TLC5940 [TI]

16 CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL; 16通道LED驱动器,具有点校正和灰度PWM控制
TLC5940
型号: TLC5940
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16 CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL
16通道LED驱动器,具有点校正和灰度PWM控制

驱动器
文件: 总29页 (文件大小:1385K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TLC5940  
PWP  
RHB  
NT  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
16 CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL  
FEATURES  
APPLICATIONS  
Monocolor, Multicolor, Fullcolor LED Displays  
LED Signboards  
Display Backlighting  
General, High-Current LED Drive  
16 Channels  
12 bit (4096 Steps) Grayscale PWM Control  
Dot Correction  
– 6 bit (64 Steps)  
– Storable in Integrated EEPROM  
Drive Capability (Constant Current Sink)  
– 0 mA to 60 mA (VCC < 3.6 V)  
– 0 mA to 120 mA (VCC > 3.6 V)  
LED Power Supply Voltage up to 17 V  
VCC = 3 V to 5.5 V  
DESCRIPTION  
The TLC5940 is a 16-channel constant-current sink  
LED driver. Each channel has an individually adjust-  
able 4096-step grayscale PWM brightness control  
and a 64-step constant-current sink (dot correction).  
The dot correction adjusts the brightness variations  
between LED channels and other LED drivers. The  
dot correction data is stored in an integrated  
EEPROM. Both grayscale control and dot correction  
are accessible via a serial interface. A single external  
resistor sets the maximum current value of all 16  
channels.  
Serial Data Interface, SPI comp.  
Controlled In-Rush Current  
30-MHz Data Transfer Rate  
CMOS Level I/O  
Error Information  
The TLC5940 features two error information circuits.  
The LED open detection (LOD) indicates a broken or  
disconnected LED at an output terminal. The thermal  
error flag (TEF) indicates an overtemperature con-  
dition.  
– LOD: LED Open Detection  
– TEF: Thermal Error Flag  
VCC  
GND  
SCLK  
SIN  
XLAT  
DCPRG  
CNT  
VPRG  
Constant Current  
1
0
12−Bit Grayscale  
PWM Control  
Driver  
OUT0  
GS Register  
DC Register  
V
=1.24 V  
REF  
IREF  
VPRG  
0
0
11  
5
Max. OUTn  
Current  
Delay  
x0  
0
DCPRG  
1
1
6−Bit Dot  
Correction  
0
0
GSCLK  
BLANK  
GS Counter  
CNT  
DC EEPROM  
VPRG  
0
5
LED Open Detection  
Input  
Shift  
Register  
CNT  
0
96  
Status  
Information:  
Constant Current  
Driver  
192  
192  
12−Bit Grayscale  
PWM Control  
GS Register  
OUT1  
LOD,  
12  
6
23  
TED,  
DCPRG  
1
Delay  
x1  
96  
DC DATA  
191  
95  
96  
6−Bit Dot  
Correction  
DC Register  
1
0
11  
0
VPRG  
DC EEPROM  
6
11  
LED Open Detection  
96  
LED Open  
Detection  
(LOD)  
VPRG  
CNT  
Temperature  
Error Flag  
(TEF)  
Blank  
1
0
Input  
Constant Current  
Driver  
12−Bit Grayscale  
PWM Control  
Shift  
GS Register  
OUT15  
Register  
180  
191  
Delay  
x15  
DCPRG  
1
XERR  
6−Bit Dot  
DC Register  
Correction  
90  
95  
0
191  
DC EEPROM  
LED Open Detection  
90  
95  
SOUT  
VPRG  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2005, Texas Instruments Incorporated  
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
These devices have limited built-in ESD protection. The leads should be shorted together or the device  
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
28-pin HTSSOP PowerPAD™  
32-pin 5 mm x 5 mm QFN  
28-pin PDIP  
PART NUMBER  
TLC5940PWP  
TLC5940RHB  
TLC5940NT  
-40°C to 85°C  
-40°C to 85°C  
-40°C to 85°C  
(1) For the most current package and ordering information, see the Package Option Addendum at the end  
of this document, or see the TI website at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS.  
over operating free-air temperature range (unless otherwise noted)(1)  
UNIT  
–0.3 V to 6 V  
130 mA  
VI  
IO  
VI  
Input voltage range(2)  
Output current (dc)  
Input voltage range  
VCC  
V(BLANK), V(DCPRG), V(SCLK), V(XLAT)  
V(SOUT), V(XERR)  
V(OUT0) to V(OUT15)  
V(PRG)  
–0.3 V to VCC +0.3 V  
–0.3 V to VCC +0.3 V  
–0.3 V to 18 V  
–0.3 V to 24 V  
50  
VO  
Output voltage range  
EEPROM program range  
EEPROM write cycles  
HBM (JEDEC JESD22-A114, Human Body Model)  
CBM (JEDEC JESD22-C101, Charged Device Model)  
2 kV  
ESD rating  
500 V  
Tstg  
TA  
Storage temperature range  
–55°C to 150°C  
–40°C to 85°C  
31.58°C/W  
35.9°C/W  
Operating ambient temperature range  
HTSSOP (PWP)(4)  
Package thermal impedance(3)  
QFN (RHB)  
PDIP (NP)  
48°C/W  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to network ground terminal.  
(3) The package thermal impedance is calculated in accordance with JESD 51-7.  
(4) With PowerPAD soldered on PCB with 2 oz. trace of copper. See SLMA002 for further information.  
2
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
RECOMMENDED OPERATING CONDITIONS  
MIN  
NOM  
MAX UNIT  
DC CHARACTERISTICS  
VCC  
VO  
Supply Voltage  
3
5.5  
17  
V
V
Voltage applied to output (OUT0–OUT15)  
High-level input voltage  
VIH  
VIL  
IOH  
IOL  
0.8 VCC  
GND  
VCC  
0.2 VCC  
–1  
V
Low-level input voltage  
V
High-level output current  
Low-level output current  
VCC = 5 V at SOUT  
mA  
mA  
mA  
mA  
V
VCC = 5 V at SOUT, XERR  
OUT0 to OUT15, VCC < 3.6 V  
OUT0 to OUT15, VCC > 3.6 V  
1
60  
IOLC  
Constant output current  
120  
23  
V(PRG)  
TA  
AC CHARACTERISTICS VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)  
EEPROM program voltage  
20  
22  
Operating free-air temperature range  
-40  
85  
°C  
f(SCLK)  
f(GSCLK)  
twh0/twl0  
twh1/twl1  
twh2  
twh3  
tsu0  
Data shift clock frequency  
Grayscale clock frequency  
SCLK pulse duration  
SCLK  
30  
30  
MHz  
MHz  
ns  
GSCLK  
SCLK = H/L (see Figure 8)  
GSCLK = H/L (see Figure 13)  
XLAT = H (see Figure 11)  
BLANK = H (see Figure 13)  
SIN–SCLK (see Figure 11)  
SCLK–XLAT (see Figure 11)  
VPRG–SCLK (see Figure 6)  
VPRG–XLAT (see Figure 6)  
BLANK–GSCLK (see Figure 13)  
VPRG–DCPRG  
16  
16  
20  
20  
10  
10  
10  
10  
10  
1
GSCLK pulse duration  
XLAT pulse duration  
ns  
ns  
BLANK pulse duration  
ns  
ns  
tsu1  
ns  
tsu2  
ns  
Setup time  
tsu3  
ns  
tsu4  
ns  
tsu5  
ms  
ns  
th0  
SCLK–SIN (see Figure 11)  
XLA–SCLK (see Figure 11)  
SCLK–VPRG (see Figure 6)  
XLAT–VPRG (see Figure 6)  
BLANK–GSCLK (see Figure 13)  
DCPRG–VPRG  
10  
10  
10  
10  
10  
1
th1  
ns  
th2  
ns  
Hold Time  
th3  
ns  
th4  
ns  
th5  
ms  
ms  
tprog  
Programming time for EEPROM  
20  
DISSIPATION RATINGS  
POWER RATING  
DERATING FACTOR  
ABOVE TA = 25°C  
POWER RATING  
POWER RATING  
PACKAGE  
TA < 25°C  
TA = 70°C  
TA = 85°C  
28-pin HTSSOP with  
3958 mW  
2026 mW  
31.67 mW/°C  
2533 mW  
1296 mW  
2058 mW  
1053 mW  
PowerPAD™(1)soldered  
28-pin HTSSOP with PowerPAD™ un-  
soldered  
16.21 mW/°C  
32-pin QFN(1)  
3482 mW  
2456 mW  
27.86 mW/°C  
19.65 mW/°C  
2228 mW  
1572 mW  
1811 mW  
1277 mW  
28-pin PDIP  
(1) The PowerPAD is soldered to the PCB with a 2 oz. copper trace. See SLMA002 for further information.  
3
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
ELECTRICAL CHARACTERISTICS  
VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VOH  
VOL  
High-level output voltage  
Low-level output voltage  
IOH = -1 mA, SOUT  
IOL = 1 mA, SOUT  
VCC– 0.5  
V
0.5  
1
V
VI = VCC or GND; BLANK, DCPRG, GSCLK, SCLK, SIN,  
XLAT  
–1  
–1  
µA  
mA  
VI = GND; VPRG  
1
50  
10  
II  
Input current  
VI = VCC; VPRG  
VI = 22 V; VPRG; DCPRG = VCC  
4
No data transfer, all output OFF,  
VO = 1 V, R(IREF) = 10 kΩ  
0.9  
6
12  
25  
No data transfer, all output OFF,  
VO = 1 V, R(IREF) = 1.3 kΩ  
5.2  
16  
ICC  
Supply current  
mA  
Data transfer 30 MHz, all output ON,  
VO = 1 V, R(IREF) = 1.3 kΩ  
Data transfer 30 MHz, all output ON,  
VO = 1 V, R(IREF) = 640 Ω  
30  
61  
60  
69  
IO(LC)  
Ilkg  
Constant output current  
Leakage output current  
All output ON, VO = 1 V, R(IREF) = 640 Ω  
54  
mA  
All output OFF, VO = 15 V, R(IREF) = 640 ,  
OUT0 to OUT15  
0.1  
µA  
All output ON, VO = 1 V, R(IREF) = 640 ,  
OUT0 to OUT15, –20°C to 85°C  
±1  
±1  
±1  
±1  
±4  
±8  
±6  
±8  
±4  
±4  
±4  
±6  
±6  
±8  
All output ON, VO = 1 V, R(IREF) = 640 ,  
OUT0 to OUT15  
IO(LC0) Constant current error  
%
All output ON, VO = 1 V, R(IREF) = 320 ,  
OUT0 to OUT15, –20°C to 85°C  
All output ON, VO = 1 V, R(IREF) = 320 ,  
VCC = 4.5 V to 5.5 V, OUT0 to OUT15  
Device to device, Averaged current from OUT0 to  
OUT15, R(IREF) = 1920 (20 mA)  
–2  
+0.4  
IO(LC1) Constant current error  
IO(LC2) Constant current error  
%
Device to device, Averaged current from OUT0 to  
OUT15, R(IREF) = 480 (80 mA)  
–2.7  
+2  
%
All output ON, VO = 1 V, R(IREF) = 640 Ω  
OUT0 to OUT15  
±1  
±1  
±2  
±2  
%/V  
%/V  
%/V  
%/V  
Power supply rejection ratio,  
PSRR  
IO(LC3)  
All output ON, VO = 1 V, R(IREF) = 320 ,  
OUT0 to OUT15  
All output ON, VO = 1 V to 3 V, R(IREF) = 640 ,  
OUT0 to OUT15  
IO(LC4) Load regulation  
All output ON, VO = 1 V to 3 V, R(IREF) = 320 ,  
OUT0 to OUT15  
T(TEF)  
V(LED)  
Thermal error flag threshold  
LED open detection threshold  
Junction temperature(1)  
150  
170  
0.4  
°C  
0.3  
V
Reference voltage  
output  
V(IREF)  
RI(REF) = 640 Ω  
1.20  
1.24  
1.28  
V
(1) Not tested. Specified by design  
4
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
SWITCHING CHARACTERISTICS  
VCC = 3 V to 5.5 V, TA = -40°C to 85°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
10  
MAX UNIT  
tr0  
SOUT  
16  
ns  
30  
Rise time  
tr1  
OUTn, VCC = 5 V, TA = 60°C, DCx = 3F  
SOUT  
tf0  
16  
ns  
30  
Fall time  
tf1  
OUTn, VCC = 5 V, TA = 60°C, DCx = 3F  
SCLK–SOUT (see Figure 11)  
DCPRG–OUT0  
10  
tpd0  
tpd1  
tpd2  
tpd3  
tpd4  
tpd5  
td  
30  
30  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
BLANK–OUT0 (see Figure 13 )  
OUTn - XERR (see Figure 13 )  
GSCLK–OUT0 (see Figure 13 )  
XLAT–IOUT (dot correction)  
OUTn–OUT(n+1) (see Figure 13 )  
60  
Propagation delay time  
Output delay time  
1000  
60  
1000  
30  
20  
5
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
DEVICE INFORMATION  
PWP PACKAGE  
(TOP VIEW)  
NT PACKAGE  
(TOP VIEW)  
OUT1  
OUT0  
VPRG  
SIN  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
1
2
28  
GND  
BLANK  
XLAT  
SCLK  
SIN  
VPRG  
OUT0  
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
OUT7  
VCC  
IREF  
2
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
OUT7  
OUT8  
OUT9  
OUT10  
OUT11  
OUT12  
OUT13  
OUT14  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
3
DCPRG  
GSCLK  
SOUT  
XERR  
OUT15  
OUT14  
OUT13  
OUT12  
OUT11  
OUT10  
OUT9  
3
4
SCLK  
XLAT  
4
5
5
6
Thermal  
PAD  
BLANK  
GND  
7
6
8
7
9
VCC  
8
10  
11  
12  
13  
14  
IREF  
9
DCPRG  
GSCLK  
SOUT  
XERR  
OUT15  
10  
11  
12  
13  
14  
OUT8  
RHB PACKAGE  
(TOP VIEW)  
DCPRG 25  
IREF 26  
VCC 27  
NC 28  
16 OUT10  
15 OUT9  
14 OUT8  
13 NC  
THERMAL  
PAD  
NC 29  
12 NC  
GND 30  
BLANK 31  
XLAT 32  
11 OUT7  
10 OUT6  
9
OUT5  
NC − No internal connection  
6
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
DEVICE INFORMATION (continued)  
TERMINAL FUNCTION  
TERMINAL  
NO.  
I/O  
DESCRIPTION  
NAME  
DIP PWP  
RHB  
Blank all outputs. When BLANK = H, all OUTn outputs are forced OFF. GS counter is also  
reset. When BLANK = L, OUTn are controlled by grayscale PWM control.  
BLANK  
23  
2
31  
I
I
Switch DC data input. When DCPRG = L, DC is connected to EEPROM. When DCPRG = H,  
DC is connected to the DC register.  
DCPRG  
19  
26  
25  
DCPRG is also controls EEPROM writing, when VPRG = V(PRG)  
GND  
22  
18  
20  
1
30  
24  
26  
G
I
Ground  
GSCLK  
IREF  
25  
27  
Reference clock for grayscale PWM control  
Reference current terminal  
I
12, 13,  
28, 29  
NC  
No connection  
OUT0  
OUT1  
OUT2  
OUT3  
OUT4  
OUT5  
OUT6  
OUT7  
OUT8  
OUT9  
OUT10  
OUT11  
OUT12  
OUT13  
OUT14  
OUT15  
SCLK  
SIN  
28  
1
7
4
5
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Constant current output  
Serial data shift clock  
Serial data input  
8
2
9
6
3
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
4
7
4
8
5
9
6
10  
11  
14  
15  
16  
17  
18  
19  
20  
21  
1
7
8
9
10  
11  
12  
13  
14  
15  
25  
26  
17  
21  
5
2
I
SOUT  
VCC  
24  
28  
23  
27  
O
I
Serial data output  
Power supply voltage  
Multifunction input pin. When VPRG = GND, the device is in GS mode. When VPRG = VCC, the  
device is in DC mode. When VPRG = V(PRG), DC register data can programmed into DC  
EEPROM with DCPRG=HIGH.  
VPRG  
27  
6
3
I
XERR  
XLAT  
16  
24  
23  
3
22  
32  
O
I
Error output. XERR is an open-drain terminal. XERR goes L when LOD or TEF is detected.  
Data latch. Note that the internal connections are switched by VPRG. At XLAT(VPRG =  
GND), GS register gets new data. At XLAT(VPRG = VCC), DC register gets new data.  
7
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
PARAMETER MEASUREMENT INFORMATION  
PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS  
Resistor values are equivalent resistances, and they are not tested.  
INPUT EQUIVALENT CIRCUIT  
OUTPUT EQUIVALENT CIRCUIT (SOUT)  
(BLANK, XLAT, SCLK, SIN, GSCLK, DCPRG)  
VCC  
23 W  
400 W  
INPUT  
SOUT  
23 W  
GND  
GND  
INPUT EQUIVALENT CIRCUIT (IREF)  
OUTPUT EQUIVALENT CIRCUIT (XERR)  
VCC  
23 W  
Amp  
XERR  
_
400 W  
+
INPUT  
100 W  
GND  
GND  
INPUT EQUIVALENT CIRCUIT (VCC)  
OUTPUT EQUIVALENT CIRCUIT (OUT)  
INPUT  
OUT  
GND  
INPUT EQUIVALENT CIRCUIT (VPRG)  
INPUT  
GND  
GND  
Figure 1. Input and Output Equivalent Circuits  
8
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
PARAMETER MEASUREMENT INFORMATION (continued)  
t
, t , t  
, t , t  
t
t
who wIO wh1 wl1 su0  
su4, h4  
V
(LED)  
= 4 V  
SOUT  
Testpoint  
C = 15 pF  
R = 51 W  
L
L
OUTn  
Testpoint  
C = 15 pF  
L
IOLC, IOLC3, IOLC4, IOUT/IREF  
=
V
(LED)  
1 V  
OUT0  
OUTn  
V
= 0 V ~ 7 V  
_
CC  
+
OUT15  
IREF  
Testpoint  
= 640 W  
R
IREF  
Figure 2. Parameter Measurement Circuits  
9
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
TYPICAL CHARACTERISTICS  
REFERENCE RESISTOR  
vs  
OUTPUT CURRENT  
POWER DISSIPATION RATE  
vs  
FREE-AIR TEMPERATURE  
100 k  
4 k  
TLC5940PWP  
PowerPAD Soldered  
TLC5940RHB  
3 k  
10 k  
TLC5940NT  
2 k  
TLC5940PWP  
PowerPAD Unsoldered  
1 k  
1 k  
100  
0
0
20  
40  
60  
80  
100  
120  
-40  
-20  
0
20  
40  
60  
80  
100  
o
I
Output Current mA  
T
Free-Air Temperature C  
O
A
Figure 3.  
Figure 4.  
OUTPUT CURRENT  
vs  
OUTPUT VOLTAGE  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
I
= 60 mA  
max  
I
= 30 mA  
max  
I
= 5 mA  
max  
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7  
3
V
Output Voltage V  
O
Figure 5.  
10  
 
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
PRINCIPLES OF OPERATION  
SERIAL INTERFACE  
The TLC5940 includes a flexible serial interface, which can be connected to microcontrollers or digital signal  
processors in various ways. Only 3 pins are needed to input data into the device. The rising edge of SCLK signal  
shifts the data from the SIN pin to the internal register. After all data is clocked in, a rising edge of XLAT latches  
the serial data to the internal registers. All data are clocked in with the MSB first. Multiple TLC5940 devices can  
be cascaded by connecting the SOUT pin of one device with the SIN pin of the following device. The SOUT pin  
can also be connected to the controller to receive status information from TLC5940. The serial data format is  
96-bit or 192-bit wide, depending on programming mode of the device.  
DC Mode Data  
Input Cycle  
GS Mode Data  
Input Cycle  
DC Mode Data  
Input Cycle  
Vcc  
VPRG  
t
h3  
t
t
h3  
su3  
XLAT  
SIN  
DC n  
MSB  
DC n  
LSB  
GS  
MSB  
GS  
LSB  
DC n+1  
MSB  
DC n+1  
MSB−1  
t
h2  
t
t
h2  
t
su2  
su2  
1
96  
1
192  
193  
1
2
SCLK  
SOUT  
DC n  
MSB  
DC n  
LSB  
DC  
MSB  
GS  
MSB  
SID  
MSB  
X
X
X
Figure 6. Serial Data Input Timing Chart  
ERROR INFORMATION OUTPUT  
The open-drain output XERR is used to report both of the TLC5940 error flags, TEF and LOD. During normal  
operating conditions, the internal transistor connected to the XERR pin is turned off. The voltage on XERR is  
pulled up to VCC through an external pullup resistor. If TEF or LOD is detected, the internal transistor is turned  
on, and XERR is pulled to GND. Since XERR is an open-drain output, multiple ICs can be OR'ed together and  
pulled up to VCC with a single pullup resistor. This reduces the number of signals needed to report a system error  
(see Figure 14).  
To differentiate LOD and TEF signal from XERR pin, LOD can be masked out with BLANK = HIGH.  
Table 1. XERR Truth Table  
ERROR CONDITION  
TEMPERATURE  
ERROR INFORMATION  
SIGNALS  
OUTn VOLTAGE  
Don't Care  
TEF  
L
LOD  
X
BLANK  
XERR  
TJ < T(TEF)  
TJ > T(TEF)  
H
H
L
H
L
L
L
Don't Care  
H
X
OUTn > V(LED)  
OUTn < V(LED)  
OUTn > V(LED)  
OUTn < V(LED)  
L
L
TJ < T(TEF)  
L
H
L
H
L
TJ > T(TEF)  
H
H
11  
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
TEF: THERMAL ERROR FLAG  
The TLC5940 provides a temperature error flag (TEF) circuit to indicate an overtemperature condition of the IC. If  
the junction temperature exceeds the threshold temperature (160°C typical), the TEF circuit trips and pulls XERR  
to ground. TEF status can also be read out from the TLC5940 status register.  
LOD: LED OPEN DETECTION  
The TLC5940 provides an LED open-detection circuit (LOD). This circuit reports an error if any one of the 16  
LEDs is open or disconnected from the circuit. The LOD circuit trips when the following two conditions are met  
simultaneously:  
1. BLANK is set to LOW  
2. When the voltage at OUTn is less than V(LED) of 0.3 V (typical) (Note: the voltage at each OUTn is sampled  
1 µs after being turned on).  
The LOD circuit also pulls XERR to GND when tripped. The LOD status of each channel can also be read out  
from the TLC5940 status information data (SID) in GS data input cycle.  
DELAY BETWEEN OUTPUTS  
The TLC5940 has graduated delay circuits between outputs. These circuits can be found in the constant current  
driver block of the device (see the functional block diagram). The fixed-delay time is 20 ns (typical), OUT0 has no  
delay, OUT1 has 20 ns delay, and OUT2 has 40 ns delay, etc. The maximum delay is 300 ns from OUT0 to  
OUT15. The delay works during switch on and switch off of each output channel. These delays prevent large  
inrush currents which reduces the bypass capacitors when the outputs turn on.  
OUTPUT ENABLE  
All OUTn channels of TLC5940 can switched off with one signal. When BLANK is set to high, all OUTn are  
disabled, regardless of logic operations of the device. The grayscale counter is also reset. When BLANK is set to  
low, all OUTn work under normal conditions.  
Table 2. BLANK Signal Truth Table  
BLANK  
LOW  
OUT0 - OUT15  
Normal condition  
Disabled  
HIGH  
SETTING MAXIMUM CHANNEL CURRENT  
The maximum output current per channel is programmed by a single resistor, R(IREF), which is placed between  
IREF pin and GND pin. The voltage on IREF is set by an internal band gap V(IREF) with a typical value of  
1.24 V. The maximum channel current is equivalent to the current flowing through R(IREF) multiplied by a factor of  
31.5. The maximum output current can be calculated by Equation 1:  
V
(IREF)  
I
+
  31.5  
max  
R
(IREF)  
(1)  
where:  
V(IREF) = 1.24 V  
R(IREF) = User selected external resistor.  
Figure 3 shows the maximum output current IO versus R(IREF). R(IREF) is the value of the resistor between IREF  
terminal to GND, and IO is the constant output current of OUT0 to OUT15.  
12  
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
POWER DISSIPATION CALCULATION  
The device power dissipation needs to be below the power dissipation rate of the device package to ensure  
correct operation. Equation 2 calculates the power dissipation of device:  
DC  
n
x d  
PWM  
x N)  
P
= V  
(
x I  
CC  
+
( V x I  
OUT MAX  
x
)
D
CC  
63  
(2)  
where:  
VCC: device supply voltage  
ICC: device supply current  
VOUT: TLC5940 OUTn voltage when driving LED current  
IMAX: LED current adjusted by R(IREF) Resistor  
DCn: maximum dot correction value for OUTn  
N: number of OUTn driving LED at the same time  
dPWM: duty cycle defined by BLANK pin or GS PWM value  
OPERATING MODES  
The TLC5940 has different operating modes depending on the signals VPRG and DCPRG. Table 3 shows the  
available operating modes. The TLC5940 GS operating mode (see Figure 11) and shift register values are not  
defined after power up. One solution to solve this is to set dot correction data after TLC5940 power up and  
switch back to GS PWM mode. The other solution is to overflow the input shift register with 193 bits of dummy  
data and latch it while TLC5940 is in GS PWM mode.  
Table 3. TLC5940 Operating Modes Truth Table  
SIGNAL  
INPUT SHIFT REGISTER  
MODE  
DC VALUE  
DCPRG  
VCPRG  
L
H
L
EEPROM  
DC Register  
GND  
192 bit  
96 bit  
X
Grayscale PWM Mode  
EEPROM  
VCC  
Dot Correction Data Input Mode  
EEPROM Programming Mode  
H
L
DC Register  
EEPROM  
V(PRG)  
H
Write dc register value to EEPROM  
SETTING DOT CORRECTION  
The TLC5940 has the capability to fine adjust the output current of each channel OUT0 to OUT15 independently.  
This is also called dot correction. This feature is used to adjust the brightness deviations of LEDs connected to  
the output channels OUT0 to OUT15. Each of the 16 channels can be programmed with a 6-bit word. The  
channel output can be adjusted in 64 steps from 0% to 100% of the maximum output current Imax. Equation 3  
determines the output current for each output n:  
DCn  
63  
I
+ I  
 
max  
OUTn  
(3)  
where:  
Imax = the maximum programmable output current for each output.  
DCn = the programmed dot correction value for output n (DCn = 0 to 63).  
n = 0 to 15  
Dot correction data are entered for all channels at the same time. The complete dot correction data format  
consists of 16 x 6-bit words, which forms a 96-bit wide serial data packet. The channel data is put one after  
another. All data is clocked in with MSB first. Figure 7 shows the DC data format.  
13  
 
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
LSB  
MSB  
95  
0
5
6
79  
90  
DC 0.0  
DC 0.5  
DC 1.0  
DC 14.5 DC 15.0  
DC 15.5  
DC OUT0  
DC OUT15  
DC OUT2 − DC OUT14  
Figure 7. Dot Correction Data Packet Format  
To input data into the dot correction register, VPRG must be set to VCC. The internal input shift register is then  
set to 96-bit width. After all serial data are clocked in, a rising edge of XLAT is used to latch the data into the dot  
correction register. Figure 8 shows the dc data input timing chart.  
DC Mode Data  
Input Cycle n  
DC Mode Data  
Input Cycle n+1  
V
CC  
MODE  
DC n  
DC n  
DC n  
DC n  
DC n  
LSB  
DC n+1  
DC n+1  
SIN  
MSB1  
MSB2  
LSB+1  
MSB  
MSB1  
MSB  
t
wh0  
SCLK  
1
2
3
95  
96  
1
2
t
wl0  
DC n1  
MSB  
DC n1  
MSB1  
DC n1  
MSB2  
DC n1  
LSB+1  
DC n1  
DC n  
DC n  
MSB1  
DC n  
MSB2  
SOUT  
LSB  
MSB  
t
wh2  
t
t
su1  
h1  
XLAT  
Figure 8. Dot Correction Data Input Timing Chart  
The TLC5940 has also an EEPROM to store dot correction data. To store data from the dot correction register to  
EEPROM, DCPRG is set to high after applying VPRG to VPRG pin. Figure 9 shows the EEPROM programming  
timings.  
DC EEPROM Write Timing  
V
(PRG)  
VPRG  
0 V or V  
CC  
t
h5  
t
t
prog  
su5  
DCPRG  
Figure 9. EEPROM Programming Timing Chart  
14  
 
 
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
SETTING GRAYSCALE  
The TLC5940 can adjust the brightness of each channel OUTn using a PWM control scheme. The use of 12-bit  
per channel results in 4096 different brightness steps, respective 0% to 100% brightness. Equation 4 determines  
the brightness level for each output n:  
GSn  
4095  
Brightness in % +  
  100  
(4)  
where:  
GSn = the programmed grayscale value for output n (GSn = 0 to 4095)  
n = 0 to 15  
Grayscale data for all OUTn  
The input shift register enters grayscale data into grayscale register for all channels simultaneously. The  
complete grayscale data format consists of 16 x 12 bit words, which forms a 192-bit wide data packet (see  
Figure 10). The data packet must be clocked in with the MSB first.  
LSB  
0
MSB  
191  
11  
12  
178  
180  
GS 0.0  
GS 0.11 GS 0.0  
GS 14.11 GS15.0  
GS 15.11  
GS OUT0  
GS OUT2 − GS OUT14  
GS OUT15  
Figure 10. Grayscale Data Packet Format  
When VPRG is set to GND, TLC5940 enters the grayscale data input mode. The device switches the input shift  
register to 192-bit width. After all data is clocked in, a rising edge of XLAT signal latches the data into the  
grayscale register (see Figure 11). The first GS data input cycle after dot correction requires an additional SCLK  
pulse after the XLAT signal to complete the grayscale update cycle. All GS data in the input shift register is  
replaced with status information data (SID) after latching into grayscale register.  
DC Mode Data  
First GS Mode Data  
Following GS Mode Data  
Input Cycle  
Input Cycle  
Input CycleAfter DC Data Input Cycle  
MODE  
t
su3  
t
h3  
t
h3  
XLAT  
t
wh2  
GS  
GS + 1  
GS + 1  
LSB  
GS  
DC  
SIN  
LSB  
MSB  
LSB  
MSB  
t
t
t
h1  
su2  
h2  
t
su1  
96  
1
192  
193  
1
192  
SCLK  
t
pd0  
SID n + 1  
MSB  
SID  
MSB1  
SID  
MSB  
SID  
LSB  
DC  
MSB  
DC n  
GS  
MSB  
SOUT  
X
X
LSB  
Figure 11. Grayscale Data Input Timing Chart  
15  
 
 
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
STATUS INFORMATION OUTPUT  
The TLC5940 does have a status information register, which can be accessed in grayscale mode (VPRG =  
GND). After the XLAT signal latches the data into GS register the input shift register data will be replaced with  
status information data (SID) of the device (see Figure 11). LOD, TEF and dot correction EEPROM data  
(DCPRG=LOW) or dot correction register data (DCPRG=HIGH) can be read out at the SOUT pin. The status  
information data packet is 192-bit wide. Bit 176 - bit 191 contains the LOD status of each channel. Bit 175  
contains the TEF status. If DCPRG is low, bit 72 - bit 167 contains the value of the dot correction EEPROM. If  
DCPRG is high, bit 72 - bit 167 contains the data of the dot correction register. The remaining bits are reserved.  
The complete status information data packet is shown in Figure 12.  
LSB  
0
MSB  
191  
71  
X
72  
167  
168  
X
175  
176  
X
DC 0.0  
DC15.5  
X
TEF  
LOD 0  
LOD 15  
Reserved  
DC Values  
TEF  
LOD Data  
Figure 12. Status Information Data Packet Format  
GRAYSCALE PWM OPERATION  
The grayscale PWM cycle starts with the falling edge of BLANK. The first GSCLK pulse after BLANK increases  
the grayscale counter by one and switches on all OUTn with grayscale value not zero. Each following rising edge  
of GSCLK increases the grayscale counter by one. The TLC5940 compares the grayscale value of each output  
OUTn with the grayscale counter value. All OUTn with grayscale values equal to counter values are switched off.  
A BLANK=H signal after 4096 GSCLK pulses resets the grayscale counter to zero and completes the grayscale  
PWM cycle (see Figure 13).  
GS PWM  
Cycle n  
GS PWM  
Cycle n+1  
BLANK  
GSCLK  
t
wl1  
t
t
su4  
t
wh1  
t
h4  
wh3  
4096  
1
2
3
1
t
wl1  
t
t
t
pd4  
pd2  
pd4  
OUT0  
(Current)  
n x t  
d
t + n x t  
pd4 d  
t
+ t  
d
pd2  
OUT1  
(Current)  
t
+ 14 x t  
d
pd2  
OUT15  
(Current)  
t
pd3  
XERR  
Figure 13. Grayscale PWM Cycle Timing Chart  
16  
 
 
TLC5940  
www.ti.com  
SLVS515ADECEMBER 2004REVISED AUGUST 2005  
SERIAL DATA TRANSFER RATE  
Figure 14 shows a cascading connection of n TLC5940 devices connected to a controller, building a basic  
module of an LED display system. The maximum number of cascading TLC5940 devices depends on the  
application system and is in the range of 40 devices. Equation 5 calculates the minimum frequency needed:  
f
4096  
f
(GSCLK)  
(update)  
f
+ 193   f  
  n  
(SCLK)  
(update)  
(5)  
where:  
f(GSCLK): minimum frequency needed for GSCLK  
f(SCLK): minimum frequency needed for SCLK and SIN  
f(update): update rate of whole cascading system  
n: number cascaded of TLC5940 device  
APPLICATION EXAMPLE  
V
V
V
V
V
(LED)  
CC  
(LED)  
(LED)  
(LED)  
100 k  
OUT0  
OUT15  
SOUT  
OUT0  
OUT15  
SOUT  
SIN  
SIN  
XERR  
SCLK  
SIN  
XERR  
SCLK  
XERR  
SCLK  
XLAT  
V
V
CC  
CC  
100 nF  
100 nF  
XLAT  
XLAT  
TLC5940  
IC 0  
TLC5940  
IC n  
GSCLK  
DCPRG  
BLANK  
SOUT  
GSCLK  
DCPRG  
BLANK  
VPRG  
GSCLK  
DCPRG  
BLANK  
VPRG  
IREF  
IREF  
Controller  
W_EEPROM  
VPRG_D  
7
VPRG_OE  
V
V
(22V)  
(22V)  
50 k  
50 k  
50 k  
50 k  
50 k  
50 k  
VPRG  
Figure 14. Cascading Devices  
17  
 
PACKAGE OPTION ADDENDUM  
www.ti.com  
8-Aug-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TLC5940NT  
ACTIVE  
ACTIVE  
PDIP  
NT  
28  
28  
13  
TBD  
Call TI  
Level-NA-NA-NA  
TLC5940PWP  
HTSSOP  
PWP  
50 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLC5940PWPG4  
TLC5940PWPR  
TLC5940PWPRG4  
TLC5940RHB  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
HTSSOP  
HTSSOP  
HTSSOP  
QFN  
PWP  
PWP  
PWP  
RHB  
RHB  
RHB  
28  
28  
28  
32  
32  
32  
50 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
73 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLC5940RHBR  
TLC5940RHBRG4  
QFN  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
QFN  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
27-Feb-2006  
PACKAGING INFORMATION  
Orderable Device  
TLC5940NT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
PDIP  
NT  
28  
28  
28  
28  
28  
28  
32  
32  
32  
32  
13 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
TLC5940NTG4  
TLC5940PWP  
PDIP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
QFN  
NT  
13 Green (RoHS & CU NIPDAU N / A for Pkg Type  
no Sb/Br)  
PWP  
PWP  
PWP  
PWP  
RHB  
RHB  
RHB  
RHB  
50 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLC5940PWPG4  
TLC5940PWPR  
TLC5940PWPRG4  
TLC5940RHB  
50 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
73 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TLC5940RHBG4  
TLC5940RHBR  
TLC5940RHBRG4  
QFN  
73 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
QFN  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
QFN  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPDI004 – OCTOBER 1994  
NT (R-PDIP-T**)  
PLASTIC DUAL-IN-LINE PACKAGE  
24 PINS SHOWN  
A
PINS **  
24  
28  
DIM  
24  
13  
1.260  
(32,04) (36,20)  
1.425  
A MAX  
1.230  
(31,24) (35,18)  
1.385  
A MIN  
B MAX  
B MIN  
0.280 (7,11)  
0.250 (6,35)  
0.310  
(7,87)  
0.315  
(8,00)  
1
12  
0.290  
(7,37)  
0.295  
(7,49)  
0.070 (1,78) MAX  
B
0.020 (0,51) MIN  
0.200 (5,08) MAX  
Seating Plane  
0.125 (3,18) MIN  
0.100 (2,54)  
0.010 (0,25)  
0°15°  
0.021 (0,53)  
0.015 (0,38)  
M
0.010 (0,25) NOM  
4040050/B 04/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
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