TPS2067 [TI]
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES; 限流配电开关
| 型号： | TPS2067 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES |
| 文件： | 总27页 (文件大小：702K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS2061, TPS2062, TPS2063
D−16
D−8
DGN−8
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
CURRENT-LIMITED, POWER-DISTRIBUTION SWITCHES
FEATURES
APPLICATIONS
•
Heavy Capacitive Loads
•
•
•
•
•
•
•
•
•
•
•
•
•
•
70-mΩ High-Side MOSFET
•
Short-Circuit Protections
1-A Continuous Current
TPS2061/TPS2065
D AND DGN PACKAGE
(TOP VIEW)
TPS2062/TPS2066
D AND DGN PACKAGE
(TOP VIEW)
Thermal and Short-Circuit Protection
Accurate Current Limit (1.1 A min, 2.1 A max)
Operating Range: 2.7 V to 5.5 V
0.6-ms Typical Rise Time
GND
IN
OUT
OUT
OUT
OC
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
GND
IN
OC1
OUT1
OUT2
OC2
†
IN
EN1
EN2
†
†
Undervoltage Lockout
EN
Deglitched Fault Report (OC)
No OC Glitch During Power Up
1-µA Maximum Standby Supply Current
Bidirectional Switch
TPS2063/TPS2067
D PACKAGE
(TOP VIEW)
1
2
16
15
GND
IN1
OC1
OUT1
†
14
3
4
OUT2
OC2
EN1
Ambient Temperature Range: -40°C to 85°C
ESD Protection
†
13
12
11
EN2
5
GND
IN2
OC3
6
7
OUT3
NC
†
10
9
EN3
UL Listed - File No. E169910
8
NC
NC
†
All Enable Inputs Are Active High For TPS2065, TPS2066, and TPS2067
DESCRIPTION
The TPS206x power-distribution switches are intended for applications where heavy capacitive loads and
short-circuits are likely to be encountered. This device incorporates 70-mΩ N-channel MOSFET power switches
for power-distribution systems that require multiple power switches in a single package. Each switch is controlled
by a logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch
rise times and fall times to minimize current surges during switching. The charge pump requires no external
components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the device limits the output current
to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When
continuous heavy overloads and short-circuits increase the power dissipation in the switch, causing the junction
temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal
shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures that the switch remains
off until valid input voltage is present. This power-distribution switch is designed to set current limit at 1.5 A
typically.
GENERAL SWITCH CATALOG
TPS2042B 500 mA
TPS2052B 500 mA
80 mΩ, dual
80 mΩ, dual
80 mΩ, quad
33 mΩ, single
80 mΩ, single
TPS201xA 0.2 A − 2 A
80 mΩ, triple
80 mΩ, quad
TPS2046
TPS2056
TPS2062
TPS2066
250 mA
250 mA
1 A
TPS202x
0.2 A − 2 A
TPS203x
0.2 A − 2 A
1 A
TPS2080
500 mA
500 mA
500 mA
250 mA
250 mA
250 mA
260 mΩ
1.3 Ω
TPS2014
TPS2015
600 mA
1 A
TPS2100/1
TPS2081
TPS2082
TPS2090
TPS2091
TPS2092
IN1 500 mA
IN2 10 mA
TPS2043 500 mA
TPS2053B 500 mA
TPS2047 250 mA
TPS2057 250 mA
TPS2063 1 A
IN1
IN2
TPS2085
500 mA
500 mA
500 mA
250 mA
TPS2041B 500 mA
TPS2051B 500 mA
TPS2044B 500 mA
TPS2054B 500 mA
TPS2048 250 mA
TPS2058 250 mA
OUT
TPS2086
TPS2087
TPS2095
TPS2102/3/4/5
IN1 500 mA
IN2 100 mA
TPS2045
TPS2055
TPS2061
TPS2065
250 mA
250 mA
1 A
TPS2096 250 mA
TPS2097 250 mA
TPS2067 1 A
1 A
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2004, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDED
MAXIMUM
CONTINUOUS
LOAD CURRENT
TYPICAL
SHORT-CIRCUIT
CURRENT LIMIT
AT 25°C
PACKAGED
DEVICES
(1)
NUMBER OF
SWITCHES
TA
ENABLE
MSOP (DGN)
SOIC(D)
Active low
Active high
Active low
Active high
Active low
Active high
TPS2061DGN
TPS2061D
TPS2065D
TPS2062D
TPS2066D
TPS2063D
TPS2067D
Single
Dual
TPS2065DGN
TPS2062DGN
-40°C to 85°C
1 A
1.5 A
TPS2066DGN
-
-
Triple
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2062DR).
LEAD (PB-FREE) ORDERING INFORMATION
TA
SOIC(D)
STATUS(1)
ECO-STATUS(2)
MSOP (DGN)
TPS2061DGNG4
TPS2062DGNG4
TPS2065DGNG4
TPS2066DGNG4
STATUS(1)
Active
ECO-STATUS(2)
TPS2061DG4
TPS2062DG4
TPS2065DG4
TPS2066DG4
Active
Active
Active
-40°C to 85°C
Green
Green
Active
Active
Active
Active
(1) The marketing status values are defined as follows:
•
•
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend
using this part in a new design.
•
•
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued production of the device.
(2) Eco-Status information - Additional details including specific material content can be accessed at www.ti.com/leadfree
•
•
N/A: Not yet available Lead (Pb)-Free, for estimated conversion dates go to www.ti.com/leadfree.
Pb-Free: TI defines “Lead (Pb)-Free” or “Pb-Free” to mean RoHS compatible, including a lead concentration that does not exceed
0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.
•
Green: TI defines “Green” to mean Lead (Pb)-Free and in addition, uses package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight.
2
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
-0.3 V to 6 V
-0.3 V to 6 V
-0.3 V to 6 V
-0.3 V to 6 V
Internally limited
See Dissipation Rating Table
-40°C to 125°C
-65°C to 150°C
260°C
(2)
Input voltage range, VI(IN)
Output voltage range, VO(OUT)(2), VO(OUTx)
Input voltage range, VI(/EN), VI(EN), VI(/ENx), VI(ENx)
Voltage range, VI(/OC), VI(/OCx)
Continuous output current, IO(OUT), IO(OUTx)
Continuous total power dissipation
Operating virtual junction temperature range, TJ
Storage temperature range, Tstg
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds
Human body model MIL-STD-883C
Electrostatic discharge (ESD) protection
2 kV
Charge device model (CDM)
500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND.
DISSIPATING RATING TABLE
T
A ≤ 25°C
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
PACKAGE
POWER RATING
D-8
DGN-8
D-16
585.82 mW
5.8582 mW/°C
17.123 mW/°C
8.9847 mW/°C
322.20 mW
941.78 mW
494.15 mW
234.32 mW
684.33 mW
359.38 mW
1712.3 mW
898.47 mW
RECOMMENDED OPERATING CONDITIONS
MIN
MAX UNIT
Input voltage, VI(IN)
2.7
0
5.5
5.5
1
V
V
Input voltage, VI(/EN), VI(EN), VI(/ENx), VI(ENx)
Continuous output current, IO(OUT), IO(OUTx)
Operating virtual junction temperature, TJ
0
A
-40
125
°C
ELECTRICAL CHARACTERISTICS
over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 1 A, VI(/ENx) = 0 V, or VI(ENx) = 5.5 V (unless
otherwise noted)
PARAMETER
POWER SWITCH
TEST CONDITIONS(1)
MIN
TYP MAX
UNIT
Static drain-source on-state
resistance, 5-V operation and VI(IN) = 5 V or 3.3 V,
3.3-V operation
IO = 1 A
IO = 1 A
-40°C ≤ TJ ≤ 125°C
-40°C ≤ TJ ≤ 125°C
70
75
135
150
mΩ
mΩ
rDS(on)
Static drain-source on-state
resistance, 2.7-V
operation(2)
VI(IN) = 2.7 V,
VI(IN) = 5.5 V
VI(IN) = 2.7 V
VI(IN) = 5.5 V
VI(IN) = 2.7 V
0.6
0.4
1.5
1
(2)
tr
Rise time, output
Fall time, output
CL = 1 µF,
RL = 5 Ω
TJ = 25°C
ms
0.05
0.05
0.5
0.5
tf(2)
ENABLE INPUT EN OR EN
(1) Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account
separately.
(2) Not tested in production, specified by design.
3
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 1 A, VI(/ENx) = 0 V, or VI(ENx) = 5.5 V (unless
otherwise noted)
PARAMETER
High-level input voltage
Low-level input voltage
Input current
TEST CONDITIONS(1)
MIN
TYP MAX
UNIT
V
VIH
VIL
II
2.7 V ≤ VI(IN) ≤ 5.5 V
2.7 V ≤ VI(IN) ≤ 5.5 V
2
0.8
0.5
3
VI(/ENx) = 0 V or 5.5 V, VI(ENx) = 0 V or 5.5 V
CL = 100 µF, RL = 5 Ω
-0.5
1.1
µA
(3)
ton
Turnon time
ms
(3)
toff
Turnoff time
CL = 100 µF, RL = 5 Ω
10
CURRENT LIMIT
IOS
Short-circuit output current
Over-current trip threshold
VI(IN) = 5 V, OUT connected to GND, device enabled into short-circuit
1.5
2.4
2.1
3
A
A
(3)
IOC_TRIP
VI(IN) = 5 V, current ramp (≤ 100 A/s) on OUT
SUPPLY CURRENT (TPS2061, TPS2065)
TJ = 25°C
0.5
0.5
43
1
5
No load on OUT, VI(/ENx) = 5.5 V,
or VI(ENx) = 0 V
Supply current, low-level output
µA
µA
-40°C ≤ TJ ≤ 125°C
TJ = 25°C
60
70
No load on OUT, VI(/ENx) = 0 V,
or VI(ENx) = 5.5 V
Supply current, high-level output
Leakage current
-40°C ≤ TJ ≤ 125°C
43
OUT connected to ground, VI(/EN) = 5.5 V,
-40°C ≤ TJ ≤ 125°C
1
0
µA
µA
or VI(EN) = 0 V
Reverse leakage current
VI(OUTx) = 5.5 V, IN = ground(3)
TJ = 25°C
SUPPLY CURRENT (TPS2062, TPS2066)
TJ = 25°C
0.5
0.5
50
1
5
No load on OUT, VI(/ENx) = 5.5 V,
or VI(ENx) = 0 V
Supply current, low-level output
µA
µA
-40°C ≤ TJ ≤ 125°C
TJ = 25°C
70
90
No load on OUT, VI(/ENx) = 0 V,
or VI(ENx) = 5.5 V
Supply current, high-level output
Leakage current
-40°C ≤ TJ ≤ 125°C
50
OUT connected to ground, VI(/ENx) = 5.5 V,
or VI(ENx) = 0 V
-40°C ≤ TJ ≤ 125°C
TJ = 25°C
1
µA
µA
Reverse leakage current
VI(OUTx) = 5.5 V, IN = ground(3)
0.2
SUPPLY CURRENT (TPS2063, TPS2067)
TJ = 25°C
0.5
0.5
65
2
10
Supply current, low-level output
No load on OUT, VI(/ENx) = 0 V
No load on OUT, VI(/ENx) = 5.5 V
µA
µA
-40°C ≤ TJ ≤ 125°C
TJ = 25°C
90
Supply current, high-level output
Leakage current
-40°C ≤ TJ ≤ 125°C
65
110
OUT connected to ground, VI(/ENx) = 5.5 V,
or VI(ENx) = 0 V
-40°C ≤ TJ ≤ 125°C
TJ = 25°C
1
µA
µA
Reverse leakage current
UNDERVOLTAGE LOCKOUT
Low-level input voltage, IN
Hysteresis, IN
VI(OUTx) = 5.5 V, INx = ground(3)
0.2
2
4
2.5
V
TJ = 25°C
75
8
mV
OVERCURRENT OC1 and OC2
Output low voltage, VOL(OCx)
Off-state current(3)
IO(/OCx) = 5 mA
0.4
1
V
VO(/OCx) = 5 V or 3.3 V
OCx assertion or deassertion
µA
ms
OC deglitch(3)
15
THERMAL SHUTDOWN(4)
Thermal shutdown threshold(3)
Recovery from thermal shutdown(3)
Hysteresis(3)
135
125
°C
°C
°C
10
(3) Not tested in production, specified by design.
(4) The thermal shutdown only reacts under overcurrent conditions.
4
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
DEVICE INFORMATION
Terminal Functions (TPS2061 and TPS2065)
TERMINAL
I/O
DESCRIPTION
NAME
EN
TPS2061
TPS2065
4
-
I
I
Enable input, logic low turns on power switch
EN
-
1
4
1
Enable input, logic high turns on power switch
Ground
GND
IN
2, 3
5
2,3
5
I
Input voltage
OC
OUT
O
O
Overcurrent, open-drain output, active-low
Power-switch output
6, 7, 8
6, 7, 8
Functional Block Diagram
(See Note A)
CS
OUT
IN
Charge
Pump
Current
Limit
EN
Driver
(See Note B)
OC
UVLO
Deglitch
Thermal
Sense
GND
Note A: Current sense
Note B: Active low (EN) for TPS2061. Active high (EN) for TPS2065.
5
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
Terminal Functions (TPS2062 and TPS2066)
TERMINAL
NO.
I/O
DESCRIPTION
NAME
TPS2062
TPS2066
EN1
EN2
EN1
EN2
GND
IN
3
4
-
-
I
I
I
I
Enable input, logic low turns on power switch IN-OUT1
Enable input, logic low turns on power switch IN-OUT2
Enable input, logic high turns on power switch IN-OUT1
Enable input, logic high turns on power switch IN-OUT2
Ground
-
3
4
1
2
8
5
7
6
-
1
2
8
5
7
6
I
Input voltage
OC1
OC2
OUT1
OUT2
O
O
O
O
Overcurrent, open-drain output, active low, IN-OUT1
Overcurrent, open-drain output, active low, IN-OUT2
Power-switch output, IN-OUT1
Power-switch output, IN-OUT2
Functional Block Diagram
OC1
Thermal
Deglitch
Sense
GND
EN1
(See Note B)
Current
Driver
Limit
Charge
Pump
(See Note A)
CS
OUT1
OUT2
UVLO
(See Note A)
CS
IN
Charge
Pump
Current
Driver
Limit
OC2
EN2
(See Note B)
Thermal
Sense
Deglitch
Note A: Current sense
Note B: Active low (ENx) for TPS2062. Active high (ENx) for TPS2066.
6
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
Terminal Functions (TPS2063 and TPS2067)
TERMINAL
I/O
DESCRIPTION
NAME
EN1
EN2
EN3
EN1
EN2
EN3
GND
IN1
TPS2063
TPS2067
3
4
--
--
I
I
I
I
I
I
Enable input, logic low turns on power switch IN1-OUT1
Enable input, logic low turns on power switch IN1-OUT2
Enable input, logic low turns on power switch IN2-OUT3
Enable input, logic high turns on power switch IN1-OUT1
Enable input, logic high turns on power switch IN1-OUT2
Enable input, logic high turns on power switch IN2-OUT3
Ground
7
--
--
3
--
4
--
7
1, 5
2
1, 5
2
I
I
Input voltage for OUT1 and OUT2
IN2
6
6
Input voltage for OUT3
NC
8, 9, 10
16
13
12
15
14
11
8, 9, 10
16
13
12
15
14
11
No connection
OC1
OC2
OC3
OUT1
OUT2
OUT3
O
O
O
O
O
O
Overcurrent, open-drain output, active low, IN1-OUT1
Overcurrent, open-drain output, active low, IN1-OUT2
Overcurrent, open-drain output, active low, IN2-OUT3
Power-switch output, IN1-OUT1
Power-switch output, IN1-OUT2
Power-switch output, IN2-OUT3
7
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
Functional Block Diagram
OC1
Thermal
Sense
GND
Deglitch
EN1
(See Note B)
Current
Driver
Limit
(See Note A)
CS
CS
OUT1
OUT2
UVLO
(See Note A)
IN1
Current
Limit
Driver
OC2
EN2
(See Note B)
Thermal
Sense
Deglitch
Charge
Pump
VCC
Selector
(See Note A)
IN2
CS
OUT3
OC3
Current
Limit
EN3
Driver
(See Note B)
UVLO
Deglitch
Thermal
Sense
GND
Note A: Current sense
Note B: Active low (ENx) for TPS2063; Active high (ENx) for TPS2067
8
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
PARAMETER MEASUREMENT INFORMATION
OUT
t
f
t
r
R
L
C
L
V
90%
10%
O(OUT)
90%
10%
TEST CIRCUIT
50%
90%
50%
50%
50%
V
V
I(EN)
I(EN)
t
off
t
off
t
on
t
on
90%
V
V
O(OUT)
O(OUT)
10%
10%
VOLTAGE WAVEFORMS
Figure 1. Test Circuit and Voltage Waveforms
R = 5 W,
L
C = 1 mF
T = 255C
A
L
V
V
I(EN)
I(EN)
5 V/div
5 V/div
R = 5 W,
L
V
O(OUT)
C = 1 mF
L
2 V/div
T = 255C
A
V
O(OUT)
2 V/div
t − Time − 500 ms/div
Figure 3. Turnoff Delay and Fall Time With 1-µF Load
t − Time − 500 ms/div
Figure 2. Turnon Delay and Rise Time With 1-µF Load
9
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
PARAMETER MEASUREMENT INFORMATION (continued)
R
C
T
= 5 W,
L
L
= 100 mF
= 255C
V
I(EN)
V
I(EN)
5 V/div
A
5 V/div
R
C
T
= 5 W,
L
L
V
O(OUT)
= 100 mF
= 255C
2 V/div
A
V
O(OUT)
2 V/div
t − Time − 500 ms/div
Figure 5. Turnoff Delay and Fall Time With 100-µF Load
t − Time − 500 ms/div
Figure 4. Turnon Delay and Rise Time With 100-µF Load
V
= 5 V
= 5 W,
= 255C
IN
R
T
L
V
I(EN)
V
I(EN)
A
5 V/div
5 V/div
220 mF
470 mF
I
O(OUT)
I
O(OUT)
100 mF
500 mA/div
500 mA/div
t − Time − 500 ms/div
t − Time − 1 ms/div
Figure 6. Short-Circuit Current,
Device Enabled Into Short
Figure 7. Inrush Current With Different
Load Capacitance
10
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
PARAMETER MEASUREMENT INFORMATION (continued)
V
O(OC)
V
O(OC)
2 V/div
2 V/div
I
O(OUT)
I
O(OUT)
1 A/div
1 A/div
t − Time − 2 ms/div
t − Time − 2 ms/div
Figure 8. 2-Ω Load Connected to Enabled Device
Figure 9. 1-Ω Load Connected to Enabled Device
11
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS
TURNON TIME
vs
INPUT VOLTAGE
TURNOFF TIME
vs
INPUT VOLTAGE
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
2
1.9
1.8
1.7
C
R
T
= 100 mF,
= 5 W,
= 255C
C
R
T
= 100 mF,
= 5 W,
= 255C
L
L
L
L
A
A
1.6
1.5
0.1
0
2
3
4
5
6
2
3
4
5
6
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 10.
Figure 11.
RISE TIME
vs
INPUT VOLTAGE
FALL TIME
vs
INPUT VOLTAGE
0.25
0.2
0.6
0.5
0.4
C
R
T
A
= 1 mF,
= 5 W,
= 255C
C
= 1 mF,
= 5 W,
= 255C
L
L
L
R
T
L
A
0.15
0.1
0.3
0.2
0.05
0
0.1
0
2
3
4
5
6
2
3
4
5
6
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 12.
Figure 13.
12
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TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS (continued)
TPS2061, TPS2065
SUPPLY CURRENT, OUTPUT ENABLED
vs
TPS2062, TPS2066
SUPPLY CURRENT, OUTPUT ENABLED
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
60
70
60
50
40
30
20
10
0
V = 5.5 V
I
V = 5.5 V
I
50
40
30
20
V = 5 V
I
V = 5 V
I
V = 3.3 V
I
V = 2.7 V
I
V = 2.7 V
I
V = 3.3 V
I
10
0
−50
0
50
100
150
−50
0
50
100
150
T − Junction Temperature − 5C
J
T − Junction Temperature − 5C
J
Figure 14.
Figure 15.
TPS2063, TPS2067
SUPPLY CURRENT, OUTPUT ENABLED
vs
TPS2061, TPS2065
SUPPLY CURRENT, OUTPUT DISABLED
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
90
80
70
60
50
40
30
20
0.5
0.45
0.4
V = 5.5 V
I
V = 5.5 V
I
V = 5 V
I
0.35
0.3
V = 5 V
I
V = 3.3 V
I
V = 3.3 V
I
V = 2.7 V
I
0.25
0.2
V = 2.7 V
I
0.15
0.1
10
0
0.05
0
−50
0
50
100
150
−50
0
50
100
150
T − Junction Temperature − 5C
J
T − Junction Temperature − 5C
J
Figure 16.
Figure 17.
13
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS (continued)
TPS2062, TPS2066
SUPPLY CURRENT, OUTPUT DISABLED
vs
TPS2063, TPS2067
SUPPLY CURRENT, OUTPUT DISABLED
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
0.5
0.45
0.4
0.5
V = 5.5 V
I
V = 5.5 V
I
0.45
0.4
V = 5 V
I
V = 5 V
I
0.35
0.3
0.35
0.3
V = 3.3 V
I
V = 3.3 V
I
V = 2.7 V
I
V = 2.7 V
I
0.25
0.2
0.25
0.2
0.15
0.1
0.15
0.1
0.05
0.05
0
−50
0
−50
0
50
100
150
0
50
100
150
T − Junction Temperature − 5C
J
T − Junction Temperature − 5C
J
Figure 18.
Figure 19.
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
SHORT-CIRCUIT OUTPUT CURRENT
vs
vs
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
120
100
80
60
40
20
0
1.56
1.54
1.52
1.5
V = 2.7 V
I
I
O
= 0.5 A
Out1 = 5 V
V = 3.3 V
I
Out1 = 3.3 V
Out1 = 2.7 V
1.48
1.46
1.44
1.42
1.4
V = 5 V
I
V = 5.5 V
I
1.38
1.36
1.34
−50
0
50
100
150
−50
0
50
100
150
T − Junction Temperature − 5C
J
T − Junction Temperature − 5C
J
Figure 20.
Figure 21.
14
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
TYPICAL CHARACTERISTICS (continued)
THRESHOLD TRIP CURRENT
UNDERVOLTAGE LOCKOUT
vs
JUNCTION TEMPERATURE
vs
INPUT VOLTAGE
2.3
2.5
UVLO Rising
T
= 255C
A
Load Ramp = 1A/10 ms
2.26
2.3
2.1
1.9
1.7
1.5
2.22
2.18
UVLO Falling
2.14
2.1
−50
0
50
100
150
2.5
3
3.5
4
4.5
5
5.5
6
T − Junction Temperature − 5C
J
V − Input Voltage − V
I
Figure 22.
Figure 23.
CURRENT-LIMIT RESPONSE
vs
PEAK CURRENT
200
150
100
V = 5 V,
I
T
= 255C
A
50
0
0
2.5
5
7.5
10
12.5
Peak Current − A
Figure 24.
15
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
APPLICATION INFORMATION
POWER-SUPPLY CONSIDERATIONS
TPS2062
2
Power Supply
2.7 V to 5.5 V
IN
7
6
Load
Load
OUT1
0.1 µF
0.1 µF
0.1 µF
22 µF
22 µF
8
OC1
EN1
OC2
3
5
OUT2
4
EN2
GND
1
Figure 25. Typical Application
A 0.01-µF to 0.1-µF ceramic bypass capacitor between IN and GND, close to the device, is recommended.
Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy.
This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the
output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients.
OVERCURRENT
A sense FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not
increase the series resistance of the current path. When an overcurrent condition is detected, the device
maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only
if the fault is present long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted before the
device is enabled or before VI(IN) has been applied (see Figure 15). The TPS206x senses the short and
immediately switches into a constant-current output.
In the second condition, a short or an overload occurs while the device is enabled. At the instant the overload
occurs, high currents may flow for a short period of time before the current-limit circuit can react. After the
current-limit circuit has tripped (reached the overcurrent trip threshold), the device switches into constant-current
mode.
In the third condition, the load has been gradually increased beyond the recommended operating current. The
current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is
exceeded (see Figure 18). The TPS206x is capable of delivering current up to the current-limit threshold without
damaging the device. Once the threshold has been reached, the device switches into its constant-current mode.
OC RESPONSE
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown condition
is encountered after a 10-ms deglitch timeout. The output remains asserted until the overcurrent or
overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause a
momentary overcurrent condition; however, no false reporting on OCx occurs due to the 10-ms deglitch circuit.
The TPS206x is designed to eliminate false overcurrent reporting. The internal overcurrent deglitch eliminates
the need for external components to remove unwanted pulses. OCx is not deglitched when the switch is turned
off due to an overtemperature shutdown.
16
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
APPLICATION INFORMATION (continued)
V+
R
pullup
TPS2062
GND
OC1
OUT1
OUT2
OC2
IN
EN1
EN2
Figure 26. Typical Circuit for the OC Pin
POWER DISSIPATION AND JUNCTION TEMPERATURE
The low on-resistance on the N-channel MOSFET allows the small surface-mount packages to pass large
currents. The thermal resistances of these packages are high compared to those of power packages; it is good
design practice to check power dissipation and junction temperature. Begin by determining the rDS(on) of the
N-channel MOSFET relative to the input voltage and operating temperature. As an initial estimate, use the
highest operating ambient temperature of interest and read rDS(on) from Figure 20. Using this value, the power
dissipation per switch can be calculated by:
•
PD = rDS(on)× I2
Multiply this number by the number of switches being used. This step renders the total power dissipation from
the N-channel MOSFETs.
Finally, calculate the junction temperature:
•
TJ = PD x RΘJA + TA
Where:
•
•
•
TA= Ambient temperature °C
ΘJA = Thermal resistance
PD = Total power dissipation based on number of switches being used.
R
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally
sufficient to get a reasonable answer.
THERMAL PROTECTION
Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for
extended periods of time. The TPS206x implements a thermal sensing to monitor the operating junction
temperature of the power distribution switch. In an overcurrent or short-circuit condition, the junction temperature
rises due to excessive power dissipation. Once the die temperature rises to approximately 140°C due to
overcurrent conditions, the internal thermal sense circuitry turns the power switch off, thus preventing the power
switch from damage. Hysteresis is built into the thermal sense circuit, and after the device has cooled
approximately 10°C, the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The OCx open-drain output is asserted (active low) when an overtemperature shutdown
or overcurrent occurs.
UNDERVOLTAGE LOCKOUT (UVLO)
An undervoltage lockout ensures that the power switch is in the off state at power up. Whenever the input
voltage falls below approximately 2 V, the power switch is quickly turned off. This facilitates the design of
hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The
UVLO also keeps the switch from being turned on until the power supply has reached at least 2 V, even if the
switch is enabled. On reinsertion, the power switch is turned on, with a controlled rise time to reduce EMI and
voltage overshoots.
17
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
APPLICATION INFORMATION (continued)
UNIVERSAL SERIAL BUS (USB) APPLICATIONS
The universal serial bus (USB) interface is a 12-Mb/s, or 1.5-Mb/s, multiplexed serial bus designed for
low-to-medium bandwidth PC peripherals (e.g., keyboards, printers, scanners, and mice). The four-wire USB
interface is conceived for dynamic attach-detach (hot plug-unplug) of peripherals. Two lines are provided for
differential data, and two lines are provided for 5-V power distribution.
USB data is a 3.3-V level signal, but power is distributed at 5 V to allow for voltage drops in cases where power
is distributed through more than one hub across long cables. Each function must provide its own regulated 3.3 V
from the 5-V input or its own internal power supply.
The USB specification defines the following five classes of devices, each differentiated by power-consumption
requirements:
•
•
•
•
•
Hosts/self-powered hubs (SPH)
Bus-powered hubs (BPH)
Low-power, bus-powered functions
High-power, bus-powered functions
Self-powered functions
SPHs and BPHs distribute data and power to downstream functions. The TPS206x has higher current capability
than required by one USB port; so, it can be used on the host side and supplies power to multiple downstream
ports or functions.
HOST/SELF-POWERED AND BUS-POWERED HUBS
Hosts and SPHs have a local power supply that powers the embedded functions and the downstream ports (see
Figure 27). This power supply must provide from 5.25 V to 4.75 V to the board side of the downstream
connection under full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection
and must report overcurrent conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers,
and stand-alone hubs.
18
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
APPLICATION INFORMATION (continued)
Downstream
USB Ports
D+
D−
V
BUS
0.1 µF
33 µF
GND
Power Supply
3.3 V
5 V
D+
D−
TPS2062
2
8
IN
7
V
BUS
OUT1
0.1 µF
0.1 µF
33 µF
GND
OC1
EN1
OC2
EN2
3
5
USB
Controller
D+
D−
4
6
V
BUS
OUT2
0.1 µF
33 µF
GND
GND
1
D+
D−
V
BUS
0.1 µF
33 µF
GND
Figure 27. Typical Four-Port USB Host / Self-Powered Hub
BPHs obtain all power from upstream ports and often contain an embedded function. The hubs are required to
power up with less than one unit load. The BPH usually has one embedded function, and power is always
available to the controller of the hub. If the embedded function and hub require more than 100 mA on power up,
the power to the embedded function may need to be kept off until enumeration is completed. This can be
accomplished by removing power or by shutting off the clock to the embedded function. Power switching the
embedded function is not necessary if the aggregate power draw for the function and controller is less than one
unit load. The total current drawn by the bus-powered device is the sum of the current to the controller, the
embedded function, and the downstream ports, and it is limited to 500 mA from an upstream port.
LOW-POWER BUS-POWERED AND HIGH-POWER BUS-POWERED FUNCTIONS
Both low-power and high-power bus-powered functions obtain all power from upstream ports; low-power
functions always draw less than 100 mA; high-power functions must draw less than 100 mA at power up and can
draw up to 500 mA after enumeration. If the load of the function is more than the parallel combination of 44 Ω
and 10 µF at power up, the device must implement inrush current limiting (see Figure 28). With TPS206x, the
internal functions could draw more than 500 mA, which fits the needs of some applications such as motor driving
circuits.
19
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
APPLICATION INFORMATION (continued)
Power Supply
D+
D−
3.3 V
TPS2062
2
8
IN
V
BUS
7
10 µF
0.1 µF
Internal
Function
OUT1
GND
0.1 µF
10 µF
OC1
EN1
OC2
EN2
3
5
USB
Control
6
4
OUT2
GND
Internal
Function
0.1 µF
10 µF
1
Figure 28. High-Power Bus-Powered Function
USB POWER-DISTRIBUTION REQUIREMENTS
USB can be implemented in several ways, and, regardless of the type of USB device being developed, several
power-distribution features must be implemented.
•
•
Hosts/SPHs must:
– Current-limit downstream ports
– Report overcurrent conditions on USB VBUS
BPHs must:
– Enable/disable power to downstream ports
– Power up at <100 mA
– Limit inrush current (<44 Ω and 10 µF)
Functions must:
•
– Limit inrush currents
– Power up at <100 mA
The feature set of the TPS206x allows them to meet each of these requirements. The integrated current-limiting
and overcurrent reporting is required by hosts and self-powered hubs. The logic-level enable and controlled rise
times meet the need of both input and output ports on bus-powered hubs, as well as the input ports for
bus-powered functions (see Figure 29).
20
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
APPLICATION INFORMATION (continued)
TUSB2040
Hub Controller
SN75240
BUSPWR
Tie to TPS2041 EN Input
Downstream
Ports
Upstream
Port
A
B
C
D
GANGED
DP1
DM1
D +
D −
DP0
DM0
D +
D −
Ferrite Beads
A
B
C
D
GND
5 V
†
GND
SN75240
DP2
DM2
TPS2041B
OC EN
IN OUT
1 µF
33 µF
5-V Power
Supply
DP3
DM3
5 V
D +
D −
A
B
C
D
Ferrite Beads
TPS76333
IN
SN75240
GND
DP4
DM4
0.1 µF
4.7 µF
V
CC
3.3 V
GND
5 V
†
4.7 µF
TPS2062
PWRON1
GND
EN1
OC1
OUT1
OUT2
33 µF
OVRCUR1
PWRON2
OVRCUR2
48-MHz
Crystal
EN2
OC2
XTAL1
XTAL2
D +
D −
IN
0.1 µF
Ferrite Beads
Tuning
Circuit
GND
5 V
†
OCSOFF
GND
33 µF
D +
D −
Ferrite Beads
GND
5 V
†
33 µF
†
USB rev 1.1 requires 120 µF per hub.
Figure 29. Hybrid Self / Bus-Powered Hub Implementation
GENERIC HOT-PLUG APPLICATIONS
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating.
These are considered hot-plug applications. Such implementations require the control of current surges seen by
the main power supply and the card being inserted. The most effective way to control these surges is to limit and
slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply
normally turns on. Due to the controlled rise times and fall times of the TPS206x, these devices can be used to
provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the TPS206x
also ensures that the switch is off after the card has been removed, and that the switch is off during the next
insertion. The UVLO feature insures a soft start with a controlled rise time for every insertion of the card or
module.
21
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
APPLICATION INFORMATION (continued)
PC Board
TPS2062
Power
Supply
Block of
Circuitry
OC1
GND
2.7 V to 5.5 V
IN
OUT1
OUT2
0.1 µF
EN1
EN2
1000 µF
Optimum
OC2
Block of
Circuitry
Overcurrent Response
Figure 30. Typical Hot-Plug Implementation
By placing the TPS206x between the VCC input and the rest of the circuitry, the input power reaches these
devices first after insertion. The typical rise time of the switch is approximately 1 ms, providing a slow voltage
ramp at the output of the device. This implementation controls system surge currents and provides a
hot-plugging mechanism for any device.
DETAILED DESCRIPTION
Power Switch
The power switch is an N-channel MOSFET with a low on-state resistance. Configured as a high-side switch, the
power switch prevents current flow from OUT to IN and IN to OUT when disabled. The power switch supplies a
minimum current of 1 A.
Charge Pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
little supply current.
Driver
The driver controls the gate voltage of the power switch. To limit large current surges and reduce the associated
electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and fall
times of the output voltage.
Enable (ENx or ENx)
The logic enable disables the power switch and the bias for the charge pump, driver, and other circuitry to reduce
the supply current. The supply current is reduced to less than 1 µA when a logic high is present on ENx, or when
a logic low is present on ENx. A logic zero input on ENx, or a logic high input on ENx restores bias to the drive
and control circuits and turns the switch on. The enable input is compatible with both TTL and CMOS logic
levels.
Overcurrent (OCx)
The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature condition is
encountered. The output remains asserted until the overcurrent or overtemperature condition is removed. A
10-ms deglitch circuit prevents the OCx signal from oscillation or false triggering. If an overtemperature shutdown
occurs, the OCx is asserted instantaneously.
22
TPS2061, TPS2062, TPS2063
TPS2065, TPS2066, TPS2067
www.ti.com
SLVS490B–DECEMBER 2003–REVISED DECEMBER 2004
DETAILED DESCRIPTION (continued)
Current Sense
A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than
conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry
sends a control signal to the driver. The driver in turn reduces the gate voltage and drives the power FET into its
saturation region, which switches the output into a constant-current mode and holds the current constant while
varying the voltage on the load.
Thermal Sense
The TPS206x implements a thermal sensing to monitor the operating temperature of the power distribution
switch. In an overcurrent or short-circuit condition the junction temperature rises. When the die temperature rises
to approximately 140°C due to overcurrent conditions, the internal thermal sense circuitry turns off the switch,
thus preventing the device from damage. Hysteresis is built into the thermal sense, and after the device has
cooled approximately 10 degrees, the switch turns back on. The switch continues to cycle off and on until the
fault is removed. The open-drain false reporting output (OCx) is asserted (active low) when an overtemperature
shutdown or overcurrent occurs.
Undervoltage Lockout
A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V, a control
signal turns off the power switch.
23
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