TPS22950LYBHR [TI]
具有可调节电流限制的 5.5V、2A、40mΩ 负载开关 | YBH | 6 | -40 to 125;
| 型号： | TPS22950LYBHR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有可调节电流限制的 5.5V、2A、40mΩ 负载开关 | YBH | 6 | -40 to 125 开关 |
| 文件： | 总29页 (文件大小：1746K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS22950
ZHCSMW7B –DECEMBER 2020 –REVISED FEBRUARY 2023
TPS22950x 5.5V、3.2A、34mΩ 可调限流负载开关
1 特性
3 说明
• 输入电压范围(VIN)：1.8 V 至5.5V
• 输出电流限制(ILIMIT)：0.05A–3.5A (典型值)
• TPS22950：自动重试电流限制响应
• TPS22950L：闭锁电流限制响应
• 热关断(TSD)
TPS22950x 器件是一款小型单通道负载开关，能够通
过可调输出电流限制、反向电流阻断和热关断提供强大
的故障保护功能。
开关导通状态由数字输入控制，此输入可与低压控制信
号直接连接。首次加电时，此器件使用智能下拉电阻来
保持 ON 引脚不悬空，直到系统时序控制完成。故意
将引脚驱动为高电平 (>VIH) 后，智能下拉电阻会断
开，以防止不必要的功率损耗。
• 导通电阻(RON)：
– VIN = 5V 时，RON：34mΩ（典型值）
– VIN = 3.3V 时，RON：41mΩ（典型值）
• 慢速开通时序可限制浪涌电流（典型值）：
– VIN = 5V 时，tON：800µs
– VIN = 3.3V 时，tON：550µs
• 常开的反向电流阻断(TPS22950)
• 故障指示(FLT)
TPS22950/C 通过自动重试行为响应过流事件，而
TPS22950L 使用去抖时间和闭锁行为。
TPS22950x 采用标准 WCSP 封装和引线式 SOT 封
装，工作环境温度范围为–40°C 至125°C。
• 快速输出放电(QOD)：150Ω
• ON 引脚智能下拉电阻(RPD,ON)：
– ON ≥VIH (ION)：50nA（最大值）
– ON ≤VIL (RPD,ON)：500kΩ（典型值）
• 低功耗：
封装信息
封装(1)
封装尺寸（标称值）
器件型号
1.106mm ×
0.706mm
TPS22950、
TPS22950L
WCSP (6)
TPS22950C
DDC（SOT，6）
2.90mm x 2.80mm
– 导通状态(IQ)：40µA（典型值）
– 关闭状态(ISD)：0.2µA（典型值）
• UL 2367 认证–文件号E169910
(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。
– 已通过ILIM = 66mA 至2.46A 认证
2 应用
• 个人电子产品
• 平板电脑
• 笔记本电脑
• 游戏机
• 附件
VOUT
VIN
CIN
RL
CL
RFLT
Fault
+
-
H
VIN
ON
FLT
ILIM
L
GND
RILIM
典型应用
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSFJ2
TPS22950
www.ti.com.cn
ZHCSMW7B –DECEMBER 2020 –REVISED FEBRUARY 2023
Table of Contents
9.2 Functional Block Diagram.........................................12
9.3 Feature Description...................................................12
9.4 Device Functional Modes..........................................15
10 Application and Implementation................................17
10.1 Application Information........................................... 17
10.2 Typical Application.................................................. 17
10.3 Power Supply Recommendations...........................18
10.4 Layout..................................................................... 18
11 Device and Documentation Support..........................20
11.1 接收文档更新通知................................................... 20
11.2 支持资源..................................................................20
11.3 Trademarks............................................................. 20
11.4 静电放电警告...........................................................20
11.5 术语表..................................................................... 20
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................5
7.4 Thermal Information....................................................5
7.5 Electrical Characteristics.............................................6
7.6 Switching Characteristics............................................7
7.7 Typical Characteristics................................................9
8 Parameter Measurement Information.......................... 11
9 Detailed Description......................................................12
9.1 Overview...................................................................12
Information.................................................................... 21
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision A (June 2022) to Revision B (February 2023)
Page
• 向数据表添加了TPS22950C 可订购信息...........................................................................................................1
Changes from Revision * (December 2020) to Revision A (June 2022)
Page
• 向数据表添加了TPS22950L 可订购信息........................................................................................................... 1
• Updated ESD ratings table to the latest sandard................................................................................................5
• Added line items in Electrical Characteristics to reflect TPS22950L parameters...............................................5
• Updated the Overview section in Detailed Description to include device functionality ....................................12
• Added a Current Limiting section to describe the latch off functionality of TPS22950L .................................. 14
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English Data Sheet: SLVSFJ2
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ZHCSMW7B –DECEMBER 2020 –REVISED FEBRUARY 2023
5 Device Comparison Table
DEVICE NAME
ILIM Range
IMAX
2.7A
2.7A
3.2A
ILIM Response
Auto-Retry
Latch Off
Debounce Time
RCB
Yes
No
TPS22950
TPS22950L
TPS22950C
0.05 A to 3.5 A
0.5 A to 3.5 A
No
Yes
No
0.5 A to 3.5 A
Auto-Retry
Yes
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6 Pin Configuration and Functions
图6-1. TPS22950x WCSP - 6 Top View
ON
VIN
6
5
4
FLT
1
2
3
VOUT
ILIM
GND
图6-2. TPS22950x SOT- 6 Top View
表6-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
ON
WCSP
SOT6
A1
A2
1
I
Active high switch control input. Do not leave floating.
Open-drain output, pulled low during thermal shutdown or reverse current-
conditions.
FLT
6
O
VIN
B1
B2
C1
C2
2
5
3
4
I
Switch input
VOUT
GND
ILIM
O
Switch output
Device ground
—
O
Adjusts device current limit through a resistor to ground.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
MAX
6
UNIT
V
VIN
Maximum Input Voltage Range
VOUT
VON
Maximum Output Voltage Range
6
V
Maximum ON Pin Voltage Range
6
V
VFLT
Maximum FLT Pin Voltage
6
V
IMAX
Maximum Continuous Output Current(TPS22950C)
Maximum Continuous Output Current(TPS22950,TPS22950L)
Maximum Pulsed Output Current (TJ = 85°C, duty cycle = 2%)
Storage temperature
3.2
2.7
4.1
150
300
A
IMAX
A
IMAX,PLS
TSTG
TLEAD
A
°C
°C
–65
Maximum Lead Temperature (10 s soldering time)
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001((1))
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per ANSI/ESDA/
JEDEC JS-002((2))
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.8
0
TYP
MAX
5.5
UNIT
V
VIN
VOUT
VIH
VIL
Input Voltage Range
Output Voltage Range
5.5
V
ON Pin High Voltage Range
ON Pin Low Voltage Range
Output Current Limit (TPS22950)
Output Current Limit (TPS22950L)
Ambient temperature
1
5.5
V
0
0.35
3.5
V
ILIM
ILIM
TA
0.05
0.5
–40
–40
A
3.5
A
125
150
°C
°C
TJ
Junction temperature
7.4 Thermal Information
TPS22950
THERMAL METRIC(1)
DDC(SOT)
6 PINS
104.8
57.6
YBH (WCSP)
6 PINS
135.8
1.4
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
36.3
39.5
12.8
0.9
ΨJT
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7.4 Thermal Information (continued)
TPS22950
THERMAL METRIC(1)
DDC(SOT)
6 PINS
36.0
YBH (WCSP)
6 PINS
UNIT
Junction-to-board characterization parameter
39.5
°C/W
ΨJB
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Electrical Characteristics
Unless otherwise noted, the characteristics in the following table apply across the recommended operating input voltage
range with a load of CL = 0.1 µF, RL = 100 Ω. Typical Values are at 5 V and TA = 25°C.
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
Input Supply (VIN)
44
60 µA
60 µA
0.4 µA
–40°C to 85°C
–40°C to 125°C
25°C
IQ, VIN
VIN Quiescent Current
VIN Shutdown Current
V
V
ON ≥VIH, VOUT = Open
0.2
9
µA
ISD, VIN
–40°C to 85°C
–40°C to 125°C
ON ≤VIL, VOUT = GND
46 µA
ON-Resistance (RON)
25°C
34
41
67
41
49
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
VIN = 5 V, IOUT = –200 mA
VIN = 3.3 V, IOUT = –200 mA
VIN = 1.8 V, IOUT = –200 mA
–40°C to 85°C
–40°C to 125°C
25°C
54
51
RON
ON-State Resistance
62
–40°C to 85°C
–40°C to 125°C
25°C
68
90
105
116
–40°C to 85°C
–40°C to 125°C
Output Current Limit (ILIM)
RILIM = 610 Ω
VIN- VOUT = 0.5 V
1.54
0.75
0.38
2
1
2.46
1.25
A
A
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
RILIM = 1.15 kΩ
VIN- VOUT = 0.5 V
ILIM
Output Current Limit
RILIM = 2.21 kΩ
VIN- VOUT = 0.5 V
0.5 0.62
A
RILIM = 19.2 kΩ
VIN- VOUT = 0.5 V
0.034 0.05 0.066
A
RILIM = 624 Ω
VIN- VOUT = 1 V
2.1
1
A
Output Current Limit Peak
(TPS22950L)
RILIM = 1.24 kΩ
VIN- VOUT = 1 V
ILIM,PEAK
A
RILIM = 2.49 kΩ
VIN- VOUT = 1 V
0.52
5
A
Current Limit Response
Time
tLIM
Output hard short (IOUT > ILIM
)
µs
Latch Off Debounce Time
(TPS22950L)
tDEBOUNCE
VIN- VOUT = 0.5 V
120 188 µs
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7.5 Electrical Characteristics (continued)
Unless otherwise noted, the characteristics in the following table apply across the recommended operating input voltage
range with a load of CL = 0.1 µF, RL = 100 Ω. Typical Values are at 5 V and TA = 25°C.
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
1.2
1.6
1.9
1.1
A
A
A
RILIM = 624 Ω
RILIM = 1.25 kΩ
RILIM = 2.5 kΩ
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
High current detection
threshold (TPS22950L)
IHCD
0.6 0.85
0.3 0.47 0.65
Reverse Current Blocking (TPS22950)
Activation Threshold
VRCB
VOUT Rising; VOUT > VIN
VOUT Falling; VOUT > VIN
VOUT = VIN + 1 V
44
16
3
mV
mV
µs
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
Release Threshold
tRCB
Response Time
Reverse Leakage Current
into VOUT
V
ON ≤VIL
IOUT,RCB
38 µA
–40°C to 125°C
VIN = 0 V, VOUT = 5 V
Fault Indication (FLT)
VOL, FLT
tD,FLT
IFLT
Output Low Voltage
IFLT = 1 mA
0.1
V
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
Fault Delay Time
Off State Leakage
10
µs
V
V
ON ≥VIH
ON ≤VIL
50 nA
Enable Pin (ON)
Smart Pull Down
RPD, ON
500 650
50 nA
V
V
ON ≤VIL
ON ≥VIH
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
kΩ
Resistance
ION
ON Pin Leakage
VIN = 5 V
ON ≤VIL
100 160
Ω
Ω
Ω
V
VIN = 3.3 V
ON ≤VIL
Quick Output Discharge
Resistance
RQOD
150 185
200 355
–40°C to 125°C
–40°C to 125°C
V
VIN = 1.8 V
ON ≤VIL
V
Thermal Shutdown (TSD)
Rising
N/A
N/A
170
150
°C
°C
TSD
Thermal Shutdown
Falling (Hysteresis)
7.6 Switching Characteristics
Unless otherwise noted, the typical characteristics in the following table applies at 25°C with a load of CL = 1 µF, RL = 100 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
800
550
400
600
320
200
260
250
260
20
MAX
UNIT
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
VIN = 5 V
tON
Turn ON Time
VIN = 3.3 V
VIN = 1.8 V
VIN = 5 V
tR
Output Rise Time
Output Delay Time
Turn OFF Time
VIN = 3.3 V
VIN = 1.8 V
VIN = 5 V
tD
VIN = 3.3 V
VIN = 1.8 V
VIN = 5 V
tOFF
VIN = 3.3 V
VIN = 1.8 V
15
17
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Unless otherwise noted, the typical characteristics in the following table applies at 25°C with a load of CL = 1 µF, RL = 100 Ω
PARAMETER
TEST CONDITIONS
MIN
TYP
118
120
130
MAX
UNIT
VIN = 5 V
µs
tFALL
Output Fall Time
VIN = 3.3 V
VIN = 1.8 V
µs
µs
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7.7 Typical Characteristics
50
6
5.5
5
-40èC
25èC
-40èC
25èC
48
85èC
85èC
125èC
125èC
4.5
4
46
3.5
3
44
42
40
38
2.5
2
1.5
1
0.5
0
1.5
2
2.5
3
3.5
4
Input Voltage (V)
4.5
5
5.5
1.5
2
2.5
3
3.5
4
Input Voltage (V)
4.5
5
5.5
D002
D001
V
ON ≤VIL
V
ON ≥VIH
图7-2. Shutdown Current vs Input Voltage
图7-1. Quiescent Current vs Input Voltage
85
220
200
180
160
140
120
100
-40èC
25èC
85èC
-40èC
25èC
85èC
80
75
70
65
60
55
50
45
40
35
30
25
125èC
125èC
1.5
2
2.5
3
3.5
4
Input Voltage (V)
4.5
5
5.5
1.5
2
2.5
3
3.5
4
Input Voltage (V)
4.5
5
5.5
D004
D003
V
ON ≤VIL
V
ON ≥VIH
IOUT = –200 mA
图7-4. QOD Resistance vs Input Voltage
图7-3. On-Resistance vs Input Voltage
2.75
2.5
2.25
2
2.4
2.2
2
4-layer JEDEC PCB
4-layer PCB with 0.5in2 Cu pad
1.8
1.6
1.4
1.2
1
1.75
1.5
1.25
1
0.75
0.5
0.25
0
0.8
0.6
0.4
-40
-20
0
20
40
60
80
100 120 140
85
95
105
115
125
135
145
Ambient Temperature (èC)
Junction Temperature (èC)
D005
D006
图7-5. Maximum Power Dissipation vs Ambient Temperature
图7-6. Maximum Continuous Current vs Junction Temperature
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7.7 Typical Characteristics (continued)
VIN = 5 V
VON = 5 V
VIN = 5 V
VON = 5 V
图7-7. Short-Circuit Response
图7-8. Reverse Current Blocking
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8 Parameter Measurement Information
VIL
VIH
VON
tON
tOFF
tFALL
tRISE
90%
90%
tDELAY
VOUT
10%
10%
图8-1. Timing Waveform
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9 Detailed Description
9.1 Overview
The TPS22950x is a single channel load switch with a 34-mΩ power MOSFET capable of driving loads up to 3.2
A. While on, the device provides protection against fault cases though its adjustable output current limiting and
thermal shutdown. The TPS22950 responds to overcurrent events with auto-retry behavior, while the
TPS22950L uses a debounce time and latch off behavior. The TPS22950 also provides reverse current blocking
for when VOUT exceeds VIN.
The switch ON state is controlled by a digital input that is capable of interfacing directly with low-voltage control
signals, and a smart pulldown is used to keep the ON pin from floating until system sequencing is complete.
When the device is turned off, quick output discharge is enabled, pulling the output voltage down to 0 V through
a resistive path to GND.
9.2 Functional Block Diagram
9.3 Feature Description
9.3.1 Current Limiting (TPS22950, TPS22950C)
The TPS22950 responds to overcurrent conditions by limiting its output current to the ILIM level shown in the
figure below.
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图9-1. Output Current Limit for Short-Circuit Protection (tLIM
)
When an overcurrent condition is detected, the device maintains a constant output current and reduces the
output voltage accordingly. Two possible overload conditions can occur.
The first condition is when a short circuit or partial short circuit is present on the output and the ON pin is toggled
high, turning the device on. The output voltage is held near zero potential with respect to ground and the
TPS22950 ramps the output current to ILIM. The TPS22950 device limits the current to ILIM until the overload
condition is removed or the internal junction temperature of the device reaches thermal shutdown and the device
turns itself off. The device remains off until the junction temperature has lowered to TSDHYS, and the device
turns itself back on. This action cycles until the overload condition is removed.
The second condition is when a short circuit, partial short circuit, or transient overload occurs after the device
has been fully powered on. The device responds to the overcurrent condition within time tLIM (see figure below),
and before this time the current is able to exceed ILIM. In the case of a fast transient, the current-sense amplifier
is over-driven and momentarily disables the internal power FET. The current-sense amplifier recovers and limits
the output current to ILIM. Similar to the previous case, the TPS22950 limits the current to ILIM until the overload
condition is removed or the internal junction temperature of the device reaches thermal shutdown and begins
thermally cycling on and off.
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ILIM
tLIM
IOUT
图9-2. Transient Current Limit Waveform
9.3.2 Current Limiting (TPS22950L)
The TPS22950L responds to overcurrent conditions by limiting its output current to the current limit (ILIM) level
after initially peaking its current at ILIM,PEAK. The behavior of the device is shown in 图9-3.
图9-3. Output Current Limit Behavior
When an overcurrent condition is detected, the device maintains a constant output current and reduces the
output voltage accordingly. Two possible overload conditions can occur.
The first condition is when a short circuit or partial short circuit is present on the output and the ON pin is toggled
high, turning the device on. The output voltage is held near zero potential with respect to ground and the
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TPS22950L ramps the output current to ILIM. The TPS22950L device limits the current to ILIM until the overload
condition is removed. If the internal junction temperature of the device reaches thermal shutdown ,the device
turns itself off. The device remains off until the junction temperature has lowered to TSDHYS, and the device
turns itself back on. If thermal shutdown is not reached, the device waits for the load current to exceed the high
current detection level (IHCD) for the tDEBOUNCE time and latch itself off. The FLT pin is pulled low, and the device
is only able to turn on again by toggling the VIN or ON pins.
The second condition is when a short circuit, partial short circuit, or transient overload occurs after the device
has been fully powered on. The device responds to the overcurrent condition within time tLIM (see 图 9-4), and
before this time the current is able to exceed ILIM. In the case of a fast transient, the current-sense amplifier is
over-driven and momentarily disables the internal power FET. The current-sense amplifier recovers and limits
the output current to ILIM. Similar to the previous case, the TPS22950L limits the current to ILIM until the overload
condition is removed, the debounce time of 120 µs is reached, or the internal junction temperature of the device
reaches thermal shutdown and begins thermally cycling on and off.
ILIM
tLIM
IOUT
图9-4. Transient Current Limit Waveform
9.3.3 Adjusting the Current Limit
The current limit is adjusted by connecting an external resistor from the ILIM pin to GND. The current limit
resistor can be chosen using the equation:
–1.072
ILIM = 1.18 × (RILIM
)
(1)
The units for the equation are amps for ILIM and kilohms for RILIM. For the TPS22950L, the device is only limiting
current during a short period of time. Therefore, the peak value of the current (ILIM,PEAK) may be more applicable
for system considerations. The equation for this parameter is below:
–1.042
ILIM,PEAK = 1.31 × (RILIM
)
(2)
The RILIM resistor is also used to set the high current detection threshold for the TPS22950L, and that equation
is shown below.
IHCD = (0.988 / RILIM) + 0.06
(3)
The units for the equation are amps for IHCD and kilohms for RILIM
.
9.3.4 Reverse Current Blocking (TPS22950, TPS22950C)
In a scenario where the device is enabled and VOUT is greater than VIN, there is potential for reverse current to
flow through the pass FET or the body diode. When the reverse current threshold is exceeded (about 900 mA),
there is a delay time (tRCB) before the switch turns off to stop the current flow. The switch remains off and block
reverse current as long as the reverse voltage condition exists. After VOUT has dropped below the release
voltage threshold (VRCB) the device turns back on. When the ON pin is pulled low, the device constantly blocks
reverse current.
9.4 Device Functional Modes
The tables below summarize the Device Functional Modes.
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表9-1. Output Connection Table
ON
L
Fault Condition
VOUT State
FLT State
N/A
Hi-Z
Hi-Z
Hi-Z
Hi-Z
L
H
None
VIN (via RON
Current Limited
Hi-Z
)
H
Output short
Thermal shutdown
Reverse current
H
H
Hi-Z
L
表9-2. Smart-ON Functional Modes (RPD,ON
)
ON
ON Pin
Pulldown active
No pulldown
≤VIL
≥VIH
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10 Application and Implementation
备注
以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
10.1 Application Information
This section highlights some of the design considerations when implementing this device in various applications.
10.2 Typical Application
This typical application demonstrates how the TPS22950x device can be used to set an adjustable current limit.
VOUT
VIN
ON
CIN
RL
CL
RFLT
Fault
+
-
H
VIN
FLT
ILIM
L
GND
RILIM
图10-1. Typical Application
10.2.1 Design Requirements
For this example, the values below are used as the design parameters.
表10-1. Design Parameters
PARAMETER
VALUE
Input Voltage (VIN)
Load Current (mA)
5 V
100 mA
500 mA
Typical Current Limit (mA)
10.2.2 Detailed Design Procedure
In this example the nominal load current is 100 mA, so the current limit can be set to 500 mA without disrupting
normal operation. Use 方程式4 to calculate the resistor needed on the ILIM pin.
–1.072
ILIM = 1.18 × (RILIM
)
(4)
where
• ILIM = Typical current limit setting
• RILIM = Resistor on the ILIM pin
Based on 方程式4, a 2.21-kΩresistor must be used on the ILIM pin to set a typical current limit of 500 mA.
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10.2.3 Application Curves
The below scope shot shows the device turning on into a fault condition and limiting the current to the specified
amount of 500 mA.
VOUT = GND
RILIM = 2.5 kΩ
图10-2. TPS22950 Turning On into an Output Short
10.3 Power Supply Recommendations
The device is designed to operate with a VIN range of 1.8 V to 5.5 V. The VIN power supply must be well
regulated and placed as close to the device terminal as possible. The power supply must be able to withstand all
transient load current steps. In most situations, using an input capacitance (CIN) of 1 μF is sufficient to prevent
the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to
respond to a large transient current or large load current step, additional bulk capacitance may be required on
the input.
10.4 Layout
10.4.1 Layout Guidelines
For best performance, all traces must be as short as possible. To be most effective, the input and output
capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects.
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10.4.2 Layout Example
To GPIO To GPIO
Via to VIN
RFLT
ON
FLT
VOUT
VIN
GND
ILIM
Via to GND
RILIM
图10-3. TPS22950x WCSP Layout Example
VIN
RFLT
From GPIO
ON
FLT
VIN
VOUT
GND
ILIM
Via to GND
RILIM
Via to GND
图10-4. TPS22950C SOT6 Layout Example
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11 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
11.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.4 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OUTLINE
YBH0006-C02
DSBGA - 0.4 mm max height
SCALE 12.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.4 MAX
SEATING PLANE
0.05 C
0.19
0.13
0.4
TYP
C
SYMM
D: Max = 1.126 mm, Min = 1.086 mm
E: Max = 0.726 mm, Min = 0.686 mm
0.8
B
TYP
0.4
TYP
A
1
2
0.225
6X
SYMM
0.185
0.015
C A B
4226594/A 03/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YBH0006-C02
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
6X ( 0.2)
1
2
A
(0.4) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 50X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
( 0.2)
METAL
(
0.2)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
(PREFERRED)
NON-SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4226594/A 03/2021
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
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EXAMPLE STENCIL DESIGN
YBH0006-C02
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
6X ( 0.21)
1
2
A
B
(0.4) TYP
SYMM
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.075 mm THICK STENCIL
SCALE: 50X
4226594/A 03/2021
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS22950CDDCR
TPS22950LYBHR
TPS22950YBHR
ACTIVE SOT-23-THIN
DDC
YBH
YBH
6
6
6
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
Call TI | SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
950C
4
Samples
Samples
Samples
ACTIVE
ACTIVE
DSBGA
DSBGA
SNAGCU
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Apr-2023
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS22950 :
Automotive : TPS22950-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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16-Mar-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS22950CDDCR
SOT-23-
THIN
DDC
6
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TPS22950LYBHR
TPS22950YBHR
DSBGA
DSBGA
YBH
YBH
6
6
3000
3000
180.0
180.0
8.4
8.4
0.8
0.8
1.21
1.21
0.43
0.43
2.0
2.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Mar-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS22950CDDCR
TPS22950LYBHR
TPS22950YBHR
SOT-23-THIN
DSBGA
DDC
YBH
YBH
6
6
6
3000
3000
3000
210.0
182.0
182.0
185.0
182.0
182.0
35.0
20.0
20.0
DSBGA
Pack Materials-Page 2
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