TLV0832IPE4 [TI]

2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP8, GREEN, PLASTIC, DIP-8;
TLV0832IPE4
型号: TLV0832IPE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDIP8, GREEN, PLASTIC, DIP-8

光电二极管 转换器
文件: 总20页 (文件大小:685K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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ꢌꢁꢀ  
SLAS148 − SEPTEMBER 1996  
D
D
D
D
D
8-Bit Resolution  
2.7 V to 3.6 V V  
TLV0831 . . . D OR P PACKAGE  
(TOP VIEW)  
CC  
Easy Microprocessor Interface or  
Standalone Operation  
CS  
IN+  
V
CC  
CLK  
DO  
1
2
3
4
8
7
6
5
Operates Ratiometrically or With V  
Reference  
CC  
IN−  
GND  
REF  
Single Channel or Multiplexed Twin  
Channels With Single-Ended or Differential  
Input Options  
TLV0832 . . . D OR P PACKAGE  
(TOP VIEW)  
D
D
D
D
Input Range 0 V to V  
With V  
Reference  
CC  
CC  
Inputs and Outputs Are Compatible With  
TTL and MOS  
CS  
CH0  
CH1  
GND  
V
/REF  
CC  
1
2
3
4
8
7
6
5
CLK  
DO  
DI  
Conversion Time of 32 µs at  
f
= 250 kHz  
(CLK)  
Designed to Be Functionally Equivalent to  
the National Semiconductor ADC0831 and  
ADC0832 at 3 V Supply  
D
Total Unadjusted Error . . . 1 LSB  
description  
These devices are 8-bit successive-approximation analog-to-digital converters. The TLV0831 has single input  
channels; the TLV0832 has multiplexed twin input channels. The serial output is configured to interface with  
standard shift registers or microprocessors.  
The TLV0832 multiplexer is software configured for single-ended or differential inputs. The differential analog  
voltage input allows for common-mode rejection or offset of the analog zero input voltage value. In addition, the  
voltage reference input can be adjusted to allow encoding any smaller analog voltage span to the full 8 bits of  
resolution.  
The operation of the TLV0831 and TLV0832 devices is very similar to the more complex TLV0834 and TLV0838  
devices. Ratiometric conversion can be attained by setting the REF input equal to the maximum analog input  
signal value, which gives the highest possible conversion resolution. Typically, REF is set equal to V  
internally on the TLV0832).  
(done  
CC  
The TLV0831C and TLV0832C are characterized for operation from 0°C to 70°C. The TLV0831I and TLV0832I  
are characterized for operation from 40°C to 85°C.  
AVAILABLE OPTIONS  
PACKAGE  
T
A
SMALL OUTLINE  
(D)  
PLASTIC DIP  
(P)  
0°C to 70°C  
TLV0831CD  
TLV0831ID  
TLV0832CD  
TLV0832ID  
TLV0831CP  
TLV0831IP  
TLV0832CP  
TLV0832IP  
40°C to 85°C  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢀꢤ  
Copyright 1996, Texas Instruments Incorporated  
ꢠ ꢤ ꢡ ꢠꢙ ꢚꢮ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢩ  
1
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SLAS148 − SEPTEMBER 1996  
functional block diagram  
Start  
Flip-Flop  
CLK  
CS  
CLK  
Shift Register  
ODD/EVEN  
DI  
(TLV0832  
D
S
R
Start  
CLK  
only)  
To Internal  
Circuits  
CLK  
SGL/DIF  
S
R
CH0/IN+  
CH1/IN−  
Analog  
MUX  
Comparator  
Time  
Delay  
EN  
CS  
CS  
CS  
CS  
R
CS  
EN  
R
R
CLK  
EN  
CLK  
SAR  
Logic  
and  
DO  
Ladder  
and  
Decoder  
EOC  
REF  
9-Bit  
Shift  
Bits 0−7  
Bits 0−7  
D
(TLV0831  
only)  
Register  
Bit 1  
LSB  
Latch  
MSB  
First  
First  
One  
Shot  
2
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functional description  
The TLV0831 and TLV0832 use a sample-data-comparator structure that converts differential analog inputs by  
a successive-approximation routine. The input voltage to be converted is applied to an input terminal and is  
compared to ground (single ended), or to an adjacent input (differential). The TLV0832 input terminals can be  
assigned a positive (+) or negative (−) polarity. The TLV0831 contains only one differential input channel with  
fixed polarity assignment; therefore it does not require addressing. The signal can be applied differentially,  
between IN+ and IN−, to the TLV0831 or can be applied to IN+ with IN− grounded as a single ended input. When  
the signal input applied to the assigned positive terminal is less than the signal on the negative terminal, the  
converter output is all zeros.  
Channel selection and input configuration are under software control using a serial-data link from the controlling  
processor. A serial-communication format allows more functions to be included in a converter package with no  
increase in size. In addition, it eliminates the transmission of low-level analog signals by locating the converter  
at the analog sensor and communicating serially with the controlling processor. This process returns noise-free  
digital data to the processor.  
A conversion is initiated by setting CS low, which enables all logic circuits. CS must be held low for the complete  
conversion process. A clock input is then received from the processor. An interval of one clock period is  
automatically inserted to allow the selected multiplexed channel to settle. DO comes out of the high-impedance  
state and provides a leading low for one clock period of multiplexer settling time. The SAR comparator compares  
successive outputs from the resistive ladder with the incoming analog signal. The comparator output indicates  
whether the analog input is greater than or less than the resistive-ladder output. As the conversion proceeds,  
conversion data is simultaneously output from DO, with the most significant bit (MSB) first. After eight clock  
periods, the conversion is complete. When CS goes high, all internal registers are cleared. At this time, the  
output circuits go to the high-impedance state. If another conversion is desired, CS must make a high-to-low  
transition followed by address information.  
A TLV0832 input configuration is assigned during the multiplexer-addressing sequence. The multiplexer  
address shifts into the converter through the data input (DI) line. The multiplexer address selects the analog  
inputs to be enabled and determines whether the input is single ended or differential. When the input is  
differential, the polarity of the channel input is assigned. In addition to selecting the differential mode, the polarity  
may also be selected. Either channel of the channel pair may be designated as the negative or positive input.  
On each low-to-high transition of the clock input, the data on DI is clocked into the multiplexer-address shift  
register. The first logic high on the input is the start bit. A 2-bit assignment word follows the start bit on the  
TLV0832. On each successive low-to-high transition of the clock input, the start bit and assignment word are  
shifted through the shift register. When the start bit is shifted into the start location of the multiplexer register,  
the input channel is selected and conversion starts. The TLV0832 DI terminal to the multiplexer shift register  
is disabled for the duration of the conversion.  
The TLV0832 outputs the least-significant-bit (LSB) first data after the MSB-first data stream. The DI and DO  
terminals can be tied together and controlled by a bidirectional processor I/O bit received on a single wire. This  
is possible because DI is only examined during the multiplexer-addressing interval and DO is still in the  
high-impedance state.  
3
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ꢐꢋ  
SLAS148 − SEPTEMBER 1996  
sequence of operation  
TLV0831  
7
1
2
3
4
5
6
8
9
10  
CLK  
t
su  
t
conv  
CS  
MSB-First Data  
MUX  
Settling Time  
Hi-Z  
Hi-Z  
DO  
MSB  
7
LSB  
0
6
5
4
3
2
1
TLV0832  
1
2
3
4
5
6
10  
11  
12  
13  
14  
18  
19  
20  
21  
CLK  
CS  
t
conv  
t
su  
+Sign Bit  
Start  
Bit  
ODD  
SGL  
DI  
(TLV0832  
only)  
Don’t Care  
DIF EVEN  
MUX  
MSB-First Data  
LSB-First Data  
Settling Time  
Hi-Z  
MSB  
7
LSB  
0
MSB  
7
DO  
6
2
1
1
2
6
TLV0832 MUX-ADDRESS CONTROL LOGIC TABLE  
MUX ADDRESS  
ODD/EVEN  
CHANNEL NUMBER  
CH0  
CH1  
SGL/DIF  
+
+
+
L
L
H
H
L
H
L
+
H
H = high level, L = low level,  
− or + = terminal polarity for the selected input channel  
4
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SLAS148 − SEPTEMBER 1996  
absolute maximum ratings over recommended operating free-air temperature range (unless  
otherwise noted)  
Supply voltage, V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5 V  
CC  
Input voltage range, V : Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V  
+ 0.3 V  
+ 0.3 V  
I
CC  
CC  
Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V  
Input current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 mA  
I
Total input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
Operating free-air temperature range, T : C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
A
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: P package . . . . . . . . . . . . . . . . . . . . . 260°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: All voltage values, except differential voltages, are with respect to the network ground terminal.  
recommended operating conditions  
MIN NOM  
MAX  
UNIT  
V
Supply voltage, V  
CC  
(see clock operating conditions)  
2.7  
2
3.3  
3.6  
High-level input voltage, V  
IH  
V
Low-level input voltage, V  
IL  
0.8  
250  
600  
60%  
V
V
V
= 2.7 V  
= 3.3 V  
kHz  
kHz  
CC  
Clock frequency, f  
(CLK)  
10  
40%  
220  
350  
90  
CC  
Clock duty cycle (see Note 2)  
Pulse duration, CS high, t  
wH(CS)  
Setup time, CS low or TLV0832 data valid before CLK, t  
ns  
ns  
ns  
su  
Hold time, TLV0832 data valid after CLK, t  
h
C suffix  
0
70  
85  
Operating free-air temperature, T  
°C  
A
I suffix  
40  
NOTE 2: The clock-duty-cycle range ensures proper operation at all clock frequencies. When a clock frequency is used outside the  
recommended duty-cycle range, the minimum pulse duration (high or low) is 1 µs.  
5
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SLAS148 − SEPTEMBER 1996  
electrical characteristics over recommended range of operating free-air temperature, V  
(CLK)  
= 3.3 V,  
CC  
f
= 250 kHz (unless otherwise noted)  
digital section  
C SUFFIX  
I SUFFIX  
TEST CONDITIONS  
PARAMETER  
UNIT  
TYP  
TYP  
MIN  
2.8  
MAX  
MIN  
2.4  
MAX  
V
V
V
V
V
= 3 V,  
= 3 V,  
= 3 V,  
I
I
I
= 360 µA  
= 10 µA  
= 1.6 mA  
CC  
CC  
CC  
OH  
OH  
OL  
V
V
High-level output voltage  
V
OH  
2.9  
2.8  
Low-level output voltage  
High-level input current  
Low-level input current  
0.34  
1
0.4  
1
V
OL  
I
I
= 3.6 V  
= 0  
0.005  
0.005  
µA  
µA  
IH  
IH  
IL  
0.005  
−1  
0.005  
−1  
IL  
High-level output  
(source) current  
I
At V  
OH  
, DO= 0 V,  
T
= 25°C  
6.5  
8
15  
6.5  
8
15  
mA  
mA  
OH  
OL  
A
I
Low-level output (sink) current At V , DO= 0 V,  
OL  
T
A
= 25°C  
= 25°C  
= 25°C  
−16  
0.01  
0.01  
5
−16  
0.01  
0.01  
5
V
= 3.3 V,  
= 0,  
T
A
3
3
High-impedance-state output  
current (DO)  
O
O
I
µA  
OZ  
V
T
A
−3  
−3  
C
C
Input capacitance  
Output capacitance  
pF  
pF  
i
5
5
o
All parameters are measured under open-loop conditions with zero common-mode input voltage.  
All typical values are at V = 3.3 V, T = 25°C.  
CC  
A
analog and converter section  
TYP  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
0.05  
to  
V
IC  
Common-mode input voltage  
See Note 3  
V
V
+0.05  
CC  
On channel  
Off channel  
On channel  
Off channel  
V = 3.3 V  
1
−1  
−1  
1
I
V = 0  
I
I
Standby input current (see Note 4)  
Input resistance to REF  
µA  
kΩ  
I(stdby)  
V = 0  
I
V = 3.3 V  
I
r
1.3  
2.4  
5.9  
i(REF)  
All parameters are measured under open-loop conditions with zero common-mode input voltage.  
All typical values are at V = 3.3 V, T = 25°C.  
CC  
A
NOTES: 3. When channel IN− is more positive than channel IN+, the digital output code is 0000 0000. Connected to each analog input are two  
on-chip diodes that conduct forward current for analog input voltages one diode drop above V . Care must be taken during testing  
CC  
levels (3 V) because high-level analog input voltage (3.6 V) can, especially at high temperatures, cause the input diode  
to conduct and cause errors for analog inputs that are near full scale. As long as the analog voltage does not exceed the supply  
at low V  
CC  
voltage by more than 50 mV, the output code is correct. To achieve an absolute 0- to 3.3-V input range requires a minimum V  
3.25 V for all variations of temperature and load.  
of  
CC  
4. Standby input currents go in or out of the on or off channels when the A/D converter is not performing conversion and the clock is  
in a high or low steady-state conditions.  
total device  
PARAMETER  
MIN  
TYP  
MAX  
0.75  
2.5  
UNIT  
TLV0831  
TLV0832  
0.2  
1.5  
I
Supply current  
mA  
CC  
All typical values are at V  
CC  
= 3.3 V, T = 25°C.  
A
6
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SLAS148 − SEPTEMBER 1996  
operating characteristics V  
otherwise noted)  
= V = 3.3 V, f  
= 250 kHz, t = t = 20 ns, T = 25°C (unless  
CC  
ref  
(CLK) r f A  
PARAMETER  
Supply-voltage variation error  
MIN  
TYP  
MAX  
UNIT  
TEST CONDITIONS  
V
= 3 V to 3.6 V  
= 3.3 V,  
1/16  
1/4  
LSB  
CC  
V
T
ref  
A
Total unadjusted error (see Note 5)  
Common-mode error  
1
LSB  
LSB  
= MIN to MAX  
Differential mode  
1/16  
200  
1/4  
Propagation delay time,  
output data after CLK↑  
(see Note 6)  
MSB-first data  
LSB-first data  
500  
t
pd  
C
= 100 pF  
ns  
ns  
L
80  
80  
200  
C
C
= 10 pF,  
R = 10 kΩ  
125  
250  
L
L
L
t
t
Output disable time, DO after CS↑  
dis  
= 100 pF,  
R = 2 kΩ  
L
Conversion time (multiplexer-addressing  
time not included)  
clock  
periods  
8
conv  
All parameters are measured under open-loop conditions with zero common-mode input voltage. For conditions shown as MIN or MAX, use the  
appropriate value specified under recommended operating conditions.  
NOTES: 5. Total unadjusted error includes offset, full-scale, linearity, and multiplexer errors.  
6. The MSB-first data is output directly from the comparator and, therefore, requires additional delay to allow for comparator response  
time. LSB-first data applies only to TLV0832.  
7
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SLAS148 − SEPTEMBER 1996  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
CLK  
CS  
50%  
50%  
GND  
V
CC  
t
t
su  
su  
CLK  
DO  
50%  
V
CC  
GND  
t
pd  
0.4 V  
2 V  
GND  
V
V
OH  
t
t
h
h
50%  
V
CC  
OL  
2 V  
DI  
0.4 V  
0.4 V  
Figure 2. Data-Output Timing  
GND  
Figure 1. TLV0832 Data-Input Timing  
V
CC  
Test  
Point  
S1  
S2  
R
L
From Output  
Under Test  
C
L
(see Note A)  
LOAD CIRCUIT  
t
t
r
r
V
V
CC  
CC  
90%  
90%  
10%  
50%  
CS  
DO  
CS  
50%  
10%  
GND  
GND  
CC  
t
t
dis  
dis  
V
CC  
V
S1 closed  
S2 open  
90%  
S1 open  
S2 closed  
DO  
Output  
10%  
Output  
GND  
GND  
VOLTAGE WAVEFORMS  
NOTE A: C includes probe and jig capacitance.  
VOLTAGE WAVEFORMS  
L
Figure 3. Output Disable Time Test Circuit and Voltage Waveforms  
8
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SLAS148 − SEPTEMBER 1996  
TYPICAL CHARACTERISTICS  
UNADJUSTED OFFSET ERROR  
vs  
LINEARITY ERROR  
vs  
REFERENCE VOLTAGE  
REFERENCE VOLTAGE  
16  
14  
1.5  
V
= 3.3 V  
= 250 kHz  
CC  
V
I+  
= V = 0 V  
I−  
f
(CLK)  
= 25°C  
T
A
1.25  
12  
1.0  
10  
8
0.75  
6
4
0.5  
0.25  
2
0
0
0.01  
0.1  
1.0  
10  
0
1
2
3
4
V
ref  
− Reference Voltage − V  
V
ref −  
Reference Voltage − V  
Figure 4  
Figure 5  
LINEARITY ERROR  
vs  
LINEARITY ERROR  
vs  
FREE-AIR TEMPERATURE  
CLOCK FREQUENCY  
0.5  
0.45  
0.4  
2.0  
1.8  
1.6  
1.4  
1.2  
1
V
= 3.3 V  
= 3.3 V  
ref  
V
= 3.3 V  
= 250 kHz  
ref  
V
CC  
f
(CLK)  
85°C  
0.35  
0.3  
0.8  
0.6  
0.4  
25°C  
40°C  
0.2  
0
0.25  
50  
25  
0
25  
50  
75  
100  
0
100 200 300 400 500 600 700 800  
T
A
− Free-Air Tempertature − °C  
f
− Clock Frequency − kHz  
(CLK)  
Figure 6  
Figure 7  
9
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SLAS148 − SEPTEMBER 1996  
TYPICAL CHARACTERISTICS  
TLV0831  
TLV0831  
SUPPLY CURRENT  
vs  
SUPPLY CURRENT  
vs  
FREE-AIR TEMPERATURE  
CLOCK FREQUENCY  
0.3  
0.5  
0.4  
f
= 250 kHz  
V
T
A
= 3.3 V  
(CLK)  
CS = High  
CC  
= 25°C  
V
CC  
= 3.6 V  
V
= 3.3 V  
= 3 V  
0.3  
0.2  
CC  
0.2  
V
CC  
0.1  
0
0.1  
50  
25  
0
25  
50  
75  
100  
0
100  
200  
300  
400  
500  
T
A
− Free-Air Temperature — °C  
f
− Clock Frequency − kHz  
(CLK)  
Figure 8  
Figure 9  
OUTPUT CURRENT  
vs  
FREE-AIR TEMPERATURE  
16.5  
V
CC  
= 3.3 V  
16  
15.5  
15  
I
OL (DO = 3.3 V)  
−I  
OH (DO = 0 V)  
−I  
OH (DO = 2.4 V)  
14.5  
I
OL (DO = 0.4 V)  
14  
50  
25  
0
25  
50  
75  
100  
T
A
− Free-Air Temperature − °C  
Figure 10  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
ꢁꢂꢃ ꢄ ꢅ ꢊ ꢇ ꢈ ꢀꢁꢂ ꢃꢄ ꢅꢊ  
ꢌꢁꢀ  
ꢀꢎ  
SLAS148 − SEPTEMBER 1996  
TYPICAL CHARACTERISTICS  
1
0.5  
0
V
= 3.3 V  
ref  
= 25°C  
−0.5  
−1  
T
A
F
V
= 250 kHz  
(CLK)  
= 3.3 V  
DD  
0
32  
64  
96  
128  
160  
192  
224  
256  
Output Code  
Figure 11. Differential Nonlinearity With Output Code  
1
V
= 3.3 V  
ref  
= 25°C  
T
A
F
V
= 250 kHz  
0.5  
0
(CLK)  
= 3.3 V  
DD  
−0.5  
−1  
0
32  
64  
96  
128  
160  
192  
224  
256  
Output Code  
Figure 12. Integral Nonlinearity With Output Code  
1
V
= 3.3 V  
ref  
= 25°C  
T
A
0.5  
0
F
V
= 250 kHz  
(CLK)  
= 3.3 V  
DD  
−0.5  
−1  
0
32  
64  
96  
128  
160  
192  
224  
256  
Output Code  
Figure 13. Total Unadjusted Error With Output Code  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
PACKAGING INFORMATION  
Orderable Device  
TLV0831CD  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
V0831C  
TLV0831CDG4  
TLV0831CDR  
TLV0831CDRG4  
TLV0831CP  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
D
P
P
D
D
D
D
P
P
D
D
D
D
P
Green (RoHS  
& no Sb/Br)  
V0831C  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
V0831C  
Green (RoHS  
& no Sb/Br)  
V0831C  
Green (RoHS  
& no Sb/Br)  
TLV0831CP  
TLV0831CP  
V0831I  
TLV0831CPE4  
TLV0831ID  
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
75  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
TLV0831IDG4  
TLV0831IDR  
TLV0831IDRG4  
TLV0831IP  
75  
Green (RoHS  
& no Sb/Br)  
V0831I  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
V0831I  
Green (RoHS  
& no Sb/Br)  
V0831I  
Green (RoHS  
& no Sb/Br)  
TLV0831IP  
TLV0831IP  
V0832C  
TLV0831IPE4  
TLV0832CD  
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
75  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
TLV0832CDG4  
TLV0832CDR  
TLV0832CDRG4  
TLV0832CP  
75  
Green (RoHS  
& no Sb/Br)  
V0832C  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
V0832C  
Green (RoHS  
& no Sb/Br)  
V0832C  
Green (RoHS  
& no Sb/Br)  
TLV0832CP  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
TLV0832CPE4  
TLV0832ID  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
P
D
D
D
D
P
P
8
8
8
8
8
8
8
50  
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
N / A for Pkg Type  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
TLV0832CP  
Green (RoHS  
& no Sb/Br)  
V0832I  
TLV0832IDG4  
TLV0832IDR  
TLV0832IDRG4  
TLV0832IP  
75  
Green (RoHS  
& no Sb/Br)  
V0832I  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
V0832I  
Green (RoHS  
& no Sb/Br)  
V0832I  
Green (RoHS  
& no Sb/Br)  
TLV0832IP  
TLV0832IP  
TLV0832IPE4  
50  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Jan-2013  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TLV0831CDR  
TLV0831IDR  
TLV0832CDR  
TLV0832IDR  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
8
8
8
8
2500  
2500  
2500  
2500  
330.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
12.4  
6.4  
6.4  
6.4  
6.4  
5.2  
5.2  
5.2  
5.2  
2.1  
2.1  
2.1  
2.1  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TLV0831CDR  
TLV0831IDR  
TLV0832CDR  
TLV0832IDR  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
8
8
8
8
2500  
2500  
2500  
2500  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
35.0  
35.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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