TMP114NC [TI]
TMP114 Ultra-Thin, 1.2-V to 1.8-V Supply, High Accuracy Digital Temperature Sensor with I2C Interface;
| 型号： | TMP114NC |
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| 描述： | TMP114 Ultra-Thin, 1.2-V to 1.8-V Supply, High Accuracy Digital Temperature Sensor with I2C Interface |
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TMP114
SNIS214A – JUNE 2021 – REVISED SEPTEMBER 2021
TMP114 Ultra-Thin, 1.2-V to 1.8-V Supply, High Accuracy Digital Temperature Sensor
with I2C Interface
1 Features
3 Description
•
High accuracy
– TMP114:
The TMP114 is a high accuracy, I2C-compatible
digital temperature sensor in an ultra-thin (0.15 mm)
4-pin package. The small size and low height of
the TMP114 package optimizes volume constrained
systems and enables novel placement of the sensor
under other surface mount components for the fastest
and most accurate temperature measurement.
•
•
±0.3 °C maximum from –10 °C to 85 °C
±0.5 °C maximum from –40 °C to 125 °C
– TMP114N package option:
•
±1 °C maximum from –40 °C to 125 °C
•
•
•
Operating temperature range: –40 °C to +125 °C
16-bit resolution: 0.0078 °C (LSB)
Low power consumption:
– 0.7-µA average supply current
– 0.16-µA shutdown current
Supply range: 1.08 V to 1.98 V
1.2-V compatible logic inputs independent of
supply voltage
The TMP114 has an accuracy of ±0.3 °C and offers
an on-chip 16-bit analog-to-digital converter (ADC)
that provides a temperature resolution of 0.0078 °C.
The TMP114 is 100% tested on a production setup
that is NIST traceable.
•
•
To maximize battery life, the TMP114 is designed to
operate from a supply voltage range of 1.08 V to 1.98
V, with a low average supply current of less than 0.7
μA.
•
•
•
•
•
•
•
•
•
•
I2C and SMBus compatible interface
50-ns spike filter to coexist on I3C mixed bus
Optional Cyclic Redundancy Check (CRC)
300-ms response time
Device Information
PART NUMBER
TMP114
PACKAGE(1)
BODY SIZE (NOM)
Adjustable averaging
Adjustable conversion time and period
Continuous or one-shot conversion mode
Temperature alert status with hysteresis
NIST traceability
Ultra-thin 4-ball PicoStar (DSBGA) package with
0.15-mm height
0.758 mm × 0.758
mm
PicoStar (4)
(1) For all available packages, see the package option
addendum at the end of the data sheet.
1.08 V to 1.98 V
1.2 kΩ
1.2 kΩ
2 Applications
0.1 µF
VDD
•
•
•
•
•
•
•
•
Mobile phones
I2C
Controller
SCL
SDA
SCL
SDA
TMP114
GND
Solid state drives (SSDs)
Wearable fitness & activity monitors
Portable electronics
Set-top boxes (STBs)
Notebooks
Simplified Schematic
IP Camera
Digital Still Camera
1
0.75
0.5
1.2 V Average
1.8 V Average
0.25
0
-0.25
-0.5
-0.75
-1
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Temperature Accuracy
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TMP114
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SNIS214A – JUNE 2021 – REVISED SEPTEMBER 2021
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison.........................................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings ....................................... 4
7.2 ESD Ratings .............................................................. 4
7.3 Recommended Operating Conditions ........................4
7.4 Thermal Information ...................................................4
7.5 Electrical Characteristics ............................................5
7.6 I2C Interface Timing ................................................... 7
7.7 Two-Wire Timing Diagram...........................................7
7.8 Typical Characteristics................................................8
8 Detailed Description......................................................12
8.1 Overview...................................................................12
8.2 Functional Block Diagram.........................................12
8.3 Feature Description...................................................13
8.4 Device Functional Modes..........................................17
8.5 Programming............................................................ 19
8.6 Register Map.............................................................29
9 Application and Implementation..................................39
9.1 Application Information............................................. 39
9.2 Separate I2C Pullup and Supply Application.............39
9.3 Equal I2C Pullup and Supply Voltage Application..... 40
10 Power Supply Recommendations..............................41
11 Layout...........................................................................41
11.1 Layout Guidelines................................................... 41
11.2 Layout Example...................................................... 41
12 Device and Documentation Support..........................42
12.1 Receiving Notification of Documentation Updates..42
12.2 Support Resources................................................. 42
12.3 Trademarks.............................................................42
12.4 Electrostatic Discharge Caution..............................42
12.5 Glossary..................................................................42
13 Mechanical, Packaging, and Orderable
Information.................................................................... 42
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (June 2021) to Revision A (September 2021)
Page
•
•
•
Added TMP114N orderable preview information................................................................................................1
Changed the data sheet status from Advanced Information to Production Mixed..............................................1
Added Device Options table............................................................................................................................... 3
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5 Device Comparison
Table 5-1. Device Options
PRODUCT
TMP114A
DEVICE ACCURACY
DEVICE TWO-WIRE ADDRESS
0.3 °C
0.3 °C
0.3 °C
1 °C
1001000
1001001
1001010
1001101
1001110
TMP114B
TMP114C
TMP114NC(1)
TMP114NB(1)
1 °C
(1) Preview only
6 Pin Configuration and Functions
1
2
VDD
GND
A
B
SDA
SCL
Figure 6-1. YMT Package 4-Pin PicoStar Top View
Table 6-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
VDD
GND
SDA
SCL
NO.
A1
A2
B1
B2
I
Supply voltage
Ground
—
IO
I
Serial data input and open-drain output. Requires a pullup resistor
Serial clock
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
-0.3
-0.3
MAX
2.1
UNIT
V
Power supply, VDD
Input voltage SCL, SDA
Output sink current SDA
Junction temperature, TJ
Storage temperature, Tstg
2.1
V
15
mA
°C
-55
-65
150
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.08
0
NOM
MAX
1.98
1.98
3
UNIT
V
Supply voltage
VDD
I/O Voltage
SCL, SDA
SDA
V
IOL
0
mA
°C
Operating free-air temperature, TA
–40
125
7.4 Thermal Information
TMP114
YMT
4 PINS
168.7
1.0
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bot) thermal resistance
Thermal mass
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
mJ/°C
RθJC(top)
RθJB
47.3
0.6
ΨJT
ΨJB
47.3
–
RθJC(bot)
MT
0.16
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
Over free-air temperature range and VDD = 1.08 V to 1.98 V (unless otherwise noted); Typical specifications are at TA = 25 °C
and VDD = 1.2 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE SENSOR
TA = -10 °C to 80 °C
VDD = 1.8 V
-0.3
0.3
Temperature Accuracy TMP114
Active Conversion time =
6.4 ms
(1)
TERR
°C
TA = -40 °C to 125 °C
TA = -40 °C to 125 °C
-0.5
-1
0.5
1
Temperature Accuracy TMP114N
Temperature resolution
Including sign bit
LSB
16
7.8125
0.17
Bits
m°C
°C/V
TRES
PSR
DC power supply rejection
One-shot mode
VDD= 1.2 V(3)
TA = 25 °C
Averaging off
6.4 ms conversion time
TREPEAT Repeatability(2)
0.06
0.03
300
980
°C
1000 hours at 125 °C, 1.98
V
TLTD
Long-term drift(4)
Single layer Flex PCB
0.2032 mm thickness
τ = 63% for step response
from 25 °C to 75 °C
tLIQUID
Response Time (Stirred Liquid)
ms
°C
2-layer FR4 PCB
1.5748 mm thickness
TSTART = -40 °C
TFINISH = 125 °C
TTEST = 25 °C
3 cycles
Temperature cycling and
hysteresis
0.05
AVG = 0
AVG = 1
5
6.4
7.5
60
tCONV
Active conversion time
Timing variation
ms
%
40
51.2
Conversion Period
Slew Rate Result
Slew Rate Limit
tVAR
-15
15
DIGITAL INPUT/OUTPUT
CIN
VIH
VIL
IIN
Input capacitance
f = 100 kHz
3
10
1.98
0.35
0.2
pF
V
High-level input logic
Low-level input logic
Leakage input current
Low-level output logic
0.84
0
V
-0.2
0
µA
V
VOL
SDA
IOL = -2 mA
0.10
0.20
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Over free-air temperature range and VDD = 1.08 V to 1.98 V (unless otherwise noted); Typical specifications are at TA = 25 °C
and VDD = 1.2 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
TA = 25 °C
68
110
150
1.5
IDD_ACTIV Supply current during active
Serial bus inactive
µA
conversion
E
TA = -40 °C to 125 °C
Continuous Conversion
cycle = 1 Hz
TA = 25 °C
0.63
Serial bus inactive
AVG = 0
TA = -40 °C to 125 °C
TA = 25 °C
3.5
6
IDD
Average current consumption
µA
Continuous Conversion
cycle = 1 Hz
Serial bus inactive
AVG = 1
3.5
0.26
0.16
TA = -40 °C to 125 °C
TA = 25 °C
8.5
0.7
3
Continuous mode
Serial bus inactive
Between active
conversions
ISB
Standby current
µA
uA
TA = -40 °C to 125 °C
TA = 25 °C
0.5
2.5
ISD
Shutdown current
Serial bus inactive
TA = -40 °C to 125 °C
Supply rising, Power-on
Reset
VPOR
VBOR
tINIT
Power supply thresholds
Power supply thresholds
0.97
0.92
V
Supply failing, Brown-out
Detect
Initialization time after Power-on
Reset
1
1
ms
ms
Soft Reset or General Call
Reset
tRESET
Reset recovery time
(1) Temperature Accuracy guaranteed in both continuous conversion mode and one-shot mode with a conversion period greater than or
equal to 31.25 ms. Averaging on or Averaging off.
(2) Repeatability is the ability to reproduce a reading when the measured temperature is applied consecutively, under the same conditions.
(3) One-shot mode setup, 1 sample per minute for 24 hours.
(4) Long-term drift is determined using accelerated operational life testing at a junction temperature of 150°C. Temperature Cycling and
Hysteresis effect is calculated out of final datasheet value.
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7.6 I2C Interface Timing
minimum and maximum specifications are over –40 °C to 125 °C and VDD = 1.08 V to 1.98 V (unless otherwise noted)(1)
FAST MODE
FAST MODE PLUS
UNIT
MIN
1
MAX
MIN
1
MAX
f(SCL)
SCL operating frequency
400
1000
kHz
µs
t(BUF)
Bus-free time between STOP and START conditions
Repeated START condition setup time
1.3
0.6
0.5
0.26
t(SUSTA)
µs
Hold time after repeated START condition.
After this period, the first clock is generated.
t(HDSTA)
0.6
0.26
µs
t(SUSTO)
t(HDDAT)
t(SUDAT)
t(LOW)
t(HIGH)
t(VDAT)
tR
STOP condition setup time
Data hold time(2)
0.6
12
0.26
12
µs
ns
ns
µs
µs
µs
ns
900
150
Data setup time
100
1.3
0.6
50
SCL clock low period
SCL clock high period
Data valid time (data response time)(3)
SDA, SCL rise time
0.5
0.26
0.9
0.45
120
20
300
20 x
(VDD / 5.5 V)
20 x
(VDD / 5.5 V)
tF
SDA, SCL fall time
300
36
120
37
ns
ttimeout
tLPF
Timeout (SCL = GND or SDA = GND)
Glitch suppression filter
23
50
23
50
ms
ns
(1) The controller and device have the same VDD value. Values are based on statistical analysis of samples tested during initial release.
(2) The maximum t(HDDAT) can be 0.9 µs for fast mode, and is less than the maximum t(VDAT) by a transition time.
(3) t(VDAT) = time for data signal from SCL LOW to SDA output (HIGH to LOW, depending on which is worse).
7.7 Two-Wire Timing Diagram
t(LOW)
tR
tF
t(HDSTA)
SCL
SDA
t(SUSTO)
t(HDSTA)
t(HIGH)
t(SUSTA)
t(SUDAT)
t(HDDAT)
t(BUF)
P
S
S
P
Figure 7-1. Two-Wire Timing Diagram
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7.8 Typical Characteristics
1
1
0.75
0.5
1.8 V Average
TMP114 1.8 V Min/Max
1.2 V Average
TMP114 Min/Max
0.75
0.5
0.25
0
0.25
0
-0.25
-0.5
-0.75
-1
-0.25
-0.5
-0.75
-1
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Temperature (C)
VDD = 1.8 V
VDD = 1.2 V
Conversion Period 31.25 ms to 2 s
AVG = 0 or 8 Averages
Conversion Period 31.25 ms to 2 s
AVG = 0 or 8 Averages
Figure 7-2. Temperature Error vs. Temperature
Figure 7-3. Temperature Error vs. Temperature
140
120
100
80
2
1.75
1.5
1.25
1
1.2 V
1.5 V
1.8 V
1.2 V
1.5 V
1.8 V
60
0.75
0.5
0.25
0
40
20
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Figure 7-5. Standby Current vs. Temperature
Figure 7-4. Active Current vs. Temperature
2
1.75
1.5
1.25
1
30
25
20
15
10
5
1.2 V
1.5 V
1.8 V
100 kHz
400 kHz
1 MHz
0.75
0.5
0.25
0
0
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
1
1.2
1.4
1.6
1.8
2
Voltage (V)
Figure 7-6. Shutdown Current vs Temperature
A.
TA = -40 °C
Figure 7-7. Supply Current vs. VDD with Toggling SCL
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7.8 Typical Characteristics (continued)
30
30
25
20
15
10
5
100 kHz
400 kHz
1 MHz
100 kHz
400 kHz
1 MHz
25
20
15
10
5
0
0
1
1.2
1.4
1.6
1.8
2
1
1.2
1.4
1.6
1.8
2
Voltage (V)
Voltage (V)
A.
TA = 25 °C
A.
TA = 125 °C
Figure 7-8. Supply Current vs. VDD with Toggling SCL
Figure 7-9. Supply Current vs. VDD with Toggling SCL
7
0.25
1.2 V
1.5 V
1.8 V
1.2 V
1.5 V
1.8 V
6.75
6.5
6.25
6
0.2
0.15
0.1
0.05
0
5.75
5.5
5.25
5
-40 -25 -10
5
20 35 50 65 80 95 110 125
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Temperature (C)
Figure 7-10. Conversion Time vs. Temperature
Figure 7-11. VOL vs. Temperature
100
80
60
40
20
0
80
70
60
50
40
30
20
10
0
Rigid PCB
Flex PCB
0
5
10
15
20
-5
-4
-3
-2
-1
0
1
2
3
4
5
Time (s)
Data Distribution (LSB)
A.
TSTART = Room (25 °C), TFINISH = 75 °C
A.
TA = 25 °C
Figure 7-12. Response Time
Figure 7-13. Data Distribution with 6.4 ms Conversion Time and
Averaging On
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7.8 Typical Characteristics (continued)
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
-5
-4
-3
-2
-1
0
1
2
3
4
5
Data Distribution (LSB)
Data Distribution (LSB)
A.
TA = 25 °C
A.
TA = 25 °C
Figure 7-14. Data Distribution with 6.4 ms Conversion Time and Figure 7-15. Data Distribution with 3.5 ms Conversion Time and
Averaging Off
Averaging On
80
70
60
50
40
30
20
10
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
Data Distribution (LSB)
A.
TA = 25 °C
A.
TA = 25 °C
Figure 7-16. Data Distribution with 3.5 ms Conversion Time and Figure 7-17. Data Distribution with 2.0 ms Conversion Time and
Averaging Off Averaging On
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
-5
-4
-3
-2
-1
0
1
2
3
4
5
-5
-4
-3
-2
-1
0
1
2
3
4
5
Data Distribution (LSB)
Data Distribution (LSB)
A.
TA = 25 °C
A.
TA = 25 °C
Figure 7-18. Data Distribution with 2.0 ms Conversion Time and Figure 7-19. Data Distribution with 1.2 ms Conversion Time and
Averaging Off
Averaging On
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7.8 Typical Characteristics (continued)
20
16
12
8
4
0
-10-9 -8 -7 -6 -5 -4 -3 -2 -1 0
1 2 3 4 5 6 7 8 9 10
Data Distribution (LSB)
A.
TA = 25 °C
Figure 7-20. Data Distribution with 1.2 ms Conversion Time and Averaging Off
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8 Detailed Description
8.1 Overview
The TMP114 is a digital output temperature sensor that comes factory calibrated on a NIST traceable setup.
The device features a two-wire SMBus and I2C interface-compatible interface with two modes of operation:
continuous mode and shutdown mode designed for thermal management and thermal protection applications.
The TMP114 also includes an alert status register with individual high and low thresholds along with adjustable
hysteresis values.
Communication with the TMP114 has an integrated optional Cyclic Redundancy Check (CRC) module that will
validate the data integrity of write and read operations.
8.2 Functional Block Diagram
VDD
Oscillator
SCL
I/O
Buffer
Register
Bank
Digital Core
SDA
Internal
thermal
BJT
Temperature
sensor circuitry
ADC
GND
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8.3 Feature Description
8.3.1 1.2 V Compatible Logic Inputs
The TMP114 features static input thresholds on the SCL and SDA pins independent of supply voltage. This
allows the TMP114 to work with a 1.2 V or 1.8 V I2C bus at any supported supply voltage.
8.3.2 Cyclic Redundancy Check (CRC)
The TMP114 implements an optional CRC function to improve data integrity and communication robustness
using an 8-bit polynomial that is checked during communication. By default the feature is disabled and can be
enabled by setting the CRC_EN bit in the Configuration register.
When enabled, the CRC function starts with the seed value of FFh at every start or repeated start condition on
the bus and computes one CRC value. After transmitting or receiving a CRC value the TMP114, the next CRC
will have the seed value reset to FFh.
When the TMP114 operates in target receive mode or during a write bus transaction, the CRC byte covers the
device address, pointer address, and received data bytes. If the device detects a CRC error on the byte, it
shall set the CRC_flag status bit in the Alert_Status register. If the CRC byte is not present, the transaction is
discarded and the CRC flag is not set.
When the TMP114 operates in target transmit mode or during a read bus transaction, the CRC byte covers the
device address and the sent data bytes.
8.3.3 Temperature Limits
TMP114 includes an on-board temperature limit warning. At the end of every completed conversion, the TMP114
compares the result against the limits stored in the low limit register and the high limit register. When the
results exceed the THigh_Limit register value, the THigh_Status and THigh_Flag bits are set. Upon read, the
THigh_Flag will clear but the THigh_Status bit will remain set. After the measured temperature crosses below
the THigh_Limit - THigh_Hyst value, the THigh_Status bit will clear and the THigh_Flag bit is set again to
indicate a change in the temperature with respect to the limits.
If the controller is unable to read the Temp_Result register for a prolonged period of time, the flag bits can be
used to determine if a thermal limit was crossed during that time. The flag bits will only clear after a successful
Alert_Status register read, therefore the high and low flags can help determine if the system crossed the
thermal limit before an I2C read could be performed. The Status bits will automatically update with changing
Temp_Result values. Figure 8-1 depicts this behavior.
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THigh_Limit
THigh_Limit œ THigh_Hyst
Temperature
TLow_Limit + TLow_Hyst
TLow_Limit
Temperature conversions
THigh_Status
THigh_Flag
TLow_Status
TLow_Flag
I2C Read
Figure 8-1. Alert Status Timing Diagram
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8.3.4 Slew Rate Warning
The slew warning alert is an alert option that can be adjusted with the Slew_Limit register. The slew rate warning
will notify the system of rapid temperature changes as they occur, allowing the system to react and correct
for the increase in temperature before reaching thermal operating limits. Compared to throttling a system after
crossing a thermal limit, the slew rate warning will allow more safe system operation and greater reliability by not
exceeding specified system operating conditions.
High temperature limit
System adjusts to fix temperature
spike before hitting overtemperature
condition
Low temperature limit
Time
Slew_Flag
Figure 8-2. Slew Rate Alert
Calculating the slew rate requires a fixed time period to calculate and is only available in continuous mode. The
Slew_Limit register is used to set the unsigned limit. The TMP114 will monitor the temperature slew rate and
compare the positive change of temperature from the current conversion to the previous against the Slew_Limit.
If the slew rate exceeds the Slew_Limit, the respective bits in the Alert_Status register will be set to indicate
the warning. Figure 8-2 depicts the timing of the Slew Rate Warning relative to the temperature conversions.
The slew rate check is always applied to the current temperature conversion and the previous temperature
conversion.
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Slew_Limit
Temperature
Temperature conversions
Slew_Status
Slew_Flag
I2C Read
Figure 8-3. Slew Rate Warning Timing Diagram
The accuracy of the slew rate alert is ±15 % due to the dependence on the internal oscillator frequency variation
for the calculation. Upon exiting continuous conversion mode, the slew rate alert will be automatically shut
off. The register settings will not be altered. The feature will automatically turn on upon entering continuous
conversion mode. The slew rate alert can only be set for positive slew rate limits.
8.3.5 NIST Traceability
The accuracy of temperature testing is verified with equipment that is calibrated by an accredited lab that
complies with ISO/IEC 17025 policies and procedures. Each device is tested and trimmed to conform to its
respective data sheet specification limits.
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8.4 Device Functional Modes
The TMP114 can be configured to operate in continuous or shutdown mode. This flexibility enables designers to
balance the requirements of power efficiency and performance.
8.4.1 Continuous Conversion Mode
When the Mode bit is set to 0b in the configuration register, the device operates in continuous conversion mode.
Figure 8-4 shows the device in a continuous conversion cycle. In this mode, the device can perform multiple
conversions and updates the temperature result register and Data_Ready_Flag in the alert status register at
the end of every active conversion. The typical active conversion time for the device is 6.4 ms with averaging
disabled. When averaging is enabled, the device will convert 8 consecutive times at the beginning of every
conversion period for a typical time of 51.2 ms.
Start of conversion
tStandby timet
)
(TSTDBY
Active conversion time
(TACT
)
Conversion interval
(TCONV
Conversion interval
)
DRDY Flag
I2C Temperature Read or
I2C Alert Status Read
Figure 8-4. Continuous Conversion Cycle Timing Diagram
The Conv_Period[1:0] bits in the configuration register control the rate at which the conversions are performed.
The device typically consumes 68 µA during conversion and 0.26 µA during the low power standby period. By
decreasing the rate at which the conversions are performed, the application can benefit from reduced average
current consumption in continuous mode.
Use Equation 1 to calculate the average current in continuous mode.
Average Current = ((IACT × tACTIVE) + (IStandby × tStandby)) / tConv_Period
(1)
Where
•
•
•
tACTIVE = Active Conversion Time
tConv_Period = Conversion Period
tStandby = Standby time between conversions calculate as tConv_Period – tACTIVE
8.4.2 Shutdown Mode
When the Mode bit is set to 1b in the Configuration register, the device immediately enters the low-power
shutdown mode. If the TMP114 is performing a temperature conversion, the device will stop the conversion and
discard the partial result. In this mode, the device powers down all active circuitry and can be used in conjunction
with the One_Shot bit to perform One-Shot temperature conversions. Shutdown mode enables designers to
extend battery life as the typical power consumption is only 0.16uA in this mode of operation.
Changing between continuous and shutdown modes will not clear any active. The slew rate alert will not be
triggered again in shutdown mode, but previous active alerts will not clear until the alert register is read or a
one-shot temperature conversion is triggered.
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8.4.2.1 One-Shot Temperature Conversions
When the OS bit is set to 1b in the Configuration register, the TMP114 immediately start a one-shot temperature
conversion. If the TMP114 is performing a temperature conversion, the device will stop the active conversion and
discard the partial result, then start a new one-shot conversion. After completing the one-shot conversion the
TMP114 will enter shutdown mode, the OS bit will be cleared, and the Mode bit will be set to 1b. If a one-shot
conversion is triggered in continuous mode the device will enter shutdown mode after the one-shot conversion
completes.
Start of conversion
tShutdownt
Active conversion time
I2C One-Shot Command
Temperature Conversion
Temp_Result Updated
Figure 8-5. One-Shot Timing Diagram
If the One_Shot bit is continuously written as faster than the active conversion time of the TMP114, the device
will continue to restart the temperature conversion with each new write to the One_Shot bit. TI recommends to
avoid this behavior because the temperature result does not update until a conversion finishes. If the system
triggers several continuous one-shot conversions, Figure 8-6 depicts how the device would continually partially
finish new conversions and not update the Temp_Result register.
Start of first conversion
Start of new conversions
Discard partial conversion
I2C One-Shot Command
Active conversion time
Temperature Conversion
Temp_Result Updated
Figure 8-6. One-Shot Continuous Trigger Timing Diagram
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8.5 Programming
8.5.1 Temperature Data Format
Temperature data is represented by a 16-bit two's complement word with a Least Significant Bit (LSB) equal to
0.0078125 °C. The temperature output of the TMP114 has a range of -256 °C to 255 °C.
Table 8-1. 16-Bit Temperature Data Format
Digital Output
Temperature
Binary
Hex
3E80
0C80
0001
0000
FFFF
F380
EC00
+125 °C
+25 °C
0011 1110 1000 0000
0000 1100 1000 0000
0000 0000 0000 0001
0000 0000 0000 0000
1111 1111 1111 1111
1111 0011 1000 0000
1110 1100 0000 0000
+0.0078125 °C
0 °C
−0.0078125 °C
−25 °C
−40 °C
8.5.2 I2C and SMBus Interface
The TMP114 has a standard bidirectional I2C interface that is controlled by a controller device in order to
be configured or read the status of this device. Each target on the I2C bus has a specific device address
to differentiate between other target devices that are on the same I2C bus. Many target devices require
configuration upon start-up to set the behavior of the device. This is typically done when the controller accesses
internal register maps of the target, which have unique register addresses. A device can have one or multiple
registers where data is stored, written, or read. The TMP114 includes 50-ns glitch suppression filters, allowing
the device to coexist on an I3C mixed bus. The TMP114 supports transmission data rates up to 1 MHz.
The physical I2C interface consists of the serial clock (SCL) and serial data (SDA) lines. Both SDA and SCL
lines must be connected to a supply through a pullup resistor. The size of the pullup resistor is determined by
the amount of capacitance on the I2C lines and the communication frequency. For further details, see the I2C
Pullup Resistor Calculation application report. Data transfer may be initiated only when the bus is idle. A bus is
considered idle if both SDA and SCL lines are high after a STOP condition (see Figure 8-7 and Figure 8-8).
The following is the general procedure for a controller to access a target device:
1. If a controller wants to send data to a target:
•
•
•
•
Controller-transmitter sends a START condition and addresses the target-receiver.
Controller-transmitter sends the requested register to write target-receiver.
Controller-transmitter sends data to target-receiver.
Controller-transmitter terminates the transfer with a STOP condition.
2. If a controller wants to receive or read data from a target:
•
•
•
•
Controller-receiver sends a START condition and addresses the target-transmitter.
Controller-receiver sends the requested register to read to target-transmitter.
Controller-receiver receives data from the target-transmitter.
Controller-receiver terminates the transfer with a STOP condition.
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SCL
SDA
Data Transfer
START
STOP
Condition
Condition
Figure 8-7. Definition of Start and Stop Conditions
SDA line is stable while SCL line is high
SCL
SDA
1
0
1
0
1
0
1
0
ACK
MSB
Bit
Bit
Bit
Bit
Bit
Bit
LSB
ACK
Byte: 1010 1010 (AAh)
Figure 8-8. Bit Transfer
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8.5.3 Device Address
To communicate with the TMP114, the controller must first address target devices through an address byte. The
address byte has seven address bits and a read-write (R/W) bit that indicates the intent of executing a read or
write operation. Table 8-2 shows the TMP114 available in multiple versions, each with a different target address.
Table 8-2. Device Target Address
Product
TMP114A
TMP114B
TMP114C
TMP114NC
TMP114NB
Device Two-Wire Address
1001000
1001001
1001010
1001101
1001110
8.5.4 Bus Transactions
Data must be sent to and received from the target devices, and this is accomplished by reading from or writing to
registers in the target device.
Registers are locations in the memory of the target which contain information, whether it be the configuration
information or some sampled data to send back to the controller. The controller must write information to these
registers in order to instruct the target device to perform a task.
8.5.4.1 Auto-Increment
The TMP114 supports the use of the auto-increment feature. In the control register byte of the I2C transaction,
bit 7 is used as the auto-increment bit. If the bit is set to 0b, continuous reads or writes will only read and write to
the register specified in the register pointer. If the Auto-increment bit is set to 1b, continuous reads and writes will
increment the address pointer by 1 after every word of data has been read or written to the TMP114. This allows
the controller to read or write to multiple registers with a single transaction for faster communication.
Figure 8-9 shows the structure of the Control Register.
Controller controls SDA line
Target controls SDA line
Register Pointer (N)
0
0
0
0
P3 P2 P1 P0
A
Must be 0h
Auto-Increment
ACK from Target
Figure 8-9. Control Register
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8.5.4.2 Writes
To write on the I2C bus, the controller sends a START condition on the bus with the address of the target, as well
as the last bit (the R/W bit) set to 0b, which signifies a write. The target acknowledges, letting the controller know
it is ready. After this, the controller starts sending the control register data to the target until the controller has
sent all the data necessary, and the controller terminates the transmission with a STOP condition.
Writes to read-only registers or register locations outside of the register map will be ignored. The TMP114 will
still ACK when writing outside of the register map.
Figure 8-10 shows an example of writing a single word write communication.
Controller controls SDA line
Target controls SDA line
Target Address
Register Pointer (N)
P3 P2 P1 P0
Data to Register N MSB
Data to Register N LSB
D7 D6 D5 D4 D3 D2 D1 D0
A
P
S
A6 A5 A4 A3 A2 A1 A0
0
A
0
0
0
0
A
D15 D14 D13 D12 D11 D10 D9 D8
A
START
R/W
Must be 0h
STOP
ACK from Target
Auto-Increment
ACK from Target
ACK from Target
ACK from Target
Figure 8-10. Write to Single Register
Multiple writes to the same register are also possible with the TMP114. Figure 8-11 shows how the controller can
repeatedly write to the same register when the Auto-Increment bit in the control register is set to 0b.
Controller controls SDA line
Target controls SDA line
Target Address
Register Pointer (N)
P3 P2 P1 P0
Data to Register N MSB
Data to Register N LSB
D7 D6 D5 D4 D3 D2 D1 D0
A
S
A6 A5 A4 A3 A2 A1 A0
0
A
0
0
0
0
A
D15 D14 D13 D12 D11 D10 D9 D8
A
START
R/W
Must be 0h
ACK from Target
Auto-Increment
ACK from Target
ACK from Target
ACK from Target
Data to Register N MSB
Data to Register N LSB
D7 D6 D5 D4 D3 D2 D1 D0
A
P
D15 D14 D13 D12 D11 D10 D9 D8
A
STOP
ACK from Target
ACK from Target
Figure 8-11. Repeated Write to Single Register
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The TMP114 also supports a continuous write to sequential registers. By setting the Auto-Increment bit in the
control register to 1b, the TMP114 will increment the address pointer after each word of data is written to the
device. This allows the controller to write multiple register values in the same transaction as shown in Figure
8-12. Currently this feature will not allow the controller to properly write to the Configuration register and it is
recommended to use single register writes to the Configuration register.
Controller controls SDA line
Target controls SDA line
Target Address
Register Pointer (N)
P3 P2 P1 P0
Data to Register N MSB
Data to Register N LSB
D7 D6 D5 D4 D3 D2 D1 D0
A
S
A6 A5 A4 A3 A2 A1 A0
0
A
1
0
0
0
A
D15 D14 D13 D12 D11 D10 D9 D8
A
START
R/W
Must be 0h
ACK from Target
Auto-Increment
ACK from Target
ACK from Target
ACK from Target
Data to Register N+1 MSB
Data to Register N+1 LSB
D7 D6 D5 D4 D3 D2 D1 D0
A
P
D15 D14 D13 D12 D11 D10 D9 D8
A
STOP
ACK from Target
ACK from Target
Figure 8-12. Burst Write to Multiple Registers
8.5.4.2.1 CRC Enabled Writes
The TMP114 supports the ability to check data integrity with an 8-bit CRC value for every transaction. By
setting the CRC_Enable bit to 1b in the Configuration Register, the device will use CRC to validate any write
transactions. During a CRC enabled write transaction, the TMP114 will check the Target Address, Control
Register, MSB, and LSB of data against the CRC value. After the first CRC byte, each subsequent MSB and
LSB of data sent to the TMP114 will have its own CRC byte for validation. If the first CRC byte fails, the
TMP114 will discard the entire write transaction. If the first CRC passes, the TMP114 will only discard data if
the associated CRC checksum fails. For example, consider the case where a controller tries to write values to
registers 03h, 04h, and 05h. If the first and third CRC values are valid but the second CRC value is incorrect,
the TMP114 will shift the 03h and 05h values into the registers and discard the 04h values. Figure 8-13shows an
overview of a write transaction with CRC.
If the TMP114 determines the CRC failed, it will NACK on the CRC byte and the CRC_Flag bit in the Alert status
register will be set. If the CRC byte is not included the TMP114 will interpret this as an incomplete transaction
and discard the write contents and the status flag will not be set. Multiple writes to the same register in a single
transaction with Auto-Increment set to 0b and CRC enabled is not supported.
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Controller controls SDA line
Target controls SDA line
Target
Address
Control
Register
MSB Data
to Register
LSB Data
to Register
MSB Data
to Register
LSB Data
to Register
I2C Bus
CRC
CRC
Subsequent CRC bytes determined by
preceding MSB and LSB bytes.
First CRC determined by Target Address, Pointer Register, MSB, and LSB data bytes
Figure 8-13. CRC Enabled Write
8.5.4.3 Reads
For a read operation the controller sends a START condition, followed by the target address with the R/W bit
set to 0b (signifying a write). The target acknowledges the write request, and the controller sends the command
byte with the Auto-Increment bit and Register Pointer. After the Control Register, the controller will initiate a
restart followed by the target address with the R/W bit set to 1b (signifying a read). The controller will continue
to send out clock pulses but releases the SDA line so that the target can transmit data. At the end of every byte
of data, the controller sends an ACK to the target, letting the target know that it is ready for more data. Once
the controller has received the number of bytes it is expecting, it sends a NACK, signaling to the target to halt
communications and release the SDA line. The controller follows this up with a STOP condition. Reading from a
non-indexed register location will return 00h.
Figure 8-14 shows an example of reading a single word from a target register.
Controller controls SDA line
Target controls SDA line
Target Address
Register Pointer (N)
P3 P2 P1 P0
Target Address
S
A6 A5 A4 A3 A2 A1 A0
0
A
0
0
0
0
A
Sr A6 A5 A4 A3 A2 A1 A0
1
A
START
R/W
Must be 0h
Re-START
R/W
ACK from Target
Auto-Increment
ACK from Target
ACK from Target
Data from Register N MSB
Data from Register N LSB
D7 D6 D5 D4 D3 D2 D1 D0 NA
P
D15 D14 D13 D12 D11 D10 D9 D8
A
STOP
ACK from Controller
NACK from Controller
Figure 8-14. Read from Single Register
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Multiple reads from the same register are also possible with the TMP114. Figure 8-15 shows how the controller
can repeatedly read from the same register when the Auto-Increment bit in the control register is set to 0b. When
reading from the same register in the same transaction the device must be read faster than the I2C timeout
period.
Controller controls SDA line
Target controls SDA line
Target Address
Register Pointer (N)
P3 P2 P1 P0
Target Address
S
A6 A5 A4 A3 A2 A1 A0
0
A
0
0
0
0
A
Sr A6 A5 A4 A3 A2 A1 A0
1
A
START
R/W
Must be 0h
Re-START
R/W
ACK from Target
Auto-Increment
ACK from Target
ACK from Target
Data from Register N MSB
Data from Register N LSB
Data from Register N MSB
Data from Register N LSB
D7 D6 D5 D4 D3 D2 D1 D0
A
D7 D6 D5 D4 D3 D2 D1 D0 NA
P
D15 D14 D13 D12 D11 D10 D9 D8
A
D15 D14 D13 D12 D11 D10 D9 D8
A
STOP
ACK from Controller
ACK from Controller
ACK from Controller
NACK from Controller
Figure 8-15. Repeated Read from Single Register
The TMP114 also supports a continuous read from sequential registers. By setting the Auto-Increment bit in the
control register to 1b, the TMP114 will increment the address pointer after each word of data is read from the
device. This allows the controller to read multiple register values in the same transaction as shown in Figure
8-16. Currently, using a burst read will not clear the Alert Status register. It is recommended to use single register
reads to clear Alert Status register contents.
Controller controls SDA line
Target controls SDA line
Target Address
Register Pointer (N)
P3 P2 P1 P0
Target Address
S
A6 A5 A4 A3 A2 A1 A0
0
A
1
0
0
0
A
Sr A6 A5 A4 A3 A2 A1 A0
1
A
START
R/W
Must be 0h
Re-START
R/W
ACK from Target
Auto-Increment
ACK from Target
ACK from Target
Data from Register N MSB
Data from Register N LSB
Data from Register N+1 MSB
Data from Register N+1 LSB
D7 D6 D5 D4 D3 D2 D1 D0
A
D7 D6 D5 D4 D3 D2 D1 D0 NA
P
D15 D14 D13 D12 D11 D10 D9 D8
A
D15 D14 D13 D12 D11 D10 D9 D8
A
STOP
ACK from Controller
ACK from Controller
ACK from Controller
NACK from Controller
Figure 8-16. Burst Read from Multiple Registers
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8.5.4.3.1 CRC Enabled Reads
The TMP114 supports the ability to check data integrity with an 8-bit CRC value for every read transaction.
By setting the CRC_Enable bit to 1b in the Configuration Register, the device will use CRC to validate any
read transactions. During a CRC enabled read, the TMP114 will check the Target Address and Control Register
against the CRC value sent by the controller. The second CRC byte, after the restart, will be sent by the TMP114
and will check the Target Address, MSB, and LSB from the first register. All subsequent MSB and LSB bytes of
data sent from the TMP114 will have their own CRC values. Figure 8-17shows an overview of a read transaction
with CRC.
If the TMP114 determines the CRC failed, it will NACK on the CRC byte and the CRC_Flag bit in the Alert status
register will be set. The TMP114 will NACK after the restart to its target address and send FFh if the controller
continues clocking the SCL line until a STOP condition is sent and a new transaction started.
Controller controls SDA line
Target controls SDA line
Target
Address
Control
Register
Target
Address
MSB from
Register
LSB from
Register
Sr
I2C Bus
CRC
CRC
Re-START
First CRC determined by Target Address and Control Register
Second CRC byte determined by preceding Target Address, MSB, and LSB bytes.
MSB from
Register
LSB from
Register
CRC
Remaining CRC bytes determined by preceding MSB, and LSB bytes.
Figure 8-17. CRC Enabled Read
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8.5.4.4 General Call Reset Function
The TMP114 responds to a two-wire, general-call address (0000 000) if the eighth bit is 0b. The device
acknowledges the general-call address and responds to commands in the second byte. If the second byte
is 0000b 0110b, the TMP114 internal registers are reset to power-up values as shown in Figure 8-18. The serial
address is unaffected by the general call reset.
Controller controls SDA line
Target controls SDA line
General Call Address
Reset Command
S
0
0
0
0
0
0
0
0
A
0
0
0
0
0
1
1
0
A
P
START
STOP
ACK from Target
ACK from Target
Figure 8-18. SMBus General Call Timing Diagram
8.5.4.5 Time-Out Function
The TMP114 resets the serial interface if the SCL line is held low by the controller or the SDA line is held low
by the TMP114 for 30 ms (typical) between a START and STOP condition. The TMP114 releases the SDA line
if the SCL pin is pulled low and waits for a START condition from the controller. To avoid activating the timeout
function, maintain a communication speed of at least 1 kHz for the SCL operating frequency. If another device on
the bus is holding the SDA pin low, the TMP114 will not reset.
8.5.4.6 Coexist on I3C MixedBus
A bus with both I3C and I2C interfaces is referred to as a mixed with clock speeds up to 12.5 MHz. The TMP114
is an I2C device that can be on the same bus that has an I3C device attached as the TMP114 incorporates
a spike suppression filter of 50 ns on the SDA and SCL pins to avoid any interference to the bus when
communicating with I3C devices.
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8.5.4.7 Cyclic Redundancy Check Implementation
Table 8-3 defines the CRC calculation rule.
Table 8-3. CRC Rule Table
CRC Rule
CRC Width
Value
8 bits
Polynomial
x8 + x2 + x + 1 (07h)
Initial seed value
Input data reflected
Result data reflected
XOR value
FFh
No
No
00h
The CRC calculation is done on the command word and the data block. Figure 8-19 shows the block diagram.
The module consists of an 8-bit shift register and 3 exclusive-OR gates. The register starts with the seed value
FFh and the module performs an XOR function and shifts its content until the last bit of the register string is
used. The final value of the shift register is the checksum that is checked by either the controller or the TMP114
to validate the transaction.
XOR
C7 C6 C5 C4 C3 C2
+
C1
+
C0
+
XOR
XOR
Data Block
MSB
LSB
Figure 8-19. CRC Module
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8.6 Register Map
Table 8-4. TMP114 Registers
ADDRESS
00h
TYPE
R
RESET
0000h
0000h
0000h
0004h
F380h
2A80h
ACRONYM
REGISTER NAME
SECTION
Go
Temp_Result
Temperature result register
01h
R
Slew_Result
Alert_Status
Configuration
TLow_Limit
THigh_Limit
Slew rate result register
Alert status register
Go
02h
R/RC
R/W
R/W
R/W
R/W
R/W
R
Go
03h
Configuration register
Temperature low limit register
Temperature high limit register
Hysteresis register
Go
04h
Go
05h
Go
06h
0A0Ah Hysteresis
Go
07h
0500h
xxxxh
xxxxh
xxxxh
1114h
xxxxh
Slew_Limit
Unique_ID1
Unique_ID2
Unique_ID3
Device_ID
Reserved
Temperature slew rate limit register
Unique_ID1 register
Go
08h
Go
09h
R
Unique_ID2 register
Go
0Ah
R
Unique_ID3 register
Go
0Bh
R
Device ID register
Go
10h - 2Ah
R
Reserved
Table 8-5. TMP114 Access Type Codes
Access Type
Code
Description
Read Type
R
R
Read
RC
R
C
Read
to Clear
R-0
R
Read
-0
Returns 0s
Write Type
W
W
Write
Reset or Default Value
-n
Value after reset or the default
value
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8.6.1 Temp_Result Register (Address = 00h) [reset = 0000h]
This register stores the latest temperature conversion result in a 16-bit two's complement format with a LSB
(Least Significant Bit) equal to 0.0078125 °C.
Return to Register Map.
Figure 8-20. Temp_Result Register
15
7
14
6
13
5
12
11
10
2
9
1
8
0
Temp_Result[15:8]
R-00h
4
3
Temp_Result[7:0]
R-00h
Table 8-6. Temp_Result Register Field Descriptions
Bit
15:0
Field
Temp_Result[15:0]
Type
Reset
Description
R
0000h
16-bit temperature conversion result
Temperature data is represented by a 16-bit, two's complement
word with an LSB (Least Significant Bit) equal to 0.0078125 °C.
8.6.2 Slew_Result Register (Address = 01h) [reset = 0000h]
This register stores the latest temperature conversion result in a 14-bit two's complement format with a LSB
(Least Significant Bit) equal to 0.03125 °C/s. The Slew Rate Warning currently does not support negative values.
Return to Register Map.
Figure 8-21. Slew_Result Register
15
7
14
6
13
5
12
Slew_Result[13:6]
R-0h
11
10
2
9
1
8
0
4
3
Slew_Result[5:0]
R-0h
Reserved
R-0h
Table 8-7. Slew_Result Register Field Descriptions
Bit
Field
Type
Reset
Description
15:2
Slew_Result[13:0]
R
0000h
Temperature slew rate result
Temperature slew rate is represented by a 14-bit, two's
complement word with an LSB (Least Significant Bit) equal to
0.03125 °C/s.
1:0
Reserved
R
0h
These two bits will always read 0h
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8.6.3 Alert_Status Register (Address = 02h) [reset = 0000h]
This register shows the current alert status of the TMP114.
Return to Register Map.
Figure 8-22. Alert_Status Register
15
14
13
12
11
10
9
8
0
Reserved
R-00h
7
6
5
4
3
2
1
CRC_Flag
Slew_Status
Slew_Flag
THigh_Status
R-0h
TLow_Status
THigh_Flag
TLow_Flag
Data_Ready_Fl
ag
RC-0h
R-0h
RC-0h
R-0h
RC-0h
RC-0h
RC-0h
Table 8-8. Alert_Status Register Field Descriptions
Bit
15:8
7
Field
Reserved
Type
Reset
00h
0h
Description
R
Reserved
CRC_Flag
RC
CRC checksum error flag indicator. This indicates that the write
transaction CRC checksum failed and the register settings were
discarded
0h = The most recent CRC enabled write transaction was
successful
1h = The most recent CRC enabled write transaction failed
6
5
Slew_Status
R
0h
0h
Slew status indicator. This bit is set if there is a positive slew
rate exceeding the Slew_Rate_Limit.
0h = The most recent temperature conversion result is below the
Slew_Rate_Limit
1h = The most recent temperature conversion result is above
the Slew_Rate_Limit
Slew_Flag
RC
Slew rate flag indicator. This indicates that the temperature
slew rate crossed the slew rate limit threshold. Reading the
Alert_Status register will clear this bit
0h = The most recent temperature conversion has not crossed
the Slew_Rate_Limit threshold
1h = A temperature conversion has crossed the
Slew_Rate_Limit threshold
4
3
THigh_Status
TLow_Status
R
R
0h
0h
High temperature status indicator.
0h: The most recent temperature conversion result is below the
THigh_Limit
1h: The most recent temperature conversion is above the
THigh_Limit. Once set, this bit will not clear until a temperature
conversion is below THigh_Limit - THigh_Hyst
Low temperature status indicator.
0h: The most recent temperature conversion result is above the
TLow_Limit
1h: The most recent temperature conversion is below the
THigh_Limit. Once set, this bit will not clear until a temperature
conversion is above TLow_Limit + TLow_Hyst
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Table 8-8. Alert_Status Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
2
THigh_Flag
RC
0h
High temperature flag indicator. This indicates that the latest
temperature conversion has cross above the THigh_Limit
register threshold or crossed below the THigh_Limit -
THigh_Hyst threshold. Reading Alert_Status register will clear
this bit.
0h = The most recent temperature conversion has not crossed
the THigh_Limit or the hysteresis threshold.
1h: A temperature conversion crossed the THigh_Limit or
crossed below the THigh_Limit - THigh_Hyst threshold. Once
the THigh_Flag is set, THigh_Flag will not be set again until a
temperature conversion is below THigh_Limit - THigh_Hyst
1
TLow_Flag
RC
0h
Low temperature flag indicator. This indicates that the latest
temperature conversion has cross below the TLow_Limit
register threshold or crossed above the Tlow_Limit + TLow_Hyst
threshold. Reading Alert_Status register will clear this bit.
0h = The most recent temperature conversion has not crossed
the TLow_Limit or the hysteresis threshold.
1h: A temperature conversion crossed below the TLow_Limit.
Once the TLow_Flag is set, TLow_Flag will not be set again until
temperature conversion is above TLow_Limit + TLow_Hyst
0
Data_Ready_Flag
RC
0h
Data Ready flag indicator. This indicates a new temperature
conversion result is available. This bit is only cleared by reading
the Alert_Status register .
0h = Data_Ready_Flag has been cleared since the last
temperature conversion
1h = Data in Temp_Result is new
8.6.4 Configuration Register (Address = 03h) [reset = 0004h]
This register is used to configuration the operation of the TMP114.
Return to Register Map.
Figure 8-23. Configuration Register
15
14
13
12
11
10
9
8
Reserved
R-00h
ADC_Conv_Time[1:0]
RW-0h
Reset
R/W-0h
7
6
5
4
3
2
1
0
AVG
CRC_En
R/W-0h
Reserved
R-0h
OS
Mode
R/W-0h
Conv_Period[2:0]
R/W-4h
R/W-0h
R/W-0h
Table 8-9. Configuration Register Field Descriptions
Bit
Field
Type
Reset
00h
0h
Description
15:8
10:9
Reserved
R
Reserved
ADC_Conv_Time[1:0]
R/W
ADC Conversion Time setting. This bit field changes the ADC
conversion time and resolution of the TMP114. If the averaging
time is longer than the conversion period setting the minimum
cycle time will be the averaging time.
0h = 6.4 ms
1h = 3.5 ms
2h = 2.0 ms
3h = 1.2 ms
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Table 8-9. Configuration Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
8
Reset
R/W
0h
Software reset bit.
When set to 1 it triggers software reset with a duration of 1 ms.
This bit will always read back 0
7
6
AVG
R/W
R/W
0h
0h
Averaging enable bit. Averaging will force every measurement
including one-shot measurements to be averaged with eight
conversions.
0h: Averaging is disabled
1h: Averaging is enabled
CRC_En
CRC enable. Enables the CRC feature for the next transaction
after a stop command is received.
0h = CRC is disabled
1h = CRC is enabled
5
4
Reserved
OS
R
0h
0h
Reserved
R/W
One-shot conversion trigger. After completing the one-shot
conversion this bit is reset to 0h. Triggering a one-shot
conversion will place the TMP114 into shutdown mode.
0h = Default
1h = Trigger a one-shot conversion
3
Mode
R/W
R/W
0h
4h
Conversion mode selection bit.
0h = Continuous conversion mode
1h = Shutdown mode
2:0
Conv_Period[2:0]
Conversion period setting. This bit field changes the conversion
period of the TMP114. If the averaging time is longer than the
conversion period setting the minimum conversion time will be
the averaging time.
0h = 6.4 ms
1h = 31.25 ms / 32 Hz
2h = 62.5 ms / 16 Hz
3h = 125 ms / 8 Hz
4h = 250 ms / 4 Hz
5h = 500 ms / 2 Hz
6h = 1 s / 1 Hz
7h = 2 s / 0.5 Hz
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8.6.5 TLow_Limit Register (Address = 04h) [reset = F380h]
This register is used to configuration the low temperature limit of the TMP114. The limit is formatted in a 14-bit
two's complement format with a LSB (Least Significant Bit) equal to 0.03125 °C. The range of the register is
±256 °C. The default value on start-up is F380h or -25 °C. If the THigh_Limit register is equal to or less than the
TLow_Limit register the temperature limits will be ignored.
Return to Register Map.
Figure 8-24. TLow_Limit Register
15
7
14
6
13
5
12
TLow_Limit[13:6]
R/W-F3h
11
10
2
9
1
8
0
4
3
TLow_Limit[5:0]
R/W-20h
Reserved
R-0h
Table 8-10. TLow_Limit Register Field Descriptions
Bit
Field
Type
Reset
Description
15:2
TLow_Limit[13:0]
R/W
3CE0h
14-bit temperature low limit setting.
Temperature low limit is represented by a 14-bit, two's
complement word with an LSB (Least Significant Bit) equal to
0.03125°C. The default setting for this is -25°C.
1:0
Reserved
R
0h
These two bits will always read 0h
8.6.6 THigh_Limit Register (Address = 05h) [reset = 2A80h]
This register is used to configuration the high temperature limit of the TMP114. The limit is formatted in a 14-bit
two's complement format with a LSB (Least Significant Bit) equal to 0.03125 °C. The range of the register is
±256 °C. The default value on start-up is 2A80h or 85 °C. If the THigh_Limit register is equal to or less than the
TLow_Limit register the temperature limits will be ignored.
Return to Register Map.
Figure 8-25. THigh_Limit Register
15
7
14
6
13
5
12
THigh_Limit[13:6]
R/W-2Ah
11
10
2
9
1
8
0
4
3
THigh_Limit[5:0]
R/W-20h
Reserved
R-0h
Table 8-11. THigh_Limit Register Field Descriptions
Bit
Field
Type
Reset
Description
15:2
THigh_Limit[13:0]
R/W
0AA0h
14-bit temperature high limit setting.
Temperature high limit is represented by a 14-bit, two's
complement word with an LSB (Least Significant Bit) equal to
0.03125°C.
1:0
Reserved
R
0h
These two bits will always read 0h
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8.6.7 Hysteresis Register (Address = 06h) [reset = 0A0Ah]
This register sets the hysteresis for the THigh_Limit threshold and the TLow_Limit threshold. The default
hysteresis value for both the high and low limits is equal to 5 °C.
The Hysteresis is in a 8-bit unsigned format with the LSB equal to 0.5 °C. This gives a maximum value of 127.5
°C of hysteresis.
Return to Register Map.
Figure 8-26. Hysteresis Register
15
7
14
6
13
5
12
11
10
2
9
1
8
0
THigh_Hyst[7:0]
R/W-0Ah
4
3
TLow_Hyst[7:0]
R/W-0Ah
Table 8-12. Hysteresis Register Field Descriptions
Bit
Field
Type
Reset
Description
15:8
THigh_Hyst[7:0]
R/W
0Ah
THigh_Limit Hysteresis setting.
Hysteresis value is represented by a unsigned byte with the LSB
equal to 0.5 °C. The High temperature limit hysteresis threshold
is equal to (THigh_Limit - THigh_Hyst).
The default hysteresis value is 5 °C.
7:0
TLow_Hyst[7:0]
R/W
0Ah
TLow_Limit Hysteresis setting.
Hysteresis value is represented by a unsigned byte with the LSB
equal to 0.5 °C. The Low temperature limit hysteresis threshold
is equal to (TLow_Limit + TLow_Hyst).
The default hysteresis value is 5 °C.
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8.6.8 Slew_Limit Register (Address = 07h) [reset = 0500h]
This register is used to configure the temperature slew rate limit of the TMP126. The limit is formatted in a 13-bit
unsigned format with the LSB (Least Significant Bit) equal to 0.03125 °C/s. The range of the register is 0 °C/s to
+256 °C/s. The default value of Slew_Limit[12:6] on start-up is 0140h or 10 °C/s. The slew rate limit will trigger a
slew rate alert on positive slew rates that are greater than the limit.
Return to Register Map.
Figure 8-27. Slew_Limit Register
15
14
6
13
5
12
11
10
2
9
1
8
0
Reserved
R-0h
Slew_Limit[12:6]
R/W-05h
7
4
3
Slew_Limit[5:0]
R/W-00h
Reserved
R-0h
Table 8-13. Slew_Limit Register Field Descriptions
Bit
15
Field
Reserved
Type
Reset
Description
R
0h
This bits will always read 0h
14:2
Slew_Limit[13:0]
R/W
0140h
13-bit temperature slew rate limit setting.
Temperature low limit is represented by a 13-bit unsigned word
with a LSB (Least Significant Bit) equal to 0.03125°C/s. The
default setting for this is 10 °C/s.
1:0
Reserved
R
0h
These two bits will always read 0h
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8.6.9 Unique_ID1 Register (Address = 08h) [reset = xxxxh]
This register contains bits 47:32 of the Unique ID for the device. The Unique ID of the device is used for NIST
traceability purposes.
Return to Register Map.
Figure 8-28. Unique_ID1 Register
15
7
14
6
13
5
12
Unique_ID[47:40]
R-xxh
11
10
2
9
1
8
0
4
3
Unique_ID[39:32]
R-xxh
Table 8-14. Unique_ID Register Field Descriptions
Bit
15:0
Field
Unique_ID[47:32]
Type
Reset
Description
R
xxxxh
Bits 47:32 of the device Unique ID
8.6.10 Unique_ID2 Register (Address = 09h) [reset = xxxxh]
This register contains bits 31:16 of the Unique ID for the device.
Return to Register Map.
Figure 8-29. Unique_ID2 Register
15
14
13
12
Unique_ID[31:24]
R-xxh
11
10
2
9
1
8
0
7
6
5
4
3
Unique_ID[23:16]
R-xxh
Table 8-15. Unique_ID2 Register Field Descriptions
Bit
15:0
Field
Unique_ID[31:16]
Type
Reset
Description
R
xxxxh
Bits 31:16 of the device Unique ID
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8.6.11 Unique_ID3 Register (Address = 0Ah) [reset = xxxxh]
This register contains bits 15:0 of the Unique ID for the device.
Return to Register Map.
Figure 8-30. Unique_ID3 Register
15
14
13
12
11
10
2
9
1
8
0
Unique_ID[15:8]
R-xxh
7
6
5
4
3
Unique_ID[7:0]
R-xxh
Table 8-16. Unique_ID3 Register Field Descriptions
Bit
15:0
Field
Unique_ID[15:0]
Type
Reset
Description
R
xxxxh
Bits 15:0 of the device Unique ID.
8.6.12 Device_ID Register (Address = 0Bh) [reset = 1114h]
This register indicates the device ID.
Return to Register Map.
Figure 8-31. Device_ID Register
15
7
14
6
13
5
12
11
10
2
9
1
8
0
Rev[3:0]
R-1h
ID[11:8]
R-1h
4
3
ID[7:0]
R-14h
Table 8-17. Device_ID Register Field Descriptions
Bit
Field
Type
Reset
Description
15:12
11:0
Rev[3:0]
ID[11:0]
R
1h
Device revision indicator.
Device ID indicator.
R
114h
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TMP114 can be operated with a two-wire I2C or SMBus compatible interface and features the ability to
operate with a 1.2-V bus voltage regardless of the VDD voltage. The TMP114 features a uniquely small z-height
of 0.15 mm designed for low clearance and space-constrained applications.
The device also features an integrated optional CRC checksum for ensuring data integrity during
communication.
9.2 Separate I2C Pullup and Supply Application
1.2 V
1.08 V to 1.98 V
1.2 kΩ
1.2 kΩ
0.1 µF
VDD
I2C
Controller
SCL
SDA
SCL
SDA
TMP114
Temperature
source
GND
Figure 9-1. Separate I2C Pullup and Supply Voltage Application
9.2.1 Design Requirements
For this design example, use the parameters listed below.
Table 9-1. Design Parameters
Parameter
Value
1.08 V to 1.98 V
1.2 V
Supply (VDD
)
SDA, SCL VPULLUP
SDA, SCL RPULLUP
1.2 kΩ
9.2.2 Detailed Design Procedure
The TMP114 will convert temperature at a default 250 ms interval with an adjustable conversion period between
6.4 ms and 2 s. The SDA and SCL pin voltage of the TMP114 can be at a higher voltage than the VDD pin
voltage, removing the need for power sequencing when using the TMP114.
The TMP114 comes in an ultra-small body and z-height package the user can place as close to temperature
sources as possible for better thermal coupling.
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9.2.3 Application Curves
1
0.75
0.5
1.2 V Average
1.8 V Average
0.25
0
-0.25
-0.5
-0.75
-1
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (C)
Figure 9-2. Average Temperature Accuracy
9.3 Equal I2C Pullup and Supply Voltage Application
1.08 V to 1.98 V
1.2 kΩ
1.2 kΩ
0.1 µF
VDD
I2C
Controller
SCL
SDA
SCL
SDA
TMP114
Temperature
source
GND
Figure 9-3. Equal I2C Pullup and Supply Voltage Application
9.3.1 Design Requirements
For this design example, use the parameters listed below.
Table 9-2. Design Parameters
Parameter
Value
1.08 V to 1.98 V
VDD
Supply (VDD
)
SDA, SCL VPULLUP
SDA, SCL RPULLUP
1.2 kΩ
9.3.2 Detailed Design Procedure
The SDA and SCL pin voltage of the TMP114 can be the same as the supply voltage VDD. The accuracy of the
TMP114 is not affected by the pullup voltage.
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10 Power Supply Recommendations
The TMP114 operates with power supply in the range of 1.08 V to 1.98 V. The device can measure temperature
accurately in the full supply range. A power-supply bypass capacitor is required for proper operation. Place this
capacitor as close as possible to the supply and ground pins of the device. A typical value for this supply bypass
capacitor is 0.1 μF. Applications with noisy or high-impedance power supplies may require additional decoupling
capacitors to reject power-supply noise.
11 Layout
11.1 Layout Guidelines
The TMP114 is a simple device to layout. Place the power supply bypass capacitor as close to the device as
possible, and connect the capacitor as shown in Figure 11-1. Pull up the open-drain output pin SDA and the I2C
clock SCL through RPULLUP pullup resistors.
11.2 Layout Example
WCSP Ball
0.1 µF
Via to Power Plane
Via to Ground Plane
VDD
SDA
GND
SCL
RPULLUP
RPULLUP
Figure 11-1. Layout Recommendation (Top View)
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Table 13-1. YMT Package D and E Dimensions
MIN
NOM
MAX
D
0.750 mm
0.750 mm
0.758 mm
0.758 mm
0.766 mm
0.766 mm
20 µm
E
C (Seating Plane)
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PACKAGE OUTLINE
YMT0004
PicoStar TM - 0.15 mm max height
SCALE 20.000
PicoStar
0.4 TYP
A
B
E
2
1
PIN A1
CORNER
A
B
0.2 TYP
SYMM
D
0.4
TYP
SYMM
0.15 MAX
0.26
0.20
4X
0.015
C A B
C
SEATING PLANE
0.018
0.008
4225388/B 08/2020
PicoStar is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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Product Folder Links: TMP114
TMP114
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SNIS214A – JUNE 2021 – REVISED SEPTEMBER 2021
EXAMPLE BOARD LAYOUT
YMT0004
PicoStar TM - 0.15 mm max height
PicoStar
(0.4) TYP
2
1
4X ( 0.23)
A
(0.2) TYP
SYMM
B
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:60X
0.05 MAX
0.05 MIN
( 0.23)
METAL
METAL UNDER
SOLDER MASK
EXPOSED
METAL
EXPOSED
METAL
(
0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4225388/B 08/2020
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
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Product Folder Links: TMP114
TMP114
www.ti.com
SNIS214A – JUNE 2021 – REVISED SEPTEMBER 2021
EXAMPLE STENCIL DESIGN
YMT0004
PicoStar TM - 0.15 mm max height
PicoStar
(0.4) TYP
1
2
4X ( 0.21)
A
B
(0.2) TYP
SYMM
METAL
TYP
(R0.05) TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.075 mm THICK STENCIL
SCALE:60X
4225388/B 08/2020
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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Product Folder Links: TMP114
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMP114AIYMTR
TMP114AIYMTT
ACTIVE
ACTIVE
PICOSTAR
PICOSTAR
YMT
YMT
4
4
3000 RoHS & Green
250 RoHS & Green
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP114AIYMTR
TMP114AIYMTT
PICOST
AR
YMT
YMT
4
4
3000
250
180.0
8.4
0.85
0.85
0.23
2.0
8.0
Q1
PICOST
AR
180.0
8.4
0.85
0.85
0.23
2.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Oct-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP114AIYMTR
TMP114AIYMTT
PICOSTAR
PICOSTAR
YMT
YMT
4
4
3000
250
182.0
182.0
182.0
182.0
20.0
20.0
Pack Materials-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
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TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated
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