TLC5928PW [TI]

16-Channel, Constant-Current LED Driver with LED Open Detection; 16通道恒流LED驱动器,具有LED开路检测
TLC5928PW
型号: TLC5928PW
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-Channel, Constant-Current LED Driver with LED Open Detection
16通道恒流LED驱动器,具有LED开路检测

显示驱动器 驱动程序和接口 接口集成电路 光电二极管 PC
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TLC5928  
www.ti.com ................................................................................................................................................. SBVS120AJULY 2008REVISED SEPTEMBER 2008  
16-Channel, Constant-Current LED Driver with LED Open Detection  
1
FEATURES  
APPLICATIONS  
LED Video Displays  
Message Boards  
Illumination  
23  
16 Channels, Constant Current Sink Output  
with On/Off Control  
35-mA Capability (Constant Current Sink)  
10-ns High-Speed Constant Current Switching  
Transient Time  
DESCRIPTION  
The TLC5928 is a 16-channel, constant current sink  
LED driver. Each channel can be turned on/off by  
writing serial data to an internal register. The constant  
current value of all 16 channels is set by a single  
external resistor.  
Low On-Time Error  
LED Power-Supply Voltage up to 17 V  
VCC = 3.0 V to 5.5 V  
Constant Current Accuracy:  
Channel-to-Channel = ±1%  
Device-to-Device = ±1%  
The TLC5928 has two error detection circuits: one for  
LED open detection (LOD) and one for a pre-thermal  
warning (PTW). LOD detects  
a
broken or  
CMOS Logic Level I/O  
disconnected LED and LEDs shorted to GND while  
the constant current output is on. PTW indicates a  
high temperature condition.  
35-MHz Data Transfer Rate  
20-ns BLANK Pulse Width  
Readable Error Information:  
LED Open Detection (LOD)  
Pre-Thermal Warning (PTW)  
Operating Temperature: –40°C to +85°C  
VLED  
VLED  
VLED  
VLED  
¼
¼
¼
¼
¼
¼
¼
¼
OUT0  
OUT15  
SOUT  
OUT0  
SIN  
OUT15  
SOUT  
DATA  
SIN  
SCLK  
VCC  
VCC  
SCLK  
SCLK  
LAT  
LAT  
Controller  
LAT  
VCC  
GND  
VCC  
GND  
BLANK  
BLANK  
IREF  
BLANK  
IREF  
TLC5928  
TLC5928  
ERROR  
READ  
IC1  
ICn  
RIREF  
RIREF  
3
Typical Application Circuit (Multiple Daisy-Chained TLC5928s)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
PowerPAD is a trademark of Texas Instruments, Inc.  
All other trademarks are the property of their respective owners.  
UNLESS OTHERWISE NOTED this document contains  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2008, Texas Instruments Incorporated  
TLC5928  
SBVS120AJULY 2008REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
PACKAGE/ORDERING INFORMATION(1)  
PRODUCT  
PACKAGE-LEAD  
ORDERING NUMBER  
TLC5928DBQR  
TLC5928DBQ  
TRANSPORT MEDIA, QUANTITY  
Tape and Reel, 2500  
Tube, 50  
TLC5928  
SO-24  
TLC5928PWR  
TLC5928PW  
Tape and Reel, 2000  
Tube, 60  
TLC5928  
TLC5928  
TLC5928  
TSSOP-24  
HTSSOP-24 PowerPAD™  
QFN-24(2)  
TLC5928PWPR  
TLC5928PWP  
TLC5928RGER  
TLC5928RGE  
Tape and Reel, 2000  
Tube, 60  
Tape and Reel, 3000  
Tape and Reel, 250  
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Shaded cells indicate product preview device.  
ABSOLUTE MAXIMUM RATINGS(1)(2)  
Over operating free-air temperature range, unless otherwise noted.  
PARAMETER  
TLC5928  
–0.3 to +6.0  
40  
UNIT  
V
VCC  
IOUT  
VIN  
Supply voltage: VCC  
Output current (dc)  
Input voltage range  
OUT0 to OUT15  
mA  
V
SIN, SCLK, LAT, BLANK, IREF  
SOUT  
–0.3 to VCC + 0.3  
–0.3 to VCC + 0.3  
–0.3 to +18  
+150  
V
VOUT  
Output voltage range  
OUT0 to OUT15  
V
TJ(MAX)  
TSTG  
Operating junction temperature  
Storage temperature range  
°C  
°C  
kV  
V
–55 to +150  
2
Human body model (HBM)  
ESD rating  
Charged device model (CDM)  
500  
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not supported.  
(2) All voltage values are with respect to network ground terminal.  
DISSIPATION RATINGS  
OPERATING FACTOR  
ABOVE TA = +25°C  
TA < +25°C  
POWER RATING  
TA = +70°C  
POWER RATING  
TA = +85°C  
POWER RATING  
PACKAGE  
SO-24  
14.3 mW/°C  
9.6 mW/°C  
28.9 mW/°C  
24.8 mW/°C  
1782 mW  
1194 mW  
3611 mW  
3106 mW  
1140 mW  
764 mW  
927 mW  
621 mW  
1878 mW  
1615 mW  
TSSOP-24  
HTSSOP-24(1)  
QFN-24(2)  
2311 mW  
1988 mW  
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available  
for download at www.ti.com).  
(2) The package thermal impedance is calculated in accordance with JESD51-5.  
2
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Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TLC5928  
TLC5928  
www.ti.com ................................................................................................................................................. SBVS120AJULY 2008REVISED SEPTEMBER 2008  
RECOMMENDED OPERATING CONDITIONS  
At TA= –40°C to +85°C, unless otherwise noted.  
TLC5928  
PARAMETER  
TEST CONDITIONS  
MIN  
NOM  
MAX  
UNIT  
DC Characteristics: VCC = 3 V to 5.5 V  
VCC  
VO  
VIH  
VIL  
IOH  
IOL  
IOLC  
TA  
Supply voltage  
3.0  
5.5  
17  
V
V
Voltage applied to output  
High-level input voltage  
OUT0 to OUT15  
0.7 × VCC  
GND  
VCC  
V
Low-level input voltage  
0.3 × VCC  
–1  
V
High-level output current  
Low-level output current  
Constant output sink current  
Operating free-air temperature range  
Operating junction temperature range  
SOUT  
SOUT  
mA  
mA  
mA  
°C  
°C  
1
OUT0 to OUT15  
2
–40  
–40  
35  
+85  
TJ  
+125  
AC Characteristics: VCC = 3 V to 5.5 V  
fCLK (SCLK)  
TWH0  
TWL0  
TWH1  
TWH2  
TWL2  
TSU0  
Data shift clock frequency  
SCLK  
SCLK  
35  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
10  
10  
20  
20  
20  
4
SCLK  
Pulse duration  
LAT  
BLANK  
BLANK  
SIN–SCLK  
LAT–SCLK↑  
SIN–SCLK↑  
LAT–SCLK↑  
Setup time  
Hold time  
TSU1  
100  
3
TH0  
TH1  
10  
Copyright © 2008, Texas Instruments Incorporated  
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TLC5928  
SBVS120AJULY 2008REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com  
ELECTRICAL CHARACTERISTICS  
At VCC = 3.0 V to 5.5 V and TA = –40°C to +85°C. Typical values at VCC = 3.3 V and TA = +25°C, unless otherwise noted.  
TLC5928  
PARAMETER  
TEST CONDITIONS  
IOH = –1 mA at SOUT  
MIN  
TYP  
MAX  
VCC  
0.4  
1
UNIT  
V
VOH  
VOL  
IIN  
High-level output voltage  
Low-level output voltage  
Input current  
VCC – 0.4  
IOL = 1 mA at SOUT  
0
V
VIN = VCC or GND at SIN, SCLK, LAT, and BLANK  
–1  
µA  
SIN/SCLK/LAT = low, BLANK = high, VOUTn = 1 V,  
RIREF = 27 k  
ICC1  
ICC2  
ICC3  
ICC4  
IOLC  
1
4.5  
7
2
8
mA  
mA  
mA  
mA  
mA  
SIN/SCLK/LAT = low, BLANK = high, VOUTn = 1 V,  
RIREF = 3 kΩ  
Supply current (VCC  
)
SIN/SCLK/LAT/BLANK = low, VOUTn = 1 V,  
RIREF = 3 kΩ  
18  
40  
37  
SIN/SCLK/LAT/BLANK = low, VOUTn = 1 V,  
RIREF = 1.5 kΩ  
16  
34  
All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩ  
(see Figure 6), at OUT0 to OUT15  
Constant output current  
Output leakage current  
31  
All OUTn for constant current driver, all outputs off  
BLANK = high, VOUTn = VOUTfix = 17 V, RIREF = 1.5 kΩ  
(see Figure 6), at OUT0 to OUT15  
IOLKG  
0.1  
µA  
Constant current error  
(channel-to-channel)(1)  
All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩ  
at OUT0 to OUT15  
ΔIOLC  
±1  
±1  
±3  
±6  
±1  
±3  
%
%
Constant current error  
(device-to-device)(2)  
All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩ  
at OUT0 to OUT15  
ΔIOLC1  
ΔIOLC2  
ΔIOLC3  
All OUTn = ON, VOUTn = VOUTfix = 1 V, RIREF = 1.5 kΩ  
at OUT0 to OUT15  
Line regulation(3)  
Load regulation(4)  
±0.5  
±1  
%/V  
%/V  
All OUTn = ON, VOUTn = 1 V to 3V, VOUTfix = 1 V,  
RIREF = 1.5 k, at OUT0 to OUT15  
T(PTW)  
VLOD  
Pre-thermal warning threshold  
LED open detection threshold  
Reference voltage output  
Junction temperature(5)  
+125  
0.25  
1.16  
+138  
0.30  
1.20  
+150  
0.35  
1.24  
°C  
V
All OUTn = ON  
VIREF  
RIREF = 1.5 kΩ  
V
(1) The deviation of each output from the average of OUT0–OUT15 constant current. Deviation is calculated by the formula:  
IOUTn  
D (%) =  
- 1 ´ 100  
(IOUT0 + IOUT1 + ... + IOUT14 + IOUT15  
)
16  
.
(2) The deviation of the OUT0–OUT15 constant current average from the ideal constant current value.  
Deviation is calculated by the following formula:  
(IOUT0 + IOUT1 + ... IOUT14 + IOUT15  
)
- (Ideal Output Current)  
16  
D (%) =  
´ 100  
Ideal Output Current  
Ideal current is calculated by the formula:  
1.20  
IOUT(IDEAL) = 42 ´  
RIREF  
(3) Line regulation is calculated by this equation:  
(IOUTn at VCC = 5.5 V) - (IOUTn at VCC = 3.0 V)  
D (%/V) =  
100  
´
(IOUTn at VCC = 3.0 V)  
5.5 V - 3 V  
(4) Load regulation is calculated by the equation:  
(IOUTn at VOUTn = 3 V) - (IOUTn at VOUTn = 1 V)  
100  
3 V - 1 V  
D (%/V) =  
´
(IOUTn at VOUTn = 1 V)  
(5) Not tested. Specified by design.  
4
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Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TLC5928  
TLC5928  
www.ti.com ................................................................................................................................................. SBVS120AJULY 2008REVISED SEPTEMBER 2008  
SWITCHING CHARACTERISTICS  
At VCC = 3.0 V to 5.5 V, TA = –40°C to +85°C, CL = 15 pF, RL = 130 , RIREF = 1.5 k, and VLED = 5.5 V. Typical values at  
VCC = 3.3 V and TA = +25°C, unless otherwise noted.  
TLC5928  
PARAMETER  
TEST CONDITIONS  
SOUT (see Figure 5)  
MIN  
TYP  
5
MAX  
15  
UNIT  
ns  
tR0  
tR1  
tF0  
tF1  
tD0  
Rise time  
OUTn (see Figure 4)  
SOUT (see Figure 5)  
OUTn (see Figure 4)  
SCLKto SOUT  
10  
5
30  
ns  
15  
ns  
Fall time  
10  
8
30  
ns  
20  
ns  
LATor BLANKto OUTn sink current on  
(see Figure 10)  
tD1  
12  
12  
30  
30  
+8  
ns  
ns  
ns  
Propagation delay time  
Output on-time error(1)  
LATor BLANKto OUTn sink current off  
(see Figure 10)  
tD2  
On/off latch data = all '1', 20 ns BLANK low level  
one-shot pulse input (see Figure 4)  
tON_ERR  
–8  
(1) Output on-time error (tON_ERR) is calculated by the formula: tON_ERR (ns) = tOUT_ON – BLANK low level one-shot pulse width (TWL2).  
tOUT_ON indicates the actual on-time of the constant current driver.  
FUNCTIONAL BLOCK DIAGRAM  
VCC  
VCC  
SIN  
LSB  
MSB  
On/Off Control Shift Register  
(1 Bit x 16 Channels)  
SCLK  
SOUT  
0
15  
16  
16  
MSB  
LSB  
LAT  
On/Off Control Data Latch  
(1 Bit x 16 Channels)  
0
15  
BLANK  
16  
SID Latch  
IREF  
GND  
16-Channel Constant Current Sink Driver  
16  
Thermal  
Detection  
16-Channel LED Open Detection  
GND  
¼
OUT0 OUT1  
OUT14 OUT15  
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TLC5928  
SBVS120AJULY 2008REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com  
DEVICE INFORMATION  
SO-24 AND TSSOP-24  
DBQ AND PW PACKAGES  
(TOP VIEW)  
HTSSOP-24 PowerPAD  
PWP PACKAGE  
(TOP VIEW)  
GND  
1
2
3
4
5
6
7
8
9
24 VCC  
GND  
SIN  
1
2
3
4
5
6
7
8
9
24 VCC  
SIN  
SCLK  
LAT  
23 IREF  
23 IREF  
22 SOUT  
21 BLANK  
20 OUT15  
19 OUT14  
18 OUT13  
17 OUT12  
16 OUT11  
15 OUT10  
14 OUT9  
13 OUT8  
SCLK  
LAT  
22 SOUT  
21 BLANK  
20 OUT15  
19 OUT14  
18 OUT13  
17 OUT12  
16 OUT11  
15 OUT10  
14 OUT9  
13 OUT8  
OUT0  
OUT1  
OUT2  
OUT3  
OUT4  
OUT0  
OUT1  
OUT2  
OUT3  
OUT4  
Thermal Pad  
(Bottom Side)  
TLC5928  
TLC5928  
OUT5 10  
OUT6 11  
OUT7 12  
OUT5 10  
OUT6 11  
OUT7 12  
QFN-24(1)  
RGE PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
18 BLANK  
LAT  
OUT0  
OUT1  
OUT2  
OUT3  
OUT4  
17 OUT15  
16 OUT14  
15 OUT13  
14 OUT12  
13 OUT11  
Thermal Pad  
(Bottom Side)  
TLC5928  
NOTE: Thermal pad is not connected to GND internally. The thermal pad must be connected to GND via the PCB pattern.  
(1) Product preview device.  
6
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Product Folder Link(s): TLC5928  
TLC5928  
www.ti.com ................................................................................................................................................. SBVS120AJULY 2008REVISED SEPTEMBER 2008  
TERMINAL FUNCTIONS  
TERMINAL  
DBQ/PW/  
NAME  
SIN  
PWP  
RGE  
I/O  
DESCRIPTION  
Serial data input for driver on/off control. When SIN = high level, data '1' are written into LSB  
of the on/off control shift register at the rising edge of SCLK.  
2
23  
I
Serial data shift clock. Schmitt buffer input. All data in the on/off control shift register are  
shifted toward the MSB by 1-bit synchronization of SCLK. A rising edge on SCLK is allowed  
100 ns after a rising edge of LAT.  
SCLK  
LAT  
3
4
24  
1
I
I
Edge triggered latch. The data in the on/off control data shift register are transferred to the  
on/off control data latch at this rising edge. At the same time, the data in the on/off control shift  
register are replaced with LED open detection (LOD) and pre-thermal warning (PTW) data.  
LAT must be toggled only once after the shift data are updated to avoid the on/off control latch  
data being replaced with LOD and PTW data in the shift register.  
Blank, all outputs. When BLANK = high level, all constant current outputs (OUT0–OUT15) are  
forced off. When BLANK = low level, all constant current outputs are controlled by the on/off  
control data in the data latch. LOD and PTW data are latched into the SID data latch at the  
rising edge of BLANK and are present at the output of the SID data latch when BLANK is low.  
BLANK  
21  
18  
I
Constant current value setting, OUT0–OUT15 sink constant current is set to desired value by  
connection to an external resistor between IREF and GND.  
IREF  
23  
22  
5
20  
19  
2
I/O  
O
Serial data output. This output is connected to the MSB of the on/off data shift register. SOUT  
data changes at the rising edge of SCLK.  
SOUT  
OUT0  
Constant current output. Each output can be tied together with others to increase the constant  
current. Different voltages can be applied to each output.  
O
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
OUT7  
OUT8  
OUT9  
OUT10  
OUT11  
OUT12  
OUT13  
OUT14  
OUT15  
VCC  
6
3
4
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Power-supply voltage  
Power ground  
7
8
5
9
6
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
24  
1
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
21  
22  
GND  
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TLC5928  
SBVS120AJULY 2008REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS  
VCC  
VCC  
INPUT  
GND  
SOUT  
GND  
Figure 1. SIN, SCLK, LAT, BLANK  
Figure 2. SOUT  
OUTn  
GND  
Figure 3. OUT0 Through OUT15  
TEST CIRCUITS  
RL  
CL  
VCC  
GND  
VCC  
VCC  
IREF  
OUTn  
SOUT  
GND  
VLED  
VCC  
(1)  
(1)  
CL  
RIREF  
(1) CL includes measurement probe and jig capacitance.  
(1) CL includes measurement probe and jig capacitance.  
Figure 4. Rise Time and Fall Time Test Circuit for OUTn  
Figure 5. Rise Time and Fall Time Test Circuit for SOUT  
VCC  
OUT0  
OUTn  
VCC  
IREF  
RIREF  
GND OUT15  
VOUTn  
VOUTFIX  
Figure 6. Constant Current Test Circuit for OUTn  
8
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TLC5928  
www.ti.com ................................................................................................................................................. SBVS120AJULY 2008REVISED SEPTEMBER 2008  
TIMING DIAGRAMS  
TWH0, TWL0, TWH1, TWH2, TWL2  
:
VCC  
INPUT(1) 50%  
GND  
TWH  
TWL  
TSU0, TSU1, TH0, TH1  
:
VCC  
CLOCK  
INPUT(1)  
50%  
GND  
VCC  
TSU  
TH  
DATA/CONTROL  
INPUT(1)  
50%  
GND  
(1) Input pulse rise and fall time is 1 ns to 3 ns.  
Figure 7. Input Timing  
tR0, tR1, tF0, tF1, tD0, tD1, tD2  
:
VCC  
INPUT(1)  
50%  
GND  
tD  
VOH or VOUTn  
90%  
50%  
10%  
OUTPUT  
VOL or VOUTn  
tR or tF  
(1) Input pulse rise and fall time is 1 ns to 3 ns.  
Figure 8. Output Timing  
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TLC5928  
SBVS120AJULY 2008REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com  
DATA  
0A  
DATA  
15B  
DATA  
14B  
DATA DATA  
13B  
12B  
DATA  
11B  
DATA  
3B  
DATA DATA  
2B 1B  
DATA  
0B  
DATA  
15C  
DATA  
14C  
DATA DATA DATA  
13C 12C 11C  
DATA  
10C  
SIN  
SCLK  
LAT  
TH0  
TH1  
TSU0  
TWH0  
TSU1  
1
2
3
4
5
1
2
3
TWL0  
4
5
6
13  
14  
15  
16  
TWH1  
Shift Register  
LSB Data (Internal)  
DATA  
0A  
LOD  
0
DATA DATA  
15B  
DATA DATA  
13B  
12B  
DATA DATA  
3B  
2B  
DATA DATA  
0B  
DATA  
15C  
DATA  
14C  
DATA DATA  
13C 12C  
DATA  
11C  
LOD 0A or PTW_A  
LOD 1A or PTW_A  
14B  
1B  
Shift Register  
LSB+1 Data (Internal)  
DATA  
1A  
LOD  
1
LOD  
0
DATA  
15B  
DATA DATA  
13B  
DATA DATA  
3B  
DATA  
2B  
LOD  
0A  
DATA  
15C  
DATA DATA  
14C  
DATA  
12C  
14B  
4B  
13C  
Shift Register  
MSB-1 Data (Internal)  
DATA  
14A  
LOD  
14  
LOD  
13  
LOD  
12  
LOD  
11  
LOD  
10  
LOD  
1
LOD  
0
DATA  
15B  
LOD  
13A  
LOD  
12A  
LOD  
11A  
LOD  
10A  
LOD  
9A  
LOD 14A or PTW_A  
LOD 15A or PTW_A  
Shift Register  
MSB Data (Internal)  
DATA  
15A  
LOD  
15  
LOD  
14  
LOD  
13  
LOD  
12  
LOD  
11  
LOD  
2
LOD  
1
LOD  
0
DATA  
15B  
LOD  
14A  
LOD  
13A  
LOD  
12A  
LOD  
11A  
LOD  
10A  
On/Off Control  
Latch Data (Internal)  
Previous Grayscale Latch Data  
Latest Grayscale Latch Data  
DATA  
15A  
LOD  
15  
LOD  
14  
LOD  
13  
LOD  
12  
LOD  
11  
LOD  
2
LOD  
1
LOD  
0
DATA  
15B  
LOD  
14A  
LOD  
13A  
LOD  
12A  
LOD  
11A  
LOD  
10A  
LOD 15A or PTW_A  
SOUT  
tD0  
tR0/tF0  
tWH2  
BLANK  
tWL2  
tD2  
ON  
tD1  
OFF  
OFF  
OUTn(1)  
ON  
ON  
tOUTON  
tD1  
tD2  
OFF  
OFF  
OUTn(2)  
ON  
ON  
tF1  
tD1  
OFF  
OFF  
OUTn(3)  
ON  
ON  
tR1  
OFF  
OFF  
OUTn(4)  
ON  
(1) On/off latched data are '1'.  
(2) On/off latched data are changed from '1' to '0' at the second LAT signal.  
(3) On/off latched data are changed from '0' to '1' at the second LAT signal.  
(4) On/off latched data are '0'.  
Figure 9. Timing Diagram  
10  
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TYPICAL CHARACTERISTICS  
At VCC = 3.3 V and TA = +25°C, unless otherwise noted.  
REFERENCE RESISTOR  
vs OUTPUT CURRENT  
POWER DISSIPATION RATE  
vs FREE-AIR TEMPERATURE  
100000  
10000  
1000  
4000  
3000  
2000  
1000  
0
TLC5928PWP  
25200  
10080  
TLC5928RGE  
5040  
TLC5928DBQ  
3360  
2520  
2016  
TLC5928PW  
1680  
1440  
30  
0
5
10  
15  
20  
25  
-40  
0
20  
60  
80  
100  
-20  
40  
Output Current (mA)  
Free-Air Temperature (°C)  
Figure 10.  
Figure 11.  
OUTPUT CURRENT vs  
OUTPUT VOLTAGE  
OUTPUT CURRENT vs  
OUTPUT VOLTAGE  
40  
35  
30  
25  
20  
15  
10  
5
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
IO = 30 mA  
IO = 35 mA  
IO = 30 mA  
TA = +25°C  
IO = 20 mA  
IO = 10 mA  
IO = 5 mA  
TA = -40°C  
IO = 2 mA  
TA = +25°C  
TA = +85°C  
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
Output Voltage (V)  
Output Voltage (V)  
Figure 12.  
Figure 13.  
ΔIOLC vs AMBIENT TEMPERATURE  
ΔIOLC vs OUTPUT CURRENT  
4
3
4
3
IO = 35 mA  
TA = +25°C  
2
2
1
1
0
0
-1  
-2  
-3  
-4  
-1  
-2  
-3  
-4  
VCC = 3.3 V  
VCC = 5 V  
VCC = 3.3 V  
VCC = 5 V  
-40  
-20  
0
20  
40  
60  
80  
100  
0
10  
20  
30  
40  
Ambient Temperature (°C)  
Output Current (mA)  
Figure 15.  
Figure 14.  
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TYPICAL CHARACTERISTICS (continued)  
At VCC = 3.3 V and TA = +25°C, unless otherwise noted.  
CONSTANT CURRENT OUTPUT  
VOLTAGE WAVEFORM  
CH1-BLANK  
(20 ns)  
CH1 (2 V/div)  
CH2-OUT0  
(BLANK = 20 ns)  
CH2 (2 V/div)  
CH3 (2 V/div)  
CH3-OUT15  
(BLANK = 20 ns)  
IOLC = 35 mA  
TA = +25°C  
RL = 130 W  
CL = 15 pF  
VLED = 5.5 V  
Time (12.5 ns/div)  
Figure 16.  
12  
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DETAILED DESCRIPTION  
SETTING FOR THE CONSTANT SINK CURRENT VALUE  
The constant current values are determined by an external resistor (RIREF) placed between IREF and GND. The  
resistor (RIREF) value is calculated by Equation 1.  
VIREF (V)  
RIREF (kW) =  
´ 42  
IOLC (mA)  
(1)  
Where:  
VIREF = the internal reference voltage on the IREF pin (typically 1.20 V)  
IOLC must be set in the range of 2 mA to 35 mA. The constant sink current characteristic for the external resistor  
value is shown in Figure 10. Table 1 describes the constant current output versus external resistor value.  
Table 1. Constant Current Output versus External Resistor Value  
IOLCMax (mA, Typical)  
RIREF (k)  
1.44  
35  
30  
25  
20  
15  
10  
5
1.68  
2.02  
2.52  
3.36  
5.04  
10.1  
2
25.2  
CONSTANT CURRENT DRIVER ON/OFF CONTROL  
When BLANK is low, the corresponding output is turned on if the data in the on/off control data latch are '1' and  
remains off if the data are '0'. When BLANK is high, all outputs are forced off. This control is shown in Table 2.  
Table 2. On/Off Control Data Truth Table  
ON/OFF CONTROL LATCH DATA  
CONSTANT CURRENT OUTPUT STATUS  
0
1
Off  
On  
When the IC is initially powered on, the data in the on/off control shift register and data latch are not set to the  
respective default value. Therefore, the on/off control data must be written to the data latch before turning the  
constant current output on. BLANK should be at a high level when powered on because the constant current  
may be turned on as a result of random data in the on/off control latch.  
The on/off data corresponding to any unconnected OUTn outputs should be set to ‘0’ before turning on the  
remaining outputs. Otherwise, the supply current (ICC) increases while the LEDs are on.  
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REGISTER CONFIGURATION  
The TLC5928 has an on/off control data shift register and data latch. Both the on/off control shift register and  
latch are 16 bits long and are used to turn on/off the constant current drivers. Figure 17 shows the shift register  
and latch configuration. The data at the SIN pin are shifted in to the LSB of the shift register at the rising edge of  
the SCLK pin; SOUT data change at the rising edge of SCLK. The timing diagram for data writing is shown in  
Figure 18. The driver on/off is controlled by the data in the on/off control data latch.  
The on/off data are latched into the data latch by a rising edge of LAT after the data are written into the on/off  
control shift register by SIN and SCLK. At the same time, the data in the on/off control shift register are replaced  
with LED open detection (LOD) and pre-thermal warning (PTW) data. Therefore, LAT must be input only once  
after the on/off data update to avoid the on/off control data latch being replaced with LOD and PTW data in the  
shift register. When the IC is initially powered on, the data in the on/off control shift register and latch are not set  
to the default values; on/off control data must be written to the on/off control data latch before turning the  
constant current output on. BLANK should be high when the IC is powered on because the constant current may  
be turned on at that time as a result of random values in the on/off data latch. All constant current outputs are  
forced off when BLANK is high.  
On/Off Control Shift Register (1 Bit ´ 16 Channels)  
MSB  
15  
LSB  
0
14  
13  
12  
11  
4
3
2
1
SIN  
On/Off Data On/Off Data On/Off Data On/Off Data  
On/Off Data On/Off Data  
On/Off Data On/Off Data  
¼
¼
for  
for  
for  
for  
for  
for  
for  
for  
SOUT  
OUT15  
OUT14  
OUT13  
OUT12  
OUT3  
OUT2  
OUT1  
OUT0  
SCLK  
MSB  
15  
LSB  
0
14  
13  
12  
11  
4
3
2
1
On/Off Data On/Off Data On/Off Data On/Off Data  
On/Off Data On/Off Data  
On/Off Data On/Off Data  
¼
for  
for  
for  
for  
for  
for  
for  
for  
LAT  
OUT15  
OUT14  
OUT13  
OUT12  
OUT3  
OUT2  
OUT1  
OUT0  
On/Off Control Data Latch (1 Bit ´ 16 Channels)  
16 Bits  
To Constant Current Driver Control Block  
Figure 17. On/Off Control Shift Register and Latch Configuration  
14  
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DATA  
0A  
DATA  
15B  
DATA  
14B  
DATA  
13B  
DATA  
12B  
DATA  
11B  
DATA  
3B  
DATA  
2B  
DATA  
1B  
DATA  
0B  
DATA  
15C  
DATA  
14C  
DATA DATA DATA  
13C 12C 11C  
DATA  
10C  
SIN  
SCLK  
1
2
3
4
5
13  
14  
15  
16  
1
2
3
4
5
6
LAT  
Shift Register  
LSB Data (Internal)  
DATA  
0A  
LOD  
0
DATA  
15B  
DATA  
14B  
DATA DATA  
13B  
12B  
DATA  
3B  
DATA  
2B  
DATA DATA  
0B  
DATA  
15C  
DATA  
14C  
DATA  
13C  
DATA  
12C  
DATA  
11C  
LOD 0A or PTW_A  
1B  
Shift Register  
LSB+1 Data (Internal)  
DATA  
1A  
LOD  
1
LOD  
0
DATA  
15B  
DATA DATA  
13B  
DATA  
4B  
DATA  
3B  
DATA  
2B  
LOD  
0A  
DATA  
15C  
DATA  
14C  
DATA  
13C  
DATA  
12C  
LOD 1A or PTW_A  
14B  
Shift Register  
MSB-1 Data(Internal)  
DATA  
14A  
LOD  
14  
LOD  
13  
LOD  
12  
LOD  
11  
LOD  
10  
LOD  
1
LOD  
0
DATA  
15B  
LOD  
13A  
LOD  
12A  
LOD  
11A  
LOD  
10A  
LOD  
9A  
LOD 14A or PTW_A  
LOD 15A or PTW_A  
Shift Register  
MSB Data(Internal)  
DATA  
1A  
LOD  
15  
LOD  
14  
LOD  
13  
LOD  
12  
LOD  
11  
LOD  
2
LOD  
1
LOD DATA  
15B  
LOD  
14A  
LOD  
13A  
LOD  
12A  
LOD  
11A  
LOD  
10A  
0
On/Off Control  
Latch Data (Internal)  
Previous Grayscale Latch Data  
Latest Grayscale Latch Data  
DATA  
1A  
LOD  
15  
LOD  
14  
LOD  
13  
LOD  
12  
LOD  
11  
LOD  
2
LOD  
1
LOD  
0
DATA  
15B  
LOD  
14A  
LOD  
13A  
LOD  
12A  
LOD  
11A  
LOD  
10A  
LOD 15A or PTW_A  
SOUT  
BLANK  
OFF  
OUTn(1)  
OFF  
ON  
ON  
OFF  
OUTn(2)  
OFF  
ON  
ON  
OFF  
OFF  
OUTn(3)  
OFF  
ON  
ON  
OFF  
OFF  
OUTn(4)  
OFF  
ON  
(1) On/off latched data are '1'.  
(2) On/off latched data are changed from '1' to '0' at the second LAT signal.  
(3) On/off latched data are changed from '0' to '1' at the second LAT signal.  
(4) On/off latched data are '0'.  
Figure 18. On/Off Control Operation  
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LED OPEN DETECTION (LOD) AND PRE-THERMAL WARNING (PTW)  
The LED open detection (LOD) circuit checks the voltage of each active (that is, on) constant current sink output  
(OUT0 through OUT15) to detect open LEDs and LEDs shorted to GND while BLANK is low. The LOD bits in the  
status information data register (SID) are set to '1' if the voltage of the corresponding OUTn pin is less than the  
LED open detection threshold (VLOD = 0.3 V, typ). The status information data can be read from the SOUT pin.  
To avoid false detection of open LEDs, the LED driver design must ensure that the constant-current sink output  
voltage is greater than 0.3 V when the outputs are on. Also, the output on-time must be 1 µs or greater to  
correctly read the valid LOD status.  
The PTW function indicates that the IC junction temperature is too high. The PTW bit in the SID data is set to '1'  
while the IC junction temperature exceeds the temperature threshold (T(PTW) = +138 °C, typ). If the IC junction  
temperature decreases below the temperature of T(PTW), the SID data are set depending on the LOD function.  
The constant current outputs are not forced off during PTW conditions, so the controller should take appropriate  
action (such as reducing the duty cycle of effected channels).  
The LOD and PTW data are latched into the SID latch with the rising edge of BLANK and do not change until  
BLANK goes low. The SID data latched in the latch are transferred into the on/off shift register with a rising edge  
of LAT. SID can be shifted out from SOUT with rising edges of SCLK. The data in the on/off control shift register  
are replaced with the LOD and PTW data at the rising edge of LAT. Therefore, LAT should be input only once  
after the shift data are updated to avoid the on/off control data latch information from being replaced with LOD  
and PTW data in the shift register. A timing diagram for LOD, PTW, and SID is shown in Figure 19.  
BLANK  
OUTn OFF  
OUTn  
OUTn ON  
VOUTn  
If the voltage of OUTn (VOUTn) is less than VLOD (0.3 V, typ) when OUTn is on,  
GND  
then the LOD circuit reports error information to the LOD data latch  
and the error information is set as '1' to the bit that corresponds with  
the error OUTn in the LOD data latch.  
LOD circuit needs 1ms to detect LED  
open correctly as maximum.  
LOD Circuit Data  
(Internal)  
Latest Error Information From LOD Circuit  
No Error Information  
No Error Information  
LOD and PTW data are always copied into  
SID data latch while BLANK is low level.  
TJ < T(PTW)  
:
TJ < T(PTW)  
:
PTW Circuit Data  
(Internal)  
Normal Temperature  
Normal Temperature  
TJ ³ T(PTW): High Temperature  
LOD and PTW data of from before  
BLANK goes high are held in the  
SID data latch at the rising edge of BLANK.  
Previous LOD and PTW Data  
SID Data Latch  
(Internal)  
PTW Error  
Latest Error Information From LOD and PTW Circuit  
No Error Information  
Figure 19. LOD/PTW/SID timing  
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STATUS INFORMATION DATA (SID)  
The latched LED open detection (LOD) error and pre-thermal warning (PTW) in the SID data latch are shifted out  
onto the SOUT pin with each rising edge of SCLK. If a PTW is reported, all LOD error bits are set to '1'. The SID  
data are written over the data in the on/off control shift register at the rising edge of LAT. Therefore, the previous  
data in the on/off control shift register are lost when SID information is latched in. Figure 20 shows the SID bit  
assignments. See Figure 7 for the read timing of SID.  
When the IC is powered on, the initial LOD data are invalid. Therefore, LOD data must be read after the rising  
edge of BLANK. Table 3 shows a truth table for LOD and PTW.  
Table 3. LOD and PTW Truth Table  
CONDITION  
SID DATA  
LED is connected (VOUTn > VLOD  
)
'0' (low level at SOUT)  
LED open detection (LODn)  
Pre-termal warning (PTW)  
LED is opened or shorted to GND  
(VOUTn VLOD and output on)  
'1' (high level at SOUT); set to the bit that has an  
LED error condition  
IC temperature is low (IC temperature T(PTW)  
)
Depend LED open error  
IC temperature is high (IC temperature > T(PTW)  
)
All bits = '1' (high level at SOUT)  
SID Data Latch (1 Bit ´ 16 Channels)  
MSB  
LSB  
15  
14  
13  
12  
11  
4
3
2
1
0
OUT15  
LOD Data  
(LOD 15)  
OUT15  
LOD Data  
(LOD 14)  
OUT15  
LOD Data  
(LOD 13)  
OUT15  
LOD Data  
(LOD 12)  
OUT15  
LOD Data  
(LOD 3)  
OUT15  
LOD Data  
(LOD 2)  
OUT15  
LOD Data  
(LOD 1)  
OUT15  
LOD Data  
(LOD 0)  
¼
All Bits Become ‘1’ When the IC is in a PTW (Pre-Thermal Warning) Condition  
¼
MSB  
15  
LSB  
0
14  
13  
12  
11  
4
3
2
1
SIN  
On/Off Data On/Off Data On/Off Data On/Off Data  
for  
OUT14  
On/Off Data On/Off Data  
for  
OUT2  
On/Off Data On/Off Data  
for  
OUT0  
¼
for  
OUT15  
for  
OUT13  
for  
OUT12  
for  
OUT3  
for  
OUT1  
SOUT  
SCLK  
The 16 bits in the SID latch are loaded into the on/off shift register at the rising edge of LAT.  
SID Control Shift Register (1 Bit ´ 16 Channels)  
Figure 20. Status Information Data Configuration  
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PACKAGE OPTION ADDENDUM  
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2-Oct-2008  
PACKAGING INFORMATION  
Orderable Device  
TLC5928DBQ  
TLC5928DBQR  
TLC5928PW  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SSOP/  
QSOP  
DBQ  
24  
24  
24  
24  
24  
24  
50 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SSOP/  
QSOP  
DBQ  
PW  
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TSSOP  
HTSSOP  
HTSSOP  
TSSOP  
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TLC5928PWP  
TLC5928PWPR  
TLC5928PWR  
PWP  
PWP  
PW  
60 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Sep-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
TLC5928DBQR  
TLC5928PWPR  
SSOP/  
QSOP  
DBQ  
24  
24  
2500  
2000  
330.0  
16.4  
6.5  
9.0  
8.3  
2.1  
1.6  
8.0  
8.0  
16.0  
16.0  
Q1  
Q1  
HTSSOP PWP  
330.0  
16.4  
6.95  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Sep-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TLC5928DBQR  
TLC5928PWPR  
SSOP/QSOP  
HTSSOP  
DBQ  
PWP  
24  
24  
2500  
2000  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
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