TMP464AIRGTT [TI]
5 通道（4 条远程通道和 1 条本地通道）高精度远程和本地温度传感器 | RGT | 16 | -40 to 125;
| 型号： | TMP464AIRGTT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5 通道（4 条远程通道和 1 条本地通道）高精度远程和本地温度传感器 | RGT | 16 | -40 to 125 温度传感 传感器 温度传感器 |
| 文件： | 总43页 (文件大小：1842K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
TMP464 5 通道（4 条远程通道和 1 条本地通道）高精度温度传感器
1 特性
3 说明
•
4 通道远程二极管温度传感器
本地和远程精度：±0.75°C（最大值）
温度分辨率：0.0625°C
TMP464器件是一款使用双线制 SMBus 或 I2C 兼容接
口的高精度低功耗温度传感器。除了本地温度外，还可
以同时监控多达四个连接远程二极管的温度区域。聚合
系统中的温度测量可通过缩小保护频带提升性能，并且
可以降低电路板复杂程度。典型用例为监测服务器和电
信设备等复杂系统中不同处理器（如 MCU、GPU 和
FPGA）的温度。众多高级 功能， 将诸如串联电阻抵
消、可编程非理想性因子、可编程偏移和可编程温度限
值等高级特性完美结合，提供了一套精度和抗扰度更高
且稳健耐用的温度监控解决方案。
1
•
•
•
•
•
•
电源和逻辑电压范围：1.7V 至 3.6V
43µA 工作电流（1SPS，所有通道激活）
0.3µA 关断电流
远程二极管：串联电阻抵消、
η 因子校正、偏移校正和二极管故障检测
寄存器锁定功能可保护关键寄存器
兼容 I2C 或 SMBus™的双线制接口，支持引脚可
编程地址
•
•
四个远程通道（以及本地通道）均可独立编程，设定两
个在测量位置的相应温度超出对应值时触发的阈值。此
外，还可通过可编程迟滞设置避免阈值持续切换。
•
16 引脚 VQFN 封装
2 应用
•
微控制器 (MCU)、图形处理器 (GPU)、专用集成电
路 (ASIC)、现场可编程门阵列 (FPGA)、数字信号
处理器 (DSP) 和中央处理器 (CPU) 温度监控
TMP464 器件可提供高测量精度 (0.75°C) 和测量分辨
率 (0.0625°C)。该器件还支持低电压轨（1.7V 至
3.6V）和通用双线制接口，采用高空间利用率的小型
封装（3mm × 3mm ），可在计算系统中轻松集成。远
程结支持 –55°C 至 +150°C 的温度范围。TMP464 的
预编程温度限制为 125°C。
•
•
•
•
•
•
•
电信设备
服务器和个人计算机
云以太网交换机
安全数据中心
器件信息(1)
高度集成的医疗系统
精密仪表和测试设备
发光二极管 (LED) 照明温度控制
器件型号
TMP464
封装
VQFN (16)
封装尺寸（标称值）
3.00mm × 3.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
典型应用电路原理图
Remote
Zone 4
Remote
Zone 3
Remote
Remote
Zone 2
Zone 1
1.7 V to 3.6 V
CBYPASS
RS1 RS2
CDIFF
RS1 RS2
CDIFF
RS1
RS2
RS1
RS2
RSCL RSDA RT2 RT
14
V+
CDIFF
CDIFF
6
5
4
3
7
13
12
11
D1+
D2+
D3+
D4+
D-
2-Wire Interface
SMBus / I2
Compatible
Controller
SCL
SDA
TMP464
C
THERM2
THERM
Overtemperature
Shutdown
10
9
Local
ADD
Zone 5
GND
8
Copyright
© 2017, Texas Instruments Incorporated
有关远程二极管建议，请参阅部分。
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SBOS835
TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 12
7.5 Programming........................................................... 12
7.6 Register Maps......................................................... 18
Application and Implementation ........................ 28
8.1 Application Information............................................ 28
8.2 Typical Application .................................................. 28
Power Supply Recommendations...................... 31
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Two-Wire Timing Requirements ............................... 6
6.7 Typical Characteristics.............................................. 7
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................. 10
8
9
10 Layout................................................................... 32
10.1 Layout Guidelines ................................................. 32
10.2 Layout Example .................................................... 33
11 器件和文档支持 ..................................................... 34
11.1 接收文档更新通知 ................................................. 34
11.2 社区资源................................................................ 34
11.3 商标....................................................................... 34
11.4 静电放电警告......................................................... 34
11.5 Glossary................................................................ 34
12 机械、封装和可订购信息....................................... 34
7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision B (August 2017) to Revision C
Page
•
Changed the Device ID code from: 0x0464 to: 0x1468 ...................................................................................................... 27
Changes from Revision A (June 2017) to Revision B
Page
•
Changed 'QFN' to 'VQFN' in table header as per industry standard ..................................................................................... 4
Changes from Original (May 2017) to Revision A
Page
•
更新的封装信息..................................................................................................................................................................... 34
2
Copyright © 2017–2019, Texas Instruments Incorporated
TMP464
www.ti.com.cn
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
5 Pin Configuration and Functions
TMP464 RGT Package
16-Pin VQFN With Exposed Thermal Pad
Top View
NC
NC
1
2
3
4
12
11
10
9
SDA
THERM2
THERM
ADD
Thermal Pad
D4+
D3+
Not to scale
NC - No internal connection
Pin Functions
PIN
NO.
9
TYPE
DESCRIPTION
NAME
ADD
Digital Input
Analog input
Address select. Connect to GND, V+, SDA, or SCL.
Positive connection to remote temperature sensors. A total of 4 remote channels are
supported. An unused channel must be connected to D–.
D1+
D2+
D3+
D4+
6
5
4
3
Positive connection to remote temperature sensors. A total of 4 remote channels are
supported. An unused channel must be connected to D–.
Analog input
Analog input
Analog input
Positive connection to remote temperature sensors. A total of 4 remote channels are
supported. An unused channel must be connected to D–.
Positive connection to remote temperature sensors. A total of 4 remote channels are
supported. An unused channel must be connected to D–.
D–
7
Analog input
Ground
—
Negative connection to remote temperature sensors. Common for 4 remote channels.
Supply ground connection
GND
NC
8
1, 2, 15, 16
No connection, may be left floating or connected to GND or V+
Serial clock line for I2C or SMBus compatible two-wire interface.
Input; requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if
driven by an open-drain output.
SCL
13
12
10
Digital input
Serial data line for I2C- or SMBus compatible two-wire interface. Open-drain; requires a pullup
resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+.
Bidirectional digital
input-output
SDA
Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not
necessarily V+. If this pin is not used it may be left open or grounded.
THERM
Digital output
Second THERM output.
THERM2
V+
11
14
Digital output
Power supply
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not
necessarily V+. If this pin is not used it may be left open or grounded.
Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.
Copyright © 2017–2019, Texas Instruments Incorporated
3
TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
MAX
UNIT
Power supply
Input voltage
V+
6
6
V
THERM, THERM2, SDA, SCL, and ADD only
((V+) + 0.3)
and ≤ 6
D1+ through D4+
–0.3
V
D– only
–0.3
–25
–10
–55
0.3
SDA sink
All other pins
Input current
mA
10
Operating temperature
150
150
150
°C
°C
°C
Junction temperature (TJ, maximum)
Storage temperature, Tstg
–60
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±2000
±750
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.7
NOM
MAX
3.6
UNIT
V
V+
TA
TD
Supply voltage
Operating free-air temperature
Remote junction temperature
–40
–55
125
150
°C
°C
6.4 Thermal Information
TMP464
THERMAL METRIC
RGT (VQFN)
UNIT
16 PINS
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
46
43
17
0.8
5
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
ψJB
4
Copyright © 2017–2019, Texas Instruments Incorporated
TMP464
www.ti.com.cn
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
6.5 Electrical Characteristics
at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE MEASUREMENT
TA = –40°C to 100°C, V+ = 1.7 V to 3.6 V
TA = –40°C to 125°C, V+ = 1.7 V to 3.6 V
–0.75
–1
±0.125
±0.5
0.75
1
°C
°C
TLOCAL
Local temperature sensor accuracy
TA = –10°C to 85°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
–0.75
–1
±0.125
±0.5
0.75
1
TREMOTE Remote temperature sensor accuracy
Local temperature error supply sensitivity
TA = –40°C to 125°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
°C
V+ = 1.7 V to 3.6 V
–0.15
–0.25
±0.05
±0.1
0.15
0.25
°C/V
°C/V
Remote temperature error supply sensitivity V+ = 1.7 V to 3.6 V
Temperature resolution
(local and remote)
0.0625
°C
ADC conversion time
ADC resolution
One-shot mode, per channel (local or remote)
16
13
17
ms
Bits
High
120
45
Remote sensor
source current
Medium
Low
Remote transistor ideality factor
SERIAL INTERFACE (SCL, SDA)
Series resistance 1 kΩ (maximum)
µA
7.5
η
1.008
VIH
VIL
High-level input voltage
Low-level input voltage
Hysteresis
0.7 × (V+)
V
V
0.3 × (V+)
200
mV
mA
V
SDA output-low sink current
20
–1
IO = –20 mA, V+ ≥ 2 V
IO = –15 mA, V+ < 2 V
0 V ≤ VIN ≤ 3.6 V
0.15
0.4
0.2 × V+
1
VOL
Low-level output voltage
V
Serial bus input leakage current
Serial bus input capacitance
μA
pF
4
DIGITAL INPUTS (ADD)
VIH
VIL
High-level input voltage
0.7 × (V+)
–0.3
V
V
Low-level input voltage
Input leakage current
Input capacitance
0.3 × (V+)
1
0 V ≤ VIN ≤ 3.6 V
–1
μA
pF
4
DIGITAL OUTPUTS (THERM, THERM2)
Output-low sink current
VOL = 0.4 V
IO = –6 mA
VO = V+
6
mA
V
VOL
IOH
Low-level output voltage
0.15
0.4
1
High-level output leakage current
μA
POWER SUPPLY
V+ Specified supply voltage range
1.7
3.6
375
600
21
V
Active conversion, local sensor
Active conversion, remote sensors
Standby mode (between conversions)
Shutdown mode, serial bus inactive
Shutdown mode, serial bus active, fS = 400 kHz
Shutdown mode, serial bus active, fS = 2.56 MHz
Rising edge
240
400
15
µA
IQ
Quiescent current
0.3
120
300
1.5
1.2
0.2
4
µA
µA
1.65
1.35
POR
POH
Power-on-reset threshold
Power-on-reset hysteresis
V
V
Falling edge
1
Copyright © 2017–2019, Texas Instruments Incorporated
5
TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
www.ti.com.cn
6.6 Two-Wire Timing Requirements
at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
The master and the slave have the same V+ value. Values are based on statistical analysis of samples tested during initial
release.
MIN
MAX
UNIT
Fast mode
0.001
0.001
1300
160
600
160
600
160
600
160
0
0.4
fSCL
SCL operating frequency
MHz
High-speed mode
Fast mode
2.56
Bus free time between stop and start
condition
tBUF
ns
ns
High-speed mode
Fast mode
Hold time after repeated start condition.
After this period, the first clock is generated.
tHD;STA
tSU;STA
tSU;STO
tHD;DAT
tVD;DAT
tSU;DAT
tLOW
High-speed mode
Fast mode
Repeated start condition setup time
Stop condition setup time
Data hold time
ns
High-speed mode
Fast mode
ns
High-speed mode
Fast mode
(1)ns
ns
High-speed mode
Fast mode
0
130
900
—
0
Data valid time(2)
High-speed mode
Fast mode
—
100
20
Data setup time
ns
High-speed mode
Fast mode
1300
250
600
60
SCL clock low period
SCL clock high period
Data fall time
ns
High-speed mode
Fast mode
tHIGH
ns
High-speed mode
Fast mode
20 × (V+ / 5.5)
300
100
300
40
tF – SDA
tF, tR – SCL
tR
ns
High-speed mode
Fast mode
Clock fall and rise time
Rise time for SCL ≤ 100 kHz
Serial bus timeout
ns
High-speed mode
Fast mode
1000
ns
High-speed mode
Fast mode
15
15
20
20
ms
High-speed mode
(1) The maximum tHD;DAT can be 0.9 µs for fast mode, and is less than the maximum tVD;DAT by a transition time.
(2) tVD;DAT = time for data signal from SCL LOW to SDA output (HIGH to LOW, depending on which is worse).
tr
t(LOW)
tf
VIH
VIL
SCL
SDA
t(HIGH)
t(SU:STA)
t(SU:STO)
t(HD:STA)
t(HD:DAT)
t(SU:DAT)
t(BUF)
VIH
VIL
P
S
S
P
Figure 1. Two-Wire Timing Diagram
6
版权 © 2017–2019, Texas Instruments Incorporated
TMP464
www.ti.com.cn
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
6.7 Typical Characteristics
at TA = 25°C and V+ = 3.6 V (unless otherwise noted)
1.5
1
1.5
Max Limit
Max Limit
Average + 3s
Average + 3s
1
0.5
0
0.5
0
Typical Units
Typical Units
-0.5
-1
-0.5
-1
Min Limit
-25
Average - 3s
75 100
Average - 3s
Min Limit
-20
-1.5
-50
-1.5
-40
0
25
50
125
0
20
40
60
80
100
120
Device Junction Temperature (èC)
Ambient Temperature (èC)
Typical behavior of 75 devices over temperature at V+ = 1.8 V
with the remote diode junction at 150°C.
Typical behavior of 75 devices over temperature at V+ = 1.8 V
图 2. Local Temperature Error vs Ambient Temperature
图 3. Remote Temperature Error vs Device Junction
Temperature
1
40
D+ to V+
D+ to GND
0.8
30
20
Average + 3s
0.6
0.4
0.2
0
Max Limit
10
0
Typical Units
-0.2
-0.4
-0.6
-0.8
-1
-10
-20
-30
-40
Min Limit
Average - 3s
1
10
Leakage Resistance (MW)
100
-40
-20
0
20
40
60
80
Device Junction Temperature (°C)
100
120
Typical behavior of 30 devices over temperature with V+ from 1.8
V to 3.6 V
图 5. Remote Temperature Error vs Leakage Resistance
图 4. Remote Temperature Error Power Supply Sensitivity vs
Device Junction Temperature
0.5
0
-5
V+ = 1.8 V
V+ = 3.6 V
0.4
0.3
0.2
0.1
0
-10
-15
-20
-25
-30
-35
-40
-0.1
-0.2
-0.3
-0.4
-0.5
0
500 1000 1500 2000 2500 3000 3500 4000 4500
Series Resistance (W)
0
2
4
6
8
10
12
14
Differential Capacitance (nF)
16
18
20
No physical capacitance during measurement
No physical series resistance on D+, D– pins during measurement
图 6. Remote Temperature Error vs Series Resistance
图 7. Remote Temperature Error vs
Differential Capacitance
版权 © 2017–2019, Texas Instruments Incorporated
7
TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
www.ti.com.cn
Typical Characteristics (接下页)
at TA = 25°C and V+ = 3.6 V (unless otherwise noted)
400
800
700
600
500
400
300
200
100
0
V+ = 1.8 V
V+ = 3.6 V
V+ = 1.8 V
V+ = 3.6 V
360
320
280
240
200
160
120
80
40
0
0.05 0.1
1
Conversion Rate (Hz)
10
100
1k
10k
100k
Frequency (Hz)
1M
10M
图 8. Quiescent Current vs Conversion Rate °
图 9. Shutdown Quiescent Current
vs SCL Clock Frequency
400
390
380
370
360
350
340
330
320
310
300
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.5
2
2.5 3
V+ Voltage (V)
3.5
4
1.5
2
2.5 3
V+ Voltage (V)
3.5
4
图 10. Quiescent Current vs Supply Voltage
(at Default Conversion Rate of 16 Conversions Per Second)
图 11. Shutdown Quiescent Current vs Supply Voltage
8
版权 © 2017–2019, Texas Instruments Incorporated
TMP464
www.ti.com.cn
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
7 Detailed Description
7.1 Overview
The TMP464 device is a digital temperature sensor that combines a local temperature measurement channel
and four remote-junction temperature measurement channels in a VQFN-16 package. The device has a two-
wire-interface that is compatible with I2C or SMBus interfaces and includes four pin-programmable bus address
options. The TMP464 is specified over a local device temperature range from –40°C to +125°C. The TMP464
device also contains multiple registers for programming and holding configuration settings, temperature limits,
and temperature measurement results. The TMP464 pinout includes THERM and THERM2 outputs that signal
overtemperature events based on the settings of temperature limit registers.
7.2 Functional Block Diagram
V+
ADD
SCL
Serial
Interface
Register
Bank
SDA
THERM
Oscillator
Local
Thermal
BJT
V+
Control
Logic
6 × I
MUX
16 × I
I
THERM2
D1+
D2+
D3+
D4+
Voltage
Reference
MUX
ADC
D-
Copyright © 2017, Texas Instruments Incorporated
GND
版权 © 2017–2019, Texas Instruments Incorporated
9
TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
www.ti.com.cn
7.3 Feature Description
7.3.1 Temperature Measurement Data
The local and remote temperature sensors have a resolution of 13 bits (0.0625°C). Temperature data that result
from conversions within the default measurement range are represented in binary form, as shown in the
Standard Binary column of 表 1. Negative numbers are represented in two's-complement format. The resolution
of the temperature registers extends to 255.9375°C and down to –256°C, but the actual device is limited to
ranges as specified in the Electrical Characteristics table to meet the accuracy specifications. The TMP464
device is specified for ambient temperatures ranging from –40°C to +125°C; parameters in the Absolute
Maximum Ratings table must be observed to prevent damage to the device.
表 1. Temperature Data Format (Local and Remote Temperature)
LOCAL OR REMOTE TEMPERATURE REGISTER VALUE
(0.0625°C RESOLUTION)
STANDARD BINARY(1)
TEMPERATURE
(°C)
BINARY
HEX
E0 00
E7 00
F3 80
FF F0
FF F8
00 00
00 08
00 10
00 18
00 20
00 28
00 30
00 38
00 40
00 48
00 50
00 58
00 60
00 68
00 70
00 78
00 80
02 80
05 00
0C 80
19 00
25 80
32 00
3E 80
3F 80
4B 00
57 80
5F 80
–64
–50
1110 0000 0000 0000
1110 0111 0000 0000
1111 0011 1000 0000
1111 1111 1111 0000
1111 1111 1111 1000
0000 0000 0000 0000
0000 0000 0000 1000
0000 0000 0001 0000
0000 0000 0001 1000
0000 0000 0010 0000
0000 0000 0010 1000
0000 0000 0011 0000
0000 0000 0011 1000
0000 0000 0100 0000
0000 0000 0100 1000
0000 0000 0101 0000
0000 0000 0101 1000
0000 0000 0110 0000
0000 0000 0110 1000
0000 0000 0111 0000
0000 0000 0111 1000
0000 0000 1000 0000
0000 0010 1000 0000
0000 0101 0000 0000
0000 1100 1000 0000
0001 1001 0000 0000
0010 0101 1000 0000
0011 0010 0000 0000
0011 1110 1000 0000
0011 1111 1000 0000
0100 1011 0000 0000
0101 0111 1000 0000
0101 1111 1000 0000
–25
–0.1250
–0.0625
0
0.0625
0.1250
0.1875
0.2500
0.3125
0.3750
0.4375
0.5000
0.5625
0.6250
0.6875
0.7500
0.8125
0.8750
0.9375
1
5
10
25
50
75
100
125
127
150
175
191
(1) Resolution is 0.0625°C per count. Negative numbers are represented in two's-complement format.
10
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Both local and remote temperature data use two bytes for data storage with a two's-complement format for
negative numbers. The high byte stores the temperature with 2°C resolution. The second or low byte stores the
decimal fraction value of the temperature and allows a higher measurement resolution, as shown in 表 1. The
measurement resolution for both the local and the remote channels is 0.0625°C.
7.3.2 Series Resistance Cancellation
Series resistance cancellation automatically eliminates the temperature error caused by the resistance of the
routing to the remote transistor or by the resistors of the optional external low-pass filter. A total up to 1-kΩ series
resistance can be cancelled by the TMP464 device, which eliminates the need for additional characterization and
temperature offset correction. See 图 6 for details on the effects of series resistance on sensed remote
temperature error.
7.3.3 Differential Input Capacitance
The TMP464 device tolerates differential input capacitance of up to 1000 pF with minimal change in temperature
error. The effect of capacitance on the sensed remote temperature error is illustrated in 图 7.
7.3.4 Sensor Fault
The TMP464 device can sense a fault at the D+ resulting from an incorrect diode connection. The TMP464
device can also sense an open circuit. Short-circuit conditions return a value of –256°C. The detection circuitry
consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) – 0.3 V (typical). The
comparator output is continuously checked during a conversion. If a fault is detected, then the RxOP bit in the
Remote Channel Status register is set to 1.
When not using the remote sensor with the TMP464 device, the corresponding D+ and D– inputs must be
connected together to prevent meaningless fault warnings.
7.3.5 THERM Functions
Operation of the THERM (pin 10) and THERM2 (pin 11) interrupt pins are shown in 图 12.
The hysteresis value is stored in the THERM Hysteresis register and applies to both the THERM and THERM2
interrupts.
Temperature Conversion Complete
150
140
130
120
THERM Limit
110
100
THERM Limit - Hysteresis
90
THERM2 Limit
80
70
THERM2 Limit - Hysteresis
Measured
Temperature
60
50
Time
THERM2
THERM
图 12. THERM and THERM2 Interrupt Operation
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7.4 Device Functional Modes
7.4.1 Shutdown Mode (SD)
The TMP464 shutdown mode enables the user to save maximum power by shutting down all device circuitry
other than the serial interface, and reducing current consumption to typically less than 0.3 μA; see 图 11.
Shutdown mode is enabled when the shutdown bit (SD, bit 5) of the Configuration Register is HIGH; the device
shuts down immediately. When the SD bit is LOW, the device maintains a continuous-conversion state.
7.5 Programming
7.5.1 Serial Interface
The TMP464 device operates only as a slave device on the two-wire bus (I2C or SMBus). Connections to either
bus are made using the open-drain I/O lines, SDA, and SCL. The SDA and SCL pins feature integrated spike
suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP464
device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.56 MHz)
modes. All data bytes are transmitted MSB first.
While the TMP464 device is unpowered bus traffic on SDA and SCL may continue without any adverse effects to
the communication or to the TMP464 device itself. As the TMP464 device is powering up, the device does not
load the bus, and as a result the bus traffic may continue undisturbed.
7.5.1.1 Bus Overview
The TMP464 device is compatible with the I2C or SMBus interface. In I2C or SMBus protocol, the device that
initiates the transfer is called a master, and the devices controlled by the master are slaves. The bus must be
controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the
start and stop conditions.
To address a specific device, a start condition is initiated. A start condition is indicated by pulling the data line
(SDA) from a high-to-low logic level when SCL is high. All slaves on the bus shift in the slave address byte, with
the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the addressed
slave responds to the master by generating an acknowledge (ACK) bit and pulling SDA low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit (ACK). During
data transfer, SDA must remain stable when SCL is high. A change in SDA when SCL is high is interpreted as a
control signal. The TMP464 device has a word register structure (16-bit wide), with data writes always requiring
two bytes. Data transfer occurs during the ACK at the end of the second byte.
After all data are transferred, the master generates a stop condition. A stop condition is indicated by pulling SDA
from low to high when SCL is high.
12
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Programming (接下页)
7.5.1.2 Bus Definitions
The TMP464 device has a two-wire interface that is compatible with the I2C or SMBus interface. 图 13 through 图
18 illustrate the timing for various operations on the TMP464 device. The bus definitions are as follows:
Bus Idle:
Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the SDA line (from high to low) when the SCL line is high defines
a start condition. Each data transfer initiates with a start condition.
Stop Data Transfer: A change in the state of the SDA line (from low to high) when the SCL line is high defines
a stop condition. Each data transfer terminates with a repeated start or stop condition.
Data Transfer: The number of data bytes transferred between a start and stop condition is not limited and is
determined by the master device. The receiver acknowledges the data transfer.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge bit. A device
that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of the acknowledge clock pulse. Take setup
and hold times into account. On a master receive, data transfer termination can be signaled by the
master generating a not-acknowledge on the last byte that is transmitted by the slave.
1
9
1
9
SCL
SDA
1
0
0
1
0
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
ACK
by
ACK
by
Device
Stop
by
Master
Start by
Master
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Pointer Byte
from Master
Device
图 13. Two-Wire Timing Diagram for Write Pointer Byte
1
1
9
1
9
SCL
SDA
0
0
1
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
0
ACK
by
Device
ACK
by
Device
Start by
Master
Frame 1
Serial Bus Address Byte
from Master
Frame 2
Pointer Byte from Master
1
9
1
9
SCL
(continued)
SDA
(continued)
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
ACK
by
ACK
by
Stop
by
Device
Device Master
Frame 3
Frame 4
Word MSB from Master
Word LSB from Master
图 14. Two-Wire Timing Diagram for Write Pointer Byte and Value Word
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Programming (接下页)
1
9
1
9
SCL
SDA
1
0
0
1
0
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
ACK
by
ACK
by
Start by
Master
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Pointer Byte
from Master
Device
Device
1
1
9
1
9
SCL
(continued)
SDA
(continued)
0
0
1
0
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
R/W
Repeat
Start by
Master
ACK
by
Device
NACK Stop
by by
Master Master
Frame 3
Serial Bus Address
Byte from Master
Frame 4
Data Byte 1 from
Device
(1) The master must leave SDA high to terminate a single-byte read operation.
图 15. Two-Wire Timing Diagram for Pointer Set Followed by a Repeat Start and Single-Byte Read Format
1
9
1
9
SCL
SDA
1
0
0
1
0
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
ACK
by
ACK
by
Start by
Master
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Pointer Byte
from Master
Device
Device
1
1
9
1
9
1
9
SCL
(continued)
SDA
(continued)
0
0
1
0
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
R/W
Repeat
Start by
Master
ACK
by
Device
ACK
by
Master
NACK Stop
by by
Master Master
Frame 3
Serial Bus Address
Byte from Master
Frame 4
Data Byte 1 from
Device
Frame 5
Data Byte 2 from
Device
图 16. Two-Wire Timing Diagram for Pointer Byte Set Followed by a Repeat Start and Word (Two-Byte)
Read
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Programming (接下页)
1
9
1
9
SCL
SDA
80h Block Read Auto Increment Pointer
1
0
0
1
0
A1 A0 R/W
ACK
by
ACK
by
Start by
Master
Frame 1
Serial Bus Address
Byte from Master
Frame 2
Pointer Byte from
Master
Device
Device
1
1
9
1
9
1
9
SCL
(continued)
SDA
(continued)
0
0
1
0
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
R/W
Repeat
Start by
Master
ACK
by
Device
ACK
by
Master
ACK
by
Master
Frame 3
Serial Bus Address
Byte from Master
Frame 4
Word 1 MSB from
Device
Frame 5
Word 1 LSB from
Device
1
9
1
9
SCL
(continued)
SDA
(continued)
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
ACK
by
NACK Stop
by by
Master Master
Frame (2N + 2)
Word N MSB from
Device
Frame (2N + 3)
Word N LSB from
Device
Master
图 17. Two-Wire Timing Diagram for Pointer Byte Set Followed by a Repeat Start and Multiple-Word (N-
Word) Read
1
1
9
1
9
1
9
SCL
SDA
0
0
1
0
A1 A0
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
R/W
ACK
by
Device
ACK
by
Master
ACK
by
Master
Start by
Master
Frame 3
Serial Bus Address
Byte from Master
Frame 4
Word 1 MSB from
Device
Frame 5
Word 1 LSB from
Device
1
9
1
9
SCL
(continued)
SDA
(continued)
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
ACK
by
NACK Stop
by by
Master Master
Frame (2N + 2)
Word N MSB from
Device
Frame (2N + 3)
Word N LSB from
Device
Master
图 18. Two-Wire Timing Diagram for Multiple-Word (N-Word) Read Without a Pointer Byte Set
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Programming (接下页)
7.5.1.3 Serial Bus Address
To communicate with the TMP464 device, the master must first address slave devices using a slave address
byte. The slave address byte consists of seven address bits and a direction bit indicating the intent of executing a
read or write operation. The TMP464 device allows up to four devices to be addressed on a single bus. The
assigned device address depends on the ADD pin connection as described in 表 2.
表 2. TMP464 Slave Address Options
SLAVE ADDRESS
ADD PIN CONNECTION
BINARY
1001000
1001001
1001010
1001011
HEX
48
GND
V+
49
SDA
SCL
4A
4B
7.5.1.4 Read and Write Operations
Accessing a particular register on the TMP464 device is accomplished by writing the appropriate value to the
pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the
R/W bit low. Every write operation to the TMP464 device requires a value for the pointer register (see 图 14).
The TMP464 registers can be accessed with block or single register reads. Block reads are only supported for
pointer values 80h to 84h. Registers at 80h through 84h mirror the Remote and Local Temperature registers (00h
to 04h). Pointer values 00h to 04h are for single register reads.
7.5.1.4.1 Single Register Reads
When reading from the TMP464 device, the last value stored in the pointer register by a write operation is used
to determine which register is read by a read operation. To change which register is read for a read operation, a
new value must be written to the pointer register. This transaction is accomplished by issuing a slave address
byte with the R/W bit low, followed by the pointer register byte; no additional data are required. The master can
then generate a start condition and send the slave address byte with the R/W bit high to initiate the read
command; see 图 15 through 图 17 for details of this sequence.
If repeated reads from the same register are desired, continually sending the pointer register bytes is not
necessary because the TMP464 device retains the pointer register value until the value is changed by the next
write operation. The register bytes are sent by the MSB first, followed by the LSB. If only one byte is read (MSB),
a consecutive read of TMP464 device results in the MSB being transmitted first. The LSB can only be accessed
through two-byte reads.
The master terminates a read operation by issuing a not-acknowledge (NACK) command at the end of the last
byte to be read or transmitting a stop condition. For a single-byte operation, the master must leave the SDA line
high during the acknowledge time of the first byte that is read from the slave.
The TMP464 register structure has a word (two-byte) length, so every write transaction must have an even
number of bytes (MSB and LSB) following the pointer register value (see 图 14). Data transfers occur during the
ACK at the end of the second byte or LSB. If the transaction does not finish, signaled by the ACK at the end of
the second byte, then the data is ignored and not loaded into the TMP464 register. Read transactions do not
have the same restrictions and may be terminated at the end of the last MSB.
7.5.1.4.2 Block Register Reads
The TMP464 supports block mode reads at address 80h through 84h for temperature results alone. Setting the
pointer register to 80h signals to the TMP464 device that a block of more than two bytes must be transmitted
before a stop is issued. In this mode, the TMP464 device auto increments the internal pointer. If the transmission
is terminated before register 84h is read, the pointer increments so a consecutive read (without a pointer set) can
access the next register.
16
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7.5.1.5 Timeout Function
The TMP464 device resets the serial interface if either SCL or SDA are held low for 17.5 ms (typical) between a
start and stop condition. If the TMP464 device is holding the bus low, the device releases the bus and waits for a
start condition. To avoid activating the timeout function, maintain a communication speed of at least 1 kHz for the
SCL operating frequency.
7.5.1.6 High-Speed Mode
For the two-wire bus to operate at frequencies above 1 MHz, the master device must issue a high-speed mode
(HS-mode) master code (0000 1xxx) as the first byte after a start condition to switch the bus to high-speed
operation. The TMP464 device does not acknowledge the master code byte, but switches the input filters on
SDA and SCL and the output filter on SDA to operate in HS-mode, allowing transfers up to 2.56 MHz. After the
HS-mode master code is issued, the master transmits a two-wire slave address to initiate a data transfer
operation. The bus continues to operate in HS-mode until a stop condition occurs on the bus. Upon receiving the
stop condition, the TMP464 device switches the input and output filters back to fast mode.
7.5.2 TMP464 Register Reset
The TMP464 registers can be software reset by setting bit 15 of the Software Reset register (20h) to 1. This
software reset restores the power-on-reset state to all TMP464 registers and aborts any conversion in progress.
7.5.3 Lock Register
All of the configuration and limit registers may be locked for writes (making the registers write-protected), which
decreases the chance of software runaway from issuing false changes to these registers. The Lock column in 表
3 identifies which registers may be locked. Lock mode does not effect read operations. To activate the lock
mode, Lock Register C4h must be set to 0x5CA6. The lock only remains active while the TMP464 device is
powered up. Because the TMP464 device does not contain nonvolatile memory, the settings of the configuration
and limit registers are lost once a power cycle occurs regardless if the registers are locked or unlocked.
In lock mode, the TMP464 device ignores a write operation to configuration and limit registers except for Lock
Register C4h. The TMP464 device does not acknowledge the data bytes during a write operation to a locked
register. To unlock the TMP464 registers, write 0xEB19 to register C4h. The TMP464 device powers up in locked
mode, so the registers must be unlocked before the registers accept writes of new data.
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7.6 Register Maps
表 3. Register Map
PTR
(HEX)
00
POR
(HEX)
0000
Lock
TMP464 Functional Registers - BIT DESCRIPTION
REGISTER DESCRIPTION
(Y/N) 15
14
13 12
11
10
9
8
7
6
5
4
3
2
0(1)
1
0
N/A
N/A
N/A
N/A
N/A
LT12
LT11 LT1 LT9
0
LT8
LT7
LT6 LT5 LT4
LT3
LT2
LT1
LT0
0
0
Local temperature
01
02
03
04
0000
0000
0000
0000
RT12
RT12
RT12
RT12
RT11 RT RT9
10
RT8
RT8
RT8
RT8
0
RT7
RT7
RT7
RT7
0
RT RT RT4
RT3
RT3
RT3
RT3
RT2
RT2
RT2
RT2
RT1
RT1
RT1
RT1
RT0
RT0
RT0
RT0
0
0
0
0
0
0
0
0
0
0
0
0
Remote temperature 1
Remote temperature 2
Remote temperature 3
Remote temperature 4
6
5
RT11 RT RT9
10
RT RT RT4
6
5
RT11 RT RT9
10
RT RT RT4
6
5
RT11 RT RT9
10
RT RT RT4
6
5
20
21
0000
N/A
N/A
N/A
RST
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Software Reset Register
THERM Status
R4TH R3TH R2 R1 LTH
TH TH
22
23
30
N/A
N/A
N/A
Y
0
0
0
0
0
0
0
0
0
0
0
0
0
R4TH R3TH R2 R1 LTH2
0
0
0
0
0
0
0
0
0
0
0
0
0
THERM2 Status
2
2
TH TH
2
2
N/A
R4O R3O R2 R1
PN PN OP OP
0
0
0
Remote channel OPEN Status
N
N
0F9C
0080
REN4 REN3 RE RE LEN OS
N2 N1
SD
CR2 CR1
CR0
BU
SY
Configuration Register (Enables,
OneShot, ShutDown, ConvRate,
BUSY)
38
39
Y
Y
HYS1 HY HYS9 HYS8 HYS7 HY HY HYS4
S10 S6 S5
0
0
0
0
0
0
0
0
0
0
0
0
0
THERM hysteresis
1
3E80
LTH1_ LTH1 LT LTH1 LTH1 LTH1 LT LT LTH1 LTH1
Local temp THERM limit
(125°C)
12
_11
H1 _09
_10
_08
_07
H1 H1 _04
_06 _05
_03
3A
7FC0
Y
LTH2_ LTH2 LT LTH2 LTH2 LTH2 LT LT LTH2 LTH2
0
0
0
0
0
0
Local temp THERM2 limit
(225.5°C)
12
_11
H2 _09
_10
_08
_07
H2 H2 _04
_06 _05
_03
40
41
0000
0000
Y
Y
ROS12 ROS RO ROS ROS ROS RO RO ROS ROS ROS ROS ROS0
0
0
0
0
0
0
Remote temp 1 offset
12(2) S10
RNC RN RNC RNC RNC RN RN
C5 C1 C0
9
8
7
S6 S5
4
3
2
1
RNC7
0
0
0
0
0
Remote temp 1 η-factor correction
6
4
3
2
(1) Register bits highlighted in purple are reserved for future use and always reports 0; writes to these bits are ignored.
(2) Register bits highlighted in green show sign extended values.
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Register Maps (接下页)
表 3. Register Map (接下页)
PTR
(HEX)
42
POR
Lock
TMP464 Functional Registers - BIT DESCRIPTION
REGISTER DESCRIPTION
0
(HEX)
3E80
(Y/N) 15
14
13 12
11
10
9
8
7
6
5
4
3
2
1
Y
RTH1_ RTH1 RT RTH1 RTH1 RTH1 RT RT RTH1 RTH1
0
0
0
0
0
0
Remote temp 1 THERM limit
12
_11
H1 _09
_10
_08
_07
H1 H1 _04
_06 _05
_03
43
7FC0
Y
RTH2_ RTH2 RT RTH2 RTH2 RTH2 RT RT RTH2 RTH2
0
0
0
0
0
0
Remote temp 1 THERM2 limit
12
_11
H2 _09
_10
_08
_07
H2 H2 _04
_06 _05
_03
48
49
4A
0000
0000
3E80
Y
Y
Y
ROS12 ROS RO ROS ROS ROS RO RO ROS ROS ROS ROS ROS0
0
0
0
0
0
0
0
0
0
Remote temp 2 offset
12
RNC RN RNC RNC RNC RN RN
C5 C1 C0
RTH1_ RTH1 RT RTH1 RTH1 RTH1 RT RT RTH1 RTH1
S10
9
8
7
S6 S5
4
3
2
1
RNC7
0
0
0
0
0
0
Remote temp 2 η-factor correction
Remote temp 2 THERM limit
6
4
3
2
0
0
0
0
12
_11
H1 _09
_10
_08
_07
H1 H1 _04
_06 _05
_03
4B
7FC0
Y
RTH2_ RTH2 RT RTH2 RTH2 RTH2 RT RT RTH2 RTH2
0
0
0
0
Remote temp 2 THERM2 limit
12
_11
H2 _09
_10
_08
_07
H2 H2 _04
_06 _05
_03
50
51
52
0000
0000
3E80
Y
Y
Y
ROS12 ROS RO ROS ROS ROS RO RO ROS ROS ROS ROS ROS0
0
0
0
0
0
0
0
0
0
Remote temp 3 offset
12
RNC RN RNC RNC RNC RN RN
C5 C1 C0
RTH1_ RTH1 RT RTH1 RTH1 RTH1 RT RT RTH1 RTH1
S10
9
8
7
S6 S5
4
3
2
1
RNC7
0
0
0
0
0
0
Remote temp 3 η-factor correction
Remote temp 3 THERM limit
6
4
3
2
0
0
0
0
12
_11
H1 _09
_10
_08
_07
H1 H1 _04
_06 _05
_03
53
7FC0
Y
RTH2_ RTH2 RT RTH2 RTH2 RTH2 RT RT RTH2 RTH2
0
0
0
0
Remote temp 3 THERM2 limit
12
_11
H2 _09
_10
_08
_07
H2 H2 _04
_06 _05
_03
58
59
5A
0000
0000
3E80
Y
Y
Y
ROS12 ROS RO ROS ROS ROS RO RO ROS ROS ROS ROS ROS0
0
0
0
0
0
0
0
0
0
Remote temperature 4 offset
Remote temp 4 η-factor correction
Remote temp 4 THERM limit
12
RNC RN RNC RNC RNC RN RN
C5 C1 C0
RTH1_ RTH1 RT RTH1 RTH1 RTH1 RT RT RTH1 RTH1
S10
9
8
7
S6 S5
4
3
2
1
RNC7
0
0
0
0
0
0
6
4
3
2
0
0
12
_11
H1 _09
_10
_08
_07
H1 H1 _04
_06 _05
_03
5B
80
7FC0
0000
Y
RTH2_ RTH2 RT RTH2 RTH2 RTH2 RT RT RTH2 RTH2
0
0
0
0
0
0
0
0
0
Remote temp 4 THERM2 limit
12
_11
H2 _09
_10
_08
_07
H2 H2 _04
_06 _05
_03
N/A
LT12
LT11 LT1 LT9
0
LT8
LT7
LT6 LT5 LT4
LT3
LT2
LT1
LT0
Local temperature (Block read range -
auto increment pointer register)
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Register Maps (接下页)
表 3. Register Map (接下页)
PTR
(HEX)
81
POR
(HEX)
0000
Lock
TMP464 Functional Registers - BIT DESCRIPTION
REGISTER DESCRIPTION
(Y/N) 15
14
13 12
11
10
9
8
7
6
5
4
3
2
1
0
N/A
N/A
N/A
N/A
N/A
RT12
RT11 RT RT9
10
RT8
RT7
RT RT RT4
RT3
RT2
RT1
RT0
0
0
0
Remote temperature 1 (Block read
range - auto increment pointer
register)
6
5
82
83
84
C4
0000
0000
0000
8000
RT12
RT12
RT12
RT11 RT RT9
10
RT8
RT8
RT8
RT7
RT7
RT7
RT RT RT4
RT3
RT3
RT3
RT2
RT2
RT2
RT1
RT1
RT1
RT0
RT0
RT0
0
0
0
0
0
0
0
0
0
Remote temperature 2 (Block read
range - auto increment pointer
register)
6
5
RT11 RT RT9
10
RT RT RT4
Remote temperature 3 (Block read
range - auto increment pointer
register)
6
5
RT11 RT RT9
10
RT RT RT4
Remote temperature 4 (Block read
range - auto increment pointer
register)
6
5
Write 0x5CA6 to lock registers and 0xEB19 to unlock registers
Read back: locked 0x8000; unlocked 0x0000
Lock Registers after initialization
FE
FF
5449
1468
N/A
N/A
0
0
1
0
0
0
1
1
0
0
1
1
0
0
0
0
0
0
1
1
0
1
0
0
1
1
0
0
0
0
1
0
Manufacturers Identification Register
Device Identification/Revision Register
20
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7.6.1 Register Information
The TMP464 device contains multiple registers for holding configuration information, temperature measurement
results, and status information. These registers are described in 图 19 and 表 3.
7.6.1.1 Pointer Register
图 19 shows the internal register structure of the TMP464 device. The 8-bit pointer register addresses a given
data register. The pointer register identifies which of the data registers must respond to a read or write command
on the two-wire bus. This register is set with every write command. A write command must be issued to set the
proper value in the pointer register before executing a read command. 表 3 describes the pointer register and the
internal structure of the TMP464 registers. The power-on-reset (POR) value of the pointer register is 00h (0000
0000b). 表 3 lists a summary of the pointer values for the different registers. Writing data to unassigned pointer
values are ignored and does not affect the operation of the device. Reading an unassigned register returns
undefined data and is ACKed.
Pointer Register
2
2
2
2
2
Local Temp
Local THERM Limit
Local THERM2 Limit
Remote Temp 1
Remote Temp 2
Remote Temp 3
Remote Temp 4
SDA
SCL
Remote 1 Offset
Remote 1 h -factor
Remote 1 THERM
Remote 1 THERM2
Remote 2 Offset
Remote 2 h -factor
Remote 2 THERM
Remote 2 THERM2
Serial
Interface
THERM Status
THERM2 Status
Remote Open Status
Remote 3 Offset
Remote 3 h -factor
Remote 3 THERM
Remote 3 THERM2
Manufacturer ID
Device ID
Configuration
Software Reset
Lock Initialization
Remote 4 Offset
Remote 4 h -factor
Remote 4 THERM
Remote 4 THERM2
THERM Hysterisis
图 19. TMP464 Internal Register Structure
7.6.1.2 Local and Remote Temperature Value Registers
The TMP464 device has multiple 16-bit registers that hold 13-bit temperature measurement results. The 13 bits
of the local temperature sensor result are stored in register 00h. The 13 bits of the four remote temperature
sensor results are stored in registers 01h through 04h. The four assigned LSBs of both the local (LT3:LT0) and
remote (RT3:RT0) sensors indicate the temperature value after the decimal point (for example, if the temperature
result is 10.0625°C, then the high byte is 0000 0101 and the low byte is 0000 1000). These registers are read-
only and are updated by the ADC each time a temperature measurement is complete. Asynchronous reads are
supported, so a read operation can occur at any time and results in valid conversion results being transmitted
once the first conversion is complete after power up for the channel being accessed. If after power up a read is
initiated before a conversion is complete, the read operation results in all zeros (0x0000).
7.6.1.3 Software Reset Register
The Software Reset Register allows the user to reset the TMP464 registers through software by setting the reset
bit (RST, bit 15) to 1. The power-on-reset value for this register is 0x0000. Resets are ignored when the device is
in lock mode, so writing a 1 to the RST bit does not reset any registers.
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表 4. Software Reset Register Format
STATUS REGISTER (READ = 20h, WRITE = 20h, POR = 0x0000)
BIT NUMBER
BIT NAME
FUNCTION
15
RST
0
1 software reset device; writing a value of 0 is ignored
Reserved for future use; always reports 0
14-0
7.6.1.4 THERM Status Register
The THERM Status register reports the state of the THERM limit comparators for local and four remote
temperatures. 表 5 lists the status register bits. The THERM Status register is read-only and is read by accessing
pointer address 21h.
表 5. THERM Status Register Format
THERM STATUS REGISTER (READ = 21h, WRITE = N/A)
BIT NUMBER
BIT NAME
0
FUNCTION
Reserved for future use; always reports 0.
1 when Remote 4 exceeds the THERM limit
1 when Remote 3 exceeds the THERM limit
1 when Remote 2 exceeds the THERM limit
1 when Remote 1 exceeds the THERM limit
1 when Local sensor exceeds the THERM limit
Reserved for future use; always reports 0.
15:12
11
10
9
R4TH
R3TH
R2TH
R1TH
LTH
8
7
6:0
0
The R4TH:R1TH and LTH flags are set when the corresponding temperature exceeds the respective
programmed THERM limit (39h, 42h, 4Ah, 52h, and 5Ah). These flags are reset automatically when the
temperature returns below the THERM limit minus the value set in the THERM Hysteresis register (38h). The
THERM output goes low in the case of overtemperature on either the local or remote channels, and goes high as
soon as the measurements are less than the THERM limit minus the value set in the THERM Hysteresis register.
The THERM Hysteresis register (38h) allows hysteresis to be added so that the flag resets and the output goes
high when the temperature returns to or goes below the limit value minus the hysteresis value.
22
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7.6.1.5 THERM2 Status Register
The THERM2 Status register reports the state of the THERM2 limit comparators for local and remote 1-4
temperatures. 表 6 lists the status register bits. The THERM2 Status register is read-only and is read by
accessing pointer address 22h.
表 6. THERM2 Status Register Format
THERM2 STATUS REGISTER (READ = 22h, WRITE = N/A)
BIT NUMBER
BIT NAME
0
FUNCTION
Reserved for future use; always reports 0.
1 when Remote 4 exceeds the THERM2 limit
1 when Remote 3 exceeds the THERM2 limit
1 when Remote 2 exceeds the THERM2 limit
1 when Remote 1 exceeds the THERM2 limit
1 when Local Sensor exceeds the THERM2 limit
Reserved for future use; always reports 0.
15:12
11
10
9
R4TH2
R3TH2
R2TH2
R1TH2
LTH2
0
8
7
6:0
The R4TH2:R1TH2 and LTH2 flags are set when the corresponding temperature exceeds the respective
programmed THERM2 limit (3Ah, 43h, 4Bh, 53h, 5Bh, 63h, 6Bh, 73h, 7Bh). These flags are reset automatically
when the temperature returns below the THERM2 limit minus the value set in the THERM Hysteresis register
(38h). The THERM2 output goes low in the case of overtemperature on either the local or remote channels, and
goes high as soon as the measurements are less than the THERM2 limit minus the value set in the THERM
Hysteresis register. The THERM Hysteresis register (38h) allows hysteresis to be added so that the flag resets
and the output goes high when the temperature returns to or goes below the limit value minus the hysteresis
value.
7.6.1.6 Remote Channel Open Status Register
The Remote Channel Open Status register reports the state of the connection of remote channels one through
four. 表 7 lists the status register bits. The Remote Channel Open Status register is read-only and is read by
accessing pointer address 23h.
表 7. Remote Channel Open Status Register Format
REMOTE CHANNEL OPEN STATUS REGISTER (READ = 23h, WRITE = N/A)
BIT NUMBER
BIT NAME
0
FUNCTION
Reserved for future use; always reports 0.
1 when Remote 4 channel is an open circuit
1 when Remote 3 channel is an open circuit
1 when Remote 2 channel is an open circuit
1 when Remote 1 channel is an open circuit
Reserved for future use; always reports 0.
15:12
11
10
9
R4OPEN
R3OPEN
R2OPEN
R1OPEN
0
8
7:0
The R4OPEN:R1OPEN bits indicate an open-circuit condition on remote sensors four through one, respectively.
The setting of these flags does not directly affect the state of the THERM or THERM2 output pins. Indirectly, the
temperature reading(s) may be erroneous and exceed the respective THERM and THERM2 limits, activating the
THERM or THERM2 output pins.
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7.6.1.7 Configuration Register
The Configuration Register sets the conversion rate, starts one-shot conversion of all enabled channels, enables
conversion the temperature channels, controls the shutdown mode and reports when a conversion is in process.
The Configuration Register is set by writing to pointer address 30h, and is read from pointer address 30h. 表 8
summarizes the bits of the Configuration Register.
表 8. Configuration Register Bit Descriptions
CONFIGURATION REGISTER (READ = 30h, WRITE = 30h, POR = 0x0F9C)
BIT NUMBER
NAME
FUNCTION
POWER-ON-RESET VALUE
Reserved for future use; always
reports 0
15:12
0
0000
1 = enable respective remote
channel 4 through 1 conversions
11:8
7
REN4:REN1
LEN
1111
1
1 = enable local channel
conversion
1 = start one-shot conversion on
enabled channels
6
5
OS
SD
0
0
1 = enables device shutdown
Conversion rate control bits;
control conversion rates for all
enabled channels from 16
seconds to continuous
conversion
4:2
CR2:CR0
111
1 when the ADC is converting
(read-only bit ignores writes)
1
0
BUSY
0
0
Reserved
—
The Remote Enable four through one (REN4:REN1, bits 11:8) bits enable conversions on the respective remote
channels. The Local Enable (LEN, bit 7) bit enables conversions of the local temperature channel. If all LEN and
REN are set to 1 (default), this enables the ADC to convert the local and all remote temperatures. If the LEN is
set to 0, the local temperature conversion is skipped. Similarly if a REN is set to 0, that remote temperature
conversion channel is skipped. The TMP464 device steps through each enabled channel in a round-robin fashion
in the following order: LOC, REM1, REM2, REM4, LOC, REM1, and so on. All local and remote temperatures are
converted by the internal ADC by default after power up. The configuration register LEN and REN bits can be
configured to save power by reducing the total ADC conversion time for applications that do not require all of the
four remote and local temperature information. Note writing all zeros to REN4:REN1 and LEN has the same
effect as SD = 1 and OS = 0.
The shutdown bit (SD, bit 5) enables or disables the temperature-measurement circuitry. If SD = 0 (default), the
TMP464 device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the
TMP464 device immediately stops the conversion in progress and instantly enters shutdown mode. When SD is
set to 0 again, the TMP464 device resumes continuous conversions starting with the local temperature.
The BUSY bit = 1 if the ADC is making a conversion. This bit is set to 0 if the ADC is not converting.
After the TMP464 device is in shutdown mode, writing a 1 to the one-shot (OS, bit 6) bit starts a single ADC
conversion of all the enabled temperature channels. This write operation starts one conversion and comparison
cycle on either the four remote and one local sensor or any combination of sensors, depending on the LEN and
REN values in the Configuration Register (read address 30h). The TMP464 device returns to shutdown mode
when the cycle is complete. 表 9 details the interaction of the SD, OS, LEN, and REN bits.
表 9. Conversion Modes
WRITE
REN[8:1], LEN
All 0
READ
REN[8:1], LEN
All 0
FUNCTION
OS SD
OS SD
—
—
0
—
0
0
0
0
1
1
0
1
1
Shutdown
Continuous conversion
Shutdown
At least 1 enabled
At least 1 enabled
At least 1 enabled
Written value
Written value
Written value
1
1
1
One-shot conversion
24
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The conversion rate bits control the rate that the conversions occur (CR2:CR0, bits 4:2). The value of CR2:CR0
bits controls the idle time between conversions but not the conversion time itself, which allows the TMP464
device power dissipation to be balanced with the update rate of the temperature register. 表 10 describes the
mapping for CR2:CR0 to the conversion rate or temperature register update rate.
表 10. Conversion Rate
CR2:CR0
000
DECIMAL VALUE
FREQUENCY (Hz)
TIME (s)
0
1
2
3
4
5
6
0.0625
0.125
0.25
0.5
1
16
8
001
010
4
011
2
100
1
101
2
0.5
0.25
110
4
Continuous conversion; depends on number of enabled channels; see 表
111
7
11 (default).
表 11. Continuous Conversion Times
CONVERSION TIME (ms)
NUMBER OF REMOTE CHANNELS ENABLED
LOCAL DISABLED
LOCAL ENABLED
0
1
2
3
4
0
15.5
31.3
47.1
62.9
78.7
15.8
31.6
47.4
63.2
The remaining bits of the configuration register are reserved and must always be set to 0. The POR value for this
register is 0x0F9C.
7.6.1.8 η-Factor Correction Register
The TMP464 device allows for a different η-factor value to be used for converting remote channel measurements
to temperature for each temperature channel. There are four η-Factor Correction registers assigned: one to each
of the remote input channels (addresses 41h, 49h, 51h, and 59h). Each remote channel uses sequential current
excitation to extract a differential VBE voltage measurement to determine the temperature of the remote
transistor. 公式 1 shows this voltage and temperature.
≈
∆
’
÷
I2
I
hkT
q
VBE2 - VBE1
=
In
« 1 ◊
(1)
The value η in 公式 1 is a characteristic of the particular transistor used for the remote channel. The POR value
for the TMP464 device is η = 1.008. The value in the η-Factor Correction register can be used to adjust the
effective η-factor, according to 公式 2 and 公式 3.
≈
∆
«
’
÷
◊
1.008 ì 2088
2088 + NADJUST
ꢀeff
=
(2)
≈
∆
«
’
÷
◊
1.008 ì 2088
NADJUST
=
- 2088
ꢀeff
(3)
The η-factor correction value must be stored in a two's-complement format, which yields an effective data range
from –128 to +127. The POR value for each register is 0000h, which does not affect register values unless a
different value is written to the register. The resolution of the η-factor register changes linearly as the code
changes and has a range from 0.0004292 to 0.0005476, with an average of 0.0004848.
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表 12. η-Factor Range
NADJUST ONLY BITS 15 TO 8 IN THE REGISTER ARE SHOWN
η
BINARY
HEX
7F
0A
08
DECIMAL
0111 1111
0000 1010
0000 1000
0000 0110
0000 0100
0000 0010
0000 0001
0000 0000
1111 1111
1111 1110
1111 1100
1111 1010
1111 1000
1111 0110
1000 0000
127
10
8
0.950205
1.003195
1.004153
1.005112
1.006073
1.007035
1.007517
1.008
06
6
04
4
02
2
01
1
00
0
FF
FE
FC
FA
F8
F6
80
–1
–2
–4
–6
–8
–10
–128
1.008483
1.008966
1.009935
1.010905
1.011877
1.012851
1.073829
7.6.1.9 Remote Temperature Offset Register
The offset registers allow the TMP464 device to store any system offset compensation value that may result from
precision calibration. The value in these registers is added to the remote temperature results upon every
conversion. Each of the four temperature channels have an independent assigned offset register (addresses 40h,
48h, 50h, and 58h). Combined with the independent η-factor corrections, this function allows for very accurate
system calibration over the entire temperature range for each remote channel. The format of these registers is
the same as the temperature value registers with a range from +127.9375 to –128. Take care to program this
register with sign extension, as values above +127.9375 and below –128 are not supported.
7.6.1.10 THERM Hysteresis Register
The THERM Hysteresis register (address 38h) sets the value of the hysteresis used by the temperature
comparison logic. All temperature reading comparisons have a common hysteresis. Hysteresis prevents
oscillations from occurring on the THERM and THERM2 outputs as the measured temperature approaches the
comparator threshold (see the THERM Functions section). The resolution of the THERM Hysteresis register is
1°C and ranges from 0°C to 255°C.
7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
Each of the four remote and the local temperature channels has associated independent THERM and THERM2
Limit registers. There are five THERM registers (addresses 39h, 42h, 4Ah, 52h, and 5Ah) and five THERM2
registers (addresses 39h, 43h, 4Bh, and 53h), 10 registers in total. The resolution of these registers is 0.5°C and
ranges from +255.5°C to –255°C. See the THERM Functions section for more information.
Setting a THERM limit to 255.5°C disables the THERM limit comparison for that particular channel and disables
the limit flag from being set in the THERM Status register. This prevents the associated channel from activating
the THERM output. THERM2 limits, status, and outputs function similarly.
7.6.1.12 Block Read - Auto Increment Pointer
Block reads can be initiated by setting the pointer register to 80h to 84h. The temperature results are mirrored at
pointer addresses 80h to 84h; temperature results for all the channels can be read with one read transaction.
Setting the pointer register to any address from 80h to 84h signals to the TMP464 device that a block of more
than two bytes must be transmitted before a design stop is issued. In block read mode, the TMP464 device auto
increments the pointer address.
26
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7.6.1.13 Lock Register
Register C4h allows the device configuration and limit registers to lock, as shown by the Lock column in 表 3. To
lock the registers, write 0x5CA6. To unlock the registers, write 0xEB19. When the lock function is enabled,
reading the register yields 0x8000; when unlocked, 0x0000 is transmitted.
7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
The TMP464 device allows the two-wire bus controller to query the device for manufacturer and device
identifications (IDs) to enable software identification of the device at the particular two-wire bus address. The
manufacturer ID is obtained by reading from pointer address FEh; the device ID is obtained from register FFh.
Note that the most significant byte of the Device ID register identifies the TMP464 device revision level. The
TMP464 device reads 0x5449 for the manufacturer code and 0x1468 for the device ID code for the first release.
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TMP464 device requires a transistor connected between the D+ and D– pins for remote temperature
measurement. Tie the D+ pin to D– if the remote channel is not used and only the local temperature is
measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup
resistors as part of the communication bus. TI recommends a 0.1-µF power-supply decoupling capacitor for local
bypassing. 图 20 and 图 21 illustrate the typical configurations for the TMP464 device.
8.2 Typical Application
Remote
Remote
Remote
Zone 2
Remote
Zone 1
Zone 4
Zone 3
1.7 V to 3.6 V
CBYPASS
RS1
RS2
CDIFF
RS1
RS2
CDIFF
RS1
RS2
CDIFF
RS1
RS2
CDIFF
RT2
RT
RSCL RSDA
14
V+
6
TMP464
13
D1+
Two-Wire
Interface
SMBus / I2C
Compatible
Controller
SCL
SDA
5
D2+
4
D3+
12
11
3
D4+
7
D-
THERM2
Overtemperature
Shutdown
10
9
THERM
ADD
Local
Zone 5
GND
8
Copyright © 2017, Texas Instruments Incorporated
(1) The diode-connected configuration provides better settling time. The transistor-connected configuration provides
better series resistance cancellation. TI recommends a MMBT3904 or MMBT3906 transistor with an η-factor of 1.008.
(2) RS (optional) is < 1 kΩ in most applications. RS is the combined series resistance connected externally to the D+, D–
pins. RS selection depends on the application.
(3) CDIFF (optional) is < 1000 pF in most applications. CDIFF selection depends on the application; see 图 7.
(4) Unused diode channels must be tied to D– .
图 20. TMP464 Basic Connections Using a Discrete Remote Transistor
28
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Typical Application (接下页)
(2)
RS
Series Resistance
(2)
RS
NPN Diode-Connected Configuration(1)
(2)
RS
Series Resistance
(2)
RS
D+
D-
(3)
CDIFF
PNP Diode-Connected Configuration(1)
TMP464
(2)
RS
Series Resistance
(2)
RS
PNP Transistor-Connected Configuration(1)
(2)
(2)
RS
RS
RS
(2)
(2)
RS
Internal and PCB
Series Resistance
Processor, FPGA, or ASIC
Integrated PNP Transistor-Connected Configuration(1)
Copyright © 2017, Texas Instruments Incorporated
图 21. TMP464 Remote Transistor Configuration Options
8.2.1 Design Requirements
The TMP464 device is designed to be used with either discrete transistors or substrate transistors built into
processor chips, field programmable gate arrays (FPGAs), and application-specific integrated circuits (ASICs) ;
see 图 21. Either NPN or PNP transistors can be used, as long as the base-emitter junction is used as the
remote temperature sensor. NPN transistors must be diode-connected. PNP transistors can either be transistor-
or diode-connected (see 图 21).
Errors in remote temperature sensor readings are typically the consequence of the ideality factor (η-factor) and
current excitation used by the TMP464 device versus the manufacturer-specified operating current for a given
transistor. Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate
transistors. The TMP464 uses 7.5 μA (typical) for ILOW and 120 μA (typical) for IHIGH
.
The ideality factor (η-factor) is a measured characteristic of a remote temperature sensor diode as compared to
an ideal diode. The TMP464 allows for different η-factor values; see the η-Factor Correction Register section.
The η-factor for the TMP464 device is trimmed to 1.008. For transistors that have an ideality factor that does not
match the TMP464 device, 公式 4 can be used to calculate the temperature error.
注
For 公式 4 to be used correctly, the actual temperature (°C) must be converted to Kelvin
(K).
版权 © 2017–2019, Texas Instruments Incorporated
29
TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
www.ti.com.cn
Typical Application (接下页)
h -1.008
1.008
≈
’
O
ì 273.15 + T C
TERR
=
(
)
∆
«
÷
◊
where
•
•
•
TERR = error in the TMP464 device because η ≠ 1.008
η = ideality factor of the remote temperature sensor
T(°C) = actual temperature, and
(4)
(5)
In 公式 4, the degree of delta is the same for °C and K.
For η = 1.004 and T(°C) = 100°C:
1.004 - 1.008
1.008
≈
’
TERR
=
ì 273.15 + 100èC
(
)
∆
÷
◊
«
TERR = -1.48èC
If a discrete transistor is used as the remote temperature sensor with the TMP464 device, then select the
transistor according to the following criteria for best accuracy:
•
•
•
•
Base-emitter voltage is > 0.25 V at 7.5 μA, at the highest-sensed temperature.
Base-emitter voltage is < 0.95 V at 120 μA, at the lowest-sensed temperature.
Base resistance is < 100 Ω.
Tight control of VBE characteristics indicated by small variations in hFE (50 to 150).
Based on these criteria, TI recommends using a MMBT3904 (NPN) or a MMBT3906 (PNP) transistor.
8.2.2 Detailed Design Procedure
The local temperature sensor inside the TMP464 is influenced by the ambient air around the device but mainly
monitors the PCB temperature that it is mounted to. The thermal time constant for the TMP464 device is
approximately two seconds. This constant implies that if the ambient air changes quickly by 100°C, then the
TMP464 device takes approximately 10 seconds (that is, five thermal time constants) to settle to within 1°C of
the final value. In most applications, the TMP464 package is in electrical (and therefore thermal) contact with the
printed-circuit board (PCB), and subjected to forced airflow. The accuracy of the measured temperature directly
depends on how accurately the PCB and forced airflow temperatures represent the temperature that the TMP464
device is measuring. Additionally, the internal power dissipation of the TMP464 device can cause the
temperature to rise above the ambient or PCB temperature. The internal power is negligible because of the small
current drawn by the TMP464 device. 公式 6 can be used to calculate the average conversion current for power
dissipation and self-heating based on the number of conversions per second and temperature sensor channel
enabled. 公式 7 shows an example with local and all remote sensor channels enabled and conversion rate of 1
conversion per second; see the Electrical Characteristics table for typical values required for these calculations.
For a 3.3-V supply and a conversion rate of 1 conversion per second, the TMP464 device dissipates 0.143 mW
(PDIQ = 3.3 V × 43 μA) when both the remote and local channels are enabled.
Average Conversion Current = (Local Conversion Time) × (Conversions Per Second) × (Local Active IQ ) +
(Remote Conversion Time) × (Conversions Per Second) × (Remote Active IQ) × (Number of Active Channels +
(Standby Mode) × [1 œ ((Local Conversion Time) + (Remote Conversion Time) × (Number of Active
Channels)) × (Conversions Per Second)]
(6)
(7)
30
版权 © 2017–2019, Texas Instruments Incorporated
TMP464
www.ti.com.cn
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
Typical Application (接下页)
1
sec
1
Average Conversion Current =(16 ms)ì(
+ (16 ms)ì(
)ì(240 mA)
)ì(200 mA)ì(4)
sec
1
»
ÿ
+ (15 mA)ì 1 - ((16 ms)+ (16 ms)ì(4))ì(
)
…
Ÿ
sec
⁄
= 43 mA
(8)
The temperature measurement accuracy of the TMP464 device depends on the remote and local temperature
sensor being at the same temperature as the monitored system point. If the temperature sensor is not in good
thermal contact with the part of the monitored system, then there is a delay between the sensor response and
the system changing temperature. This delay is usually not a concern for remote temperature-sensing
applications that use a substrate transistor (or a small, SOT-23 transistor) placed close to the monitored device.
8.2.3 Application Curve
图 22 shows the typical step response to submerging a TMP464 device (initially at 25°C) in an oil bath with a
temperature of 100°C and logging the local temperature readings.
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0
-2
0
2
4
6
8
Time (s)
10
12
14
16
18
图 22. TMP464 Temperature Step Response of Local Sensor
9 Power Supply Recommendations
The TMP464 device operates with a power-supply range from 1.7 V to 3.6 V. The device is optimized for
operation at a 1.8-V supply, but can measure temperature accurately in the full supply range.
TI recommends a power-supply bypass capacitor. Place this capacitor as close as possible to the supply and
ground pins of the device. A typical value for this supply bypass capacitor is 0.1 μF. Applications with noisy or
high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.
版权 © 2017–2019, Texas Instruments Incorporated
31
TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
www.ti.com.cn
10 Layout
10.1 Layout Guidelines
Remote temperature sensing on the TMP464 device measures very small voltages using very low currents;
therefore, noise at the device inputs must be minimized. Most applications using the TMP464 device have high
digital content, with several clocks and a multitude of logic-level transitions that create a noisy environment.
Layout must adhere to the following guidelines:
1. Place the TMP464 device as close to the remote junction sensor as possible.
2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of
ground guard traces, as shown in 图 23. If a multilayer PCB is used, bury these traces between the ground
or V+ planes to shield them from extrinsic noise sources. TI recommends 5-mil (0.127 mm) PCB traces.
3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are
used, make the same number and approximate locations of copper-to-solder connections in both the D+ and
D– connections to cancel any thermocouple effects.
4. Use a 0.1-μF local bypass capacitor directly between the V+ and GND of the TMP464. For optimum
measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less. This
capacitance includes any cable capacitance between the remote temperature sensor and the TMP464.
5. If the connection between the remote temperature sensor and the TMP464 is wired and is less than eight
inches (20.32 cm) long, use a twisted-wire pair connection. For lengths greater than eight inches, use a
twisted, shielded pair with the shield grounded as close to the TMP464 device as possible. Leave the remote
sensor connection end of the shield wire open to avoid ground loops and 60-Hz pickup.
6. Thoroughly clean and remove all flux residue in and around the pins of the TMP464 device to avoid
temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.
V+
D+
Ground or V+ layer
on bottom and top,
if possible.
D-
GND
NOTE: Use a minimum of 5-mil (0.127 mm) traces with 5-mil spacing.
图 23. Suggested PCB Layer Cross-Section
32
版权 © 2017–2019, Texas Instruments Incorporated
TMP464
www.ti.com.cn
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
10.2 Layout Example
VIA to Power or Ground Plane
0.1 ꢀF
VIA to Internal Layer
NC V+
NC
SCL
16 15 14 13
NC
SDA
12
1
2
3
4
NC
THERM2
11
THERM
10
Exposed
Thermal Pad
D4+
1 nF
D3+
ADD
9
5
6
7
8
1 nF
GND
D2+ D1+ D-
1 nF
1 nF
图 24. TMP464 Layout Example
版权 © 2017–2019, Texas Instruments Incorporated
33
TMP464
ZHCSGB8C –MAY 2017–REVISED OCTOBER 2019
www.ti.com.cn
11 器件和文档支持
11.1 接收文档更新通知
如需接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收
产品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 社区资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 商标
E2E is a trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
34
版权 © 2017–2019, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMP464AIRGTR
TMP464AIRGTT
ACTIVE
ACTIVE
VQFN
VQFN
RGT
RGT
16
16
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
T464
T464
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Oct-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMP464AIRGTR
TMP464AIRGTT
VQFN
VQFN
RGT
RGT
16
16
3000
250
330.0
180.0
12.4
12.4
3.3
3.3
3.3
3.3
1.1
1.1
8.0
8.0
12.0
12.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Oct-2019
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TMP464AIRGTR
TMP464AIRGTT
VQFN
VQFN
RGT
RGT
16
16
3000
250
367.0
210.0
367.0
185.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
RGT0016C
VQFN - 1 mm max height
S
C
A
L
E
3
.
6
0
0
PLASTIC QUAD FLATPACK - NO LEAD
3.1
2.9
B
A
PIN 1 INDEX AREA
3.1
2.9
SIDE WALL
METAL THICKNESS
DIM A
OPTION 1
0.1
OPTION 2
0.2
1.0
0.8
C
SEATING PLANE
0.08
0.05
0.00
1.68 0.07
(DIM A) TYP
5
8
EXPOSED
THERMAL PAD
12X 0.5
4
9
4X
SYMM
1.5
1
12
0.30
16X
0.18
13
16
0.1
C A B
PIN 1 ID
(OPTIONAL)
SYMM
0.05
0.5
0.3
16X
4222419/D 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGT0016C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
1.68)
SYMM
13
16
16X (0.6)
1
12
16X (0.24)
SYMM
(2.8)
(0.58)
TYP
12X (0.5)
9
4
(
0.2) TYP
VIA
5
(0.58) TYP
8
(R0.05)
ALL PAD CORNERS
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222419/D 04/2022
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGT0016C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
1.55)
16
13
16X (0.6)
1
12
16X (0.24)
17
SYMM
(2.8)
12X (0.5)
9
4
METAL
ALL AROUND
5
8
SYMM
(2.8)
(R0.05) TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17:
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4222419/D 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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