TMAG5170A1QDGKR [TI]
TMAG5170 High-Precision 3D Linear Hall-Effect Sensor With SPI;
| 型号： | TMAG5170A1QDGKR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TMAG5170 High-Precision 3D Linear Hall-Effect Sensor With SPI |
| 文件： | 总60页 (文件大小：2716K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMAG5170
SBASAF4 – SEPTEMBER 2021
TMAG5170 High-Precision 3D Linear Hall-Effect Sensor With SPI
1 Features
3 Description
•
High-precision linear 3D Hall-effect sensor to
optimize position sensing speed and accuracy:
– Linear measurement total error: ±2.6%
(maximum at 25°C)
– Sensitivity temperature drift: ±2.8% (maximum)
– 20-Ksps conversion rate for single axis
10-MHz serial peripheral interface (SPI) with cyclic
redundancy check (CRC)
The TMAG5170 is a high-precision linear 3D Hall-
effect sensor designed for a wide range of industrial
and personal electronics applications. The high level
of integration offers flexibility and accuracy in a variety
of position sensing systems. This device features 3
independent Hall sensors at X, Y, and Z axes.
•
A precision signal-chain along with an integrated 12-
bit ADC enables high accuracy and low drift magnetic
field measurements while supporting a sampling of
up to 20 ksps. On-chip temperature sensor data is
available for system-level drift compensation.
•
•
Built-in temperature sensor with < ±2°C error
Independently selectable X, Y, and Z magnetic
ranges:
– TMAG5170A1: ±25, ±50, ±100 mT
– TMAG5170A2: ±75, ±150, ±300 mT
5-nA (typical) deep sleep mode current
Autonomous wake-up and sleep mode for
threshold detection consuming only 1.5 µA
ALERT function to initiate sensor conversion or
indicate conversion complete
Integrated diagnostics for fault detection
Integrated angle CORDIC calculation with gain
and offset adjustment
Integrated angle calculation engine (CORDIC)
provides full 360° angular position information for both
on-axis and off-axis angle measurement topologies.
The angle calculation is performed using two
user-selected magnetic axes. The device features
magnetic gain and offset correction to mitigate the
impact of system mechanical error sources.
•
•
•
•
•
The TMAG5170 can be configured through the
SPI to enable any combination of magnetic axes
and temperature measurements. Multiple sensor
conversion schemes and SPI read frames help
optimize throughput and accuracy. A dedicated
ALERT pin can act as a system interrupt during low
power wake-up and sleep mode, and can also be
used by a microcontroller to trigger a new sensor
conversion.
•
•
2.3-V to 5.5-V supply voltage range
Operating temperature range: –40°C to +150°C
2 Applications
•
•
•
•
•
•
•
•
•
•
Robotic arm sensors
Mobile robot motor control
Proximity sensors
Linear motor position sensors
Servo drive position sensors
Actuators
Robotic lawnmowers
Vacuum robots
Washer & dryers
The TMAG5170 offers multiple diagnostics features
to detect and report both system and device-level
failures. The SPI communication features a user-
enabled cyclic redundancy check to enhance the data
integrity.
Door & window sensor
The device is offered in two different orderables to
support wide magnetic fields ranges from ±25mT to
±300mT.
2.3V to 5.5V
VDD/VIO
VCC
The device performs consistently across a wide
ambient temperature range of –40°C to +150°C.
ALERT
CS
Device Information(1)
SDI
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SDO
SCK
TMAG5170
VSSOP (8)
3.00 mm × 3.00 mm
TEST
GND
(1) For all available packages, see the package option
addendum at the end of the data sheet.
Application Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMAG5170
SBASAF4 – SEPTEMBER 2021
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings ....................................... 4
6.2 ESD Ratings .............................................................. 4
6.3 Recommended Operating Conditions ........................4
6.4 Thermal Information ...................................................4
6.5 Electrical Characteristics ............................................5
6.6 Magnetic Characteristics ............................................6
6.7 Power up Timing ...................................................... 10
6.8 SPI Interface Timing .................................................10
6.9 Typical Characteristics.............................................. 11
7 Detailed Description......................................................15
7.1 Overview...................................................................15
7.2 Functional Block Diagram.........................................15
7.3 Feature Description...................................................15
7.4 Device Functional Modes..........................................22
7.5 Programming............................................................ 25
7.6 Register Map.............................................................33
8 Application and Implementation..................................45
8.1 Application Information............................................. 45
8.2 Typical Application.................................................... 48
8.3 Do's and Don'ts.........................................................50
9 Power Supply Recommendations................................51
10 Layout...........................................................................51
10.1 Layout Guidelines................................................... 51
10.2 Layout Example...................................................... 52
11 Device and Documentation Support..........................53
11.1 Receiving Notification of Documentation Updates..53
11.2 Support Resources................................................. 53
11.3 Trademarks............................................................. 53
11.4 Electrostatic Discharge Caution..............................53
11.5 Glossary..................................................................53
12 Mechanical, Packaging, and Orderable
Information.................................................................... 53
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
NOTES
*
Initial Release
September 2021
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5 Pin Configuration and Functions
SCK
SDI
1
2
3
4
8
7
6
5
ALERT
TEST
GND
SDO
CS
VCC
Not to scale
Figure 5-1. DGK Package 8-Pin VSSOP Top View
Table 5-1. Pin Functions
PIN
TYPE(1)
DESCRIPTION
NO.
1
NAME
SCK
I
I
Serial clock
Serial data in
Serial data out
Chip select
2
SDI
3
SDO
CS
O
I
4
5
VCC
GND
TEST
ALERT
P
G
P
I/O
Main power supply. Handles 2.3-V to 5.5-V power supply input
Ground reference
6
7
TI test pin. Should be grounded in application
Status output/trigger
8
(1) I = input, O = output, I/O = input and output, G = ground, P = power
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–10
MAX
UNIT
V
VVCC
IOUT
VOUT
BMAX
TJ
Main supply voltage
7
10
Output current, SDO, ALERT
Output voltage, SDO, ALERT
Magnetic flux density
mA
V
–0.3
7
Unlimited
170
T
Junction temperature
–40
–65
°C
°C
Tstg
Storage temperature
150
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins(1)
±3500
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
2.3
–2
NOM
MAX
5.5
2
UNIT
V
VVCC
IOUT
IOUT
VIH
Main supply voltage
Output current, SDO
mA
mA
VVCC
VVCC
µs
Output current, ALERT
0
2
Input HIGH voltage, SDI, CS, SCK
Input LOW voltage, SDI, CS, SCK
Pulse width for conversion trigger input signal
Operating free air temperature
0.75
VIL
0.25
25
tw_trigger
TA
1
-40
150
C
6.4 Thermal Information
TMAG5170
THERMAL METRIC(1)
DGK (8-MSOP)
UNIT
PINS
170.9
63.0
91.7
8.7
RθJA
RθJC(top)
RθJB
ΨJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
ΨJB
90.2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SDO, ALERT
VOH
VOL
VOL
Output HIGH voltage, SDO pin
Output LOW voltage, SDO pin
Output LOW voltage, ALERT pin
IOUT = -2mA
IOUT = 2mA
IOUT = 2mA
VCC –0.4
VCC
0.4
0.4
V
V
V
0
0
RPU =10KΩ, CL =20pF, VCC =2.3V to
5.5V
tFALL_ALERT
ALERT output fall time
50
5
ns
µs
ALERT output pulse width with
conversion complete or threshold
cross interrupt event
ALERT_MODE =0b, Interrupt &
Trigger Mode
tALERT
ALERT output pulse width with other
interrupt events
ALERT_MODE =0b, Interrupt &
Trigger Mode
tALERT
31
30
µs
IOZ
Output Leakage current, ALERT pin
ALERT pin disabled, VOZ = 5.5V
nA
DC Power
VVCC_UV
VVCC_OV
IACT
Under voltage threshold at VCC
Over voltage threshold at VCC
Active mode current from VCC
Stand-by mode current from VCC
2.1
5.9
3.4
840
60
V
V
CS high, VCC = 5.5V
CS high, VCC = 5.5V
mA
µA
µA
µA
nA
ISTDBY
ICFG
Configuration mode current from VCC CS high, VCC = 5.5V
ISLP
Sleep mode current from VCC
CS high, VCC = 5.5V
CS high, VCC = 5.5V
1.5
5
IDEEP_SLP
Deep sleep mode current from VCC
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Average Power
Data active rate 1000Hz, VVCC = 5V
Data active rate 100Hz, VVCC = 5V
Data active rate 10Hz, VVCC = 5V
Data active rate 1Hz, VVCC = 5V
Data active rate 1000Hz, VVCC = 5V
Data active rate 100Hz, VVCC = 5V
Data active rate 10Hz, VVCC = 5V
Data active rate 1Hz, VVCC = 5V
245
32
µA
µA
µA
µA
µA
µA
µA
µA
Duty-cycle mode current consumption,
one channel enabled, CONV_AVG =
000
4.5
1.5
292
39
IVCC_DCM
Duty-cycle mode current consumption,
two channels enabled, CONV_AVG =
000
5
1.6
Operating Speed
CONV_AVG = 000,
OPERATING_MODE =010, only one
50
µs
channel enabled (2)
tmeasure
Conversion time (1)
CONV_AVG = 101,
OPERATING_MODE =010, only one
825
µs
channel enabled (3)
Internal high-frequency oscillator
speed
fHFOSC
fLFOSC
3
3.2
16
3.5 MHz
Internal low-frequency oscillator speed
13.5
19.5
KHz
Temperature Sensing
TSENS_RANGE Temperature sensing range
TSENS_T0
–40
23
170
27
℃
℃
Reference temperature for TADCT0
25
TEMP_RESULT decimal value @
TSENS_T0
TADCT0
17522
TADCRES
NRMS (T)
NRMS (T)
Temp sensing resolution
58.2
60.0
0.06
0.35
61.8 LSB/℃
RMS (1 Sigma) temperature noise
RMS (1 Sigma) temperature noise
CONV_AVG = 101
CONV_AVG = 000
℃
℃
(1) To calculate the time between conversion request and the availability of the conversion result, add the initialization time to the tmeasure
as explained in Comparing Operating Modes Table. For continuous conversion, the initialization time is applicable only for the first
conversion.
(2) Add 25µs for each additional channel enabled for conversion with CONV_AVG =000.
(3) For conversion with CONV_AVG =101, each axis data is collected 32 times. If an additional channel is enabled with CONV_AVG =101,
add 32×25µs = 800µs to the tmeasure to calculate the conversion time for two axes.
6.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TMAG5170A1
x_RANGE(2) = 00b
±50
±25
mT
mT
BIN_A1
Linear magnetic range
Sensitivity; X, Y, or Z axis
x_RANGE(2) = 01b
x_RANGE(2) = 10b
x_RANGE(2) = 00b
x_RANGE(2) = 01b
x_RANGE(2) = 10b
±100
654
mT
SENS50 _A1
SENS25_A1
SENS100_A1
LSB/mT
LSB/mT
LSB/mT
1308
326
Sensitivity error; X, Y, or Z axis, 25mT,
50mT range
SENSER_25C_A1
SENSER_25C_A1
TA = 25℃
TA = 25℃
±0.5%
±0.5%
±0.9%
±2.5%
±3.5%
±2.8%
Sensitivity error; X, Y, or Z axis; 100mT
range
Sensitivity Drift from 25℃ value; X, Y, MAG_TEMPCO = 00b, TA = 25℃ to
or Z axis; 25mT, 50mT range
(1)
SENSDR_A1
125℃
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
Sensitivity Drift from 25℃ value; X, Y, MAG_TEMPCO = 00b, TA = 25℃ to –
(1)
(1)
(1)
(1)
SENSDR_A1
SENSDR_A1
SENSDR_A1
SENSDR_A1
±1.2%
±4.3%
or Z axis; 25mT, 50mT range
40℃
Sensitivity Drift from 25℃ value; X, Y, MAG_TEMPCO = 01b, 10b, 11b; TA =
±1.2%
±1.0%
±1.2%
±3.8%
±4.0%
±4.6%
or Z axis; 25mT, 50mT range
–40℃ to 125℃
Sensitivity Drift from 25℃ value; X, Y,
or Z axis; 100mT range
TA = 25℃ to 125℃
Sensitivity Drift from 25℃ value; X, Y,
or Z axis; 100mT range
TA = 25℃ to -40℃
SENSLDR_A1
Sensitivity Lifetime drift, X, Y, Z axis
Sensitivity Linearity Error, X, Y-axis
Sensitivity Linearity Error, Z axis
±0.5%
±0.1%
SENSLER_XY_A1
SENSLER_Z_A1
SENSMS_XY_A1
SENSMS_YZ_A1
SENSMS_XZ_A1
TA = 25℃
±0.05%
±0.02%
±0.17%
±0.15%
Sensitivity mismatch among X-Y axes TA = 25℃
Sensitivity mismatch among Y-Z axes TA = 25℃
Sensitivity mismatch among X-Z axes TA = 25℃
±3.5%
±4.5%
±4.0%
SENSMS_DR_XY_A1 Sensitivity mismatch drift from 25℃
TA = 25℃ to 125℃
TA = 25℃ to –40℃
TA = 25℃ to 125℃
TA = 25℃ to –40℃
TA = 25℃ to 125℃
TA = 25℃ to –40℃
±0.8%
±0.5%
±0.7%
±0.5%
±1.4%
±0.1%
±4.0%
±3.4%
±3.5%
±3.6%
±4.2%
±3.5%
(1)
value; X-Y axes
Sensitivity mismatch drift from 25℃
SENSMS_DR_XY_A1
value; X-Y axes
SENSMS_DR_YZ_A1 Sensitivity mismatch drift from 25℃
(1)
value; Y-Z axes
Sensitivity mismatch drift from 25℃
SENSMS_DR_YZ_A1
value; Y-Z axes
SENSMS_DR_XZ_A1 Sensitivity mismatch drift from 25℃
(1)
value; X-Z axes
SENSMS_DR_XZ_A1 Sensitivity mismatch drift from 25℃
(1)
value; X-Z axes
Offset; X, Y, or Z axis; 25mT, 50mT
range
Boff_A1
TA = 25℃
–10
–150
0
±200
±350
µT
µT
Boff_A1
Offset, X, Y, or Z axis; 100mT range
TA = 25℃
Offset drift from 25℃ value; X or Y
axis
(1)
(1)
(1)
(1)
Boff_DR_A1
Boff_DR_A1
Boff_DR_A1
TA = 25℃ to 125℃
TA = 25℃ to 125℃
TA = 25℃ to –40℃
TA = 25℃ to –40℃
±5.0 µT/°C
±1.5 µT/°C
2.5 µT/°C
Offset drift from 25℃ value; Z axis
0
Offset drift from 25℃ value; X or Y
axis
–6.5
–3.0
–1.5
Boff_DR_A1
Boff_DR_A1
Offset drift from 25℃ value; Z axis
–1.0
±50
1.0 µT/°C
µT
Offset Lifetime drift
RMS (1 Sigma) magnetic noise (X or
Y-axis)
x_RANGE(2) = 00b; CONV_AVG =
000b, TA = 25℃
x_RANGE(2) = 00b; CONV_AVG =
000b, TA = 125℃
x_RANGE(2) = 00b; CONV_AVG =
101b, TA = 25℃
x_RANGE(2) = 00b; CONV_AVG =
101b, TA = 125℃
NRMS_XY_FAST_A1
NRMS_XY_FAST_A1
NRMS_XY_SLOW_A1
NRMS_XY_SLOW_A1
NRMS_Z_FAST_A1
NRMS_Z_FAST_A1
NRMS_Z_SLOW_A1
NRMS_Z_SLOW_A1
140
170
24
191
228
34
µT
µT
µT
µT
µT
µT
µT
µT
RMS (1 Sigma) magnetic noise (X or
Y-axis)
RMS (1 Sigma) magnetic noise (X or
Y-axis)
RMS (1 Sigma) magnetic noise (X or
Y-axis)
30
41
RMS (1 Sigma) magnetic noise (Z
axis)
Z_RANGE = 00b; CONV_AVG =
000b, TA = 25℃
61
76
RMS (1 Sigma) magnetic noise (Z
axis)
Z_RANGE = 00b; CONV_AVG =
000b, TA = 125℃
70
84
RMS (1 Sigma) magnetic noise (Z
axis)
Z_RANGE = 00b; CONV_AVG =
101b, TA = 25℃
11
14.2
15.2
RMS (1 Sigma) magnetic noise (Z
axis)
Z_RANGE = 00b; CONV_AVG =
101b, TA = 125℃
13
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
AERR_Y_Z_00_101_A1 Y-Z Angle error in full 360 degree
x_RANGE(2) = 00b, CONV_AVG =
101b
±0.5
Degree
Degree
Degree
(3)
rotation, 25℃
AERR_X_Z_00_101_A1 X-Z Angle error in full 360 degree
x_RANGE(2) = 00b, CONV_AVG =
101b
±0.5
±0.4
(3)
rotation, 25℃
AERR_X_Y_00_101_A1 X-Y Angle error in full 360 degree
x_RANGE(2) = 00b, CONV_AVG =
101b
(3)
rotation, 25℃
TMAG5170A2
x_RANGE(2) = 00b
x_RANGE(2) = 01b
x_RANGE(2) = 10b
x_RANGE(2) = 00b
x_RANGE(2) = 01b
x_RANGE(2) = 10b
±150
±75
mT
mT
BIN_A2
Linear magnetic range
±300
218
mT
SENS150 _A2
SENS75_A2
SENS300_A2
LSB/mT
LSB/mT
LSB/mT
Sensitivity, X, Y, or Z axis
436
108
Sensitivity error; X, Y, or Z axis, 75mT,
150mT range
SENSER_25C_A2
SENSER_25C_A2
TA = 25℃
±0.5%
±0.5%
±0.5%
±0.5%
±1.6%
±3.5%
±6.0%
±4.5%
±4.0%
±6.2%
Sensitivity error; X, Y, or Z axis, 300mT
range
TA = 25℃
Sensitivity Drift from 25℃ value; X, Y,
or Z axis; 75mT, 150mT range
(1)
SENSDR_A2
TA = –40℃ to 125℃
TA = 25℃ to 125℃
TA = 25℃ to –40℃
Sensitivity Drift from 25℃ value; X, Y,
or Z axis; 300mT range
(1)
SENSDR_A2
Sensitivity Drift from 25℃ value; X, Y,
or Z axis; 300mT range
(1)
SENSDR_A2
SENSLER_XY_A2
SENSLER_Z_A2
SENSLDR_A2
Sensitivity Linearity Error, X, Y-axis
Sensitivity Linearity Error, Z axis
Sensitivity Lifetime drift, X, Y, Z axis
TA = 25℃
TA = 25℃
±0.1%
±0.1%
±0.6%
Sensitivity mismatch among X-Y
axes; 75mT, 150mT range
SENSMS_XY_A2
SENSMS_XY_A2
SENSMS_YZ_A2
SENSMS_YZ_A2
SENSMS_XZ_A2
SENSMS_XZ_A2
TA = 25℃
±0.37%
±0.42%
±0.41%
±0.37%
±0.38%
±1.2%
±0.5%
±0.5%
±0.9%
±0.4%
±0.2%
±0.5%
±0.2%
±2.8%
±5.8%
±4.3%
±6.0%
±3.6%
±7.5%
±4.0%
±5.2%
±7.6%
±4.0%
±5.4%
±8.1%
±5.5%
Sensitivity mismatch among X-Y axes;
300mT range
TA = 25℃
Sensitivity mismatch among Y-Z
axes; 75mT, 150mT range
TA = 25℃
Sensitivity mismatch among Y-Z axes;
300mT range
TA = 25℃
Sensitivity mismatch among X-Z
axes; 75mT, 150mT range
TA = 25℃
Sensitivity mismatch among X-Z axes;
300mT range
TA = 25℃
SENSMS_DR_XY_A2 Sensitivity mismatch drift from 25℃
TA = –40℃ to 125℃
TA = 25℃ to 125℃
TA = 25℃ to -40℃
TA = –40℃ to 125℃
TA = 25℃ to 125℃
TA = 25℃ to -40℃
TA = –40℃ to 125℃
(1)
value; X-Y axes; 75mT, 150mT range
SENSMS_DR_XY_A2 Sensitivity mismatch drift from 25℃
(1)
value; X-Y axes; 300mT range
SENSMS_DR_XY_A2 Sensitivity mismatch drift from 25℃
(1)
value; X-Y axes; 300mT range
SENSMS_DR_YZ_A2 Sensitivity mismatch drift from 25℃
(1)
value; Y-Z axes; 75mT, 150mT range
SENSMS_DR_YZ_A2 Sensitivity mismatch drift from 25℃
(1)
value; Y-Z axes; 300mT range
SENSMS_DR_YZ_A2 Sensitivity mismatch drift from 25℃
(1)
value; Y-Z axes; 300mT range
SENSMS_DR_XZ_A2 Sensitivity mismatch drift from 25℃
(1)
value; X-Z axes; 75mT, 150mT range
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SENSMS_DR_XZ_A2 Sensitivity mismatch drift from 25℃
TA = –40℃ to 125℃
±1.1%
±6.6%
(1)
value; X-Z axes; 300mT range
Boff_A2
Boff_A2
Offset; 75mT, 150mT range
Offset; 300mT range
TA = 25℃
TA = 25℃
–50
±300
±900
µT
µT
–300
Offset drift from value at TA = 25℃; X
(1)
(1)
(1)
(1)
(1)
Boff_DR_A2
Boff_DR_A2
Boff_DR_A2
Boff_DR_A2
TA = 25℃ to 125℃
TA = 25℃ to 125℃
TA = 25℃ to –40℃
TA = 25℃ to –40℃
TA = –40℃ to 125℃
1.0
–1.5
–3.0
–0.4
±5.5 µT/°C
±3.5 µT/°C
2.0 µT/°C
±5.0 µT/°C
or Y axis; 75mT, 150mT range
Offset drift from value at TA = 25℃; Z
axis; 75mT, 150mT range
Offset drift from value at TA = 25℃; X
or Y axis; 75mT, 150mT range
–8.0
Offset drift from value at TA = 25℃; Z
axis; 75mT, 150mT range
Offset drift from value at TA = 25℃;
300mT range
Boff_DR_A2
Boff_DR_A2
NRMS (X, Y)
±2.5
±50
160
±12.0 µT/°C
µT
Offset Lifetime drift
RMS (1 Sigma) magnetic noise (X or
Y-axis)
x_RANGE(2) = 00b; CONV_AVG =
000b, TA = 25℃
x_RANGE(2) = 00b; CONV_AVG =
000b, TA =125℃
x_RANGE(2) = 00b; CONV_AVG =
101b, TA = 25℃
x_RANGE(2) = 00b; CONV_AVG =
101b, TA = 125℃
236
251
41
µT
µT
RMS (1 Sigma) magnetic noise (X or
Y-axis)
NRMS (X, Y)
NRMS (X, Y)
NRMS (X, Y)
NRMS (Z)
193
28
RMS (1 Sigma) magnetic noise (X or
Y-axis)
µT
RMS (1 Sigma) magnetic noise (X or
Y-axis)
34
46
µT
RMS (1 Sigma) magnetic noise (Z
axis)
Z_RANGE = 00b; CONV_AVG =
000b, TA = 25℃
72
85
µT
RMS (1 Sigma) magnetic noise (Z
axis)
Z_RANGE = 00b; CONV_AVG =
000b, TA = 125℃
NRMS (Z)
84
98
µT
RMS (1 Sigma) magnetic noise (Z
axis)
Z_RANGE = 00b; CONV_AVG =
101b, TA = 25℃
NRMS (Z)
13
16
µT
RMS (1 Sigma) magnetic noise (Z
axis)
Z_RANGE = 00b; CONV_AVG =
101b, TA = –40℃ to 125℃
NRMS (Z)
15
18
µT
AERR_Y_Z_00_101_A2 Y-Z Angle error in full 360 degree
x_RANGE(2) = 00b, CONV_AVG =
101b
±0.5
±0.5
±0.40
Degree
Degree
Degree
(3)
rotation, 25℃
AERR_X_Z_00_101_A2 X-Z Angle error in full 360 degree
x_RANGE(2) = 00b, CONV_AVG =
101b
(3)
rotation, 25℃
AERR_X_Y_00_101_A2 X-Y Angle error in full 360 degree
x_RANGE(2) = 00b, CONV_AVG =
101b
(3)
rotation, 25℃
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
TEMPERATURE COMPENSATION
Temperature compensation (no
compensation)
TC
TC
TC
TC
MAG_TEMPCO =00b
MAG_TEMPCO =01b
MAG_TEMPCO =10b
MAG_TEMPCO =11b
0
0.12
0.03
0.2
%/°C
%/°C
%/°C
%/°C
Temperature compensation (for
NdBFe magnet)
Temperature compensation (for SmCo
magnet)
Temperature compensation (for
Ceramic magnet)
(1) Drift at any temperature can be calculated from drift values at 125°C or –40°C. For example, drift at 85℃ = ((85 – 25) / (125 – 25)) ×
(drift at 125℃); similarly, drift at –20℃ = ((25 – (–20)) / (25 – (–40))) × (drift at –40℃).
(2) x_RANGE denotes the X_RANGE, Y_RANGE, or Z_RANGE register bits
(3) Angle measurement is performed in static condition. The input sinusoidal magnetic fields have peak magnitudes equal to 80% of the
magnetic full range. Offset and gain corrections have been performed at 25℃.
6.7 Power up Timing
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
VCC = 5.5V
tstart_power_up Time to start up after VVCC supply voltage crossing VVCC_MIN
246
40
350 µs
50 µs
µs
tstart_sleep
tgo_sleep
Time to activate from sleep mode
Time to go into sleep mode after CS goes high
50
tstart_deep_sleep Time to start up from deep sleep mode
246
75
350 µs
µs
tstart_deep_sleep Time to go into deep sleep mode after CS goes high
tstand_by
Time to go to Stand-by mode from Configuration mode
90
µs
Setup time between CS going low and SCK start during
sleep mode
tspi_sleep
8
10 µs
VCC =2.3V
tstart_power_up Time to start up after VCC supply voltage crossing VCC_MIN
260
40
500 µs
50 µs
µs
tstart_sleep
tgo_sleep
Time to activate from sleep mode
Time to go into sleep mode after CS goes high
60
tstart_deep_sleep Time to start up from deep sleep mode
260
75
500 µs
µs
tstart_deep_sleep Time to go into deep sleep mode after CS goes high
tstand_by
tspi_sleep
Time to go to Stand-by mode from Configuration mode
90
µs
Delay time between CS going low and SCK start during
sleep mode
8
10 µs
6.8 SPI Interface Timing
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
SPI Interface
fSPI
SPI clock (SCK) frequency
LOAD = 25 pF
10 MHz
twhigh
twlow
High time: SCK logic high time duration
Low time: SCK logic low time duration
45
45
ns
ns
CS setup time: Time delay between falling edge of CS and rising
edge of SCK
tsu_cs
th_cs
45
45
ns
ns
Hold time: Time between the falling edge of SCK and rising edge
of CS
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
Delay time: Time delay from falling edge of CS to data valid at
SDO
tpd_soen
45
55
ns
ns
Delay time: Time delay from rising edge of CS to SDO transition
to tristate
tpd_sodis
tsu_si
th_si
SDI setup time: Setup time of SDI before the rising edge of SCK
Hold time: Time between the rising edge of SCK to SDI valid
Propagation delay from falling edge of SCK to SDO
25
25
ns
ns
ns
tpd_so
45
10
SPI transfer inactive time (time between two transfers) during
which CS must remain high.
tw_cs
LOAD = 25 pF
100
ns
µs
Setup time between CS going low and SCK start during sleep
mode
tspi_sleep
8
6.9 Typical Characteristics
100
200
175
150
125
100
75
−40C
0C
20C
85C
125C
150C
−40C
0C
20C
85C
125C
150C
75
50
25
0
50
25
0
0
4
8
12
16
20
24
28
32
0
4
8
12
16
20
24
28
32
Conversion Average
Conversion Average
Figure 6-1. Z-Axis Noise vs. Conversion Average, 25-mT Range
Figure 6-2. X, Y-Axis Noise vs. Conversion Average, 25-mT
Range
100
200
−40C
0C
−40C
0C
175
150
125
100
75
20C
20C
85C
125C
150C
85C
125C
150C
75
50
25
0
50
25
0
0
4
8
12
16
20
24
28
32
0
4
8
12
16
20
24
28
32
Conversion Average
Conversion Average
Figure 6-3. Z-Axis Noise vs. Conversion Average, 50-mT Range
Figure 6-4. X, Y-Axis Noise vs. Conversion Average, 50-mT
Range
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6.9 Typical Characteristics (continued)
100
200
175
150
125
100
75
−40C
0C
20C
85C
125C
150C
−40C
0C
20C
85C
125C
150C
75
50
25
0
50
25
0
0
4
8
12
16
20
24
28
32
0
4
8
12
16
20
24
28
32
Conversion Average
Conversion Average
Figure 6-5. Z-Axis Input vs. Conversion Average, 75-mT Range
Figure 6-6. X, Y-Axis Noise vs. Conversion Average, 75-mT
Range
100
200
−40C
0C
−40C
0C
175
150
125
100
75
20C
20C
85C
125C
150C
85C
125C
150C
75
50
25
0
50
25
0
0
4
8
12
16
20
24
28
32
0
4
8
12
16
20
24
28
32
Conversion Average
Conversion Average
Figure 6-7. Z-Axis Noise vs. Conversion Average, 100-mT
Range
Figure 6-8. X, Y-Axis Noise vs. Conversion Average, 100-mT
Range
100
200
−40C
0C
−40C
0C
175
150
125
100
75
20C
20C
85C
125C
150C
85C
125C
150C
75
50
25
0
50
25
0
0
4
8
12
16
20
24
28
32
0
4
8
12
16
20
24
28
32
Conversion Average
Conversion Average
Figure 6-9. Z-Axis Noise vs. Conversion Average, 150-mT
Range
Figure 6-10. X, Y-Axis Noise vs. Conversion Average, 150-mT
Range
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6.9 Typical Characteristics (continued)
125
250
200
150
100
50
−40C
0C
20C
85C
125C
150C
−40C
0C
20C
85C
125C
150C
100
75
50
25
0
0
0
4
8
12
16
20
24
28
32
0
4
8
12
16
20
24
28
32
Conversion Average
Conversion Average
Figure 6-11. Z-Axis Noise vs. Conversion Average, 300-mT
Range
Figure 6-12. X, Y-Axis Noise vs. Conversion Average, 300-mT
Range
6000
0.5
VCC = 2.3 V
VCC = 3.3 V
VCC = 5.5 V
−40C
0C
5500
5000
4500
4000
3500
3000
20C
0.4
85C
125C
150C
0.3
0.2
0.1
0
-40 -20
0
20
40
60
80 100 120 140 160
0
4
8
12
16
20
24
28
32
Temperature [C]
Conversion Average
Figure 6-14. Active Mode Supply Current vs. Temperature
Figure 6-13. Temperature Sensor Noise vs. Conversion Average
2000
500
VCC = 2.3 V
VCC = 3.3 V
VCC = 5.5 V
VCC = 2.3 V
VCC = 3.3 V
VCC = 5.5 V
400
1500
1000
500
0
300
200
100
0
-40 -20
0
20
40
60
80 100 120 140 160
-40 -20
0
20
40
60
80 100 120 140 160
Temperature [C]
Temperature [C]
Figure 6-15. Standby Mode Supply Current vs. Temperature
Figure 6-16. Configuration Mode Supply Current vs.
Temperature
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6.9 Typical Characteristics (continued)
5
4
3
2
1
0
VCC = 2.3 V
VCC = 3.3 V
VCC = 5.5 V
-40 -20
0
20
40
60
80 100 120 140 160
Temperature [C]
Figure 6-17. Sleep Mode Supply Current vs. Temperature
Figure 6-18. Deep Sleep Mode Supply Current vs. Temperature
1
0.8
0.6
0.4
0.2
0
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-0.2
-0.4
-0.6
-0.8
-1
0
50
100
150
200
250
300
350
0
50
100
150
200
250
300
350
Forced Angle (Degree)
Forced Angle (Degree)
Figure 6-19. Angle Error at 25℃, X-Y Configuration, 50-mT
Figure 6-20. Angle Error at 25℃ , X-Z Configuration, 50-mT
Range
Range
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
0
50
100
150
200
250
300
350
Forced Angle (Degree)
Figure 6-21. Angle Error at 25℃ , Y-Z Configuration, 50-mT Range
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7 Detailed Description
7.1 Overview
The TMAG5170 IC is based on the Hall-effect technology and precision mixed signal circuitry from Texas
Instruments. The output signals (raw X, Y, Z Magnetic data and Die temperature data) is provided through the
SPI. The device can be configured in multiple settings through user access registers through the SPI.
The IC consists of the following functional and building blocks:
•
The Power Management & Oscillator block contains a low-power oscillator, biasing circuitry, undervoltage and
overvoltage detection circuitry, and a fast oscillator.
•
The sensing and temperature measurement block contains the Hall biasing, Hall sensors with multiplexers,
noise filters, integrator circuit, temperature sensor, and the ADC. The Hall sensor data and temperature data
are multiplexed through the same ADC.
•
•
The Interface block contains the SPI control circuitry, ESD protection circuits, and all the I/O circuits. The
TMAG5170 supports SPI along with integrated cyclic redundancy check (CRC).
The diagnostic blocks are embedded in the circuitry to enable mandatory and user-enabled diagnostic
checks.
7.2 Functional Block Diagram
VCC
SCK
SDO
SDI
Power Management and Oscillator
Result Registers
ADC
Z
Y
X
+
Gain and
Filtering
Interface
MUX
–
Config Registers
Temperature sensor
CS
Digital Core
ALERT
GND
7.3 Feature Description
7.3.1 Magnetic Flux Direction
The TMAG5170 is sensitive to the magnetic field component in X, Y, and Z directions. The X and Y fields are in
plane with the package. The Z filed is perpendicular to the top of the package. The device is sensitive to both
magnetic north and south poles in each axis. As shown in Figure 7-1, the device will generate positive ADC
codes in response to a magnetic south pole in the proximity. Similarly, the device will generate negative ADC
codes if magnetic north poles approach from the same directions.
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N
S
1
2
3
4
Figure 7-1. Direction of Applied Magnetic South Pole to Generate Positive ADC Codes
7.3.2 Sensor Location
Figure 7-2 shows the location of X, Y, Z Hall elements inside the TMAG5170.
1.54-mm
Y
X
Z
1.77-mm
Figure 7-2. Location of X, Y, Z Hall Elements
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7.3.3 Magnetic Range Selection
Table 7-1 shows the magnetic range selection for the TMAG5170 device. Each axis range can be independently
selected irrespective of the others.
Table 7-1. Magnetic Range Selection
RANGE REGISTER SETTING
X_RANGE = 00b
X_RANGE = 01b
X_ RANGE = 10b
Y_RANGE = 00b
Y_RANGE = 01b
Y_RANGE = 10b
Z_RANGE = 00b
Z_RANGE = 01b
Z_RANGE = 10b
TMAG5170A1
TMAG5170A2
±150 mT
±75 mT
COMMENT
±50 mT
X Axis Field
Y Axis Field
Z Axis Field
±25 mT
Best resolution case
±100 mT
±50 mT
±300 mT
±150 mT
±75 mT
Highest range, best SNR case
±25 mT
Best resolution case
±100 mT
±50 mT
±300 mT
±150 mT
±75 mT
Highest range, best SNR case
±25 mT
Best resolution case
±100 mT
±300 mT
Highest range, best SNR case
7.3.4 Update Rate Settings
The TMAG5170 offers multiple update rates for system design flexibility. Figure 7-4 shows the different update
rates for the TMAG5170 during continuous conversion.
Table 7-2. Update Rate Settings
UPDATE RATE
TWO AXIS
13.3 ksps
8.0 ksps
OPERATING
MODE
REGISTER SETTING
COMMENT
SINGLE AXIS
20 ksps
THREE AXIS
10 ksps
X, Y, Z Axis
X, Y, Z Axis
X, Y, Z Axis
X, Y, Z Axis
X, Y, Z Axis
X, Y, Z Axis
CONV_AVG = 000b
CONV_AVG = 001b
CONV_AVG = 010b
CONV_AVG = 011b
CONV_AVG = 100b
CONV_AVG = 101b
Fastest update rate
13.3 ksps
8.0 ksps
5.7 ksps
3.1 ksps
1.6 ksps
0.8 ksps
0.4 ksps
4.4 ksps
4.4 ksps
2.4 ksps
2.4 ksps
1.2 ksps
1.2 ksps
0.6 ksps
Best SNR case
7.3.5 ALERT Function
The ALERT pin of the TMAG5170 supports multiple operating modes targeting different applications.
7.3.5.1 Interrupt and Trigger Mode
With ALERT_MODE at default value of 0b, the ALERT output can be configured to generate an interrupt signal
for microcontroller when a user-defined event occurs. A user-defined event can be a conversion completion or
an error from diagnostic tests. The ALERT pin can also be used in this mode to trigger a conversion start using
the TRIGGER_MODE register bit.
7.3.5.2 Magnetic Switch Mode
With ALERT_MODE set at 1b, the ALERT output is configured as a magnetic switch. One or multiple magnetic
channels can be selected in the ALERT_CONFIG register. The magnetic switch thresholds are determined by
the *_THRX_CONFIG register bits setting. If the measured magnetic field is greater than *_HI_THRESHOLD,
or smaller than *_LO_THRESHOLD, the ALERT output will assert low. Figure 7-3 shows the magnetic switch
function using the X-axis magnetic field as an example.
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X Channel Magnetic
Field (mT)
X_HI_THRESHOLD (mT)
X_LO_THRESHOLD (mT)
ALERT (V)
time
Magnetic field crossing X_HI_THRESHOLD & X_LO_THRESHOLD levels
X Channel Magnetic
Field (mT)
X_HI_THRESHOLD (mT)
X_LO_THRESHOLD (mT)
ALERT (V)
time
Magnetic field crossing only X_HI_THRESHOLD levels
Figure 7-3. ALERT Pin Working as Magnetic Switch
7.3.6 Threshold Count
The THRX_COUNT bits in the ALERT_CONFIG register offer robust noise filtering and immunity against
false tripping while the TMAG5170 implements the ALERT function for a specific magnetic or temperature
threshold crossing. With THRX_COUNT at default 00b, only one measured value must cross the threshold to
be considered a valid threshold crossing event. With THRX_COUNT at 11b, four successive measured values
must cross the threshold to be considered a valid threshold crossing. An internal counter tracks and records the
number of threshold crossing for a given sensor.
The counter resets if any of the below events occur:
•
The device meets the threshold cross count for the specified number per the THRX_COUNT bits, the
corresponding *CH_THX bit(s) are set, and the SPI read of the SYS_STATUS register has occurred
If a measured result does not cross the threshold
•
When the ALERT pin is configured to work as a magnetic switch, the threshold count is active for both low-to-
high and high-to-low transitions, offering noise immunity in both directions of the threshold cross.
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7.3.7 Diagnostics
The TMAG5170 supports several device and system level diagnostics features to detect, monitor, and report
failures during the device operation.
In the event of a failure, the TMAG5170 reports back to the controller through the following mechanisms:
•
•
•
•
ERROR_STAT bit during the SDO read frame
Direct read of the status registers through the SPI
ALERT pin response to indicate a failure, if enabled
No response through SDO line, or CRC error during SPI communication
The TMAG5170 performs the following device and system level checks:
7.3.7.1 Memory CRC Check
This diagnostic mechanism checks the content of the internal memory by comparing a calculated CRC of the
read content against a factory-programmed expected CRC value. During runtime, when the internal memory is
read again for configuration for different channels, the CRC is checked again, providing detection of memory
errors even during runtime.
Run Mode
Continuous
Configuration Register(s)
Fault Register Bit
Impact if disabled
N/A
TRIM_STAT
N/A. Cannot be disabled
7.3.7.2 ALERT Integrity Check
This diagnostic mechanism checks and compares the read back value of the ALERT pin to the value that is
driven by the device. This will check the presence of an external short on ALERT pin to a higher voltage such
as VCC which will prevent device to indicate a fault. When the controller is driving the ALERT pin to trigger a
measurement, it can read the ALRT_LVL bit to check if the correct polarity of the ALERT was detected by the
device, thus checking any failures on the pin.
Run Mode
Continuous
Configuration Register(s) N/A
Fault Register Bit
Impact if disabled
ALRT_DRV and ALRT_LVL
When driven by device N/A. Cannot be disabled. When driven by controller, device may not detect a new
measurement command and still report old measurement data.
7.3.7.3 VCC Check
This diagnostic mechanism continuously checks the external voltage supply on VCC pin and flags a fault if the
supply is out of range.
Run Mode
Continuous
Data Sheet Parameters
Fault Register Bit
Impact if disabled
VVCC_UV, VVCC_OV
VCC_UV and VCC_OV
N/A. Cannot be disabled.
7.3.7.4 Internal LDO Under Voltage Check
This diagnostic mechanism continuously monitors the internal regulator that supplies the critical analog blocks
and Hall sensor biasing, and flags a fault if the internal regulator falls below a threshold after which the accuracy
of the magnetic field measurement cannot be guaranteed.
Run Mode
Continuous
N/A
Data Sheet Parameters
Fault Register Bit
LDO_STAT
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Impact if disabled
N/A. Cannot be disabled.
7.3.7.5 Digital Core Power-on Reset Check
This diagnostic mechanism continuously monitors the internal regulator that supplies the internal digital core,
and puts the device in reset if the digital core cannot function reliably. The occurrence of the fault is detected by
reading the CFG_RESET bit which can only be set at power up or if the digital core was reset.
Run Mode
Continuous
Data Sheet Parameters
Fault Register Bit
Impact if disabled
N/A
CFG_RESET
N/A. Cannot be disabled.
7.3.7.6 SDO Output Check
This diagnostic mechanism continuously compares the internally driven value by device on the SDO pin to the
read-back value on SDO pin to detect any shorts to ground or power supply.
Run Mode
Continuous, every time a SPI transaction is initiated
Data Sheet Parameters
Fault Register Bit
Impact if disabled
N/A
SDO_DRV
N/A. Cannot be disabled.
7.3.7.7 Communication CRC Check
This diagnostic mechanism for every SPI transaction will compute the CRC of the received SPI frame from the
controller and check the CRC against the CRC value transmitted by the controller, and flag a fault if the values
do not match. The device also embeds a CRC value as part of the SPI frame in the response for the controller
to check the integrity of the received data. This check detects faults with SPI communication block in digital core
and the SPI I/O buffers and also controller to check for any faults on the SPI external to the device.
Another check is also run in the background that counts the number of SPI clocks in a SPI frame and flags a
fault if the number of clocks sent by the controller is not same as the expected value. This can help controller
detect any issues with the SPI.
Run Mode
Continuous, every time a SPI transaction is initiated
Configuration Register(s) CRC_DIS to disable CRC in the SPI protocol
Fault Register Bit
Impact if disabled
CRC_STAT, FRAME_STAT
If CRC is disabled, then any fault with SPI communication will not be detected and incorrect value of measured
field can be reported.
7.3.7.8 Oscillator Integrity Check
This diagnostic mechanism allows the controller to check any hardware fault with the internal oscillator. With
this check, any drift of internal oscillators can be checked. The high-frequency oscillator is critical for precision
measurement of the magnetic field and low-power oscillator is critical to control wake-up and sleep mode and
other state machine control.
To run this check, external software code on the controller is required. The controller has to instate the check
by setting the OSC_CNT_CTL bits to select a particular oscillator and start the internal count on the device. At
the same time, the controller should also start a counter using its own timebase. After a pre-determined time, the
controller should issue a stop to the oscillator count by setting OSC_CNT_CTL=0x3 and read the OSC_COUNT.
The read value of the OSC_COUNT should not exceed the value based off maximum fHFOSC, fLFPOSC in the
specification section. Variation of controller clock speed and SPI communication timing need to be considers
while calculating the error margin for the OSC_COUNT.
Run Mode
On-demand as run by the external controller
Data Sheet Parameter(s) fHFOSC, fLFPOSC
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Configuration Register(s) OSC_CNT_CTL
Fault Register Bit
Impact if disabled
OSC_COUNT
If the controller decides not to run this test, then any drift of HF oscillator can impact the accuracy of the reported
sensor data
7.3.7.9 Magnetic Field Threshold Check
This diagnostic mechanism allows the controller to monitor the external applied field. The controller can use this
check to determine if a magnetic field is present within specified thresholds. This check, though used as check
at system level, can also indicate any gross problems with the signal path if a field much outside the expected
range is detected and reported.
To run this check, the controller must enable the check separately for each axis and also set the thresholds for
each axis independently. The user can configure the ALERT pin to toggle if the threshold crossed, which is also
reported in the user register.
Run Mode
Every time a magnetic measurement is initiated and completed
Configuration Register(s) X_HLT_EN, Y_HLT_EN, Z_HLT_EN to enable test. X_THRX_CONFIG, Y_THRX_CONFIG, Z_THRX_CONFIG to
set threshold
Fault Register Bit
Impact if disabled
XCH_THX, YCH_THX, ZCH_THX
If disabled, it does not have impact on device-level failure detection but at system level. Examples of system
failure would be loss of magnet, magnet too far, or too close to the sensor.
7.3.7.10 Temperature Alert Check
This diagnostic mechanism allows the controller to monitor the junction temperature of the die, which is also an
indication of the ambient temperature as the device does not generate significant self-heating. This is useful to
monitor the temperature at the system level accurately and alert the controller if the temperature is exceeded. It
can also be used to warn the controller if the die temperature due to some internal failure has increased beyond
the expected range.
To run this check, the controller must enable the temperature check and set the threshold. The user can
configure the ALERT pin to toggle if the threshold crossed, which is also reported in the user register.
Run Mode
Every time a magnetic measurement is initiated and completed
Configuration Register(s) T_HLT_EN to enable test. T_THRX_CONFIG to set threshold
Fault Register Bit
Impact if disabled
TEMP_THX
If disabled, it does not have impact on device-level failure detection but at system level increase or decrease of
temperature.
7.3.7.11 Analog Front-End (AFE) Check
This diagnostic mechanism allows the controller to check the performance of the analog signal path. In this
check, the device disconnects the Hall sensor from the signal path and uses an alternate resistance bridge
to create a known, predetermined signal as an input to the signal path. This mechanism then checks if
the measured digital value compared to a fixed value from the factory is within a pre-programmed, factory-
determined value. This mechanism can detect issues with multiplexers, offset cancellation mechanism, the gain
stages, the low-pass filter, and the ADC, as well.
To run this check, the controller must enable the check and set the scheduling for the run. During this check, the
AFE is not available for magnetic field conversion. The user can configure the ALERT pin to toggle if an error is
detected. This error is also reported in the user register.
Run Mode
Every time a magnetic measurement is initiated and completed
DIAG_EN to enable test. DIAG_SEL to schedule when the test is run
SENS_STAT
Configuration Register(s)
Fault Register Bit
Impact if disabled
If disabled, any failures or drift with the analog front-end signal path may not be detected.
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7.3.7.12 Hall Resistance and Switch Matrix Check
This diagnostic mechanism allows the controller to check if the sensitivity of the Hall sensor is within the
factory-determined limits by checking the resistance of the Hall-effect sensor. In this check, the biasing and
multiplexing control of all directions of the Hall sensor (X, Y and Z) are also checked.
To run this check, the controller must enable the check and set the scheduling for the run. During this check, the
Hall sensor is not available for magnetic field conversion. The user can configure the ALERT pin to toggle if an
error is detected. This error is also reported in the user register.
Run Mode
Every time a magnetic measurement is initiated and completed
Configuration Register(s) DIAG_EN to enable test. DIAG_SEL to schedule when the test is run
Fault Register Bit
Impact if disabled
ZHS_STAT, YHS_STAT and XHS_STAT
If disabled, any failures or drift in the Hall-effect sensor properties and biasing will not be detected, leading to
potentially incorrect magnetic field conversion
7.3.7.13 Hall Offset Check
This diagnostic mechanism allows the controller to check if the offset of the Hall sensor is within the factory-
determined limits and the offset cancellation circuitry is working properly.
To run this check, the controller must enable the check and set the scheduling for the run. During this check, the
AFE is not available for magnetic field conversion. The user can configure the ALERT pin to toggle if an error is
detected. This error is also reported in the user register.
Run Mode
Every time a magnetic measurement is initiated and completed
Configuration Register(s) DIAG_EN to enable test. DIAG_SEL to schedule when the test is run
Fault Register Bit
Impact if disabled
SENS_STAT
If disabled, any failures with offset cancellation mechanism or large drift of Hall-effect sensor may not be
detected, leading to potentially incorrect magnetic field conversion.
7.3.7.14 ADC Check
This diagnostic mechanism checks ADC functionality and conversion. This check is done by converting a known
bandgap voltage, which is completely independent of the ADC reference, and comparing the voltage against the
factory-determined tolerance limits.
To run this check, the controller must enable the check and set the scheduling for the run. During this check the
AFE is not available for magnetic field conversion. The user can configure the ALERT pin to toggle if an error is
detected. This error is also reported in the user register.
Run Mode
Every time a magnetic measurement is initiated and completed
Configuration Register(s) DIAG_EN to enable test. DIAG_SEL to schedule when the test is run
Fault Register Bit
Impact if disabled
TEMP_STAT
If disabled, any failures with ADC conversion will not be detected, leading to potentially incorrect errors in the
converted magnetic field values.
7.4 Device Functional Modes
7.4.1 Operating Modes
The TMAG5170 supports multiple operating modes for wide array of applications as explained in Figure 7-4.
The device starts powering up after the VCC supply crosses the minimum threshold as specified in the
Recommended Operating Conditions table. Any particular operating mode can be selected by setting the
corresponding OPERATING_MODE register bits.
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Device Startup: (VCC crossing VCC_UV
)
Deep Sleep Mode
tstart_power_up
Wake-up &
Sleep Mode
Sleep Mode
tstart_deep_sleep
tstart_sleep
Configuration Mode
(Default Power-up Mode)
tstand_by
Stand-by Mode
tmeasure
Active Hall/ Temp Measure
Figure 7-4. TMAG5170 Power-Up Sequence
Table 7-3 shows different power saving modes of the TMAG5170.
Table 7-3. Comparing Operating Modes
INITIALIZATION TIME TO START
CONVERSION(1)
OPERATING MODE
Active Conversion
Standby Mode
DEVICE FUNCTION
DATA CONVERSION
Continuously measuring X, Y, Z axis, or
temperature data
Supports continuous and trigger
mode conversion
10 µs
35 µs
Device is ready to accept SPI commands
and start active conversion
Supports trigger mode conversion
Configuration Mode SPI and user configuration registers active tstand_by + 35 µs
Supports trigger mode conversion
1, 5, 10, 15, 20, 30, 100, 500, and
Wake-up & Sleep
Mode
Wakes up at a certain interval to measure
the X, Y, Z axis, or temperature data
tstart_sleep + tstand_by + 35 µs
1000-ms intervals supported(1)
.
The microcontroller can use sleep
mode to implement other power
saving intervals not supported by
wake-up and sleep mode.
Device retains key configuration settings,
and last measurement data
Sleep Mode
tstart_sleep + tstand_by + 35 µs
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Table 7-3. Comparing Operating Modes (continued)
INITIALIZATION TIME TO START
OPERATING MODE
DEVICE FUNCTION
CONVERSION(1)
DATA CONVERSION
Device does not retain key configuration
settings, and last measurement data
No conversion start is supported
during deep-sleep mode
Deep-sleep Mode
tstart_deep_sleep + tstand_by + 35 µs
(1) The timing numbers are typical parameters. Their value may vary depending on the internal oscillator frequency.
7.4.1.1 Active Mode
The TMAG5170 converts the magnetic sensor or temperature data during active mode. Active mode supports
both continuous conversion and trigger mode conversion based off the OPERATING_MODE setting. Continuous
operation at this mode is useful for applications where the fastest data conversion is required, and power budget
is not stringent. In the Active trigger mode, a controller can trigger a conversion through one of several trigger
mechanisms as described in the TRIGGER_MODE register bits. When the conversion started, the time it takes
to finish a conversion is denoted by tmeasure. The conversion time can vary widely based off the MAG_CH_EN,
CONV_AVG, DIAG_SEL, and DIAG_EN register bits setting. The average current consumption during the active
conversion is IACT
.
7.4.1.2 Standby Mode
In the standby mode, the TMAG5170 is ready to start sensor conversion with a trigger command from a
controller. Several trigger methods are supported as defined in the TRIGGER_MODE register bits. During this
operating mode the relevant analog and digital support circuitry remain active to enable a faster conversion start.
The average current consumption during this mode is denoted by ISTDBY. The time it takes for the device to go to
standby mode from configuration mode is denoted by tstand_by
.
7.4.1.3 Configuration Mode (DEFAULT)
At power up, the TMAG5170 goes into the default configuration mode. In this mode, the SPI communication and
user register access are enabled. A controller may configure the device to select the desired operating mode,
sensor data conversion, enable/ disable diagnostic features, and so forth. The average current consumption
during this mode is denoted by ICFG. Similar to the standby mode, the configuration mode also supports sensor
conversion start with a trigger. However, the configuration mode takes longer time to start the sensor conversion,
and consumes approximately ten times less current compared to standby mode.
7.4.1.4 Sleep Mode
The TMAG5170 supports the sleep mode where it retains the user configuration settings and previous
conversion results. A controller can wake up the device from sleep mode through either the SPI communication
or the ALERT signal. The average power consumption in this mode is denoted by ISLP. The time it takes for the
device to go to the configuration mode from the sleep mode is denoted by tstart_sleep
.
7.4.1.5 Wake-Up and Sleep Mode
The TMAG5170 supports the wake-up and sleep mode where the device is configured to wake up at a certain
time interval, and perform the sensor conversion as defined in the SENSOR_CONFIG register setting. When
the sensor conversion is complete, an ALERT signal can be generated to notify the controller that the new
conversion data is ready. It is possible to generate an ALERT signal only in the event a particular magnetic or
temperature threshold is exceeded. Detail setting on ALERT signal is specified in the ALERT_CONFIG register.
A controller can wake up the TMAG5170 and access the conversion data at any time. The average power
consumption in the wake-up and sleep mode is denoted by IVCC_DCM. The time it takes for the device to go to
configuration mode from wake-up and sleep mode is denoted by tstart_sleep
.
7.4.1.6 Deep-Sleep Mode
For ultra-low power system, the TMAG5170 supports a deep-sleep mode to conserve power. In this mode, the
TMAG5170 does not retain the user configuration or previous result data. The device reverts back to factory
setting in this mode. The average power consumption in this mode is IDEEP_SLP. The time it takes for the device
to go to the configuration mode from the deep-sleep mode is denoted by tstart_sleep
.
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7.5 Programming
7.5.1 Data Definition
7.5.1.1 Magnetic Sensor Data
The X, Y, and Z magnetic sensor data are stored in the X_CH_RESULT, Y_CH_RESULT, and Z_CH_RESULT
registers, respectively. The 12-bit ADC output is stored in 16-bit result registers in 2's complement format as
shown in Figure 7-5. With fastest conversion (CONV_AVG = 000b), the ADC output loads the 12 MSB bits of the
16-bit result register along with 4 LSB bits as zeros. With CONV_AVG ≠ 000b, all the 16 bits are used to store
the results. With DATA_TYPE = 00b, the 16-bit magnetic sensor data can be accessed through regular 32-bit
SPI read. Use Equation 1 to calculate the measured magnetic field.
14
i = 0
15
− D × 2
i
+ ∑
D × 2
i
15
B =
× 2 B
R
(1)
16
2
where
•
•
•
B is magnetic field in mT.
Di is the data bit as shown in Figure 7-5.
BR is the magnetic range in mT for the corresponding channel.
12-bit data when CONV_AVG = 000b
Additional 4-bit LSB data when
CONV_AVG B 000b
Figure 7-5. Magnetic Sensor Data Definition
With DATA_TYPE ≠ 00b, the 12 MSB bits (D04 to D15) from the magnetic result registers can be accessed. In
this mode, use Equation 2 to calculate the measured magnetic field.
14
+ ∑
11
− D × 2
i − 4
D × 2
15
i = 4
12
i
B =
× 2 B
R
(2)
2
7.5.1.2 Temperature Sensor Data
The TMAG5170 temperature sensor will measure temperature from –40°C to 170°C. Figure 7-6 shows the
temperature stored in the 16-bit TEMP_RESULT register. With DATA_TYPE = 00b, the 16-bit temperature data
can be accessed through regular 32-bit SPI read. Use Equation 3 to calculate the temperature.
6#&%6 F 6#&%60
6 = 6
+
5'05_60
6#&%4'5
(3)
where
•
•
•
•
T is the measured temperature in degree Celsius.
TSENS_T0 is the reference temperature in degree Celsius as listed in the Electrical Characteristics table.
TADCRES is the change in ADC code per degree Celsius as listed in the Electrical Characteristics table.
TADCT0 is the TEMP_RESULT decimal value at reference temperature, TSENS_T0 as listed in the Electrical
Characteristics table.
•
TADCT is the measured TEMP_RESULT decimal value for temperature T.
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With DATA_TYPE ≠ 00b, the 12 MSB bits from the TEMP_RESULT register can be accessed. In this mode, use
Equation 4 to calculate the temperature.
6#&%
16
6#&%4'5
16 × @6#&%6 F
60A
6 = 6
+
5'05_60
(4)
Binary data for temperature
Figure 7-6. Temperature Sensor Data Definition
7.5.1.3 Magnetic Sensor Offset Correction
Figure 7-7 shows that the TMAG5170 can enable offset correction for a pair of magnetic axes. The magnetic
axes and order are selected based off the ANGLE_EN register bit settings. The MAG_OFFSET_CONFIG
register stores the offset values to be corrected in 2's complement data format. The selection and order of the
sensors are defined in the ANGLE_EN register bits setting. The default value of these offset correction registers
are set as zero.
ΔOffset
0mT Reference Axis
Figure 7-7. Magnetic Sensor Data Offset Correction
Use Equation 5 and Equation 6 to calculate the amount of offset for each axis. As an example, with a ±50mT
magnetic range for X and Z axes, MAG_OFFSET_CONFIG set at 1110 0000 0011 0000b, ANGLE_EN set at
11b. With these conditions the offset correction for the X axis is −1.56mT and Z axis is 1.17mT. The offset values
are added to the sensor conversion results before loading into the corresponding result registers.
5
6
i
− D × 2 + ∑ × 2
D
13
i = 0 i + 7
Δ
=
× 2 B
R
(5)
Offset_Value1
12
2
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5
i = 0
6
i
− D × 2 + ∑
D × 2
i
6
∆
=
× 2 B
R
(6)
Offset
Value2
12
2
where
•
•
•
•
ΔOffset_Value1 is the amount of offset correction (in mT) to be applied for first axis.
ΔOffset_Value2 is the amount of offset correction (in mT) to be applied for second axis.
Di is the data bit in the offset MAG_OFFSET_CONFIG register.
BR is the magnetic range in mT for the corresponding channel.
7.5.1.4 Angle and Magnitude Data Definition
The TMAG5170 calculates the angle based off the ANGLE_EN register bit settings. Figure 7-8 shows that the
ANGLE_RESULT register stores the angle information in the 13-LSB bits. Bits D04-D12 store angle integer
value from 0 to 360 degree. Bits D00-D03 store fractional angle value with a resolution of 1/16 degree. The
3-MSB bits are always populated as b000. The TMAG5170 CORDIC offers angle resolution of 1/4 degree. An
external CORDIC may be used if higher angle resolution is required. Use Equation 7 to calculate the angle.
3
i
∑
D × 2
i
12
i = 4
i − 4
i = 0
16
A = ∑
D × 2
+
(7)
i
where
•
•
A is the angle measured in degree.
Di is the data bit as shown in Figure 7-8.
For example: a 354.50 degree is populated as 0001 0110 0010 1000b and a 17.25 degree is populated as 0000
0001 0001 0100b.
With DATA_TYPE ≠ 00b, the D01-D12 bits from the ANGLE_RESULT register can be accessed. In this mode,
the angle fractional value is represented by 3 bit with resolution of 1/8 degree. Use Equation 8 to calculate the
angle in degree.
3
i = 1
i − 1
∑
D × 2
12
i = 4
i − 4
i
A = ∑
D × 2
+
(8)
i
8
Reserved bits
9-bit Angle integer value
4-bit Angle fraction value
0
0 0
Figure 7-8. Angle Data Definition
During the angle calculation, use Equation 9 to calculate the resultant vector magnitude.
2
/ = /#&%%D12 + /#&%%D2
§
(9)
where
•
MADCCh1, MADCCh2 are the ADC codes of the two magnetic channels selected for the angle calculation.
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Figure 7-9 shows the magnitude value stored in the MAGNITUDE_RESULT register. This value should be
constant during 360 degree angle measurements.
Reserved bits
13-bit Magnitude result data
0
0 0
Figure 7-9. Magnitude Result Data Definition
The magnitude result can be accessed through SPI in 16-bit or 12-bit formats. In the 12-bit format, bit D01 to bit
D12 are sent through the SPI.
7.5.2 SPI Interface
The Serial Peripheral Interface (SPI) is a synchronous serial communication interface used for short distance
communication, usually between devices on a printed circuit board (PCB) assembly. The TMAG5170 supports a
4-wire SPI interface. The primary communication between the device and the external microcontroller is through
the SPI bus that provides full-duplex communication. The external microcontroller works as the SPI controller
that sends command requests on the SDI pin and receives device responses on the SDO pin. The TMAG5170
device works as the SPI peripheral device that receives command requests and sends responses (such as
status and measured values) to the external microcontroller over the SDO line. The TMAG5170 supports a
fixed 32-bit frame size to communicate with a controller device. However, the 32-bit frame can be configured
through DATA_TYPE register bits to support a regular single register read data packet, or a special packet to
read two-channel data simultaneously.
7.5.2.1 SCK
The Serial Clock (SCK) represents the controller clock signal. This clock determines the speed of data transfer
and all receiving and sending are done synchronously to this clock. The output data on the SDO pin transitions
on the falling edge of the SCK and input data on the SDI pin is latched on the rising edge of the SC.
7.5.2.2 CS
The CS activates the SPI interface at the SPI. As long as the CS signal is at high level, the TMAG5170 will
not accept the SCK signal or the Serial-data-in (SDI), and the Serial-data-out (SDO) is in high impedance. Hold
CS low for the duration of a communication frame without toggling to ensure proper communication. The SPI is
disabled each time CS is brought from low to high.
7.5.2.3 SDI
The Serial-data-in (SDI) line is used by the controller to configure the user access registers, start a new
conversion, or send a read command. The SDI bits are transmitted with each SCK rising edge when the CS pin
is low. Figure 7-10 explains the SDI frame details. There are 4 command bits in the SDI line to select the status
bit for the next frame or start a new conversion.
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Read or write command
Seven bit address to
access registers
Sixteen bit data to be wri en,
don’t care during read command
Command bits to instruct read
type and start new conversion
CRC bits
SDI: Read or Write
*
CMD2 & CMD3 are reserved bits
** SET_COUNT register bits indicate the rolling count of the conversion data set. The counter is reset a er 111b.
*** DATA_TYPE register bits indicate the type of data being read through the SDO line
Figure 7-10. 32-Bit Frame Definition of the SDI Line
7.5.2.4 SDO
The Serial-data-out (SDO) line is used by the controller to read the data from the TMAG5170. The TMAG5170
will shift out command responses and ADC conversion data serially with each rising SCK edge when the CS pin
is low. This pin assumes a high-impedance state when CS is high. Based off the DATA_TYPE bit setting, the
TMAG5170 supports two different SDO frames:
•
•
Regular 32-Bit SDO Read
Special 32-Bit SDO Read
7.5.2.4.1 Regular 32-Bit SDO Read
With DATA_TYPE = 000b, the TMAG5170 supports a regular 16-bit register read during the 32-bit SDO frame
as explained in Figure 7-11. In this read mode, 12-bit status bits are displayed. All the status bits except for the
ERROR_STAT bit are directly read from the status registers. The ERROR_STAT bit indicates if any error bit set
in the device. Figure 7-11 shows how the status bits STAT[2:0] can be changed based off CMD1 value in the
previous frame.
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Last eight status bits
Sixteen bit data
First four status bits
CRC bits
SDO: Regular 32-bit Read
(DATA_TYPE = 000b)
*
PREV_CRC_STAT indicates if there is any CRC error in the immediate past frame
** ERROR_STAT indicates if there is any error bit ipped in the part
*** STAT10 to STAT4 indicate select status bits from the CONV_STATUS and AFE_STATUS registers
Figure 7-11. Regular 32-Bit SDO Read
7.5.2.4.2 Special 32-Bit SDO Read
With DATA_TYPE > 000b, the TMAG5170 supports a special 32-bit SDO frame for two-channel simultaneous
data read. Each channel data is limited to 12 bits. This feature is useful for systems requiring faster data
throughput while performing multi-axis measurements. Figure 7-12 explains the detail construction of the special
32-bit SDO frame. When the device is set to special 32-bit read, it will continue to deliver the 2-channel data
set through the SDO line during consecutive read or write cycles. DATA_TYPE bits must be reset to get back
to a regular read cycle. Only four status bits are transmitted in this mode. All the status bits except for the
ERROR_STAT bit are directly read from the status registers. The ERROR_STAT bit indicates if any error bit set
in the device. The status bits, STAT[2:0] can be changed based off CMD1 value in the previous frame.
Eight MSBs for ch2
Eight MSBs of Ch1
Four LSBs for Ch2
Four LSBs for Ch1
Four status bits
CRC bits
SDO: Special 32-bit Read
(DATA_TYPE 000b)
* ERROR_STAT indicates if there is any error bit set in the device
Figure 7-12. Special 32-Bit SDO Read
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7.5.2.5 SPI CRC
The TMAG5170 performs mandatory CRC for SPI communication. The Data integrity is maintained in both
directions by a 4-bit CRC covering the content of the incoming and outgoing 32-bit messages. The four LSB bits
of each 32-bit SPI frame are dedicated for the CRC. The CRC code is generated by the polynomial x4 + x + 1.
Initialize the CRC bits with b1111.
During the SDI write frame, the TMAG5170 reads for the CRC data before executing a write instruction. The
write instruction from the controller is ignored if there is any CRC error present in the frame. During the SDI
regular read frame, the TMAG5170 starts to deliver the requested data through SDO line in the same frame
and notifies the controller of any error occurrence through the ERROR_STAT bit. If the device detects a CRC
error in the SDI line, the device will invert the last bit of the SDO CRC in the same frame to promptly signal to a
controller that the SPI communication is compromised. A controller can also determine the presence of a CRC
error in the SDI frame by checking the Status11 bit in the next regular read frame.
Note
The TMAG5170 default mode at power up is CRC-enabled. With CRC enabled, the device will ignore
all the SDI commands if proper CRC codes are not received. To disable the CRC at the SDI line, send
the SPI SDI command x0F000407.
d[31]
d[31]
.
.
.
.
.
.
.
.
CRC Polynomial
x4 +x +1
&
CRC Initialization Bits
crci[3] = b1
crci[2] = b1
crci[1] = b1
crci[0] = b1
.
.
.
.
d[4]
d[4]
d[3] =b0
d[2] =b0
d[1] =b0
d[0] =b0
crc[3]
crc[2]
crc[1]
crc[0]
Figure 7-13. 4-Bit CRC Calculation
Use the following XOR function equations to calculate the 4-bit CRC. Figure 7-13 describes the notations of
these equations.
crc 0 = d 30 ^ d 26 ^ d 25 ^ d 24 ^ d 23 ^ d 21 ^ d 19 ^ d 18 ^ d 15 ^ d 11 ^ d 10 ^ d 9 ^ d 8 ^ d 6
^ d 4 ^ d 3 ^ d 0 ^ crci 2
(10)
(11)
crc 1 = d 31 ^ d 30 ^ d 27 ^ d 23 ^ d 22 ^ d 21 ^ d 20 ^ d 18 ^ d 16 ^ d 15 ^ d 12 ^ d 8 ^ d 7 ^ d 6
^ d 5 ^ d 3 ^ d 1 ^ d 0 ^ crci 2 ^ crci 3
crc 2 = d 31 ^ d 28 ^ d 24 ^ d 23 ^ d 22 ^ d 21 ^ d 19 ^ d 17 ^ d 16 ^ d 13 ^ d 9 ^ d 8 ^ d 7 ^ d 6
^ d 4 ^ d 2 ^ d 1 ^ crci 0 ^ crci 3
(12)
crc 3 = d 29 ^ d 25 ^ d 24 ^ d 23 ^ d 22 ^ d 20 ^ d 18 ^ d 17 ^ d 14 ^ d 10 ^ d 9 ^ d 8 ^ d 7 ^ d 5
^ d 3 ^ d 2 ^ crci 1
(13)
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The following shows example codes for calculating the 4-bit CRC.
function logic [3:0] calculate_crc4;
input logic [27:0] frame;
logic [31:0]
logic [3:0]
logic
padded_frame;
frame_crc;
inv;
i;
integer
padded_frame = {frame, 4'b0000};
begin
frame_crc = 4'hf; // initial value
for (i=31; i >= 0; i=i-1) begin
inv = padded_frame[i] ^ frame_crc[3];
frame_crc[3] = frame_crc[2];
frame_crc[2] = frame_crc[1];
frame_crc[1] = frame_crc[0] ^ inv;
frame_crc[0] = inv;
end
return frame_crc;
end
endfunction
7.5.2.6 SPI Frame
With the flexible definition of the 32-bit frames, the TMAG5170 supports a wide array of application requirements
catering to multiple user-specific data throughout. Two different frame examples are shown in this section to
illustrate the complete SPI bus communication:
•
•
32-Bit Read Frame
32-Bit Write Frame
7.5.2.6.1 32-Bit Read Frame
Figure 7-14 shows both regular and special SDO frames during SDI read command. The TMAG5170
implements in-frame communication. When the controller sends a register read command during a regular read
cycle, the corresponding 16-bit register data is sent through the SDO line in the same frame. During the special
read cycle, the TMAG5170 ignores the address and data bits of the SDI line and sends the two channel data set
through the SDO line as defined in the DATA_TYPE register bits.
Figure 7-14. 32-Bit SPI Read
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7.5.2.6.2 32-Bit Write Frame
Figure 7-15 shows both regular and special SDO frames during SDI write command. During a regular 32-bit
frame write command through SDI, the SDO delivers '0's in place of 16-bit data placeholders. During the special
frame write cycle through SDI line, the TMAG5170 will continue to send the two channel data through SDO line
as defined by the DATA_TYPE register bits.
Figure 7-15. 32-BIT WRITE FRAME
7.6 Register Map
7.6.1 TMAG5170 Registers
Table 7-4 lists the TMAG5170 registers. All register offset addresses not listed in Table 7-4 should be considered
as reserved locations and the register contents should not be modified.
Reserved 2
Table 7-4. TMAG5170 Registers
Offset
0h
Acronym
Register Name
Section
Go
DEVICE_CONFIG
SENSOR_CONFIG
SYSTEM_CONFIG
ALERT_CONFIG
X_THRX_CONFIG
Y_THRX_CONFIG
Z_THRX_CONFIG
T_THRX_CONFIG
CONV_STATUS
X_CH_RESULT
Y_CH_RESULT
Z_CH_RESULT
TEMP_RESULT
AFE_STATUS
Configure Device Operation Modes
Configure Device Operation Modes
Configure Device Operation Modes
Configure Device Operation Modes
Configure Device Operation Modes
Configure Device Operation Modes
Configure Device Operation Modes
Configure Device Operation Modes
Conversion Status Register
Conversion Result Register
Conversion Result Register
Conversion Result Register
Conversion Result Register
Status Register
1h
Go
2h
Go
3h
Go
4h
Go
5h
Go
6h
Go
7h
Go
8h
Go
9h
Go
Ah
Bh
Ch
Dh
Eh
Go
Go
Go
Go
SYS_STATUS
Status Register
Go
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Table 7-4. TMAG5170 Registers (continued)
Offset
Fh
Acronym
Register Name
Section
TEST_CONFIG
Test Configuration Register
Go
Go
Go
Go
Go
Go
10h
11h
OSC_MONITOR
Conversion Result Register
Configure Device Operation Modes
Configure Device Operation Modes
Conversion Result Register
Conversion Result Register
MAG_GAIN_CONFIG
MAG_OFFSET_CONFIG
ANGLE_RESULT
MAGNITUDE_RESULT
12h
13h
14h
Complex bit access types are encoded to fit into small table cells. Table 7-5 shows the codes that are used for
access types in this section.
Table 7-5. TMAG5170 Access Type Codes
Access Type
Code
Description
Read Type
R
R
Read
RC
R
C
Read
to Clear
Write Type
W
W
Write
Reset or Default Value
- n
Value after reset or the default value
7.6.1.1 DEVICE_CONFIG Register (Offset = 0h) [Reset = 0h]
DEVICE_CONFIG is shown in Table 7-6.
Return to the Summary Table.
Table 7-6. DEVICE_CONFIG Register Field Descriptions
Bit
15
Field
Type
Reset
Description
RESERVED
CONV_AVG
R
0h
Reserved
14-12
R/W
0h
Enables additional sampling of the sensor data to reduce the noise
effect (or to increase resolution)
0h = 1x - 10.0Ksps (3-axes) or 20Ksps (1 axis)
1h = 2x - 5.7Ksps (3-axes) or 13.3Ksps (1 axis)
2h = 4x - 3.1Ksps (3-axes) or 8.0Ksps (1 axis)
3h = 8x - 1.6Ksps (3-axes) or 4.4Ksps (1 axis)
4h = 16x - 0.8Ksps (3-axes) or 2.4Ksps (1 axis)
5h = 32x - 0.4Ksps (3-axes) or 1.2Ksps (1 axis)
6h = Code not used, defaults to 000b if selected
7h = Code not used, defaults to000b if selected
11-10
9-8
RESERVED
R
0h
0h
Reserved
MAG_TEMPCO
R/W
Temperature coefficient of sense magnet
0h = 0%/ deg C (Current sensor applications)
1h = 0.12%/deg C (NdBFe)
2h = 0.03% /deg C (SmCo)
3h = 0.2%/deg C (Ceramic)
7
RESERVED
R
0h
Reserved
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Table 7-6. DEVICE_CONFIG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
6-4
OPERATING_MODE
R/W
0h
Selects operating mode
0h = Configuration mode, Default (TRIGGER_MODE active)
1h = Stand-by mode (TRIGGER_MODE active)
2h = Active measure mode (Continuous conversion)
3h = Active trigger mode (TRIGGER_MODE active)
4h = Wake-up and sleep mode (duty-cycled mode)
5h = Sleep mode
6h = Deep sleep mode (wakes up at CS signal from controller)
7h = Code not used, defaults to 000b if selected
3
2
1
0
T_CH_EN
T_RATE
R/W
R/W
R/W
R
0h
0h
0h
0h
Enables data acquisition of the temperature channel
0h = Temp channel disabled, Default
1h = Temp channel enabled
Temperature conversion rate. It is linked to the CONV_AVG field
0h = Same as other sensors per CONV_AVG, Default
1h = Once per conversion set
T_HLT_EN
RESERVED
Enables temperature limit check
0h = Temperature limit check off, Default
1h = Temperature limit check on
Reserved
7.6.1.2 SENSOR_CONFIG Register (Offset = 1h) [Reset = 0h]
SENSOR_CONFIG is shown in Table 7-7.
Return to the Summary Table.
Table 7-7. SENSOR_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-14
ANGLE_EN
R/W
0h
Enable angle calculation using two axis data
0h = No angle calculation (default)
1h = X-Y-angle calculation enabled
2h = Y-Z-angle calculation enabled
3h = X-Z-angle calculation enabled
13-10
SLEEPTIME
R/W
0h
Selects the time spent in low power mode between conversions
when OPERATING_MODE =010b
0h = 1ms
1h = 5ms
2h = 10ms
3h = 15ms
4h = 20ms
5h = 30ms
6h = 50ms
7h = 100ms
8h = 500ms
9h = 1000ms
Ah = Code not used, defaults to 0000b if selected
Bh = Code not used, defaults to 0000b if selected
Ch = Code not used, defaults to 0000b if selected
Dh = Code not used, defaults to 0000b if selected
Eh = Code not used, defaults to 0000b if selected
Fh = Code not used, defaults to 0000b if selected
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Table 7-7. SENSOR_CONFIG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
9-6
MAG_CH_EN
R/W
0h
Enables data acquisition of the magnetic axis channel(s)
0h = All magnetic channels of OFF, DEFAUT
1h = X channel enabled
2h = Y channel enabled
3h = X, Y channel enabled
4h = Z channel enabled
5h = Z, X channel enabled
6h = Y, Z channel enabled
7h = X, Y, Z channel enabled
8h = XYX channel enabled
9h = YXY channel enabled
Ah = YZY channel enabled
Bh = ZYZ channel enabled
Ch = ZXZ channel enabled
Dh = XZX channel enabled
Eh = XYZYX channel enabled
Fh = XYZZYX channel enabled
5-4
3-2
1-0
Z_RANGE
Y_RANGE
X_RANGE
R/W
R/W
R/W
0h
0h
0h
Enables different magnetic ranges to support magnetic fields from
±25mT to ±300mT
0h = ±50mT (TMAG5170A1)/ ±150mT(TMAG5170A2), Default
1h = ±25mT (TMAG5170A1)/ ±75mT(TMAG5170A2)
2h = ±100mT (TMAG5170A1)/ ±300mT(TMAG5170A2)
3h = Code not used, defaults to 00b if selected
Enables different magnetic ranges to support magnetic fields from
±25mT to ±300mT
0h = ±50mT (TMAG5170A1)/ ±150mT(TMAG5170A2), Default
1h = ±25mT (TMAG5170A1)/ ±75mT(TMAG5170A2)
2h = ±100mT (TMAG5170A1)/ ±300mT(TMAG5170A2)
3h = Code not used, defaults to 00b if selected
Enables different magnetic ranges to support magnetic fields from
±25mT to ±300mT
0h = ±50mT (TMAG5170A1)/ ±150mT(TMAG5170A2), Default
1h = ±25mT (TMAG5170A1)/ ±75mT(TMAG5170A2)
2h = ±100mT (TMAG5170A1)/ ±300mT(TMAG5170A2)
3h = Code not used, defaults to 00b if selected
7.6.1.3 SYSTEM_CONFIG Register (Offset = 2h) [Reset = 0h]
SYSTEM_CONFIG is shown in Table 7-8.
Return to the Summary Table.
Table 7-8. SYSTEM_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-14
13-12
RESERVED
DIAG_SEL
R
0h
Reserved
R/W
0h
Selects a diagnostic mode run
0h = Run all data path diagnostics all together, Default
1h = Run only enabled data path diagnostics all together
2h = Run all data path diagnostics in sequence
3h = Run only enabled data path diagnostics in sequence
11
RESERVED
R
0h
0h
Reserved
10-9
TRIGGER_MODE
R/W
Selects a condition which initiates a single conversion based
off already configured registers. A running conversion completes
before executing a trigger. Redundant triggers are ignored.
TRIGGER_MODE is available only during the modes explicitly
mentioned in OPERATING_MODE.
0h = Conversion start at SPI command, Default
1h = Conversion start at CS pulse
2h = Conversion start at ALERT pulse
3h = Code not used, defaults to 00b if selected
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Table 7-8. SYSTEM_CONFIG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
8-6
DATA_TYPE
R/W
0h
Data Type to be accessed from results registers via SPI
0h = Default 32-bit register access
1h = 12-Bit XY data access
2h = 12-Bit XZ data access
3h = 12-Bit ZY data access
4h = 12-Bit XT data access
5h = 12-Bit YT data access
6h = 12-Bit ZT data access
7h = 12-Bit AM data access
5
DIAG_EN
R/W
0h
Enables user controlled AFE diagnostic tests
0h = Execution of AFE diagnostics is disabled, Default
1h = Execution of AFE diagnostics is enabled
4-3
2
RESERVED
Z_HLT_EN
R
0h
0h
Reserved
R/W
Enables magnetic field limit check on Z axis
0h = Z axis limit check off, Default
1h = Z axis limit check on
1
0
Y_HLT_EN
X_HLT_EN
R/W
R/W
0h
0h
Enables magnetic field limit check on Y axis
0h = Y axis limit check off, Default
1h = Y axis limit check on
Enables magnetic field limit check on X axis
0h = X axis limit check off, Default
1h = X axis limit check on
7.6.1.4 ALERT_CONFIG Register (Offset = 3h) [Reset = 0h]
ALERT_CONFIG is shown in Table 7-9.
Return to the Summary Table.
Table 7-9. ALERT_CONFIG Register Field Descriptions
Bit
15-14
13
Field
Type
Reset
Description
RESERVED
ALERT_LATCH
R
0h
Reserved
R/W
0h
Latched ALERT mode select
0h = ALERT sources are not latched. ALERT is asserted only while
the source of the ALERT response is present
1h = ALERT sources are latched. ALERT response is latched when
the source of the ALERT is asserted until cleared on Read of
the corresponding status register (AFE_STATUS, SYS_STATUS, or
result registers)
12
11
ALERT_MODE
STATUS_ALRT
R/W
R/W
0h
0h
ALERT mode select
0h = Interrupt mode
1h = Switch mode. This mode overrides any interrupt function
(ALERT trigger is also disabled), and implements Hall switch function
based off the *_THRX_ALRT settings. In the switch mode the
corresponding X_HLT_EN, Y_HLT_EN, Z_HLT_EN need to be set.
Enable ALERT response when any flag in the AFE_STATUS or
SYS_STATUS registers are set
0h = ALERT is not asserted when any of the AFE_STATUS or
SYS_STATUS bit is set
1h = ALERT output is asserted when any of the AFE_STATUS or
SYS_STATUS bit is set
10-9
8
RESERVED
RSLT_ALRT
R
0h
0h
Reserved
R/W
Enable ALERT response when the configured set of conversions is
complete
0h = ALERT is not used to signal when the configured set of
conversions are complete
1h = ALERT output is asserted when the configured set of
conversions are complete
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Table 7-9. ALERT_CONFIG Register Field Descriptions (continued)
Bit
7-6
5-4
Field
Type
Reset
Description
RESERVED
THRX_COUNT
R
0h
Reserved
R/W
0h
Number of conversions above the HIGH threshold or below the LOW
threshold before the ALERT response is initiated
0h = 1-Conversion result
1h = 2-Conversion results
2h = 3-Conversion results
3h = 4-Conversion results
3
2
1
0
T_THRX_ALRT
Z_THRX_ALRT
Y_THRX_ALRT
X_THRX_ALRT
R/W
R/W
R/W
R/W
0h
0h
0h
0h
Temperature threshold ALERT enable
0h = ALERT is not used to signal when temperature thresholds are
crossed
1h = ALERT output is asserted when temperature thresholds are
crossed
Z-Channel threshold ALERT enable
0h = ALERT is not used to signal when Z-Axis magnetic thresholds
are crossed
1h = ALERT output is asserted when Z-Axis magnetic thresholds are
crossed
Y-Channel threshold ALERT enable
0h = ALERT is not used to signal when Y-Axis magnetic thresholds
are crossed
1h = ALERT output is asserted when Y-Axis magnetic thresholds are
crossed
X-Channel threshold ALERT enable
0h = ALERT is not used to signal when X-Axis magnetic thresholds
are crossed
1h = ALERT output is asserted when X-Axis magnetic thresholds are
crossed
7.6.1.5 X_THRX_CONFIG Register (Offset = 4h) [Reset = 7D83h]
X_THRX_CONFIG is shown in Table 7-10.
Return to the Summary Table.
Table 7-10. X_THRX_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
X_HI_THRESHOLD
R/W
7Dh
X-Axis maximum magnetic field threshold. User input as 2's
complement 8-bit binary number. The threshold in mT can be
calculated as: (X_RANGE/128)*X_HI_THRESHOLD. Default to 98%
of the full-scale
7-0
X_LO_THRESHOLD
R/W
83h
X-Axis minimum magnetic field threshold. User input as 2's
complement 8-bit binary number. The threshold in mT can be
calculated as: (X_RANGE/128)*X_LO_THRESHOLD. Default to
-98% of the full-scale
7.6.1.6 Y_THRX_CONFIG Register (Offset = 5h) [Reset = 7D83h]
Y_THRX_CONFIG is shown in Table 7-11.
Return to the Summary Table.
Table 7-11. Y_THRX_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
Y_HI_THRESHOLD
R/W
7Dh
Y-Axis maximum magnetic field threshold. User input as 2's
complement 8-bit binary number. The threshold in mT can be
calculated as: (Y_RANGE/128)*Y_HI_THRESHOLD. Default to 98%
of the full-scale.
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Table 7-11. Y_THRX_CONFIG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
7-0
Y_LO_THRESHOLD
R/W
83h
Y-Axis minimum magnetic field threshold. User input as 2's
complement 8-bit binary number. The threshold in mT can be
calculated as: (Y_RANGE/128)*Y_LO_THRESHOLD. Default to
-98% of the full-scale.
7.6.1.7 Z_THRX_CONFIG Register (Offset = 6h) [Reset = 7D83h]
Z_THRX_CONFIG is shown in Table 7-12.
Return to the Summary Table.
Table 7-12. Z_THRX_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
Z_HI_THRESHOLD
R/W
7Dh
Z-Axis maximum magnetic field threshold. User input as 2's
complement 8-bit binary number. The threshold in mT can be
calculated as:(Z_RANGE/128)*Z_HI_THRESHOLD. Default to 98%
of the full-scale
7-0
Z_LO_THRESHOLD
R/W
83h
Z-Axis minimum magnetic field threshold. User input as 2's
complement 8-bit binary number. The threshold in mT can be
calculated as: (Z_RANGE/128)*X_LO_THRESHOLD. Default to
-98% of the full-scale
7.6.1.8 T_THRX_CONFIG Register (Offset = 7h) [Reset = 6732h]
T_THRX_CONFIG is shown in Table 7-13.
Return to the Summary Table.
Table 7-13. T_THRX_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-8
T_HI_THRESHOLD
R/W
67h
Temperature maximum threshold. User input as 2's complement 8-
bit binary number. Each LSB in this field corresponds to 4.267°C.
Default value of 67h represents 172°C.
7-0
T_LO_THRESHOLD
R/W
32h
Temperature minimum threshold. User input as 2's complement 8-
bit binary number. Each LSB in this field corresponds to 4.267°C.
Default value of 32h represents -53°C.
7.6.1.9 CONV_STATUS Register (Offset = 8h) [Reset = 0h]
CONV_STATUS is shown in Table 7-14.
Return to the Summary Table.
Table 7-14. CONV_STATUS Register Field Descriptions
Bit
15-14
13
Field
Type
Reset
Description
RESERVED
RDY
R
0h
Reserved
R
0h
Conversion data buffer is ready.
0h = Conversion data not valid (result registers hold previous
conversion value)
1h = Conversion data valid
12
11
A
T
R
R
0h
0h
Angle/Magnitude data from current conversion
0h = Data is not current
1h = Data is current
Temperature data from current conversion
0h = Temperature data is not current
1h = Temperature data is current
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Table 7-14. CONV_STATUS Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
10
Z
R
0h
Z-Channel data from current conversion
0h = Z-Channel data is not current
1h = Z-Channel data is current
9
8
Y
X
R
R
0h
0h
Y-Channel data from current conversion
0h = Y-Channel data is not current
1h = Y-Channel data is current
X-Channel data from current conversion
0h = X-Channel data is not current
1h = X-Channel data is current
7
RESERVED
SET_COUNT
RESERVED
ALRT_STATUS
R
R
R
R
0h
0h
0h
0h
Reserved
6-4
3-2
1-0
Rolling count of conversion data sets
Reserved
State of ALERT response
0h = No ALERT conditions
1h = AFE status flag set
2h = SYS status flag set
3h = Flags set in both AFE and SYS status registers
7.6.1.10 X_CH_RESULT Register (Offset = 9h) [Reset = 0h]
X_CH_RESULT is shown in Table 7-15.
Return to the Summary Table.
Table 7-15. X_CH_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
X_CH_RESULT
R
0h
X-Channel data conversion results
7.6.1.11 Y_CH_RESULT Register (Offset = Ah) [Reset = 0h]
Y_CH_RESULT is shown in Table 7-16.
Return to the Summary Table.
Table 7-16. Y_CH_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
Y_CH_RESULT
R
0h
Y-Channel data conversion results
7.6.1.12 Z_CH_RESULT Register (Offset = Bh) [Reset = 0h]
Z_CH_RESULT is shown in Table 7-17.
Return to the Summary Table.
Table 7-17. Z_CH_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
Z_CH_RESULT
R
0h
Z-Channel data conversion results
7.6.1.13 TEMP_RESULT Register (Offset = Ch) [Reset = 0h]
TEMP_RESULT is shown in Table 7-18.
Return to the Summary Table.
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Table 7-18. TEMP_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
TEMP_RESULT
R
0h
Temperature sensor data conversion results
7.6.1.14 AFE_STATUS Register (Offset = Dh) [Reset = 8000h]
AFE_STATUS is shown in Table 7-19.
Return to the Summary Table.
Table 7-19. AFE_STATUS Register Field Descriptions
Bit
Field
Type
Reset
Description
15
CFG_RESET
RC
1h
Device power up status. This bit is reset when microcontroller reads
the AFE_STATUS register.
0h = Device reset has been acknowledged and cleared
1h = Device has experienced a hardware reset after a power down
or brown-out
14-13
12
RESERVED
SENS_STAT
R
0h
0h
Reserved
RC
Analog front end sensor diagnostic status
0h = No error detected
1h = Analog front end sensor diagnostic test failed
11
10
9
TEMP_STAT
ZHS_STAT
YHS_STAT
XHS_STAT
RC
RC
RC
RC
0h
0h
0h
0h
Temperature sensor diagnostic status
0h = No error detected
1h = Analog front end temperature sensor diagnostic test failed
Z-Axis hall sensor diagnostic status
0h = No error detected
1h = Z-Axis hall sensor diagnostic test failed
Y-Axis hall sensor diagnostic status
0h = No error detected
1h = Y-Axis hall sensor diagnostic test failed
8
X-Axis hall sensor diagnostic status
0h = No error detected
1h = X-Axis hall sensor diagnostic test failed
7-2
1
RESERVED
TRIM_STAT
R
0h
0h
Reserved
RC
Trim data error
0h = No trim data errors were detected
1h = Trim data error was detected
0
LDO_STAT
RC
0h
LDO error
0h = No faults in the internal LDO supplied power were detected
1h = A fault in the internal LDO supplied power was detected
7.6.1.15 SYS_STATUS Register (Offset = Eh) [Reset = 0h]
SYS_STATUS is shown in Table 7-20.
Return to the Summary Table.
Table 7-20. SYS_STATUS Register Field Descriptions
Bit
Field
Type
Reset
Description
15
ALRT_LVL
R
0h
Reflects the current state of the ALERT pin feed-back path
0h = The input ALERT logic level is low
1h = The input ALERT logic level is high
14
ALRT_DRV
RC
0h
Each time the open drain ALERT signal is driven, the feedback
circuit checks if the ALERT output goes Low. An error flag is
generated at the ALRT_DRV bit if the output doesn't go Low.
0h = No ALERT drive error detected
1h = ALERT drive error detected
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Table 7-20. SYS_STATUS Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
13
SDO_DRV
RC
0h
The Logic value driven output on SDO was not the value of the SDO
Pin Feed-back path when SDO is being driven by the device
0h = No SDO drive error detected
1h = SDO drive error detected
12
CRC_STAT
RC
0h
Cyclic redundancy check error
0h = No cyclic redundancy check error was detected
1h = Cyclic redundancy check error was detected for a SPI
transaction
11
FRAME_STAT
RC
R
0h
0h
Incorrect number of clocks in SPI frame
0h = No frame error was detected
1h = Incorrect number of clocks detected for a SPI transaction
10-8
OPERATING_STAT
Reports the status of operating mode
0h = Config state
1h = Standby state
2h = Active measure (Continuous Mode) state
3h = Active triggered mode state
4h = DCM active state
5h = DCM Sleep state
6h = Sleep state
7-6
5
RESERVED
VCC_OV
R
0h
0h
Reserved
RC
VCC over-voltage detection in active or stand-by mode
0h = No over-voltage detected on VCC
1h = VCC was detected to be over-voltage
4
3
2
1
0
VCC_UV
RC
RC
RC
RC
RC
0h
0h
0h
0h
0h
VCC under voltage detection in active or stand-by mode
0h = No under-voltage was detected on VCC
1h = VCC was detected to be under-voltage
TEMP_THX
ZCH_THX
YCH_THX
XCH_THX
Temperature threshold crossing detected
0h = No temperature threshold crossing detected
1h = Temperature threshold crossing detected
Z-Channel threshold crossing detected
0h = No Z-Axis magnetic field threshold crossing detected
1h = Z-Axis magnetic field threshold threshold crossing detected
Y-Channel threshold crossing detected
0h = No Y-Axis magnetic field threshold crossing detected
1h = Y-Axis magnetic field threshold crossing detected
X-Channel threshold crossing detected
0h = No X-Axis magnetic field threshold crossing detected
1h = X-Axis magnetic field threshold crossing detected
7.6.1.16 TEST_CONFIG Register (Offset = Fh) [Reset = X]
TEST_CONFIG is shown in Table 7-21.
Return to the Summary Table.
Table 7-21. TEST_CONFIG Register Field Descriptions
Bit
15-6
5-4
Field
Type
Reset
Description
RESERVED
VER
R
1h
Reserved
R
X
Indicates the version of the device
0h = A1 rev
1h = A2 rev
2h = reserved
3h = reserved
3
2
RESERVED
CRC_DIS
R
0h
0h
Reserved
R/W
Enable or disable CRC in SPI communication
0h = CRC enabled in SPI communication (Default)
1h = CRC disabled in SPI communication
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Table 7-21. TEST_CONFIG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
1-0
OSC_CNT_CTL
R/W
0h
Oscillator count control - starts, stops, and resets the counter driven
by the HFOSC or LFOSC oscillator to facilitate oscillator frequency
and integety checks
0h = Reset OSC counter (default)
1h = Start OSC counter driven by HFOSC
2h = Start OSC counter driven by LFOSC
3h = Stop OSC counter
7.6.1.17 OSC_MONITOR Register (Offset = 10h) [Reset = 0h]
OSC_MONITOR is shown in Table 7-22.
Return to the Summary Table.
Table 7-22. OSC_MONITOR Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
OSC_COUNT
R
0h
Oscillator Counter. The number of selected oscillator clock cycles
that have been counted since Oscillator Counter was started. The
HFOSC and LFOSC clock roll-over the 16-bit counter once reaching
the max value.
7.6.1.18 MAG_GAIN_CONFIG Register (Offset = 11h) [Reset = 0h]
MAG_GAIN_CONFIG is shown in Table 7-23.
Return to the Summary Table.
Table 7-23. MAG_GAIN_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-14
GAIN_SELECTION
R/W
0h
Enables the selection of a particular Hall axis for amplitude
correction to get accurate angle measurement
0h = No axis is selected (Default)
1h = X-axis is selected
2h = Y-axis is selected
3h = Z-axis is selected
13-11
10-0
RESERVED
R
0h
0h
Reserved
GAIN_VALUE
R/W
11-bit gain value determined by controller to adjust the a particular
Hall axis value. The gain value is anywhere between 0 and 2. Gain is
calculated as 'user entered value/1024'.
7.6.1.19 MAG_OFFSET_CONFIG Register (Offset = 12h) [Reset = 0h]
MAG_OFFSET_CONFIG is shown in Table 7-24.
Return to the Summary Table.
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Table 7-24. MAG_OFFSET_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
15-14
OFFSET_SELECTION
R/W
0h
Enables the selection of a particular Hall axis for offset correction to
get accurate angle measurement:
00b = No axis is selected for offset correction (Default).
01b = Only OFFSET_VALUE1 is used for offset correction. Applied
to X axis when ANGLE_EN = 01b or 11b, and to Y axis when
ANGLE_EN =10b. No axis is selected if ANGLE_EN =00b.
10b = Only OFFSET_VALUE2 is used for offset correction. Applied
to Y axis when ANGLE_EN = 01b, and to Z axis when ANGLE_EN
=10b or 11b. No axis is selected if ANGLE_EN =00b.
11b = Both OFFSET_VALUE1 and OFFSET_VALUE2 are used
for offset correction. OFFSET_VALUE1 applied to X axis when
ANGLE_EN = 01b or 11b, and to Y axis when ANGLE_EN =10b.
OFFSET_VALUE2 applied to Y axis when ANGLE_EN = 01b, and
to Z axis when ANGLE_EN =10b or 11b. No axis is selected if
ANGLE_EN =00b.
13-7
6-0
OFFSET_VALUE1
OFFSET_VALUE2
R/W
R/W
0h
0h
7-bit, 2' complement offset value determined by controller to adjust a
particular Hall axis value. The range of possible offset valid entries
can be +/-64. The offset value is calculated from the user input as
the 7 LSB bits of a 11-bit range per SENSOR_CONFIG register
setting for the corresponding axis. Default offset value is 0.
7-bit, 2' complement offset value determined by controller to adjust a
particular Hall axis value. The range of possible offset valid entries
can be +/-64. The offset value is calculated from the user input as
the 7 LSB bits of a 11-bit range per SENSOR_CONFIG register
setting for the corresponding axis. Default offset value is 0.
7.6.1.20 ANGLE_RESULT Register (Offset = 13h) [Reset = 0h]
ANGLE_RESULT is shown in Table 7-25.
Return to the Summary Table.
Table 7-25. ANGLE_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
ANGLE_RESULT
R
0h
Angle measurement result in degree. The data is displayed from 0 to
360 degree in 13 LSB bits. The 4 LSB bits allocated for fraction of an
angle in the format (xxxx/16).
7.6.1.21 MAGNITUDE_RESULT Register (Offset = 14h) [Reset = 0h]
MAGNITUDE_RESULT is shown in Table 7-26.
Return to the Summary Table.
Table 7-26. MAGNITUDE_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
MAGNITUDE_RESULT
R
0h
Resultant vector magnitude (during angle measurement) result. This
value should be constant during 360 degree measurements
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
8.1.1 Selecting the Sensitivity Option
Select the highest TMAG5170 sensitivity option that can measure the required range of magnetic flux density so
that the ADC output range is maximized.
Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very
small magnets at close distances, because magnetic flux density increases exponentially with the proximity to
a magnet. TI created an online tool to help with simple magnet calculations under the TMAG5170-Q1 product
folder on ti.com.
8.1.2 Temperature Compensation for Magnets
The TMAG5170 temperature compensation is designed to directly compensate the average temperature drift
of several magnets as specified in the MAG_TEMPCO register bits. The residual induction (Br) of a magnet
typically reduces by 0.12%/°C for NdFeB, and 0.20%/°C for ferrite magnets as the temperature increases. Set
the MAG_TEMPCO bit to default 00b if the device temperature compensation is not needed.
8.1.3 Sensor Conversion
Multiple conversion schemes can be adopted based off the MAG_CH_EN, CONV_AVG, DIAG_SEL, and
DIAG_EN register bit settings.
8.1.3.1 Continuous Conversion
The TMAG5170 can be set in continuous conversion mode when OPERATING_MODE is set to 010b. Figure 8-1
shows an example of continuous conversion where only X-axis is selected for conversion. The input magnetic
field is processed in two steps. In the first step, the device spins the hall sensor elements and integrates the
sampled data. In the second step, the ADC block converts the analog signal into digital bits and stores the signal
in the corresponding result register. While the ADC starts processing the first magnetic sample, the spin block
can start processing the second magnetic sample. In this mode, the maximum sampling rate is determined by
the update interval, not by the conversion time.
HALL Spin &
Integration
X-Axis
(1st)
X-Axis
(2nd)
X-Axis
(3rd)
X-Axis
(4th)
X-Axis
(1st)
X-Axis
(2nd)
X-Axis
(3rd)
X-Axis
(4th)
ADC
Update interval
Conversion time
Time
Figure 8-1. Continuous Conversion Selecting X Axis
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8.1.3.2 Trigger Conversion
The TMAG5170 supports trigger conversion with OPERATING_MODE set to 00b, 001b, or 011b. During trigger
conversion, the initialization time can vary depending on the operating mode as shown in Table 7-3. The trigger
event can be initiated through SPI command, ALERT, or CS signal. Figure 8-2 shows an example of trigger
conversion with X, Y, Z, and temperature sensors activated.
Initialization time
HALL Spin &
Integration
X-Axis
Temp
Y-Axis
X-Axis
Z-Axis
Y-Axis
Z-Axis
ADC
Conversion
Conversion
time
Conversion
Trigger
start
Time
Figure 8-2. Trigger Conversion for X, Y, Z, and Temperature Sensors
8.1.3.3 Pseudo-Simultaneous Sampling
In absolute angle measurement, application sensor data from multiple axes are required to calculate an accurate
angle. The magnetic field data collected at different times through the same signal chain introduces error in
angle calculation. The TMAG5170 offers pseudo-simultaneous sampling data collection modes to eliminate this
error. Figure 8-3 shows an example where MAG_CH_EN is set at 1101b to collect XZX data. Equation 14 shows
that the time stamps for the X and Z sensor data are the same.
P:1 + P:2
P< =
2
(14)
where
•
tX1, tZ, tX2 are time stamps for X, Z, X sensor data completion as defined in Figure 8-3.
HALL Spin &
Integration
X-Axis
Z-Axis
X-Axis
X-Axis
Z-Axis
X-Axis
ADC
tX1
tZ
tX1
Time
Figure 8-3. XZX Magnetic Field Conversion
The vertical X, Y sensors of the TMAG5170 exhibit more noise than the horizontal Z sensor. The pseudo-
simultaneous sampling can be used to equalize the noise floor when two set of vertical sensor data are collected
against one set of horizontal sensor data, as in examples of XZX or YZY modes.
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8.1.4 Error Calculation During Linear Measurement
The TMAG5170 offers independent configurations to perform linear position measurements in X, Y, and Z
axes. To calculate the expected error during linear measurement, the contributions from each of the individual
error sources must be understood. The relevant error sources include sensitivity error, offset, noise, cross axis
sensitivity, hysteresis, nonlinearity, drift across temperature, drift across life time, and so forth. For a 3-axis
Hall solution like the TMAG5170, the cross-axis sensitivity and hysteresis error sources are insignificant. Use
Equation 15 to estimate the linear measurement error calculation at room temperature.
2
2
off
2
B × SENS
ER
+ B
+ N
RMS_25
Error
=
× 100%
(15)
LM_25C
B
where
•
•
•
•
•
•
ErrorLM_25C is total error in % during linear measurement at 25°C.
B is input magnetic field.
SENSER is sensitivity error at 25°C.
Boff is offset error at 25°C.
NRMS_25 is RMS noise at 25°C.
In many applications, system level calibration at room temperature can nullify the offset and sensitivity errors
at 25°C. The noise errors can be reduced by further digital averaging the sensor data in a microcontroller. Use
Equation 15 to estimate the linear measurement error across temperature after calibration at room temperature.
2
2
2
B × SENS
DR
+ B
+ N
RMS_Temp
off_DR
Error
=
× 100%
(16)
LM_Temp
B
where
•
ErrorLM_Temp is total error in % during linear measurement across temperature after room temperature
calibration.
•
•
•
•
B is input magnetic field.
SENSDR is sensitivity drift from value at 25°C.
Boff_DR is offset drift from value at 25°C.
NRMS_125 is RMS noise across temperature.
If room temperature calibration is not performed, sensitivity and offset errors at room temperature must also
account for total error calculation across temperature (see Equation 17).
2
2
2
2
2
B × SENS
ER
+ B × SENS
DR
+ B
off
+ B
off_DR
+ N
RMS_Temp
Error
=
× 100%
(17)
LM_Temp_NCal
B
where
•
ErrorLM_Temp_NCal is total error in % during linear measurement across temperature without room temperature
calibration.
The table below summarizes linear measurement error estimate for z-axis with magnetic field range of ±50mT
and CONV_AVG =101b:
Table 8-1. Total Error Examples During Linear Measurement
Input Field 50mT
Input Field 25mT
Error % for z sensor at 25°C without any calibration
2.6%
3.0%
4.0%
2.8%
3.6%
4.5%
Error % for z sensor across temperature after 25°C calibration
Error % for z sensor across temperature without 25°C calibration
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Note
In this section, error sources such as system mechanical vibration, magnet temperature gradient,
nonlinearity, lifetime drift, and so forth, are not considered. The user must take these additional error
sources into account while calculating overall system error budgets.
8.1.5 Error Calculation During Angular Measurement
The TMAG5170 offers on-chip CORDIC to measure angle data from any of the two magnetic axes. The
linear magnetic axis data can be used to calculate the angle using an external CORDIC as well. To calculate
the expected error during angular measurement, the contributions from each individual error source must be
understood. The relevant error sources include sensitivity error, offset, noise, axis-axis mismatch, nonlinearity,
drift across temperature, drift across life time, and so forth. Use the Angle Error Calculation Tool to estimate the
total error during angular measurement.
Table 8-2 offers an example angular error estimate for X-Y plane with magnetic field range of ±100mT, peak
X, Y field of ±80mT, and CONV_AVG =101b. The angle error can be improved by calibrating at room and high
temperature, using multi-pole magnet, implementing linearization scheme in the controller, and so forth.
Table 8-2. Error Estimates During Angle Measurement
Angle Error Calculation using
Max Magnetic Specification
Expected Angle Error After
Offset and Gain Calibrations
Angle error for 360° rotation at 25°C
1.5°
2.1°
~0.5°
~1.0°
Angle error for 360° rotation across temperature
Note
In this section, system level error sources such as mechanical misalignment, vibration, magnet
temperature gradient, lifetime drift, and so forth, are not considered. The user must take these
additional error sources into account while calculating overall system error budgets.
8.2 Typical Application
Magnetic angle sensors are very popular due to contactless and reliable measurements, especially in
applications requiring long-term measurements in rugged environments. The TMAG5170 offers an on-chip angle
calculator that can provide angular measurement based off any two of the magnetic axes. The two axes of
interest can be selected in the ANGLE_EN register bits. The device offers an angle output in complete 360
degree scale. Take several error sources into account for angle calculation, including sensitivity error, offset
error, linearity error, noise, mechanical vibration, temperature drift, and so forth.
2.3V to 5.5V
VDD/VIO
VCC
ALERT
CS
SDI
SDO
SCK
TEST
GND
Figure 8-4. TMAG5170 Application Diagram
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8.2.1 Design Requirements
Use the parameters listed in Table 8-3 for this design example
Table 8-3. Design Parameters
DESIGN PARAMETERS
ON-AXIS MEASUREMENT
OFF-AXIS MEASUREMENT
Device
VCC
TMAG5170-A1
5 V
TMAG5170-A1
5 V
Cylinder: 4.7625-mm diameter, 12.7-mm
thick, neodymium N52, Br = 1480
Cylinder: 4.7625-mm diameter, 12.7-mm
thick, neodymium N52, Br = 1480
Magnet
Select the same range for both axes based
off the highest possible magnetic field seen
by the sensor
Select the same range for both axes based
off the highest possible magnetic field seen
by the sensor
Magnetic Range Selection
RPM
<600
<600
Desired Accuracy
<1° for 360° rotation
<1° for 360° rotation
8.2.1.1 Gain Adjustment for Angle Measurement
Common measurement topology include angular position measurements in on-axis or off-axis angular
measurements shown in Figure 8-5. Select the on-axis measurement topology whenever possible, as this offers
the best optimization of magnetic field and the device measurement ranges. The TMAG5170 offers an on-chip
gain adjustment option to account for mechanical position misalignments.
On-axis
Off-axis
S
S
N
N
Figure 8-5. On-Axis vs. Off-Axis Angle Measurements
8.2.2 Detailed Design Procedure
For accurate angle measurement, the two axes amplitudes must be normalized by selecting the proper gain
adjustment value in the MAG_GAN_CONFIG register. The gain adjustment value is a fractional decimal number
between 0 and 1. The following steps must be followed to calculate this fractional value:
1. Set the device at 32x average mode and rotate the shaft a full 360 degree.
2. Record the two axes sensor ADC codes for the full 360 degree rotation.
3. Measure the maximum peak-peak ADC code delta for each axis, Ax and Ay, as shown in Figure 8-6 or
Figure 8-7.
4. Calculate the gain adjustment value for X axis:
#
;
): =
#
:
(18)
5. If GX>1, apply the gain adjustment value to Y axis:
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1
); =
)
:
(19)
(20)
6. Calculate the target binary gain setting at the GAIN_VALUE register bits:
GX or GY = GAIN_VALUEdecimal / 1024
Example 1: If AX = AY = 60,000, the GAIN_SELECTION resister bits can be set as 00b. The GAIN_VALUE
register bits are don't care bits in this case.
Example 2: If AX= 60,000, AY = 45,000, the GX = 45,000/60,000 =0.75. Select 01b for the GAIN_SELECTION
register bits.
Example 3: If AX= 45,000, AY = 60,000, the GX = (60,000/45,000) =1.33. Since GX >1, the gain adjustment
needs to be applied to Y axis with GY =1/GX. Select 10b for the GAIN_SELECTION register bits.
8.2.3 Application Curves
Ay
Ax = Ay
Figure 8-7. X and Y Sensor Data for Full 360
Degree Rotation for Off-Axis Measurement
Figure 8-6. X and Y Sensor Data for Full 360
Degree Rotation for On-Axis Measurement
8.3 Do's and Don'ts
The TMAG5170 updates the result registers at the end of a conversion. SPI read of the result register needs
to be synchronized with the conversion update time to ensure reading the updated result data. The conversion
update time, tmeasure is defined in the Electrical Characteristics table. Figure 8-8 shows examples of correct
and incorrect SPI read timings for applications with strict timing budgets. Use the ALERT signal to notify the
controller when a conversion is complete.
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Figure 8-8. SPI Read During Continuous Conversion
9 Power Supply Recommendations
A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI
recommends using a ceramic capacitor with a value of at least 0.01 µF. Connect the TEST pin to ground.
10 Layout
10.1 Layout Guidelines
Magnetic fields pass through most nonferromagnetic materials with no significant disturbance. Embedding Hall-
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed circuit boards (PCBs), which makes placing the magnet on
the opposite side of the PCB possible.
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10.2 Layout Example
SCK
SDI
SDO
CS
ALERT
TEST
GND
VCC
Figure 10-1. Layout Example With TMAG5170
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
11.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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24-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMAG5170A1QDGKR
TMAG5170A1QDGKT
TMAG5170A2QDGKR
TMAG5170A2QDGKT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VSSOP
VSSOP
VSSOP
VSSOP
DGK
DGK
DGK
DGK
8
8
8
8
2500 RoHS & Green
250 RoHS & Green
2500 RoHS & Green
250 RoHS & Green
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 150
-40 to 150
-40 to 150
-40 to 150
70A1
70A1
70A2
70A2
SN
SN
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Sep-2021
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMAG5170 :
Automotive : TMAG5170-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Sep-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMAG5170A1QDGKR
TMAG5170A1QDGKT
TMAG5170A2QDGKR
TMAG5170A2QDGKT
VSSOP
VSSOP
VSSOP
VSSOP
DGK
DGK
DGK
DGK
8
8
8
8
2500
250
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
5.3
5.3
5.3
5.3
3.4
3.4
3.4
3.4
1.4
1.4
1.4
1.4
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
2500
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Sep-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMAG5170A1QDGKR
TMAG5170A1QDGKT
TMAG5170A2QDGKR
TMAG5170A2QDGKT
VSSOP
VSSOP
VSSOP
VSSOP
DGK
DGK
DGK
DGK
8
8
8
8
2500
250
366.0
366.0
366.0
366.0
364.0
364.0
364.0
364.0
50.0
50.0
50.0
50.0
2500
250
Pack Materials-Page 2
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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Copyright © 2021, Texas Instruments Incorporated
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