TLC34058 [TI]

256 × 24 COLOR PALETTE; 256 ? 24调色板
TLC34058
型号: TLC34058
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

256 × 24 COLOR PALETTE
256 ? 24调色板

文件: 总26页 (文件大小:481K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
LinEPIC 1-µm CMOS Process  
125-MHz Pipelined Architecture  
Direct Interface to TMS340XX Graphics  
Processors  
Standard Microprocessor Unit (MPU)  
Available Clock Rates . . . 80, 110, 125,  
Palette Interface  
135 MHz  
Multiplexed TTL Pixel Ports  
Dual-Port Color RAM  
256 Words x 24 Bits  
Triple Digital-to-Analog Converters (DACs)  
Dual-Port Overlay Registers . . . 4 × 24 Bits  
5-V Power Supply  
Bit Plane Read and Blink Masks  
EIA RS-343-A Compatible Outputs  
Functionally Interchangeable With  
Brooktree Bt458  
description  
TheTLC34058color-paletteintegratedcircuitisspecificallydevelopedforhigh-resolutioncolorgraphicsinsuch  
applications as CAE/CAD/CAM, image processing, and video reconstruction.  
The architecture provides for the display of 1280 × 1024 bit-mapped color graphics (up to 8 bits per pixel  
resolution) with 2 bits of overlay information. The TLC34058 has a 256-word × 24-bit RAM used as a lookup  
table with three 8-bit video D/A converters.  
On-chip features such as high-speed pixel clock logic minimize costly ECL interface. Multiple pixel ports and  
internal multiplexing provide TTL-compatible interface (up to 32 MHz) to the frame buffer while maintaining  
sophisticated color graphic data rates (up to 135 MHz). Programmable blink rates, bit plane masking and  
blinking, color overlay capability, and a dual-port palette RAM are other key features. The TLC34058 generates  
red, green, and blue signals compatible with EIA RS-343-A and can drive, without external buffering, 75-Ω  
coaxial cables terminated at each end.  
AVAILABLE OPTIONS  
DAC  
RESOLUTION  
PACKAGE  
Ceramic Grid Array (GA)  
T
A
SPEED  
Plastic Chip Carrier (FN)  
TLC34058-80FN  
80 MHz  
110 MHz  
125 MHz  
135 MHz  
8 Bits  
8 Bits  
8 Bits  
8 Bits  
TLC34058-80GA  
TLC34058-110GA  
TLC34058-125GA  
TLC34058-135GA  
0°C  
To  
70°C  
TLC34058-110FN  
TLC34058-125FN  
TLC34058-135FN  
LinEPIC is a trademark of Texas Instruments Incorporated.  
Brooktree is a registered trademark of Brooktree Corporation.  
Copyright 1991, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
FN PACKAGE  
(TOP VIEW)  
11 10 9  
8
7
6
5
4
3
2
1 84 83 82 81 80 79 78 77 76 75  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
12  
13  
14  
15  
16  
17  
18  
74 P2B  
73  
72  
71  
70  
69  
68  
67  
66  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
P2C  
P2D  
P2E  
P3A  
P3B  
P3C  
P3D  
P3E  
GND  
D7 19  
CE 20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
GND  
GND  
V
V
DD  
DD  
V
DD  
C0  
C1  
CLK  
CLK  
LD  
R/W  
V
BLK  
SYNC  
P4A  
P4B  
P4C  
P4D  
DD  
IOR  
IOG  
IOB  
FS ADJ  
COMP  
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
84-pin GA package pin assignments  
SIGNAL  
BLK  
PIN NO.  
L9  
SIGNAL  
PIN NO.  
SIGNAL  
PIN NO.  
PORT 5  
POWER, REFERENCE  
AND MPU INTERFACE  
SYNC  
LD  
M10  
M9  
P5A  
K11  
L12  
K12  
J11  
J12  
P5B  
V
DD  
V
DD  
V
DD  
V
DD  
V
DD  
V
DD  
C12  
C11  
A9  
CLK  
L8  
P5C  
CLK  
M8  
P5D  
P5E  
L7  
PORT 0  
P0A  
PORT 6  
M7  
A7  
G1  
G2  
H1  
H2  
J
P6A  
H11  
H12  
G12  
G11  
F12  
P0B  
P6B  
GND  
GND  
GND  
GND  
GND  
COMP  
FS ADJ  
REF  
CE  
B12  
B11  
M6  
B6  
P0C  
P6C  
P0D  
P6D  
P0E  
P6E  
PORT 1  
P1A  
PORT 7  
A6  
J2  
K1  
L1  
K2  
L2  
P7A  
F11  
E12  
E11  
D12  
D11  
A12  
B10  
C10  
A5  
P1B  
P7B  
P1C  
P7C  
P1D  
P7D  
P1E  
P7E  
R/W  
C1  
B8  
PORT 2  
P2A  
OVERLAY SELECT 0  
A8  
K3  
M1  
L3  
OL0A  
OL0B  
A1  
C2  
B1  
C1  
D2  
C0  
B7  
P2B  
DATA BUS  
D0  
P2C  
OL0C  
C3  
B2  
B3  
A2  
A3  
B4  
A4  
B5  
P2D  
M2  
M3  
OL0D  
D1  
P2E  
OL0E  
D2  
PORT 3  
P3A  
OVERLAY SELECT 1  
OL1A  
D3  
L4  
M4  
L5  
D1  
E2  
E1  
F1  
F2  
D4  
P3B  
OL1B  
D5  
P3C  
OL1C  
D6  
P3D  
M5  
L6  
OL1D  
D7  
P3E  
OL1E  
PORT 4  
P4A  
DAC CURRENT OUTPUTS  
M11  
L10  
L11  
IOG  
IOB  
IOR  
A10  
P4B  
A11  
B9  
P4C  
P4D  
K10  
M12  
P4E  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
functional block diagram  
REF  
FS ADJ  
CLK  
CLK  
Reference  
Amplifier  
COMP  
Load  
Control  
Mux  
Control  
Blink  
Control  
LD  
8-Bit  
D/A  
Converter  
40  
10  
40  
10  
40  
10  
8
2
8
8
2
P0P7  
(AE)  
IOR  
IOG  
IOB  
256 Words  
8
8
× 24 Bits  
Palette  
Ram  
Input  
Latch  
Latch  
Mux  
Read Blink  
Mask Mask  
8-Bit  
D/A  
Converter  
OL0OL1  
(AE)  
4 × 24  
Overlay  
Palette  
SYNC  
BLK  
8-Bit  
D/A  
Converter  
Registers  
CE  
To  
R/W  
C0  
Bus  
Control  
Control  
Functions  
C1  
To  
8
8
8
Address  
Control  
Functions  
Address  
Register  
D0D7  
Red  
Value  
Green  
Value  
Blue  
Value  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
Terminal Functions  
PIN NAME  
BLK  
I/O  
DESCRIPTION  
I
Composite blank control. This TTL-compatible blanking input is stored in the input latch on the rising edge of LD. When  
low, BLK drives the DAC outputs to the blanking level, as shown in Table 6. This causes the P0P7 [AE] and  
OL0OL1 [AE] inputs to be ignored. When high, BLK allows the device to perform in the standard manner.  
C0, C1  
CE  
I
I
Command control inputs. The inputs specify the type of write or read operation (see Tables 1, 2, 3, and 4). These  
TTL-compatible inputs are latched on the falling edge of CE.  
Chip enable. This TTL-compatible input control allows data to be stored and enables data to be written or read (see  
Figure 1). When low, CE enables data to be written or read. When high, CE allows data to be internally latched on the  
rising edge during write operations. Care should be taken to avoid transients on this input.  
CLK  
I
Clock. This input provides the pixel clock rate. CLK and CLK inputs are designed to be driven by ECL logic using a 5-V  
single supply.  
I
I
Clock. This input is the complement of CLK and also provides the pixel clock rate.  
CLK  
COMP  
Compensation. This input is used to compensate the internal reference amplifier (see the video generation section).  
A 0.1-µF ceramic capacitor is connected between this pin and V  
(see Figure 4). The highest possible supply voltage  
rather than to GND.  
DD  
rejection ratio is attained by connecting the capacitor to V  
DD  
D0D7  
FS ADJ  
I
I
Data input bus. This TTL-compatible bus transfers data into or out of the device. The data bus is an 8-bit bidirectional  
bus where D0 is the least significant bit.  
Full-scale adjust control. A resistor R , (see Figure 4) which is connected between this pin and GND, controls the  
set  
magnitude of the full-scale video signal. Note that the proportional current and voltage relationships in Figure 3 are  
maintained independent of the full-scale output current. The relationships between R  
full-scale output currents are:  
and the IOR, IOG, and IOB  
set  
R
() = 11294 × V (V) / IOG(mA)  
set ref  
IOR, IOB (mA) = 8067 × V (V) / R ()  
ref set  
GND  
Ground. All GND pins must be connected together.  
IOR, IOG  
IOB  
O
I
Current outputs, red, green, and blue. High-impedance red, green, and blue video analog current outputs can directly  
drive a 75-coaxial terminated at each end (see Figure 4).  
LD  
Load control. This TTL-compatible load control input latches the P0P7 [AE], OL0OL1 [AE], BLK, and SYNC  
inputs on its rising edge. The LD strobe occurs at 1/4 or 1/5 the clock rate and may be phase independent of the CLK  
and CLK inputs. The LD duty cycle limits are specified in the timing requirements table.  
OL0AOL1A  
OL0BOL1B  
OL0COL1C  
OL0DOL1D  
OL0EOL1E  
l
Overlay selection inputs. These TTL-compatible selection inputs for the Palette overlay registers are stored in the input  
latch on the rising edge of LD. These inputs (up to 2 bits per pixel), along with bit CR6 of the command register (refer  
to the command register section and Table 5), specify whether the color information is selected from the palette RAM  
or the overlay registers. If the color information is selected from the overlay registers, the OL0OL1 [AE] inputs  
address a particular overlay register. The OL0OL1 [AD] or OL0OL1 [AE] inputs are simultaneously input to the  
device (see the description of bit CR7 in the command register section). The OL0OL1 [A] inputs are processed first,  
then the OL0OL1 [B] inputs, and so on. When obtaining the color information from the overlay registers, the P0P7  
[A – E] inputs are ignored. Unused inputs should be connected to GND.  
P0A P7A  
P0BP7B  
P0CP7C  
P0DP7D  
P0EP7E  
l
Addressinputs. TheseTTL-compatibleaddressinputsforthePaletteRAMarestoredintheinputlatchontherisingedge  
of LD. These address inputs (up to 8-bits per pixel) select one of 256 24-bit words in the palette RAM, which is  
subsequently input to the red, green, and blue D/A converters as three 8-bit or 4-bit bytes. Four or five addresses are  
simultaneously input to the P0P7 [AD] or P0P7 [AE] ports, respectively (see the description of bit CR7 in the  
command register section). The word addressed by P0AP7A is first sent to the DACs, then the word addressed by  
P0BP7B, and so on. Unused inputs should be connected to GND.  
REF  
I
Reference voltage. 1.235-V is supplied at this input. An external voltage reference circuit, shown in Figure 4, is sug-  
gested.Generatingthereferencevoltagewitharesistornetworkisnotrecommendedsincelow-frequencypowersupply  
noisewill directly couple into the DAC output signals. This input must be decoupled by connecting a 0.1-µF ceramic  
capacitorbetween VREF and GND.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
Terminal Functions (continued)  
PIN NAME  
I/O  
DESCRIPTION  
I
R/W  
Read/write input. This TTL-compatible control input is latched on the falling edge of CE (see Figure 1). When low, writes  
data to the device. Data is internally latched on the rising edge of CE. When high, reads data from the device.  
I
Composite sync control. This TTL-compatible sync control input is stored in the input latch on the rising edge of LD. When  
low, SYNC turns off a 40 IRE current source on the IOG output, as shown in Figure 3. This input does not override any  
control data input, as shown in Table 6. It should be brought low during the blanking interval only, as shown in Figure 3.  
When high, SYNC allows the device to perform in the standard manner.  
SYNC  
V
DD  
Supply voltage. All V  
pins must be connected together.  
DD  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)  
Supply voltage V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
DD  
Voltage range on any digital input (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V to V  
Analog output short circuit duration to any power supply or common, I  
Operating free-air temperature range, T  
+ 0.5 V  
DD  
. . . . . . . . . . . . . . . . . . . . . unlimited  
OS  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
A
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
Case temperature for 10 seconds: FN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: GA package . . . . . . . . . . . . . . . . . . . 260°C  
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and  
functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of  
this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: All voltage values are with respect to GND terminal.  
recommended operating conditions  
MIN NOM  
4.75  
–1  
MAX  
UNIT  
V
Supply voltage, V  
5
5.25  
DD  
CLK, CLK  
V
DD  
V
V
V
+0.5  
V
DD  
DD  
DD  
High-level Input voltage, V  
IH  
Other inputs  
CLK, CLK  
2
+0.5  
1.6  
0.8  
V
0.5  
0.5  
V
Low-level Input voltage, V  
IL  
Other inputs  
V
Reference voltage, V  
ref  
1.2 1.235  
1.26  
V
Output load resistance, R  
37.5  
L
FS ADJ resistor, R  
set  
523  
0
Operating free-air temperature, T  
70  
°C  
A
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature, R  
= 523 , V = 1.235 V (unless otherwise noted)  
set  
ref  
PARAMETER  
Input reference current  
TEST CONDITIONS  
MIN TYP  
MAX  
UNIT  
µA  
I
10  
0.5  
ref  
f = 1 kHZ,  
C8 = 0.1 µF (see Figure 4)  
%
k
Supply voltage rejection ratio  
SVR  
%V  
DD  
V
V
V
V
V
V
V
V
= 5 V,  
T
= 20°C  
= 0°C  
175  
DD  
DD  
DD  
DD  
DD  
DD  
DD  
DD  
A
80 MHz  
= 5.25 V,  
= 5 V,  
T
A
400  
420  
435  
T
= 20°C  
T = 0°C  
A
195  
205  
200  
A
110 MHz  
125 MHz  
= 5.25 V,  
= 5 V,  
I
Supply current  
mA  
DD  
T
= 20°C  
T = 0°C  
A
A
= 5.25 V,  
= 5 V,  
T
A
= 20°C  
= 0°C  
135 MHz  
= 5.25 V,  
T
A
435  
1
CLK, CLK  
V = 4 V  
I
µA  
µA  
µA  
µA  
pF  
pF  
V
I
I
High-level input current  
Low-level input current  
IH  
Other inputs V = 2.4 V  
1
I
CLK, CLK  
V = 0.4 V  
I
–1  
–1  
10  
10  
IL  
Other inputs V = 0.4 V  
I
C
C
Input capacitance, digital  
f = 1 MHz,  
f = 1 MHz,  
V = 2.4 V  
4
4
i
I
Input capacitance, CLK, CLK  
High-level output voltage, D0D7  
Low-level output voltage, D0D7  
High-impedance-state output current  
Output impedance  
V = 4 V  
I
i(CLK)  
OH  
OL  
V
V
I
I
= 800 µA  
2.4  
OH  
= 6.4 mA  
0.4  
10  
V
OL  
I
µA  
kΩ  
pF  
OZ  
z
50  
13  
o
C
Output capacitance (f = 1 MHz, I = 0)  
20  
o
O
All typical values are at T = 25°C.  
A
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
timing requirements over recommended ranges of supply voltage and operating free-air  
temperature, R  
= 523 , V = 1.235 V (see Note 2)  
set  
ref  
VERSION  
TIMING  
PARAMETER  
LIMIT  
UNITS  
REFERENCE  
135 MHz  
125 MHz  
110 MHz  
80 MHz  
80  
20  
0
Clock frequency  
LD frequency  
MAX  
MAX  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
MIN  
135  
33.75  
0
125  
31.25  
0
110  
27.5  
0
MHz  
MHz  
ns  
Setup time, R/W, C0, C1 high before CE ↓  
Hold time, R/W, C0, C1 high after CE ↓  
Pulse duration, CE low  
1
2
15  
50  
25  
35  
0
15  
50  
25  
35  
0
15  
50  
25  
35  
0
15  
50  
25  
50  
0
ns  
3
ns  
Pulse duration, CE high  
4
ns  
Setup time, write data before CE ↑  
Hold time, write data after CE ↓  
Pixel and control setup time  
Pixel and control hold time  
Clock cycle time  
8
ns  
9
ns  
10  
11  
12  
13  
14  
15  
16  
17  
3
3
3
4
ns  
2
2
2
2
ns  
7.4  
3
8
9.09  
4
12.5  
5
ns  
Pulse duration, CLK high  
Pulse duration, CLK low  
3.2  
3.2  
32  
13  
13  
ns  
3
4
5
ns  
LD cycle time  
29.6  
12  
12  
36.36  
15  
15  
50  
20  
20  
ns  
LD pulse duration high time  
LD pulse duration low time  
ns  
ns  
See Figures 1 and 2.  
NOTE 2. TTL input signals are 0 to 3 V with less than 3 ns rise/fall times between 10% and 90% levels. ECL input signals are V  
1.8 V to  
DD  
V
0.8 V with less than 2 ns rise/fall times between 20% and 80% levels. For input and output signals, timing reference points are  
DD  
at the 50% signal level. Analog output loads are less than 10 pF. D0D7 output loads are less than 40 pF.  
operating characteristics over recommended ranges of supply voltage and operating free-air  
temperature, R  
= 523 , V = 1.235 V (unless otherwise noted)  
set  
ref  
analog outputs  
TYP  
PARAMETER  
MIN  
MAX  
±1  
UNIT  
LSB  
LSB  
E
E
Integral linearity error (each DAC)  
Differential linearity error  
Gray scale error  
L
±1  
D
±5  
White level relative to blank  
White level relative to black  
Black level relative to blank  
Blank level on IOR, IOB  
Blank level on IOG  
17.69 19.05  
16.74 17.62  
20.4  
18.5  
1.9  
mA  
0.95  
0
1.44  
5
I
O
Output current  
50  
µA  
mA  
µA  
µA  
6.29  
0
7.6  
5
8.96  
50  
Sync level on IOG  
LSB size  
69.1  
2%  
DAC to DAC matching  
Output compliance voltage  
5%  
1.2  
–1  
V
All typical values are at T = 25°C  
A
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature, R  
= 523 , V = 1.235 V (see Note 2)  
set  
ref  
VERSION  
TIMING  
PARAMETER  
LIMIT  
UNITS  
REFERENCE  
135 MHz  
125 MHz  
110 MHz  
80 MHz  
CE low to data bus enabled  
5
6
MIN  
MAX  
MAX  
TYP  
TYP  
MAX  
TYP  
TYP  
MAX  
MIN  
10  
75  
15  
20  
2
10  
75  
15  
20  
2
10  
75  
15  
20  
2
10  
100  
15  
20  
3
ns  
ns  
CE low to data valid  
CE high to data bus disabled  
7
ns  
Analog output delay time (see Note 3)  
Analog output rise or fall time (see Note 4)  
Analog output setting time (see Note 5)  
Glitch impulse (see Note 6)  
18  
19  
20  
ns  
ns  
8
8
9
12  
50  
0
ns  
50  
0
50  
0
50  
0
pV-s  
ns  
Analog output skew  
Pipeline delay  
2
2
2
2
ns  
6
6
6
6
clock  
cycles  
MAX  
10  
10  
10  
10  
See Figures 1 and 2.  
NOTES: 2. TTL input signals are 0 to 3 V with less than 3 ns rise/fall times between 10% and 90% levels. ECL input signals are V  
1.8 to  
DD  
0.8 V with less than 2 ns rise/fall times between 20% and 80% levels. For input and output signals, timing reference points  
V
DD  
are at the 50% signal level. Analog output loads are less than 10 pF. D0D7 output loads are less than 40 pF.  
3. Measured from 50% point of rising clock edge to 50% point of full-scale transition.  
4. Measured between 10% and 90% of full-scale transition.  
5. Measured from 50% point of full-scale transition to output settling within ± 1  
6. Glitch impulse includes clock and data feedthrough. The 3-dB test bandwidth is twice the clock rate.  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PARAMETER MEASUREMENT INFORMATION  
t
h1  
t
su1  
R/W, C0, C1  
CE  
t
w1  
t
w2  
t
en2  
t
dis  
t
en1  
D0D7 (Read)  
D0D7 (Write)  
t
su2  
t
h2  
Figure 1. Read/Write Timing Waveform  
t
c2  
t
t
w6  
w5  
LD  
P0 P7 (AB),  
Data  
OL0OL1 (AB),  
SYNC, BLK  
t
su3  
t
d
t
s
t
h3  
IOR, IOG, IOB  
t
t
t
c1  
t
w3  
CLK  
t
w4  
Figure 2. Video Input/Output Timing Waveform  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PARAMETER MEASUREMENT INFORMATION  
RED, BLUE  
mA  
GREEN  
mA  
V
V
White Level  
19.05 0.714 26.67 1.000  
92.5 IRE  
Black Level  
Blank Level  
1.44 0.054 9.05 0.340  
0.00 0.000 7.62 0.286  
7.5 IRE  
40 IRE  
Sync Level  
0.00  
0.00  
NOTE A: The IRE (Institute of Radio Engineers – now IEEE) scale is used for defining the relative voltage levels of the sync, white, black, and  
blank levels in a monitor circuit. The reference white level is set at 100 IRE units. The blanking level is set at φ IRE units. One IRE unit  
is equivalent to 1/100 of the difference between the reference white level and the blanking level.  
Figure 3. Composite Video Output Waveforms  
COMP  
C8  
L1  
V
DD  
5 V (V  
)
DD  
C5–C7  
C9  
C2–C4  
R4  
C1  
REF  
C10  
TLC34058  
Z1  
GND  
GND  
R
R1  
R2  
R3  
SET  
FS ADJ  
IOR  
To  
Video  
Connector  
IOG  
IOB  
LOCATION  
DESCRIPTION  
0.1-µF ceramic capacitor  
VENDOR PART NUMBER  
C1C4, C8, C9  
Erie RPE112Z5U104M50V  
C5C7  
C10  
0.01-µF ceramic chip capacitor AVX 12102T903QA1018  
33-µF tantalum capacitor  
ferrite bead  
Mallory CSR13-K336KM  
Fair-Rite 2743001111  
Dale CMF-55C  
L1  
R1, R2, R3  
R4  
75-1% metal film resistor  
1000-1% metal film resistor  
523-1% metal film resistor  
1.2-V diode  
Dale CMF-55C  
R
set  
Z1  
Dale CMF-55C  
National Semiconductor  
LM385Z-1.2  
NOTE A: Theabovelistedvendornumbersarelistedonlyasaguide. Substitutionofdeviceswith  
similar characteristics does not degrade the performance of the TLC34058.  
Figure 4. Circuit Diagram  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PARAMETER MEASUREMENT INFORMATION  
5 V  
220 Ω  
5 V  
14  
CLK  
CLK  
CLK  
330 Ω  
5 V  
220 Ω  
Monitor  
Products  
970E  
CLK  
LDA  
Clock  
Generator  
330 Ω  
TLC34058  
7
LD  
5 V  
0.1 µF  
1 kΩ  
V
ref  
REF  
Figure 5. Generating the Clock, Load, and Voltage Reference Signals  
V
DD  
G0G7  
15 PF  
C (stray + load)  
R
L
BLK  
SYNC  
(IOG Only)  
Figure 6. Equivalent Circuit of the Current Output (IOG)  
12  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PRINCIPLES OF OPERATION  
microprocessor unit (MPU) interface  
As shown in the functional block diagram, the MPU has direct access to the internal control registers and color  
overlay palettes via a standard MPU interface. Since the palette RAM and overlay registers have dual ports,  
they can be updated without affecting the display refresh process. One port is allocated for updating or reading  
data and the other for display.  
palette RAM write or read  
The palette RAM location is addressed by the internal 8-bit address register (ADDR07). The MPU can either  
write to or read from this register. The register eliminates the need for external address multiplexers.  
ADDR0ADDR7 are updated via D0D7. To address the red, green, and blue part of a particular RAM location,  
the internal address register is provided with two additional bits, ADDRa and ADDRb. These address bits count  
modulo 3 and are reset to 0 when the MPU accesses the internal address register.  
After writing to or reading from the internal address register, the MPU executes three write or read cycles (red,  
green and blue). The register ADDRab is incremented after each of these cycles so that the red, green, and blue  
information is addressed from the correct part of the particular RAM location. During the blue write cycle, the  
red, green, and blue color information is adjoined to form a 24-bit word, which is then written to the particular  
RAM location. After the blue write/read cycle, the internal address register bits ADDR0–7 are incremented to  
access the next RAM location. For an entire palette RAM write or read, the bits ADDR0–7 are reset to 00 after  
accessing the FF (256) palette RAM location.  
Two additional control bits, C0 and C1, are used to differentiate the palette RAM read/write function from other  
operations that utilize the internal address register. C0 and C1 are respectively set high and low for writing to  
or reading from the palette RAM. Table 1 summarizes this differentiation, along with other internal address  
register operations. Note that C0 and C1 are each set low for writing to or reading from the internal address  
register.  
13  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PRINCIPLES OF OPERATION  
Table 1. Writing to or Reading from Palette RAM  
R/W  
C1  
L
C0  
L
ADDRb  
ADDRa  
FUNCTION  
write ADDR0–7: D0D7 ADDR07; 0 ADDRa,b  
write red color: D0D7 RREG; increment ADDRa,b  
write green color: D0D7 GREG; increment ADDRa,b  
L
L
L
X
L
L
X
L
L
H
L
H
H
write blue color: D0D7 BREG; increment ADDRa,b; increment ADDR07; write  
palette RAM  
L
L
H
H
L
H
L
L
L
L
L
H
H
H
X
L
X
L
read ADDR07: ADDR0–7 D0D7; 0 ADDRa,b  
H
read red color: R0R7 D0D7; increment ADDRa,b  
H
L
H
L
read green color: G0G7 D0D7; increment ADDRa,b  
read blue color: B0B7 D0D7; increment ADDRa,b; increment ADDR0–7  
H
H
X = irrelevant  
overlay register write/read  
With a few exceptions, the overlay register operation is identical to the palette RAM write/read operation (refer  
to the palette RAM write/read section). Upon writing to or reading from the internal address register, the  
additional address register ADDRab is automatically reset to 0. ADDRab counts modulo 3 as the red, green,  
and blue information is written to or read from a particular overlay register. The four overlay registers are  
addressed with internal address register values 0003. After writing/reading blue information, the internal  
address register bits ADDR0–7 are incremented to the next overlay location. After accessing overlay register  
value 03, the internal address register does not reset to 00 but is advanced to 04.  
For writing to or reading from the internal address register, C0 and C1 are set low. When accessing the overlay  
registers, C0 and C1 are set high. Refer to Table 2 for quick reference.  
Table 2. Writing to or Reading from Overlay Registers  
R/W  
C1  
L
C0  
L
ADDRb  
ADDRa  
FUNCTION  
write ADDR0-7: D0D7 ADDR0–7; 0 ADDRa,b  
write red color: D0D7 RREG; increment ADDRa,b  
write green color: D0D7 GREG; increment ADDRa,b  
L
L
L
X
L
L
X
L
H
H
H
H
H
write blue color: D0D7 BREG; increment ADDRa,b; increment ADDR07; write  
overlay register  
L
H
H
H
L
H
L
H
H
H
L
H
H
H
X
L
X
L
read ADDR07: ADDR0–7 D0D7; 0 ADDRa,b  
H
read red color: R0R7 D0D7; increment ADDRa,b  
H
L
H
L
read green color: G0G7 D0D7; increment ADDRa,b  
read blue color: B0B7 D0D7; increment ADDRa,b; increment ADDR0–7  
H
H
X = irrelevant  
14  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PRINCIPLES OF OPERATION  
control register write/read  
The four control registers are addressed with internal address register values 0407. Upon writing to or reading  
from the internal address register, the additional address bits ADDRab are automatically reset to 0. To facilitate  
read-modify-write operations, the internal address register does not increment after writing to or reading from  
the control registers. All control registers may be accessed at any time. When accessing the control registers,  
C0 and C1 are respective set low and high. Refer to Table 3 for quick reference.  
Table 3. Writing to or Reading from Control Registers  
R/W  
C1  
L
C0  
L
ADDRba  
ADDRab  
FUNCTION  
write ADDR07: D0D7 ADDR07; 0 ADDRa,b  
write control register: D0D7 control register  
read ADDR07: ADDR0–7 D0D7; 0 ADDRa,b  
read control register: control register D0D7  
L
X
L
X
L
X
L
X
L
L
H
L
L
H
L
H
H
L
X = irrelevant  
summary of internal address register operations  
Table 4 provides a summary of operations that use the internal address register. Figure 1 presents the read/write  
timing for the device.  
If an invalid address is loaded into the internal address register, the device will ignore subsequent data from the  
MPU during a write operation and will send incorrect data to the MPU during a read operation.  
Table 4. Internal Address Register Operations  
INTERNAL ADDRESS  
REGISTER VALUE  
(ADDR07) (HEX)  
ADDRab  
(counts  
modulo 3)  
C1  
C0  
MPU ACCESS  
COLOR  
00  
01  
11  
red value  
green value  
blue value  
red value  
00FF  
0003  
L
H
color palette RAM  
00  
01  
110  
H
H
over color 0 to 3  
green value  
blue value  
04  
05  
06  
07  
H
H
H
H
L
L
L
L
read mask register  
blink mask register  
command register  
test register  
interruption of display refresh pixel data (via simultaneous pixel data retrieval and MPU write)  
IftheMPUiswritingtoaparticularpaletteRAMlocationoroverlayregister(duringthebluecycle)andthedisplay  
refresh process is accessing pixel data from the same RAM location or overlay register, one or more pixels on  
the display screen may be disturbed. If the MPU write data is valid during the complete chip enable period, a  
maximum of one pixel will be disturbed.  
15  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PRINCIPLES OF OPERATION  
frame buffer interface and timing  
An internal latch and multiplexer enables the frame buffer to send the pixel data to the device at TTL rates. On  
the rising edges of LD, information for four or five consecutive pixels is latched into the device. This information  
includes the palette RAM address (up to 8 bits), the overlay register address (up to 2 bits), and the sync and  
blank information for each of the four or five consecutive pixels. The timing diagram for this pixel data input  
transfer is shown in Figure 2, along with the video output waveforms (IOR, IOG, and IOB). Note that with this  
architecture, the sync and blank timing can only be recognized with four- or five-pixel resolution.  
The display refresh process follows the first-in first-out format. Color data is output from the device in the same  
order in which palette RAM and overlay addresses are input. This process continues until all four or five pixels  
have been output, at which point the cycle will repeat.  
The overlay timing can be controlled by the pixel timing. However, this approach requires that the frame buffer  
emit additional bit planes to control the overlay selection on a pixel basis. Alternatively, the overlay timing can  
be controlled by external character or cursor generation timing (see the color selection section).  
No phase relationship between the LD and CLK signals is required (see Figure 2). Therefore, the LD signal can  
bederivedbyexternallydividingtheCLKsignalbyfourorfive. AnypropagationdelayinLDcausedbythedivider  
circuitry will not render the device nonfunctional. Regardless of the phase relationship between LD and CLK,  
the pixel, overlay, sync, and blank data are latched on the rising edge of LD.  
The device has an internal load signal (not brought out to a pin), which is synchronous to CLK and will follow  
LD by at least one and not more than four clock cycles. This internal load signal transfers the LD-latched data  
into a second set of latches, which are then internally multiplexed at the pixel clock or CLK signal frequency.  
For 4:1 or 5:1 multiplexing, a rising edge of LD should occur every four or five clock cycles. Otherwise, the  
internal load signal generation circuitry cannot lock onto or synchronize with LD.  
color selection  
The read mask, blink mask, and command registers process eight bits of color information (P0P7) and two  
bits of overlay information (OL0OL1) for each pixel every clock cycle. Control registers allow individual bit  
planes to be enabled/disabled for display and/or blinked at one of four blink rates and duty cycles (see the  
command register section, bits CR4CR5).  
By monitoring the BLK input to determine vertical retrace intervals, the device ensures that a color change due  
to blinking occurs only during the nonactive display time. Thus, a color change does not occur in the middle of  
the screen. A vertical retrace is sensed when BLK is low for at least 256 LD cycles. The color information is then  
selected from the palette RAM or overlay registers, in accordance with the processed input pixel data.  
Table 5 presents the effect of the processed input pixel data upon color selection. Note that P0 is the least  
significantbit (LSB) of the color palette RAM. When CR6 is high and both OL1 and OL0 are low, color information  
resides in the color palette RAM. When CR6 is low or either of the overlay inputs is high, the overlay registers  
provide the DAC inputs.  
16  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PRINCIPLES OF OPERATION  
Table 5. Input Pixel Data versus Color Selection  
COMMAND  
REGISTER  
BIT  
OVERLAY  
SELECT  
INPUT  
COLOR  
ADDRESS  
(HEX)  
COLOR  
INFORMATION  
CR6  
OL1  
OL0  
P7P0  
00  
01  
H
L
L
L
L
color palette entry 00  
color palette entry 01  
H
H
L
L
L
H
H
L
L
H
L
H
FF  
XX  
XX  
XX  
XX  
color palette entry FF  
overlay register 0  
overlay register 1  
overlay register 2  
overlay register 3  
L
X
X
X
X = irrelevant  
video generation  
The TLC34058 presents 8 bits of red, green, and blue information from either the palette RAM or overlay  
registers to the three 8-bit DACs during every clock cycle. The DAC outputs produce currents that correlate to  
their respective color input data. These output currents are translated to voltage levels that drive the color CRT  
monitor. The SYNC and BLK signals adjust the DAC analog output currents to generate specific output levels  
that are required in video applications. Table 6 shows the effectofSYNCandBLKupon the DAC output currents.  
Figure 3 presents the overall composite video output waveforms. Note that only the green output (IOG) contains  
sync information.  
The DAC architecture ensures monotonicity and reduced switching transients by using identical current sources  
and routing their outputs to the DAC current output or GND. Utilizing identical current sources eliminates the  
need for precision component ratios within the DAC ladder circuitry. An on-chip operational amplifier stabilizes  
the DAC full-scale output current over temperature and power supply variations.  
Table 6. Effects of Sync and Blank Upon DAC Output Currents (see Note 7)  
IOG  
(mA)  
IOR, IOB  
(mA)  
DAC  
INPUTS  
DESCRIPTION  
SYNC  
BLK  
WHITE  
DATA  
26.67  
data + 9.05  
data + 1.44  
9.05  
19.05  
H
H
L
H
H
H
H
H
L
FF  
data  
data  
00  
data + 1.44  
DATA w/o SYNC  
BLACK  
data + 1.44  
1.44  
1.44  
0
H
L
BLACK w/o SYNC  
BLACK  
1.44  
00  
7.62  
H
L
xx  
SYNC  
0
0
L
xx  
NOTE 7: The data in this table was measured with full-scale IOG current = 26.67 mA, R  
= 523 , V = 1.235 V.  
ref  
set  
command register  
The MPU can write to or read from the command register at any time. The command register is not initialized.  
CR0 corresponds to the D0 data bus line. Refer to Table 7 for quick reference.  
17  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PRINCIPLES OF OPERATION  
Table 7. Command Register  
COMMAND  
COMMAND REGISTER BIT  
REGISTER  
COMMAND REGISTER BIT DESCRIPTION  
This bit selects either 4:1 or 5:1 multiplexing for the palette RAM and overlay register address,  
FUNCTION  
BIT  
CR7  
Multiplex Select Bit  
low: selects 4:1 multiplexing SYNC, and BLK inputs. If 4:1 multiplexing is selected, the device ignores the ‘E’ palette RAM  
high: selects 5:1 multiplexing and overlay register address inputs. These inputs should be connected to GND, and the LD  
signal frequency should be 1/4 of the clock frequency. If 5:1 is specified, all of the palette  
RAM and overlay register address inputs are used and the LD signal should be 1/5 of the  
clock frequency.  
CR6  
RAM Enable Bit  
low: use overlay register 0  
high: use palette RAM  
When the overlay select bits, OL0 and OL1, are both low, this bit causes the DACs color  
information to be selected from overlay register 0 or the palette RAM.  
CR5, CR4  
Blink Rate Select Bits  
00: 16 on, 48 off (25/75)  
01: 16 on, 16 off (50/50)  
10: 32 on, 32 off (50/50)  
11: 64 on, 64 off (50/50)  
OL1 Blink Enable Bit  
low: disable blinking  
These two bits select the blink rate cycle time and duty cycle. The on and off numbers specify  
the blink rate cycle time as the number of vertical periods.  
The numbers in parentheses specify the duty cycle in (on/off) percent.  
CR3  
CR2  
CR1  
CR0  
If this bit is a high, the OL1 [AE] inputs will toggle between a logic 0 and their input value at  
the selected blink rate before latching the incoming pixel data. Simultaneously, command  
register CR1 must be set high. If the CR2 bit is low, the OL0 [AE] inputs will be unaffected.  
high: enable blinking  
OL0 Blink Enable Bit  
low: disable blinking  
high: enable blinking  
If this bit is high, the OL0 [AE] inputs will toggle between a logic 0 and their input value at the  
selected blink rate before latching the incoming pixel data. Simultaneously, command register  
CR0 must be set high. If the CR2 bit is low, the OL0 [AE] inputs will be unaffected.  
OL1 Display Enable Bit  
low: disable  
high: enable  
If this bit is low, the OL1 [AE] inputs are forced to a logic 0 before latching the incoming pixel  
data. If the CR1 bit is high, the OL1 [AE] inputs will be affected.  
OL0 Display Enable Bit  
low: disable  
If this bit is low, the OL0 [AE] inputs are forced to a logic 0 before latching the incoming pixel  
data. If the CR0 bit is high, the OL0 [AE] inputs will be affected.  
high: enable  
read mask register  
The read mask register is used to enable (high) or disable (low) the eight bit planes (P0P7) within the palette  
RAM addresses. The enabling or disabling is accomplished by logic ANDing the read mask register with the  
palette RAM address before addressing the palette RAM. Note that read mask register bit 0 corresponds to data  
bus line D0. The MPU can write to or read from this register at any time. This register is not initialized.  
blink mask register  
The blink mask register is used to enable (high) or disable (low) the blinking of bit planes within the palette RAM  
addresses. For example, if blink mask register bit n is set high, the true Pn value will address the palette RAM  
during the on portion of the blink cycle. During the off part of the blink cycle, the Pn value will be replaced with  
a 0 before the palette RAM is addressed. The blink rate cycle time and duty cycle is specified by command  
register bits CR4 and CR5. If blink mask register bit n is set low, the true Pn value will always address the palette  
RAM. Note that blink mask register bit 0 corresponds to data bus line D0. This register is not initialized.  
18  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
PRINCIPLES OF OPERATION  
test register  
The test register allows the MPU to read the inputs to the DAC for diagnostic purposes. The MPU can write to  
or read from this register at any time. This register is not initialized. Only the four least significant bits can be  
written to, while all 8 bits can be read. Note that test register bit 0 corresponds to data bus line D0.  
A function description of this register is presented in Table 8.  
Table 8. Functional Description of Test Register  
TR3–TR0  
0100  
D4–D7  
FUNCTION  
4 MSBs of blue data input  
4 MSBs of green data input  
4 MSBs of red data input  
4 LSBs of blue data input  
4 LSBs of green data input  
4 LSBs of red data input  
0010  
MPU read or write D0D3  
0001  
1100  
1010  
MPU read D0D7  
1001  
To read the DAC inputs, the MPU must first load the test register’s four least significant bits. One of the test  
register bits, b0 (red DAC), b1 (green DAC) or b2 (blue DAC), must be set high and the other two bits low. This  
process determines whether the inputs to the red, green, or blue DAC will be read. The test register bit b3 must  
be set high for reading the four most significant DAC inputs or low for reading the four least significant inputs.  
The MPU then reads the test register while the test register’s four least significant bits contain the previously  
written information. Note that either the device clock must be slowed down to the MPU cycle time or the same  
pixel and overlay data must be continuously presented to the device during the entire MPU read cycle.  
19  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
APPLICATION INFORMATION  
device ground plane  
Use of a four-layer PC board is recommended. All of the ground pins, voltage reference circuitry, power supply  
bypass circuitry, analog output signals, and digital signals, as well as any output amplifiers, should have a  
common ground plane.  
device analog power plane (APP)  
Thedeviceplusassociatedanalogcircuitryshouldhaveaseparateanalogpowerplane(APP)forV .TheAPP  
DD  
powers the device, voltage reference circuitry, and any output amplifiers. It should be connected to the overall  
PCB power plane (V ) at a single point through a ferrite bead, which should be within 3 inches of the device.  
DD  
This connection is shown in Figure 4.  
PCB power plane and PCB ground plane  
The PCB power plane powers the digital circuitry. The PCB power plane and PCB ground planes should not  
overlay the APP unless the plane-to-plane noise is common-mode.  
supply decoupling  
Bypass capacitors should have the shortest possible lead lengths to reduce lead inductance. For best results,  
a parallel combination of 0.1-µF ceramic and 0.01-µF chip capacitors should be connected from each V  
pin  
DD  
to GND. If chip capacitors are not feasible, radial-lead ceramic capacitors may be substituted. These capacitors  
should be located as close to the device as possible.  
The performance of the internal power supply noise rejection circuitry decreases with noise frequency. If a  
switching power supply is used for V , close attention must be paid to reducing power supply noise. To reduce  
DD  
such noise, the APP could be powered with a three-terminal voltage regulator.  
digital interconnect  
The digital inputs should be isolated from the analog outputs and other analog circuitry as much as possible.  
Shielding the digital inputs will reduce noise on the power and ground lines. The lengths of clock and data lines  
should be minimized to prevent high-frequency clock and data information from inducing noise into the analog  
part of the video system. Active termination resistors for the digital inputs should be connected to the PCB power  
plane, not the APP. These digital inputs should not overlay the device ground plane.  
analog signal interconnect  
Minimizing the lead lengths between groups of V  
and GND minimizes inductive ringing. To minimize noise  
DD  
pickup due to reflections and impedance mismatch, the device should be located as close to the output  
connectors as possible. The external voltage reference should also be as close to the device as possible, to  
minimize noise pickup.  
To maximize high-frequency supply voltage rejection, the video output signals should overlay the device ground  
plane and not the APP.  
Eachanalog output should have a 75-load resistor connected to GND for maximum performance. Tominimize  
reflections, the resistor connections between current output and ground should be as close to the device as  
possible.  
20  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TLC34058  
256 × 24 COLOR PALETTE  
SLAS050 – D3961, NOVEMBER 1991  
APPLICATION INFORMATION  
clock interfacing  
To facilitate the generation of high-frequency clock signals, the CLK and CLK pins are designed to accept  
differential signals that can be generated with 5-V (single supply) ECL logic. Due to noise margins of the CMOS  
process, the CLK and CLK inputs must be differential signals. Connecting a single-ended clock signal to CLK  
and connecting CLK to GND will not work.  
The CLK and CLK pins require termination resistors (220-to V  
to the device as possible.  
and 330-to GND) that should be as close  
DD  
LD is typically generated by dividing the clock frequency by four (4:1 multiplexing) or five (5:1 multiplexing) and  
translating the resulting signal to TTL levels. Since no phase relationship between the LD and CLK signals is  
required, any propagation delay in LD caused by the divider circuitry will not affect device performance.  
The pixel, overlay, sync and blank data are latched on the rising edge of LD. LD may also be used as the shift  
clock for the video DRAMs. In short, LD provides the fundamental timing for the video system.  
The Bt438 Clock Generator (from Brooktree) is recommended for generating the CLK, CLK, LD, and REF  
signals. It supports both 4:1 and 5:1 multiplexing. Alternatively, the Bt438 can interface the device to a TTL clock.  
Figure 5 illustrates the interconnection between the Bt438 and the device.  
21  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Apr-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CPGA  
CPGA  
PLCC  
PLCC  
CPGA  
CPGA  
CFP  
Drawing  
5962-8992801XA  
5962-8992801XC  
TLC34058-110FN  
TLC34058-110FNR  
TLC34058-110MGA  
TLC34058-110MGAB  
TLC34058-110MHFG  
TLC34058-135FN  
TLC34058-80FN  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
GA  
84  
84  
84  
84  
84  
84  
84  
84  
84  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
GA  
FN  
FN  
GA  
GA  
HFG  
FN  
PLCC  
PLCC  
FN  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPLC004A – OCTOBER 1994  
FN (S-PQCC-J**)  
PLASTIC J-LEADED CHIP CARRIER  
20 PIN SHOWN  
Seating Plane  
0.004 (0,10)  
0.180 (4,57) MAX  
0.120 (3,05)  
D
0.090 (2,29)  
D1  
0.020 (0,51) MIN  
3
1
19  
0.032 (0,81)  
0.026 (0,66)  
4
18  
D2/E2  
D2/E2  
E
E1  
8
14  
0.021 (0,53)  
0.013 (0,33)  
0.050 (1,27)  
9
13  
0.007 (0,18)  
M
0.008 (0,20) NOM  
D/E  
D1/E1  
D2/E2  
NO. OF  
PINS  
**  
MIN  
0.385 (9,78)  
MAX  
MIN  
MAX  
MIN  
MAX  
0.395 (10,03)  
0.350 (8,89)  
0.356 (9,04)  
0.141 (3,58)  
0.191 (4,85)  
0.291 (7,39)  
0.341 (8,66)  
0.169 (4,29)  
0.219 (5,56)  
0.319 (8,10)  
0.369 (9,37)  
20  
28  
44  
52  
68  
84  
0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)  
0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)  
0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)  
0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)  
1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)  
4040005/B 03/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-018  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
www.ti.com/audio  
Data Converters  
DLP® Products  
Automotive  
www.ti.com/automotive  
www.ti.com/communications  
Communications and  
Telecom  
DSP  
dsp.ti.com  
Computers and  
Peripherals  
www.ti.com/computers  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Consumer Electronics  
Energy  
www.ti.com/consumer-apps  
www.ti.com/energy  
Logic  
Industrial  
www.ti.com/industrial  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Medical  
www.ti.com/medical  
microcontroller.ti.com  
www.ti-rfid.com  
Security  
www.ti.com/security  
Space, Avionics &  
Defense  
www.ti.com/space-avionics-defense  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
Video and Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2010, Texas Instruments Incorporated  

相关型号:

TLC34058-110CFN

IC,D/A CONVERTER,TRIPLE,8-BIT,CMOS,LDCC,84PIN
TI

TLC34058-110CGA

IC,D/A CONVERTER,TRIPLE,8-BIT,CMOS,PGA,84PIN
TI

TLC34058-110FN

256 × 24 COLOR PALETTE
TI

TLC34058-110FNR

256 × 24 COLOR PALETTE
TI

TLC34058-110GA

暂无描述
TI

TLC34058-110M

256 x 24 COLOR PALETTE
TI

TLC34058-110MGA

256 x 24 COLOR PALETTE
TI

TLC34058-110MGAB

256 × 24 COLOR PALETTE
TI

TLC34058-110MHFG

256 x 24 COLOR PALETTE
TI

TLC34058-125GA

1280X1024 PIXELS PALETTE-DAC DSPL CTLR, CPGA84, CERAMIC, GA-84
TI

TLC34058-135CFN

IC,D/A CONVERTER,TRIPLE,8-BIT,CMOS,LDCC,84PIN
TI

TLC34058-135FN

256 × 24 COLOR PALETTE
TI