TLC352CPWR [TI]

LinCMOS DUAL DIFFERENTAL COMPARATOR; 路LinCMOS DUAL高差比较器
TLC352CPWR
型号: TLC352CPWR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LinCMOS DUAL DIFFERENTAL COMPARATOR
路LinCMOS DUAL高差比较器

比较器 放大器 放大器电路 光电二极管
文件: 总16页 (文件大小:864K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁ ꢂꢃ ꢄꢅ  
ꢋꢌꢍ ꢁ ꢋꢎ ꢏꢏ ꢐꢑ ꢐꢒꢀ ꢎꢍ ꢁ ꢂꢉ ꢈꢓꢍ ꢑꢍꢀꢉ ꢑ  
SLCS016A − SEPTEMBER 1985 − REVISED SEPTEMBER 2002  
TLC352C, TLC352I . . . D OR P PACKAGE  
(TOP VIEW)  
D
D
D
Single- or Dual-Supply Operation  
Wide Range of Supply Voltages  
1.5 V to 18 V  
1OUT  
1IN−  
1IN+  
GND  
V
DD  
1
2
3
4
8
7
6
5
2OUT  
2IN−  
2IN+  
Very Low Supply Current Drain  
150 µA Typ at 5 V  
65 µA Typ at 1.4 V  
D
D
D
D
D
Built-In ESD Protection  
symbol (each comparator)  
12  
High Input Impedance . . . 10 Typ  
Extremely Low Input Bias Current 5 pA Typ  
Ultrastable Low Input Offset Voltage  
IN+  
IN−  
OUT  
Input Offset Voltage Change at Worst-Case  
Input Conditions Typically 0.23 µV/ Month,  
Including the First 30 Days  
D
D
D
Common-Mode Input Voltage Range  
Includes Ground  
Outputs Compatible With TTL, MOS, and  
CMOS  
Pin-Compatible With LM393  
description  
This device is fabricated using LinCMOStechnology and consists of two independent voltage comparators,  
each designed to operate from a single power supply. Operation from dual supplies is also possible if the  
difference between the two supplies is 1.4 V to 18 V. Each device features extremely high input impedance  
12  
(typically greater than 10 ), which allows direct interface to high-impedance sources. The output are  
n-channel open-drain configurations and can be connected to achieve positive-logic wired-AND relationships.  
The capability of the TLC352 to operate from 1.4-V supply makes this device ideal for low-voltage battery  
applications.  
The TLC352 has internal electrostatic discharge (ESD) protection circuits and has been classified with a 2000-V  
ESD rating tested under MIL-STD-883C, Method 3015. However, care should be exercised in handling this  
device as exposure to ESD may result in degradation of the device parametric performance.  
The TLC352C is characterized for operation from 0°C to 70°C. The TLC352I is characterized for operation over  
the industrial temperature range of − 40°C to 85°C.  
AVAILABLE OPTIONS  
PACKAGE  
V
IO  
max  
T
A
SMALL-OUTLINE  
(D)  
PLASTIC DIP  
(P)  
AT 25°C  
0°C to 70°C  
5 mV  
5 mV  
TLC352CD  
TLC352ID  
TLC352CP  
TLC352IP  
− 40°C to 85°C  
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC352 CDR).  
LinCMOS is a trademark of Texas Instruments Incorporated.  
ꢀꢝ  
Copyright 2002, Texas Instruments Incorporated  
ꢙ ꢝ ꢚ ꢙꢆ ꢇꢧ ꢕꢔ ꢘ ꢠꢠ ꢞꢘ ꢖ ꢘ ꢗ ꢝ ꢙ ꢝ ꢖ ꢚ ꢢ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁ ꢂ ꢃꢄ ꢅ  
 
ꢋ ꢌꢍ ꢁ ꢋꢎ ꢏ ꢏꢐ ꢑꢐ ꢒꢀ ꢎ ꢍꢁ ꢂꢉ ꢈ ꢓꢍꢑꢍꢀꢉ ꢑ  
SLCS016A − SEPTEMBER 1985 − REVISED SEPTEMBER 2002  
equivalent schematic (each comparator)  
Common to All Channels  
V
DD  
OUT  
GND  
IN−  
IN+  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage, V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V  
DD  
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V  
ID  
Input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
I
DD  
Input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.3 V to 18 V  
I
Output voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V  
O
Input current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 mA  
I
Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
O
Duration of output short circuit to ground (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited  
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table  
Operating free-air temperature range, T TLC352C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
A
TLC352I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 85°C  
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P package . . . . . . . . . . . . . . . . . 260°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltage values except differential voltages are with respect to the network ground.  
2. Differential voltages are at IN+ with respect to IN −.  
3. Short circuits from outputs to V  
DD  
can cause excessive heating and eventual device destruction.  
DISSIPATION RATING TABLE  
T
25°C  
DERATING  
FACTOR  
DERATE  
ABOVE T  
T
= 70°C  
T = 85°C  
A
A
A
PACKAGE  
POWER RATING  
POWER RATING POWER RATING  
A
D
P
500 mW  
500 mW  
5.8 mW/°C  
64°C  
N/A  
464 mW  
500 mW  
377 mW  
500 mW  
N/A  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅ  
TM  
ꢁꢨ  
SLCS016A − SEPTEMBER 1985 − REVISED SEPTEMBER 2002  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
Template Release Date: 7−11−94  
ꢀ ꢁ ꢂꢃ ꢄ ꢅ  
TM  
ꢁꢨ  
ꢓꢍ  
ꢍꢀꢉ  
SLCS016A − SEPTEMBER 1985 − REVISED SEPTEMBER 2002  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅ  
ꢋꢌꢍ ꢁ ꢋꢎ ꢏꢏ ꢐꢑ ꢐꢒꢀ ꢎꢍ ꢁ ꢂꢉ ꢈꢓꢍ ꢑꢍꢀꢉ ꢑ  
SLCS016A − SEPTEMBER 1985 − REVISED SEPTEMBER 2002  
PARAMETER MEASUREMENT INFORMATION  
The digital output stage of the TLC352 can be damaged if it is held in the linear region of the transfer curve.  
Conventional operational amplifier/comparator testing incorporates the use of a servo loop that is designed to force  
the device output to a level within this linear region. Since the servo-loop method of testing cannot be used, the  
following alternative for measuring parameters such as input offset voltage, common-mode rejection, etc., are  
offered.  
To verify that the input offset voltage falls within the limits specified, the limit value is applied to the input as shown  
in Figure 1(a). With the noninverting input positive with respect to the inverting input, the output should be high. With  
the input polarity reversed, the output should be low.  
A similar test can be made to verify the input offset voltage at the common-mode extremes. The supply voltages can  
be slewed as shown in Figure 1(b) for the V  
accuracy.  
test, rather than changing the input voltages, to provide greater  
ICR  
A close approximation of the input offset voltage can be obtained by using a binary search method to vary the  
differential input voltage while monitoring the output state. When the applied input voltage differential is equal but  
opposite in polarity to the input offset voltage, the output changes state.  
5 V  
1 V  
5.1 kΩ  
5.1 kΩ  
+
+
Applied V  
Limit  
Applied V  
Limit  
IO  
IO  
V
O
V
O
− 4 V  
(a) V WITH V = 0  
IO IC  
(b) V WITH V = 4 V  
IO IC  
Figure 1. Method for Verifying That Input Offset Voltage Is Within Specified Limits  
5
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ꢀ ꢁ ꢂ ꢃꢄ ꢅ  
ꢋ ꢌꢍ ꢁ ꢋꢎ ꢏ ꢏꢐ ꢑꢐ ꢒꢀ ꢎ ꢍꢁ ꢂꢉ ꢈ ꢓꢍꢑꢍꢀꢉ ꢑ  
SLCS016A − SEPTEMBER 1985 − REVISED SEPTEMBER 2002  
PARAMETER INFORMATION  
Figure 2 illustrates a practical circuit for direct dc measurement of input offset voltage that does not bias the  
comparator into the linear region. The circuit consists of a switching-mode servo loop in which U1a generates a  
triangular waveform of approximately 20-mV amplitude. U1b acts as a buffer, with C2 and R4 removing any residual  
dc offset. The signal is then applied to the inverting input of the comparator under test, while the noninverting input  
is driven by the output of the integrator formed by U1c through the voltage divider formed by R9 and R10. The loop  
reaches a stable operating point when the output of the comparator under test has a duty cycle of exactly 50%, which  
can only occur when the incoming triangle wave is sliced symmetrically or when the voltage at the noninverting input  
exactly equals the input offset voltage.  
Voltage divider R9 and R10 provides a step up of the input offset voltage by a factor of 100 to make measurement  
easier. The values of R5, R8, R9, and R10 can significantly influence the accuracy of the reading; therefore, it is  
suggested that their tolerance level be 1% or lower.  
Measuring the extremely low values of input current requires isolation from all other sources of leakage current and  
compensation for the leakage of the test socket and board. With a good picoammeter, the socket and board leakage  
can be measured with no device in the socket. Subsequently, this open-socket leakage value can be subtracted from  
the measurement obtained with a device in the socket to obtain the actual input current of the device.  
R5  
1.8 kΩ, 1%  
V
DD  
C3 0.68 µF  
U1b  
1/4 TLC274CN  
C2  
U1c  
1/4 TLC274CN  
1 µF  
R6  
Buffer  
+
5.1 kΩ  
+
DUT  
V
IO  
(X100)  
R7  
1MΩ  
R4  
47 kΩ  
R1  
Integrator  
240 kΩ  
R8  
1.8 k, 1%  
C4  
0.1 µF  
U1a  
+
1/4 TLC274CN  
C1  
0.1 µF  
Triangle  
Generator  
R9  
10 k, 1%  
R10  
100 , 1%  
R2  
10 kΩ  
R3  
100 kΩ  
Figure 2. Circuit for Input Offset Voltage Measurement  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁ ꢂꢃ ꢄꢅ  
ꢋꢌꢍ ꢁ ꢋꢎ ꢏꢏ ꢐꢑ ꢐꢒꢀ ꢎꢍ ꢁ ꢂꢉ ꢈꢓꢍ ꢑꢍꢀꢉ ꢑ  
SLCS016A − SEPTEMBER 1985 − REVISED SEPTEMBER 2002  
PARAMETER MEASUREMENT INFORMATION  
Response time is defined as the interval between the application of an input step function and the instant when the  
output reaches 50% of its maximum value. Response time, low-to-high-level output, is measured from the leading  
edge of the input pulse, while response time, high-to-low level output, is measured from the trailing edge of the input  
pulse. Response-time measurement at low input signal levels can be greatly affected by the input offset voltage. The  
offset voltage should be balanced by the adjustment at the inverting input (as shown in Figure 3) so that the circuit  
is just at the transition point. Then a low signal, for example 105-mV or 5-mV overdrive, causes the output to change  
state.  
V
DD  
5.1 kΩ  
1 µF  
Pulse Generator  
DUT  
50 Ω  
C
L
(see Note A)  
1 V  
Input  
Offset Voltage  
Compensation  
Adjustment  
10 Ω  
10 Turn  
1 kΩ  
0.1 mF  
− 1 V  
TEST CIRCUIT  
Overdrive  
Overdrive  
Input  
Input  
100 mV  
100 mV  
90%  
50%  
10%  
90%  
10%  
Low-to-High-  
Level Output  
50 %  
High-to-Low-  
Level Output  
t
t
t
r
f
t
PLH  
PHL  
VOLTAGE WAVEFORMS  
NOTE A: C includes probe and jig capacitance.  
L
Figure 3. Response, Rise, and Fall Times Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
TLC352CD  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOIC  
SOIC  
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
352C  
TLC352CDG4  
TLC352CDR  
TLC352CDRG4  
TLC352CP  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
75  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
0 to 70  
352C  
SOIC  
Green (RoHS  
& no Sb/Br)  
0 to 70  
352C  
SOIC  
D
Green (RoHS  
& no Sb/Br)  
0 to 70  
352C  
PDIP  
P
Pb-Free  
(RoHS)  
0 to 70  
TLC352CP  
TLC352CP  
P352  
TLC352CPE4  
TLC352CPWR  
TLC352CPWRG4  
TLC352ID  
PDIP  
P
50  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
0 to 70  
TSSOP  
TSSOP  
SOIC  
PW  
PW  
D
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
0 to 70  
Green (RoHS  
& no Sb/Br)  
0 to 70  
P352  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
352I  
TLC352IDG4  
TLC352IDR  
SOIC  
D
75  
Green (RoHS  
& no Sb/Br)  
352I  
SOIC  
D
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
352I  
TLC352IDRG4  
TLC352IP  
SOIC  
D
Green (RoHS  
& no Sb/Br)  
352I  
PDIP  
P
Pb-Free  
(RoHS)  
TLC352IP  
TLC352IP  
P352I  
TLC352IPE4  
TLC352IPW  
PDIP  
P
50  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
150  
150  
2000  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
TLC352IPWG4  
TLC352IPWR  
Green (RoHS  
& no Sb/Br)  
P352I  
Green (RoHS  
& no Sb/Br)  
P352I  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Orderable Device  
TLC352IPWRG4  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
TSSOP  
PW  
8
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-40 to 85  
P352I  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TLC352CDR  
TLC352CPWR  
TLC352IDR  
SOIC  
TSSOP  
SOIC  
D
PW  
D
8
8
8
8
2500  
2000  
2500  
2000  
330.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
12.4  
6.4  
7.0  
6.4  
7.0  
5.2  
3.6  
5.2  
3.6  
2.1  
1.6  
2.1  
1.6  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
TLC352IPWR  
TSSOP  
PW  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TLC352CDR  
TLC352CPWR  
TLC352IDR  
SOIC  
TSSOP  
SOIC  
D
PW  
D
8
8
8
8
2500  
2000  
2500  
2000  
340.5  
367.0  
340.5  
367.0  
338.1  
367.0  
338.1  
367.0  
20.6  
35.0  
20.6  
35.0  
TLC352IPWR  
TSSOP  
PW  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
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