TLIN1024ARGYRQ1 [TI]
具有显性状态超时的汽车类四路本地互连网络 (LIN) 收发器 | RGY | 24 | -40 to 125;型号: | TLIN1024ARGYRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有显性状态超时的汽车类四路本地互连网络 (LIN) 收发器 | RGY | 24 | -40 to 125 |
文件: | 总42页 (文件大小:2884K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TLIN1024A-Q1
ZHCSOZ3 –SEPTEMBER 2021
具有显性状态超时的TLIN1024A-Q1 四路本地互连网络(LIN) 收发器
1 特性
2 应用
• 符合面向汽车应用的AEC-Q100(1 级)标准
• 符合LIN 2.0、LIN 2.1、LIN 2.2、LIN 2.2 A 和
ISO/DIS 17987–4 电气物理层(EPL) 规格标准
• 符合SAE J2602-1 面向汽车应用的LIN 网络标准
• 提供功能安全
• 车身电子装置和照明
• 混合动力电动汽车和动力总成系统
• 信息娱乐系统与仪表组
• 电器
3 说明
– 可帮助进行功能安全系统设计的文档
• 支持12V 电池应用
TLIN1024A-Q1 是一款四路本地互连网络 (LIN) 物理层
收发器,集成了唤醒和保护功能,符合 LIN 2.0、LIN
2.1、LIN 2.2、LIN 2.2A 和 ISO/DIS 17987–4 标准。
LIN 是一根单线制双向总线,通常用于低速车载网络,
数据传输速率高达 20kbps。TLIN1024A-Q1 旨在为
12V 应用提供支持,具有更宽的工作电压范围和额外
的总线故障保护。
• LIN 传输数据速率高达20kbps
• LIN 接收数据速率高达100kbps
• 宽工作电源电压范围:4V 至36V
• 休眠模式:超低电流消耗允许以下类型的唤醒事
件:
– LIN 总线
TLIN1024A-Q1 接收器支持高达 100kbps 的数据速
率,从而更快速地执行内联编程。TLIN1024A-Q1 使用
一个可降低电磁辐射 (EME) 的限流波形整形驱动器将
TXD 输入上的 LIN 协议数据流转化为 LIN 总线信号。
接收器将数据流转化为逻辑电平信号,此信号通过开漏
RXD 引脚发送到微处理器。休眠模式可实现超低电流
消耗,该模式允许通过 LIN 总线或 EN 引脚实现唤
醒。
– 通过EN 引脚实现本地唤醒
• 集成45kΩLIN 上拉电阻器
• 在LIN 总线和RXD 输出上实现上电和断电无干扰
运行
• 保护特性:
– ±45V LIN 总线容错
– VSUP 欠压保护
– TXD 显性超时(DTO) 保护
– 热关断保护
器件信息
封装(1)
封装尺寸(标称值)
– 系统级未供电节点或接地断开失效防护。
• 3.5mm × 5.5mm VQFN 封装,提高了自动光学检测
(AOI) 能力
器件型号
TLIN1024A-Q1
VQFN (24)
3.50mm × 5.50mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
Node 1
Commander
Node 2
Node 3
Node n
MCU or DSP
MCU or DSP
MCU or DSP
MCU or DSP
LIN
LIN
LIN
LIN
Controller
Controller
Controller
Controller
TLIN1024A
TLIN1022A
TLIN1029A
TLIN1029A
LIN Bus
LIN Bus
LIN Bus
LIN Bus
12V - VBAT
简化版电路原理图
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLLSFF6
TLIN1024A-Q1
ZHCSOZ3 –SEPTEMBER 2021
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Table of Contents
9.2 Functional Block Diagram.........................................21
9.3 Feature Description...................................................21
9.4 Device Functional Modes..........................................25
10 Application and Implementation ...............................27
10.1 Application Information........................................... 27
10.2 Typical Application.................................................. 27
11 Power Supply Recommendations..............................29
12 Layout...........................................................................30
12.1 Layout Guidelines................................................... 30
12.2 Layout Example...................................................... 31
13 Device and Documentation Support..........................32
13.1 Documentation Support.......................................... 32
13.2 接收文档更新通知................................................... 32
13.3 支持资源..................................................................32
13.4 Trademarks.............................................................32
13.5 术语表..................................................................... 32
14 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 说明(续).........................................................................2
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings ....................................... 4
7.2 ESD Ratings .............................................................. 4
7.3 ESD Ratings - IEC ..................................................... 4
7.4 Thermal Information ...................................................4
7.5 Recommended Operating Conditions ........................5
7.6 Electrical Characteristics ............................................5
7.7 Duty Cycle Characteristics .........................................7
7.8 Switching Characteristics ...........................................9
7.9 Typical Characteristics..............................................10
8 Parameter Measurement Information..........................12
9 Detailed Description......................................................20
9.1 Overview...................................................................20
Information.................................................................... 33
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
September 2021
*
Initial release
5 说明(续)
TLIN1024A-Q1 集成了电阻器,可用于LIN 响应器节点应用并具有ESD 保护和故障保护功能,从而可减少应用中
的外部元件数量。一旦发生接地漂移或电源电压断开,该器件可防止反馈电流经LIN 流向电源输入。器件还包含
欠压保护、过热关断保护和接地失效保护功能。
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6 Pin Configuration and Functions
EN1
TXD1
RXD2
EN2
2
23
22
21
20
NC
LIN1
VSUP1
LIN2
3
4
5
Thermal
Pad
TXD2
RXD3
EN3
6
19
18
17
16
15
14
GND1
NC
7
8
LIN3
VSUP2
LIN4
GND2
TXD3
RXD4
EN4
9
10
11
图6-1. RGY Package, 24-Pin RGY (VQFN), Top View
表6-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
RXD1
EN1
NO.
1
O
Channel 1 RXD Output (open-drain) interface reporting state of LIN1 bus voltage
Channel 1 Enable Input
2
I
TXD1
RXD2
EN2
3
I
Channel 1 TXD input interface to control state of LIN1 output
Channel 2 RXD Output (open-drain) interface reporting state of LIN2 bus voltage
Channel 2 Enable Input
4
O
5
I
TXD2
RXD3
EN3
6
I
Channel 2 TXD input interface to control state of LIN2 output
Channel 3 RXD Output (open-drain) interface reporting state of LIN3 bus voltage
Channel 3 Enable Input
7
O
8
I
I
TXD3
RXD4
EN4
9
Channel 3 TXD input interface to control state of LIN3 output
Channel 4 RXD Output (open-drain) interface reporting state of LIN4 bus voltage
Channel 4 Enable Input
10
O
11
I
TXD4
GND2
LIN4
12
I
Channel 4 TXD input interface to control state of LIN4 output
Ground pin for Channels 3 and 4
14
GND
I/O
Supply
I/O
GND
I/O
Supply
I/O
–
15
Channel 4 LIN Bus single-wire transmitter and receiver
Channels 3 and 4 Supply Voltage (connected to battery in series with external reverse blocking diode)
Channel 3 LIN Bus single-wire transmitter and receiver
Ground pin for Channels 1 and 2
VSUP2
LIN3
16
17
GND1
LIN2
19
20
Channel 2 LIN Bus single-wire transmitter and receiver
Channels 1 and 2 Supply Voltage (connected to battery in series with external reverse blocking diode)
Channel 1 LIN Bus single-wire transmitter and receiver
Not Connected
VSUP1
LIN1
21
22
NC
13, 18, 23, 24
Thermal Pad
Can be connected to the PCB ground plane to improve thermal coupling
–
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7 Specifications
7.1 Absolute Maximum Ratings
(1) (2)
Symbol
Parameter
MIN
–0.3
–45
–0.3
MAX
45
45
6
UNIT
V
VSUP
VLIN
Supply voltage range (ISO/DIS 17987 Param 10)
LIN bus input voltage (ISO/DIS 17987 Param 82)
Logic pin voltage (RXD, TXD, EN)
Logic pin output current
V
VLOGIC
IO
V
8
mA
°C
TJ
Junction temperature range
150
–55
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to ground terminal.
7.2 ESD Ratings
ESD Ratings
VALUE
UNIT
Human body model (HBM) classification level 3A: TXD, RXD,
EN Pins, per AEC Q100-002(1)
±4000
Human body model (HBM) classification level 3B: LIN and VSUP
Pin with respect to ground
±8000
±1500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM)
classification level C5, per AEC All pins
Q100-011
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 ESD Ratings - IEC
ESD and Surge Protection Ratings
VALUE
UNIT
IEC 62228-2 per ISO 10605
Contact discharge
R = 330 Ω, C = 150 pF
Electrostatic discharge, LIN, VSUP to
GND(1)
V(ESD)
±8000
V
Pulse 1
Pulse 2
Pulse 3a
Pulse 3b
V
V
V
V
–100
75
ISO 7637-2 and IEC 62228-2 per IEC
62215-3 transients according to IBEE LIN
EMC test specifications (2) (LIN, VSUP to
GND )
VTRAN
–150
100
(1) Results given here are specific to the IEC 62228-2 Integrated circuits –EMC evaluation of transceivers –Part 2: LIN transceivers.
Testing performed by OEM approved independent 3rd party, EMC report available upon request.
(2) ISO 7637 is a system level transient test. Different system level configurations may lead to different results.
7.4 Thermal Information
TLIN1024A
THERMAL METRIC(1)
RGY (QFN)
24-PINS
34.3
UNIT
RΘJA
RΘJC(top)
RΘJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
30.8
13.3
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.5
13.3
ΨJB
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7.4 Thermal Information (continued)
TLIN1024A
RGY (QFN)
24-PINS
2.8
THERMAL METRIC(1)
UNIT
RΘJC(bot)
Junction-to-case (bottom) thermal resistance
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.5 Recommended Operating Conditions
parameters valid across -40℃≤TA ≤125℃(unless otherwise noted)
PARAMETER - DEFINITION
MIN
4
NOM
MAX
36
UNIT
V
VSUP1/2
VLINx
VLOGIC
TA
Supply voltage
LIN Bus input voltage
0
36
V
Logic Pin Voltage (RXDx, TXDx, ENx)
Ambient temperature range
Thermal shutdown rising threshold
Thermal shutdown hysteresis
0
5.25
125
V
-40
165
°C
°C
°C
TSD
TSD(HYS)
15
7.6 Electrical Characteristics
parameters valid across -40℃≤TA ≤125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
4
TYP
MAX UNIT
Power Supply
Device is operational beyond the LIN
defined nominal supply voltage; range
See Figure 8-1 and Figure 8-2
Operational supply voltage (ISO/DIS
17987 Param 10)
VSUP1/2
36
36
V
V
Normal and Standby Modes: ramp VSUP
while LIN signal is a 10 kHz square
wave with 50 % duty cycle and 36V
swing; See Figure 8-1 and Figure 8-2
Nominal supply voltage (ISO/DIS 17987
Param 10)
4
VSUP1/2
Sleep Mode
4
36
V
V
UVSUP
UVHYS
Under voltage VSUP threshold
2.9
3.85
Delta hysteresis voltage for VSUP under
voltage threshold
0.2
1.2
V
Normal Mode: EN = High, bus
dominant: total bus load where RLIN
500 Ωand CLIN < 10 nF
>
>
7.5
mA
ISUP
Supply current (6)
Standby Mode: EN = Low, bus
dominant: total bus load where RLIN
500 Ωand CLIN < 10 nF
1.1
3.75
mA
Normal Mode: EN = High, Bus
Recessive: LIN = VSUP
670
20
1300
40
µA
µA
µA
µA
Standby Mode: EN = Low, Bus
Recessive LIN = VSUP
ISUP
Supply current (6)
Sleep Mode: 4.0 V < VSUP < 14 V, LIN =
VSUP, EN = 0 V, TXD and RXD Floating
10
20
Sleep Mode: 14 V < VSUP < 36 V, LIN =
VSUP, EN = 0 V, TXD and RXD floating
30
RXDx OUTPUT PIN (OPEN DRAIN)
(4)
VOL
IOL
Output Low voltage
Based upon external pull up to VCC
0.6
5
V
Low level output current, open drain
Leakage current, high-level
LIN = 0 V, RXD = 0.4 V
LIN = VSUP, RXD = 5 V
1.5
mA
µA
IILG
0
–5
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MAX UNIT
7.6 Electrical Characteristics (continued)
parameters valid across -40℃≤TA ≤125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
TXDx INPUT PIN
VIL
VIH
Low level input voltage
High level input voltage
0.8
V
V
–0.3
2
5.25
Input threshold voltage, normal modes
& selective wake modes
VHYS
50
500
mV
IILG
Low level input leakage current
Internal pull-down resistor value
TXD = Low
0
5
µA
–5
RTXD
125
350
800
kΩ
ENx INPUT PIN
VIL
Low level input voltage
High level input voltage
Hysteresis voltage
0.8
5.25
500
5
V
V
–0.3
VIH
2
VHYS
IILG
By design and characterization
EN = Low
50
0
mV
µA
Low level input current
Internal Pulldown resistor
–5
REN
125
350
800
kΩ
LINx PIN
TXD = high, IO = 0 mA, 7 V ≤VSUP
36
V
≤
≤
LIN recessive high-level output voltage
VOH
0.85
VSUP
(3)
TXD = high, IO = 0 mA, 7 V ≤VSUP
18
V
LIN recessive high-level output voltage
VOH
0.8
3
VSUP
(1) (2)
LIN recessive high-level output voltage
TXD = high, IO = 0 mA, 4 V ≤
VSUP < 7 V
VOH
V
(3)
VOL
LIN dominant low-level output voltage (3)
0.2 VSUP
0.2 VSUP
TXD = low, 7 V ≤VSUP ≤36 V
TXD = low, 7 V ≤VSUP ≤18 V
TXD = low, 4 V ≤VSUP < 7 V
TXD & RXD open, LIN = 4 V to 45 V
LIN dominant low-level output voltage (1)
VOL
(2)
VOL
LIN dominant low-level output voltage (3)
1.2
45
V
V
VSUP where impact of recessive LIN bus
< 5% (ISO/DIS 17987 Param 11)
VSUP_NON_OP
–0.3
40
TXD = 0 V, VLIN = 18 V, VSUP = 18 V,
RMEAS = 440 Ω, VBUSDOM < 4.518 V
Limiting current (ISO/DIS 17987 Param
12)
IBUS_LIM
90
200
mA
mA
µA
Receiver leakage current, dominant
(ISO/DIS 17987 Param 13)
LIN = 0 V, VSUP = 12 V Driver off/
recessive; See Figure 8-6
IBUS_PAS_dom
IBUS_PAS_rec1
IBUS_PAS_rec2
IBUS_NO_GND
–1
Receiver leakage current, recessive
(ISO/DIS 17987 Param 14)
LIN > VSUP, 4 V ≤VSUP ≤36 V Driver
off; See Figure 8-7
20
5
Receiver leakage current, recessive
(ISO/DIS 17987 Param 14)
LIN = VSUP, Driver off; See Figure 8-7
µA
–5
–1
Leakage current, loss of ground
(ISO/DIS 17987 Param 15)
GNDDEVICE = VSUP, VSUP = 12 V, 0 V <
VLIN < 18 V
1
mA
VSUP = 8 V, GND = open, VSUP = 18 V,
GND = open
RCommander = 1 kΩ, CL = 1 nF
RResponder = 20 kΩ, CL = 1 nF
LIN = dominant
Ileak gnd(dom)
Leakage current, loss of ground (5)
Leakage current, loss of ground (5)
1
mA
–1
VSUP = 8 V, GND = open, VSUP = 18 V,
GND = open
RCommander = 1 kΩ, CL = 1 nF
RResponder = 20 kΩ, CL = 1 nF
LIN = recessive
Ileak gnd(rec)
-100
100
5
µA
µA
Leakage current, loss of supply
(ISO/DIS 17987 Param 16)
IBUS_NO_BAT
0 V ≤VLIN ≤36 V, VSUP = GND
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7.6 Electrical Characteristics (continued)
parameters valid across -40℃≤TA ≤125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
LIN dominant (including LIN dominant
for wake-up); See Figure 8-4 and Figure
8-3
Low level input voltage (ISO/DIS 17987
Param 17) (3)
VBUSdom
0.4 VSUP
High level input voltage (ISO/DIS 17987 LIN recessive; See Figure 8-4 and
VBUSrec
VIH
0.6
0.47
0.4
VSUP
0.6 VSUP
Param 18) (3)
Figure 8-3
LIN recessive high-level input voltage (1)
7 V ≤VSUP ≤18 V
(2)
LIN dominant low-level input voltage (1)
VIL
0.53 VSUP
0.525 VSUP
0.175 VSUP
0.175 VSUP
7 V ≤VSUP ≤18 V
(2)
Receiver center threshold (ISO/DIS
17987 Param 19)
VBUS_CNT = (VBUSdom + VBUSrec)/2 ; See
Figure 8-4 and Figure 8-3
VBUS_CNT
VHYS
0.475
0.5
Hysteresis voltage (ISO/DIS 17987
Param 20)
VHYS = (VBUSrec - VBUSdom) ; See Figure
8-4 and Figure 8-3
VHYS = VIH - VIL ; See Figure 8-4 and
Figure 8-3
VHYS
Hysteresis voltage (SAE J2602)
0.07
0.4
Serial diode LIN termination pullup path
(ISO/DIS 17987 Param 21)
VSERIAL_DIODE
0.7
45
1
V
ISERIAL_DIODE = 10 μA
Pullup resistor to VSUP (ISO/DIS 17987
Param 26)
RPU
Normal and Standby modes
20
60
kΩ
IRSLEEP
CLINPIN
Pullup current source to VSUP
Capacitance of the LIN pin
Sleep mode, VSUP = 14 V, LIN = GND
VSUP = 14 V
µA
pF
–20
–2
25
(1) SAE 2602 commander node load conditions: 5.5 nF/4 kΩand 899 pF/20 kΩ
(2) SAE 2602 responder node load conditions: 5.5 nF/875 Ωand 899 pF/900 Ω
(3) ISO 17987 bus load conditions (CLINBUS, RLINBUS) include 1 nF/1 kΩ; 6.8 nF/660 Ω; 10 nF/500 Ω.
(4) RXD uses open drain output structure therefore VOL level is based upon microcontroller supply voltage VCC
(5) Ileak gnd = (VBAT - VLIN)/RLoad
.
(6) Values are for each VSUP pin
7.7 Duty Cycle Characteristics
parameters valid across -40℃≤TA ≤125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
THREC(MAX) = 0.744 x VSUP THDOM(MAX)
= 0.581 x VSUP, VSUP = 7 V to 18 V, tBIT
= 50 µs (20 kbps), D1 = tBUS_rec(min)/(2 x
tBIT) (See Figure 8-10, Figure 8-11)
Duty Cycle 1 (ISO/DIS 17987 Param
27)(3)
D112V
0.396
THREC(MAX) = 0.625 x VSUP, THDOM(MAX)
= 0.581 x VSUP, VSUP = 4 V to 7 V, tBIT
50 µs (20 kbps), D1 = tBUS_rec(min)/(2 x
tBIT) (See Figure 8-10, Figure 8-11)
=
D112V
Duty Cycle 1 (3)
0.396
0.396
THREC(MAX) = 0.744 x VSUP
,
THDOM(MAX) = 0.581 x VSUP
,
D1
Duty Cycle 1 (1) (2)
VSUP = 7 V to 18 V, tBIT = 52 μs
D1 = tBUS_rec(min)/(2 x tBIT) (See Figure
8-10, Figure 8-11)
THREC(MIN) = 0.422 x VSUP, THDOM(MIN)
= 0.284 x VSUP, VSUP = 7 V to 18 V, tBIT
= 50 µs (20 kbps), D2 = tBUS_rec(MAX)/(2
x tBIT) (See Figure 8-10, Figure 8-11)
Duty Cycle 2 (ISO/DIS 17987 Param
28) (3)
D212V
0.581
0.581
THREC(MIN) = 0.546 x VSUP, THDOM(MIN)
= 0.4 x VSUP, VSUP = 4 V to 7 V, tBIT
=
D212V
Duty Cycle 2 (3)
50 µs (20 kbps), D2 = tBUS_rec(MAX)/(2 x
tBIT) (See Figure 8-10, Figure 8-11)
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7.7 Duty Cycle Characteristics (continued)
parameters valid across -40℃≤TA ≤125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
THREC(MIN) = 0.422 x VSUP
THDOM(MIN) = 0.284 x VSUP
VSUP = 7 V to 18 V, tBIT = 52 μs
D2 = tBUS_rec(MAX)/(2 x tBIT) (See Figure
8-10, Figure 8-11)
MIN
TYP
MAX UNIT
,
,
D2
Duty Cycle 2 (1) (2)
0.581
THREC(MAX) = 0.778 x VSUP, THDOM(MAX)
= 0.616 x VSUP, VSUP = 7 V to 18 V, tBIT
= 96 µs (10.4 kbps), D3 = tBUS_rec(min)/(2
x tBIT) (See Figure 8-10, Figure 8-11)
Duty Cycle 3 (ISO/DIS 17987 Param
29) (3)
D312V
0.417
0.417
THREC(MAX) = 0.645 x VSUP, THDOM(MAX)
= 0.616 x VSUP, VSUP = 4 V to 7 V, tBIT
=
D312V
Duty Cycle 3 (3)
96 µs (10.4 kbps), D3 = tBUS_rec(min)/(2 x
tBIT) (See Figure 8-10, Figure 8-11)
THREC(MAX) = 0.778 x VSUP
THDOM(MAX) = 0.616 x VSUP
VSUP = 7 V to 18 V, tBIT = 96 μs
D3 = tBUS_rec(min)/(2 x tBIT) (See Figure
8-10, Figure 8-11)
D3
Duty Cycle 3 (1) (2)
0.417
THREC(MIN) = 0.389 x VSUP, THDOM(MIN)
= 0.251 x VSUP, VSUP = 7 V to 18 V, tBIT
= 96 µs (10.4 kbps), D4 =
tBUS_rec(MAX)/(2 x tBIT) (See Figure 8-10,
Figure 8-11)
Duty Cycle 4 (ISO/DIS 17987 Param
30) (3)
D412V
D412V
D4
0.59
0.59
0.59
THREC(MIN) = 0.422 x VSUP, THDOM(MIN)
= 0.284 x VSUP, VSUP = 4 V to 7 V, tBIT
=
Duty Cycle 4 (3)
96 µs (10.4 kbps), D4 = tBUS_rec(MAX)/(2
x tBIT) (See Figure 8-10, Figure 8-11)
THREC(MIN) = 0.389 x VSUP
THDOM(MIN) = 0.251 x VSUP
VSUP = 7 V to 18 V, tBIT = 96 μs
D4 = tBUS_rec(MAX)/(2 x tBIT) (See Figure
8-10, Figure 8-11)
Duty Cycle 4 (1) (2)
THREC(MAX) = 0.665 x VSUP
THDOM(MAX) = 0.499 x VSUP
VSUP = 5.5 V to 7 V, tBIT = 52 μs
,
,
D1LB
D2LB
D3LB
D4LB
Duty cycle 1 at low battery (1) (2)
Duty cycle 2 at low battery (1) (2)
Duty cycle 3 at low battery (1) (2)
Duty cycle 4 at low battery (1) (2)
0.396
0.396
THREC(MAX) = 0.496 x VSUP
THDOM(MAX) = 0.361 x VSUP
VSUP = 6.1 V to 7 V, tBIT = 52 μs
0.581
0.581
THREC(MAX) = 0.665 x VSUP
,
THDOM(MAX) = 0.499 x VSUP
VSUP = 5.5 V to 7 V, tBIT = 96 μs
,
THREC(MAX) = 0.496 x VSUP
THDOM(MAX) = 0.361 x VSUP
VSUP = 6.1 V to 7 V, tBIT = 96 μs
THREC(MAX) = 0.744 x VSUP
,
Transmitter propagation delay timings
for the duty cycle (1) (2)
Recessive to dominant
THDOM(MAX) = 0.581 x VSUP
7 V ≤VSUP ≤18 V, tBIT = 52 μs
tREC(MAX)_D1 - tDOM(MIN)_D1
Tr-d max
Td-r max
Tr-d max
10.8
8.4
µs
µs
µs
THREC(MAX) = 0.422 x VSUP
,
Transmitter propagation delay timings
for the duty cycle (1) (2)
Dominant to recessive
THDOM(MAX) = 0.284 x VSUP
7 V ≤VSUP ≤18 V, tBIT = 52 μs
tDOM(MAX)_D2 - tREC(MIN)_D2
THREC(MAX) = 0.778 x VSUP
THDOM(MAX) = 0.616 x VSUP
7 V ≤VSUP ≤18 V, tBIT = 96 μs
tREC(MAX)_D3 - tDOM(MIN)_D3
Transmitter propagation delay timings
for the duty cycle (1) (2)
Recessive to dominant
15.9
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7.7 Duty Cycle Characteristics (continued)
parameters valid across -40℃≤TA ≤125℃(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
THREC(MIN) = 0.389 x VSUP
THDOM(MIN) = 0.251 x VSUP
7 V ≤VSUP ≤18 V, tBIT = 96 μs
tDOM(MAX)_D4 - tREC(MIN)_D4
Transmitter propagation delay timings
for the duty cycle (1) (2)
Dominant to recessive
Td-r max
17.28
10.8
8.4
µs
µs
µs
THREC(MAX) = 0.665 x VSUP
,
Low battery transmitter propagation
THDOM(MAX) = 0.499 x VSUP
5.5 V ≤VSUP ≤7 V, tBIT = 52 μs
tREC(MAX)_low - tDOM(MIN)_low
Tr-d max_low delay timings for the duty cycle (1) (2)
Recessive to dominant
THREC(MAX) = 0.496 x VSUP
THDOM(MAX) = 0.361 x VSUP
6.1 V ≤VSUP ≤7 V, tBIT = 52 μs
tDOM(MAX)_low - tREC(MIN)_low
Low battery transmitter propagation
Td-r max_low delay timings for the duty cycle (1) (2)
Dominant to recessive
(1) SAE 2602 commander node load conditions: 5.5 nF/4 kΩand 899 pF/20 kΩ
(2) SAE 2602 responder node load conditions: 5.5 nF/875 Ωand 899 pF/900 Ω
(3) ISO 17987 bus load conditions (CLINBUS, RLINBUS) include 1 nF/1 kΩ; 6.8 nF/660 Ω; 10 nF/500 Ω.
7.8 Switching Characteristics
parameters valid across -40℃≤TA ≤125℃(unless otherwise noted)
SYMBOL
DESCRIPTION
TEST CONDITIONS
MIN
NOM
MAX UNIT
Receiver rising propagation delay time
(ISO/DIS 17987 Param 31)
trx_pdr
6
6
µs
µs
RRXD = 2.4 kΩ, CRXD = 20 pF
(See Figure 8-12 and Figure 8-13 )
Receiver falling propagation delay time
(ISO/DIS 17987 Param 31)
trx_pdf
Rising edge with respect to falling edge,
Symmetry of receiver propagation delay (trx_sym = trx_pdf –trx_pdr), RRXD
time
=
2.4 kΩ, CRXD = 20 pF (See Figure 8-12
and Figure 8-13 )
trs_sym
2
µs
µs
–2
LIN wake-up time (Minimum dominant
time on LIN bus for wake-up)
See Figure 8-16, Figure 9-2, and Figure
9-3
tLINBUS
25
100
150
Time to clear false wake-up prevention
logic if LIN bus had a bus stuck
dominant fault (recessive time on LIN
bus to clear bus stuck dominant fault)
tCLEAR
See Figure 9-3
8
20
2
17
34
50
80
15
µs
ms
µs
tDST
Dominant state time out
Time to change from standby mode to
normal mode or normal mode to sleep
mode through EN pin; See Figure 8-14
and Figure 9-4
tMODE_CHANGE Mode change delay time
Time for normal mode to initialize and
data on RXD pin to be valid; See Figure
8-14
tNOMINT
Normal mode initialization time
Power up time
35
µs
Upon power up time it takes for valid
data on RXD
tPWR
1.5
ms
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7.9 Typical Characteristics
图7-1. VOH vs VSUP and Temperature
图7-2. VOL vs VSUP and Temperature
Representative of only one VSUP supply.
Normal Mode (Dominant)
Representative of only one VSUP supply.
Normal Mode (Recessive)
图7-3. Supply Current vs Voltage Supply Across
图7-4. Supply Current vs Voltage Supply Across
Temperature
Temperature
Representative of only one VSUP supply.
Standby Mode (Dominant)
Representative of only one VSUP supply.
Standby Mode (Recessive)
图7-5. Supply Current vs Voltage Supply and
图7-6. Supply Current vs Voltage Supply and
Temperature
Temperature
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Representative of only one VSUP supply.
Sleep Mode
图7-7. Supply Current vs Voltage Supply and Temperature
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8 Parameter Measurement Information
1,4,7,10
NC 13,18,23,24
16,21
RXD1/2/3/4
Power Supply
Resolution: 10mV/ 1mA
Accuracy: 0.2%
5 V
VSUP1/2
VPS
EN1/2/3/4
2,5,8,11
3,6,9,12
15,17,20,22
LIN1/2/3/4
Pulse Generator
tR/tF: Square Wave: < 20 ns
tR/tF: Triangle Wave: < 40ns
Frequency: 20 ppm
TXD1/2/3/4
14,19
GND1/2
Jitter: < 25 ns
Measurement Tools
O-scope:
DMM
图8-1. Test System: Operating Voltage Range with RX and TX Access
Delta t = + 5 µs (tBIT = 50 µs)
Trigger Point
RX
2 x tBIT = 100 µs (20 kBaud)
图8-2. RX Response: Operating Voltage Range
Period T = 1/f
Amplitude
(signal range)
LIN Bus Input
Frequency: f = 20 Hz
Symmetry: 50%
图8-3. LIN Bus Input Signal
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1,4,7,10
NC
RXD1/2/3/4
EN1/2/3/4
13,18,23,24
16,21
5 V
Power Supply
Resolution: 10mV/ 1mA
Accuracy: 0.2%
VSUP1/2
VPS
2,5,8,11
3,6,9,12
15,17,20,22
14,19
LIN1/2/3/4
GND1/2
Pulse Generator
tR/tF: Square Wave: < 20 ns
tR/tF: Triangle Wave: < 40ns
Frequency: 20 ppm
TXD1/2/3/4
Jitter: < 25 ns
Measurement Tools
O-scope:
DMM
图8-4. LIN Receiver Test with RX Access
13,18,23,24
1,4,7,10
NC
RXD1/2/3/4
EN1/2/3/4
5 V
Power Supply 1
Resolution: 10mV/ 1mA
Accuracy: 0.2%
16,21
VSUP1/2
VPS1
2,5,8,11
3,6,9,12
D
LIN1/2/3/4 15, 17, 20, 22
Power Supply 2
Resolution: 10mV/ 1mA
Accuracy: 0.2%
TXD1/2/3/4
14,19
VPS2
RBUS
GND1/2
Measurement Tools
O-scope:
DMM
图8-5. VSUP_NON_OP
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1,4,7,10
NC 13,18,23,24
16,21
RXD1/2/3/4
EN1/2/3/4
5V
Power Supply
Resolution: 10 mV / 1mA
VSUP1/2
Accuracy: 0.2%
VPS
2,5, 8,11
3,6,9,12
RMEAS = 499
15,17,20,22
14,19
LIN1/2/3/4
GND1/2
TXD1/2/3/4
Measurement Tools
O-scope:
DMM
图8-6. Test Circuit for IBUS_PAS_dom; TXD = Recessive State VBUS = 0 V
1,4,7,10
NC 13,18,23,24
RXD1/2/3/4
EN1/2/3/4
Power Supply
Resolution: 10 mV / 1mA
Accuracy: 0.2%
5V
VPS1
16,21
VSUP1/2
2,5, 8,11
3,6,9,12
Power Supply 2
Resolution: 10mV/ 1mA
Accuracy: 0.2%
1 k
15,17,20,22
14,19
LIN1/2/3/4
GND1/2
VPS2
TXD1/2/3/4
VPS2 2 V/s ramp
[8 V à 36 V]
V Drop across resistor
< 20 mV
Measurement Tools
O-scope:
DMM
图8-7. Test Circuit for IBUS_PAS_rec
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1,4,7,10
NC 13,18,23,24
16,21
RXD1/2/3/4
EN1/2/3/4
Power Supply
Resolution: 10 mV / 1mA
Accuracy: 0.2%
5V
VPS1
VSUP1/2
2,5, 8,11
3,6,9,12
Power Supply 2
Resolution: 10mV/ 1mA
Accuracy: 0.2%
15,17,20,22
14,19
1 kΩ
LIN1/2/3/4
GND1/2
VPS2
TXD1/2/3/4
VPS2 2 V/s ramp
[0 V → 36 V]
V Drop across resistor
< 1V
Measurement Tools
O-scope: DMM
图8-8. Test Circuit for IBUS_NO_GND Loss of GND
1,4,7,10
NC 13,18,23,24
RXD1/2/3/4
EN1/2/3/4
5V
16,21
VSUP1/2
2,5, 8,11
3,6,9,12
Power Supply 2
Resolution: 10mV/ 1mA
Accuracy: 0.2%
VPS
15,17,20,22
14,19
10 k
LIN1/2/3/4
GND1/2
TXD1/2/3/4
VPS2 2 V/s ramp
[0 V → 36 V]
V Drop across resistor
< 1V
Measurement Tools
O-scope: DMM
图8-9. Test Circuit for IBUS_NO_BAT Loss of Battery
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1,4,7,10
NC 13,18,23,24
16,21
RXD1/2/3/4
EN1/2/3/4
Power Supply
Resolution: 10 mV / 1mA
Accuracy: 0.2%
5V
VPS1
VSUP1/2
2,5, 8,11
3,6,9,12
RMEAS
Power Supply 2
Resolution: 10mV/ 1mA
Accuracy: 0.2%
15,17,20,22
14,19
LIN1/2/3/4
GND1/2
Pulse Generator
tR/tF: Square Wave: < 20 ns
tR/tF: Triangle Wave: < 40ns
Frequency: 20 ppm
VPS2
TXD1/2/3/4
Jitter: < 25 ns
Measurement Tools
O-scope:
DMM
图8-10. Test Circuit Slope Control and Duty Cycle
TBIT
D = 50%
TXD (Input)
D112: 0.744 * VSUP
D312: 0.778 * VSUP
THREC(MAX)
THDOM(MAX)
THREC(MIN)
THDOM(MIN)
Thresholds
RX Node 1
D112: 0.581 * VSUP
D312: 0.616 * VSUP
LIN Bus
Signal
D212: 0.422 * VSUP
D412: 0.389 * VSUP
VSUP
Thresholds
RX Node 2
D212: 0.284 * VSUP
D412: 0.251 * VSUP
tBUS_REC(MIN)
tBUS_DOM(MAX)
RXD: Node 1
D1 (20 kbps)
D3 (10.4 kbps)
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD: Node 2
D2 (20 kbps)
D4 (10.4 kbps)
图8-11. Definition of Bus Timing Parameters
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VCC
2.4 k
1,4,7,10
NC 13,18,23,24
16,21
RXD1/2/3/4
EN1/2/3/4
5 V
20 pF
Power Supply
Resolution: 10 mV / 1mA
Accuracy: 0.2%
VPS
VSUP1/2
2,5, 8,11
3,6,9,12
15,17,20,22
14,19
Pulse Generator
tR/tF: Square Wave: < 20 ns
tR/tF: Triangle Wave: < 40ns
Frequency: 20 ppm
LIN1/2/3/4
GND1/2
TXD1/2/3/4
Jitter: < 25 ns
Measurement Tools
O-scope: DMM
图8-12. Propagation Delay Test Circuit
D1: 0.744 * VSUP
D3: 0.778 * VSUP
THREC(MAX)
Thresholds
RX Node 1
D1: 0.581 * VSUP
D3: 0.616 * VSUP
THDOM(MAX)
THREC(MIN)
THDOM(MIN)
LIN Bus
Signal
D2: 0.422 * VSUP
D4: 0.389 * VSUP
VSUP
Thresholds
RX Node 2
D2: 0.284 * VSUP
D4: 0.251 * VSUP
RXD: Node 1
D1 (20 kbps)
D3 (10.4 kbps)
trx_pdr(1)
trx_pdf(1)
RXD: Node 2
D2 (20 kbps)
D4 (10.4 kbps)
trx_pdr(2)
trx_pdf(2)
图8-13. Propagation Delay
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Wake Event
tMODE_CHANGE
EN
tNOMINT
tMODE_CHANGE
Transition
Sleep
Standby
Transition
Normal
Normal
MODE
Indeterminate
Ignore
Mirrors
Bus
Wake Request
RXD = Low
RXD
Floating
Indeterminate Ignore
Mirrors Bus
图8-14. Mode Transitions
图8-15. Wake-Up Through EN
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0.6 x
VSUP
0.6 x
VSUP
LINx
0.4 x VSUP
VSUP
0.4 x
VSUP
t < tLINBUS
tLINBUS
TXDx
Weak Internal Pulldown
ENx
Floating
Sleep
RXDx
MODE
Standby
Normal
图8-16. Wake-Up Through LIN
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9 Detailed Description
9.1 Overview
The TLIN1024A-Q1 device is a Quad Local Interconnect Network (LIN) physical layer transceiver, compliant to
LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A and ISO/DIS 17987–4 standards, with integrated wake-up and protection
features. The device has two separate dual LIN transceiver blocks. VSUP1/2 provides power to the separate dual
transceiver blocks. The LIN bus is a single wire bidirectional bus typically used for low speed in-vehicle networks
using data rates up to 20 kbps. The device's LIN receivers work up to 100 kbps supporting in-line programming.
The LIN protocol output data stream on the TXD in converted by the device into LIN bus signal using a current-
limited wave shaping driver as outlined by the LIN physical layer specification. The receiver converts the data
stream to logic level signals that are sent to the microprocessor through the open-drain RXD pin. The LIN bus
has two states: dominant state (voltage near ground) and recessive state (voltage near battery). In the recessive
state, the LIN bus is pulled high by the internal pull-up resistor (45 kΩ) and a series diode. No external pull-up
components are required for responder node applications. Commander node applications require an external
pull-up resistor (1 kΩ) plus a series diode per the LIN specification.
The device is designed to support 12-V applications with a wide input voltage operating range and also supports
low-power sleep mode. The device also provides two methods to wake-up: EN pin and from the LIN bus.
The TLIN1024A-Q1 integrates ESD protection and fault protection which allow for a reduction in the required
external components in the applications. In the event of a ground shift or supply voltage disconnection, the
device prevents back-feed current through LIN to the supply input. The device also includes undervoltage
detection, temperature shutdown protection, and loss-of-ground protection.
VSUP1 and GND1 supplies transceivers 1 and 2 while VSUP2 and GND2 supplies transceiver 3 and 4. The device
is part of the LIN family that includes the TLIN1022A and TLIN1029A LIN transceivers.
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9.2 Functional Block Diagram
VSUP1
1
RXD1
VSUP1/2
Filter
Comp
GND1
Wake-Up
State &
EN1
2
Fault Detection
& Protection
22 LIN1
GND1
21 VSUP1
18 GND1
DR/
Slope
CTL
Dominant
TXD1
3
State
Timeout
GND1
GND1
GND1
RXD2
EN2
4
5
6
20 LIN2
Channel2issameasChannel1
TXD2
VSUP2
RXD3
7
8
VSUP2/2
Comp
GND2
Filter
Wake-Up
State &
EN3
Fault Detection
& Protection
LIN3
17
GND2
DR/
Slope
CTL
Dominant
TXD3
9
16 VSUP2
14
State
Timeout
GND2
GND2
GND2
GND2
RXD4 10
EN4 11
15 LIN4
Channel4issameasChannel3
12
TXD4
9.3 Feature Description
9.3.1 LIN (Local Interconnect Network) Bus
These high voltage input/output pins are single wire LIN bus transmitters and receivers. The LIN pins can survive
excessive DC and transient voltages up to 45 V. Reverse currents from the LIN pins to supply (VSUP1/2) are
minimized with blocking diodes, even in the event of a ground shift or loss of supply (VSUP1/2).
9.3.1.1 LIN Transmitter Characteristics
The transmitter has thresholds and AC parameters according to the LIN specification. The transmitter is a low
side transistor with and internal current limitation and thermal shutdown. During a thermal shutdown condition,
the transmitter is disabled to protect the device. There is an internal pull-up resistor with a serial diode structure
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to VSUP1/2, so no external pull-up components are required for the LIN responder node applications. An external
pull-up resistor and series diode to VSUP1/2 must be added when the device is used for a commander node
application.
9.3.1.2 LIN Receiver Characteristics
The receiver characteristic thresholds are proportional with the device supply pin according to the LIN
specification.
The receiver is capable of receiving higher data rates (> 100 kbps) than supported by LIN or SAE J2602
specifications. This allows the TLIN1024A-Q1 to be used for high speed downloads at the end-of-line production
or other applications. The actual data rate achievable depends on system time constants (bus capacitance and
pull-up resistance) and driver characteristics used in the system.
9.3.1.2.1 Termination
There is an internal pull-up resistor with a serial diode structure to VSUP1/2, so no external pull-up components
are required for the LIN responder node applications. An external pull-up resistor (1 kΩ) and a series diode to
VSUP1/2 must be added when the device is used for commander node applications as per the LIN specification.
图9-1 shows a commander node configuration and how the voltage levels are defined
Voltage drop across the
Simplified Transceiver
VLIN_Bus
diodes in the pullup path
RXD
VSUP1/2
VSUP
VSUP/2
VBattery
VSUP
VLIN_Recessive
Receiver
Filter
1 k
45 k
LIN 1/2/3/4
GND1/2
LIN
Bus
TXD
350 k
Transmitter
with slope control
VLIN_Dominant
t
图9-1. Commander Node Configuration with Voltage Levels
9.3.2 TXD (Transmit Input and Output)
TXD is the interface to the processor's LIN protocol controller or SCI/UART that is used to control the state of the
LIN output. When TXD is low the LIN output is dominant (near ground). When TXD is high the LIN output is
recessive (near VBattery). See 图 9-1. The TXD input structure is compatible with microprocessors with 3.3 V and
5 V I/O. TXD has an internal pull-down resistor. The LIN bus is protected from being stuck dominant through a
system failure driving TXD low through the dominant state timeout timer.
9.3.3 RXD (Receive Output)
RXD is the interface to the processor's LIN protocol controller or SCI/UART, which reports the state of the LIN
bus voltage. LIN recessive (near VBattery) is represented by a high level on the RXD and LIN dominant (near
ground) is represented by a low level on the RXD pin. The RXD output structure is an open-drain output stage.
This allows the device to be used with 3.3 V and 5 V I/O microprocessors. If the microprocessor’s RXD pin
does not have an integrated pull-up, an external pull-up resistor to the microprocessor I/O supply voltage is
required. In standby mode the RXD pin is driven low to indicate a wake-up request from the LIN bus.
9.3.4 VSUP1/2 (Supply Voltage)
VSUP1/2 are the power supply pins. VSUP1/2 is connected to the battery through and external reverse battery
blocking diode (See 图 9-1). If there is a loss of power at the ECU level, the device has extremely low leakage
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from the LIN pin, which does not load the bus down. This is optimal for LIN systems in which some of the nodes
are unpowered (ignition supplied) while the rest of the network remains powered (battery supplied).
9.3.5 GND1/2 (Ground)
GND1 and GND2 are the ground connections for LIN1/2 and LIN3/4 channels respectively. VSUP1 is referred to
GND1 and VSUP2 is referred to GND2. The device can operate with a ground shift as long as the ground shift
does not reduce VSUP1/2 below the minimum operating voltage. If there is a loss of ground at the ECU level, the
device has a low leakage from the LIN pin, which does not load the bus down. This is optimal for LIN systems in
which some of the nodes are unpowered (ignition supplied) while the rest of the network remains powered
(battery supplied).
9.3.6 EN (Enable Input)
EN1, EN2, EN3 and EN4 control the operational modes of the respective LIN channel. When EN1/EN2/EN3/EN4
is high, the LIN1/LIN2/LIN3/LIN4 channel is in normal operating mode allowing a transmission path from TXD to
LIN and from LIN to RXD. When either of the EN pins is low, the respective LIN channel is put into sleep mode
and there is no transmission path available. The device can enter normal mode only after wake-up. EN has an
internal pull-down resistor to ensure the device remains in low power mode even if EN floats.
9.3.7 Protection Features
The TLIN1024A-Q1 has several protection features.
9.3.8 TXD Dominant Time Out (DTO)
During normal mode, if TXD is inadvertently driven permanently low by a hardware or software application
failure, the LIN bus is protected by the dominant state timeout timer. This timer is triggered by a falling edge on
the TXD pin. If the low signal remains on TXD for longer than tDST, the transmitter is disabled, thus allowing the
LIN bus to return to recessive state and communication to resume on the bus. The protection is cleared and the
tDST timer is reset by a rising edge on TXD. The TXD pin has an internal pull-down to ensure the device fails to a
known state if TXD is disconnected. During this fault, the transceiver remains in normal mode (assuming no
change of state request on EN), the transmitter is disabled, the RXD pin reflects the LIN bus and the LIN bus
pull-up termination remains on.
9.3.9 Bus Stuck Dominant System Fault: False Wake-Up Lockout
The TLIN1024A-Q1 contains logic to detect bus stuck dominant system faults and prevents the device from
waking up falsely during the system fault. Upon entering sleep mode, the device detects the state of the LIN bus.
If the bus is dominant, the wake-up logic is locked out until a valid recessive on the bus “clears”the bus stuck
dominant, preventing excessive current use. Figure 9-2 and Figure 9-3 show the behavior of this protection.
RXDx
ENx
LINxBus
tLINBUS
< tLINBUS
< tLINBUS
图9-2. No Bus Fault: Entering Sleep Mode with Bus Recessive Condition and Wake-up
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RXDx
ENx
tLINBUS
tLINBUS
tLINBUS
LINxBus
tCLEAR
< tCLEAR
图9-3. Bus Fault: Entering Sleep Mode with Bus Stuck Dominant Fault, Clearing, and Wake-up
9.3.10 Thermal Shutdown
The LIN transmitter is protected by limiting the current; however if the junction temperature of the device
exceeds the thermal shutdown threshold, the device puts the LIN transmitter into the recessive state. Once the
over temperature fault condition has been removed and the junction temperature has cooled beyond the
hysteresis temperature, the transmitter is re-enabled, assuming the device remains in the normal operation
mode. During this fault, the transceiver remains in normal mode (assuming no change of state request on EN),
the transmitter is in recessive state, the RXD pin reflects the LIN bus and LIN bus pull-up termination remains
on.
9.3.11 Under Voltage on VSUP
The TLIN1024A-Q1 contains a power on reset circuit to avoid false bus messages during under voltage
conditions when VSUP1/2 is less than UVSUP1/2
.
9.3.12 Unpowered Device and LIN Bus
In automotive applications some LIN nodes in a system can be unpowered (ignition supplied) while others in the
network remains powered by the battery. The TLIN1024A-Q1 has a low unpowered leakage current from the bus
so an unpowered node does not affect the network or load it down.
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9.4 Device Functional Modes
The TLIN1024A-Q1 has three functional modes of operation, normal, sleep, and standby. The next sections
describe these modes as well as how the device moves between the different modes. 图 9-4 graphically shows
the relationship while 表9-1 shows the state of pins.
表9-1. Operating Modes
LIN BUS
TERMINATION
MODE
ENx
RXDx
TRANSMITTER
COMMENT
Weak Current Pull-
up
Sleep
Low
Floating
Off
Wake-up event detected, waiting on
MCU to set EN
Standby
Normal
Low
Low
Off
On
45 kΩ (typical)
45 kΩ (typical)
High
LINx Bus Data
LINx transmission up to 20 kbps
Unpowered System
VSUP < UVSUP
VSUP > UVSUP
EN = LOW
,
VSUP > UVSUP
EN = High
,
VSUP < UVSUP
VSUP < UVSUP
Standby Mode
Driver: Off
RXD: Low
LIN termination: 45 kΩ
VSUP < UVSUP
EN = High
Normal Mode
LIN bus wake-up
Sleep Mode
Driver: On
RXD: LIN Bus Data
LIN termination: 45 kΩ
Driver: Off
RXD: Floating
LIN termination: Weak pull-up
EN = Low
EN = High
图9-4. Operating State Diagram
9.4.1 Normal Mode
The EN pin controls the mode of the channel. If the EN1/EN2/EN3/EN4 pin is high at power up, the channel
powers up in normal mode. In normal operational mode, the receiver and transmitter are active and the LIN
transmission up to the LIN specified maximum of 20 kbps is supported. The receiver detects the data stream on
the LIN bus and outputs it on RXD for the LIN controller. A recessive signal on the LIN bus is a digital high and a
dominant signal on the LIN bus is a digital low. The driver transmits input data from TXD to the LIN bus. Normal
mode is entered as EN transitions high while the LIN channel is in sleep or standby mode for > tMODE_CHANGE
plus tNOMINT
.
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9.4.2 Sleep Mode
Sleep Mode is the power saving mode for the TLIN1024A-Q1. Even with extremely low current consumption in
this mode, the LIN channel can still wake-up from LIN bus through a wake-up signal or if EN is set high for >
tMODE_CHANGE. The LIN bus is filtered to prevent false wake-up events. The wake-up events must be active for
the respective time periods (tLINBUS).
The sleep mode is entered by setting EN low for longer than tMODE_CHANGE
.
While the device is in sleep mode, the following conditions exist.
• The LIN bus driver is disabled and the internal LIN bus termination is switched off (to minimize power loss if
LIN is short circuited to ground). However, the weak current pull-up is active to prevent false wake-up events
in case an external connection to the LIN bus is lost.
• The normal receiver is disabled.
• EN input and LIN wake-up receiver are active.
9.4.3 Standby Mode
If the device powers up with any of the ENx pins held low, the corresponding LINx channel is in standby mode.
Standby mode is also entered whenever a wake-up event occurs through the LIN bus while the device is in
sleep mode. The LIN bus responder termination circuit is turned on when standby mode is entered. Standby
mode is signaled through a low level on RXD. See Standby Mode Application Note for more application
information.
When EN is set high for longer than tMODE_CHANGE while the device is in standby mode the device returns to
normal mode and the normal transmission paths from TXD to LIN bus and LIN bus to RXD are enabled.
9.4.4 Wake-Up Events
There are two ways to wake-up from sleep mode:
• Remote wake-up initiated by the falling edge of a recessive (high) to dominant (low) state transition on LIN
bus where the dominant state is be held for tLINBUS filter time. After this tLINBUS filter time has been met and a
rising edge on the LIN bus going from dominant state to recessive state initiates a remote wake-up event,
eliminating false wake-ups from disturbances on the LIN bus or if the bus is shorted to ground.
• Local wake-up through EN being set high for longer than tMODE_CHANGE
.
9.4.4.1 Wake-Up Request (RXD)
When the TLIN1024A-Q1 encounters a wake-up event from the LIN bus, RXD goes low and the channel
transitions to standby mode until EN is reasserted high and the channel enters normal mode. Once the channel
enters normal mode the RXD pin releases the wake-up request signal and the RXD pin then reflects the receiver
output from the LIN bus.
9.4.4.2 Mode Transitions
When the TLIN1024A-Q1 is transitioning between modes the device needs the time, tMODE_CHANGE, to allow the
change to fully propagate from the EN pin through the device into the new state. When transitioning from sleep
or standby mode to normal mode the transition time is the sum of tMODE_CHANGE and tNOMINT
.
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10 Application and Implementation
Note
以下应用部分中的信息不属于TI 器件规格的范围,TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计,以确保系统功能。
10.1 Application Information
The TLIN1024A-Q1 can be used as both a responder device and a commander device in a LIN network. The
device comes with the ability to support both remote wake-up request and local wake-up request.
10.2 Typical Application
The device comes with an integrated 45 kΩ pull-up resistor and series diode for responder node applications.
For commander node applications, an external 1 kΩ pull-up resistor with series blocking diode can be used.
Figure 10-1 shows the device being used in both commander and responder applications.
VSUP
12 V - VBAT
VREG
VSUP
Commander
Node
Pullup
VDD
VDD
VSUP2
VSUP1
EN1
EN2
16 21
VDD
2
5
I/O
I/O
1 k
LIN1
MCU
VDD I/O
22
20
MCU w/o
pullup(2)
220 pF
LIN2
1
3
RXD1
TXD1
VDD I/O
MCU w/o
pullup(2)
220 pF
4
6
RXD2
TXD2
LIN Controller
Or
VDD I/O
TLIN1024A
SCI/UART(1)
MCU w/o
pullup(2)
LIN3
17
15
7
9
RXD3
TXD3
220 pF
VDD I/O
MCU w/o
pullup(2)
LIN4
10
12
RXD4
TXD4
220 pF
EN3
EN4
8
I/O
I/O
11
GND
14
19
(1) If RXD on MCU, or LIN transceiver, has an internal pull-up, then an external pull-up resistor is not required.
(2) If RXD on MCU, or LIN transceiver, does not have an internal pull-up, then an external pull-up resistor is required.
(3) Commander node applications require an external 1 k pull-up resistor and serial diode.
(4) Decoupling capacitor values are system dependent but usually have 100 nF, 1 µF and ≥10 µF
图10-1. Typical LIN Bus
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10.2.1 Design Requirements
The RXD output structure is an open-drain output stage. This allows the TLIN1024A-Q1 to be used with 3.3 V
and 5 V I/O microprocessors. If the RXD pin of the microprocessor does not have an integrated pull-up, an
external pull-up resistor to the microprocessor I/O supply voltage is required.
The VSUP1/2 pins of the device should be decoupled with a 100 nF capacitor as close to the supply pin on the
device as possible. The system should include additional decoupling on the VSUP line as needed per the
application requirements.
10.2.1.1 Detailed Design Procedures
10.2.1.2 Normal Mode Application Note
When using the TLIN1024A-Q1 in systems which are monitoring the RXD pin for a wake-up request, special
care should be taken during the mode transitions. The output of the RXD pin is indeterminate for the transition
period between states as the receivers are switched. The application software should not look for an edge on the
RXD pin indicating a wake-up request until tMODE_CHANGE when going from sleep or standby to normal mode.
This is shown in 图8-14
10.2.1.3 Standby Mode Application Note
If the TLIN1024A-Q1 detects an under voltage on VSUP1/2, the RXD pin transitions low and would signal to the
software that the device is in standby mode and should be returned to sleep mode for the lowest power state.
10.2.1.4 TXD Dominant State Timeout Application Note
The maximum dominant TXD time allowed by the TXD dominant state time out limits the minimum possible data
rate of the device. The LIN protocol has different constraints for commander and responder applications thus
there are different maximum consecutive dominant bits for each application case and thus different minimum
data rates.
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10.2.2 Application Curves
图 10-2 and 图 10-3 show the propagation delay from the TXD pin to the LIN pin for both dominant to recessive
and recessive to dominant edges. Waveforms are for 1 channel of the device configured in commander mode
with external pull-up resistor (1 kΩ) and 680 pF bus capacitance.
图10-2. Dominant to Recessive Propagation
图10-3. Recessive to Dominant Propagation
11 Power Supply Recommendations
The TLIN1024A-Q1 was designed to operate directly off a car battery, or any other DC supply ranging from 4 V
to 36 V. A 100 nF decoupling capacitor should be placed as close to the VSUP1/2 pin of the device as possible. It
is good practice for some applications with noisier supplies to include 1 µF and 10 µF decoupling capacitor.
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12 Layout
In order for the PCB design to be successful, start with the design of the protection and filtering circuitry.
Because ESD and EFT transients have a wide frequency bandwidth from approximately 3 MHz to 3 GHz, high
frequency layout techniques must be applied during PCB design. Placement at the connector also prevents
these noisy events from propagating further into the PCB and system.
12.1 Layout Guidelines
• Pins 1, 4, 7 and 10 (RXD1/2/3/4): The pins are open drain outputs and require an external pull-up resistor in
the range of 1 kΩ and 10 kΩ to function properly. If the microprocessor paired with the transceiver does not
have an integrated pull-up, an external resistor should be placed between RXD and the regulated voltage
supply for the microprocessor.
• Pins 2, 5, 8 and 11 (EN1/2/3/4): EN is an input pin that is used to place the device in a low power sleep
mode. If this feature is not used the pin should be pulled high to the regulated voltage supply of the
microprocessor through a series resistor, values between 1 kΩ and 10 kΩ. Additionally, a series resistor may
be placed on the pinto limit current on the digital lines in the case of an over voltage fault.
• Pin 13, 18, 23 and 24 (NC): Not Connected
• Pins 3, 6, 9 and 12 (TXD1/2/3/4): The TXD pins are the transmitter input signals to the device from the
microprocessor. A series resistor can be placed to limit the input current to the device in the case of an
overvoltage on this pin. A capacitor to ground can be placed close to the input pin of the device to filter noise.
• Pin 14, 19 (GND2/1): This is the ground connection for the device. This pin should be tied to the ground
plane through a short trace with the use of two vias to limit total return inductance.
• Pins 22, 20, 17 and 15 (LIN1/2/3/4): This pin connects to the LIN bus. For responder node applications a
220 pF capacitor to ground is implemented. For commander node applications and additional series resistor
and blocking diode should be placed between the LIN pin and the VSUP1/2 pin.
• Pin 21, 160 (VSUP1/2): This is the supply pin for the device. A 100 nF decoupling capacitor should be placed
as close to the device as possible.
Note
All ground and power connections should be made as short as possible and use at least two vias to
minimize the total loop inductance.
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12.2 Layout Example
VDD
RXD1
VSUP1
Onlyneededfor
theCommander
node
VDD
R3
EN1
NC
EN1
2
R2
23
GND
C1
R4
GND
TXD1
VDD
TXD1
LIN1
22
LIN1
3
VSUP1
RXD2
VSUP1
D1
RXD2
4
GND
21
C6
Onlyneededfor
theCommander
node
VDD
R7
R6
C2
R8
EN2
LIN2
LIN2
EN2
5
20
GND
TXD2
6
VSUP2
GND1
19
TXD2
GND
GND
Onlyneededfor
theCommander
node
Thermal Pad
RXD3
7
NC
RXD3
18
GND
VDD
R11
R10
EN3
LIN3
17
LIN3
EN3
8
VSUP2
C3
GND
TXD3
VSUP2
D5
TXD3
R12
9
GND
C9
16
Onlyneededfor
theCommander
node
RXD4
10
LIN4
15
LIN4
RXD4
VDD
R15
R14
EN4
GND2
EN4
11
14
GND
GND
C4
GND
TXD4
R16
图12-1. Layout Example
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13 Device and Documentation Support
13.1 Documentation Support
This device will conform to the following LIN standards. The core of what is needed is covered within this system
spec, however reference should be made to these standards and any discrepancies pointed out and discussed.
This document should provide all the basics of what is needed.
13.1.1 Related Documentation
For related documentation see the following:
LIN Standards:
• ISO/DIS 17987-1: Road vehicles -- Local Interconnect Network (LIN) -- Part 1: General information and use
case definition
• ISO/DIS 17987-4: Road vehicles -- Local Interconnect Network (LIN) -- Part 4: Electrical Physical Layer (EPL)
specification 12V/24V
• SAE J2602-1: LIN Network for Vehicle Applications
EMC requirements:
• SAE J2962-1
• ISO 10605: Road vehicles - Test methods for electrical disturbances from electrostatic discharge
• ISO 11452-4:2011: Road vehicles - Component test methods for electrical disturbances from narrowband
radiated electromagnetic energy - Part 4: Harness excitation methods
• ISO 7637-1:2015: Road vehicles - Electrical disturbances from conduction and coupling - Part 1: Definitions
and general considerations
• ISO 7637-3: Road vehicles - Electrical disturbances from conduction and coupling - Part 3: Electrical
transient transmission by capacitive and inductive coupling via lines other than supply lines
• IEC 62132-4:2006: Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4:
Direct RF power injection method
• IEC 6100-4-2
• IEC 61967-4
• CISPR25
Conformance Test requirements:
• ISO/DIS 17987-7: Road vehicles -- Local Interconnect Network (LIN) -- Part 7: Electrical Physical Layer (EPL)
conformance test specification
• SAE J2602-2: LIN Network for Vehicle Applications Conformance Test
13.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
13.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
13.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
13.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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重要声明和免责声明
TI 提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没
有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更,恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
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TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021,德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLIN1024ARGYRQ1
ACTIVE
VQFN
RGY
24
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
TL1024A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLIN1024ARGYRQ1
VQFN
RGY
24
3000
330.0
12.4
3.8
5.8
1.2
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
VQFN RGY 24
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
TLIN1024ARGYRQ1
3000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RGY 24
5.5 x 3.5 mm, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4203539-5/J
PACKAGE OUTLINE
VQFN - 1 mm max height
RGY0024E
PLASTIC QUAD FLATPACK-NO LEAD
A
3.6
3.4
B
0.1 MIN
PIN 1 INDEX AREA
5.6
5.4
(0.13)
SECTION A-A
TYPICAL
C
1 MAX
SEATING PLANE
0.08 C
0.05
0.00
2.1±0.1
2X 1.5
(0.2) TYP
12
13
18X 0.5
11
14
(0.16)
A
A
SYMM
25
2X
4.1±0.1
4.5
EXPOSED
THERMAL PAD
23
2
0.3
24X
0.2
24
1
PIN 1 ID
(OPTIONAL)
SYMM
24X
0.1
C A B
0.05
C
0.5
0.3
4225182/A 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
RGY0024E
PLASTIC QUAD FLATPACK-NO LEAD
(3.3)
(2.1)
2X (1.5)
24X (0.6)
24X (0.25)
1
24
2
23
18X (0.5)
(Ø0.2) VIA
TYP
SYMM
2X
25
(4.1)
(5.3)
(4.5)
(0.68)
(1.12)
11
14
(R0.05) TYP
13
12
(0.8)
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 15X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
EXPOSED METAL
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4225182/A 08/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
VQFN - 1 mm max height
RGY0024E
PLASTIC QUAD FLATPACK-NO LEAD
(3.3)
2X (1.5)
24X (0.6)
24X (0.25)
1
24
2
23
25
18X (0.5)
METAL
TYP
SYMM
2X
(5.3)
(4.5)
(1.36)
6X (1.16)
(R0.05) TYP
11
14
13
12
6X (0.94)
(0.57)
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
76% PRINTED COVERAGE BY AREA
SCALE: 15X
4225182/A 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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