TLV27L1CDBV [TI]

OP-AMP, 7000uV OFFSET-MAX, 0.16MHz BAND WIDTH, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN;


型号：	TLV27L1CDBV
厂家：	TEXAS INSTRUMENTS
描述：	OP-AMP, 7000uV OFFSET-MAX, 0.16MHz BAND WIDTH, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN 放大器光电二极管
文件：	总21页 (文件大小：789K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

FAMILY OF MICROPOWER RAIL-TO-RAIL OUTPUT

OPERATIONAL AMPLIFIERS

FEATURES

DESCRIPTION

BiMOS Rail-to-Rail Output

The TLV27Lx single supply operational amplifiers

Input Bias Current . . . 1 pA

provide rail-to-rail output capability. The TLV27Lx takes

the minimum operating supply voltage down to 2.7 V

over the extended industrial temperature range, while

adding the rail-to-rail output swing feature. The

TLV27Lx also provides 160-kHz bandwidth from only

7 μA. The maximum recommended supply voltage is

16 V, which allows the devices to be operated from

( 8-V supplies down to 1.35 V) two rechargeable cells.

High Wide Bandwidth . . . 160 kHz

High Slew Rate . . . 0.1 V/μs

Supply Current . . . 7 μA (per channel)

Input Noise Voltage . . . 89 nV/√Hz

Supply Voltage Range . . . 2.7 V to 16 V

Specified Temperature Range

− −40°C to 125°C . . . Industrial Grade

− 0°C to 70°C . . . Commercial Grade

Ultra-Small Packaging

− 5 Pin SOT-23 (TLV27L1)

The rail-to-rail outputs make the TLV27Lx good

upgrades for the TLC27Lx family—offering more

bandwidth at a lower quiescent current. The TLV27Lx

offset voltage is equal to that of the TLC27LxA variant.

Their cost effectiveness makes them a good alternative

to the TLC/V225x, where offset and noise are not of

premium importance.

APPLICATIONS

Portable Medical

The TLV27L1/2 are available in the commercial

temperature range to enable easy migration from the

equivalent TLC27Lx. The TLV27L1 is not available with

the power saving/performance boosting programmable

pin 8.

Power Monitoring

Low Power Security Detection Systems

Smoke Detectors

The TLV27L1 is available in the small SOT-23 package

—something the TLC27(L)1 was not—enabling

performance boosting in a smaller package. The

TLV27L2 is available in the 3mm x 5mm MSOP,

providing PCB area savings over the 8-pin SOIC and

8-pin TSSOP.

SELECTION GUIDE

[V]

I /ch

[μA]

[V]

[mV]

GBW

[MHz]

SLEW RATE

V , 1 kHz

[nV/√Hz]

ICR

DEVICE

[pA]

[V/μs]

TLV27Lx

TLV238x

TLC27Lx

OPAx349

OPAx347

TLC225x

2.7 to 16

4 to 16

−0.2 to V +1.2

0.18

0.06

0.03

0.02

0.01

0.02

−0.2 to V −0.2

4.5

−0.2 to V −1.5

10/5/2

0.085

0.070

0.35

1.8 to 5.5

2.3 to 5.5

2.7 to 16

−0.2 to V +0.2

300

−0.2 to V +0.2

62.5

0 to V −1.5

1.5/0.85

0.200

NOTE: All dc specs are maximums while ac specs are typicals.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

PACKAGE/ORDERING INFORMATION

SPECIFIED

PACKAGE

CODE

PRODUCT

PACKAGE

SYMBOL

TEMPERATURE

RANGE

ORDER NUMBER TRANSPORT MEDIA

TLV27L1CD

TLV27L1CDR

TLV27L1CDBVR

TLV27L1CDBVT

TLV27L1ID

Tube

TLV27L1CD

TLV27L1CDBV

TLV27L1ID

SOIC-8

SOT-23

SOIC-8

SOT-23

SOIC-8

27V1C

VBIC

Tape and Reel

0°C to 70°C

DBV

Tape and Reel

Tube

27V1I

VBII

TLV27L1IDR

TLV27L1IDBVR

TLV27L1IDBVT

TLV27L2CD

Tape and Reel

−40°C to 125°C

TLV27L1IDBV

TLV27L2CD

TLV27L2ID

DBV

Tape and Reel

Tube

27V2C

27V2I

0°C to 70°C

TLV27L2CDR

TLV27L2ID

Tape and Reel

Tube

−40°C to 125°C

TLV27L2IDR

Tape and Reel

absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†

Supply voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V

Input voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V

Output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

Differential input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V

Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table

Maximum junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C

Operating free-air temperature range, T : C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C

I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C

Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 125°C

stg

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: Relative to GND pin.

DISSIPATION RATING TABLE

PACKAGE

T ≤ 25°C

T = 85°C

(°C/W)

38.3

(°C/W)

POWER RATING POWER RATING

D (8)

176

710 mW

385 mW

425 mW

370 mW

201 mW

221 mW

DBV (5)

DBV (6)

324.1

294.3

recommended operating conditions

MIN

1.35

2.7

MAX

UNIT

Dual supply

Supply voltage, (V )

Single supply

Input common-mode voltage range

−0.2 V −1.2

C-suffix

I-suffix

Operating free-air temperature, T

°C

−40

125

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

electrical characteristics at recommended operating conditions, V_S= 2.7 V, 5 V, and 10 V (unless

otherwise noted)

dc performance

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

25°C

Full range

25°C

0.5

Input offset voltage

Offset voltage drift

= V /2,

= 50 Ω

R = 100 kΩ,

VIO

1.1

μV/°C

25°C

= 0 V to V −1.2 V,

= 50 Ω

CMRR Common-mode rejection ratio

Full range

25°C

100

= 2.7 V,

5 V

Full range

25°C

Large-signal differential voltage

amplification

=V /2,

O(PP)

R = 100 kΩ

5 V

Full range

†

Full range is −40°C to 125°C for I suffix.

input characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

≤25°C

≤70°C

≤125°C

≤25°C

≤70°C

≤125°C

25°C

100

1000

Input offset current

= V /2,

R = 100 kΩ,

= 50 Ω

200

1000

Input bias current

Differential input resistance

1000

GΩ

i(d)

Common-mode input capacitance

f = 1 kHz

25°C

power supply

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

25°C

Full range

25°C

Quiescent current (per channel)

= V /2

μA

= 2.7 V to 16 V,

No load,

PSRR

Power supply rejection ratio (ΔV /ΔV

)

= V /2 V

Full range

†

Full range is −40°C to 125°C for I suffix.

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

electrical characteristics at recommended operating conditions, V_S= 2.7 V, 5 V, and 5 V (unless

otherwise noted) (continued)

output characteristics

†

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

200

220

120

200

120

150

800

900

400

500

UNIT

25°C

Full range

25°C

160

= 2.7 V

= 5 V

= V /2,

= 100 μA

Full range

25°C

Output voltage swing from rail

5 V

Full range

25°C

420

200

400

= 5 V

Full range

25°C

= V /2,

= 500 μA

5 V

Full range

25°C

Output current

= 0.5 V from rail

= 2.7 V

μA

†

Full range is −40°C to 125°C for I suffix.

dynamic performance

PARAMETER

Gain bandwidth product

TEST CONDITIONS

MIN

TYP

160

0.06

0.05

0.8

MAX

UNIT

GBP

R = 100 kΩ, C = 10 pF, f = 1 kHz

25°C

kHz

= 1 V, R = 100 kΩ,

C = 50 pF

O(pp)

−40°C

125°C

25°C

Slew rate at unity gain

V/μs

Phase margin

R = 100 kΩ,

C = 50 pF

Rise

Fall

= 1 V, A = −1,

(STEP)pp

Settling time (0.1%)

25°C

μs

C = 50 pF,

R = 100 kΩ

noise/distortion performance

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

nV/√Hz

fA/√Hz

Equivalent input noise voltage

Equivalent input noise current

f = 1 kHz

25°C

0.6

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

TYPICAL CHARACTERISTICS

Table of Graphs

FIGURE

1, 2, 3

Input offset voltage

vs Common-mode input voltage

I /I

IB IO

Input bias and offset current

High-level output voltage

Low-level output voltage

vs Free-air temperature

vs High-level output current

vs Low-level output current

vs Supply voltage

5, 7, 9

6, 8, 10

Quiescent current

vs Free-air temperature

Supply voltage and supply current ramp up

Differential voltage gain and phase shift

Gain-bandwidth product

vs Frequency

GBP

vs Free-air temperature

vs Load capacitance

vs Frequency

Phase margin

CMRR Common-mode rejection ratio

PSRR

Power supply rejection ratio

Input referred noise voltage

Slew rate

vs Frequency

vs Free-air temperature

vs Frequency

O(PP)

Peak-to-peak output voltage

Inverting small-signal response

Inverting large-signal response

Crosstalk

vs Frequency

INPUT OFFSET VOLTAGE

COMMON-MODE INPUT VOLTAGE

2000

1500

1000

500

= 2.7 V

= 25°C

5 Vdc

= 2.7 V

= 25°C

1500

= 25°C

1000

500

1000

500

−500

−1000

−500

−1000

−1500

−2000

−1500

−2000

−1500

−2000

0.5

1.5

2.5

−5.2 −3.6

−2

−0.4

1.2

2.8

4.4

0.5

1.5

2.5

3.5

4.5

− Common-Mode Input Voltage − V

Figure 2

Figure 3

Figure 1

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

TYPICAL CHARACTERISTICS

INPUT BIAS AND INPUT

OFFSET CURRENT

HIGH-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT CURRENT

LOW-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT CURRENT

FREE-AIR TEMPERATURE

100

= 5 V

= 2.5

125°C

−40°C

0°C

25°C

70°C

25°C

−1

−2

−1

−2

−3

−4

−5

0°C

125°C

−40°C

−3

−4

−5

10 11 12 13 14 15

2 3 4 5 6 7 8 9 10 11 12 13 14 15

105

125

− High-Level Output Current − mA

− Low-Level Output Current − mA

− Free-Air Temperature − °C

Figure 4

Figure 5

Figure 6

HIGH-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT CURRENT

LOW-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT CURRENT

HIGH-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT CURRENT

2.7

2.4

2.1

1.8

1.5

1.2

0.9

0.6

= 2.7 V

V = 5 V

= 5 V

4.5

−40°C

125°C

70°C

−40°C

0°C

3.5

25°C

70°C

25°C

0°C

70°C

2.5

1.5

125°C

−40°C

0.3

0.5

0.2

0.4 0.6

0.8

1.2 1.4

0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

0.5

1.5

2.5

3.5

4.5

I − High-Level Output Current − mA

− Low-Level Output Current − mA

− High-Level Output Current − mA

Figure 7

Figure 8

Figure 9

QUIESCENT CURRENT

FREE-AIR TEMPERATURE

LOW-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT CURRENT

QUIESCENT CURRENT

SUPPLY VOLTAGE

2.7

16 V

10 V

= 2.7 V

125°C

70°C

2.4

2.1

1.8

1.5

1.2

5 V

125°C

70°C

2.7 V

25°C

0°C

−40°C

25°C

0°C

0.9

0.6

0.3

−40°C

−40 −25 −10

20 35 50 65 80 95 110 125

0.2

0.4

0.6

0.8

1.2

1.4

10 12 14

V − Supply Voltage − V

− Free-Air Temperature − °C

− Low-Level Output Current − mA

Figure 10

Figure 11

Figure 12

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

TYPICAL CHARACTERISTICS

DIFFERENTIAL VOLTAGE GAIN

AND PHASE SHIFT

SUPPLY VOLTAGE AND

FREQUENCY

SUPPLY CURRENT RAMP UP

120

100

= 5 V

= 100 kΩ

= 10 pF

= 25°C

0°

30°

= 0 to 15 V,

= 100 Ω,

= 10 pF,

= 25°C

60°

90°

120°

150°

180°

−20

0.1

100

1 k 10 k 100 k 1 M

t − Time − ms

f − Frequency − Hz

Figure 14

Figure 13

COMMON-MODE REJECTION RATIO

PHASE MARGIN

LOAD CAPACITANCE

GAIN-BANDWIDTH PRODUCT

FREE-AIR TEMPERATURE

FREQUENCY

120

170

160

= 5 V

= 100 kΩ

= 25°C

110

= 5 V

= 25°C

100

= 2.7 V

150

140

130

= 5 V

120

110

100

1 k

10 k

100 k

1 M

−40 −25 −10 5 20 35 50 65 80 95 110 125

100

1000

f − Frequency − Hz

− Load Capacitance − pF

− Free-Air Temperature − °C

Figure 15

Figure 16

Figure 17

SLEW RATE

FREE-AIR TEMPERATURE

POWER SUPPLY REJECTION RATIO

INPUT REFERRED NOISE VOLTAGE

FREQUENCY

0.09

0.08

0.07

0.06

0.05

100

250

200

150

100

= 5 V,

= 2.5 V

= 25°C

SR+

G = 2,

= 100 kΩ

SR−

0.04

0.03

0.02

V = 5 V

Gain = 1

= 1

= 100 kΩ

= 50 pF

0.01

−40 −25 −10 5 20 35 50 65 80 95 110 125

100

1 k

10 k

100 k

1 M

100

1 k

10 k

100 k

− Free-air Temperature − °C

f − Frequency − Hz

Figure 20

Figure 18

Figure 19

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

TYPICAL CHARACTERISTICS

PEAK-TO-PEAK OUTPUT VOLTAGE

INVERTING SMALL-SIGNAL

RESPONSE

FREQUENCY

V = 3 V

1.5

= 15 V

Gain = −1,

= 100 kΩ,

= 10 pF,

= 5 V,

0.5

= 100 kΩ,

= 10 pF,

−0.5

−1

= 3 V

THD+N <= 5%

f = 1 kHz

= 5 V

−1.5

−2

= 3 V

= 2.7 V

−100

100 200 300 400 500 600 700

100

1000

1 k

10 k

t − Time − μs

f − Frequency − Hz

Figure 22

Figure 21

CROSSTALK

FREQUENCY

INVERTING LARGE-SIGNAL

RESPONSE

0.06

0.04

0.02

= 5 V

= 2 kΩ

= 10 pF

= 25°C

−20

V = 100 mV

Gain = −1,

−40

−60

Channel 1 to 2

= 100 kΩ,

= 10 pF,

= 5 V,

= 100 mV

−80

f = 1 kHz

−0.02

−0.04

−0.06

−100

−120

−140

= 100 mV

−100

100 200 300 400 500 600 700

100

1 k

10 k

100 k

t − Time − μs

f − Frequency − Hz

Figure 23

Figure 24

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

APPLICATION INFORMATION

offset voltage

The output offset voltage (V ) is the sum of the input offset voltage (V ) and both input bias currents (I ) times the

corresponding gains. The following schematic and formula can be used to calculate the output offset voltage:

IB−

−

+ V

1 ) ǒ Ǔ " I

ǒ Ǔ ǒ Ǔ

IB)

IB–

IB+

Figure 25. Output Offset Voltage Model

general configurations

When receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. The

simplest way to accomplish this is to place an RC filter at the noninverting terminal of the amplifier (see Figure 26).

ǒ_{1 ) sR1C1}Ǔ

1 )

−

–3dB

2pR1C1

Figure 26. Single-Pole Low-Pass Filter

If even more attenuation is needed, a multiple pole filter is required. The Sallen-Key filter can be used for this task.

For best results, the amplifier should have a bandwidth that is 8 to 10 times the filter frequency bandwidth. Failure

to do this can result in phase shift of the amplifier.

R1 = R2 = R

C1 = C2 = C

Q = Peaking Factor

(Butterworth Q = 0.707)

–3dB

2pRC

2 −

)

(

Figure 27. 2-Pole Low-Pass Sallen-Key Filter

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

APPLICATION INFORMATION

circuit layout considerations

To achieve the levels of high performance of the TLV27Lx, follow proper printed-circuit board design techniques. A

general set of guidelines is given in the following.

Ground planes—It is highly recommended that a ground plane be used on the board to provide all

components with a low inductive ground connection. However, in the areas of the amplifier inputs and

output, the ground plane can be removed to minimize the stray capacitance.

Proper power supply decoupling—Use a 6.8-μF tantalum capacitor in parallel with a 0.1-μF ceramic

capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers

depending on the application, but a 0.1-μF ceramic capacitor should always be used on the supply terminal

of every amplifier. In addition, the 0.1-μF capacitor should be placed as close as possible to the supply

terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less

effective. The designer should strive for distances of less than 0.1 inches between the device power

terminals and the ceramic capacitors.

Sockets—Sockets can be used but are not recommended. The additional lead inductance in the socket pins

will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board

is the best implementation.

Short trace runs/compact part placements—Optimum high performance is achieved when stray series

inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,

thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of

the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at

the input of the amplifier.

Surface-mount passive components—Using surface-mount passive components is recommended for high

performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of

surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small

size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray

inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be

kept as short as possible.

www.ti.com

TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

APPLICATION INFORMATION

general power dissipation considerations

For a given θ , the maximum power dissipation is shown in Figure 28 and is calculated by the following formula:

–T

MAX

ǒ Ǔ

Where:

= Maximum power dissipation of TLV27Lx IC (watts)

= Absolute maximum junction temperature (150°C)

MAX

= Free-ambient air temperature (°C)

= θ + θ

= Thermal coefficient from junction to case

= Thermal coefficient from case to ambient air (°C/W)

MAXIMUM POWER DISSIPATION

FREE-AIR TEMPERATURE

= 150°C

PDIP Package

Low-K Test PCB

1.75

1.5

1.25

= 104°C/W

MSOP Package

Low-K Test PCB

SOIC Package

Low-K Test PCB

= 260°C/W

= 176°C/W

0.75

0.5

SOT-23 Package

Low-K Test PCB

0.25

= 324°C/W

−55−40 −25 −10

20 35 50 65 80 95 110 125

− Free-Air Temperature − °C

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 28. Maximum Power Dissipation vs Free-Air Temperature

TLV27L1

D PACKAGE

(TOP VIEW)

TLV27L2

D PACKAGE

(TOP VIEW)

TLV27L1

DBV PACKAGE

(TOP VIEW)

IN−

IN+

1OUT

1IN−

1IN+

GND

V_DD

OUT

GND

V_DD

OUT

2OUT

2IN−

2IN+

GND

IN−

IN+

NC − No internal connection

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

PACKAGING INFORMATION

Orderable Device

TLV27L1CD

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

ACTIVE

SOIC

SOT-23

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

27V1C

TLV27L1CDBVR

TLV27L1CDBVRG4

TLV27L1CDBVT

TLV27L1CDBVTG4

TLV27L1CDG4

TLV27L1ID

ACTIVE

DBV

3000

250

Green (RoHS

& no Sb/Br)

0 to 70

VBIC

27V1C

27V1I

VBII

Green (RoHS

& no Sb/Br)

0 to 70

Green (RoHS

& no Sb/Br)

0 to 70

Green (RoHS

& no Sb/Br)

0 to 70

Green (RoHS

& no Sb/Br)

0 to 70

SOIC

Green (RoHS

& no Sb/Br)

-40 to 125

TLV27L1IDBVR

TLV27L1IDBVRG4

TLV27L1IDBVT

TLV27L1IDBVTG4

TLV27L1IDG4

SOT-23

SOIC

DBV

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

VBII

Green (RoHS

& no Sb/Br)

VBII

Green (RoHS

& no Sb/Br)

VBII

Green (RoHS

& no Sb/Br)

27V1I

BAC

TLV27L1IDR

SOIC

2500

Green (RoHS

& no Sb/Br)

TLV27L1IDRG4

TLV27L2CDGK

TLV27L2CDGKG4

TLV27L2CDGKR

SOIC

Green (RoHS

& no Sb/Br)

VSSOP

DGK

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

BAC

2500

Green (RoHS

& no Sb/Br)

BAC

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

TLV27L2CDGKRG4

TLV27L2CDR

ACTIVE

VSSOP

SOIC

DGK

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BAC

ACTIVE

2500

Green (RoHS

& no Sb/Br)

0 to 70

27V2C

27V2I

BAD

TLV27L2CDRG4

TLV27L2ID

SOIC

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

-40 to 125

TLV27L2IDG4

TLV27L2IDGK

TLV27L2IDGKG4

TLV27L2IDGKR

TLV27L2IDGKRG4

TLV27L2IDR

SOIC

Green (RoHS

& no Sb/Br)

VSSOP

SOIC

DGK

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

BAD

2500

Green (RoHS

& no Sb/Br)

BAD

Green (RoHS

& no Sb/Br)

BAD

Green (RoHS

& no Sb/Br)

-40 to 125

27V2I

TLV27L2IDRG4

SOIC

Green (RoHS

& no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com

16-Aug-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TLV27L1CDBVR

TLV27L1CDBVT

TLV27L1IDBVR

TLV27L1IDBVT

TLV27L1IDR

SOT-23

SOIC

DBV

3000

250

180.0

330.0

9.0

3.15

6.4

3.2

5.2

3.4

5.2

3.4

5.2

1.4

2.1

1.4

2.1

1.4

2.1

4.0

8.0

3000

250

9.0

8.0

9.0

8.0

2500

12.4

12.0

TLV27L2CDGKR

TLV27L2CDR

VSSOP

SOIC

DGK

5.3

6.4

TLV27L2IDGKR

TLV27L2IDR

VSSOP

SOIC

DGK

5.3

6.4

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

16-Aug-2012

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TLV27L1CDBVR

TLV27L1CDBVT

TLV27L1IDBVR

TLV27L1IDBVT

TLV27L1IDR

SOT-23

SOIC

DBV

3000

250

182.0

340.5

358.0

364.0

340.5

358.0

364.0

340.5

182.0

338.1

335.0

364.0

338.1

335.0

364.0

338.1

20.0

20.6

35.0

27.0

20.6

35.0

27.0

20.6

3000

250

2500

TLV27L2CDGKR

TLV27L2CDR

VSSOP

SOIC

DGK

TLV27L2IDGKR

TLV27L2IDR

VSSOP

SOIC

DGK

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

Medical

Logic

Security

www.ti.com/security

Power Mgmt

Microcontrollers

RFID

power.ti.com

Space, Avionics and Defense

Video and Imaging

www.ti.com/space-avionics-defense

www.ti.com/video

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

OMAP Applications Processors

Wireless Connectivity

TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TLV27L1CDBV [TI]

相关型号：

TLV27L1CDBVR

TLV27L1CDBVT

TLV27L1CDR

TLV27L1CDRG4

TLV27L1ID

TLV27L1IDBV

TLV27L1IDBVR

TLV27L1IDBVRG4

TLV27L1IDBVT

TLV27L1IDBVTG4

TLV27L1IDR

TLV27L1IDRG4