TMP121AIDBVT [TI]
1.5 C Accurate Digital Temperature Sensor with SPI Interface; 1.5℃精确的数字温度传感器，具有SPII英镑ª接口
| 型号： | TMP121AIDBVT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1.5 C Accurate Digital Temperature Sensor with SPI Interface |
| 文件： | 总18页 (文件大小：734K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TMP121
TMP123
SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
1.5°C Accurate Digital Temperature Sensor
with SPI Interface
FD EATURES
DESCRIPTION
DIGITAL OUTPUT: SPI-Compatible Interface
The TMP121 and TMP123 are SPI-compatible tempera-
ture sensors available in the tiny SOT23-6 package.
Requiring no external components, the TMP121 and
TMP123 are capable of measuring temperatures within
2°C of accuracy over a temperature range of −40°C to
+125°C. Low supply current, and a supply range from 2.7V
to 5.5V, make the TMP121 and TMP123 excellent
candidates for low-power applications.
D
RESOLUTION: 12-Bit + Sign, 0.0625°C
D
ACCURACY:
1.5°C from −25°C to +85°C (max)
D
D
D
D
LOW QUIESCENT CURRENT: 50µA (max)
WIDE SUPPLY RANGE: 2.7V to 5.5V
TINY SOT23-6 PACKAGE
OPERATION TO 150°C
The TMP121 and TMP123 are ideal for extended thermal
measurement in a variety of communication, computer,
consumer, environmental, industrial, and instrumentation
applications.
AD PPLICATIONS
POWER-SUPPLY TEMPERATURE
MONITORING
D
COMPUTER PERIPHERAL THERMAL
PROTECTION
D
D
D
D
NOTEBOOK COMPUTERS
CELL PHONES
BATTERY MANAGEMENT
OFFICE MACHINES
Tem pe r at ur e
Temperature
Diode
Temp.
Sensor
Diode
Te mp.
Sensor
Control
Logic
Control
Logic
NC
GND
V+
1
2
3
SO
GND
SO
6
5
4
1
2
3
6
5
4
∆Σ
A/D
Converter
∆Σ
A/D
Converter
Serial
Interface
Serial
Interface
NC
CS
CS
Config.
and Temp.
Register
Config.
and Temp.
Register
V+
OSC
SCK
OSC
SCK
TMP121
TMP123
NC = No Connection(1)
NC = No Connection(1)
(1)
Pins labeled NC should be left floating or connected to GND.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
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ꢀꢎ ꢍ ꢙꢔꢓ ꢑ ꢊꢍ ꢋ ꢖꢎ ꢍ ꢓ ꢕ ꢒ ꢒ ꢊꢋ ꢟ ꢙꢍ ꢕ ꢒ ꢋꢍꢑ ꢋꢕ ꢓꢕ ꢒꢒ ꢐꢎ ꢊꢘ ꢞ ꢊꢋꢓ ꢘꢔꢙ ꢕ ꢑꢕ ꢒꢑꢊ ꢋꢟ ꢍꢌ ꢐꢘ ꢘ ꢖꢐ ꢎ ꢐꢏ ꢕꢑꢕ ꢎ ꢒꢚ
Copyright 2003−2005, Texas Instruments Incorporated
www.ti.com
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
(1)
ABSOLUTE MAXIMUM RATINGS
Power Supply, V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
handledwith appropriate precautions. Failure to observe
(2)
proper handling and installation procedures can cause damage.
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3V to +7V
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +150°C
Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +150°C
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
Junction Temperature (T max) . . . . . . . . . . . . . . . . . . . . . . +150°C
J
Lead Temperature (soldering) . . . . . . . . . . . . . . . . . . . . . . . . +300°C
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2)
Input voltage rating applies to all TMP121 and TMP123 input
voltages.
(1)
ORDERING INFORMATION
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TMP121
T121
T123
SOT23-6
DBV
TMP123
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
Top View
SOT23-6
TMP121(1)
TMP123(1)
1
2
3
NC
GND
V+
6
5
4
SO
1
2
3
6
5
4
GND
NC
SO
CS
CS
SCK
V+
SCK
SOT23−6
NC = No Connection(2)
SOT23−6
NC = No Connection(2)
Pin 1 orientation is determined by package marking.
(1)
(2)
Pin 1 of the SOT23-6 package is determined by orienting the package marking as shown.
Pins labeled NC should be left floating or connected to GND.
2
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
ELECTRICAL CHARACTERISTICS
At T = −40°C to +125°C and V+ = 2.7V to 5.5V, unless otherwise noted.
A
TMP121, TMP123
PARAMETER
TEMPERATURE INPUT
Range
CONDITIONS
MIN
TYP
MAX
UNIT
−40
+125
1.5
°C
°C
Accuracy (temperature error)
−25°C to +85°C
−40°C to +125°C
−40°C to +150°C
0.5
1.0
2.0
°C
1.5
°C
vs Supply
−0.3
0.1
+0.3
°C/V
°C
Resolution
0.0625
DIGITAL INPUT/OUTPUT
Input Logic Levels:
V
V
0.7(V+)
V
V
IH
IL
0.3(V+)
1
Input Current, SO, SCK, CS
Output Logic Levels:
I
IN
0V ≤ V ≤ V+
IN
µA
V
V
SO
SO
I
= 3mA
0.4
V
V
OL
SINK
I
= 2mA
(V+)−0.4
OH
SOURCE
Resolution
12
Bits
pF
ms
ms
Input Capacitance, SO, SCK, CS
Conversion Time
2.5
240
480
12-Bit
12-Bit
320
640
(1)
Conversion Period
POWER SUPPLY
Operating Range
Quiescent Current
2.7
5.5
50
1
V
I
Serial Bus Inactive
Serial Bus Inactive
Serial Bus Inactive
35
0.1
0.1
µA
µA
µA
Q
Shutdown Current (TMP121)
Shutdown Current (TMP123)
TEMPERATURE RANGE
Specified Range
I
I
SD
SD
3
−40
−55
−60
+125
+150
+150
°C
°C
Operating Range
Storage Range
°C
Thermal Resistance
q
JA
SOT23-6 Surface-Mount
200
°C/W
(1)
Period indicates time between conversion starts.
3
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
TYPICAL CHARACTERISTICS
At T = +25°C and V+ = 5.0V, unless otherwise noted.
A
SHUTDOWN CURRENT vs TEMPERATURE
QUIESCENT CURRENT vs TEMPERATURE
50
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
V+ = 5V
40
30
V+ = 2.7V
20
Serial Bus Inactive
10
−
0.1
−
−
−
40 20
60
0
20
40
60
80 100 120 140
−
−
−
40 20
60
0
20
40
60
80 100 120 140
_
_
Temperature ( C)
Temperature ( C)
CONVERSION TIME vs TEMPERATURE
TEMPERATURE ACCURACY vs TEMPERATURE
400
2.0
1.5
1.0
0.5
0.0
300
200
100
V+ = 5V
−
−
−
−
0.5
1.0
1.5
2.0
V+ = 2.7V
12−Bit Resolution
3 Typical Units 12−Bit Resolution
−
−
−
−
−
−
60
40
20
0
20
40
60
80 100 120 140
60 40 20
0
20 40 60 80 100 120 140 160
_
_
Temperature ( C)
Temperature ( C)
4
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
TEMPERATURE REGISTER
APPLICATIONS INFORMATION
The Temperature Register of the TMP121 and TMP123 is
a 16-bit, signed read-only register that stores the output of
the most recent conversion. Up to 16 bits can be read to
obtain data and are described in Table 1. The first 13 bits
are used to indicate temperature with bits D2 = 0, and D1,
D0 in a high impedance state. Data format for temperature
is summarized in Table 2. Following power-up or reset, the
Temperature Register will read 0°C until the first
conversion is complete.
The TMP121 and TMP123 are 12-bit plus sign read-only
digital temperature sensors optimal for thermal
management and thermal protection applications. The
TMP121 and the TMP123 communicate through a serial
interface that is SPI-compatible. Temperature is converted
to a 12-bit plus sign data word with 0.0625°C resolution.
The TMP121 and TMP123 are specified for a temperature
range of −40°C to +125°C, with operation extending from
−55°C to +150°C.
The TMP121 and TMP123 are optimal for low power
applications, with a 0.5s conversion period for reduced
power consumption. The TMP121 and TMP123 are
specified for a supply voltage range of 2.7V to 5.5V, and
also feature a hardware shutdown to provide additional
power savings.
D15
D14
D13
D12
D11
D10
D9
D8
T12
T11
T10
T9
T8
T7
T6
T5
D7
D6
D5
D4
D3
D2
D1
D0
T4
T3
T2
T1
T0
0
Z
Z
Table 1. Temperature Register
The TMP121 and TMP123 require no external
components for operation, though a 0.1µF supply bypass
capacitor is recommended. Figure 1 shows typical
connections for the TMP121 and TMP123.
(1)
TEMPERATURE
DIGITAL OUTPUT
(BINARY)
(°C)
HEX
4B00
3E80
0C80
0008
0000
FFF8
F380
E480
150
125
0100 1011 0000 0000
0011 1110 1000 0000
0000 1100 1000 0000
0000 0000 0000 1000
0000 0000 0000 0000
1111 1111 1111 1000
1111 0011 1000 0000
1110 0100 1000 0000
25
V+
V+
0.0625
0
−0.0625
−25
µ
µ
0.1 F
0.1 F
3
3
1
5
2
5
NC(1)
CS
NC(1)
CS
−55
SCK
SO
SCK
SO
4
6
4
6
(1)
The last two bits are high impedance and are shown as 00 in the
table.
TMP121
TMP123
Table 2. Temperature Data Format
2
1
NC = No Connection
COMMUNICATING WITH THE TMP121
The TMP121 and TMP123 continuously convert
temperatures to digital data while CS is high. CS must be
high for a minimum of one conversion time (320ms max)
to update the temperature data. Reading temperature data
from the TMP121 and TMP123 is initiated by pulling CS
low, which will cause any conversion in progress to
terminate, and place the device into analog shutdown.
Quiescent current is reduced to 1µA during analog
shutdown. Once CS is pulled low, temperature data from
the last completed conversion prior to dropping CS is
latched into the shift register and clocked out at SO on the
falling SCK edge. The 16-bit data word is clocked out sign
bit first, followed by the MSB. Any portion of the 16-bit word
can be read before raising CS. The TMP121 and TMP123
typically require 0.25s to complete a conversion and
consume 50µA of current during this period. If CS is held
high for longer than one conversion time period the
TMP121 and TMP123 will go into idle mode for 0.25s,
requiring only 20µA of current. A new conversion begins
every 0.5s. Figure 2 describes the conversion timing for
the TMP121 and TMP123.
GND
GND
NOTE: (1) Pins labeled NC should be left floating or connected to GND.
Figure 1. Typical Connections of the TMP121 and
TMP123
The sensing device of both the TMP121 and TMP123 is
the chip itself; the die flag of the lead frame is thermally
connected to pin 2 of the TMP121, and of the TMP123.
Thermal paths run through the package leads as well as
the plastic package, and the lower thermal resistance of
metal causes the leads to provide the primary thermal
path. The GND pin (pin 2) of the TMP121 and the NC pin
(pin 2) of the TMP123 are thermally connected to the metal
lead frame, and are the best choice for thermal input.
To maintain accuracy in applications requiring air or
surface temperature measurement, care should be taken
to isolate the package and leads from ambient air
temperature.
5
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SBOS273C − JUNE 2003 − REVISED FEBRUARY 2005
Timing Diagrams
0.5s
The TMP121 and TMP123 are SPI-compatible. Figure 4
and Figure 5 describe the various timing requirements,
with parameters defined in Table 3.
0.25s
µ
50 A (active)
µ
20 A (idle)
PARAMETER
MIN
MAX UNITS
Figure 2. Conversion Time and Period
SCK Period
t
t
t
t
t
100
ns
1
2
3
4
5
SCK Falling Edge to Output Data Delay
CS to Rising Edge SCK Set-Up Time
CS to Output Data Delay
30
ns
ns
ns
ns
The serial data of the TMP121 and TMP123 consists of
12-bit plus sign temperature data followed by a
confirmation bit and two high impedance bits. Data is
transmitted in Binary Two’s Complement format. Figure 3
describes the output data of the TMP121 and TMP123.
40
30
30
CS Rising Edge to Output High Impedance
Table 3. Timing Description
CS
SCK
SO/I
Z
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
1
Z
Z
Figure 3. Data READ
SCK
t3
t1
t2
CS
SO
t4
Figure 4. Output Data Timing Diagram
SCK
SCK
CS
CS
SO
t5
t5
SO
Figure 5. High Impedance Output Timing Diagram
6
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
TMP121AIDBVR
TMP121AIDBVRG4
TMP121AIDBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TMP121AIDBVTG4
TMP123AIDBVR
TMP123AIDBVRG4
TMP123AIDBVT
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TMP123AIDBVTG4
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP121 :
Enhanced Product: TMP121-EP
•
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TMP121AIDBVR
TMP121AIDBVT
TMP123AIDBVR
TMP123AIDBVT
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
6
6
6
6
3000
250
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.1
3.1
3.1
3.1
1.39
1.39
1.39
1.39
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP121AIDBVR
TMP121AIDBVT
TMP123AIDBVR
TMP123AIDBVT
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
6
6
6
6
3000
250
190.5
190.5
190.5
190.5
212.7
212.7
212.7
212.7
31.8
31.8
31.8
31.8
3000
250
Pack Materials-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
TMP121AIDBVR
TMP121AIDBVRG4
TMP121AIDBVT
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
6
6
6
6
6
6
6
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
T121
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
DBV
DBV
3000
250
Green (RoHS
& no Sb/Br)
T121
T121
T121
T123
T123
T123
T123
Green (RoHS
& no Sb/Br)
TMP121AIDBVTG4
TMP123AIDBVR
TMP123AIDBVRG4
TMP123AIDBVT
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TMP123AIDBVTG4
250
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP121 :
Enhanced Product: TMP121-EP
•
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP121AIDBVR
TMP121AIDBVT
SOT-23
SOT-23
DBV
DBV
6
6
3000
250
178.0
178.0
9.0
9.0
3.23
3.23
3.17
3.17
1.37
1.37
4.0
4.0
8.0
8.0
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Apr-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP121AIDBVR
TMP121AIDBVT
SOT-23
SOT-23
DBV
DBV
6
6
3000
250
180.0
180.0
180.0
180.0
18.0
18.0
Pack Materials-Page 2
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