TPS22916BYFPR [TI]
具有输出放电功能的 5.5V、2A、60mΩ、10nA 泄漏负载开关 | YFP | 4 | -40 to 85;
| 型号： | TPS22916BYFPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有输出放电功能的 5.5V、2A、60mΩ、10nA 泄漏负载开关 | YFP | 4 | -40 to 85 开关 驱动 接口集成电路 |
| 文件： | 总29页 (文件大小：1349K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS22916
SLVSDO5F – JULY 2017 – REVISED DECEMBER 2021
TPS22916xx 1-V–5.5-V, 2-A, 60-mΩ Ultra-Low Leakage Load Switch
1 Features
3 Description
•
•
•
Input operating voltage range (VIN): 1 V–5.5 V
Maximum continuous current (IMAX): 2 A
ON-resistance (RON):
– 5 VIN = 60 mΩ (typ.), 100 mΩ (85°C max.)
– 1.8 VIN = 100 mΩ (typ.), 150 mΩ (85°C max.)
– 1 VIN = 200 mΩ (typ.), 325 mΩ (85°C max.)
Ultra-low power consumption:
– ON state (IQ): 0.5 µA (typ.), 1 µA (max.)
– OFF state (ISD): 10 nA (typ.), 100 nA (max.)
– TPS22916BL/CL/CNL (ISD): 100 nA (typ.), 300
nA (max.)
The TPS22916xx is a small, single channel load
switch using a low leakage P-Channel MOSFET for
minimum power loss. Advanced gate control design
supports operating voltages as low as 1 V with
minimal increase in ON-resistance and power loss.
Multiple timing options are available to support
various system loading conditions. For heavy
capacitive loads, the slow turn-on timing in the C
version minimizes the inrush current. In cases with
light capacitive loads, the fast timing in the B version
reduces required wait time.
•
•
•
Smart ON pin pulldown (RPD):
– ON ≥ VIH (ION): 10 nA (max.)
– ON ≤ VIL (RPD): 750 kΩ (typ.)
The switch ON state is controlled by a digital input
that is capable of interfacing directly with low-voltage
control signals. Both Active High and Active Low (L)
versions are available. When power is first applied,
a smart pulldown is used to keep the ON pin from
floating until system sequencing is complete. AFter
the ON pin is deliberately driven high (≥VIH), the smart
pulldown is disconnected to prevent unnecessary
power loss.
Slow Timing in C Version Limits Inrush Current:
– 5-V turn-on time (tON): 1400 µs at 5 mV/µs
– 1.8-V turn-on time (tON): 3000 µs at 1 mV/µs
– 1-V turn-on time (tON): 6500 µs at 0.3 mV/µs
Fast timing in b version reduces wait time:
– 5-V turn-on time (tON): 115 µs at 57 mV/µs
– 1.8-V turn-on time (tON): 250 µs at 12 mV/µs
– 1-V turn-on time (tON): 510 µs at 3.3 mV/µs
Always-ON true Reverse Current Blocking (RCB):
– Activation current (IRCB): –500 mA (typ.)
– Reverse leakage (IIN,RCB): –300 nA (max.)
Quick Output Discharge (QOD): 150 Ω (typ.)
(N version has no QOD)
•
•
The TPS22916xx is available in a small, space
saving 0.78 mm × 0.78 mm, 0.4-mm pitch, 0.5-
mm height 4-pin Wafer-Chip-Scale (WCSP) package
(YFP). The device is characterized for operation over
a temperature range of –40°C to +85°C.
•
•
Device Information(1)
Active low enable option (L versions)
PART NUMBER
TPS22916xx
PACKAGE
BODY SIZE (NOM)
WCSP (4)
0.78 mm × 0.78 mm
2 Applications
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
•
•
•
•
Wearables
Smartphones
Tablets
Device Comparison Table
Portable speakers
VERSION
TPS22916B
TIMING
QOD
ENABLE (ON)
Fast
Yes
Active High
TPS22916BL
TPS22916C
Fast
Yes
Yes
Active Low
Active High
Slow
TPS22916CN
TPS22916CL
Slow
Slow
No
Active High
Active Low
Yes
TPS22916CNL
Slow
No
Active Low
VIN
ON
VOUT
+
RL
CIN
CL
VIN
œ
H
GND
TPS22916xx
Copyright © 2017, Texas Instruments Incorporated
L
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS22916
www.ti.com
SLVSDO5F – JULY 2017 – REVISED DECEMBER 2021
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Switching Characteristics............................................6
6.7 Typical Characteristics................................................8
7 Parameter Measurement Information..........................15
8 Detailed Description......................................................16
8.1 Overview...................................................................16
8.2 Functional Block Diagram.........................................16
8.3 Feature Description...................................................16
8.4 Device Functional Modes..........................................17
9 Application and Implementation..................................18
9.1 Application Information............................................. 18
9.2 Typical Application.................................................... 18
10 Power Supply Recommendations..............................19
11 Layout...........................................................................20
11.1 Layout Guidelines................................................... 20
11.2 Layout Example...................................................... 20
11.3 Thermal Considerations..........................................20
12 Device and Documentation Support..........................21
12.1 Documentation Support.......................................... 21
12.2 Receiving Notification of Documentation Updates..21
12.3 Support Resources................................................. 21
12.4 Trademarks.............................................................21
12.5 Electrostatic Discharge Caution..............................21
12.6 Glossary..................................................................21
13 Mechanical, Packaging, and Orderable
Information.................................................................... 21
13.1 Tape and Reel Information......................................22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (September 2020) to Revision F (December 2021)
Page
•
Added TPS22916CNL and TPS22916BL orderables to the data sheet.............................................................1
Changes from Revision D (October 2019) to Revision E (September 2020)
Page
•
Updated the numbering format for tables, figures and cross-references throughout the document...................1
Changes from Revision C (October 2018) to Revision D (October 2019)
Page
•
Changed package dimensions from 0.74 mm x 0.74 mm to 0.78 mm x 0.78 mm..............................................1
Changes from Revision B (December 2017) to Revision C (October 2018)
Page
•
Changed Package Drawing Dimensions ......................................................................................................... 21
Changes from Revision A (September 2017) to Revision B (December 2017)
Page
•
Changed Pinout drawing labeled Laser Marking................................................................................................1
Changes from Revision * (July 2017) to Revision A (September 2017)
Page
•
Changed device document from Advanced Info to Production Data .................................................................1
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SLVSDO5F – JULY 2017 – REVISED DECEMBER 2021
5 Pin Configuration and Functions
GND
ON
ON
GND
B
B
VOUT
VIN
VIN
VOUT
A
A
2
1
1
2
Figure 5-1. YFP Package 4-Pin WSON Laser
Marking View
Figure 5-2. YFP Package 4-Pin WSON Bump View
Table 5-1. Pin Functions
PIN
TYPE
DESCRIPTION
NO.
A1
A2
B1
B2
NAME
VOUT
VIN
Power
Power
Switch output
Switch input
GND
ON
Ground
Device ground
Device enable
Digital input
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6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
MAX
6
UNIT
V
VIN
Input voltage
VOUT
VON
Output voltage
6
V
Enable voltage
6
V
IMAX
IPLS
Maximum continuous switch current
Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle
Maximum junction temperature
Storage temperature
2
A
2.5
125
150
300
A
TJ,MAX
TSTG
TLEAD
°C
°C
°C
–65
Maximum Lead temperature (10-s soldering time)
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±500 V may actually have higher performance.
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
1
MAX
5.5
UNIT
V
VIN
VOUT
VIH
VIL
Input voltage
Output voltage
0
5.5
V
High-level input voltage, ON
Low-level input voltage, ON
Operating free-air temperature
1
5.5
V
0
0.35
85
V
TA
–40
°C
6.4 Thermal Information
TPS22916xx
Thermal Parameters(1)
YFP (WCSP)
UNIT
4 PINS
193
2.3
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
θJCtop
θJB
Junction-to-board thermal resistance
36
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
12
ψJB
36
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
Unless otherwise noted, the specification in the following table applies for all variants over the entire recommended power
supply voltage range of 1 V to 5.5 V unless noted otherwise. Typical Values are at 25°C.
PARAMETER
TEST CONDITIONS
TJ
MIN TYP MAX UNIT
INPUT SUPPLY (VIN)
IQ,VIN
VIN Quiescent current
VIN Shutdown current
Enabled, VOUT = Open
–40°C to +85°C
–40°C to +85°C
0.5
1.0
µA
nA
ISD,VIN
Disabled, VOUT = GND
(TPS22916B/C/CN)
10 100
Disabled, VOUT = GND (TPS22916BL/CL/ –40°C to +85°C
CNL)
100 300
nA
ON-RESISTANCE
(RON
)
25°C
60
70
80
100
120
90
VIN = 5 V
–40°C to +85°C
–40°C to +105°C
25°C
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
–40°C to +85°C
–40°C to +105°C
25°C
120
140
100 125
RON
ON-Resistance
IOUT = 200 mA
–40°C to +85°C
–40°C to +105°C
25°C
150 mΩ
175
150 200
–40°C to +85°C
–40°C to +105°C
25°C
250
300
200 275
325
–40°C to +85°C
–40°C to +105°C
375
ENABLE PIN (ON)
ION
ON Pin leakage
Smart Pull Down Resistance
Enabled
Disabled
–40°C to +85°C
–40°C to +85°C
–10
10
nA
kΩ
RPD
750
REVERSE CURRENT BLOCKING
(RCB)
IRCB
RCB Activation Current
RCB Activation time
RCB Release Voltage
Enabled, VOUT > VIN
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
-500
10
mA
µs
tRCB
Enabled, VOUT > VIN + 200mV
Enabled, VOUT > VIN
VRCB
IIN,RCB
25
mV
nA
VIN Reverse Leakage Current 0 V ≤ VIN + VRCB ≤ VOUT ≤ 5.5 V
–300
QUICK OUTPUT DISCHARGE
(QOD)
QOD(1)
Output discharge resistance
Disabled (Not in TPS22916CN/CNL)
–40°C to +85°C
150
Ω
(1) For more information on which devices include quick output discharge, see the Device Functional Modes section.
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6.6 Switching Characteristics
Unless otherwise noted, the typical characteristics in the following table applies over the entire recommended power supply
voltage range of 1 V to 5.5 V at 25°C with a load of CL = 0.1µF, RL = 10Ω.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TPS22916B,
TPS22916BL
VIN = 5 V
115
140
250
350
510
70
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
tON
Turn On Time
µs
VIN = 5 V
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
80
tRISE
Rise Time
Slew Rate
130
190
240
57
µs
VIN = 5 V
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
36
SRON
12
mV/µs
5.1
3.3
5
VIN = 5 V
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
5
tOFF
Turn Off Time
Fall Time
10
µs
µs
15
25
CL = 0.1 µF, RL = 10 Ω(1)
CL = 1µF, RL = Open(1)
2.3
315
tFALL
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6.6 Switching Characteristics (continued)
Unless otherwise noted, the typical characteristics in the following table applies over the entire recommended power supply
voltage range of 1 V to 5.5 V at 25°C with a load of CL = 0.1µF, RL = 10Ω.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TPS22916C, TPS22916CN, TPS22916CL,
TPS22916CNL
VIN = 5 V
1400
1700
3000
5000
6500
800
900
1400
2300
3000
5
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
tON
Turn On Time
µs
VIN = 5 V
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
tRISE
Rise Time
µs
VIN = 5 V
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
3.2
SRON
Slew Rate
1
mV/µs
0.4
0.3
VIN = 5 V
5
VIN = 3.6 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1 V
5
tOFF
Turn Off Time
Fall Time(2)
10
µs
µs
15
25
CL = 0.1 µF, RL = 10 Ω(1)
CL = 10µF, RL = Open(1)
2.3
tFALL
3150
(1) See the Fall Time (tFALL) and Quick Output Discharge (QOD) section for information on how RL and CL affect Fall Time.
(2) Devices without Quick Output Discharge (QOD) may not discharge completely.
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6.7 Typical Characteristics
6.7.1 Typical Electrical Characteristics
The typical characteristics curves in this section apply to all devices unless otherwise noted.
220
200
180
160
140
120
100
80
220
200
180
160
140
120
100
80
1 V
1.2 V
1.8 V
3.6 V
5 V
105èC
85èC
25èC
-40èC
60
60
40
40
-40
-20
0
20
Temperature (°C)
40
60
80
100
120
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D004
D003
Enabled
Enabled
Figure 6-2. ON-Resistance vs Input voltage
Figure 6-1. ON-Resistance vs Temperature
50
45
40
35
30
25
20
15
10
5
250
85èC
25èC
40èC
200
150
100
50
85°C
15°C
-40°C
0
0
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D002
D015
TPS22916C, TPS22916CN, TPS22916B
Figure 6-3. Shutdown Current
VON ≤ VIL
TPS22916CL, TPS22916BL,
TPS22916CNL
VON ≥ VIH
Figure 6-4. Shutdown Current (Active Low)
800
750
700
650
600
550
500
450
400
350
300
0.72
VIH
VIL
0.7
0.68
0.66
0.64
0.62
0.6
0.58
0.56
0.54
85èC
25èC
-40èC
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D001
D006
Enabled
Figure 6-5. Quiescent Current
–40°C to +85°C
Figure 6-6. ON Pin Threshold
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6.7.1 Typical Electrical Characteristics (continued)
The typical characteristics curves in this section apply to all devices unless otherwise noted.
1050
1000
950
900
850
800
750
700
650
260
240
220
200
180
160
140
85èC
25èC
-40èC
-40
-20
0
20
40
60
80
100
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Temperature (èC)
VIN (V)
D005
D007
VON ≤ VIL
TPS22916C, TPS22916CL, TPS22916B, TPS22916BL
Figure 6-7. ON Pin Smart Pulldown
Figure 6-8. Quick Output Discharge
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6.7.2 Typical Switching Characteristics
600
550
500
450
400
350
300
250
200
150
100
85°C
25°C
-40°C
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D009
CL = 0.1 µF
RL = 10 Ω
TPS22916B
VIN = 5 V
CL = 0.1 μF
RL = 10 Ω
RL = 10 Ω
RL = 10 Ω
Figure 6-9. Fast Turn-On Time
Figure 6-10. Fast Turn-On at 5 V
275
250
225
200
175
150
125
100
75
85èC
25èC
-40èC
50
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D010
CL = 0.1 µF
RL = 10 Ω
TPS22916B
VIN = 3.6 V
CL = 0.1 μF
Figure 6-11. Fast Rise Time
Figure 6-12. Fast Turn-On at 3.6 V
80
60
40
20
0
85èC
25èC
-40èC
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D008
CL = 0.1 µF
RL = 10 Ω
TPS22916B
VIN = 1 V
CL = 0.1 μF
Figure 6-13. Fast Slew Rate
Figure 6-14. Fast Turn-On at 1 V
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6.7.2 Typical Switching Characteristics (continued)
550
700
600
500
400
300
200
100
10 mF
3 W
10 W
Open
500
1 mF
0.1 mF
450
400
350
300
250
200
150
100
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D016
D017
RL = 10 Ω
TPS22916B
CL = 10 µF
TPS22916B
Figure 6-15. Fast Turn-On vs Load Capacitance
Figure 6-16. Fast Turn-On vs Load Resistance
270
400
10 µF
1 µF
0.1 µF
3 W
10 W
Open
240
350
300
250
200
150
100
50
210
180
150
120
90
60
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D018
D019
RL = 10 Ω
TPS22916B
CL = 10 µF
TPS22916B
Figure 6-17. Fast Rise Time vs Load Capacitance
Figure 6-18. Fast Rise Time vs Load Resistance
80
80
10 µF
1 µF
0.1 µF
3 W
10 W
Open
60
40
20
0
60
40
20
0
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D020
D021
RL = 10 Ω
TPS22916B
CL = 10 µF
TPS22916B
Figure 6-19. Fast Slew Rate vs Load Capacitance
Figure 6-20. Fast Slew Rate vs Load Resistance
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6.7.2 Typical Switching Characteristics (continued)
8000
85èC
25èC
-40èC
7000
6000
5000
4000
3000
2000
1000
0
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D013
CL = 0.1 µF
RL = 10 Ω
TPS22916C
VIN = 5 V
CL = 0.1 μF
RL = 10 Ω
RL = 10 Ω
RL = 10 Ω
Figure 6-21. Slow Turn-On Time
Figure 6-22. Slow Turn-On at 5 V
3500
3000
2500
2000
1500
1000
500
85èC
25èC
-40èC
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D014
CL = 0.1 µF
RL = 10 Ω
TPS22916C
VIN = 3.6 V
CL = 0.1 μF
Figure 6-23. Slow Rise Time
Figure 6-24. Slow Turn-On at 3.6 V
6
5
4
3
2
1
85èC
25èC
-40èC
0
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D012
CL = 0.1 µF
RL = 10 Ω
TPS22916C
VIN = 1 V
CL = 0.1 μF
Figure 6-25. Slow Slew Rate
Figure 6-26. Slow Turn-On at 1 V
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6.7.2 Typical Switching Characteristics (continued)
6000
7000
6000
5000
4000
3000
2000
1000
100 µF
1 µF
0.1 µF
3 W
10 W
Open
5500
5000
4500
4000
3500
3000
2500
2000
1500
1000
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D022
D023
RL = 10 Ω
TPS22916C TPS22916CN TPS22916CL
CL = 100 µF
TPS22916C TPS22916CN TPS22916CL
Figure 6-27. Slow Turn-On vs Load Capacitance
Figure 6-28. Slow Turn-On vs Load Resistance
2700
3600
100 µF
1 µF
0.1 µF
3 W
10 W
Open
3300
3000
2700
2400
2100
1800
1500
1200
900
2400
2100
1800
1500
1200
900
600
600
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D024
D025
RL = 10 Ω
TPS22916C TPS22916CN TPS22916CL
CL = 100 µF
TPS22916C TPS22916CN TPS22916CL
Figure 6-29. Slow Rise Time vs Load Capacitance
Figure 6-30. Slow Rise Time vs Load Resistance
6
6
100 µF
1 µF
0.1 µF
3 W
10 W
Open
5
4
3
2
1
0
5
4
3
2
1
0
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
VIN (V)
D026
D027
RL = 10 Ω
TPS22916C TPS22916CN TPS22916CL
CL = 100 µF
TPS22916C TPS22916CN TPS22916CL
Figure 6-31. Slow Slew Rate vs Load Capacitance
Figure 6-32. Slow Slew Rate vs Load Resistance
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6.7.2 Typical Switching Characteristics (continued)
45
85°C
25°C
-40°C
40
35
30
25
20
15
10
5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VIN (V)
D011
Figure 6-33. Turn-Off Time
TPS22916CL
VIN = 5 V CL = 0.1 μF
RL = 10 Ω
Figure 6-34. Turn-Off at 5 V (Active Low)
50000
10000
1000
100
3 W
10 W
Open
10
5
1
10
CL (mF)
100
D028
VIN = 1 V to 5.5 V
TPS22916C
TPS22916CL
TPS22916B
Figure 6-35. Fall Time
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7 Parameter Measurement Information
VIN
VOUT
+
RL
CIN
CL
VIN
œ
H
ON
GND
TPS22916xx
L
Copyright © 2017, Texas Instruments Incorporated
Figure 7-1. TPS22916 Test Circuit
VIH
VON
tON
tOFF
VIL
tFALL
tRISE
90%
tDELAY
90%
VOUT
SRON
10%
10%
Figure 7-2. TPS22916 Timing Waveform
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8 Detailed Description
8.1 Overview
This family of devices are single channel, 2-A load switches in ultra-small, space saving 4-pin WCSP package.
These devices implement a low resistance P-channel MOSFET with a controlled rise time for applications that
must limit inrush current.
These devices are designed to have very low leakage current during OFF state. This design prevents
downstream circuits from pulling high standby current from the supply. Integrated control logic, driver, power
supply, and output discharge FET eliminates the need for additional external components, which reduces
solution size and BOM count.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 On and Off Control
The ON pin controls the state of the switch. The ON pin is compatible with standard GPIO logic threshold. the
pin can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V, 3.3-V, or 5.5-V GPIO.
8.3.2 Fall Time (tFALL) and Quick Output Discharge (QOD)
The TPS22916B, TPS22916BL, TPS22916C, and TPS22916CL include a Quick Output Discharge feature.
When the switch is disabled, a discharge resistor is connected between VOUT and GND. This resistor has a
typical value of QOD and prevents the output from floating while the switch is disabled.
As load capacitance and load resistance increase: tFALL increases. The larger the load resistance or load
capacitance is, the longer it takes to discharge the capacitor, resulting in a longer fall time.
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The output fall time is determined by how quickly the load capacitance is discharged and can be found using
Equation 1 .
tFALL = – (RDIS) × CL × ln (V10% / V90%
)
(1)
Where
•
•
•
•
V10% is 10% of the initial output voltage
V90% is 90% of the initial output voltage
RDIS is the result of the QOD resistance in parallel with the Load Resistance RL
CL is the load capacitance
With the Quick Output Discharge feature, the QOD resistance is in parallel with RL. This provides a lower total
load resistance as seen from the load capacitance which discharges the capacitance faster resulting in a smaller
tFALL
.
8.3.3 Full-Time Reverse Current Blocking
In a scenario where the device is enabled and VOUT is greater than VIN there is potential for reverse current to
flow through the pass FET or the body diode. When the reverse current threshold (IRCB) is exceeded, the switch
is disabled within tRCB. The switch remains off and block reverse current as long as the reverse voltage condition
exists. After VOUT has dropped below the VRCB release threshold the TPS22916xx turns back on with slew rate
control.
8.4 Device Functional Modes
Table 8-1 describes the state for each variant as determined by the ON pin.
Table 8-1. Device Function Table
ON
TPS22916B
TPS22916BL
TPS22916C
TPS22916CN
TPS22916CL
TPS22916CNL
≤ VIL
≥ VIH
Disabled
Enabled
Enabled
Disabled
Disabled
Enabled
Disabled
Enabled
Enabled
Disabled
Enabled
Disabled
Table 8-2 shows when QOD is active for each variant.
Table 8-2. QOD Function Table
Device
Enabled
Disabled
TPS22916B
TPS22916BL
TPS22916C
TPS22916CN
TPS22916CL
TPS22916CNL
No
No
No
No
No
No
No
No
Yes
Yes
Yes
Yes
Table 8-3 shows when the ON pin smart pulldown is active.
Table 8-3. Smart-ON Pulldown
VON
≤ VIL
≥ VIH
Pulldown
Connected
Disconnected
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
This section highlights some of the design considerations when implementing this device in various applications.
A PSPICE model for this device is also available in the product page of this device.
9.2 Typical Application
VIN
ON
VOUT
+
RL
CIN
CL
VIN
œ
H
GND
TPS22916xx
Copyright © 2017, Texas Instruments Incorporated
L
Figure 9-1. Typical Application
9.2.1 Design Requirements
For this design example, below, use the input parameters shown in Table 9-1.
Table 9-1. Design Parameters
Design Parameter
Example Value
3.6 V
Input voltage (VIN)
Load capacitance (CL)
47 μF
Maximum inrush current (IRUSH
)
300 mA
9.2.2 Detailed Design Procedure
9.2.2.1 Maximum Inrush Current
When the switch is enabled, the output capacitors must be charged up from 0 V to VIN voltage. This charge
arrives in the form of inrush current. Inrush current can be calculated using the following equation:
IRUSH = CL × SRON
IRUSH = 47 μF × 3.2 mV/μs
IRUSH = 150 mA
(2)
(3)
(4)
The TPS22916x offers multiple rise time options to control the inrush current during turn-on. The appropriate
device can be selected based upon the maximum acceptable slew rate which can be calculated using the design
requirements and the inrush current equation. In this case, the TPS22916C provides a slew rate slow enough to
limit the inrush current to the desired amount.
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9.2.3 Application Curve
VIN = 3.6 V
CL = 47 μF
TA = 25°C
RL = Open
TPS22916C
Figure 9-2. Inrush Current
10 Power Supply Recommendations
The device is designed to operate with a VIN range of 1 V to 5.5 V. The VIN power supply must be well
regulated and placed as close to the device terminal as possible. The power supply must be able to withstand all
transient load current steps. In most situations, using an input capacitance (CIN) of 1 µF is sufficient to prevent
the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to
respond to a large transient current or large load current step, additional bulk capacitance can be required on the
input.
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11 Layout
11.1 Layout Guidelines
For best performance, all traces must be as short as possible. To be most effective, the input and output
capacitors must be placed close to the device to minimize the effects that parasitic trace inductances can have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects.
11.2 Layout Example
Equation 3 shows an example for these devices. Notice the connection to system ground between the VOUT
Bypass Capacitor ground and the GND pin of the load switch,. This connection creates a ground barrier which
helps to reduce the ground noise seen by the device.
To GPIO
control
Gnd
Via
GND
Gnd
Via
ON
A2
VOUT Bypass
Capacitor
VIN Bypass
Capacitor
VOUT
VIN
VIA to Power Ground Plane
Figure 11-1. TPS22916xx Layout
11.3 Thermal Considerations
The maximum IC junction temperature must be restricted to 125°C under normal operating conditions. To
calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use
Equation 5 as a guideline:
TJ(MAX) - TA
=
P
D(MAX)
RθJA
(5)
Where,
PD(max) = maximum allowable power dissipation
TJ(max) = maximum allowable junction temperature
TA = ambient temperature for the device
θJA = junction to air thermal impedance. See the Thermal Information section.
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
Texas Instruments, TPS22916 Load Switch Evaluation Module User's Guide
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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13.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
P1 Pitch between successive cavity centers
W
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TPS22916BYFPR
TPS22916BYFPT
TPS22916CLYFPR
TPS22916CLYFPT
TPS22916CNYFPR
TPS22916CNYFPT
TPS22916CYFPR
TPS22916CYFPT
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
4
4
4
4
4
4
4
4
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.86
0.59
0.59
0.59
0.59
0.59
0.59
0.59
0.59
0.59
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
3000
250
3000
250
3000
250
TPS22916CNLYFPR
TPS22916BLYFPR
4
4
3000
3000
180.0
180.0
DSBGA
YFP
8.4
0.86
0.86
0.59
4.0
8.0
Q1
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TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
SPQ
3000
250
Length (mm) Width (mm)
Height (mm)
20.0
TPS22916BYFPR
TPS22916BYFPT
TPS22916CLYFPR
TPS22916CLYFPT
TPS22916CNYFPR
TPS22916CNYFPT
TPS22916CYFPR
TPS22916CYFPT
TPS22916CNLYFPR
TPS22916BLYFPR
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
4
4
4
4
4
4
4
4
4
4
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
3000
250
20.0
20.0
3000
250
20.0
20.0
3000
250
20.0
20.0
3000
3000
20.0
20.0
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PACKAGE OUTLINE
YFP0004
DSBGA - 0.5 mm max height
S
C
A
L
E
1
0
.
0
0
0
DIE SIZE BALL GRID ARRAY
B
E
A
D
BALL A1
CORNER
C
0.5 MAX
SEATING PLANE
0.05 C
0.19
0.13
BALL TYP
0.4
TYP
B
A
D: Max = 0.81 mm, Min = 0.75 mm
E: Max = 0.81 mm, Min = 0.75 mm
SYMM
0.4
TYP
0.25
0.21
4X
0.015
1
2
C A B
SYMM
4223507/A 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YFP0004
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
4X ( 0.23)
1
2
A
B
SYMM
(0.4) TYP
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:50X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
( 0.23)
METAL
EXPOSED
(
0.23)
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4223507/A 01/2017
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
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EXAMPLE STENCIL DESIGN
YFP0004
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
4X ( 0.25)
1
2
A
B
SYMM
(0.4) TYP
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:50X
4223507/A 01/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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PACKAGE OPTION ADDENDUM
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28-Dec-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS22916BYFPR
TPS22916BYFPT
TPS22916CLYFPR
TPS22916CLYFPT
TPS22916CNLYFPR
TPS22916CNYFPR
TPS22916CNYFPT
TPS22916CYFPR
TPS22916CYFPT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
YFP
4
4
4
4
4
4
4
4
4
3000 RoHS & Green SAC396 | SNAGCU
250 RoHS & Green SAC396 | SNAGCU
3000 RoHS & Green
250 RoHS & Green
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
(BA, R)
(BA, R)
B9
SAC396
SAC396
SNAGCU
SAC396
SAC396
SAC396
SAC396
B9
3000 RoHS & Green
3000 RoHS & Green
S
B8
250
3000 RoHS & Green
250 RoHS & Green
RoHS & Green
B8
B7
B7
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Dec-2021
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
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Addendum-Page 2
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