TLC5922DAP [TI]

LED DRIVER; LED驱动器
TLC5922DAP
型号: TLC5922DAP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LED DRIVER
LED驱动器

驱动器
文件: 总16页 (文件大小:337K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
LED DRIVER  
DESCRIPTION  
FEATURES  
16 Channels  
The TLC5922 is a constant-current sink driver with 128  
steps of adjustable current value (dot-correction). Each  
of the 16 channels has an individually controlled  
dot-correction and an ON/OFF state. Both the ON/OFF  
and dot-correction have their respective modes set via  
1 port of serial I/F. The maximum current value of the  
constant-current output of all 16 channels is pro-  
grammed by a single external resistor. An external  
processor programs each of the 16 channels of the  
TLC5922 with the desired ON/OFF state and  
dot-correction value through a single serial interface.  
After all data is loaded, the processor then latches the  
information into the TLC5922 and enables the outputs.  
Drive Capability  
– 0 to 80 mA (Constant-Current Sink) x 16 ch  
Constant Current Accuracy  
±1% (typ)  
1 Port of Serial Data Input/Output  
Fast Switching Output: Tr / Tf = 10ns (typ)  
CMOS Input/Output  
30 MHz Data Transfer Rate  
Vcc = 3 V to 5.5 V  
Operating Temperature = -20°C to 85 °C  
LED Supply Voltage up to 17 V  
32-pin HTSSOP (PowerPADTM) Package  
The TLC5922 includes two error flags. First is the LED  
open detection (LOD) which indicates a broken LED at  
an output terminal. The second is a thermal error flag  
(TEF) which indicates an over temperature condition.  
The TLC5922 has two methods to communicate these  
error flags to the external processor. One method is on  
a dedicated output pin, XDOWN. The other method is  
through the serial data output pin, SOUT.  
Dot Correction  
– 128-Step For Each Individual 16 ch  
Controlled In-Rush Current  
Error Information  
– LOD: LED Open Detection  
– TEF: Thermal Error Flag  
APPLICATIONS  
LED Display  
LED Signboard  
FUNCTIONAL BLOCK DIAGRAM  
VCC  
0
1
SIN  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
FF  
FF  
FF  
FF  
FF  
FF  
1
0
SCLK  
0
1
SOUT  
D
Q
D Q  
D
Q
D
Q
D
Q
D Q  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
1
0
XLAT  
SW0  
SW1  
SW15  
16  
DC15[6]  
XDOWN  
IREF  
16[output] Constant  
Current Driver  
DC0[1]  
DC0[0]  
with Dot Correction  
BLANK  
BLANK  
GND  
OUT0  
OUT15  
PGND  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments  
semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily in-  
cludetestingofallparameters.  
Copyright © 2003, Texas Instruments Incorporated  
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
(1)  
ORDERING INFORMATION  
(1)  
TA  
PACKAGE  
PART NUMBER  
-20 °C to 85 °C  
4 mm x 4 mm, 32-pin HTSSOP  
TLC5922DAP  
(1)  
The DAP package is available in tape and reel. Add R suffix (TLC5922DAPR) to order quantities of 2000 parts per reel.  
DAP PACKAGE  
(TOP VIEW)  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
GND  
BLANK  
XLAT  
SCLK  
SIN  
PGND  
OUT0  
OUT1  
PGND  
OUT2  
OUT3  
OUT4  
OUT5  
PGND  
OUT6  
OUT7  
VCC  
IREF  
2
3
MODE  
XDOWN  
SOUT  
PGND  
OUT15  
OUT14  
PGND  
OUT13  
OUT12  
OUT11  
OUT10  
PGND  
OUT9  
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
OUT8  
Terminal Functions  
TERMINAL  
NO.  
I/O  
DESCRIPTION  
NAME  
Blank(Light OFF). When BLANK=H, All OUTx outputs are forced OFF. When BLANK=L,  
ON/OFF of OUTx outputs are controlled by input data.  
BLANK  
2
2
GND  
IREF  
1
Ground  
31  
I/O  
I
Reference current terminal  
Mode select. When MODE=L, SIN, SOUT, SCLK, XLAT are connected to ON/OFF control  
logic. When MODE=H, SIN, SOUT, SCLK, XLAT are connected to dot-correction logic.  
MODE  
30  
OUT0  
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
OUT7  
OUT8  
OUT9  
OUT10  
OUT11  
OUT12  
OUT13  
OUT14  
OUT15  
7
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
8
10  
11  
12  
13  
15  
16  
17  
18  
20  
21  
22  
23  
25  
26  
6, 9, 14, 19,  
24, 27  
PGND  
Power ground  
2
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
Terminal Functions (continued)  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
Data shift clock. Note that the internal connections are switched by MODE (pin #30). At  
SCLK, the shift-registers selected by MODE shift the data.  
SCLK  
4
I
SIN  
5
I
Data input of serial I/F  
SOUT  
VCC  
28  
32  
29  
O
Data output of serial I/F  
Power supply voltage  
XDOWN  
O
I
Error output. XDOWN is open drain terminal. XDOWN gets L when LOD or TEF detected.  
Data latch. Note that the internal connections are switched by MODE (pin #30). At XLAT, the  
latches selected by MODE get new data.  
XLAT  
3
(1)  
ABSOLUTE MAXIMUM RATINGS  
(2)  
See  
UNIT  
(2)  
Supply voltage  
VCC  
- 0.3 V to 6 V  
90 mA  
Output current (dc)  
Input voltage range  
IL(LC)  
(2)  
(2)  
V(BLANK), V(XLAT), V(SCLK), V(SIN)  
V(MODE)  
,
- 0.3 V to VCC + 0.3 V  
Output voltage range  
ESD rating  
V(SOUT), V(XDOWN)  
V(OUT0) - V(OUT15)  
- 0.3 V to VCC + 0.3 V  
-0.3 V to 18.0 V  
2 kV  
HBM (JEDEC JESD22-A114, Human  
Body Model)  
CDM (JEDEC JESD22-C101,  
Charged Device Model)  
500 V  
Storage temperature range, Tstg  
-40°C to 150°C  
3.9 W  
Continuous total power dissipation at (or below) TA = 25°C  
Power dissipation rating at (or above) TA = 25°C  
31.4 mW/°C  
(1)  
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
All voltage values are with respect to network ground terminal.  
(2)  
RECOMMENDED OPERATING CONDITIONS  
DC CHARACTERISTICS  
MIN  
NOM MAX  
UNIT  
V
Supply voltage, VCC  
3
5.5  
Voltage applied to output, VO (Out0 - Out15)  
High-level input voltage, VIH  
Low-level input voltage, VIL  
17  
V
0.8 VCC  
GND  
VCC  
V
0.2 VCC  
-1  
V
High-level output current, IOH  
VCC = 5 V at SOUT  
mA  
mA  
mA  
°C  
Low-level output current, IOL  
VCC = 5 V at SOUT, XDOWN  
OUT0 to OUT15  
1
Constant output current, IO(LC)  
Operating free-air temperature range, TA  
80  
85  
(1)  
-20  
(1)  
Please contact TI sales for slightly extended temperature range.  
3
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
AC CHARACTERISTICS  
VCC = 3 V to 5.5 V, TA = -20°C to 85°C (unless otherwise noted)  
MIN TYP  
MAX UNIT  
fSCLK  
twh0/twl0  
twh1  
tsu0  
tsu1  
tsu2  
tsu3  
th0  
Clock frequency  
SCLK  
30 MHz  
ns  
CLK pulse duration  
XLAT pulse duration  
SCLK=H/L  
20  
20  
10  
10  
10  
10  
10  
10  
10  
10  
XLAT=H  
ns  
SIN - SCLK↑  
SCLK-XLAT↓  
MODE↑↓-SCLK↑  
MODE↑↓-XLAT↓  
SCLK-SIN  
ns  
ns  
Setup time  
Hold time  
ns  
ns  
ns  
th1  
XLAT-SCLK↑  
SCLK-MODE↑↓  
XLAT-MODE↑↓  
ns  
th2  
ns  
th3  
ns  
ELECTRICAL CHARACTERISTICS  
VCC = 3 V to 5.5 V, TA = - 20°C to 85°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP MAX UNIT  
VOH  
VOL  
II  
High-level output voltage  
IOH = - 1 mA, SOUT  
VCC0.5V  
V
Low-level output voltage  
Input current  
IOL = 1 mA, SOUT  
0.5  
1
V
VI = VCC or GND, BLANK, XLAT,SCLK, SIN, MODE  
-1  
µA  
No data transfer, All output OFF, VO = 1 V, R(IREF) = 10  
kΩ  
6
No data transfer, All output OFF, VO = 1 V, R(IREF) = 1.3  
kΩ  
12  
25  
ICC  
Supply current  
mA  
Data transfer 30 MHz, All output ON, VO = 1 V, R(IREF)  
=
1.3 kΩ  
Data transfer 30 MHz, All output ON, VO = 1 V, R(IREF)  
600 kΩ  
=
(1)  
36  
80  
65  
IOLC  
Constant output current  
Leakage output current  
All output ON, VO= 1 V, R(IREF) = 600Ω  
70  
90  
mA  
µA  
µA  
%
All output OFF, VO= 15 V, R(IREF) = 600, OUT0 to  
IOKL0  
IOKL1  
IOLC  
0.1  
10  
OUT15  
VXDOWN = 5.5 V, No TEF and LOD  
All output ON, VO = 1 V, R(IREF) = 600 , OUT0 to  
OUT15  
Constant current error  
Power supply rejection ratio  
Load regulation  
±1  
± 4  
All output ON, VO = 1 V, R(IREF) = 600 , OUT0 to  
OUT15  
IOLC1  
IOLC2  
± 1  
± 2  
± 4  
± 6  
%/V  
%/V  
All output ON, VO = 1 V to 3 V, R(IREF) = 600 , OUT0 to  
OUT15  
(2)  
TTEF  
Thermal error flag threshold  
LED open detection threshold  
Reference voltage output  
Junction temperature, rising temperature  
150  
180  
°C  
V
V(LOD)  
VIREF  
0.3  
R(IREF) = 600 Ω  
1.22  
V
(1)  
(2)  
Measured at device start-up temperature. Once the IC is operatiing (self heating), lower ICC values will be seen. See Figure 12.  
Not tested. Specified by design.  
4
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
SWITCHING CHARACTERISTICS  
PARAMETER  
TEST CONDITIONS  
(1)  
MIN  
TYP  
10  
MAX  
20  
UNIT  
SOUT(see  
OUTx, VCC = 5 V, TA = 60°C, DCx = 7F (see  
(1)  
)
tr  
tf  
Rise time  
ns  
(2)  
(2)  
)
30  
SOUT(see  
)
20  
Fall time  
ns  
OUTx, VCC = 5 V, TA = 60°C, DCx = 7F (see  
)
10  
30  
(3)  
SCLK- SOUT↑↓ (see  
)
300  
300  
60  
(3)  
MODE↑↓ - SOUT↑↓ (see  
)
(4)  
BLANK- OUT0↑↓ (see  
)
Propagation delay  
time  
ns  
ns  
(4)  
tpd  
XLAT- OUT0↑↓ (see  
OUTx↑↓-XDOWN↑↓ (see  
)
60  
(5)  
)
1000  
1000  
30  
(6)  
)
XLAT-IOUT(dot-correction) (see  
(4)  
Output delay time  
OUTn↑↓-OUT(n+1)↑↓ (see  
)
14  
22  
(1)  
See Figure 4. Defined as from 10% to 90%  
See Figure 5. Defined as from 10% to 90%  
See Figure 4, Figure 9and Figure 10  
See Figure 5 and Figure 9  
See Figure 5, Figure 6, and Figure 9  
See Figure 5 and Figure 10  
(2)  
(3)  
(4)  
(5)  
(6)  
PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS  
(Note: Resistor values are equivalent resistance and not tested).  
VCC  
400 W  
INPUT  
GND  
Figure 1. Input Equivalent Circuit (BLANK, XLAT, SCLK, SIN, MODE)  
10 W  
SOUT  
GND  
Figure 2. Output Equivalent Circuit  
20 W  
XDOWN  
GND  
Figure 3. Output Equivalent Circuit (XDOWN)  
5
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
PARAMETER MEASUREMENT INFORMATION  
SOUT  
15 pF  
Figure 4. Test Circuit for Tr0, Tf1, Td0, Td1  
51  
OUTn  
15 pF  
Figure 5. Test Circuit for Tr1, Tf1, Td2, Td3, Td5, Td6  
470 k  
XDOWN  
Figure 6. Test Circuit for Td4  
PRINCIPLES OF OPERATION  
Setting Constant-Current Value  
The maximum programmable output current for all 16 outputs is set by a single resistor, R(IREF), which is placed  
between IREF and GND. The current flowing through R(IREF) is sampled by the TLC5922 and multiplied by a  
scaling factor of 40 to set the maximum output current for all outputs. The voltage on IREF is set by an internal  
band gap with a nominal value of 1.22V. The maximum programmable output current is set by Equation 1:  
V
IREF  
I
+
  40  
MAX  
R
IREF  
(1)  
where:  
VIREF = 1.22V  
RIREF = User selected external resistor (RIREF should not be smaller than 600)  
Setting Dot-Correction  
The TLC5922 has the capability to adjust the brightness of each channel, OUT0,...,OUT15. This capability is  
called dot-correction. The external processor programs each of the 16 channels of the TLC5922 with a 7 bit word  
that adjusts each respective output from 0% to 100% of the maximum output current, Imax. The 7 bits provides  
27 (= 128) programmable current values. Equation 2 below determines the output current for each output:  
I
DC  
n
MAX  
I
+
Outn  
127  
(2)  
6
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
PRINCIPLES OF OPERATION (continued)  
where:  
IMax = the maximum programmable current of each output  
DCn = the programmed dot-correction value for output n (DCn = 0, 1, 2 ...127)  
n = 0, 1, 2 ... 15  
Forcing OFF the Constant Current Outputs  
The BLANK input pin is used to disable all OUTx constant-current output terminals. When BLANK is a logic 1, all  
OUTx are forced off, regardless of any other logic operations.  
Internal Register Definitions  
The TLC5922 has two separate serial data shift-registers and two separate data-latches. The first combination of  
registers and latches controls the ON/OFF function of the output. These are referred to as the EN_REG registers  
and EN_LATCHn latches, where n= 0,1...15 and specifies the output channel. There are 16 EN_REG registers  
and 16 EN_LATCHn latches. Both are one bit each. Figure 7 shows how these are connected.  
The second combination of registers and latches controls the dot-correction value for each output. These are  
referred to as the DC_REG registers and DC_LATCHn latches, where n=0,1...15 and specifies the output  
channel. There are 112 DC_REG data shift-registers (1 bit each) and 16 DC_LATCHn latches (seven bits each).  
Figure 8 shows how these are connected.  
All data to the TLC5922 comes from the SIN pin. The MODE pin determines whether the inputs and outputs of  
the TLC5922 are connected to the ON/OFF logic or the dot-correction logic. When MODE is a logic 0, all data is  
connected to the ON/OFF logic. When MODE is a logic 1, all data is connected to the dot-correction logic.  
Each rising edge of the SCLK pin shifts the data in either the EN_REG or DC_REG registers. Each rising edge  
of the XLAT pin transfers the data from the selected registers (either EN_REG or DC_REG) and latches it into  
the selected latch (EN_LATCHn or DC_LATCHn).  
Turning ON/OFF the Constant Current Outputs  
The TLC5922 EN_LATCHn data-latches hold the ON/OFF information for each output. When the MODE input is  
low, the processor can access both the EN_LATCHn and EN_REG registers. The 16 cascaded EN_REG shift  
registers transfer ON/OFF data from SIN to SOUT output at each rising edge of the SCLK pin. XLAT is held low  
when the ON/OFF data is clocked into the TLC5922. When all data is clocked in, the rising edge of the XLAT pin  
transfers and latches the ON/OFF data into the EN_LATCHn latches. Each of the 16 EN_LATCHn data-latches  
holds a 1 bit digital code that turns each of the 16 outputs on or off. The processor must clock in 16 bits of data  
to fully program the ON/OFF setting for all 16 outputs. The ON/OFF data becomes valid on the OUTn outputs  
when BLANK goes low.  
During the XLAT=H(MODE=L), shift-register loads the LOD status of each 16 outputs (and the controller can  
read the LOD status from SOUT). Note that incoming data from the controller is latched at XLAT(MODE=L),  
and afterwards, the shift-register loads LOD status during XLAT=H(MODE=L).  
7
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
PRINCIPLES OF OPERATION (continued)  
SIN  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
SOUT  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
SCLK  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
XLAT  
Figure 7. Shift Register and Data Latch for ON/OFF Setting  
Delay Between Outputs  
The TLC5922 has graduated delay circuits between outputs. In Figure 7, these delay circuits can be found  
between OUTn and constant current block. The fixed delay time is 20 ns (TYP), OUT0 has no delay, OUT1 has  
20 ns delay, OUT2 has 40 ns delay. This delay prevents large inrush currents, which reduce power supply  
bypass capacitor requirements when the outputs turn on.  
Setting Dot-Correction  
The TLC5922 DC_LATCHn data latches hold the dot-correction information for each output. When the MODE  
input is high, the processor can access both the DC_LATCHn and DC_REG registers. The 112 cascaded  
DC_REG shift registers transfer dot-correction data from SIN to SOUT output at each rising edge of the SCLK  
pin. XLAT is held low when the dot-correction data is clocked into the TLC5922. When all data is clocked in, the  
rising edge of the XLAT pin transfers and latches the dot-correction data into the DC_LATCHn latches. Each of  
the 16 DC_LATCHn data-latches holds a 7 bit digital code to adjust the constant current value for each of the 16  
outputs. The processor must clock in 112 bits of data to fully program the dot-correction for all 16 channnels.  
SIN  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
SOUT  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
FF  
SCLK  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
LAT  
XLAT  
Bit 0 Bit 1 −−−− Bit 6  
(LSB) (MSB)  
7[bit] Digital=>Analog  
Bit 0 Bit 1 −−−− Bit 6  
(MSB)  
7[bit] Digital=>Analog  
Bit 0 Bit 1 −−−− Bit 6  
(MSB)  
(LSB)  
(LSB)  
7[bit] Digital=>Analog  
Figure 8. Shift Register and Data Latch for Dot-Correction  
8
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
PRINCIPLES OF OPERATION (continued)  
Error Information Output  
The open-drain output, XDOWN, is used to report both of the TLC5922 error flags. (Note: the XDOWN output  
must be pulled to VCC with a pullup resistor)  
During normal operating conditions, an internal FET connected to the XDOWN pin is turned off. The voltage on  
XDOWN is pulled up to VCC through the pullup resistor. If TEF or LOD is detected (see following sections), the  
internal FET is turned on, and XDOWN is pulled to GND.  
Since XDOWN is an open-drain output, multiple ICs can be OR’ed together and pulled up to VCC with a single  
pullup resistor. This reduces the number of signals needed to report a system error.  
TEF: Thermal Error Flag  
The TLC5922 provides a temperature error flag (TEF) circuit to indicate an over-temperature condition of the IC.  
If the junction temperature exceeds the threshold temperature (160oC typ), the TEF circuit trips and pulls  
XDOWN to ground.  
LOD: LED Open Detection  
The TLC5922 provides an LED open detection circuit (LOD). This circuit reports an error if any one of the 16  
LEDs is open, or is disconnected from the circuit. The LOD circuit trips when two conditions are met  
simultaneouly: When OUTn is programmed to be on, and when the voltage at OUTn is less than 0.3V (Note: the  
voltage at each OUTn is sampled 1µS after being turned on).  
An LOD failure is reported in two ways. First, the LOD circuit only monitors OUTn when the OUTn is turned on.  
Each OUTn is individually monitored. The state of all 16 outputs are OR’ed together and reported at the XDOWN  
pin.  
Second, the LOD circuit may also be monitored from the SOUT pin. When the MODE pin is low and the XLAT  
pin goes high, the 16 bits of ON/OFF data get transferred from the EN_REG registers to the EN_LATCHn  
latches. At the same time, the LOD status of each output is transferred to the EN_REG registers. These 16 bits  
of LOD data are then clocked out of the SOUT pin as the new ON/OFF data is clocked into the SIN pin. This  
reporting scheme allows the processor to determine the state of each LED.  
9
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
PRINCIPLES OF OPERATION (continued)  
Figure 9. Timing Chart Example for ON/OFF Setting to Dot-Correction  
10  
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
PRINCIPLES OF OPERATION (continued)  
Figure 10. Timing Chart Example for Dot-Correction to ON/OFF Setting  
11  
TLC5922  
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SLVS486SEPTEMBER 2003  
PRINCIPLES OF OPERATION (continued)  
Power Rating - Free-Air Temperature  
Figure 11 shows total power dissipation. Figure 12 shows supply current versus free-air temperature.  
Power Dissipation  
vs  
Temperature  
3.9  
3.2  
1.48  
2
−20  
0
25  
85  
T
A
− Free- Air Temperature − °C  
Figure 11  
Supply Current1  
vs  
Free-Air Temperature  
70  
60  
50  
40  
30  
20  
10  
0
−50 −30 −10 10 30 50 70 90 110 130 150  
T
A
− Free- Air Temperature − °C  
1. Data Transfer = 30 MHz / All Outputs, ON/VO = 1 V / RIREF = 600 / AVDD = 5 V  
Figure 12  
12  
TLC5922  
www.ti.com  
SLVS486SEPTEMBER 2003  
PRINCIPLES OF OPERATION (continued)  
Constant Output Current - Reference Resistor  
Figure 13 shows the maximum output current, IOLC, versus R(IREF) . In Figure 13, R(IREF) is the value of the  
resistor between IREF terminal to ground, and IOLC is the constant output current of OUT0,.....OUT15.  
Reference Resistor  
vs  
Output Current  
100 k  
48.8 k  
V
Outn  
= 1 V  
DC = 127  
10 k  
9.76 k  
4.88 k  
2.44 k  
1.63 k  
1.22 k  
976  
1 k  
813  
697  
100  
0
0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08  
I
− Output Current − mA  
OLC  
Figure 13  
13  
www.ti.com  
Thermal Pad Mechanical Data  
DAP (R–PDSO–G32)  
THERMAL INFORMATION  
The DAP PowerPADpackage incorporates an exposed thermal die pad that is designed to be attached directly  
to an external heat sink. When the thermal die pad is soldered directly to the printed circuit board (PCB), the PCB  
can be used as a heatsink. In addition, through the use of thermal vias, the thermal die pad can be attached directly  
to a ground plane or special heat sink structure designed into the PCB. This design optimizes the heat transfer from  
the integrated circuit (IC).  
For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities, refer to  
Technical Brief, PowerPAD Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 and  
Application Brief, PowerPAD Made Easy, Texas Instruments Literature No. SLMA004. Both documents are available  
at www.ti.com. See Figure 1 for DAP package exposed thermal die pad dimensions.  
32  
1
Exposed Thermal  
Die Pad  
3,91  
3,31  
17  
16  
4,11  
3,35  
Bottom View  
PPTD001  
NOTE: All linear dimensions are in millimeters.  
Figure 1. DAP Package Exposed Thermal Die Pad Dimensions  
PowerPAD is a trademark of Texas Instruments.  
1
 
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accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
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