TMAG5123B1CQDBZT [TI]
TMAG5123 In-Plane, High-Precision, High-Voltage, Hall-Effect Switch;
| 型号： | TMAG5123B1CQDBZT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TMAG5123 In-Plane, High-Precision, High-Voltage, Hall-Effect Switch |
| 文件： | 总32页 (文件大小：2182K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG5123
SLYS030 – MAY 2021
TMAG5123 In-Plane, High-Precision, High-Voltage, Hall-Effect Switch
1 Features
3 Description
•
•
In-plane, omnipolar Hall-effect switch
High magnetic sensitivity:
The TMAG5123 is a chopper-stabilized omnipolar,
active-low, in-plane, Hall-effect switch sensor. The
TMAG5123 eases mechanical placement of the
sensor by measuring magnetic fields parallel to the
surface of the printed circuit board (PCB) in a surface
mount SOT-23 package.
– TMAG5123B: 4.1 mT (typical)
– TMAG5123C: 7.5 mT (typical)
– TMAG5123D: 10.9 mT (typical)
Supports a wide voltage range
– 2.5-V to 38-V operating VCC range
– No external regulator required
Wide operating temperature range
– Ambient operating temperature range: –40 °C
to +125 °C
•
•
Different sensitivity levels are available to match
the specific requirement of the application. When
the applied magnetic flux density value exceeds the
operating point (BOP) threshold in absolute magnetic
field values, the open-drain output produces a low-
state voltage. The output remains low until the applied
field decreases to less than the release point (BRP)
threshold also in absolute terms.
•
•
•
•
30kHz continuous conversion
Open-drain output
SOT-23 package option
Protection features
– Supports up to 40-V load dump
– Reverse battery protection to –20-V
– Output short-circuit protection
– Output current limitation
The TMAG5123 incorporates a wide 2.5-V to 38-
V operating voltage range and reverse polarity
protection of up to -20-V, enabling robust operation
for industrial appliations.
2 Applications
Device Information
PART NUMBER
PACKAGE(1)
BODY SIZE (NOM)
•
•
•
•
•
•
Major appliances
Small home appliances
Cordless vaccum vobot
Flow meters
Residential breakers
Open and close detection
TMAG5123
SOT-23 (3)
2.92 mm × 1.30 mm
(1) For all available packages, see the package option
addendum at the end of the data sheet.
In-Plane Sensor
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMAG5123
SLYS030 – MAY 2021
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Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings ....................................... 4
7.2 ESD Ratings .............................................................. 4
7.3 Recommended Operating Conditions ........................4
7.4 Thermal Information ...................................................4
7.5 Electrical Characteristics ............................................5
7.6 Magnetic Characteristics ............................................5
7.7 Typical Characteristics................................................6
8 Detailed Description........................................................9
8.1 Overview.....................................................................9
8.2 Functional Block Diagram...........................................9
8.3 Feature Description.....................................................9
8.4 Device Functional Modes..........................................14
9 Application and Implementation..................................15
9.1 Application Information............................................. 15
9.2 Typical Applications.................................................. 15
10 Power Supply Recommendations..............................19
11 Layout...........................................................................19
11.1 Layout Guidelines................................................... 19
11.2 Layout Example...................................................... 19
12 Device and Documentation Support..........................20
12.1 Receiving Notification of Documentation Updates..20
12.2 Support Resources................................................. 20
12.3 Trademarks.............................................................20
12.4 Electrostatic Discharge Caution..............................20
12.5 Glossary..................................................................20
13 Mechanical, Packaging, and Orderable
Information.................................................................... 20
4 Revision History
DATE
REVISION
NOTES
May 2021
*
Initial Release
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5 Device Comparison Table
DEVICE
DEVICE OPTION
Threshold level (BOP)
B
C
D
4.1mT
7.5mT
10.9mT
TMAG5123
6 Pin Configuration and Functions
VCC
1
3
GND
OUT
2
Not to scale
Figure 6-1. DBZ Package 3-Pin SOT-23 Top View
Table 6-1. Pin Functions
PIN
NAME
TYPE
DESCRIPTION
NO.
2.5-V to 38-V power supply. Connect a ceramic capacitor with a value of at least 0.01 µF
(minimum) between VCC and ground.
1
VCC
Power supply
2
3
OUT
GND
Output
Hall sensor open-drain output. The open drain requires a pull-up resistor
Ground reference.
Ground
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Power Supply
VCC
–20
40
V
Voltage
Magnetic Flux Density,BMAX
Junction temperature, TJ
Storage temperature, Tstg
Unlimited
T
150
150
°C
°C
–65
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, allpins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specificationJESD22-C101, all pins(2)
± 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
38
UNIT
V
VCC
VO
Power supply voltage
Output pin voltage
2.5
0
38
V
ISINK
TA
Output pin current sink
Ambient temperature
0
20
mA
°C
–40
125
7.4 Thermal Information
TMAG5123
DBZ (SOT-23)
3 PINS
197.7
THERMAL METRIC(1)
UNIT
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
87.1
27.4
Junction-to-top characterization parameter
Junction-to-board characterization parameter
3.7
ΨJB
27.1
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
-100
0
TYP
MAX
UNIT
POWER SUPPLY
ICC
Operating supply current
Operating supply current
Reverse-battery current
Power-on-time
VCC = 2.5V to 38V, TA = 25°C
VCC = 2.5V to 38V, TA = – 40°C to 125°C
VCC = -20V
3.5
3.5
mA
mA
µA
µs
ICC
5.4
IRCC
tON
62.5
POS
OUTPUT
VOL
IOH
Power-on-state
VCC>VCCmin, t>=tON
High
Low-level output voltage
Output leakage current
Output short-circuit current
Output rise time
IOL=5mA
VCC=5V
0.5
1
V
µA
mA
µs
µs
µs
0.1
65
ISC
100
tR
RL=1kΩ, CL=50pF, VCC = 12 V
RL=1kΩ, CL=50pF, VCC = 12 V
Change in B field to change in output
0.2
0.2
50
tF
Output fall time
tPD
Propagation delay time
FREQUENCY RESPONSE
fCHOP
fBW
Chopping frequency
Signal bandwidth
320
10
kHz
kHz
7.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TMAG5123B
BOP
BRP
Magnetic field operating point
Magnetic field release point
Magnetic hysteresis BOP - BRP
±2.2
±0.3
±0.5
±4.1
±2.2
±1.9
±6
±4
±3
mT
mT
mT
VCC = 2.5V to 38V, TA = – 40°C to 125°C
VCC = 2.5V to 38V, TA = – 40°C to 125°C
VCC = 2.5V to 38V, TA = – 40°C to 125°C
BHYS
TMAG5123C
BOP
BRP
Magnetic field operating point
±5.5
±3.5
±0.5
±7.5
±5.5
±2
±9.5
±7.5
±3
mT
mT
mT
Magnetic field release point
BHYS
Magnetic hysteresis BOP - BRP
TMAG5123D
BOP
BRP
Magnetic field operating point
±8.7
±6.7
±0.5
±10.9
±8.9
±2
±13
±11
±3
mT
mT
mT
Magnetic field release point
BHYS
Magnetic hysteresis BOP - BRP
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7.7 Typical Characteristics
at TA = 25 °C typical and VCC = 6V (unless otherwise noted)
4
4
3.8
3.6
3.4
3.2
3
VCC = 2.5V
VCC = 3V
VCC = 6V
VCC = 12V
TA = -40°C
TA = 25°C
TA = 125°C
3.8
3.6
3.4
3.2
3
-40
-15
10
Ambient Temperature (°C)
35
60
85
110 125
2.5
4.5
6.5 8.5
Supply Voltage (V)
10.5
12
Figure 7-1. TMAG5123 ICC vs Temperature
Figure 7-2. TMAG5123 ICC vs Voltage
7
7
5
BOPS
BOPN
BRPS
BRPN
BOPS
BOPN
BRPS
BRPN
5
3
3
1
1
-1
-3
-5
-1
-3
-5
-40
-15
10
Ambient Temperature (°C)
35
60
85
110 125
2.5
7.5
12.5
17.5 22.5
Supply Voltage (V)
27.5
32.5
37.5
Figure 7-3. TMAG5123B Magnetic Thresholds vs
Temperature
Figure 7-4. TMAG5123B Magnetic Thresholds vs
Voltage
4
4
HYSTS
HYSTN
HYSTS
HYSTN
3
2
1
0
3
2
1
0
-40
-15
10
Ambient Temperature (°C)
35
60
85
110 125
2.5
7.5
12.5
17.5 22.5
Supply Voltage (V)
27.5
32.5
37.5
Figure 7-5. TMAG5123B Hysteresis vs Temperature
Figure 7-6. TMAG5123B Hysteresis vs Supply
Voltage
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12
12
10
8
BOPS
BOPN
BRPS
BRPN
BOPS
BOPN
BRPS
BRPN
8
4
6
4
2
0
0
-2
-4
-6
-8
-10
-12
-4
-8
-12
-40
-15
10
35
Ambient Temperature (°C)
60
85
110 125
2.5
7.5
12.5
17.5 22.5
Supply Voltage (V)
27.5
32.5
37.5
Figure 7-7. TMAG5123C Magnetic Thresholds vs
Temperature
Figure 7-8. TMAG5123C Magnetic Thresholds vs
Voltage
4
4
HYSTS
HYSTN
HYSTS
HYSTN
3
2
1
0
3
2
1
0
-40
-15
10
Ambient Temperature (°C)
35
60
85
110 125
2.5
7.5
12.5
17.5 22.5
Supply Voltage (V)
27.5
32.5
37.5
Figure 7-9. TMAG5123C Hysteresis vs Temperature
Figure 7-10. TMAG5123C Hysteresis vs Supply
Voltage
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17
13
9
19
15
11
7
BOPS
BOPN
BRPS
BRPN
BOPS
BOPN
BRPS
BRPN
5
3
1
-1
-3
-5
-7
-9
-11
-15
-13
-17
-40
-15
10
Ambient Temperature (°C)
35
60
85
110 125
2.5
7.5
12.5
17.5 22.5
Supply Voltage (V)
27.5
32.5
37.5
Figure 7-11. TMAG5123D Magnetic Thresholds vs
Temperature
Figure 7-12. TMAG5123D Magnetic Thresholds vs
Voltage
4
4
HYSTS
HYSTN
HYSTS
HYSTN
3
2
1
0
3
2
1
0
-40
-15
10
Ambient Temperature (°C)
35
60
85
110 125
2.5
7.5
12.5
17.5 22.5
Supply Voltage (V)
27.5
32.5
37.5
Figure 7-13. TMAG5123D Hysteresis vs
Temperature
Figure 7-14. TMAG5123D Hysteresis vs Supply
Voltage
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8 Detailed Description
8.1 Overview
The TMAG5123 device is a chopper-stabilized Hall sensor with a digital omnipolar switch output for magnetic
sensing applications. The TMAG5123 device can be powered with a supply voltage range between 2.5-V and
38 V, and can withstand –20-V reverse battery conditions continuously. Note that the TMAG5123 device will not
operate when approximately –20-V to 2.5-V is applied to the VCC pin (with respect to GND). In addition, the
device can withstand voltages up to 40 V for transient durations.
While most of the Hall-effect sensors switch their output in the presence of a vertical field, the TMAG5123 will
switch the output in the presence of a horizontal field. The TMAG5123 is then an in-plane or vertical sensor,
sensitive to a horizontal or parallel magnetic fields.
The omnipolar configuration allows the Hall sensor to respond to either a south or north pole. A strong magnetic
field of either polarity will cause the output to pull low (operate point, BOP), and a weaker magnetic field will
cause the output to release (release point, BRP). Hysteresis is included in between the operate and release
points, so magnetic field noise will not trip the output accidentally.
An external pullup resistor is required on the OUT pin. The OUT pin can be pulled up to VCC, or to a different
voltage supply. This allows for easier interfacing with controller circuits.
8.2 Functional Block Diagram
VCC
Chopper
stabilization
Threshold
selection
LDO
OUT
Output
control
X
Amp
∫
GND
Figure 8-1. Block Diagram
8.3 Feature Description
8.3.1 Field Direction Definition
The TMAG5123 is sensitive to both south and north poles in the same plane as the die as shown Figure 8-2.
Figure 8-2. Field Direction Definition
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8.3.2 Device Output
The TMAG5123 is featured with an open drain output. In order to generate a two state output, a pull-up resistor
needs to be added.
Once the device is powered and with no magnetic field applied to it, the output stays at Vout(H). As an omnipolar
sensor the output will go down to Vout(L) when the field increase beyond the BOP threshold either with a north
or a south magnetic field. When the field decrease below the BRP threshold, either with a north or a south
magnetic field, the output will go up to Vout(H)
Vout
BHYS
BHYS
Vout(H)
Vout(L)
B
BOP
BRP
BRP
BOP
North
South
0 mT
Figure 8-3. Omnipolar Functionality
8.3.3 Protection Circuits
The TMAG5123 device is protected against load dump and reverse-supply conditions
8.3.3.1 Load Dump Protection
The TMAG5123 device operates at DC VCC conditions up to 38-V nominally, and can additionally withstand
VCC = 40-V. No current-limiting series resistor is required for this protection.
8.3.3.2 Reverse Supply Protection
The TMAG5123 device is protected in the event that the VCC pin and the GND pin are reversed (up to –20-V).
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8.3.4 Hall Element Location
The sensing element inside the device is in the center of both packages when viewed from the top. Figure 8-4
shows the tolerances and side-view dimensions.
0.66
0.55
1.83
1.70
0.73
0.57
Figure 8-4. Hall Element Location
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8.3.5 Power-On Time
Figure 8-5 shows the behavior of the device after the VCC voltage is applied and when the field is below the BOP
threshold. Once the minimum value for VCC is reached, the TMAG5123 will take time tON to power up and then
time tPD to update the output to a level High.
Figure 8-6 shows the behavior of the device after the VCC voltage is applied and when the field is above the BOP
threshold. Once the minimum value for VCC is reached, the TMAG5123 will take time tON to power up and then
time tPD to update the output to a level Low.
The output value during tON is unknown in both cases. The output value at the end of tON will be set at High.
Supply (V)
Supply (V)
VCC
VCC
2.5V
0V
2.5V
0V
t (s)
t (s)
t (s)
t (s)
t (s)
t (s)
B (mT)
B (mT)
BOP
BRP
BOP
BRP
Output (V)
Output (V)
VCC
VCC
0V
0V
tON
tPD
tON
tPD
Figure 8-5. Power-On Time When B < BOP
Supply (V)
VCC
2.5V
0V
t (s)
B (mT)
BOP
BRP
t (s)
Output (V)
VCC
0V
t (s)
tON
tPD
Figure 8-6. Power-On Time When B > BOP
8.3.6 Propagation Delay
The TMAG5123 samples the Hall element at a nominal sampling interval of tPD to detect the presence of a
magnetic south or north pole. Between each sampling interval, the device calculates the average magnetic
field applied to the device. If this average value crosses the BOP or BRP threshold, the device changes the
corresponding level as defined in Figure 8-3. The Hall sensor + magnet system is by nature asynchronous,
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therefore the propagation delay (tPD) will vary depending on when the magnetic field goes above the BOP value.
As shown in Figure 8-7, the output delay also depends on when the magnetic field goes above the BOP value.
The first graph in Figure 8-7 shows the typical case. The magnetic field goes above the BOP value at the moment
the output is updated. The part will only require one sampling period of tPD to update the output.
The second graph in Figure 8-7 shows a magnetic field going above the BOP value just before half of the
sampling period. This is the best-case scenario where the output is updated in just half of the sampling period.
Finally, the third graph in Figure 8-7 shows the worst-case scenario where the magnetic field goes above the
BOP value just after half of the sampling period. At the next output update, the device will still see the magnetic
field under the BOP threshold and will require a whole new sampling period to update the output.
Magnetic Field
B7
Magnetic Field
B7
Magnetic Field
B7
B6
B6
B6
B5
B5
B5
BOP
B4
BOP
B4
BOP
B4
B3
B2
B1
B3
B2
B1
B3
B2
B1
t1
t2
t3
t4
t5
t6
t7
t8
t1
t2
t3
t4
t5
t6
t7
t8
t1
t2
t3
t4
t5
t6
t7
t8
Time
Time
Time
Output
Output
Output
VCC
VCC
VCC
tPDMin
tPDTyp
tPDMax
0V
0V
0V
Time
Time
Time
Figure 8-7. Field Sampling Timing
Figure 8-8 shows TMAG5123 propagation delay analysis when a magnetic south or north pole is applied. The
Hall element of the TMAG5123 experiences an increasing magnetic field as a magnetic south or north pole
approaches the device, as well as a decreasing magnetic field as a magnetic south or north pole moves away. At
time t1, the magnetic field goes above the BOP threshold. The output will then start to move after the propagation
delay (tPD). This time will vary depending on when the sampling period is, as shown in Figure 8-7. At t2, the
output start pulling the output voltage Low. At t3, the output is completely pulled down. The same process
happens on the other way when the magnetic value is going under the BRP threshold.
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Magnetic Field
BOP
BRP
Time
Output
VCC
0V
t1
t2 t3
t4
t5 t6
Time
tPD
tPD
tF
tR
Figure 8-8. Propagation Delay
8.3.7 Chopper Stabilization
The Basic Hall-effect sensor consists of four terminals where a current is injected through two opposite terminals
and a voltage is measured through the other opposite terminals. The voltage measured is proportional to the
current injected and the magnetic field measured. By knowing the current inject, the device can then know the
magnetic field strength. The problem is that the voltage generated is small in amplitude while the offset voltage
generated is more significant. To create a precise sensor, the offset voltage must be minimized.
Chopper stabilization is one way to significantly minimize this offset. It is achieved by "spinning" the sensor and
sequentially applying the bias current and measuring the voltage for each pair of terminals. This means that
a measurement is completed once the spinning cycle is completed. The full cycle is completed after sixteen
measurements. The output of the sensor is connected to an amplifier and an integrator that will accumulate and
filter out a voltage proportional to the magnetic field present. Finally, a comparator will switch the output if the
voltage reaches either the BOP or BRP threshold (depending on which state the output voltage was previously
in).
The frequency of each individual measurement is referred as the Chopping frequency, or fCHOP. The total
conversion time is referred as the Propagation delay time, tPD, and is basically equal to 16/fCHOP. Finally,
the Signal bandwidth, fBW, represents the maximum value of the magnetic field frequency, and is equal to
(fCHOP/16)/2 as defined by the sampling theorem.
8.4 Device Functional Modes
The device operates in only one mode when operated within the Recommended Operating Conditions.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TMAG5123 is typically used in magnetic-field sensing applications to detect the proximity of a magnet that is
in the "in-plane" axis from the sensor. The magnet is often attached to a movable component in the system.
The TMAG5123 is a Hall sensor that implements a Hall sensing element that senses parallel to the package of
the part rather than through the z-axis of the device. This eases constraints in system design where a parallel
magnetic field is needed to be detected, but normal industry packages, such as TO-92 are undesirable due to
space constraints.
9.2 Typical Applications
9.2.1 In-Plane Typical Application Diagrams
N
S
VCC
TMAG5123
VCC
Controller
GPIO
N
S
OUT
0.1 …F
GND
GND
Figure 9-1. Typical In-Plane Sensing Diagram
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9.2.1.1 Design Requirements
For this design example, use the parameters listed in one of the 3 tables below depending on wich version of the
device is used.
Table 9-1. Design Parameters for TMAG5123B
DESIGN PARAMETER
EXAMPLE VALUE
Vcc
12V
TMAG5123 Device
TMAG5123B
Magnet
1-cm Cube NdFeB (N45)
2.8 cm (±6mT) with BOP Max
8.4 cm (±0.3mT) with BRP Min
Minimum Magnet Distance to Operate
Maximum Magnet Distance to Release
Table 9-2. Design Parameters for TMAG5123C
DESIGN PARAMETER
EXAMPLE VALUE
Vcc
12V
TMAG5123 Device
TMAG5123C
Magnet
1-cm Cube NdFeB (N45)
2.33 cm (±9.5mT) with BOP Max
3.44 cm (±3.5mT) with BRP Min
Minimum Magnet Distance to Operate
Maximum Magnet Distance to Release
Table 9-3. Design Parameters for TMAG5123D
DESIGN PARAMETER
EXAMPLE VALUE
Vcc
12V
TMAG5123 Device
TMAG5123D
Magnet
1-cm Cube NdFeB (N45)
2.04 cm (±13mT) with BOP Max
2.68 cm (±6.7mT) with BRP Min
Minimum Magnet Distance to Operate
Maximum Magnet Distance to Release
9.2.1.2 Detailed Design Procedure
When designing a digital-switch magnetic sensing system, three variables should always be considered: the
magnet, sensing distance, and threshold of the sensor.
The TMAG5123 device has a detection threshold specified by parameter BOP, which is the amount of magnetic
flux required to pass through the Hall sensor mounted inside the TMAG5123. To reliably activate the sensor,
the magnet must apply a flux greater than the maximum specified BOP. In such a system, the sensor typically
detects the magnet before it has moved to the closest position, but designing to the maximum parameter
ensures robust turn-on for all possible values of BOP. When the magnet moves away from the sensor, it must
apply less than the minimum specified BRP to reliably release the sensor.
Magnets are made from various ferromagnetic materials that have tradeoffs in cost, drift with temperature,
absolute maximum temperature ratings, remanence or residual induction (Br), and coercivity (Hc). The Br and the
dimensions of a magnet determine the magnetic flux density (B) it produces in 3-dimensional space. For simple
magnet shapes, such as rectangular blocks and cylinders, there are simple equations that solve B at a given
distance centered with the magnet.
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Thickness
Thickness
Width
Distance
Distance
S
N
Length
S
N
B
B
Diameter
Figure 9-2. Rectangular Block and Cylinder Magnets
Use Equation 1 for the rectangular block shown in Figure 9-2:
≈
∆
’
÷
≈
∆
’
÷
≈
’
:
B =
Br
WL
WL
arctan∆
÷ - arctan
∆
∆
«
÷
÷
◊
∆
∆
«
÷
÷
◊
∆
÷
2D 4D2 + W2 + L2
2
p
2 D + T 4 D + T + W2 + L2
«
◊
(
)
(
)
(1)
(2)
Use Equation 2 for the cylinder shown in Figure 9-2:
≈
∆
’
÷
:
B =
Br
2
D + T
2
D
-
∆
∆
«
÷
÷
◊
2
2
0.5C + D + T
0.5C + D2
(
)
(
)
(
)
where
•
•
•
•
•
W is width.
L is length.
T is thickness (the direction of magnetization).
D is distance.
C is diameter.
An online tool, the Hall Effect Switch Magnetic Field Calculator, that uses these formulas is located at http://
www.ti.com/product/tmag5123.
All magnetic materials generally have a lower Br at higher temperatures. Systems should have margin to
account for this, as well as for mechanical tolerances.
For the TMAG5123B, the maximum BOP is 4.5 mT. Choosing a 1-cm cube NdFeB N45 magnet, Equation 1
shows that this point occurs at 3.05 cm. This means that, provided the design places the magnet within 3.05 cm
from the sensor during a "turn-on" event, the magnet will activate the sensor. The removal of the magnet away
from the device will ensure a crossing of the minimum BRP point and will return the device to its initial state.
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9.2.1.3 Application Curve
60
55
50
45
40
35
30
25
20
15
10
5
0
1
1.5
2
2.5
3
Distance (cm)
3.5
4
4.5
5
D017
Figure 9-3. Magnetic Profile of a 1-cm Cube NdFeB Magnet
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10 Power Supply Recommendations
The TMAG5123 is powered from 2.5-V to 38-V DC power supplies. A decoupling capacitor close to the device
must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor with a
value of at least 0.01 µF.
11 Layout
11.1 Layout Guidelines
The bypass capacitor should be placed near the TMAG5123 to reduce noise.
Generally, using PCB copper planes underneath the TMAG5123 device has no effect on magnetic flux, and
does not interfere with device performance. This is because copper is not a ferromagnetic material. However, If
nearby system components contain iron or nickel, they may redirect magnetic flux in unpredictable ways.
11.2 Layout Example
VCC
GND
OUT
Figure 11-1. TMAG5123 Layout Example
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SLYS030 – MAY 2021
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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TMAG5123
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PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
3.04
2.80
1.9
3
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
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EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
Copyright © 2021 Texas Instruments Incorporated
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SLYS030 – MAY 2021
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EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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Product Folder Links: TMAG5123
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMAG5123B1CQDBZR
TMAG5123B1CQDBZT
TMAG5123C1CQDBZR
TMAG5123C1CQDBZT
TMAG5123D1CQDBZR
TMAG5123D1CQDBZT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
SN
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
23B1
23B1
23C1
23C1
23D1
23D1
SN
SN
SN
SN
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2021
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMAG5123 :
Automotive : TMAG5123-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-May-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMAG5123B1CQDBZR SOT-23
TMAG5123B1CQDBZT SOT-23
TMAG5123C1CQDBZR SOT-23
TMAG5123C1CQDBZT SOT-23
TMAG5123D1CQDBZR SOT-23
TMAG5123D1CQDBZT SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3000
250
178.0
178.0
178.0
178.0
178.0
178.0
9.0
9.0
9.0
9.0
9.0
9.0
3.15
3.15
3.15
3.15
3.15
3.15
2.77
2.77
2.77
2.77
2.77
2.77
1.22
1.22
1.22
1.22
1.22
1.22
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
3000
250
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-May-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMAG5123B1CQDBZR
TMAG5123B1CQDBZT
TMAG5123C1CQDBZR
TMAG5123C1CQDBZT
TMAG5123D1CQDBZR
TMAG5123D1CQDBZT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBZ
DBZ
DBZ
DBZ
DBZ
DBZ
3
3
3
3
3
3
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
18.0
18.0
18.0
18.0
18.0
18.0
3000
250
3000
250
Pack Materials-Page 2
4203227/C
PACKAGE OUTLINE
DBZ0003A
SOT-23 - 1.12 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
2.64
2.10
1.12 MAX
1.4
1.2
B
A
0.1 C
PIN 1
INDEX AREA
1
0.95
3.04
2.80
1.9
3
2
0.5
0.3
3X
0.10
0.01
(0.95)
TYP
0.2
C A B
0.25
GAGE PLANE
0.20
0.08
TYP
0.6
0.2
TYP
SEATING PLANE
0 -8 TYP
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
2
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/C 04/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
2
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
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TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated
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