1
330 mf
(Note A)
+
+
22 mF
3.3 V
P’R
Out 2
330 mf
(Note A)
+
A. Due to the high frequency content of the video signal, it is recommended, but not required, to add a 0.1-µF or
0.01-µF capacitor in parallel with these large capacitors.
B. Current sinking DAC / Encoder shown. See the application notes.
Figure 32. Typical 480i/576i Y'P'BP'R AC-Input System Driving 2 AC-Coupled Video Lines
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APPLICATION INFORMATION (continued)
LOW PASS FILTER
Each channel of the THS7316 incorporates a 5th-Order Low Pass Filter. These video reconstruction filters
minimize DAC images from being passed onto the video receiver. Depending on the receiver design, failure to
eliminate these DAC images can cause picture quality problems due to aliasing of the ADC. Another benefit of
the filter is to smooth out aberrations in the signal which some DACs can have if their own internal filtering is not
good. This helps with picture quality and helps insure the signal meets video bandwidth requirements.
Each filter in the THS7316 is associated with a Butterworth characteristic. The benefit of the Butterworth
response is that the frequency response is flat with a relatively steep initial attenuation at the corner frequency.
The problem is that the group delay rises near the corner frequency. Group delay is defined as the change in
phase (radians/second) divided by a change in frequency. An increase in group delay corresponds to a time
domain pulse response that has overshoot and some possible ringing associated with the overshoot.
The use of other type of filters, such as elliptic or chebyshev, are not recommended for video applications due to
their very large group delay variations near the corner frequency resulting in significant overshoot and ringing.
While these elliptic or chebyshev filters may help meet the video standard specifications with respect to
amplitude attenuation, their group delay is beyond the standard specifications. Coupled with the fact that video
can go from a white pixel to a black pixel over and over again, ringing can occur. Ringing typically causes a
display to have ghosting or fuzziness appear on the edges of a sharp transition. However, a Bessel filter has an
ideal group delay response, but the rate of attenuation is typically too low for acceptable image rejection. Thus
the Butterworth filter is a respectable compromise for both attenuation and group delay.
The THS7316 filters have a nominal corner (-3dB) frequency at 36-MHz and a –1 dB passband typically at
31-MHz. This 36-MHz filter is ideal for High Definition (HD) 720p and 1080i signals. For systems that
oversample significantly, the THS7316 can also be useful for Standard Definition (SD) NTSC and PAL signals
such as 480i/576i Y'P'BP'R, Y'U'V', and broadcast G’B’R’ (R’G’B’) signals. It can also be useful with Enhanced
Definition (ED) signals including 480p/576p Y'P'BP'R, Y'U'V', broadcast G’B’R’ (R’G’B’) signals, and computer
video signals.
The 36-MHz -3dB corner frequency was designed to allow a maximally flat video signal while achieving 30-dB of
attenuation at 74.25-MHz – a common sampling frequency between the DAC/ADC 2nd and 3rd Nyquist zones
found in many video systems. This is important because any signal appearing around this frequency can appear
in the baseband due to aliasing effects of an analog to digital converter found in a receiver. Keep in mind that
DAC images do not stop at 74.25 MHz, they continue around the sampling frequencies of 148.5 MHz,
222.75-MHz, 297-MHz, etc. Because of these multiple images that an ADC can fold down into the baseband
signal, the low pass filter must also eliminate these higher order images. The THS7316 has over 50-dB
attenuation at 148.5-MHz, over 50-dB attenuation at 222.75-MHz, and about 55-dB attenuation at 297-MHz.
Attenuation to 1-GHz is at least 36-dB which makes sure that images do not effect the desired video baseband
signal.
The 36-MHz filter frequency was chosen to account for process variations in the THS7316. To ensure the
required video frequencies are not affected, the filter corner frequency must be high enough to allow component
variations. The other consideration is the attenuation must be large enough to ensure the anti-aliasing /
reconstruction filtering is enough to meet the system demands. Thus, the filter frequencies were not arbitrarily
selected.
19
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SLOS521–MARCH 2007
APPLICATION INFORMATION (continued)
BENEFITS OVER PASSIVE FILTERING
Two key benefits of using an integrated filter system, such as the THS7316, over a passive system is PCB area
and filter variations. The small SOIC-8 package for 3-video channels is much smaller over a passive RLC
network, especially a 5-pole passive network. Add in the fact that inductors have at best ±10% tolerances
(normally ±15% to ±20% is common) and capacitors typically have ±10% tolerances. Using a Monte Carlo
analysis shows that the filter corner frequency (–3 dB), flatness (–1 dB), Q factor (or peaking), and
channel-to-channel delay has wide variations. This can lead to potential performance and quality issues in
mass-production environments. The THS7316 solves most of these problems by using the corner frequency as
essentially the only variable.
One concern about an active filter in an integrated circuit is the variation of the filter characteristics when the
ambient temperature and the subsequent die temperature changes. To minimize temperature effects, the
THS7316 uses low temperature coefficient resistors and high quality – low temperature coefficient capacitors
found in the BiCom-3 process. The filters have been specified by design to account for process variations and
temperature variations to maintain proper filter characteristics. This maintains a low channel-to-channel time
delay which is required for proper video signal performance.
Another benefit of a THS7316 over a passive RLC filter are the input and output impedances. The input
impedance presented to the DAC varies significantly with a passive network and may cause voltage variations
over frequency. The THS7316 input impedance is 800-kΩ and only the 2-pF input capacitance plus the PCB
trace capacitance impacting the input impedance. As such, the voltage variation appearing at the DAC output is
better controlled with the THS7316.
On the output side of the filter, a passive filter will again have a impedance variation over frequency. The
THS7316 is an op-amp which approximates an ideal voltage source. A voltage source is desirable because the
output impedance is very low and can source and sink current. To properly match the transmission line
characteristic impedance of a video line, a 75-Ω series resistor is placed on the output. To minimize reflections
and to maintain a good return loss, this output impedance must maintain a 75-Ω impedance. A passive filter
impedance variation is not specified while the THS7316 has approximately 0.5-Ω of output impedance at 10
MHz. Thus, the system is matched better with a THS7316 compared to a passive filter.
One last benefit of the THS7316 over a passive filter is power dissipation. A DAC driving a video line must be
able to drive a 37.5-Ω load - the receiver 75-Ω resistor and the 75-Ω impedance matching resistor next to the
DAC to maintain the source impedance requirement. This forces the DAC to drive at least 1.25-V peak (100%
Saturation CVBS) / 37.5 Ω = 33.3 mA. A DAC is a current steering element and this amount of current flows
internally to the DAC even if the output is 0-V. Thus, power dissipation in the DAC may be high - especially
when 6-channels are being driven. Using the THS7316, with a high input impedance and the capability to drive
up to 2-video lines per channel, can reduce the DAC power dissipation significantly. This is because the
resistance the DAC is driving can be substantially increased. It is common to set this in a DAC by a current
setting resistor on the DAC. Thus, the resistance can be 300-Ω or more - substantially reducing the current drive
demands from the DAC and saving substantial amount of power. For example, a 3.3-V 6-Channel DAC
dissipates 660 mW just for the steering current capability (6 ch x 33.3 mA x 3.3 V) if it needs to drive 37.5-Ω
load. With a 300-Ω load, the DAC power dissipation due to current steering current would only be 82.5 mW (6 ch
X 4.16 mA X 3.3 V).
20
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SLOS521–MARCH 2007
EVALUATION MODULE
To evaluate the THS7316, an evaluation module (EVM) is available. This allows for testing of the THS7316 in
many different systems. Inputs and outputs include RCA connectors for consumer grade interconnections, or
BNC connectors for higher level lab grade connections. Several unpopulated component pads are found on the
EVM to allow for different input and output configurations as dictated by the user.
Figure 33 shows the schematic of the THS7316 EVM. Figure 34 and Figure 35 shows the top layer and bottom
layer of the EVM which incorporates standard high-speed layout practices. The bill of materials is shown in
Table 1 as supplied from Texas Instruments.
+
Figure 33. THS7316D EVM
Figure 34. Top View
21
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SLOS521–MARCH 2007
EVALUATION MODULE (continued)
Figure 35. Bottom View
Table 1. THS7316D EVM
Bill of Materials
MANUFACTURER PART
NUMBER
DISTRIBUTOR PART
NUMBER
ITEM
REF DES
QTY
DESCRIPTION
SMD SIZE
(DIGI-KEY)
445-1569-1-ND
1
FB1
1
BEAD, FERRITE, 2.5A, 330 OHM
0805
(TDK) MPZ2012S331A
(AVX)
TPSC107K010R0100
(DIGI-KEY)
478-1765-1-ND
2
3
4
C16
C17, C18, C19
C15
1
3
1
CAP, 100µF, TAN, 10V, 10%, LO ESR
OPEN
C
0603
0603
(GARRETT)
0603YC104KAT2A
CAP, 0.1µF, CERAMIC, 16V, X7R
(AVX) 0603YC104KAT2A
C1, C2, C3, C12,
C13, C14
5
6
6
1
3
1
3
6
9
6
OPEN
0805
0805
0805
0805
F
(DIGI-KEY)
478-1358-1-ND
C5
CAP, 0.01µF, CERAMIC, 100V, X7R
CAP, 0.1µF, CERAMIC, 50V, X7R
CAP, 1µF, CERAMIC, 16V, X7R
CAP, ALUM, 470µF, 10V, 20%
OPEN
(AVX) 08051C103KAT2A
(AVX) 08055C104KAT2A
(TDK) C2012X7R1C105K
(DIGI-KEY)
478-1395-1-ND
7
C7, C9, C11
C4
(DIGI-KEY)
445-1358-1-ND
8
(CORNELL)
AFK477M10F24B
9
C6, C8, C10
(NEWARK) 97C7597
RX1, RX2, RX3,
RX4, RX5, RX6
10
11
12
0603
0805
0805
R4, R5, R6, R7, R8,
R9, Z1, Z2, Z3
(DIGI-KEY)
RHM0.0ACT-ND
RESISTOR, 0 OHM
(ROHM) MCR10EZHJ000
(ROHM) MCR10EZHF75.0
R1, R2, R3, R10,
R11, R12
(DIGI-KEY)
RHM75.0CCT-ND
RESISTOR, 75 OHM, 1/8W, 1%
22
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SLOS521–MARCH 2007
EVALUATION MODULE (continued)
Table 1. THS7316D EVM (continued)
MANUFACTURER PART
NUMBER
DISTRIBUTOR PART
NUMBER
ITEM
REF DES
QTY
DESCRIPTION
SMD SIZE
JACK, BANANA RECEPTANCE, 0.25"
DIA. HOLE
13
J9, J10
2
6
(SPC) 813
(NEWARK) 39N867
(NEWARK) 93F7554
J1, J2, J3, J6, J7,
J8
(AMPHENOL)
31-5329-72RFX
14
CONNECTOR, BNC, JACK, 75 OHM
15
16
17
18
19
20
21
J4, J5
TP1, TP2, TP3
TP4, TP5
U1
2
3
2
1
4
4
1
CONNECTOR, RCA, JACK, R/A
TEST POINT, RED
(CUI) RCJ-32265
(DIGI-KEY) CP-1446-ND
(DIGI-KEY) 5000K-ND
(DIGI-KEY) 5001K-ND
(KEYSTONE) 5000
(KEYSTONE) 5001
(TI) THS7316D
TEST POINT, BLACK
IC, THS7316
D
STANDOFF, 4-40 HEX, 0.625" LENGTH
SCREW, PHILLIPS, 4-40, .250"
BOARD, PRINTED CIRCUIT
(KEYSTONE) 1808
(BF) PMS 440 0031 PH
EDGE # 6483761 REV. A
(NEWARK) 89F1934
(DIGI-KEY) H343-ND
EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR
EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general
consumer use. Persons handling the product(s) must have electronics training and observe good engineering
practice standards. As such, the goods being provided are not intended to be complete in terms of required
design-, marketing-, and/or manufacturing-related protective considerations, including product safety and
environmental measures typically found in end products that incorporate such semiconductor components or
circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives
regarding electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and
therefore may not meet the technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be
returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE
EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,
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FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user
indemnifies TI from all claims arising from the handling or use of the goods. Due to the open construction of the
product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic
discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE
TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior
to handling the product. This notice contains important safety information about temperatures and voltages. For
additional information on TI’s environmental and/or safety programs, please contact the TI application engineer
or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any
machine, process, or combination in which such TI products or services might be or are used.
23
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SLOS521–MARCH 2007
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR
EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general
consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for
compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to
provide reasonable protection against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which case the user at his own expense
will be required to take whatever measures may be required to correct this interference.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 2.85 V to 5.5 V single supply and the
output voltage range of 0 V to 5.5 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM.
If there are questions concerning the input range, please contact a TI field representative prior to connecting
the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible
permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM
output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 85°C. The EVM
is designed to operate properly with certain components above 85°C as long as the input and output ranges
are maintained. These components include but are not limited to linear regulators, switching transistors, pass
transistors, and current sense resistors. These types of devices can be identified using the EVM schematic
located in the EVM User's Guide. When placing measurement probes near these devices during operation,
please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
24
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
2-Apr-2007
PACKAGING INFORMATION
Orderable Device
THS7316D
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
75 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
THS7316DR
SOIC
SOIC
D
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
THS7316DRG4
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号：
THS7327
3-Channel RGBHV Video Buffer with I2C Control, Selectable Filters, Monitor Pass-Thru,2:1 Input MUX, and Selectable Input Bias Modes
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