TLC5957 [TI]

具有预充电 FET、LED 开路检测和 Caterpillar 消除功能的 48 通道、16 位 ES-PWM LED 驱动器;


型号：	TLC5957
厂家：	TEXAS INSTRUMENTS
描述：	具有预充电 FET、LED 开路检测和 Caterpillar 消除功能的 48 通道、16 位 ES-PWM LED 驱动器驱动驱动器
文件：	总26页 (文件大小：1284K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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TLC5957

ZHCSCX6 –OCTOBER 2014

TLC5957 具有预充电 FET、LED 开路检测和 Caterpillar 消除功能

的 48 通道、16 位 ES-PWM LED 驱动器

1 特性

3 说明

•

48 个恒定灌电流输出通道

TLC5957 是一款 48 通道恒流灌电流驱动器。每个通

道都具有单独可调的 65536 步长脉宽调制 (PWM) 灰

度 (GS) 亮度控制。

•

具有最大亮度控制 (BC)/最大颜色亮度控制 (CC) 数

据的灌电流

–

1~20mA (VCC = 3.3V)

1~25mA (VCC = 5V)

输出通道分为三组，每组均含 512 步长的颜色亮度控

制 (CC) 功能，CC 可调节颜色之间的亮度。全部 48

通道的最大电流值可通过 8 步长全局亮度控制 (BC) 功

能设置。 BC 调节 LED 驱动器之间的亮度偏差。可通

过一个串行接口端口访问 GS、CC 和 BC 数据。

•

全局亮度控制 (BC)：3 位（8 步长）

每个颜色组的全局亮度控制 (CC)：9 位（512 步

长），三组

•

LED 电源电压高达 10V

VCC = 3.0V 至 5.5V

10mA 时拐点电压 Vout = 0.24V

恒流精度

TLC5957 有一个错误标志：LED 开路检测 (LOD)，可

通过串行接口端口读取。每个恒流输出都有一个预充

电的场效应晶体管 (FET)，能够消除复用 LED 显示时

的重影并提升显示性能。此外，TLC5957 具有增强电

路，可消除 LED 开路所引起的 caterpillar 效应。

–

通道之间 = ±1%（典型值），±3%（最大值）

器件之间 = ±1%（典型值），±2%（最大值）

•

数据传输速率：33MHz

TLC5957 具有扑克数据传输模式；GS 数据长度可配

置为 9 位至 16 位，具体取决于各子段中的 PWM 位。

扑克模式可显著提升复用应用的视觉刷新率。

灰度控制时钟：33MHz

预充电 FET 可消除重影

增强电路可消除 Caterpillar 效应

器件信息⁽¹⁾

可选数据传输位和脉宽调制 (PWM) 位（9 位至 16

位）

部件号

TLC5957

封装

QFN (56)

封装尺寸（标称值）

8.0mm x 8.0mm

•

可选传统 PWM 和 ES-PWM

LED 开路检测 (LOD)

(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。

热关断 (TSD)

自动显示重复/自动数据刷新

延迟开关可防止浪涌电流

工作温度范围：-40°C 至 +85°C

2 应用范围

•

采用多路复用系统的 LED

LED 信号板

4 典型应用电路（多个菊花链 TLC5957）

LED

OUTR0 - - - - - - - - - - - OUTB15

DATA

SCLK

LAT

SIN

SOUT

SIN

SOUT

SCLK

LAT

SCLK

LAT

Device 1

VCC

Device n

VCC

GSCLK

IREF

GND

IREF

Controller

R_IREF

Data Read

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

English Data Sheet: SLVSCQ4

TLC5957

ZHCSCX6 –OCTOBER 2014

www.ti.com.cn

8.2 Test Circuit.............................................................. 10

Detailed Description ............................................ 11

9.1 Overview ................................................................. 11

9.2 Functional Block Diagram ....................................... 12

9.3 Device Functional Modes........................................ 13

特性.......................................................................... 1

应用范围................................................................... 1

说明.......................................................................... 1

典型应用电路（多个菊花链 TLC5957） .................. 1

修订历史记录 ........................................................... 2

Pin Configuration and Functions......................... 3

Specifications......................................................... 4

7.1 Absolute Maximum Ratings ...................................... 4

7.2 Handling Ratings ...................................................... 4

7.3 Recommended Operating Conditions....................... 5

7.4 Thermal Information ................................................. 5

7.5 Electrical Characteristics........................................... 5

7.6 Timing Requirements ............................................... 7

7.7 Typical Characteristics.............................................. 8

Parameter Measurement Information ................ 10

10 Application and Implementation........................ 17

10.1 Application Information.......................................... 17

11 Power Supply Recommendations ..................... 17

12 Layout................................................................... 17

12.1 Layout Guidelines ................................................. 17

12.2 Layout Example .................................................... 18

13 器件和文档支持 ..................................................... 18

13.1 相关链接................................................................ 18

13.2 商标....................................................................... 18

13.3 静电放电警告......................................................... 18

13.4 术语表 ................................................................... 18

14 机械封装和可订购信息 .......................................... 18

8.1 Pin Equivalent Input and Output Schematic

Diagrams.................................................................. 10

5 修订历史记录

日期

修订版本

注释

2014 年 10 月

最初发布。

TLC5957

www.ti.com.cn

ZHCSCX6 –OCTOBER 2014

6 Pin Configuration and Functions

RTQ

56 PINS

Top View

56 55 54 53 52 51 50 49 48 47 46 45 44 43

IREF

OUTR14

OUTG14

OUTB14

OUTR15

OUTG15

OUTB15

OUTR0

OUTG0

OUTB0

SOUT

OUTB9

OUTG9

OUTR9

OUTB8

OUTG8

OUTR8

OUTB7

OUTG7

OUTR7

OUTB6

OUTG6

OUTR6

GCLK

Thermal

PAD

(Solder side)

(GND terminal)

OUTR1

OUTG1

OUTB1

OUTR2

15 16 17 18 19 20 21 22 23 24 25 26 27 28

Pin Functions

NO.

I/O

DESCRIPTION

NAME

GCLK

Grayscale(GS) pulse width modulation (PWM) reference clock control for OUTXn.

Each GCLK rising edge increase the GS counter by1 for PWM control.

Power ground. The thermal pad must be soldered to GND on PCB.

GND

IREF

ThermalPad

—

Maximum constant-current value setting. The OUTR0 to OUTB15 maximum constant output

current are set to the desired values by connecting an external resistor between IREF and

IREFGND. See Equation 1 for more detail. The external resistor should be placed close to the

device.

IREFGND 56

—

Analog ground. Dedicated ground pin for the external IREF resistor. This pin should be connected

to analog ground trace which is connected to power ground near the common GND point of board.

LAT

The LAT falling edge latches the data from the common shift register into the GS data latch or FC

data latch.

OUTR0-

R15

8, 11, 14, 17, 20,

23, 30, 33, 36,

39, 44, 47, 50,

53, 2, 5

Constant current output for RED LED. Multiple outputs can be tied together to increase the

constant current capability. Different voltages can be applied to each output. These outputs are

turned on-off by GCLK signal and the data in GS data memory.

OUTG0-

G15

9, 12, 15, 18, 21,

24, 31, 34, 37,

40, 45, 48, 51,

54, 3, 6

Constant current output for GREEN LED. Multiple outputs can be tied together to increase the

constant current capability. Different voltages can be applied to each output. These outputs are

turned on-off by GCLK signal and the data in GS data memory.

OUTB0-

B15

10, 13, 16, 19,

22, 25, 32, 35,

38, 41, 46, 49,

52, 55, 4, 7

Constant current output for BLUE LED. Multiple outputs can be tied together to increase the

constant current capability. Different voltages can be applied to each output. These outputs are

turned on-off by GCLK signal and the data in GS data memory.

TLC5957

ZHCSCX6 –OCTOBER 2014

www.ti.com.cn

Pin Functions (continued)

I/O

DESCRIPTION

NAME

NO.

SCLK

Serial data shift clock. Data present on SIN are shifted to the 48-bit common shift register LSB

with the SCLK rising edge. Data in the shift register are shifted towards the MSB at each SCLK

rising edge.

The common shift register MSB appears on SOUT.

SIN

Serial data input of the 48-bit common shift register.

When SIN is high level, the LSB is set to '1' for only one SCLK input rising edge. If two SCLK

rising edges are input while SIN is high, then the 48-bit shift register LSB and LSB+1 are set to '1'.

When SIN is low, the LSB is set to '0' at the SCLK input rising edge.

SOUT

VCC

Serial data output of the 48-bit common shift register. SOUT is connected to the MSB of the

—

Power-supply voltage.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

–0.3

MAX

6.0

UNIT

(2)

V_CC

I_OUT

Supply voltage

VCC

Output current (dc)

Input voltage range

OUTx0 to OUTx15, x = R, G, B

SIN, SCLK, LAT, GCLK, IREF

SOUT

(2)

V_IN

–0.3

–40

V_CC+ 0.3

(2)

V_OUT

Output voltage range

OUTx0 to OUTx15, x = R, G, B

T_J(MAX)

Operation junction temperature

150

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to device ground terminal.

7.2 Handling Ratings

MIN

–55

–3

MAX

150

UNIT

T_stg

Storage temperature range

Electrostatic discharge

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾

V_(ESD)

Charged device model (CDM), per JEDEC specification JESD22-C101, all

pins⁽²⁾

–1

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TLC5957

www.ti.com.cn

ZHCSCX6 –OCTOBER 2014

7.3 Recommended Operating Conditions

At T_A= –40°C to 85°C, unless otherwise noted.

MIN

NOM

MAX

UNIT

DC CHARACTERISTICS V_CC= 3 V to 5.5 V

V_CC

V_O

Supply voltage

5.5

Voltage applied to output

High level input voltage

Low level input voltage

High level output current

Low level output current

OUTx0 to OUTx15, x = R, G, B

SIN, SCLK, LAT, GCLK

V_IH

V_IL

I_OH

I_OL

0.7×V_CC

GND

V_CC

0.3×V_CC

–2

SIN, SCLK, LAT, GCLK

SOUT

OUTx0 to OUTx15, x = R, G, B, 3V ≤ V_CC≤ 4V

OUTx0 to OUTx15, x = R, G, B, 4V < V_CC≤ 5.5V

I_OLC

Constant output sink current

T_A

T_J

Operating free air temperature

Operation junction temperature

–40

°C

125

AC CHARACTERISTICS, V_CC= 3 V to 5.5 V

F_CLK(SCLK)Data shift clock frequency

F_CLK(GCLK)

SCLK

MHz

Grayscale control clock frequency GCLK

7.4 Thermal Information

TLC5957

THERMAL METRIC⁽¹⁾

UNIT

RTQ (56 PINS)

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

27.4

13.6

5.5

R_θJC(top)

R_θJB

Junction-to-board thermal resistance

°C/W

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

0.2

ψ_JB

5.5

R_θJC(bot)

0.8

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

Output voltage

TEST CONDITIONS

MIN

TYP

MAX

V_CC

0.4

UNIT

V_OH

High

Low

I_OH= –2mA at SOUT

I_OL= 2mA at SOUT

LODVTH = 00b

LODVTH = 01b

LODVTH = 10b

LODVTH = 11b

V_CC-0.4

V_OL

V_LOD0

V_LOD1

V_LOD2

V_LOD3

V_IREF

I_IN

0.05

0.15

0.3

0.09

0.19

0.15

0.25

0.4

LED open detection threshold

0.35

0.45

1.184

–1

0.49

0.55

1.234

Reference voltage output

R_IREF= 5.97kΩꢀ(1mA target), BC = 0h, CCR/G/B = 80h

1.209

Input current (SIN, SCLK, LAT, GCLK)

V_IN= V_CCor GND

µA

SIN/SCLK/LAT/GSCLK = GND, GSn = 0000h, BC = 4h, CCR/G/B = 120h,

VOUTn = 0.6V, RIREF = OPEN, V_CC= 4V

I_CC0

SIN/SCLK/LAT/GSCK = GND, GSn = 0000h, BC = 4h, CCR/G/B = 120h,

VOUTn = 0.6V, RIREF = 7.5kΩ (Io = 10mA target) , V_CC= 4V

I_CC1

SIN/SCLK/LAT = GND, GCLK = 33MHz, T_SU3= 200ns, XREFRESH = 0,

GSn = FFFFh, BC = 4h, CCR/G/B = 120h, VOUTn = 0.6V,

RIREF = 7.5kΩ (Io = 10mA target) , V_CC= 4V

I_CC2

Supply current (V_CC

)

SIN/SCLK/LAT = GND, GCLK = 33MHz, T_SU3= 200ns, XREFRESH = 0,

GSn = FFFFh, BC = 7h, CCR/G/B = 1D2h, VOUTn = 0.6V,

RIREF = 7.5kΩ (Io = 25mA target) , V_CC= 4V

I_CC3

I_CC4

In power save mode

0.9

1.5

TLC5957

ZHCSCX6 –OCTOBER 2014

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Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

All OUTn = on, BC = 0h, CCR/G/B = 08Fh, VOUTn = VOUTfix = 0.6V,

RIREF = 7.5kΩ(1mA target), T_A= +25C, at same color grouped output of

OUTR0-15, OUTG0-15 and OUTB0-15

Constant current error

(OUTx0-15, x = R/G/B)

Channel-to-

channel⁽¹⁾

Δ I_OLC0

±1%

±3%

All OUTn = on, BC = 0h, CCR/G/B = 08Fh, VOUTn = VOUTfix = 0.6V,

RIREF = 7.5kΩ(1mA target), T_A= +25C, at same color grouped output of

OUTR0-15, OUTG0-15 and OUTB0-15

Constant current error

(OUTx0-15, x = R/G/B)

Device-to-

device⁽²⁾

ΔI_OLC1

±1%

±2%

VCC = 3.0 to 5.5V, All OUTn = on, BC = 0h, CCR/G/B = 08Fh,

VOUTn = VOUTfix = 0.6V, RIREF = 7.5kΩꢀ(1mA target)

Δ I_OLC2

Line regulation⁽³⁾

Load regulation⁽⁴⁾

±1

±3

%/V

VCC = 4V, All OUTn = on, BC = 0h, CCR/G/B = 08Fh, VOUTn = 0.6 to 3V,

VOUTfix = 1V, RIREF = 7.5kΩꢀ(1mA target)

ΔI_OLC3

All OUTn = on, BC = 7h, CCR/G/B - 1CCh, VOUTn = VOUTfix = 0.6V,

RIREF = 7.5kΩ(25mA target), T_A= +25C, at same color grouped output of

OUTR0-15, OUTG0-15 and OUTB0-15

Constant current error

(OUTx0-15, x = R/G/B)

Channel-to-

channel⁽¹⁾

ΔI_OLC4

±1%

±3%

All OUTn = on, BC = 7h, CCR/G/B - 1CCh, VOUTn = VOUTfix = 0.6V,

RIREF = 7.5kΩ(25mA target), T_A= +25C, at same color grouped output of

OUTR0-15, OUTG0-15 and OUTB0-15

Constant current error

(OUTx0-15, x = R/G/B)

Device-to-

device⁽²⁾

ΔI_OLC5

±3%

±3

VCC = 3.0 to 5.5V, All OUTn = on, BC = 7h, CCR/G/B - 1CCh,

VOUTn = VOUTfix = 0.6V, RIREF = 7.5kΩꢀ(25mA target)

ΔI_OLC6

Line regulation⁽³⁾

Load regulation⁽⁴⁾

±1

%/V

All OUTn = on, BC = 7h, CCR/G/B - 1CCh, VOUTn = 0.6 to 3V,

VOUTfix = 0.6V, RIREF = 7.5kΩꢀ(25mA target)

Δ I_OLC7

±3

T_TSD

Thermal shutdown threshold

160

170

180

°C

T_HYS

Thermal shutdown hysterisis

V_ISP(in)

I_REFresistor short protection threshold

0.190

I_REFresistor short-protection release

threshold

V_ISP(out)

0.330

(1) The deviation of each outputs in same color group (OUTR0~15 or OUTG0~15 or OUTB0~15) from the average of same color group

constant current. The deviation is calculated by the formula. (X = R or G or B, n = 0~15

IOUTXn

- 1 ´ 100

^{D(%) =}ç

(IOUTX0 + IOUTX1 + ... + IOUTX14 + IOUTX15)

(2) The deviation of the average of constant-current in each color group from the ideal constant-current value. (X = R or G or B) :

(^{IOUTX0 + IOUTX1 + ... + IOUTX15})

- (Ideal Output Current)

D(%) =

´ 100

Ideal Output Current

Ideal current is calculated by the following equation:

IREF

Ideal Output (mA) = Gain ´

´ CCR(or CCG, CCB) / 511d, VIREF = 1.209V(Typ), refer to Table 1 for the Gain at chosen BC.

è ^R

^(W)ø

IREF

(3) Line regulation is calculated by the following equation. (X = R or G or B, n = 0~15):

(IOUTXn at VCC = 5.5V)

(IOUTXn at VCC = 3.0V)

100

^{D(% / V) =}ç

(IOUTXn at VCC = 3.0V

5.5V - 3V

(4) Load regulation is calculated by the following equation. (X = R or G or B, n = 0~15):

(IOUTXn at VOUTXn

3V)

(IOUTXn at VOUTXn

1V)

100

^{D(% / V) =}ç

(IOUTXn at VOUTXn

3V - 1V

TLC5957

www.ti.com.cn

ZHCSCX6 –OCTOBER 2014

7.6 Timing Requirements

At T_A= –40°C to 85°C, unless otherwise noted.

MIN

TYP

MAX UNIT

AC CHARACTERISTICS, V_CC= 3 V to 5.5 V

t_WH0

t_WL0

t_WH1

t_WL1

t_WH2

t_SU0

t_SU1

SCLK

Pulse duration

GCLK

LAT

SIN – SCLK↑

LAT↑ – SCLK↑

Setup time

LAT↓ – SCLK↑ , for WRTGS, WRTFC, and TMGST Command

LAT↓ – SCLK↑ , for LATGS, READFC, and LINERESET Command

LAT↓ – GCLK↑ , for LATGS AND LINERESET Command

SCLK↑ – SIN

t_SU2

t_SU3

t_H0

t_H1

SCLK↑ – LAT↑

t_H2

SCLK↓ – LAT↓

t_WHO,t_WL0, t_WH1, t_WL1, t_WH2

V_CC

INPUT

50%

GND

t_wl

t_wh

t_SU0, t_SU1, t_SU2, t_SU3, t_H0, t₁

V_CC

CLOCK

50%

(1)

INPUT

GND

t_SU

t_H

V_CC

DATA/CONTROL

50%

(1)

INPUT

GND

t_H2

LAT

SCLK

1022 1023 1024

t_H2

LAT Signal needsto include falling edge of SCLK

Figure 1. Input Timing

TLC5957

ZHCSCX6 –OCTOBER 2014

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7.7 Typical Characteristics

At VCC= 4V and T_A= 25°C, unless otherwise noted.

1 mA

5 mA

10 mA

20 mA

1 mA

5 mA

10 mA

20 mA

25 mA

0.2

0.4

0.6

0.8

0.2

0.4

0.6

0.8

Output Voltage (V)

D001

D003

V_CC= 4 V

V_CC= 5 V

Figure 2. Output Current vs Output Voltage

Figure 3. Output Current vs Output Voltage

1 mA

5 mA

10 mA

20 mA

1 mA

5 mA

10 mA

20 mA

-1

-2

-3

-1

-2

-3

Output Current (Ch)

D005

D006

V_CC= 4 V

Figure 4. Constant-Current Error vs Output Current

(Channel-to-Channel in RED color group)

Figure 5. Constant-Current Error vs Output Current

(Channel-to-Channel in GREEN color group)

1.4

1.3

1.2

1.1

1 mA

5 mA

10 mA

20 mA

1 mA

25 mA

0.9

0.8

0.7

0.6

0.5

-1

-2

-3

-40

-20

100 120 140

Ambient Temperature (qC)

D014

V_CC=4V

VOUTXn=0.6V

Output Current (Ch)

D007

V_CC= 4 V

Figure 7. Maximum Constant-Current Error vs Ambient

Temperature

Figure 6. Constant-Current Error vs Output Current

(Channel-to-Channel in BLUE color group)

(Channel-to-Channel in RED color group)

TLC5957

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ZHCSCX6 –OCTOBER 2014

Typical Characteristics (continued)

At VCC= 4V and T_A= 25°C, unless otherwise noted.

1.6

1.4

1.2

1 mA

25 mA

1 mA

25 mA

1.4

1.2

0.8

0.6

0.4

0.2

0.8

0.6

0.4

0.2

-40

-20

100 120 140

-40

-20

100 120 140

Ambient Temperature (qC)

D015

D016

V_CC=4V

VOUTXn=0.6V

V_CC=4V

VOUTXn=0.6V

Figure 8. Maximum Constant-Current Error vs Ambient

Temperature

Figure 9. Maximum Constant-Current Error vs Ambient

Temperature

(Channel-to-Channel in GREEN color group)

(Channel-to-Channel in BLUE color group)

1 mA

5 mA

10 mA

20 mA

25 mA

V_CC= 3 V

V_CC= 4 V

V_CC= 5.5 V

Step [dec]

Output Current (mA)

D012

D017

VOUTXn=0.6V,

GCLK=33MHz,

GSXn=FFFFh,

Figure 10. Global Brightness Control Linearity

Figure 11. Supply Current (I_CC) vs Output Current

21.5

21.25

20.75

20.5

20.25

V_CC= 3 V

V_CC= 4 V

V_CC= 5.5 V

19.75

19.5

-50

100

150

Ambient Temperature (qC)

D013

GCLK=33MHz

GSXn=FFFFh,

VOUTXn=0.6V,

Output Current=10mA,

Figure 12. Supply Current vs Ambient Temperature

TLC5957

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8 Parameter Measurement Information

8.1 Pin Equivalent Input and Output Schematic Diagrams

VCC

V_CC

OUTPUT

INPUT

GND

Figure 13. SIN, SCLK

Figure 14. SOUT

(1)

V_CC

OUTXn

(1) X=R or G or B, n=0~15

INPUT

GND

Figure 16. OUTR0/G0/B0 through OUTR15/G15/B15

Figure 15. LAT, GCLK

8.2 Test Circuit

R_L

C_L

VCC

V_LED

V_CC

(2)

OUTXn

SOUT

(1)

C_L

GND

(1) CL includes measurement probe and jig capacitance.

(2) X=R or G or B, n=0~15

Figure 17. Rise Time and Fall Time Test Circuit for OUTXn

Figure 18. Rise Time and Fall Time Test Circuit for SOUT

OUTR0

VCC

GND

V_CC

(1)

OUTXn

(1)

VOUTXn

OUTB15

VOUTfix

(1) X=R or G or B, n=0~15

Figure 19. Constant Current Test Circuit for OUTXn

TLC5957

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ZHCSCX6 –OCTOBER 2014

9 Detailed Description

9.1 Overview

The TLC5957 is a 48-channel constant-current sink driver for multiplexing an LED display system. Each channel

has an individually-adjustable, 65536-step, pulse width modulation (PWM) grayscale control.

The TLC5957 supports output current range from 1 mA to 25 mA. Channel-to-channel accuracy is 3% max,

device-to-device accuracy is 2% max in all current ranges. Also, the TLC5957 implements Low Grayscale

Enhancement (LGSE) technology to improve the display quality at low grayscale conditions. These features

improve the performance of the TLC5957-multiplexed display system.

The output channels are grouped in three groups, each group has 16 channels for one color. Each group has a

512-step color brightness control (CC) function. The maximum current value of all 48 channels can be set by 8-

step global brightness control (BC) function. GS, CC and BC data are accessible via a serial interface port.

The TLC5957 has one error flag: LED open detection (LOD), that can be read via a serial interface port. The

TLC5957 also has an enhanced circuit to solve the caterpillar issue caused by open LEDs. Thermal shutdown

(TSD) and Iref resistor short protection (ISP) assure TLC5957 of a higher system reliability.

TLC5957

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9.2 Functional Block Diagram

VCC

SIN

48 bit LOD

DATA LATCH

LSB

MSB

SOUT

48 bit Common Shift Register

SEL_TD0

SCLKB

767

SCLK

ADR<767:0>

Grayscale (GS)

LSB

MSB

XRST

data latch

Address Counter

GS first data GS first data

latch for latch for

OUTR/G/B0 OUTR/G/B1

GS first data GS first data

latch for latch for

OUTR/G/B14 OUTR/G/B15

ADR Select

47 48

95 97

671 672 719 720 767

LAT16B LOAD

LAT768B

LSB

MSB

767

LAT

Command

Decoder

LATFC

2nd 48ch GS Data Latch for Display

XRST

SCLK

XRFESH

Poker Trans

Mode

ES-PWN Timing Control

SCLKB

LAT

PWM Mode

LSB

MSB

XRST

Power On

Reset

Function Control (FC) Data latch

Internal circuit

1st line and

Quick pulse

PRIODEND

XRFRESH

GCLK EDGE

LSB

MSB

16 bit

GS Counter

3rd GS Data Latch for ES-PWN Synch

GSCLK

GDLY

12-grouped Switching Delay

BC & CC & PCHG

48CH Constant driver with 3 bit BC, 27 bit CC

and Pre-charge FET

Reference

Current Control

IREF

GND

Detection

Voltage

LOD Detection

OUTR

OUTG0

OUTB0

OUTR15

OUTR1

OUTG15

OUTB15

TLC5957

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ZHCSCX6 –OCTOBER 2014

9.3 Device Functional Modes

After power on, all OUTXn of TLC5957 are turned off. All the internal counters and function control registers are

initialized. Below is a brief summary of the sequence to operate TLC5957, just give users a general idea how this

part works. After that, the function block related to each step will be detailed in following sections.

1. According to required LED current, choose BC and CC code, select the current programming resistor R_IREF

2. Send WRTFC command to set FC register value if the default value need be changed.

3. Write GS data of line 1 into GS data latch. Using LATGS command for the last group of 48bit GS data

loading, the GS data written just now will be displayed.

4. Input GCLK continuously, 2^NGCLK (N>=9) as a segment. Between the interval of two segments, supply

voltage should be switched from one line to next line accordingly.

5. During the same period of step4, GS data for next line should be written into GS data latch. Using LATGS

command for the last group of 48bit GS data loading.

6. Repeat step 4-5 until it comes to the last line for a multiplexing panel. Input 2^NGCLK (N>=9) as a segment,

at the same time, GS data for 1^stline should be written into GS data latch. Using LINERESET command for

the last group of 48bit GS data loading.

Repeat step 4 through 6.

9.3.1 Brightness Control (BC) Function

The TLC5957 is able to adjust the output current of all constant-current outputs simultaneously. This function is

called global brightness control (BC). The global BC for all outputs is programmed with a 3-bit word, thus all

output currents can be adjusted in 8 steps from 12.9% to 100% (See Table 2) for a given current programming

resistor(R_IREF

)

BC data can be set via the serial interface. When the BC data change, the output current also changes

immediately. When the device is powered on, the BC data in the function control (FC) register is set to 4h as the

initial value.

9.3.2 Color Control (CC) Function

The TLC5957 is able to adjust the output current of each of the three color groups OUTR0-OUTR15, OUTG0-

OUTG15, and OUTB0-OUTB15 separately. This function is called color brightness control (CC). For each color,

it has 9-bit data latch CCR, CCG, or CCB in FC register. Thus, all color group output currents can be adjusted in

512 steps from 0% to 100% of the maximum output current, I_OLCMax. (See next section for more details about

I_OLCMax). The CC data are entered via the serial interface. When the CC data change, the output current also

changes immediately.

When the IC is powered on, the CC data are set to ‘100h’.

Equation 1 calculates the actual output current.

Iout(mA) = I_OLCMax(mA) × ( CCR/511d or CCB/511d)

(1)

Where:

I_OLCMax= the maximum channel current for each channel, determined by BC data and R_IREF(See Equation 2)

CCR/G/B = the color brightness control value for each color group in the FC1 register (000h to 1FFh)

Table 1 shows the CC data versus the constant-current against I_OLCMax

TLC5957

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Device Functional Modes (continued)

Table 1. CC Data vs Current Ratio and Set Current Value

RATIO OF OUTPUT

CURRENT

CC DATA (CCR or CCG or CCB)

OUTPUT CURRENT (mA, R_IREF= 7.41 kΩ)

TO I_olcMax(%, typical)

BC = 7h

(IolcMax =25mA)

BC = 0h

(IolcMax=3.2mA)

BINARY

DECIMAL

HEX

0 0000 0000

0 0000 0001

0 0000 0010

—

0.2

0.4

—

0.05

0.10

—

0.006

0.013

—

1 0000 0000

(Default)

256

(Default)

100

(Default)

50.1

12.52

1.621

—

1 1111 1101

1 1111 1110

1 1111 1111

509

510

511

1FD

1FE

1FF

99.6

99.8

100.0

24.90

24.95

3.222

3.229

3.235

9.3.3 Select R_IREFFor a Given BC

The maximum output current per channel, I_OLCMaxis determined by resistor R_IREFplaced between the IREF and

IREFGND pins, and the BC code in FC register. The voltage on IREF is typically 1.209V. R_IREFcan be calculated

by Equation 2.

Riref(kΩ) = Viref(V) / I_OLCMax(mA) × Gain

(2)

Where:

V_IREF= the internal reference voltage on IREF (1.209V, typical)

I_OLCMaxis the largest current for each output at CCR/G/B=1FFh.

Gain = the current gain at a selected BC code (See Table 2 )

Table 2. Current Gain Versus BC Code

BC DATA

RATIO OF

GAIN / GAIN_MAX (AT MAX BC)

GAIN

BINARY

HEX

000 (recommend)

0 (recommend)

20.0

39.5

12.9%

25.6%

37.9%

52.4%

64.7%

73.3%

91.7%

100%

001

010

58.6

011

80.9

100 (default)

101

4 (default)

100.0

113.3

141.6

154.5

110

111

NOTE: Recommend to use smaller BC code for better performance. For noise immunity purposes, suggest R_IREF< 60 kΩ.

9.3.4 Choosing BC/CC For a Different Application

BC is mainly used for global brightness adjustment between day and night. Suggested BC is 4h, which is in the

middle of the range; thus, one can change brightness up and down flexibly.

CC can be used to fine tune the brightness in 512 steps, this is suitable for white balance adjustment between

RGB color groups. To get a pure white color, the general requirement for the luminous intensity ratio of R, G, B

LED is 3:6:1. Depending on LED’s characteristics (Electro-Optical conversion efficiency), the current ratio of R,

G, B LED will be much different from this ratio. Usually, the Red LED will need the largest current. One can

choose 511d(the max value) CC code for the color group which needs the largest current at first, then choose

proper CC code for the other two color groups according to the current ratio requirement of the LED used.

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9.3.4.1 Example 1: Red LED Current is 20mA, Green LED Needs 12mA, Blue LED needs 8mA

1. Red LED needs the largest current, so choose 511d for CCR

2. 511 x 12mA / 20mA = 306.6, thus choose 307d for CCG. With same method, choose 204d for CCB.

3. According to the required red LED current, choose 7h for BC.

4. According to Equation 2, R_IREF= 1.2V/20mA x 154.5 = 9.27 kΩ

In this example, we choose 7h for BC, instead of using the default 4h. This is because the Red LED current is

20mA, approaching the upper limit of current range. To prevent the constant output current from exceeding the

upper limit in case a larger BC code is input accidently, we choose the maximum BC code here.

9.3.4.2 Example 2: Red LED Current is 5mA, Green LED Needs 2mA, Blue LED Needs 1mA.

1. Red LED needs the largest current, so choose 511d for CCR.

2. 511 x 2mA / 5mA = 204.4, thus choose 204d for CCG. With same method, choose 102d for CCB.

3. According to the required blue LED current, choose 0h for BC.

4. According to Equation 2, R_IREF= 1.2V / 5mA x 20 = 4.8 kΩ

In this example, we choose 0h for BC, instead of using the default 4h. This is because the Blue LED current is

1mA, which is approaching the lower limit of current range. To prevent the constant output current from

exceeding the lower limit in case a lower BC code is input accidently, we choose the min BC code here.

In general, if LED current is in the middle of range(i.e, 10mA), one can just use the default 4h as BC code.

9.3.5 LED Open Detection (LOD)

LOD function detects a fault caused by an open circuit in any LED string, or a short from OUTXn to ground with

low impedance, by comparing the OUTXn voltage to the LOD detection threshold voltage level set by LODVLT in

the FC register. If the OUTXn voltage is lower than the programmed voltage, the corresponding output LOD bit

will be set to '1' to indicate a opened LED. Otherwise, the output of that LOD bit is '0'. LOD data output by the

detect circuit are valid only during the ‘on’ period of that OUTXn output channel. LOD data are always ‘0’ for

outputs that are turned off.

9.3.6 Poker Mode

Poker Mode provides the TLC5957 with a flexible PWM bit, from 9 bit to 16 bit. Therefore, data length can be

reduced. In high multiplexing applications, Poker Mode can significantly increase visual refresh rate.

9.3.7 Internal Circuit for Caterpillar Removal

Caterpillar effect is a very common issue on LED panels. It is usually caused by an LED lamp open, LED lamp

leakage or LED lamp short. The TLC5957 implements an internal circuit that can eliminate the caterpillar issue

caused by LED open. This function can be enabled and disabled by LINERESET command. If the function is

enabled, the IC automatically detects the broken LED lamp, and the lamp will not light until IC reset.

9.3.8 Internal Pre-charge FET for Ghost Removal

The internal pre-charge FET can prevent ghosting of multiplexed LED modules. One cause of this phenomenon

is the charging current for parasitic capacitance of the OUTXn through the LED when the supply voltage switches

from one common line to the next common line.

To prevent this unwanted charging current, the TLC5957 uses an internal FET to pull OUTXn up to VCC-1.4V

during the common line switching period. Thus, no charging current flows through LED and the ghosting is

eliminated.

9.3.9 Thermal Shutdown (TSD)

The thermal shutdown (TSD) function turns off all IC constant-current outputs when the junction temperature (T_J)

exceeds 170°C (typ). It resumes normal operation when T_Jfalls below 160°C (typ).

TLC5957

ZHCSCX6 –OCTOBER 2014

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9.3.10 IREF Resistor Short Protection (ISP)

The Iref resistor short protection (ISP) function prevents unwanted large currents from flowing though the

constant-current output when the Iref resistor is shorted accidently. The TLC5957 turns off all output channels

when the Iref pin voltage is lower than 0.19V (typ). When the Iref pin voltage goes higher than 0.33V (typ), the

TLC5957 resumes normal operation.

9.3.11 Noise Reduction

Large surge currents may flow through the IC and the board on which the device is mounted if all 48 LED

channels turn on simultaneously at the 1^stGCLK rising edge. This large surge current could induce detrimental

noise and electromagnetic interference (EMI) into other circuits.

The TLC5957 separate the LED channels into 12 groups. Each group turns on sequentially with some delay

between one group and the next group. By this means, a soft-start feature is provided and the inrush current is

minimized.

TLC5957

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10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

10.1 Application Information

Send request via email for Application Note: Build High Density, High Refresh Rate, Multiplexing LED Panel with

TLC5957

11 Power Supply Recommendations

The V_CCpower supply voltage should be decoupled by placing a 0.1 µF ceramic capacitor close to VCC pin and

GND plane. Depending on panel size, several electrolytic capacitors must be placed on board equally distributed

to get a well regulated LED supply voltage (VLED). VLED voltage ripple should be less than 5% of its nominal

value. Furthermore, the VLED should be set to the voltage calculated by equation:

VLED > Vf + 0.4V (10mA constant current example)

(3)

Where: Vf = maximum forward voltage of LED

12 Layout

12.1 Layout Guidelines

1. Place the decoupling capacitor near the VCC pin and GND plane.

2. Place the current programming resistor Riref close to IREF pin and IREFGND pin.

3. Route the GND pattern as widely as possible for large GND currents. Maximum GND current is

approximately 1.2A

4. Routing between the LED cathode side and the device OUTXn pin should be as short and straight as

possible to reduce wire inductance.

5. The PowerPAD™ must be connected to GND plane because the pad is used as power ground pin internally,

there will be large current flow through this pad when all channels turn on. Furthermore, this pad should be

connected to a heat sink layer by thermal via to reduce device temperature. One suggested thermal via

pattern is shown as below. For more information about suggested thermal via pattern and via size, see "

PowerPAD Thermally Enhanced Package", SLMA002G.

TLC5957

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12.2 Layout Example

13 器件和文档支持

13.1 相关链接

以下表格列出了快速访问链接。范围包括技术文档、支持与社区资源、工具和软件，并且可以快速访问样片或购买

链接。

表 3. 相关链接

部件

产品文件夹

请单击此处

样片与购买

请单击此处

技术文档

工具与软件

请单击此处

支持与社区

请单击此处

TLC5957

请单击此处

13.2 商标

PowerPAD is a trademark of Texas Instruments.

13.3 静电放电警告

这些装置包含有限的内置 ESD 保护。存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损

伤。

13.4 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。

14 机械封装和可订购信息

以下页中包括机械封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对

本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。

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IMPORTANT NOTICE

邮寄地址：上海市浦东新区世纪大道1568 号，中建大厦32 楼邮政编码： 200122

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TLC5957RTQR

TLC5957RTQT

ACTIVE

QFN

RTQ

2000 RoHS & Green

250 RoHS & Green

NIPDAU

Level-3-260C-168 HR

-40 to 85

5957AB

NIPDAU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

Addendum-Page 2

GENERIC PACKAGE VIEW

RTQ 56

8 x 8, 0.5 mm pitch

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

Images above are just a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224653/A

www.ti.com

PACKAGE OUTLINE

VQFN - 1 mm max height

RTQ0056G

PLASTIC QUAD FLATPACK-NO LEAD

8.15

7.85

8.15

7.85

PIN 1 INDEX AREA

1 MAX

SEATING PLANE

0.08 C

0.05

0.00

5.6±0.1

(0.2) TYP

52X 0.5

6.5

SYMM

5.6±0.1

0.30

0.18

56X

PIN 1 ID

(OPTIONAL)

0.1

C A B

0.5

0.3

56X

SYMM

0.05

4225369 / A 10/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

VQFN - 1 mm max height

RTQ0056G

PLASTIC QUAD FLATPACK-NO LEAD

(0.78)

(5.6)

8X (1.33)

6X (1.22)

56X (0.6)

56X (0.24)

6X (1.22)

8X (1.33)

52X (0.5)

SYMM

(7.8)

(5.6)

(R0.05)

TYP

(Ø0.2) TYP

VIA

SYMM

LAND PATTERN EXAMPLE

SCALE: 10X

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4225369 / A 10/2019

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments

literature number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their

locations shown on this view. it is recommended thar vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

VQFN - 1 mm max height

RTQ0056G

PLASTIC QUAD FLATPACK-NO LEAD

(7.8)

8X (0.665)

8X (1.33)

56X (0.6)

56X (0.24)

8X (1.33)

52X (0.5)

SYMM

(7.8)

8X (0.665)

(R0.05) TYP

16X

(

1.13)

METAL

TYP

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD

66% PRINTED COVERAGE BY AREA

SCALE: 10X

4225369 / A 10/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations..

www.ti.com

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