TLC555TDF1 [TI]

DIE LinCMOS 计时器 | TD | 0;


型号：	TLC555TDF1
厂家：	TEXAS INSTRUMENTS
描述：	DIE LinCMOS 计时器 \| TD \| 0 信号电路模拟波形发生功能
文件：	总5页 (文件大小：71K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TLC555-DIE

www.ti.com

SLFS079 –JULY 2012

LinCMOS™ TIMER

FEATURES

•

Very Low Power Consumption

•

Functionally Interchangeable With the NE555;

Has Same Pinout

Capable of Operation in Astable Mode

CMOS Output Capable of Swinging Rail to Rail

High Output-Current Capability

ESD Protection Exceeds 2000 V Per

MIL-STD-883C, Method 3015.2

Available in Q-Temp Automotive

Output Fully Compatible With CMOS, TTL, and

MOS

–

High Reliability Automotive Applications

Configuration Control/Print Support

Qualification to Automotive Standards

•

Low Supply Current Reduces Spikes During

Output Transitions

Single-Supply Operation From 2 V to 15 V

DESCRIPTION

The TLC555 is a monolithic timing circuit fabricated using the TI LinCMOS process. The timer is fully compatible

with CMOS, TTL, and MOS logic and operates at frequencies up to 2 MHz. Because of its high input impedance,

this device uses smaller timing capacitors than those used by the NE555. As a result, more accurate time delays

and oscillations are possible. Power consumption is low across the full range of power supply voltage.

Like the NE555, the TLC555 has a trigger level equal to approximately one-third of the supply voltage and a

threshold level equal to approximately two-thirds of the supply voltage. These levels can be altered by use of the

control voltage terminal (CONT). When the trigger input (TRIG) falls below the trigger level, the flip-flop is set and

the output goes high. If TRIG is above the trigger level and the threshold input (THRES) is above the threshold

level, the flip-flop is reset and the output is low. The reset input (RESET) can override all other inputs and can be

used to initiate a new timing cycle. If RESET is low, the flip-flop is reset and the output is low. Whenever the

output is low, a low-impedance path is provided between the discharge terminal (DISCH) and GND. All unused

inputs should be tied to an appropriate logic level to prevent false triggering.

While the CMOS output is capable of sinking over 100 mA and sourcing over 10 mA, the TLC555 exhibits greatly

reduced supply-current spikes during output transitions. This minimizes the need for the large decoupling

capacitors required by the NE555.

ORDERING INFORMATION⁽¹⁾

PACKAGE

DESIGNATOR

PRODUCT

PACKAGE

ORDERABLE PART NUMBER

PACKAGE QUANTITY

TLC555TDF1

TLC555TDF2

210

TLC555

Bare die in waffle pack⁽²⁾

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality

Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room

temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not

warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

LinCMOS is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TLC555-DIE

SLFS079 –JULY 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

BARE DIE INFORMATION

BACKSIDE

POTENTIAL

BOND PAD

METALLIZATION COMPOSITION

BOND PAD

THICKNESS

DIE THICKNESS

BACKSIDE FINISH

11 mils.

Silicon with backgrind

Floating

TiW/AlSi (1%)Cu (0.5%)

760 nm

Submit Documentation Feedback

TLC555-DIE

www.ti.com

SLFS079 –JULY 2012

Table 1. Bond Pad Coordinates in Microns⁽¹⁾

DESCRIPTION

PAD NUMBER

X MIN

102.87

373.38

773.43

1432.56

849.63

102.87

Y MIN

462.28

104.14

327.66

1064.26

802.64

X MAX

204.47

474.98

875.03

1534.16

951.23

204.47

Y MAX

563.88

205.74

429.26

1165.86

1151.89

1165.86

904.24

GND

TRIG

OUT

RESET

CONT

THRES

DISCH

VDD

(1) Substrate N/C.

Submit Documentation Feedback

PACKAGE OPTION ADDENDUM

www.ti.com

6-Aug-2012

PACKAGING INFORMATION

Status ⁽¹⁾

Eco Plan ⁽²⁾

MSL Peak Temp ⁽³⁾

Samples

Orderable Device

Package Type Package

Drawing

Pins

Package Qty

Lead/

Ball Finish

(Requires Login)

TLC555TDF1

TLC555TDF2

ACTIVE

210

TBD

Call TI

N / A for Pkg Type

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

IMPORTANT NOTICE

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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

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TLC555TDF1 [TI]

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