TLC59213IPWR [TI]
8-BIT PARALLEL IN/OUT DARLINGTON SOURCE DRIVER WITH LATCH; 与LATCH 8位并行输入/输出达林顿源极驱动器
| 型号： | TLC59213IPWR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 8-BIT PARALLEL IN/OUT DARLINGTON SOURCE DRIVER WITH LATCH |
| 文件： | 总13页 (文件大小：539K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLC59213
TLC59213A
www.ti.com
SLVS867A –MAY 2009–REVISED MARCH 2010
8-BIT PARALLEL IN/OUT DARLINGTON SOURCE DRIVER WITH LATCH
Check for Samples: TLC59213, TLC59213A
1
FEATURES
APPLICATIONS
•
•
•
Lamp and Display (LED)
Hammer
Relay
•
Output Current on Each Channel
(IOUT Max = –500 mA)
•
•
•
VCE(sus) = 13.2 V
Input Compatible With TTL/5-V CMOS
N OR PW PACKAGE
(TOP VIEW)
Clear (CLR) and Clock (CLK) TTL/CMOS
Control Inputs
V
1
2
20
19
18
17
16
15
14
13
12
11
CLR
D1
CC
•
•
•
•
•
CLR Control Input to Off the Output
Darlington Source Driver
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
GND
3
D2
Clock Input Up to 1 MHz
4
D3
5
D4
Enhanced Hold Time (th) on TLC59213A
Temperature Range: –40°C to 85°C
6
D5
7
D6
8
D7
9
D8
10
CLK
DESCRIPTION
The TLC59213 and TLC59213A are 8-bit source drivers with input latch with CLK input and CLR to set the
output OFF. The TLC59213 and TLC59213A have large output source currents up to 500 mA with Darlington
transistor and collectors tied to VCC. These feature make the device optimum level of driving the matrix of ink jet
printer head, LEDs, and the scan-side of resistor's matrix. The TLC59213 and TLC59213A differ only in the Data
Hold Time Specification (th).
The clamp diode is between output and ground for switching inductive load.
All inputs are TTL/CMOS, which enable to any logic-level inputs such as MCU, CPU or SN74LV594 (serial to
parallel) and the output enable LED matrix display. It can also be used with another device sink driver such as
TLC59210, TLC59211 and TLC59212.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TLC59213IN
PDIP – N
Tube of 20
TLC59213IN
TSSOP – PW
PDIP – N
Reel of 2000
Tube of 20
TLC59213IPWR
Y59213
–40°C to 85°C
TLC59213AIN
TLC59213AIN
Reel of 2000
Reel of 250
TLC59213AIPWR
TLC59213AIPWT
TSSOP – PW
Y59213A
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TLC59213
TLC59213A
SLVS867A –MAY 2009–REVISED MARCH 2010
www.ti.com
FUNCTION TABLE
(EACH LATCH)(1)
INPUTS
OUTPUT
Y
CLR
L
CLK
D
X
L
X
↑
↑
L
↓
Z (OFF)
Z (OFF)
H (ON)
Y0
H
H
H
X
X
H
H
Y0
(1) L: Low-level
H: High-level
X: Irrelevant
↑: Rising edge
↓: Falling edge
Z : High-impedance (off)
BLOCK DIAGRAM
V
Y3
17
Y4
16
Y5
15
Y6
14
Y7
13
Y8
12
Y1
19
Y2
18
CC
20
1
CLR
CLK
Q_
D
Q_
D
Q_
D
Q_
D
Q_
D
Q_
D
Q_
Q_
D
10
R
CK
R
CK
R
CK
R
CK
R
CK
R
CK
R
CK
R
CK
D
4
5
6
7
8
9
11
2
3
D3
D4
D5
D6
D7
D8
GND
D1
D2
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
15
UNIT
VDD
VI
Supply voltage range
Input voltage range
Collector-emitter voltage
Peak output current
Input clamp current
Output clamp current
–0.5
–0.5
–0.5
V
V
VCC + 0.5
15
V
IO
–500
–20
mA
mA
mA
IIK
IOK
VI < 0 V
VO < 0 V
–500
69
N package
PW package
qJA
Package thermal impedance(2)
Storage temperature range
°C/W
°C
83
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
2
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TLC59213 TLC59213A
TLC59213
TLC59213A
www.ti.com
SLVS867A –MAY 2009–REVISED MARCH 2010
RECOMMENDED OPERATING CONDITIONS
CONDITIONS
MIN
4.5
2
MAX
UNIT
VCC
VIH
VIL
Supply voltage
13.2
V
V
V
High-level input voltage
Low-level input voltage
0.8
400
200
350
170
85
Duty cycle < 10%
Duty cycle < 50%
Duty cycle < 10%
Duty cycle < 50%
N package
IO
Output current (8 channel)
mA
°C
PW package
TA
Operating free-air temperature
–40
Copyright © 2009–2010, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TLC59213 TLC59213A
TLC59213
TLC59213A
SLVS867A –MAY 2009–REVISED MARCH 2010
www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC = 13.2 V, Outputs off
MIN
TYP
MAX UNIT
ICEX
Output leakage current
2
2.35
2.15
1.96
1
µA
IOUT = –350 mA
VCE(sus)
Output saturation voltage
IOUT = –225 mA
V
IOUT = –100 mA
II
Input current
VCC = 13.2 V, VI = 0 or 13.2 V
If = –350 mA
µA
V
Vf
Clamp forward voltage
–2
All outputs OFF
All outputs ON
4.6
4.8
13
13
10
VCC = 13.2 V,
VI = 0 or 13.2 V
ICC
CI
Supply current
mA
pF
Input capacitance
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted), see Figure 3
PARAMETER
TEST CONDITIONS
MIN
50
MAX UNIT
D before CLK ↑
ns
ns
tsu
Setup time
CLR high before CLK ↑
50
TLC59213,
TLC59213A
TA = -40°C to 85°C
50
TLC59213
TA = 0°C to 70°C
25
15
th
Hold time
D after CLK ↑
ns
ns
TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V
TA = 0°C to 70°C, VCC = 10.8 V to 13.2 V
TLC59213A
19
tw
Pulse width
CLK, CLR
100
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted), see Figure 3
TA = 25°C
TA = –40°C to 85°C
MIN MAX
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
PARAMETER
UNIT
ns
MIN TYP MAX
Propagation delay time,
low-to-high level output
RL = 25 Ω,
CL = 15 pF
tPLH
CLK
Y
107
200
250
tPHL
CLK
CLR
Y
Y
111
104
200
200
250
250
Propagation delay time,
high-to-low level output
RL = 25 Ω,
CL = 15 pF
ns
tPHLR
4
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TLC59213 TLC59213A
TLC59213
TLC59213A
www.ti.com
SLVS867A –MAY 2009–REVISED MARCH 2010
THERMAL INFORMATION
MAXIMUM OUTPUT CURRENT
vs
DUTY CYCLE
550
500
450
400
350
300
250
200
150
100
50
T
= 85°C
A
N = Number of outputs
conducting
simultaneously
N = 1
N = 2
N = 3
N = 8
N = 7
N = 5
N = 6
N = 4
0
0
10 20 30 40 50 60 70 80 90
Duty Cycle (%)
100
Figure 1. TSSOP (PW) PACKAGE
MAXIMUM OUTPUT CURRENT
vs
DUTY CYCLE
550
500
450
400
350
300
250
200
150
100
50
T
= 85°C
A
N = Number of outputs
conducting
simultaneously
N = 1
N = 2
N = 3
N = 8
N = 7
N = 5
N = 6
N = 4
0
0
10 20 30 40 50 60 70 80 90
Duty Cycle (%)
100
Figure 2. DIP (N) PACKAGE
Copyright © 2009–2010, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TLC59213 TLC59213A
TLC59213
TLC59213A
SLVS867A –MAY 2009–REVISED MARCH 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Test Point
From Output
Under Test
C
R = 25 Ω
L
L
(See Note A)
TEST CIRCUIT
3 V
CLR
1.5 V
t
su
GND
3 V
D
1.5 V
1.5 V
GND
3 V
t
t
t
su
h
t
f
r
90%
90%
1.5 V
10%
1.5 V
10%
50%
CLK
t
w
GND
t
t
PLH
PHL
V
OH
50%
50%
Y
GND
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns,
and tf ≤ 3 ns.
C. The outputs are measured one at a time with one transition per measurement.
Figure 3. Test Circuit and Voltage Waveforms
6
Submit Documentation Feedback
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TLC59213 TLC59213A
TLC59213
TLC59213A
www.ti.com
SLVS867A –MAY 2009–REVISED MARCH 2010
APPLICATION INFORMATION
V
CLR
D1
CC
1
2
20
19
18
17
16
15
14
13
12
11
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
D2
3
D3
4
D4
5
CPU
I/O
D5
6
D6
7
D7
8
D8
9
CLK
10
TLC59213
8-Channel Sink Driver
GND
Figure 4. Example of LED Display Connection
Copyright © 2009–2010, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TLC59213 TLC59213A
PACKAGE OPTION ADDENDUM
www.ti.com
2-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TLC59213AIN
ACTIVE
ACTIVE
PDIP
N
20
20
20
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
TLC59213AIPWR
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
TLC59213AIPWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TLC59213IN
ACTIVE
ACTIVE
PDIP
N
20
20
20
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
TLC59213IPWR
TSSOP
PW
2000
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLC59213AIPWR
TLC59213AIPWT
TLC59213IPWR
TSSOP
TSSOP
TSSOP
PW
PW
PW
20
20
20
2000
250
330.0
180.0
330.0
16.4
16.4
16.4
6.95
6.95
6.95
7.1
7.1
7.1
1.6
1.6
1.6
8.0
8.0
8.0
16.0
16.0
16.0
Q1
Q1
Q1
2000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLC59213AIPWR
TLC59213AIPWT
TLC59213IPWR
TSSOP
TSSOP
TSSOP
PW
PW
PW
20
20
20
2000
250
367.0
210.0
367.0
367.0
185.0
367.0
38.0
35.0
38.0
2000
Pack Materials-Page 2
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