TLV700XX-Q1 [TI]
汽车类 200mA、高 PSRR、低 IQ、低压降稳压器;
| 型号： | TLV700XX-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车类 200mA、高 PSRR、低 IQ、低压降稳压器 电源电路 线性稳压器IC |
| 文件： | 总14页 (文件大小：325K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLV70033-Q1
www.ti.com
SLVSA61 –FEBRUARY 2010
200-mA LOW-IQ LOW-DROPOUT REGULATOR FOR PORTABLE DEVICES
Check for Samples: TLV70033-Q1
1
FEATURES
APPLICATIONS
•
•
•
MP3 Players
23
•
Qualified for Automotive Applications
Very Low Dropout: 175 mV at 200 mA
2% Accuracy
ZigBee® Networks
Bluetooth® Devices
•
•
•
•
•
•
•
•
Low IQ: 31 mA
DDC PACKAGE
SOT23-5
(TOP VIEW)
Fixed-Output Voltage of 3.3 V
High PSRR: 68 dB at 1 kHz
Stable with Effective Capacitance of 0.1 mF
Thermal Shutdown and Overcurrent Protection
1
2
3
5
4
OUT
IN
GND
EN
Latch-Up Performance Meets 100 mA
Per AEC-Q100, Level I
N/C(1)
•
Available in the SOT23-5 (DDC) Package
DESCRIPTION
The TLV700xx series of low-dropout (LDO) linear regulators are low quiescent current devices with excellent line
and load transient performance. These LDOs are designed for power-sensitive applications. A precision bandgap
and error amplifier provides overall 2% accuracy. Low output noise, very high power-supply rejection ratio
(PSRR), and low dropout voltage make this series of devices ideal for most battery-operated handheld
equipment. All device versions have thermal shutdown and current limit for safety.
Furthermore, these devices are stable with an effective output capacitance of only 0.1 mF. This feature enables
the use of cost-effective capacitors that have higher bias voltages and temperature derating. The devices
regulate to specified accuracy with no output load.
The TLV700xx LDOs are available in the SOT23-5 (DDC) package.
VIN
VOUT
IN
OUT
1 mF
Ceramic
CIN
COUT
TLV700xx
On
EN
Off
GND
Typical Application Circuit (Fixed-Voltage Versions)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
Bluetooth is a registered trademark of Bluetooth SIG.
ZigBee is a registered trademark of ZigBee Alliance.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
TLV70033-Q1
SLVSA61 –FEBRUARY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TJ
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
OFL
–40°C to 125°C
SOT23 – DDC
Reel of 3000
TLV70033QDDCRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ABSOLUTE MAXIMUM RATINGS(1)
At TJ = –40°C to 125°C (unless otherwise noted). All voltages are with respect to GND.
VIN
Input voltage range
–0.3 V to 6 V
–0.3 V to 6 V
VEN
VOUT
IOUT
Enable voltage range
Output voltage range
–0.3 V to 6 V
Maximum output current
Output short-circuit duration
Total continuous power dissipation
Operating junction temperature range
Storage temperature range
Internally limited
Indefinite
PD
See Dissipation Ratings
–55°C to 150°C
–55°C to 150°C
TJ
TSTG
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
DISSIPATION RATINGS
DERATING FACTOR
BOARD
Low-K(1)
High-K(2)
PACKAGE
DDC
RqJC
RqJA
ABOVE TA = 25°C
T
A ≤ 25°C
TA = 70°C
200 mW
275 mW
TA = 85°C
145 mW
200 mW
90°C/W
90°C/W
280°C/W
200°C/W
3.6 mW/°C
360 mW
500 mW
DDC
5.0 mW/°C
(1) The JEDEC low-K (1s) board used to derive this data was a 3-inch × 3-inch, two-layer board with 2-ounce copper traces on top of the
board.
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3-inch × 3-inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on top and bottom of the board.
2
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
www.ti.com
SLVSA61 –FEBRUARY 2010
ELECTRICAL CHARACTERISTICS
VIN = VOUT(Typ) + 0.3 V or 2.0 V (whichever is greater); IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF, and TJ = –40°C to 125°C
(unless otherwise noted). Typical values are at TJ = 25°C.
space
TLV700xx
PARAMETER
TEST CONDITIONS
MIN
2.0
–2
TYP
MAX
5.5
+2
UNIT
V
VIN
Input voltage range
V
OUT ≥ 1 V
%
VOUT
DC output accuracy
Line regulation
–40°C ≤ TJ ≤ 125°C
VOUT < 1 V
–20
20
mV
VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.5 V,
IOUT = 10 mA
ΔVO/ΔVIN
1
5
mV
ΔVO/ΔIOUT
VDO
Load regulation
Dropout voltage(1)
0 mA ≤ IOUT ≤ 200 mA
1
175
350
31
15
250
550
55
mV
mV
mA
mA
VIN = 0.98 × VOUT(NOM), IOUT = 200 mA
VOUT = 0.9 × VOUT(NOM)
ICL
Output current limit
220
IOUT = 0 mA
IGND
Ground pin current
IOUT = 200 mA, VIN = VOUT + 0.5 V
270
1
mA
ISHDN
Ground pin current (shutdown)
Power-supply rejection ratio
VEN ≤ 0.4 V, 2.0 V ≤ VIN ≤ 4.5 V
2
mA
VIN = 2.3 V, VOUT = 1.8 V,
IOUT = 10 mA, f = 1 kHz
PSRR
68
dB
BW = 100 Hz to 100 kHz,
VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA
VN
Output noise voltage
48
mVRMS
tSTR
VEN(HI)
VEN(LO)
IEN
Startup time(2)
COUT = 1.0 mF, IOUT = 200 mA
100
ms
V
Enable pin high (enabled)
Enable pin low (disabled)
Enable pin current
0.9
0
VIN
0.4
0.5
V
VEN = 5.5 V , IOUT = 10 mA
VIN rising
0.04
1.9
mA
V
UVLO
Undervoltage lockout
Shutdown, temperature increasing
Reset, temperature decreasing
160
140
°C
°C
°C
TSD
TJ
Thermal shutdown temperature
Operating junction temperature
–40
125
(1) VDO is measured for devices with VOUT(NOM) ≥ 2.35 V.
(2) Startup time = time from EN assertion to 0.98 × VOUT(NOM)
.
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
SLVSA61 –FEBRUARY 2010
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
IN
OUT
Current
Limit
Thermal
Shutdown
UVLO
Bandgap
EN
LOGIC
TLV700xx Series
GND
PIN CONFIGURATIONS
DDC PACKAGE
SOT23-5
(TOP VIEW)
IN
GND
EN
1
2
3
5
4
OUT
N/C(1)
PIN DESCRIPTIONS
NAME
NO.
DESCRIPTION
Input pin. A small 1-mF ceramic capacitor is recommended from this pin to ground to assure stability and good
transient performance. See Input and Output Capacitor Requirements in the Application Information section for
more details.
IN
1
GND
EN
2
3
4
5
Ground pin
Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown
mode and reduces operating current to 1 mA, nominal.
NC
No connection. This pin can be tied to ground to improve thermal dissipation.
Regulated output voltage pin. A small 1-mF ceramic capacitor is needed from this pin to ground to assure stability.
See Input and Output Capacitor Requirements in the Application Information section for more details.
OUT
4
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
www.ti.com
SLVSA61 –FEBRUARY 2010
TYPICAL CHARACTERISTICS
TJ = –40°C to 125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V (whichever is greater); IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF (unless
otherwise noted). Typical values are at TJ = 25°C.
TLV70018
TLV70018
LINE REGULATION
LINE REGULATION
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
IOUT = 200 mA
IOUT = 10 mA
+125°C
+85°C
+25°C
-40°C
+125°C
+85°C
+25°C
-40°C
2.1
2.6
3.1
3.6
4.1
4.6
5.1
5.6
2.1
2.6
3.1
3.6
4.1
4.6
5.1
5.6
Input Voltage (V)
Input Voltage (V)
Figure 1.
Figure 2.
TLV70018
TLV70048
LOAD REGULATION
DROPOUT VOLTAGE vs INPUT VOLTAGE
250
200
150
100
50
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
IOUT = 200 mA
+125°C
+85°C
+25°C
-40°C
+125°C
+85°C
+25°C
-40°C
0
2.25
2.75
3.25
3.75
4.25
4.75
0
20
40
60
80 100 120 140 160 180 200
Output Current (mA)
Input Voltage (V)
Figure 3.
Figure 4.
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
SLVSA61 –FEBRUARY 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TJ = –40°C to 125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V (whichever is greater); IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF (unless
otherwise noted). Typical values are at TJ = 25°C.
TLV70048
TLV70018
DROPOUT VOLTAGE vs OUTPUT CURRENT
OUTPUT VOLTAGE vs TEMPERATURE
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
180
160
140
120
100
80
60
+125°C
IOUT = 200 mA
40
+85°C
+25°C
-40°C
IOUT = 10 mA
IOUT = 150 mA
20
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
0
30
60
90
120
150
180
210
Temperature (°C)
Output Current (mA)
Figure 5.
Figure 6.
TLV70018
TLV70018
GROUND PIN CURRENT vs INPUT VOLTAGE
GROUND PIN CURRENT vs LOAD
300
250
200
150
100
50
50
45
40
35
30
25
20
15
10
5
IOUT = 0 mA
+125°C
+125°C
+85°C
+25°C
-40°C
+85°C
+25°C
-40°C
0
0
0
20
40
60
80 100 120 140 160 180 200
Output Current (mA)
2.1
2.6
3.1
3.6
4.1
4.6
5.1
5.6
Input Voltage (V)
Figure 7.
Figure 8.
6
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
www.ti.com
SLVSA61 –FEBRUARY 2010
TYPICAL CHARACTERISTICS (continued)
TJ = –40°C to 125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V (whichever is greater); IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF (unless
otherwise noted). Typical values are at TJ = 25°C.
TLV70018
TLV70018
GROUND PIN CURRENT vs TEMPERATURE
SHUTDOWN CURRENT vs INPUT VOLTAGE
40
35
30
25
20
15
10
5
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
+125°C
+85°C
+25°C
IOUT = 0 mA
20 35 50 65 80 95 110 125
0
-40 -25 -10
5
2.1
2.6
3.1
3.6
4.1
4.6
5.1
5.6
Temperature (°C)
Input Voltage (V)
Figure 9.
Figure 10.
TLV70018
TLV70018
CURRENT LIMIT vs INPUT VOLTAGE
POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
440
430
420
410
400
390
380
370
360
350
100
IOUT = 10 mA
90
80
IOUT = 150 mA
70
60
50
40
30
20
10
TA = +25°C
4.0
4..5
VIN - VOUT = 0.5 V
0
2.0
2.5
3.0
3.5
10
100
1 k
10 k
100 k
1 M
10 M
Input Voltage (V)
Frequency (Hz)
Figure 11.
Figure 12.
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
SLVSA61 –FEBRUARY 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TJ = –40°C to 125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V (whichever is greater); IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF (unless
otherwise noted). Typical values are at TJ = 25°C.
TLV70018
TLV70018
POWER-SUPPLY RIPPLE REJECTION vs INPUT VOLTAGE
OUTPUT SPECTRAL NOISE DENSITY vs OUTPUT VOLTAGE
10
80
1 kHz
70
1
60
10 kHz
50
100 kHz
40
0.1
30
20
10
0
0.01
IOUT = 10 mA
CIN = COUT = 1 mF
0
10
100
1 k
10 k
100 k
1 M
10 M
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Frequency (Hz)
Input Voltage (V)
Figure 13.
Figure 14.
TLV70018
TLV70018
LOAD TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
tR = tF = 1 ms
tR = tF = 1 ms
200 mA
10 mA
0 mA
IOUT
IOUT
0 mA
VOUT
VOUT
VIN = 2.3 V
VIN = 2.1 V
10 ms/div
10 ms/div
Figure 15.
Figure 16.
TLV70018
TLV70018
LOAD TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
Slew Rate = 1 V/ms
tR = tF = 1 ms
IOUT
50 mA
VIN
2.9 V
0 mA
2.3 V
VOUT
VOUT
IOUT = 200 mA
VIN = 2.3 V
1 ms/div
10 ms/div
Figure 17.
Figure 18.
8
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
www.ti.com
SLVSA61 –FEBRUARY 2010
TYPICAL CHARACTERISTICS (continued)
TJ = –40°C to 125°C, VIN = VOUT(TYP) + 0.5 V or 2.0 V (whichever is greater); IOUT = 10 mA, VEN = VIN, COUT = 1.0 mF (unless
otherwise noted). Typical values are at TJ = 25°C.
TLV70018
TLV70018
LINE TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
Slew Rate = 1 V/ms
Slew Rate = 1 V/ms
VIN
2.7 V
VIN
5.5 V
2.3 V
2.1 V
VOUT
VOUT
IOUT = 1 mA
IOUT = 200 mA
1 ms/div
1 ms/div
Figure 19.
Figure 20.
TLV70018
VIN RAMP UP, RAMP DOWN RESPONSE
IOUT = 1 mA
VIN
VOUT
200 ms/div
Figure 21.
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
SLVSA61 –FEBRUARY 2010
www.ti.com
APPLICATION INFORMATION
The TLV700xx belongs to a new family of next-generation value LDO regulators. It consumes low quiescent
current and delivers excellent line and load transient performance. These characteristics, combined with low
noise, very good PSRR with little (VIN – VOUT) headroom, make this device ideal for RF portable applications.
This family of regulators offers sub-bandgap output voltages down to 0.7 V, current limit, and thermal protection,
and is specified from –40°C to 125°C.
Input and Output Capacitor Requirements
1.0-mF X5R- and X7R-type ceramic capacitors are recommended because these capacitors have minimal
variation in value and equivalent series resistance (ESR) over temperature.
However, the TLV700xx is designed to be stable with an effective capacitance of 0.1 mF or larger at the output.
Thus, the device is stable with capacitors of other dielectric types as well, as long as the effective capacitance
under operating bias voltage and temperature is greater than 0.1 mF. This effective capacitance refers to the
capacitance that the LDO sees under operating bias voltage and temperature conditions; that is, the capacitance
after taking both bias voltage and temperature derating into consideration. In addition to allowing the use of
cheaper dielectrics, this capability of being stable with 0.1-mF effective capacitance also enables the use of
smaller footprint capacitors that have higher derating in size- and space-constrained applications.
Note that using a 0.1-mF rated capacitor at the output of the LDO does not ensure stability because the effective
capacitance under the specified operating conditions would be less than 0.1 mF. Maximum ESR should be less
than 200 mΩ.
Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1-mF to
1.0-mF, low ESR capacitor across the IN pin and GND in of the regulator. This capacitor counteracts reactive
input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor
may be necessary if large, fast rise-time load transients are anticipated, or if the device is not located close to the
power source. If source impedance is more than 2 Ω, a 0.1-mF input capacitor may be necessary to ensure
stability.
Board Layout Recommendations to Improve PSRR and Noise Performance
Input and output capacitors should be placed as close to the device pins as possible. To improve ac performance
such as PSRR, output noise, and transient response, it is recommended that the board be designed with
separate ground planes for VIN and VOUT, with the ground plane connected only at the GND pin of the device. In
addition, the ground connection for the output capacitor should be connected directly to the GND pin of the
device. High ESR capacitors may degrade PSRR performance.
Internal Current Limit
The TLV700xx internal current limit helps to protect the regulator during fault conditions. During current limit, the
output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the
output voltage is not regulated, and is VOUT = ILIMIT × RLOAD. The PMOS pass transistor dissipates (VIN – VOUT) ×
ILIMIT until thermal shutdown is triggered and the device turns off. As the device cools down, it is turned on by the
internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and
thermal shutdown. See the Thermal Information section for more details.
The PMOS pass element in the TLV700xx has a built-in body diode that conducts current when the voltage at
OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is
anticipated, external limiting to 5% of the rated output current is recommended.
Shutdown
The enable pin (EN) is active high and is compatible with standard and low-voltage, TTL-CMOS levels. When
shutdown capability is not required, EN can be connected to the IN pin.
10
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TLV70033-Q1
TLV70033-Q1
www.ti.com
SLVSA61 –FEBRUARY 2010
Dropout Voltage
The TLV700xx uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout
voltage (VDO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the
RDS(ON) of the PMOS pass element. VDO scales approximately with output current because the PMOS device
behaves as a resistor in dropout.
As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout.
This effect is shown in Figure 13 in the Typical Characteristics section.
Transient Response
As with any regulator, increasing the size of the output capacitor reduces over-/undershoot magnitude but
increases the duration of the transient response.
Undervoltage Lockout (UVLO)
The TLV700xx uses an undervoltage lockout circuit to keep the output shut off until internal circuitry is operating
properly.
Thermal Information
Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the
device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a
result of overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least 35°C above the maximum expected ambient condition of the particular application. This
configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature
and worst-case load.
The internal protection circuitry of the TLV700xx has been designed to protect against overload conditions. It was
not intended to replace proper heatsinking. Continuously running the TLV700xx into thermal shutdown degrades
device reliability.
Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves
the heat from the device to the ambient air. Performance data for JEDEC low and high-K boards are given in the
Dissipation Ratings table. Using heavier copper increases the effectiveness in removing heat from the device.
The addition of plated through-holes to heat-dissipating layers also improves heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of
the output current and the voltage drop across the output pass element, as shown in Equation 1.
PD = (VIN - VOUT) ´ IOUT
(1)
Copyright © 2010, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): TLV70033-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TLV70033QDDCRQ1
ACTIVE
SOT
DDC
5
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLV70033-Q1 :
Catalog: TLV70033
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明