TPA6045A4CRHBR [TI]
2-W STEREO AUDIO POWER AMPLIFIER WITH DirectPath™ STEREO HEADPHONE DRIVE AND REGULATOR; 与DirectPath⑩立体声耳机驱动和稳压器的2W立体声音频功率放大器型号: | TPA6045A4CRHBR |
厂家: | TEXAS INSTRUMENTS |
描述: | 2-W STEREO AUDIO POWER AMPLIFIER WITH DirectPath™ STEREO HEADPHONE DRIVE AND REGULATOR |
文件: | 总30页 (文件大小:1207K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPA6045A4C
www.ti.com.............................................................................................................................................................................................. SLOS614–OCTOBER 2008
2-W STEREO AUDIO POWER AMPLIFIER
WITH DirectPath™ STEREO HEADPHONE DRIVE AND REGULATOR
1
FEATURES
DESCRIPTION
23
•
Microsoft™ Windows Vista™ Compliant
•
Fully Differential Architecture and High PSRR
Provide Excellent RF Rectification Immunity
The TPA6045A4C is a stereo audio power amplifier
and DirectPath™ headphone amplifier in a thermally
enhanced, space-saving, 32-pin QFN package. The
speaker amplifier is capable of driving 2.1 W per
channel continuously into 4-Ω loads at 5 V. The
headphone amplifier achieves a minimum of 85 mW
at 1% THD+N from a 5-V supply. A built-in internal
4-step gain control for the speaker amplifier and a
fixed –1.5 V/V gain for the headphone amplifier
minimizes external components needed.
•
2.1-W, 1% THD+N Into 4-Ω Speakers and
85-mW, 1% THD+N Into 16-Ω Headphones
From 5-V Supply
•
•
DirectPath™ Headphone Amplifier Eliminates
(1)
Output Capacitors
Internal 4-Step Speaker Gain Control: 10, 12,
15.6, 21.6 dB and Fixed –1.5-V/V Headphone
Independent shutdown control and dedicated inputs
for the speaker and headphone allow the
•
•
3.3-V Low Dropout Regulator for CODEC
Independent Shutdown Controls for Speaker,
Headphone Amplifier, and Low Dropout
Regulator (LDO)
TPA6045A4C
to
simultaneously
drive
both
headphones and internal speakers. Differential inputs
to the speaker amplifiers offer superior power-supply
and common-mode noise rejection.
•
Output Short-Circuit and Thermal Protection
APPLICATIONS
•
Notebook Computers
•
Portable DVD
SIMPLIFIED APPLICATION CIRCUIT
TPA6045A4C
Speaker
LDO (V)
4.75
3.3
Gain (dB)
Enable
CODEC
ROUT+
ROUT–
SPKR_RIN+
SPKR_RIN–
SPKR
HPR
6, 10, 15.6,
21.6
TPA6040A4
TPA6041A4
TPA6043A4
TPA6045A4C
TPA6047A4
Active Low
LOUT+
LOUT–
HPL
10, 12, 15.6,
21.6
SPKR_LIN+
SPKR_LIN–
SPKL
Active Low
Active Low
Active High
Active High
VDD
SPVDD
SPGND
4.5 V – 5.5 V
6, 10, 15.6,
21.6
BYPASS
3.3
GAIN0
GAIN1
Gain
Control
HP_EN
10, 12, 15.6,
21.6
Shutdown
Control
3.3
SPKR_EN
OUTL
OUTR
10, 12, 15.6,
21.6
HP_INR
SGND
4.75
HPVSS
CPVSS
HP_INL
HPVDD
CPVDD
VDD
3 V – 5.5 V
CPGND
C1P
C1N
4.5 V – 5.5 V
Regulator Enable
REG_EN
REG_OUT
3.3 V (To CODEC)
(1) US Patent Number 5289137
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
DirectPath, PowerPAD are trademarks of Texas Instruments.
Microsoft, Windows Vista are trademarks of Microsoft Corporation.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPA6045A4C
SLOS614–OCTOBER 2008.............................................................................................................................................................................................. www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Functional Block Diagram
REG_EN
BYPASS
(3.3-V Output)
REG_OUT
SPKR_EN
Bias Control
LDO
0.47 mF
1 mF
HP_EN
VDD
1 mF
SPVDD
ROUT+
SPKR_RIN+
SPKR_RIN–
+
–
1 mF
1 mF
+
–
ROUT–
GAIN0
GAIN1
SPGND
SPVDD
Gain Control
SPKR_LIN+
SPKR_LIN–
LOUT+
LOUT–
1 mF
1 mF
+
–
–
+
4.5 V – 5.5 V
SPVDD
HP_INL
SPGND
1 mF
HPVDD
–
HP_OUTL
HP_OUTR
1 mF
+
HPVSS
+
HP_INR
HPVDD
–
1 mF
HPVDD
3 V – 5.5 V
CPVDD
CPGND
Charge Pump
1 mF
C1P
C1N
CPVSS
GND
HPVSS
SPGND
1 mF
1 mF
2
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AVAILABLE PACKAGE OPTIONS
TA
PACKAGED DEVICE(1)(2)
32-Pin QFN (RHB)
–40°C to 85°C
TPA6045A4CRHB
(1) The RHB package is available taped and reeled. To order a taped and reeled part, add the suffix R to
the part number (e.g., TPA6045A4CRHBR).
(2) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
TPA6045A4CRHB
(TOP VIEW)
32 31 30 29 28 27 26 25
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
SPKR_RIN–
BYPASS
SPKR_EN
HP_EN
SPGND
ROUT+
ROUT–
SPVDD
HPVDD
SPKR_RIN+
SPKR_LIN+
SPKR_LIN–
SPGND
LOUT+
Thermal
Pad
LOUT–
SPVDD
9
10 11 12 13 14 15 16
TERMINAL FUNCTIONS
TERMINAL
NAME
I/O/P
DESCRIPTION
NO.
1
SPKR_RIN–
SPKR_RIN+
SPKR_LIN+
SPKR_LIN–
SPGND
LOUT+
I
I
Right-channel negative differential audio input for speaker amplifier
Right-channel positive differential audio input for speaker amplifier
Left-channel positive differential audio input for speaker amplifier
Left-channel negative differential audio input for speaker amplifier
Speaker power ground
2
3
I
4
I
5, 21
6
P
O
O
P
P
Left-channel positive audio output
LOUT–
7
Left-channel negative audio output
SPVDD
8, 18
9
Supply voltage terminal for speaker amplifier
CPVDD
Charge pump positive supply, connect to HPVDD via star connection
C1P
10
11
12
13
14
15
16
17
I/O Charge pump flying capacitor positive terminal
Charge pump ground
I/O Charge pump flying capacitor negative terminal
CPGND
C1N
P
CPVSS
P
P
O
O
P
Charge pump output (negative supply for headphone amplifier), connect to HPVSS
Headphone amplifier negative supply, connect to CPVSS
Right-channel capacitor-free headphone output
HPVSS
HP_OUTR
HP_OUTL
HPVDD
Left-channel capacitor-free headphone output
Headphone amplifier supply voltage, connect to CPVDD
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TERMINAL FUNCTIONS (continued)
TERMINAL
I/O/P
DESCRIPTION
NAME
NO.
19
20
22
23
24
25
26
27
28
29
30
31
32
ROUT–
ROUT+
HP_EN
SPKR_EN
BYPASS
REG_EN
HP_INR
HP_INL
SGND
O
O
I
Right-channel negative audio output
Right-channel positive audio output
Headphone channel enable logic input; active high enable. HIGH=ENABLE.
Speaker channel enable logic input; active high enable. HIGH=ENABLE.
Common-mode bias voltage for speaker preamplifiers
Enable pin for turning on/off LDO. HIGH=ENABLE
Headphone right-channel audio input
I
P
I
I
I
Headphone left-channel audio input
P
O
P
I
Signal ground, connect to CPGND and SPGND
Regulated 3.3-V output
REG_OUT
VDD
Positive power supply
GAIN0
Bit 0, MSB, of gain select bits
GAIN1
I
Bit 1, LSB, of gain select bits
Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is required for
mechanical stability and will enhance thermal performance.
Thermal Pad Die Pad
P
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE
–0.3 to 6
–0.3 to 6.3
UNIT
Supply voltage
Input voltage
HPVDD, VDD, SPVDD, CPVDD
V
SPKR_LIN+, SPKR_LIN-, SPKR_RIN+, SPKR_RIN-,
HP_EN,GAIN0, GAIN1, SPK_EN, REG_EN
VI
V
HP_INL, HP_INR HP Enabled
–3.5 to 3.5
HP_INL, HP_INR HP not Enabled
–0.3 to 3.5
Continuous total power dissipation
Operating free-air temperature range
Operating junction temperature range
Storage temperature range
See Dissipation Rating Table
TA
–40 to 85
°C
°C
°C
kV
V
TJ
–40 to 150
Tstg
–65 to 150
Electrostatic discharge
HBM for HP_OUTL and HP_OUTR
8
500
2
CDM
HBM
Electrostatic discharge,
all other pins
kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
PACKAGE(1)
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
RHB
5.06 W
40 mW/°C
4.04 W
3.23 W
(1) The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. Refer to the Texas Instruments document,
PowerPAD™ Thermally Enhanced Package application report (literature number SLMA002) for more information regarding the
PowerPAD™ package.
RECOMMENDED OPERATING CONDITIONS
MIN
4.5
3
MAX
5.5
UNIT
V
Supply voltage
Supply voltage
VDD, SPVDD
HPVDD, CPVDD
5.5
V
4
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RECOMMENDED OPERATING CONDITIONS (continued)
MIN
MAX
UNIT
V
VIH
VIL
TA
High-level input voltage
Low-level input voltage
SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN
SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN
2
0.8
85
V
Operating free-air temperature
–40
°C
GENERAL DC ELECTRICAL CHARACTERISTICS
TA = 25°C, VDD = SPVDD = HPVDD = CPVDD = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SPKR_EN, HP_EN, GAIN0, GAIN1,
REG_EN = VDD
IIH
High-level input current
0.02
1
µA
SPKR_EN, HP_EN, GAIN0, GAIN1,
REG_EN = 0 V
IIL
Low-level input current
0.02
5
1
12
14
µA
mA
mA
Supply current, speaker amplifier
ONLY enabled
IDD(Speaker)
IDD(HP)
IDD(REG)
IDD(SD)
SPKR_EN = 2 V, HP_EN = REG_EN = 0 V
HP_EN = 2 V, SPKR_EN = REG_EN = 0 V
Supply current, headphone
amplifier ONLY enabled
7.5
Supply current, regulator ONLY
enabled
REG_EN = 2 V, SPKR_EN = HP_EN = 0 V
SPKR_EN = HP_EN = REG_EN = 0 V
0.65
2.5
1
5
mA
Supply current, shutdown mode
µA
SPEAKER AMPLIFIER DC CHARACTERISTICS
TA = 25°C, VDD = SPVDD = 5 V, RL = 4 Ω, Gain = 10 dB (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
| VOO
|
Output offset voltage (measured differentially)
Inputs AC-coupled to GND, Gain = 10
dB
0.5
10
mV
PSRR
Power supply rejection ratio
VDD = SPVDD = 4.5 V to 5.5 V
-60
–74
dB
SPEAKER AMPLIFIER AC CHARACTERISTICS
TA = 25°C, VDD = SPVDD = 5 V, RL = 4 Ω, Gain = 10 dB (unless otherwise noted)
PARAMETER
TEST CONDITIONS
THD+N = 1%, f = 1 kHz, RL = 8 Ω
THD+N = 10%, f = 1 kHz, RL = 8 Ω
THD+N = 1%, f = 1 kHz, RL = 4 Ω
THD+N = 10%, f = 1 kHz, RL = 4 Ω
PO = 1 W, RL = 8 Ω, f = 20 Hz to 20 kHz
PO = 1 W, RL = 4 Ω, f = 20 Hz to 20 kHz
MIN
TYP
1.3
MAX
UNIT
1.6
PO
Output power
2.1
W
2.6
0.06%
0.1%
THD+N
Total harmonic distortion plus noise
f = 1 kHz, CBYPASS = 0.47 µF, RL = 8 Ω
VRIPPLE = 200 mVPP
kSVR
SNR
Supply ripple rejection ratio
Signal-to-noise rejection ratio
–53
90
dB
dB
Maximum output at THD+N <1%, f = 1 kHz,
Gain = 10 dB
f = 1 kHz, Po = 1 W, Gain = 10 dB
f = 10 kHz, Po = 1 W, Gain = 10 dB
–110
–100
dB
dB
Crosstalk (Left-Right; Right-Left)
CBYPASS = 0.47 µF, f = 20 Hz to 20 kHz,
Gain = 10 dB, No weighting
Vn
ZI
Noise output voltage
Input Impedance
21
µVrms
kΩ
Gain = 21.6 dB
15
9.4
11.4
15
20
10
GAIN0, GAIN1 = 0.8 V
GAIN0 = 0.8 V; GAIN1 = 2 V
GAIN0 = 2 V, GAIN1 = 0.8 V
GAIN0, GAIN1 = 2 V
Channel-to Channel
10.6
12.6
16.2
22.2
12
G
Gain
dB
dB
15.6
21.6
0.01
21
Gain Matching
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SPEAKER AMPLIFIER AC CHARACTERISTICS (continued)
TA = 25°C, VDD = SPVDD = 5 V, RL = 4 Ω, Gain = 10 dB (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CBYPASS = 0.47 µF
MIN
TYP
MAX
UNIT
Start-up time from shutdown
25
ms
HEADPHONE AMPLIFIER DC ELECTRICAL CHARACTERISTICS
TA = 25°C, HPVDD = CPVDD = VDD = 5 V, RL = 16 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Inputs grounded
HPVDD = 4.5 V to 5.5 V
MIN
TYP
1
MAX
UNIT
mV
| VOS
|
Output offset voltage
Power supply rejection ratio
3
PSRR
–75
–100
dB
HEADPHONE AMPLIFIER AC CHARACTERISTICS
TA = 25°C, HPVDD = 5 V, RL = 16 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
200
100
MAX
UNIT
THD+N = 10%, RL = 16 Ω, f = 1 kHz
THD+N = 10%, RL = 32 Ω, f = 1 kHz
PO
Output power (outputs in phase)
mW
PO = 85 mW, f = 20 Hz to 20 kHz,
RL = 16 Ω
0.03%
0.04%
THD+N
Total harmonic distortion plus noise
PO = 50 mW, f = 20 Hz to 20 kHz,
RL = 32 Ω
Dynamic Range with Signal Present
Supply ripple rejection ratio
Crosstalk
A-Weighted, f = 20 Hz to 20 kHz
f = 1 kHz, 200-mVPP ripple
–100
-60
-80
95
dB FS
dB
kSVR
Po = 35 mW, f = 20 Hz to 20 kHz
Maximum output at THD+N 1%, f = 1 kHz
f = 20 Hz to 20 kHz, No weighting
dB
SNR
Vn
Signal-to-noise ratio
dB
Noise output voltage
20
µVrms
kΩ
ZI
Input Impedance
15
20
Gain
Closed-loop voltage gain
Start-up time from shutdown
RL = 16 Ω
–1.45
–1.5
7.5
–1.55
V/V
ms
LDO CHARACTERISTICS
TA = 25°C, VDD = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
4.5
TYP
MAX
UNIT
V
VI
Input voltage
VDD
5.5
IO
Continuous output current
Output voltage
120
3.2
mA
V
VO
0 < IO < 120 mA; 4.9 V < Vin < 5.5 V
IL = 5 mA; 4.9 V < Vin < 5.5 V
IL = 0 – 120 mA, Vin = 5 V
3.3
1.8
3.4
10
Line regulation
mV
Load regulation
0.13
-46
0.23 mV/ mA
dB
Power supply ripple rejection
VDD = 4.9 V, IL = 10 mA
f = 100 Hz
6
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TYPICAL CHARACTERISTICS
Default graph conditions: VCC = 5 V, Freq = 1 kHz, AES17 Filter.
TOTAL HARMONIC DISTORTION + NOISE (SP)
TOTAL HARMONIC DISTORTION + NOISE (SP)
vs
vs
FREQUENCY
FREQUENCY
1
1
Gain = 10 dB,
Gain = 10 dB,
R
V
= 8 W,
P
= 0.1 W
L
R
V
= 4 W,
O
L
= 5 V
DD
= 5 V
P
= 1 W
DD
O
P
= 0.25 W
O
0.1
P
= 0.25 W
O
0.1
0.01
P
= 1 W
O
P
= 1.5 W
O
0.01
0.001
0.0001
0.001
10
100
1 k
f - Frequency - Hz
10 k
100 k
10
100
1 k
f - Frequency - Hz
10 k
100 k
Figure 1.
Figure 2.
TOTAL HARMONIC DISTORTION + NOISE (HP)
TOTAL HARMONIC DISTORTION + NOISE (HP)
vs
vs
FREQUENCY
FREQUENCY
1
1
Gain = 3.5 dB
Gain = 3.5 dB
R
= 16 Ω
= 5 V
R
= 32 Ω
= 5 V
L
L
V
DD
V
DD
0.1
0.1
P
O
= 50 mW
P
O
= 2.8 mW
P
O
= 100 mW
P
O
= 1.4 mW
P
O
= 25 mW
P
O
= 50 mW
0.01
0.01
0.001
0.001
10
10
100
1k
10k
100k
100
1k
10k
100k
f − Frequency − Hz
f − Frequency − Hz
G003
G004
Figure 3.
Figure 4.
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TYPICAL CHARACTERISTICS (continued)
TOTAL HARMONIC DISTORTION + NOISE (SP)
TOTAL HARMONIC DISTORTION + NOISE (SP)
vs
vs
OUTPUT POWER
OUTPUT POWER
100
10
1
100
10
Gain = 10 dB,
= 4 W
Gain = 10 dB,
= 8 W
R
R
L
L
V
= 4.5 V
DD
V
= 4.5 V
= 5 V
DD
V
= 5 V
DD
V
DD
V
= 5.5 V
DD
1
V
= 5.5 V
DD
0.1
0.1
0.01
0.01
0.01
0.1
P
O
1
- Output Power - W
10
0.01
0.1
P
O
1
- Output Power - W
10
Figure 5.
Figure 6.
TOTAL HARMONIC DISTORTION + NOISE (HP)
TOTAL HARMONIC DISTORTION + NOISE (HP)
vs
vs
OUTPUT POWER
OUTPUT POWER
10
1
10
1
Gain = 3.5 dB
Gain = 3.5 dB
R
L
= 16 Ω
= 5 V
R
L
= 32 Ω
= 5 V
V
DD
V
DD
0.1
0.1
V
DD
= 5 V
In Phase
In Phase
0.01
0.001
0.01
0.001
V
DD
= 5 V
100µ
1m
10m
100m
1
100µ
1m
10m
100m
1
P
O
− Output Power − W
P
O
− Output Power − W
G007
G008
Figure 7.
Figure 8.
8
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TYPICAL CHARACTERISTICS (continued)
CROSSTALK (SP)
vs
FREQUENCY
CROSSTALK (SP)
vs
FREQUENCY
0
-10
-20
0
Gain = 10 dB,
Power = 1 W,
-10
Gain = 10 dB,
P
= 1 W,
= 8 W,
= 5 V
O
R
V
= 4 W,
-20
L
R
V
L
= 5 V
DD
-30
-40
-50
-30
-40
-50
DD
-60
-70
-60
-70
-80
-90
-80
-90
L to R
L to R
-100
-110
-100
-110
R to L
-120
-130
-140
-120
-130
-140
R to L
10 k
10
100
1 k
f - Frequency - Hz
10 k
100 k
10
100
1 k
100 k
f - Frequency - Hz
Figure 9.
Figure 10.
CROSSTALK (LDO)
vs
CROSSTALK (HP)
vs
FREQUENCY
FREQUENCY
0
-10
-20
-30
-40
-50
-60
0
Gain = 10 dB,
Gain = 3.5 dB,
-10
-20
P
= 2 W,
= 4 W,
= 5 V
P
= 2.8 m W,
= 16 W,
= 5 V
O
O
R
V
R
V
L
L
DD
DD
-30
-40
-50
-60
-70
-80
L to LDO
-70
-90
R to L
-80
-100
-110
R to LDO
-90
L to R
-100
-110
-120
-120
-130
-140
10
100
1 k
10 k
100 k
10
100
1 k
f - Frequency - Hz
10 k
100 k
f - Frequency - Hz
Figure 11.
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
CROSSTALK (HP)
vs
FREQUENCY
CROSSTALK (HP)
vs
FREQUENCY
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
−110
−120
0
Gain = 3.5 dB
PO = 2.8 mW
Gain = 3.5 dB
–10
P
= 35 mW
= 16 Ω
O
RL = 32 W
R
–20
–30
L
VDD = 5 V
V
DD
= 5 V
–40
–50
–60
–70
R to L
–80
–90
–100
L to R
–110
–120
10
100
1k
10k
100k
10
100
1k
f – Frequency – Hz
10k
100k
f − Frequency − Hz
G012
Figure 13.
Figure 14.
CROSSTALK (HP)
vs
FREQUENCY
OUTPUT POWER (SP)
vs
SUPPLY VOLTAGE
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
−110
−120
3.2
Gain = 10 dB,
= 4 W
3.1
3
Gain = 3.5 dB
R
L
P
= 35 mW
= 32 Ω
O
R
L
2.9
THD+N = 10%
V
DD
= 5 V
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
THD+N = 1%
R to L
2
1.9
1.8
1.7
L to R
1.6
10
100
1k
10k
100k
4.5 4.6 4.7 4.8 4.9
V
5 5.1 5.2 5.3 5.4 5.5
- Supply Voltage - V
f − Frequency − Hz
DD
G013
Figure 15.
Figure 16.
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TYPICAL CHARACTERISTICS (continued)
OUTPUT POWER (SP)
vs
SUPPLY VOLTAGE
OUTPUT POWER (HP)
vs
SUPPLY VOLTAGE
0.30
0.25
0.20
0.15
0.10
0.05
0.00
2.05
1.95
Gain = 10 dB,
= 8 W
THD+N = 10%
R
L
THD+N = 10%
1.85
1.75
1.65
1.55
1.45
1.35
THD+N = 1%
THD+N = 1%
1.25
Gain = 3.5 dB
= 16 Ω
1.15
1.05
R
L
4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5
4.5 4.6 4.7 4.8 4.9
5
5.1 5.2 5.3 5.4 5.5
V
- Supply Voltage - V
V
− Supply Voltage − V
DD
DD
Figure 17.
Figure 18.
SUPPLY CURRENT (SP)
vs
TOTAL OUTPUT POWER
SUPPLY CURRENT (SP)
vs
TOTAL OUTPUT POWER
1.6
1.4
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
V
= 5 V
DD
V
= 5 V
Gain = 10 dB,
= 8 W
DD
V = 4.5 V
DD
Gain = 10 dB,
= 4 W
R
V
= 4.5 V
L
DD
R
L
V = 5.5 V
DD
1.2
1
V
= 5.5 V
DD
0.8
0.6
0.4
0.2
0
0
0.4 0.8 1.2 1.6
2
2.4 2.8 3.2 3.6
4
0
1
2
3
4
5
6
P
- Output Power - W
P
- Output Power - W
O
O
Figure 19.
Figure 20.
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TYPICAL CHARACTERISTICS (continued)
POWER DISSIPATION (SP)
vs
TOTAL OUTPUT POWER
POWER DISSIPATION (SP)
vs
TOTAL OUTPUT POWER
3.2
3
1.6
1.4
1.2
2.8
2.6
V
= 5.5 V
DD
2.4
2.2
2
V
= 5 V
DD
V
= 5.5 V
DD
1
0.8
0.6
0.4
1.8
1.6
V
= 5 V
V
= 4.5 V
DD
DD
V
= 4.5 V
DD
1.4
1.2
1
0.8
0.6
0.4
Gain = 10 dB,
= 8 W
0.2
0
Gain = 10 dB,
= 4 W
R
L
R
0.2
0
L
0
0.5
1
1.5
2
2.5
- Output Power - W
3
3.5
4
0
1
2
3
4
- Output Power - W
5
6
P
P
O
O
Figure 21.
Figure 22.
REGULATOR OUTPUT VOLTAGE (LDO)
SUPPLY VOLTAGE (LDO)
vs
vs
SUPPLY VOLTAGE
LOAD CURRENT
3.40
3.36
3.32
3.40
3.38
3.36
3.34
V
= 5 V
DD
V
= 5.5 V
DD
3.28
I
= -10 mA
I
= -1 mA
L
L
V
= 4.5 V
DD
3.24
3.20
3.16
3.12
3.08
3.32
3.30
3.28
3.26
I
= -50 mA
L
I
= -120 mA
L
3.24
3.04
3
3.22
3.20
0
0.025 0.05 0.075 0.1 0.125 0.15 0.175 0.2
4.5 4.6 4.7 4.8 4.9
5
5.1 5.2 5.3 5.4 5.5
- V
V
I
- Load Current - A
DD
L
Figure 23.
Figure 24.
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TYPICAL CHARACTERISTICS (continued)
COMMON-MODE REJECTION RATIO (SP)
COMMON-MODE REJECTION RATIO (SP)
vs
vs
FREQUENCY
FREQUENCY
0
-10
-20
0
-10
-20
-30
-40
Gain = 10 dB,
Input Level = 0.2 V
Gain = 10 dB,
Input Level = 0.2 V
,
PP
,
PP
R
V
= 4 W,
L
R
V
= 8 W,
L
= 5 V
DD
= 5 V
DD
-30
-40
-50
-60
-70
-80
-50
-60
-70
-80
-90
-90
-100
-100
10
100
1 k
f - Frequency - Hz
10 k
100 k
10
100
1 k
f - Frequency - Hz
10 k
100 k
Figure 25.
Figure 26.
POWER SUPPLY REJECTION RATIO (LDO)
POWER SUPPLY REJECTION RATIO (SP)
vs
vs
FREQUENCY
FREQUENCY
0
-10
-20
-30
-40
-50
0
Gain = 10 dB,
I
= 10 mA,
O
R
V
= 8 W,
L
-10
V
V
= 0.20 V
,
PP
ripple
= 5 V
= 5 V
DD
DD
-20
-30
-40
-50
-60
-60
-70
-80
-70
-80
10
100
1 k
10 k
100 k
10
100
1 k
f - Frequency - Hz
10 k
100 k
f - Frequency - Hz
Figure 27.
Figure 28.
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TYPICAL CHARACTERISTICS (continued)
POWER SUPPLY REJECTION RATIO (HP)
OUTPUT POWER (HP)
vs
LOAD RESISTANCE
vs
FREQUENCY
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
500
450
400
350
300
250
200
150
100
50
f
= 1 kHz
IN
Gain = 3.5 dB
Gain = 3.5 dB
= 5 V
R
= 16 Ω
= 5 V
L
V
DD
V
DD
THD+N = 10%
THD+N = 1%
0
10
10
100
1k
10k
100k
100
1k
f − Frequency − Hz
R − Load Resistance − Ω
L
G028
G029
Figure 29.
Figure 30.
OUTPUT POWER (SP)
vs
LOAD RESISTANCE
2.6
2.4
2.2
2
f = 1 kHz
I
Gain = 10 dB,
= 5 V
V
DD
1.8
1.6
1.4
1.2
1
THD+N = 10%
0.8
0.6
0.4
THD+N = 1%
4
6
8
10 12 14 16 18 20 22 24 26 28 30
R
- Load Resistance - W
L
Figure 31.
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TYPICAL CHARACTERISTICS (continued)
SPEAKER SHUTDOWN - 8 Ω - 10 dB
SPEAKER STARTUP - 8 Ω - 10 dB
Figure 32.
Figure 33.
LDO SHUTDOWN - 120 mA
LDO STARTUP - 120 mA
Figure 34.
Figure 35.
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TYPICAL CHARACTERISTICS (continued)
HP SHUTDOWN - 32 Ω
HP STARTUP - 32 Ω
Figure 36.
Figure 37.
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APPLICATION INFORMATION
3.3 V
(Output)
4.5 V - 5.5 V
mF
0.1
HP Left Input
mF
2.2
HP Right Input
mF
1
1 mF
1 mF
4-Step
Gain Control
Regulator Enable
{
mF
0.47
SPKR_RIN–
SPKR_RIN+
SPKR_LIN+
BYPASS
0.47 mF
SPKR Right Input
SPKR Left Input
SPKR_EN
HP_EN
Speaker Enable
0.47 mF
0.47 mF
Headphone Enable
SPKR_LIN–
SPGND
ROUT+
0.47 mF
TPA6045A4C
SPGND
LOUT+
Right
Speaker
ROUT-
Left
Speaker
SPVDD
4.5 V - 5.5 V
3 V - 5.5 V
LOUT-
HPVDD
SPVDD
4.5 V - 5.5 V
1 mF
3 V - 5.5 V
10 mF
1 mF
1 mF
1 mF
Headphone
Output
Figure 38. Single-Ended Input Application Circuit
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3.3 V
(Output)
4.5 V - 5.5 V
mF
0.1
HP Left Input
mF
2.2
HP Right Input
mF
1
1 mF
1 mF
4-Step
Gain Control
Regulator Enable
{
mF
0.47
SPKR_RIN–
SPKR_RIN+
SPKR_LIN+
SPKR Right (–) Input
SPKR Right (+) Input
SPKR Left (+) Input
SPKR Left (–) Input
BYPASS
0.47 mF
0.47 mF
0.47 mF
0.47 mF
SPKR_EN
HP_EN
Speaker Enable
Headphone Enable
SPKR_LIN–
SPGND
ROUT+
TPA6045A4C
SPGND
LOUT+
Right
Speaker
ROUT-
Left
Speaker
SPVDD
LOUT-
HPVDD
3 V - 5.5 V
SPVDD
4.5 V - 5.5 V
1 mF
10 mF
1 mF
1 mF
1 mF
Headphone
Output
Figure 39. Differential Input Application Circuit
Power Enable Modes
The TPA6045A4C allows disable of any or all of the main circuit blocks when not in use in order to reduce
operating power to an absolute minimum. The SPKR_EN control can be used to disable the speaker amplifier
while the HP_EN can be used separately to turn off the headphone amplifier. The LDO also has an independent
power control, REG_EN. With all circuit blocks disabled, the supply current in shutdown mode is only 5 µA. See
the General DC Electrical Characteristics for operating currents with each circuit block operating independently.
Speaker Amplifier Description
The speaker amplifier is capable of driving 2.1 W/ch of continuous RMS power into a 4-Ω load at 5 V. An internal
4-step control allows variation of the gain from 10 dB to 21.6 dB.
Fully Differential Amplifier
The TPA6045A4C speaker amplifier is a fully differential amplifier with differential inputs and outputs. The fully
differential architecture consist of a differential amplifier and a common mode amplifier. The differential amplifier
ensures that the amplifier outputs a differential voltage that is equal to the differential input times the gain. The
common-mode voltage at the output is biased around VDD/2 regardless of the common-mode voltage at the
input.
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One of the primary advantages of the fully differential amplifier is improved RF immunity. GSM handsets save
power by turning on and off the RF transmitter at a rate of 217 Hz. The transmitted signal is picked up on input
and output traces. The fully differential amplifier cancels the signal and others of this type much better than
typical audio amplifiers.
Gain Setting via GAIN0 and GAIN1 Inputs
The gain of the TPA6045A4C is set by two terminals, GAIN0 and GAIN1. The gains listed in Table 1 are realized
by changing the taps on the input resistors and feedback resistors inside the amplifier. This causes the input
impedance (ZI) to vary as a function of the gain setting.
Gain Setting
AMPLIFIER GAIN
INPUT IMPEDANCE (kΩ)
(dB)
TYPICAL
10
GAIN1
GAIN0
TYPICAL
0
0
1
1
0
1
0
1
78
65
46
20
12
15.6
21.6
Input Capacitor, CI
The input capacitor allows the amplifier to bias the input signal to the proper dc level for proper operation. In this
case, the input capacitor, CI, and the input impedance of the amplifier, RI, form a high-pass filter with the corner
frequency determined in Equation 1. Figure 40 shows how the input capacitor and the input resistor within the
amplifier interact.
Figure 40. Input Resistor and Input Capacitor
(1)
The value of CI is important to consider as it directly affects the low-frequency, or bass, performance of the
circuit. Furthermore, the input impedance changes with a change in volume. The higher the volume, the lower
the input impedance is. To determine the appropriate capacitor value, reconfigure Equation 1 into Equation 2.
The value of the input resistor, RI, can be determined from Equation 2.
1
CI +
2pRI fc
(2)
Low-leakage tantalum or ceramic capacitors are recommended. When polarized capacitors are used, the positive
side of the capacitor should face the amplifier input in most applications as the dc level there is held at VCC/2,
which is likely higher than the source dc level. Note that it is important to confirm the capacitor polarity in each
specific application. Recommended capacitor values are between 0.1 µF and 1 µF.
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Windows Vista™ Premium Mobile Mode Specifications
Windows Premium Mobile Vista
Device Type
Requirement
TPA6045A4C Typical Performance
–88 dB FS[20 Hz, 20 kHz]
–88 dB FS A-Weight
Specifications
THD+N
≤ –65 dB FS [20 Hz, 20 kHz]
Analog Speaker Line Jack
(RL = 10 kΩ, FS = 0.707
Vrms)
Dynamic Range with Signal
Present
≤ –80 dB FS A-Weight
Line Output Crosstalk
THD+N
≤ –60 dB [20 Hz, 20 kHz]
–105 dB [20 Hz, 20 kHz]
–88 dB FS [20 Hz, 20 kHz]
≤ –45 dB FS [20 Hz, 20 kHz]
Analog Headphone Out Jack
(RL = 32Ω, FS = 0.300
Vrms)
Dynamic Range with Signal
Present
≤ –80 dB FS A-Weight
–89 dB FS A-Weight
Headphone Output Crosstalk
≤ –60 dB [20 Hz, 20 kHz]
–100 dB [20 Hz, 20 kHz]
Bridge-Tied Load Versus Single-Ended Mode
Figure 41 shows a Class-AB audio power amplifier (APA) in a bridge-tied-load (BTL) configuration. The
TPA6045A4C speaker amplifier consists of two Class-AB differential amplifiers per channel driving the positive
and negative terminals of the load. Specifically, differential drive means that as one side of the amplifier (the
positive terminal, for example) is slewing up, the other side is slewing down, and vice versa. This doubles the
voltage swing across the load as opposed to a ground-referenced load, or a single-ended load. Power is
proportional to the square of the voltage. Plugging 2x VO(PP) into the power equation yields 4X the output power
from the same supply rail and load impedance as would have been obtained with a ground-referenced load (see
Equation 3).
V
O(PP)
V
+
(RMS)
Ǹ
2 2
2
V
(RMS)
Power +
R
L
(3)
V
DD
V
O(PP)
2x V
O(PP)
R
L
V
DD
−V
O(PP)
Figure 41. Differential Output Configuration
VDD
–3 dB
VO(PP)
CC
VO(PP)
RL
fc
Figure 42. Single-Ended Configuration and Frequency Response
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Bridge-tying the outputs in a typical computer audio, LCD TV, or multimedia LCD monitor application drastically
increases output power. For example, if an amplifier in a single-ended configuration was capable of outputting a
maximum of 250 mW for a given load with a supply voltage of 12 V, then that same amplifier would be able to
output 1 W of power in a BTL configuration with the same supply voltage and load. In addition to the increase in
output power, the BTL configuration does not suffer from the same low-frequency issues that plague the
single-ended configuration. In a BTL configuration, there is no need for an output capacitor to block dc, so no
unwanted filtering occurs. In addition, the BTL configuration saves money and space, as the dc-blocking
capacitors needed for single-ended operation are large and expensive. For example, with an 8-Ω load in SE
operation, the user needs a 1000-µF capacitor to obtain a cutoff frequency below 20 Hz. This capacitor is
expensive and large.
Headphone Amplifier Description
The headphone amplifier has a fixed gain of –1.5 V/V. It uses single-ended (SE) inputs. The DirectPath™
amplifier architecture operates from a single supply but makes use of an internal charge pump to provide a
negative voltage rail. Combining the user-provided positive rail and the negative rail generated by the IC, the
device operates in what is effectively a split supply mode. The output voltages are now centered at zero volts
with the capability to swing to the positive rail or negative rail. The DirectPath™ amplifier requires no output dc
blocking capacitors and does not place any voltage on the sleeve. The block diagram and waveform of Figure 43
illustrate the ground-referenced headphone architecture. This is the architecture of the TPA6045A4C.
Single-supply headphone amplifiers typically require dc-blocking capacitors. The capacitors are required because
most headphone amplifiers have a dc bias on the outputs pin. If the dc bias is not removed, the output signal is
severely clipped, and large amounts of dc current rush through the headphones, potentially damaging them. The
left-side drawing in Figure 43 illustrates the conventional headphone amplifier connection to the headphone jack
and output signal.
DC blocking capacitors are often large in value. The headphone speakers (typical resistive values of 16 Ω or
32 Ω) combine with the dc blocking capacitors to form a high-pass filter. Equation 4 shows the relationship
between the load impedance (RL), the capacitor (CO), and the cutoff frequency (fC).
1
fc +
2pRLCO
(4)
CO can be determined using Equation 5, where the load impedance and the cutoff frequency are known.
1
CO
+
2pRLfc
(5)
If fc is low, the capacitor must then have a large value because the load resistance is small. Large capacitance
values require large package sizes. Large package sizes consume PCB area, stand high above the PCB,
increase cost of assembly, and can reduce the fidelity of the audio output signal.
Two different headphone amplifier applications are available that allow for the removal of the output dc blocking
capacitors. The capacitor-less amplifier architecture is implemented in the same manner as the conventional
amplifier with the exception of the headphone jack shield pin. This amplifier provides a reference voltage, which
is connected to the headphone jack shield pin. This is the voltage on which the audio output signals are
centered. This voltage reference is half of the amplifier power supply to allow symmetrical swing of the output
voltages. Do not connect the shield to any GND reference, or large currents will result. The scenario can happen
if, for example, an accessory other than a floating GND headphone is plugged into the headphone connector.
See the second block diagram and waveform in Figure 43.
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Conventional
VDD
CO
VOUT
GND
VDD/2
CO
Capacitor-Less
VDD
VOUT
GND
VBIAS
VBIAS
DirectPathTM
VDD
GND
VSS
Figure 43. Amplifier Applications
Input-Blocking Capacitors
DC input-blocking capacitors block the dc portion of the audio source and allow the inputs to properly bias.
Maximum performance is achieved when the inputs of the TPA6045A4C are properly biased. Performance
issues such as pop are optimized with proper input capacitors.
The dc input-blocking capacitors can be removed, provided the inputs are connected differentially and within the
input common-mode range of the amplifier, the audio signal does not exceed ±3 V, and pop performance is
sufficient.
CIN is a theoretical capacitor used for mathematical calculations only. Its value is the series combination of the dc
input-blocking capacitors, C(DCINPUT-BLOCKING). Use Equation 6 to determine the value of C(DCINPUT-BLOCKING). For
example, if CIN is equal to 0.22 µF, then C(DCINPUT-BLOCKING) is equal to about 0.47 µF.
1
2
C
C
=
(DCINPUT-BLOCKING)
IN
(6)
The two C(DCINPUT-BLOCKING) capacitors form a high-pass filter with the input impedance of the TPA6045A4C. Use
Equation 6 to calculate CIN, then calculate the cutoff frequency using CIN and the differential input impedance of
the TPA6045A4C, RIN, using Equation 7. Note that the differential input impedance changes with gain. See
Figure 39 for input impedance values. The frequency and/or capacitance can be determined when one of the two
values are given.
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1
1
fcIN
+
CIN
+
or
2p RIN CIN
2p fcIN RIN
(7)
If a high-pass filter with a -3-dB point of no more than 20 Hz is desired over all gain settings, the minimum
impedance would be used in the Equation 7. The minimum input impedance for TPA6045A4C is 20 kΩ. The
capacitor value by Equation 7 would be 0.399 µF. However, this is CIN, and the desired value is for
C(DCINPUT-BLOCKING). Multiplying CIN by 2 yields 0.80 µF, which is close to the standard capacitor value of 1 µF.
Place 1-µF capacitors at each input terminal of the TPA6045A4C to complete the filter.
Charge Pump Flying Capacitor and CPVSS Capacitor
The charge pump flying capacitor serves to transfer charge during the generation of the negative supply voltage.
The CPVSS capacitor must be at least equal to the flying capacitor in order to allow maximum charge transfer.
Low ESR capacitors are an ideal selection, and a value of 1 µF is typical.
Decoupling Capacitors
The TPA6045A4C is a DirectPath™ headphone amplifier that requires adequate power supply decoupling to
ensure that the noise and total harmonic distortion (THD) are as low as possible. To filter high-frequency
transients, spikes, and digital hash on the power line, use good low equivalent-series-resistance (ESR) ceramic
capacitors, typically 1 µF. Find the smallest package possible, and place as close as possible to the device VDD
lead. Placing the decoupling capacitors close to the TPA6045A4C is important for the performance of the
amplifier. Use a 10 µF or greater capacitor near the TPA6045A4C to filter lower frequency noise signals;
however, the high PSRR of the TPA6045A4C makes the 10-µF capacitor unnecessary in most applications.
Midrail Bypass Capacitor, CBYPASS
The midrail bypass capacitor, C(BYPASS), has several important functions. During start-up or recovery from
shutdown mode, CBYPASS determines the rate at which the amplifier starts up. A 1-µF capacitor yields a start-up
time of approximately 25 ms. CBYPASS also reduces the noise coupled into the output signal by the power supply.
This improves the power supply ripple rejection (PSRR) of the amplifier. Ceramic or polyester capacitors with low
ESR and values in the range of 0.47 µF to 1 µF are recommended.
Low Dropout Regulator (LDO) Description
The TPA6045A4C contains a 3.3-V output low dropout regulator (LDO) capable of providing a maximum of 120
mA with a drop of less than 150 mV from the 5-V supply. This can be used to power an external CODEC. A
10-µF decoupling capacitor is recommended at the output of the LDO as well as 0.1-µF capacitor to filter
high-frequency noise from the supply line.
Layout Recommendations
Solder the exposed thermal pad (metal pad on the bottom of the part) on the TPA6045A4C QFN package to a
pad on the PCB.
It is important to keep the TPA6045A4C external components close to the body of the amplifier to limit noise
pickup. One should lay out the differential input leads symmetrical and close together to take advantage of the
inherent common mode rejection of the TPA6045A4C. The layout of the TPA6045A4C evaluation module (EVM)
is a good example of component placement and the layout files are available at www.ti.com.
Copyright © 2008, Texas Instruments Incorporated
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Product Folder Link(s): TPA6045A4C
PACKAGE OPTION ADDENDUM
www.ti.com
20-Nov-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TPA6045A4CRHBR
ACTIVE
QFN
RHB
32
3000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Nov-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TPA6045A4CRHBR
QFN
RHB
32
3000
330.0
12.4
5.3
5.3
1.5
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Nov-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
QFN RHB 32
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 29.0
TPA6045A4CRHBR
3000
Pack Materials-Page 2
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