TLV703 [TI]
300mA、高 PSRR、低 IQ、低压降稳压器;
| 型号： | TLV703 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 300mA、高 PSRR、低 IQ、低压降稳压器 稳压器 |
| 文件： | 总24页 (文件大小：601K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TLV703
SBVS305 –MARCH 2017
TLV703 300-mA, Low-IQ, Low-Dropout Regulator
1 Features
3 Description
The TLV703 series of low-dropout (LDO) linear
regulators are low quiescent current devices with
excellent line and load transient performance. These
LDOs are designed for power-sensitive applications.
A precision band-gap and error amplifier provides
overall 2% accuracy. Low output noise, very high
power-supply rejection ratio (PSRR), and low-dropout
voltage make this series of devices ideal for a wide
selection of battery-operated handheld equipment. All
device versions have thermal shutdown and current
limit for safety.
1
•
Very Low Dropout:
–
–
–
37 mV at IOUT = 50 mA, VOUT = 2.8 V
75 mV at IOUT = 100 mA, VOUT = 2.8 V
220 mV at IOUT = 300 mA, VOUT = 2.8 V
•
•
•
2% Accuracy
Low IQ: 35 μA
Fixed-Output Voltage Combinations Possible
From 1.2 V to 4.8 V
•
•
•
•
High PSRR: 68 dB at 1 kHz
Furthermore, these devices are stable with an
effective output capacitance of only 0.1 µF. This
feature enables the use of cost-effective capacitors
that have higher bias voltages and temperature
derating. The devices regulate to specified accuracy
with no output load.
Stable With Effective Capacitance of 0.1 μF
Thermal Shutdown and Overcurrent Protection
Packages: 5-Pin SOT-23
2 Applications
•
•
•
•
•
•
Wireless Handsets
The TLV703 series of LDO linear regulators are
available in a 5-pin SOT-23 package.
Smart Phones
ZigBee® Networks
Device Information(1)
Bluetooth® Devices
PART NUMBER
TLV703
PACKAGE
BODY SIZE (NOM)
Li-Ion Battery-Operated Handheld Products
WLAN and Other PC Add-on Cards
SOT-23 (5)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
SPACE
SPACE
SPACE
SPACE
Typical Application Circuit
IN
OUT
GND
TLV703
COUT
CIN
EN
ON
OFF
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLV703
SBVS305 –MARCH 2017
www.ti.com
Table of Contents
8.1 Application Information............................................ 12
8.2 Typical Application .................................................. 12
Power Supply Recommendations...................... 13
9.1 Power Dissipation ................................................... 13
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 11
Application and Implementation ........................ 12
9
10 Layout................................................................... 14
10.1 Layout Guidelines ................................................. 14
10.2 Layout Example .................................................... 14
10.3 Thermal Consideration.......................................... 14
11 Device and Documentation Support ................. 15
11.1 Device Support .................................................... 15
11.2 Documentation Support ........................................ 15
11.3 Receiving Notification of Documentation Updates 15
11.4 Community Resources.......................................... 15
11.5 Trademarks........................................................... 15
11.6 Electrostatic Discharge Caution............................ 15
11.7 Glossary................................................................ 15
7
8
12 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
NOTES
March 2017
*
Initial release.
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5 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
Top View
IN
GND
EN
1
2
3
5
4
OUT
NC
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NO.
NAME
Input pin. A small, 1-µF ceramic capacitor is recommended from this pin to ground to assure stability and
good transient performance. See the Input and Output Capacitor Requirements in the Application
Information section for more details.
1
IN
I
2
3
4
GND
EN
—
I
Ground pin
Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into
shutdown mode and reduces operating current to 1 µA, nominal.
NC
—
No connection. This pin can be tied to ground to improve thermal dissipation.
Regulated output voltage pin. A small, 1-µF ceramic capacitor is needed from this pin to ground to assure
stability. See the Input and Output Capacitor Requirements in the Application Information section for more
details.
5
OUT
O
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6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Voltage(2)
IN, EN, OUT
OUT
–0.3
6
V
Current (source)
Internally limited
Output short-circuit duration
Indefinite
Total continuous power dissipation
See Thermal Information
Operating virtual junction, TJ
Storage, Tstg
–55
–55
150
150
Temperature
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to the network ground terminal.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2
NOM
MAX
UNIT
VIN
Input voltage range
Output voltage range
Output current
5.5
4.8
V
V
VOUT
IOUT
1.2
0
300
mA
6.4 Thermal Information
TLV703
THERMAL METRIC(1)
DBV (SOT-23)
5 PINS
254.1
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
143.9
58.0
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
25.3
ψJB
56.6
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
at VIN = VOUT(nom) + 0.5 V or 2 V (whichever is greater), IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and TJ = –40°C to +125°C
(unless otherwise noted); typical values are at TJ = 25°C
PARAMETER
TEST CONDITIONS
MIN
2
TYP
MAX
5.5
UNIT
VIN
Input voltage range
DC output accuracy
V
VOUT
–40°C ≤ TJ ≤ 125°C
–2%
0.5%
1
2%
VOUT(nom) + 0.5 V ≤ VIN ≤ 5.5 V,
IOUT = 10 mA
ΔVOUT(ΔVIN)
Line regulation
5
mV
ΔVOUT(ΔIOUT) Load regulation
0 mA ≤ IOUT ≤ 300 mA
1
260
500
35
15
375
860
55
mV
mV
mA
VDO
ICL
Dropout voltage(1)
VIN = 0.98 × VOUT(nom), IOUT = 300 mA
VOUT = 0.9 × VOUT(nom)
Output current limit
320
IOUT = 0 mA
IGND
Ground pin current
µA
IOUT = 300 mA, VIN = VOUT + 0.5 V
VEN ≤ 0.4 V, VIN = 2 V
370
400
nA
µA
ISHDN
Ground pin current (shutdown)
VEN ≤ 0.4 V, 2 V ≤ VIN ≤ 4.5 V,
TJ = –40°C to +85°C
1
2
VIN = 2.3 V, VOUT = 1.8 V,
IOUT = 10 mA, f = 1 kHz
PSRR
Vn
Power-supply rejection ratio
Output noise voltage
68
dB
BW = 100 Hz to 100 kHz,
VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA
48
µVRMS
tSTR
Start-up time(2)
COUT = 1 µF, IOUT = 300 mA
100
µs
V
VEN(high)
VEN(low)
IEN
Enable pin high (enabled)
Enable pin low (disabled)
Enable pin current
0.9
0
VIN
0.4
V
VIN = VEN = 5.5 V
0.04
1.9
µA
V
UVLO
Undervoltage lockout
VIN rising
Shutdown, temperature increasing
Reset, temperature decreasing
165
145
Tsd
TJ
Thermal shutdown temperature
Operating junction temperature
°C
°C
–40
125
(1) VDO is measured for devices with VOUT(nom) ≥ 2.35 V.
(2) Start-up time = time from EN assertion to 0.98 × VOUT(nom)
.
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6.6 Typical Characteristics
over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater, IOUT = 10 mA,
VEN = VIN, COUT = 1 μF (unless otherwise noted); typical values are at TJ = 25°C
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
+125°C
+85°C
+25°C
-40°C
+125°C
+85°C
+25°C
-40°C
2.1
2.6
3.1
3.6
4.1
4.6
5.1
5.6
2.3
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
VIN (V)
VIN (V)
VOUT = 1.8 V, IOUT = 10 mA
VOUT = 1.8 V, IOUT = 300 mA
Figure 2. Line Regulation
Figure 1. Line Regulation
350
300
250
200
150
100
50
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
+125°C
+85°C
+25°C
–40°C
+125°C
+85°C
+25°C
-40°C
0
0
50
100
150
200
250
300
2.25
2.75
3.25
3.75
4.25
4.75
IOUT (mA)
VIN (V)
VOUT = 1.8 V
Figure 3. Load Regulation
IOUT = 300 mA
Figure 4. Dropout Voltage vs Input Voltage
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
50
45
40
35
30
25
20
15
10
5
+125°C
10mA
+85°C
+25°C
-40°C
150mA
200mA
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
2.1
2.6
3.1
3.6
4.1
4.6
5.1
5.6
VIN (V)
VOUT = 1.8 V
VOUT = 1.8 V
Figure 5. Output Voltage vs Temperature
Figure 6. Ground Pin Current vs Input Voltage
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Typical Characteristics (continued)
over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater, IOUT = 10 mA,
VEN = VIN, COUT = 1 μF (unless otherwise noted); typical values are at TJ = 25°C
450
400
350
300
250
200
150
100
50
50
45
40
35
30
25
20
15
10
5
+125°C
+85°C
+25°C
-40°C
0
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
0
2.1
10
50
100
150
200
250
300
IOUT (mA)
VOUT = 1.8 V
VOUT = 1.8 V
Figure 7. Ground Pin Current vs Load
Figure 8. Ground Pin Current vs Temperature
2.5
2
700
600
500
400
300
200
100
0
1.5
1
+125°C
+125°C
+85°C
+25°C
-40°C
+85°C
+25°C
-40°C
0.5
0
2.6
3.1
3.6
4.1
4.6
5.1
5.6
2.3
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
VIN (V)
VIN (V)
VOUT = 1.8 V
VOUT = 1.8 V
Figure 9. Shutdown Current vs Input Voltage
Figure 10. Current Limit vs Input Voltage
100
90
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
1 kHz
IOUT = 10 mA
IOUT = 150 mA
10 kHz
100 kHz
100
1 k
10 k
100 k
1 M
10 M
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Frequency (Hz)
Input Voltage (V)
VIN – VOUT = 0.5 V
VOUT = 1.8 V
Figure 11. Power-Supply Ripple Rejection vs Frequency
Figure 12. Power-Supply Ripple Rejection vs Input Voltage
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Typical Characteristics (continued)
over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater, IOUT = 10 mA,
VEN = VIN, COUT = 1 μF (unless otherwise noted); typical values are at TJ = 25°C
10
200 mA
1
IOUT
0 mA
0.1
VOUT
0.01
0.001
10 ms/div
10
100
1 k
10 k
100 k
1 M
10 M
VOUT = 1.8 V
Frequency (Hz)
VOUT = 1.8 V, IOUT = 10 mA, CIN = COUT = 1 µF
Figure 14. Load Transient Response
Figure 13. Output Spectral Noise Density vs Frequency
10 mA
0 mA
IOUT
50 mA
0 mA
IOUT
VOUT
VOUT
10 ms/div
10 ms/div
VOUT = 1.8 V, tR = tF = 1 µs
VOUT = 1.8 V, tR = tF = 1 µs
Figure 15. Load Transient Response
Figure 16. Load Transient Response
300 mA
2.9 V
IOUT
0 mA
VIN
2.3 V
VOUT
VOUT
10 ms/div
1 ms/div
VOUT = 1.8 V, IOUT = 300 mA, slew rate = 1 V/µs
VOUT = 1.8 V, tR = tF = 1 µs
Figure 17. Load Transient Response
Figure 18. Line Transient Response
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Typical Characteristics (continued)
over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater, IOUT = 10 mA,
VEN = VIN, COUT = 1 μF (unless otherwise noted); typical values are at TJ = 25°C
VIN
2.9 V
5.5 V
2.3 V
VIN
2.1 V
VOUT
VOUT
1 ms/div
1 ms/div
VOUT = 1.8 V, IOUT = 1 mA, slew rate = 1 V/µs
VOUT = 1.8 V, IOUT = 300 mA, slew rate = 1 V/µs
Figure 19. Line Transient Response
Figure 20. Line Transient Response
VOUT = 1.8 V
IOUT = 1 mA
VIN
VOUT
200 ms/div
VOUT = 1.8 V, IOUT = 1 mA
Figure 21. VIN Ramp Up, Ramp Down Response
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7 Detailed Description
7.1 Overview
The TLV703 series of low-dropout (LDO) linear regulators are low quiescent current devices with excellent line
and load transient performance. These LDOs are designed for power-sensitive applications. A precision band-
gap and error amplifier provides overall 2% accuracy. Low output noise, very high power-supply rejection ratio
(PSRR), and low dropout voltage make this series of devices ideal for most battery-operated handheld
equipment. All device versions have integrated thermal shutdown, current limit, and undervoltage lockout
(UVLO).
7.2 Functional Block Diagram
IN
OUT
Current
Limit
R1
Thermal
Shutdown
œ
+
UVLO
R2
EN
Bandgap
GND
Logic
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7.3 Feature Description
7.3.1 Internal Current Limit
The TLV703 internal current limit helps protect the regulator during fault conditions. During current limit, the
output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the
output voltage is not regulated, and is VOUT = ICL × RLOAD. The PMOS pass transistor dissipates (VIN – VOUT) ×
ICL until thermal shutdown is triggered and the device turns off. As the device cools, the internal thermal
shutdown circuit turns the device back on. If the fault condition continues, the device cycles between current limit
and thermal shutdown; see the Thermal Consideration section for more details.
The PMOS pass element in the TLV703 has a built-in body diode that conducts current when the voltage at OUT
exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated,
external limiting to 5% of the rated output current is recommended.
7.3.2 Shutdown
The enable pin (EN) is active high. The device is enabled when voltage at the EN pin goes above 0.9 V. The
device is turned off when the EN pin is held at less than 0.4 V. When shutdown capability is not required, EN can
be connected to the IN pin.
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Feature Description (continued)
7.3.3 Dropout Voltage
The TLV703 uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout
voltage (VDO), the PMOS pass device is in the linear (triode) region of operation and the input-to-output
resistance is the RDS(on) of the PMOS pass element. VDO scales approximately with output current because the
PMOS device functions as a resistor in dropout.
As with any linear regulator, PSRR and transient response are degraded when (VIN – VOUT) approaches dropout.
Figure 12 illustrates this effect.
7.3.4 Undervoltage Lockout (UVLO)
The TLV703 uses a UVLO circuit to keep the output shut off until internal circuitry is operating properly.
7.4 Device Functional Modes
7.4.1 Normal Operation
The device regulates to the nominal output voltage under the following conditions:
•
•
•
The input voltage is greater than the nominal output voltage added to the dropout voltage
The output current is less than the current limit
The input voltage is greater than the UVLO voltage
7.4.2 Dropout Operation
If the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other
conditions are met for normal operation, the device operates in dropout mode. In this condition, the output
voltage is the same as the input voltage minus the dropout voltage. The transient performance of the device is
significantly degraded because the pass device is in a triode state and no longer regulates the output voltage of
the LDO. Line or load transients in dropout can result in large output voltage deviations.
Table 1 lists the conditions that lead to the different modes of operation.
Table 1. Device Functional Mode Comparison
PARAMETER
OPERATING MODE
VIN
IOUT
Normal mode
Dropout mode
Current limit
VIN > VOUT (nom) + VDO
VIN < VOUT (nom) + VDO
VIN > UVLO
IOUT < ICL
IOUT < ICL
IOUT > ICL
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TLV703 belongs to a family of next-generation value LDO regulators. These devices consume low quiescent
current and deliver excellent line and load transient performance. These characteristics, combined with low noise
and very good PSRR with little (VIN – VOUT) headroom, make this family of devices ideal for portable RF
applications. This family of regulators offers current limit and thermal protection, and is specified from –40°C to
+125°C.
8.2 Typical Application
IN
OUT
GND
TLV703
COUT
CIN
EN
ON
OFF
Figure 22. Typical Application Circuit
8.2.1 Design Requirements
Table 2 lists the design parameters.
Table 2. Design Parameters
PARAMETER
Input voltage
Output voltage
Output current
DESIGN REQUIREMENT
2.5 V to 3.3 V
1.8 V
100 mA
8.2.2 Detailed Design Procedure
8.2.2.1 Input and Output Capacitor Requirements
1-μF X5R- and X7R-type ceramic capacitors are recommended because these capacitors have minimal variation
in value and equivalent series resistance (ESR) over temperature.
However, the TLV703 is designed to be stable with an effective capacitance of 0.1 μF or larger at the output.
Thus, the device is stable with capacitors of other dielectric types as well, as long as the effective capacitance
under operating bias voltage and temperature is greater than 0.1 µF. In addition to allowing the use of lower-cost
dielectrics, this capability of being stable with 0.1-µF effective capacitance also enables the use of smaller
footprint capacitors that have higher derating in size- and space-constrained applications.
Using a 0.1-µF rated capacitor at the output of the LDO does not ensure stability because the effective
capacitance under the specified operating conditions must not be less than 0.1 µF. Maximum ESR must be less
than 200 mΩ.
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Although an input capacitor is not required for stability, good analog design practice is to connect a 0.1-µF to
1-µF, low ESR capacitor across the IN pin and GND pin of the regulator. This capacitor counteracts reactive
input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor
may be necessary if large, fast rise-time load transients are anticipated, or if the device is not located close to the
power source. If source impedance is more than 2 Ω, a 0.1-μF input capacitor may be necessary to ensure
stability.
8.2.2.2 Transient Response
As with any regulator, increasing the size of the output capacitor reduces overshoot and undershoot magnitude
but increases the duration of the transient response.
8.2.3 Application Curves
VIN
2.9 V
IOUT
50 mA
0 mA
2.3 V
VOUT
VOUT
10 ms/div
1 ms/div
VOUT = 1.8 V, tR = tF = 1 µs
VOUT = 1.8 V, IOUT = 1 mA, slew rate = 1 V/µs
Figure 23. Load Transient Response
Figure 24. Line Transient Response
9 Power Supply Recommendations
Connect a low output impedance power supply directly to the IN pin of the TLV703. Inductive impedances
between the input supply and the IN pin can create significant voltage excursions at the IN pin during start-up or
load transient events.
9.1 Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the printed-circuit-board (PCB) layout. The PCB area around the device that is free of other components moves
the heat from the device to the ambient air; see the Thermal Information section for thermal performance on the
TLV703 evaluation module (EVM). The EVM is a two-layer board with two ounces of copper per side.
Power dissipation depends on input voltage and load conditions. Equation 1 shows that power dissipation (PD) is
equal to the product of the output current and the voltage drop across the output pass element.
PD = (VIN - VOUT) ´ IOUT
(1)
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Product Folder Links: TLV703
TLV703
SBVS305 –MARCH 2017
www.ti.com
10 Layout
10.1 Layout Guidelines
Place input and output capacitors as close to the device pins as possible. To improve ac performance (such as
PSRR, output noise, and transient response), TI recommends designing the board with separate ground planes
for VIN and VOUT with the ground plane connected only at the GND pin of the device. In addition, connect the
ground connection for the output capacitor directly to the GND pin of the device. High ESR capacitors can
degrade PSRR performance.
10.2 Layout Example
VOUT
VIN
OUT
IN
CIN
COUT
GND
EN
NC
GND PLANE
Represents via used for
application specific connections
Figure 25. Example Layout
10.3 Thermal Consideration
Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the
device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit can cycle on and off. This cycling limits the dissipation of the regulator, thus protecting the regulator from
damage resulting from overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, limit junction temperature to 125°C maximum.
To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature
until the thermal protection is triggered; use worst-case loads and signal conditions.
The internal protection circuitry of the TLV703 is designed to protect against overload conditions. This circuitry is
not intended to replace proper heatsinking. Continuously running the TLV703 into thermal shutdown degrades
device reliability.
14
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Product Folder Links: TLV703
TLV703
www.ti.com
SBVS305 –MARCH 2017
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
11.1.2 Device Nomenclature
Table 3. Ordering Information(1)
(2)
PRODUCT
VOUT
TLV703xx yyyz
XX is nominal output voltage (for example, 28 = 2.8 V).
YYY is the package designator.
Z is tape and reel quantity (R = 3000).
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2) Output voltages from 1.2 V to 4.8 V in 50-mV increments are available. Contact factory for details and availability.
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation see the following:
Using the TLV700xxEVM-503 Evaluation Module
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 Trademarks
E2E is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG.
ZigBee is a registered trademark of the ZigBee Alliance.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2017, Texas Instruments Incorporated
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15
Product Folder Links: TLV703
TLV703
SBVS305 –MARCH 2017
www.ti.com
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: TLV703
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TLV70310DBVR
TLV70311DBVR
TLV70312DBVR
TLV70313DBVR
TLV70315DBVR
TLV70318DBVR
TLV70325DBVR
TLV70327DBVR
TLV70328DBVR
TLV70329DBVR
TLV70330DBVR
TLV70333DBVR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
1F4Q
1F1Q
1ECQ
1G5Q
1EDQ
1AZE
1EEQ
1EXQ
1B3E
1EZQ
1I9Q
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
SN
1AHQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV70310DBVR
TLV70311DBVR
TLV70312DBVR
TLV70313DBVR
TLV70315DBVR
TLV70318DBVR
TLV70325DBVR
TLV70327DBVR
TLV70328DBVR
TLV70329DBVR
TLV70330DBVR
TLV70333DBVR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLV70310DBVR
TLV70311DBVR
TLV70312DBVR
TLV70313DBVR
TLV70315DBVR
TLV70318DBVR
TLV70325DBVR
TLV70327DBVR
TLV70328DBVR
TLV70329DBVR
TLV70330DBVR
TLV70333DBVR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
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