TPS22924BYZPRB [TI]
具有输出放电功能和 100µs 上升时间（在 3.6V 时）的 3.6V、2A、18.3mΩ 负载开关 | YZP | 6 | -40 to 85;
| 型号： | TPS22924BYZPRB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有输出放电功能和 100µs 上升时间（在 3.6V 时）的 3.6V、2A、18.3mΩ 负载开关 | YZP | 6 | -40 to 85 开关 |
| 文件： | 总17页 (文件大小：576K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
ULTRA-SMALL, LOW-INPUT-VOLTAGE, LOW rON LOAD SWITCH
Check for Samples: TPS22924B
1
FEATURES
DESCRIPTION
•
•
•
Integrated Single Load Switch
Input Voltage: 0.75 V to 3.6 V
Ultra-Low ON Resistance
The TPS22924B is a small, ultra-low rON load switch
with controlled turn on. The device contains a
N-channel MOSFET that can operate over an input
voltage range of 0.75 V to 3.6 V. An integrated
charge pump biases the NMOS switch to achieve a
minimum switch ON resistance. The switch is
controlled by an on/off input (ON), which is capable of
interfacing directly with low-voltage control signals.
–
–
–
–
–
–
rON = 18.3 mΩ at VIN = 3.6 V
rON = 18.5 mΩ at VIN = 2.5 V
rON = 19.6 mΩ at VIN = 1.8 V
rON = 19.4 mΩ at VIN = 1.2 V
rON = 20.3 mΩ at VIN = 1.0 V
rON = 22.7 mΩ at VIN = 0.75 V
A 1250-Ω on-chip load resistor is added for output
quick discharge when the switch is turned off. The
rise time of the device is internally controlled to avoid
inrush current. The TPS22924B features a rise time
of 100 µs at 3.6 V.
•
Ultra Small CSP-6 package
0.9 mm x 1.4 mm, 0.5-mm Pitch
2-A Maximum Continuous Switch Current
Low Shutdown Current
Low Threshold Control Input
Controlled Slew Rate to Avoid Inrush Currents
Quick Output Discharge Transistor
ESD Performance Tested Per JESD 22
•
•
•
•
•
•
The TPS22924B is available in an ultra-small
space-saving
6-pin
CSP
package
and
is
characterized for operation over the free-air
temperature range of –40ºC to 85ºC.
Figure 1. TYPICAL APPLICATION
–
5000-V Human-Body Model
(A114-B, Class II)
LOAD
V
V
IN
OUT
SMPS
ON
–
1000-V Charged-Device Model (C101)
TPS22924B
C
R
L
L
C
= 1 µF
IN
OFF
APPLICATIONS
GND
GND
GND
•
•
•
•
•
•
•
•
•
Battery Powered Equipment
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point Of Sales Terminal
GPS Devices
Digital Cameras
Notebooks / Tablet PCs / eReaders
Smartphones
NOTE: SMPS = Switched-mode power supply
Table 1. FEATURE LIST
SLEW RATE
(TYP)
AT 3.6 V
QUICK
OUTPUT
MAXIMUM
OUTPUT
CURRENT
rON (TYP)
AT 3.6 V
ENABLE
DISCHARGE(1)
TPS22924B
18.3 mΩ
100 μs
Yes
2 A
Active high
(1) This feature discharges the output of the switch to ground through a 1250-Ω resistor, preventing the
output from floating. See the Output Pulldown section in Application Information.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
___5N_
–40°C to 85°C DSBGA – YZ (0.5-mm pitch)
Tape and reel
TPS22924BYZR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZ PACKAGE
C
B
A
C
B
A
2
1
1
2
Laser Marking View
Bump View
TERMINALS ASSIGNMENTS (YZ PACKAGE)
C
B
A
GND
VOUT
VOUT
1
ON
VIN
VIN
2
TERMINAL FUNCTIONS
NO.
C1
NAME
GND
ON
DESCRIPTION
Ground
C2
Switch control input, active high. Do not leave floating
Switch output
A1, B1 VOUT
A2, B2 VIN
Switch input, bypass this input with a ceramic capacitor to ground
2
Copyright © 2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
BLOCK DIAGRAM
V
IN
Charge
Pump
Control
Logic
ON
V
OUT
GND
FUNCTION TABLE
ON (Control Signal)
VIN to VOUT
VOUT to GND(1)
L
OFF
ON
H
ON
OFF
(1) See application section Output Pulldown.
Copyright © 2011, Texas Instruments Incorporated
3
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
MIN
MAX
UNIT
V
VIN
Input voltage range
–0.3
4
VOUT
VON
IMAX
IPLS
TA
Output voltage range
VIN + 0.3
V
Input voltage range
–0.3
4
2
V
Maximum continuous switch current, TA = -40°C to 85°C
Maximum pulsed switch current, 100-µs pulse, 2% duty cycle, TA = -40°C to 85°C
Operating free-air temperature range
Storage temperature range
A
4
A
–40
–65
85
°C
°C
Tstg
150
5000
1000
Human-Body Model (HBM)
Electrostatic discharge protection
ESD
V
Charged-Device Model (CDM)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
DERATING
FACTOR
ABOVE
BOARD
PACKAGE
RθJC
RθJA
TA < 25°C
TA = 70°C
TA = 85°C
TA = 25°C
- 8.1063
mW/°C
High-K(1)
YZ
17.6°C/W
123.36°C/W
810.63 mW
445.84 mW
324.25 mW
(1) The JEDEC high-K (2s2p) board used to derive this data was a 3- × 3-inch, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
3.6
VIN
3.6
3.6
0.6
0.4
UNIT
V
VIN
Input voltage
0.75
VOUT
Output voltage
V
VIN = 2.5 V to 3.6 V
VIN = 0.75 V to 2.5 V
VIN = 2.5 V to 3.6 V
VIN = 0.75 V to 2.49 V
1.2
0.9
VIH
High-level input voltage, ON
V
VIL
Low-level input voltage, ON
Input capacitance
V
CIN
1(1)
μF
(1) See the Input Capacitor section in Application Information.
4
Copyright © 2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
ELECTRICAL CHARACTERISTICS
VIN = 0.75 V to 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIN = 3.6 V
TA
MIN TYP(1) MAX UNIT
75 160
VIN = 2.5 V
42
70
VIN = 1.8 V
50 350
95 200
65 110
IIN
Quiescent current
IOUT = 0, VIN = VON
Full
µA
µA
VIN = 1.2 V
VIN = 1.0 V
VIN = 0.75 V
35
70
IIN(LEAK)
OFF-state supply current VON = GND, OUT = 0V
Full
25°C
Full
3.5
18.3 19.7
26.0
VIN = 3.6 V
VIN = 2.5 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1.0 V
VIN = 0.75 V
25°C
Full
18.5 19.5
25.8
25°C
Full
19.6 21.8
27.4
rON
ON-state resistance
IOUT = -200 mA
mΩ
25°C
Full
19.4 21.8
28.0
25°C
Full
20.3 21.2
28.6
25°C
Full
22.7 25.3
34.8
Output pulldown
resistance(2)
rPD
ION
VIN = 3.3 V, VON = 0, IOUT = 3 mA
VON = 0.9 V to 3.6 V or GND
25°C
1250 1500
0.1
Ω
ON-state input leakage
current
Full
µA
(1) Typical values are at VIN = 3.3 V and TA = 25°C.
(2) See Output Pulldown in Application Information.
SWITCHING CHARACTERISTICS
VIN = 3.6 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
111
3
MAX
UNIT
μs
tON
tOFF
tr
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 μF, VIN = 3.6V
RL = 10 Ω, CL = 0.1 μF, VIN = 3.6V
RL = 10 Ω, CL = 0.1 μF, VIN = 3.6V
RL = 10 Ω, CL = 0.1 μF, VIN = 3.6V
μs
96
μs
tf
2.5
μs
SWITCHING CHARACTERISTICS
VIN = 0.9 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
160
20
MAX
UNIT
μs
tON
tOFF
tr
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 μF, VIN = 0.9V
RL = 10 Ω, CL = 0.1 μF, VIN = 0.9V
RL = 10 Ω, CL = 0.1 μF, VIN = 0.9V
RL = 10 Ω, CL = 0.1 μF, VIN = 0.9V
μs
81
μs
tf
5
μs
Copyright © 2011, Texas Instruments Incorporated
5
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
PARAMETER MEASURMENT INFORMATION
V
V
IN
OUT
C
=1 μF
IN
C
ON
L
R
L
ON
+
–
(A)
GND
TPS22924B
OFF
GND
GND
TEST CIRCUIT
V
ON
50%
50%
t
r
t
f
t
90%
90%
OFF
t
ON
V
OUT
50%
50%
10%
10%
V
OUT
t
/t
WAVEFORMS
ON OFF
Figure 2. Test Circuit and tON/tOFF Waveforms
6
Copyright © 2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
ON-STATE RESISTANCE
vs
vs
INPUT VOLTAGE
TEMPERATURE
INPUT CURRENT, QUIESCENT
INPUT CURRENT, LEAK
vs
vs
INPUT VOLTAGE
INPUT VOLTAGE
Copyright © 2011, Texas Instruments Incorporated
7
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
ON INPUT THRESHOLD
TURN-ON TIME
vs
TURN-OFF TIME
vs
TEMPERATURE
TEMPERATURE
VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω
VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω
8
Copyright © 2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
TYPICAL CHARACTERISTICS (continued)
RISE TIME
FALL TIME
vs
vs
TEMPERATURE
TEMPERATURE
VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω
VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω
TURN-ON TIME
vs
TURN-OFF TIME
vs
TEMPERATURE
TEMPERATURE
VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω
VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω
Copyright © 2011, Texas Instruments Incorporated
9
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
RISE TIME
FALL TIME
vs
vs
TEMPERATURE
TEMPERATURE
VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω
VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω
RISE TIME
vs
RISE TIME
vs
INPUT VOLTAGE
CL = 0.1 µF, RL = 10 Ω, VON = 1.8 V
INPUT VOLTAGE
CL = 20 µF, RL = 10 Ω, VON = 1.8 V
10
Copyright © 2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE
TURN-OFF RESPONSE
CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C
CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C
TURN-ON RESPONSE
TURN-OFF RESPONSE
CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C
CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C
TURN-ON RESPONSE
TURN-OFF RESPONSE
CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C
CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C
Copyright © 2011, Texas Instruments Incorporated
11
TPS22924B
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE
TURN-OFF RESPONSE
CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C
CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C
12
Copyright © 2011, Texas Instruments Incorporated
TPS22924B
www.ti.com
SLVSAR3A –APRIL 2011–REVISED JUNE 2011
APPLICATION INFORMATION
ON/OFF Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard
GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
Output Capacitor
Due to the integral body diode in the NMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN. A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip
caused by inrush currents during startup.
Output Pulldown
The output pulldown is active when the user is turning off the main pass FET. The pulldown discharges the
output rail to approximately 10% of the rail, then the output pulldown is automatically disconnected to optimize
the shutdown current.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
Copyright © 2011, Texas Instruments Incorporated
13
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jul-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS22924BYZR
TPS22924BYZT
ACTIVE
ACTIVE
DIESALE
DIESALE
YZ
YZ
6
6
3000
250
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS22924BYZR
DIESALE
YZ
6
3000
178.0
9.2
1.02
1.52
0.63
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
DIESALE YZ
SPQ
Length (mm) Width (mm) Height (mm)
220.0 220.0 35.0
TPS22924BYZR
6
3000
Pack Materials-Page 2
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