TL1593CNS [TI]

780- 】 488-pixel ccd image sensor; 780- 】 488像素的CCD图像传感器
TL1593CNS
型号: TL1593CNS
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

780- 】 488-pixel ccd image sensor
780- 】 488像素的CCD图像传感器

传感器 图像传感器 CD
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TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
DUAL-IN-LINE PACKAGE  
(TOP VIEW)  
High-Resolution, Solid-State Image Sensor  
for NTSC B/W TV Applications  
11-mm Image-Area Diagonal, Compatible  
With 2/3” Vidicon Optics  
1
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
SUB  
IAG  
SUB  
ABG  
IAG  
2
754 (H) x 244 (V) Active Elements in  
Image-Sensing Area  
3
SAG  
Low Dark Current  
4
TDB  
SAG  
SRG3  
SRG2  
SRG1  
TRG  
IDB  
Electron-Hole Recombination Antiblooming  
Dynamic Range . . . More Than 60 dB  
High Sensitivity  
5
ADB  
6
OUT3  
OUT2  
OUT1  
AMP GND  
GND  
High Photoresponse Uniformity  
High Blue Response  
7
8
Single-Phase Clocking  
9
Solid-State Reliability With No Image  
Burn-in, Residual Imaging, Image  
Distortion, Image Lag, or Microphonics  
10  
11  
CDB  
SUB  
SUB  
description  
The TC241 is a frame-transfer charge-coupled device (CCD) image sensor designed for use in single-chip B/W  
NTSC TV applications. The device is intended to replace a 2/3-inch vidicon tube in applications requiring small  
size, high reliability, and low cost.  
The image-sensing area of the TC241 is configured into 244 lines with 780 elements in each line. Twenty-four  
elements are provided in each line for dark reference. The blooming-protection feature of the sensor is based  
on recombining excess charge with charge of opposite polarity in the substrate. This antiblooming is activated  
by supplying clocking pulses to the antiblooming gate, which is an integral part of each image- sensing element.  
The sensor is designed to operate in an interlace mode, electronically displacing the image-sensing elements  
by one-half of a vertical line during the charge integration period in alternate fields, effectively increasing the  
vertical resolution and minimizing aliasing. The device can also be run as a 754 (H) by 244 (V) noninterlaced  
sensor with significant reduction in the dark signal.  
Agatedfloating-diffusiondetectionstructurewithanautomaticresetandvoltagereferenceincorporatedon-chip  
converts charge to signal voltage. A low-noise, two-stage, source-follower amplifier buffers the output and  
provides high output-drive capability.  
The TC241 is built using TI-proprietary virtual-phase technology, which provides devices with high blue  
response, low dark current, high photoresponse uniformity, and single-phase clocking.  
The TC241 is characterized for operation from –10°C to 45°C.  
This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together  
or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to SUB. Under no  
circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUTn to ADB during operation to prevent  
damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is  
allowed to flow. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling  
Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.  
Copyright 1991, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
functional block diagram  
Top Drain  
21  
20  
ABG  
IAG  
2
Image Area With  
Blooming Protection  
IAG  
4
TDB  
3
Dark-Reference Elements  
Storage Area  
SAG  
Amplifiers  
5
ADB  
6
OUT3  
19  
SAG  
Multiplexer, Transfer  
Gates and Serial Registers  
7
18  
17  
16  
OUT2  
SRG3  
SRG2  
SRG1  
8
OUT1  
15  
TRG  
Clearing Drain  
13  
6 Dummy  
Elements  
9
10  
GND  
14  
CDB IDB  
AMP GND  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
sensor topology diagram  
780  
3
1
753  
24  
1
Image-Sensing  
Area  
244  
488  
Image-Storage  
Area  
One 1/2-Amplitude Element  
7
251  
251  
251  
8
8
One 1/2-Amplitude Element  
6 Dummy  
Columns  
Terminal Functions  
TERMINAL  
NAME NO.  
I/O  
DESCRIPTION  
ABG  
ADB  
21  
5
I
I
Antiblooming gate  
Supply voltage for amplifier-drain bias  
Amplifier ground  
AMP GND  
CDB  
9
13  
10  
2
I
Supply voltage for clearing-drain bias  
Ground  
GND  
IAG  
IAG  
I
I
Image-area gate  
20  
14  
8
Image-area gate  
IDB  
I
Supply voltage for input diode bias  
Output signal 1  
OUT1  
OUT2  
OUT3  
O
O
O
I
7
Output signal 2  
6
Output signal 3  
SAG  
SAG  
3
Storage-area gate  
19  
16  
17  
18  
1
I
Storage-area gate  
SRG1  
SRG2  
SRG3  
I
Serial-register gate 1  
Serial-register gate 2  
Serial-register gate 3  
Substrate and clock return  
Substrate and clock return  
Substrate and clock return  
Substrate and clock return  
Supply voltage for top-drain bias  
Transfer gate  
I
I
SUB  
SUB  
SUB  
SUB  
11  
12  
22  
4
TDB  
TRG  
I
I
15  
All pins of the same name should be connected together externally.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
detailed description  
The TC241 consists of four basic functional blocks: (1) the image-sensing area, (2) the image-storage area,  
(3) the multiplexer with serial registers and transfer gates, and (4) the buffer amplifier with charge-detection  
nodes. The location of each of these blocks is shown in the functional block diagram.  
image-sensing storage areas  
Cross sections with potential-well diagrams and top views of image-sensing and storage-area elements are  
shown in Figure 1 and Figure 2. As light enters the silicon in the image-sensing area, free electrons are  
generated and collected in the potential wells of the sensing elements. During this time, the antiblooming gate  
is activated by the application of a burst of pulses every horizontal-blanking interval. This prevents blooming  
caused by the spilling of charge from overexposed elements into neighboring elements. After the completion  
of integration, the signal charge is transferred into the storage area. To generate the dark reference necessary  
in subsequent video-processing circuits for restoration of the video-black level, 23 full columns and one  
half-column of elements at the left edge of the image-sensing area are shielded from incident light. Two full  
columns and one half-column of elements at the right of the image-sensing area are also shielded from incident  
light. The total number of elements per row is 780 (753 active elements plus 25 shielded elements and 2  
transitional elements).  
multiplexer with transfer gates and serial registers  
The multiplexer and transfer-gates transfer charge line by line from the image-element columns into the  
corresponding serial register and prepare it for readout. Multiplexing is activated during the horizontal-blanking  
interval by applying appropriate pulses to the transfer gates and serial registers. The required pulse timing is  
shown in Figure 3. A drain is included in this area to provide the capability to quickly clear the image-sensing  
and storage areas of unwanted charge. Such charge can accumulate in the imager during the start-up of  
operation or under special circumstances when nonstandard TV operation is desired.  
buffer amplifier with charge-detection nodes  
The bufferamplifierconverts charge into a video signal. Figure 4 shows the circuit diagram of a charge-detection  
node and one of the three amplifiers. As charge is transferred into the detection node, the potential of this node  
changes in proportion to the amount of signal received. This change is sensed by an MOS transistor and, after  
proper buffering, the signal is supplied to the output terminal of the image sensor. After the potential change has  
been sensed, the node is reset to a reference voltage supplied by an on-chip reference generator. The reset  
is accomplished by a reset gate that is connected internally to the serial register. The detection nodes and  
corresponding amplifiers are located some distance from the edge of the storage area; six dummy elements  
are used to span this distance. The location of the dummy elements is shown in the functional block diagram.  
11.5 µm  
Light  
Clocked Barrier  
IAG  
ABG  
Virtual Barrier  
Antiblooming  
Clocking Levels  
27 µm  
Antiblooming Gate  
Virtual Well  
Clocked Well  
Accumulated Charge  
Figure 1. Charge-Accumulation Process  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
SAG  
Clocked Phase  
Virtual Phase  
Channel Stops  
Figure 2. Charge-Transfer Process  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
Composite  
Blanking  
ABG  
IAG  
SAG  
TRG  
SRG 1  
SRG2  
SRG3  
Expanded  
Horizontal  
Blanking Interval  
Figure 3. Timing Diagram  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
Reference Generator  
ADB  
Reset Gate  
and  
Output Diode  
CCD Register  
Detection Node  
Two-Stage  
Source-  
Clocked Virtual  
Follower  
Amplifier  
Gate  
Gate  
OUTn  
SRGn  
Figure 4. Buffer Amplifier and Charge-Detection Node  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
spurious-nonuniformity specification  
Thespurious-nonuniformityspecificationoftheTC241CCDgrades 10, 20, 30, and40isbasedonseveral  
sensor characteristics:  
Amplitude of the nonuniform pixel  
Polarity of the nonuniform pixel  
Black  
White  
Location of the nonuniformity (see Figure 5)  
Area A  
Element columns near horizontal center of the area  
Element rows near vertical center of the area  
Area B  
Up to the pixel or line border  
Up to area A  
Other  
Edge of the imager  
Up to area B  
Nonuniform pixel count  
Distance between nonuniform pixels  
Column amplitude  
The CCD sensors are characterized in both an illuminated condition and a dark condition. In the dark condition,  
the nonuniformity is specified in terms of absolute amplitude as shown in Figure 6. In the illuminated condition,  
the nonuniformity is specified as a percentage of the total illumination as shown in Figure 7.  
15 Pixels  
360  
Pixels  
7
Lines  
233  
Lines  
A
B
11  
Lines  
20 Pixels  
Figure 5. Sensor-Area Map  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
mV  
Amplitude  
% of Total  
Illumination  
t
t
Figure 6. Pixel-Nonuniformity,  
Dark Condition  
Figure 7. Pixel-Nonuniformity,  
Illuminated Condition  
The grade specification for the TC241 is as follows (CCD video-output signal is 50 mV ±10 mV):  
Pixel-nonuniformity:  
DARK CONDITION  
ILLUMINATED CONDITION  
DISTANCE  
SEPARATION  
NONUNIFORM PIXEL TYPE  
PART  
NUMBER  
TOTAL  
COUNT  
PIXEL  
AMPLITUDE, x  
(mV)  
WHITE BLACK  
AREA AREA  
W/B  
AREA  
% OF TOTAL  
ILLUMINATION  
AREA A AREA B  
X
Y
AREA  
A
0
2
0
3
0
B
0
5
0
7
0
A
0
2
0
3
0
B
0
5
0
7
0
A
0
2
0
3
0
B
0
5
0
7
0
TC241-20  
TC241-30  
x > 3.5  
2.5 < x 3.5  
x > 3.5  
x > 5  
5.0 < x 7.5  
x > 7.5  
0
2
0
3
0
0
5
0
7
0
A
12  
100  
80  
3.5 < x 7  
x > 7  
7.5 < x 15  
x > 15  
TC241-40  
15  
White and black nonuniform pixel pair  
The total spot count is the sum of all nonuniform white, black, and white/black pairs in the dark condition added to the number of nonuniform black  
pixels in the illuminated condition. The sum of all nonuniform combinations do not exceed the total count.  
Column nonuniformity:  
WHITE  
BLACK  
COLUMN  
PART  
AMPLITUDE, x  
AREAS  
A AND B  
AREAS  
A AND B  
NUMBER  
(mV)  
TC241-20  
TC241-30  
TC241-40  
x > 0.3  
x > 0.5  
x > 0.7  
0
0
0
0
0
0
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V : ADB, CDB, IDB, TDB (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 15 V  
CC  
Input voltage range, V : ABG, IAG, SAG, SRG, TRG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –15 V to 15 V  
I
Operating free-air temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10°C to 45°C  
A
Storage temperature range, T  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30°C to 85°C  
STG  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: All voltage values are with respect to the substrate terminal.  
recommended operating conditions  
MIN NOM  
MAX  
UNIT  
V
Supply voltage, V  
CC  
Substrate bias voltage  
ADB, CDB, IDB, TDB  
11  
12  
0
13  
V
High level  
1.5  
2
2.5  
§
§
IAG  
Intermediate level  
–5  
–9  
2
Low level  
10  
1.5  
–10  
2
–8  
2.5  
–8  
6
High level  
SRG1, SRG2, SRG3  
ABG  
Low level  
–9  
4
High level  
V
Input voltage, V  
I
Intermediate level  
Low level  
2.5  
–7  
2
High level  
1.5  
10  
1.5  
2.5  
–8  
SAG  
TRG  
Low level  
–9  
2
High level  
2.5  
–8  
Low level  
10  
–9  
IAG, SAG  
2.05  
4.77  
2.05  
8
Clock frequency, f  
Load capacitance  
SRG1, SRG2, SRG3, TRG  
ABG  
MHz  
clock  
OUT1, OUT2, OUT3  
pF  
Operating free-air temperature, T  
10  
45  
°C  
A
The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for clock voltage  
levels.  
§
Adjustment is required for optimal performance.  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
electrical characteristics over recommended operating ranges of supply voltage and operating  
free-air temperature (unless otherwise noted)  
TYP  
PARAMETER  
Antiblooming disabled (see Note 3)  
MIN  
60  
MAX  
UNIT  
dB  
Dynamic range (see Note 2)  
Charge-conversion factor  
1.4  
1.6  
1.8  
µV/e  
Charge-transfer efficiency (see Note 4)  
0.9999 0.99995  
Signal-response delay time, τ (see Note 5 and Figure 11)  
Gamma (see Note 6)  
18  
20  
0.98  
700  
0.13  
0.11  
120  
20  
22  
ns  
0.97  
Output resistance  
800  
1/f noise (5 kHz)  
Noise voltage  
µV/Hz  
Random noise (f = 100 kHz)  
Noise-equivalent signal  
electrons  
ADB (see Note 7)  
Rejection ratio at 4.77 MHz  
Supply current  
SRG1, SRG2, SRG3 (see Note 8)  
ABG (see Note 9)  
40  
dB  
20  
5
mA  
IAG  
12000  
120  
4000  
350  
14000  
SRG1, SRG2, SRG3  
Input capacitance, C  
ABG  
TRG  
SAG  
pF  
i
All typical values are at T = 25 °C  
A
NOTES: 2. Dynamic range is 20 times the logarithm of the mean-noise signal divided by the saturation-output signal.  
3. For this test, the antiblooming gate must be biased at the intermediate level.  
4. Charge-transfer efficiency is one minus the charge loss per transfer in the output register. The test is performed in the dark using  
an electrical input signal.  
5. Signal-response delay time is the time between the falling edge of the SRG clock pulse and the output-signal valid state.  
6. Gamma (γ) is the value of the exponent in the equation below for two points on the linear portion of the transfer-function curve (this  
value represents points near saturation):  
Exposure (2)  
Exposure (1)  
Output signal (2)  
Output signal (1)  
7. ADB rejection ratio is 20 times the logarithm of the ac amplitude at the output divided by the ac amplitude at ADB.  
8. SRGn rejection ratio is 20 times the logarithm of the ac amplitude at the output divided by the ac amplitude at SRGn.  
9. ABG rejection ratio is 20 times the logarithm of the ac amplitude at the output divided by the ac amplitude at ABG.  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
optical characteristics, T = 40°C (unless otherwise noted)  
A
PARAMETER  
MIN  
TYP  
150  
19  
MAX  
UNIT  
No IR filter  
Measured at V  
(see Notes 10 and 11)  
U
Sensitivity  
mV/lx  
With IR filter  
Saturation signal, V  
(see Note 12) Antiblooming disabled, interlace off  
320  
180  
100  
200  
400  
360  
mV  
mV  
sat  
Maximum usable signal, V  
use  
Antiblooming enabled, interlace on  
Interlace on  
Blooming-overload ratio (see Note 13)  
Interlace off  
3
Image-area well capacity  
Smear (see Note 14)  
Dark current  
200 x 10  
electrons  
See Note 15  
0.00072  
0.027  
2
Interlace off  
T
= 21°C  
nA/cm  
A
TC241-30  
TC241-40  
TC241-30  
TC241-40  
TC241-30  
TC241-40  
15  
20  
Dark signal (see Note 16)  
Pixel uniformity  
mV  
3.5  
5
Output signal = 50 mV ±10 mV  
mV  
mV  
0.5  
0.7  
15%  
Column uniformity  
Shading  
Output signal = 50 mV ±10 mV  
Output signal = 100 mV  
NOTES: 10. Sensitivity is measured at an integration time of 16.667 ms with a source temperature of 2856 K. A CM-500 filter is used.  
11. is the output voltage that represents the threshold of operation of antiblooming. V 1/2 saturation signal.  
V
U
U
12. Saturation is the condition in which further increase in exposure does not lead to further increase in output signal.  
13. Blooming-overload ratio is the ratio of blooming exposure to saturation exposure.  
14. Smear is a measure of the error induced by transferring charge through an illuminated pixel in shutterless operation. It is equivalent  
to the ratio of the single-pixel transfer time during a fast dump to the exposure time using an illuminated section that is 1/10 of the  
image-area vertical height with recommended clock frequencies.  
15. Exposure time is 16.67 ms and the fast-dump clocking rate during vertical timing is 2.05 MHz.  
16. Dark-signal level is measured from the dummy pixels.  
12  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
PARAMETER MEASUREMENT INFORMATION  
Blooming Point  
With Antiblooming  
Enabled  
V
O
Blooming Point  
With Antiblooming  
Disabled  
Dependent on  
Well Capacity  
V
sat (min)  
Level Dependent  
Upon Antiblooming  
Gate High Level  
V
use (max)  
V
use (typ)  
DR  
V
n
Lux  
(light input)  
camera white-clip voltage  
Vn  
DR (dynamic range)  
V
V
= noise-floor voltage  
n
= minimum saturation voltage  
sat (min)  
V
= maximum usable voltage  
use (max)  
= typical user voltage (camera white clip)  
V
use (typ)  
NOTES: A.  
V
is defined as the voltage determined to equal the camera white clip. This voltage must be less than V  
use  
use (typ)  
.
(max)  
B. A system trade-off is necessary to determine the system light sensitivity versus the signal/noise ratio. By lowering  
the V , the light sensitivity of the camera is increased; however, this sacrifices the signal/noise ratio of the  
use (typ)  
camera.  
Figure 8. Typical V , V  
Relationship  
sat use  
13  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
PARAMETER MEASUREMENT INFORMATION  
100%  
V
IH  
min  
Intermediate Level  
V
IL  
max  
0%  
t1  
t2  
Slew rate between 10% and 90% = 70 to 120 V/µs  
Ratio t1 : t2 at 2 MHz = 4:3  
Ratio t1 : t2 at 1 MHz = 1:1  
Figure 9. Typical Clock Waveform for ABG, IAG, and SAG  
100%  
V
IH  
min  
10%  
0%  
V
IL  
max  
t1  
t2  
Slew rate between 10% and 90% = 300 V/µs  
Ratio t1 : t2 = 1:1  
Figure 10. Typical Clock Waveform for SRG1, SRG2, SRG3, and TRG  
1.5 V to 2.5 V  
– 8 V to 10 V  
SRG  
– 8 V  
0%  
OUT  
90%  
100%  
CCD Delay  
τ
10 ns  
15 ns  
Sample  
and  
Hold  
Figure 11. SRG and CCD Output Waveforms  
14  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
TYPICAL CHARACTERISTICS  
VERTICAL MODULATION  
TRANSFER FUNCTION  
HORIZONTAL MODULATION  
TRANSFER FUNCTION  
(BARS PARALLEL TO SERIAL REGISTER)  
(BARS PERPENDICULAR TO SERIAL REGISTER)  
1
1
0.8  
0.8  
0.6  
0.4  
0.6  
0.4  
0.2  
0
0.2  
0
λ = 400 to 700-nm Monochromatic Light  
λ = 400 to 700-nm Monochromatic Light  
V = 12 V  
V
T
A
= 12 V  
ADB  
= 25°C  
ADB  
T = 25°C  
A
0
0.2  
0.4  
0.6  
0.8  
1
0
0.2  
0.4  
0.6  
0.8  
1
Normalized Spatial Frequency  
Normalized Spatial Frequency  
0
0
3.7  
7.4  
11.1  
14.8  
18.5  
8.7  
17.4  
26.1  
34.8  
43.5  
Spatial Frequency – Cycles/mm  
Spatial Frequency – Cycles/mm  
Figure 12  
Figure 13  
AMPLIFIER NOISE VOLTAGE  
RESPONSIVITY  
vs  
vs  
FREQUENCY  
WAVELENGTH OF INCIDENT LIGHT  
1
1000  
100  
10  
100%  
V
T
A
= 12 V  
ADB  
= 25°C  
V
T
A
= 12 V  
ADB  
= 25°C  
70%  
50%  
30%  
20%  
0.1  
10%  
7%  
5%  
3%  
2%  
1
0.01  
3
10  
4
10  
5
10  
6
10  
7
10  
400  
600  
800  
1000  
1200  
f – Frequency – Hz  
Incident Wavelength – nm  
Figure 14  
Figure 15  
15  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
APPLICATION INFORMATION  
V
V
V
ABG+  
SS  
TMS3473B  
IALVL  
ADB  
1
2
3
4
5
6
7
8
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
47 kΩ  
IALVL  
V
SS  
I/N  
IASR  
IAIN  
ABSR  
TC241  
SH2, 3  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
1
47 kΩ  
ABIN  
MIDSEL  
SAIN  
PD  
V
SUB  
ABG  
IAG  
SUB  
IAG  
CC  
2
ABLVL  
IAOUT  
ABLVL  
3
TL1593  
L
SAG  
4
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
4.7 µF  
+
ANLGV  
AIN1  
CIN1  
IAN2  
CIN2  
AIN3  
CIN3  
S/H1  
S/H2  
S/H3  
ABOUT  
SAOUT  
SAG  
TDB  
CC  
5
GND  
SRG3  
SRG2  
SRG1  
TRG  
ADB  
100 Ω  
100 Ω  
100 Ω  
9
6
4.7 µF  
SH1  
V
V
OUT3  
OUT2  
OUT1  
AMPGND  
GND  
AGB+  
CC  
+
10  
7
V
V
DGTL V  
CC  
V
SS  
AGB–  
ABG–  
8
4.7 µF  
OUT1  
9
+
TMS3472A  
OUT2  
OUT3  
IDB  
10  
11  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
CDB  
SUB  
+
CP2  
DLADJ  
GND  
V
SS  
100 pF  
4.7 µF  
ANLG GND DGTL GND  
SUB  
1PC2  
1PC1  
3
PD  
4
SRG2,3IN  
V
CC  
100 Ω  
100 Ω  
5
OUT3  
SRG1IN SRG3OUT  
TRGIN SRG2OUT  
2,3PC1 SRG1OUT  
2,3PC2 TRGOUT  
6
OUT2  
OUT1  
7
100 Ω  
100 Ω  
V
CC  
8
V
CC  
9
SSR  
V
CC  
22 21 20 19 18 17 16 15 14 13 12  
10  
V
TSR  
SS  
47 kΩ  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
11  
10  
9
47 kΩ  
T
ABS2  
ABS1  
ABS0  
SC (90)  
SC  
S1  
S2, 3  
PD  
PS  
8
7
6
TMS3471C  
GT  
BF  
CBLK  
CSYNC  
CP1  
5
ABIN  
PI  
4
1 kΩ  
3
DC VOLTAGES  
SH2, 3  
SH1  
SH2, 3  
SH1  
2
ADB  
12 V  
5 V  
10 V  
2 V  
CP2  
1
1 kΩ  
V
V
V
GND  
BCP2  
CC  
SS  
20 pF  
34 35 36 37 38 39 40 41 42 43 44  
ABLVL  
IALVL  
2.5 V  
–5 V  
4 V  
4.7 kΩ  
Oscillator  
14.3-MHz  
V
CC  
GT3  
GT2  
GT1  
V
V
ABG+  
ABG–  
–6 V  
15 pF  
SUPPORT CIRCUITS  
APPLICATION  
Timing generator  
Serial driver  
DEVICE  
PACKAGE  
44 pin flatpack  
FUNCTION  
NTSC timing generator  
TMS3471CFS  
TMS3472ADW  
TMS3473BDW  
TL1593CNS  
20 pin flatpack with tabs  
20 pin small outline  
Driver for SRG1, SRG2, SRG3, and TRG  
Driver for ABG, IAG, and SAG  
Parallel driver  
16 pin small outline (EIAJ)  
Sample and hold  
Three-channel sample-and-hold IC  
Figure 16. Typical Application Circuit Diagram  
Decoupling capacitors are not shown.  
TI recommends designing AC coupled systems.  
16  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TC241  
780- × 488-PIXEL CCD IMAGE SENSOR  
SOCS006C – AUGUST 1986 – REVISED DECEMBER 1991  
MECHANICAL DATA  
The package for the TC241 consists of a ceramic base, a glass window, and a 22-lead frame. The glass window is  
sealed to the package by an epoxy adhesive. The package leads are configured in a dual in-line organization and  
fit into mounting holes with 2.54 mm (0.10 in) center-to-center spacings.  
TC241 (22 pin)  
23,39 (0.921)  
Optical Center  
2,01 x 2,39  
(0.079 x 0.094)  
2,01 (0.079)  
C
Optical  
(see Note B)  
L
18,24  
(0.718)  
9,35 (0.368)  
REF  
8,00 (0.315)  
Index Dot  
27,81 (1.095) MAX  
18,54  
MAX  
3,86 (0.152) MAX  
0,25 (0.010)  
(0.730)  
2,79 (0.110)  
0,46 (0.018)  
2,54 (0.100)  
(see Note D)  
5,50 ± 0,76  
(0.217 ± 0.030)  
10,16 (0.400) TYP  
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES  
7/94  
NOTES: A. Single dimensions are nominal.  
B. The center of the package and the center of the image area are not coincident.  
C. The distance from the top of the glass to the image-sensor surface is typically 1,46 mm (0.057 in). The glass is 0,95 ±0,08 mm thick  
and has an index of refraction of 1.53.  
D. Each pin centerline is located within 0,25 mm (0.010 in) of its true longitudinal position.  
17  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1998, Texas Instruments Incorporated  

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