TPS22976NDPUT [TI]
具有可调节上升时间和可选输出放电功能的 2 通道、5.7V、6A、14mΩ 负载开关 | DPU | 14 | -40 to 105;
| 型号： | TPS22976NDPUT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有可调节上升时间和可选输出放电功能的 2 通道、5.7V、6A、14mΩ 负载开关 | DPU | 14 | -40 to 105 开关 |
| 文件： | 总32页 (文件大小：1372K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
TPS22976 5.7-V, 6-A, 14-mΩ On-Resistance Dual-Channel Load Switch
1 Features
3 Description
The TPS22976 product family consists of two
devices: TPS22976 and TPS22976N. Each device is
a dual-channel load switch with controlled turnon. The
device contains two N-channel MOSFETs that can
operate over an input voltage range of 0.6 V to 5.7 V,
and can support a maximum continuous current of 6
1
•
Integrated Dual-Channel Load Switch
Input Voltage Range: 0.6 V to VBIAS
VBIAS Voltage Range: 2.5 V to 5.7 V
On-resistance
•
•
•
–
RON = 14 mΩ (Typical)
A
per channel. Each switch is independently
at VIN = 0.6 V to 5 V, VBIAS = 5 V
controlled by an on and off input (ON1 and ON2),
which can interface directly with low-voltage control
signals. The TPS22976 is capable of thermal
shutdown when the junction temperature is above the
threshold, turning the switch off. The switch turns on
again when the junction temperature stabilizes to a
safe range. The TPS22976 also offers an optional
integrated 230-Ω on-chip load resistor for quick
output discharge when the switch is turned off.
–
RON = 18 mΩ (Typical)
at VIN = 0.6 V to 2.5 V, VBIAS = 2.5 V
•
•
6-A Maximum Continuous Switch Current per
Channel
Quiescent Current
–
37 µA (Typical, Both Channels)
at VIN = VBIAS = 5 V
–
35 µA (Typical, Single Channel)
at VIN = VBIAS = 5 V
The TPS22976 is available in a small, space-saving
3-mm
×
2-mm 14-SON package (DPU) with
integrated thermal pad allowing for high power
dissipation. The device is characterized for operation
over the free-air temperature range of –40°C to
105°C.
•
Control Input Threshold Enables Use of
1.2-, 1.8-, 2.5-, and 3.3-V Logic
Configurable Rise Time
•
•
•
•
•
Thermal Shutdown
Device Information(1)
Quick Output Discharge (QOD) (Optional)
SON 14-Pin Package with Thermal Pad
ESD Performance Tested per JESD 22
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS22976
TPS22976N
WSON (14)
3.00 mm × 2.00 mm
–
2-kV HBM and 1-kV CDM
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
•
•
•
Ultrabook™
Notebooks and Netbooks
Tablet PCs
Set-top Boxes and Residential Gateways
Telecom Systems
Solid-State Drives (SSD)
Application Circuit
VIN1
VOUT1
CT1
ON
OFF
Dual
ON1
CL
RL
CIN
Power
Supply
CT2
VBIAS
VIN2
GND
or
VOUT2
Dual
DC-DC
ON
OFF
Converter
ON2
CL
RL
CIN
GND
TPS22976
GND
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
Table of Contents
9.3 Feature Description................................................. 16
9.4 Device Functional Modes........................................ 17
10 Application and Implementation........................ 18
10.1 Application Information.......................................... 18
10.2 Typical Application ................................................ 20
11 Power Supply Recommendations ..................... 23
12 Layout................................................................... 23
12.1 Layout Guidelines ................................................. 23
12.2 Layout Example .................................................... 23
12.3 Power Dissipation ................................................. 23
13 Device and Documentation Support ................. 24
13.1 Device Support...................................................... 24
13.2 Documentation Support ........................................ 24
13.3 Receiving Notification of Documentation Updates 24
13.4 Community Resources.......................................... 24
13.5 Trademarks........................................................... 24
13.6 Electrostatic Discharge Caution............................ 24
13.7 Glossary................................................................ 24
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics—VBIAS = 5 V..................... 5
7.6 Electrical Characteristics—VBIAS = 2.5 V.................. 6
7.7 Switching Characteristics.......................................... 7
7.8 Typical DC Characteristics........................................ 8
7.9 Typical AC Characteristics...................................... 11
Parameter Measurement Information ................ 14
Detailed Description ............................................ 15
9.1 Overview ................................................................. 15
9.2 Functional Block Diagram ....................................... 16
8
9
14 Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
Changes from Revision A (March 2017) to Revision B
Page
•
Updated VIH in Recommended Operating Conditions ............................................................................................................ 4
Changes from Original (February 2016) to Revision A
Page
•
Updated statement for Equation 4 in Adjustable Rise Time section from "CT = 0 pF" to "CT < 100 pF"............................ 22
2
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
5 Device Comparison Table
RON AT VIN = VBIAS = 5 V
QUICK OUTPUT
DISCHARGE
MAXIMUM OUTPUT
ENABLE
DEVICE
(TYPICAL)
CURRENT
TPS22976
14 mΩ
Yes
No
6 A
6 A
Active high
Active high
TPS22976N
14 mΩ
6 Pin Configuration and Functions
DPU Package
14-Pin WSON with Exposed Thermal Pad
Top View
DPU Package
14-Pin WSON with Exposed Thermal Pad
Bottom View
14
1
1
2
14
VIN1
VIN1
VOUT1
VOUT1
VIN1
VOUT1
13
12
VOUT1
CT1
VIN1
ON1
3
4
CT1
ON1
Thermal
Pad
GND
VBIAS
11
10
GND
VBIAS
ON2
CT2
5
6
7
ON2
VIN2
CT2
VOUT2
9
8
VIN2
VIN2
VOUT2
VOUT2
VIN2
VOUT2
Pin Functions
PIN
I/O
DESCRIPTION
NO.
NAME
1
2
3
Switch 1 input. Recommended voltage range for these pins for optimal RON performance is 0.6 V to
VBIAS. Place an optional decoupling capacitor between these pins and GND to reduce VIN1 dip during
turnon of the channel. See the Application Information section for more information
VIN1
I
ON1
VBIAS
ON2
I
I
I
Active-high switch 1 control input. Do not leave floating
Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5 V to 5.7 V.
See the Application Information section
4
5
6
Active-high switch 2 control input. Do not leave floating
Switch 2 input. Recommended voltage range for these pins for optimal RON performance is 0.6 V to
VBIAS. Place an optional decoupling capacitor between these pins and GND to reduce VIN2 dip during
turnon of the channel. See the Application Information section for more information
VIN2
I
7
8
9
VOUT2
O
Switch 2 output
Switch 2 slew rate control. Can be left floating. Capacitor used on this pin must be rated for a
minimum of 25 V for desired rise time performance
10
11
12
CT2
GND
CT1
O
—
O
Ground
Switch 1 slew rate control. Can be left floating. Capacitor used on this pin must be rated for a
minimum of 25 V for desired rise time performance
13
14
VOUT1
O
Switch 1 output
Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See the Layout section for
layout guidelines
—
Thermal pad
—
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
MAX
6
UNIT(2)
VIN1,2
Input voltage
V
V
VOUT1,2 Output voltage
6
VON1,2
VBIAS
IMAX
IPLS
ON-pin voltage
6
V
Bias voltage
6
V
Maximum continuous switch current per channel
Maximum pulsed switch current per channel, pulse < 300 µs, 3% duty cycle
Maximum junction temperature
6
A
8
A
TJ
125
150
°C
°C
Tstg
Storage temperature
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
VBIAS
5.7
UNIT
VIN1,2
Input voltage
Bias voltage
ON voltage
0.6
2.5
0
V
V
V
V
VBIAS
VON1,2
VOUT1,2
5.7
Output voltage
VIN
VBIAS = 2.5 V to 5 V, TA< 85°C
VBIAS = 2.5 V to 5.7 V, TA< 105°C
VBIAS = 2.5 V to 5.7 V
1.05
1.2
0
5.7
VIH
High-level input voltage, ON
V
5.7
VIL
Low-level input voltage, ON
Input capacitor
0.5
V
CIN1,2
TA
1(1)
µF
°C
(2)
Operating free-air temperature
–40
105
(1) See the Input Capacitor (Optional) section.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the
maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)
)
7.4 Thermal Information
TPS22976
DPU (WSON)
14 PINS
50.8
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
52.3
18.4
ψJT
1.6
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
Thermal Information (continued)
TPS22976
THERMAL METRIC(1)
DPU (WSON)
14 PINS
18.6
UNIT
ψJB
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
°C/W
°C/W
RθJC(bot)
6.5
7.5 Electrical Characteristics—VBIAS = 5 V
Unless otherwise noted, the specifications in the following table applies where VBIAS = 5 V. Typical values are for TA = 25°C
PARAMETER
TEST CONDITIONS
TA
MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
VBIAS quiescent current (both
channels)
IOUT1 = IOUT2 = 0 mA,
VIN1,2 = VON1,2 = 5 V
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +105°C
37
35
48
49
µA
IQ,VBIAS
43
IOUT1 = IOUT2 = 0 mA, VON2 = 0 V
VIN1,2 = VON1 = 5 V
VBIAS quiescent current (single
channel)
µA
µA
44
ISD,VBIAS
ISD,VIN
ION
VBIAS shutdown current
VON1,2 = 0 V, VVOUT1,2 = 0 V
VIN = 5 V
1.37
.005
2.3
5.5
11.3
1.4
3.4
0.5
1.4
0.3
0.8
0.1
.002
.002
.001
VIN = 3.3 V
VON = 0 V,
VOUT = 0 V
VIN shutdown current (per channel)
µA
µA
VIN = 1.8 V
VIN = 0.6 V
ON-pin input leakage current
VON = 5.5 V
RESISTANCE CHARACTERISTICS
25°C
–40°C to +85°C
–40°C to +105°C
25°C
14
14
14
14
14
14
90
18
22
23
18
22
23
18
22
23
18
22
23
18
22
23
18
22
23
VIN = 5 V
VIN = 3.3 V
VIN = 1.8 V
VIN = 1.2 V
VIN = 1.05 V
VIN = 0.6 V
–40°C to +85°C
–40°C to +105°C
25°C
–40°C to +85°C
–40°C to +105°C
25°C
RON
On-state resistance (per channel) IOUT = –200 mA
mΩ
–40°C to +85°C
–40°C to +105°C
25°C
–40°C to +85°C
–40°C to +105°C
25°C
–40°C to +85°C
–40°C to +105°C
25°C
VON,HYS
ON-pin hysteresis
VIN = 5 V
mV
Ω
(1)
RPD
Output pulldown resistance
Thermal shutdown
VIN = VOUT = 5 V, VON = 0 V
Junction temperature rising
Junction temperature falling
–40°C to +105°C
—
230 280
160
TSD
ºC
ºC
TSD,HYS
Thermal-shutdown hysteresis
—
20
(1) Not present in TPS22976N
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
7.6 Electrical Characteristics—VBIAS = 2.5 V
Unless otherwise noted, the specifications in the following table applies where VVBIAS = 2.5 V. Typical values are for TA =
25°C
PARAMETER
TEST CONDITIONS
TA
MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
VBIAS quiescent current (both
channels)
IOUT1 = IOUT2 = 0 mA,
VIN1,2 = VON1,2 = 2.5 V
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +105°C
15
14
20
20
µA
IQ,VBIAS
19
IOUT1 = IOUT2 = 0 mA, VON2 = 0 V
VIN1,2 = VON1 = 2.5 V
VBIAS quiescent current (single
channel)
µA
µA
19
ISD,VBIAS
ISD,VIN
ION
VBIAS shutdown current
VON1,2 = 0 V, VVOUT1,2 = 0 V
VIN = 2.5 V
.58
1.1
0.8
2.1
0.5
1.4
0.3
1
.005
.002
.002
.001
VIN = 1.8 V
VON = 0 V,
VOUT = 0 V
VIN shutdown current (per channel)
ON-pin input leakage current
µA
µA
VIN = 1.05 V
0.3
0.8
0.1
VIN = 0.6 V
VON = 5.5 V
RESISTANCE CHARACTERISTICS
25°C
–40°C to +85°C
–40°C to +105°C
25°C
18
16
16
16
16
15
70
23
28
30
23
28
29
22
27
28
21
26
28
21
25
27
20
25
26
VIN = 2.5 V
VIN = 1.8 V
VIN = 1.5 V
VIN = 1.2 V
VIN = 1.05 V
VIN = 0.6 V
–40°C to +85°C
–40°C to +105°C
25°C
–40°C to +85°C
–40°C to +105°C
25°C
RON
On-state resistance (per channel) IOUT = –200 mA
mΩ
–40°C to +85°C
–40°C to +105°C
25°C
–40°C to +85°C
–40°C to +105°C
25°C
–40°C to +85°C
–40°C to +105°C
25°C
VON,HYS
ON-pin hysteresis
VIN = 2.5 V
mV
Ω
(1)
RPD
Output pulldown resistance
Thermal shutdown
VIN = VOUT = 2.5 V, VON = 0 V
Junction temperature rising
Junction temperature falling
–40°C to +105°C
—
250 330
160
TSD
ºC
ºC
TSD,HYS
Thermal-shutdown hysteresis
—
20
(1) Not present in TPS22976N
6
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
7.7 Switching Characteristics
PARAMETER
TEST CONDITION
MIN
TYP
MAX UNIT
VIN = VON = VBIAS = 5 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turnon time
Turnoff time
VOUT rise time
VOUT fall time
ON delay time
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
1490
3
1770
2
µs
tF
tD
620
VIN = 0.6 V, VON = VBIAS = 5 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turnon time
Turnoff time
VOUT rise time
VOUT fall time
ON delay time
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
620
3
285
2
µs
µs
µs
tF
tD
460
VIN = 2.5 V, VON = 5 V, VBIAS = 2.5 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turnon time
Turnoff time
VOUT rise time
VOUT fall time
ON delay time
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
2350
4
2275
2
tF
tD
1210
VIN = 0.6 V, VON = 5 V, VBIAS = 2.5 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turnon time
Turnoff time
VOUT rise time
VOUT fall time
ON delay time
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
RL = 10 Ω, CL = 0.1 µF, CT = 1000 pF
1410
5
700
2
tF
tD
1030
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
7.8 Typical DC Characteristics
60
60
50
40
30
20
10
-40èC
25èC
-40èC
25èC
85èC
105èC
85èC
50
105èC
40
30
20
10
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
Bias Voltage (V)
Bias Voltage (V)
D001
D002
VIN1 = VIN2 = VBIAS
VON1 = VON2 = 5 V
VOUT = Open
VIN1 = VBIAS
VON1 = 5 V
VOUT = Open
Figure 1. VBIAS Quiescent Current vs Bias Voltage
Both Channels
Figure 2. VBIAS Quiescent Current vs Bias Voltage
Single Channel
0.4
2.5
-40èC
25èC
85èC
105èC
-40èC
25èC
85èC
105èC
0.35
0.3
2
1.5
1
0.25
0.2
0.15
0.1
0.05
0
0.5
0
-0.05
2.5
3
3.5
4
4.5
5
5.5
0.6
1.1
1.6
2.1
2.6
3.1
3.6
4.1
4.6
5
Bias Voltage (V)
Input Voltage (V)
D003
D004
VIN1 = VIN2 = VBIAS
VON1 = VON2 = 0 V
VOUT = 0 V
VBIAS = 5 V
VON = 0 V
VOUT = 0 V
Note: –40°C and 25°C curves have similar values,
Figure 3. VBIAS Shutdown Current vs Bias Voltage
Both Channels
therefore only one line is visible.
Figure 4. Off-State VIN Current vs Input Voltage
Single Channel
25
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
VIN = 0.6 V
VIN = 0.8 V
VIN = 1.05 V
VIN = 1.2 V
VIN = 1.8 V
VIN = 2.5 V
VIN = 0.6 V
VIN = 1.05 V
VIN = 1.8 V
VIN = 2.5 V
VIN = 3.3 V
VIN = 5 V
20
15
10
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature (èC)
Ambient Temperature (èC)
D005
D0056
VBIAS = 2.5 V
IOUT = –200 mA
VON = 5 V
VBIAS = 5 V
IOUT = –200 mA
VON = 5 V
Note: All RON curves have similar values,
Figure 5. On-Resistance vs Ambient Temperature
Single Channel
therefore only one line is visible.
Figure 6. On-Resistance vs Ambient Temperature
Single Channel
8
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
Typical DC Characteristics (continued)
25
26
24
22
20
18
16
14
12
10
-40èC
25èC
85èC
105èC
-40èC
25èC
85èC
105èC
20
15
10
0.6
1
1.4
1.8
2.2
2.5
0.6
1.1
1.6
2.1
2.6
3.1
3.6
4.1
4.6
5
Input Voltage (V)
Input Voltage (V)
D007
D008
VBIAS = 2.5 V
IOUT = –200 mA
VON = 5 V
VBIAS = 5 V
IOUT = –200 mA
VON = 5 V
Figure 7. On-Resistance vs Input Voltage
Figure 8. On-Resistance vs Input Voltage
Single Channel - Across Ambient Temperatures
Single Channel - Across Ambient Temperatures
260
255
250
245
240
235
230
225
220
215
18
17
16
15
14
13
12
-40èC
25èC
85èC
105èC
VBias = 2.5 V
VBias = 3.3 V
VBias = 5 V
VBias = 5.7 V
0.6 1.1 1.6 2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6
Input Voltage (V)
2.5
3
3.5
4
4.5
5
5.5
Bias Voltage (V)
D011
D012
VIN = 2.5 V
VON = 0 V
TA = 25°C
Note: VBIAS = 5 V and 5.7 V curves have similar
Figure 10. Pulldown Resistance vs Bias Voltage
Single Channel
values, therefore only one line is visible.
Figure 9. On-Resistance vs Input Voltage
Single Channel - Across VBIAS
1
0.95
0.9
0.9
-40èC
25èC
85èC
105èC
-40èC
25èC
85èC
105èC
0.85
0.8
0.85
0.8
0.75
0.7
0.75
0.65
0.7
0.6
2.5
3
3.5
4
4.5
5
5.5
2.5
3
3.5
4
4.5
5
5.5
Bias Voltage (V)
Bias Voltage (V)
D013
D014
VIN = VBIAS
VIN = VBIAS
Figure 11. High-Level Input Voltage vs Bias Voltage
Figure 12. Low-Level Input Voltage vs Bias Voltage
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
Typical DC Characteristics (continued)
140
120
100
80
60
40
20
0
-40èC
25èC
85èC
105èC
2.5
3
3.5
4
4.5
5
5.5
Bias Voltage (V)
D015
VIN = VBIAS
Figure 13. Voltage Input Hysteresis vs Bias Voltage
10
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
7.9 Typical AC Characteristics
TA = 25°C, CT = 1000 pF, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VON = 5 V
800
700
600
500
400
300
200
100
0
1600
1400
1200
1000
800
600
400
200
0
-40èC
25èC
85èC
105èC
-40èC
25èC
85èC
105èC
0.6 0.8
1
1.2 1.4 1.6 1.8
Input Voltage (V)
2
2.2 2.4
0.6
1.1
1.6
2.1
2.6
3.1
3.6
4.1
4.6
5
Input Voltage (V)
D016
D017
VBIAS = 2.5 V
VBIAS = 5 V
Figure 14. Delay Time vs Input Voltage
Figure 15. Delay Time vs Input Voltage
3
2.5
2
3
2.5
2
1.5
1
1.5
1
-40èC
-40èC
25èC
85èC
105èC
25èC
85èC
105èC
0.5
0.5
0
0
0.6
1
1.4
1.8
2.2
2.5
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Input Voltage (V)
Input Voltage (V)
D018
D019
VBIAS = 2.5 V
VBIAS = 5 V
Figure 16. Fall Time vs Input Voltage
Figure 17. Fall Time vs Input Voltage
5
4
3
2
1
0
5
4.5
4
-40èC
25èC
85èC
105èC
3.5
3
2.5
2
1.5
1
-40èC
25èC
85èC
105èC
0.5
0
0.6 0.8
1
1.2 1.4 1.6 1.8
Input Voltage (V)
2
2.2 2.4
0.6
1.1
1.6
2.1
2.6
3.1
3.6
4.1
4.6
5
Input Voltage (V)
D020
D021
VBIAS = 2.5 V
VBIAS = 5 V
Figure 18. Turnoff Time vs Input Voltage
Figure 19. Turnoff Time vs Input Voltage
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
Typical AC Characteristics (continued)
TA = 25°C, CT = 1000 pF, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VON = 5 V
3000
2500
2000
1500
1000
500
1800
-40èC
25èC
85èC
105èC
1600
1400
1200
1000
800
600
400
200
0
-40èC
25èC
85èC
105èC
0
0.6 0.8
1
1.2 1.4 1.6 1.8
Input Voltage (V)
2
2.2 2.4
0.6
1
1.4 1.8 2.2 2.6
3
3.4 3.8 4.2 4.6
5
Input Voltage (V)
D022
D023
VBIAS = 2.5 V
VBIAS = 5 V
Figure 20. Turnon Time vs Input Voltage
Figure 21. Turnon Time vs Input Voltage
3000
2500
2000
1500
1000
500
2500
2000
1500
1000
500
-40èC
25èC
85èC
105èC
-40èC
25èC
85èC
105èC
0
0
0.6 0.8
1
1.2 1.4 1.6 1.8
Input Voltage (V)
2
2.2 2.4
0.6
1
1.4 1.8 2.2 2.6
3
3.4 3.8 4.2 4.6
5
Input Voltage (V)
D024
D025
VBIAS = 5 V
VBIAS = 2.5 V
Figure 22. Rise Time vs Input Voltage
Figure 23. Rise Time vs Input Voltage
VIN = 0.6 V
VBIAS = 2.5 V
VIN = 0.6 V
VBIAS = 5 V
Figure 24. Turnon Response Time
Figure 25. Turnon Response Time
12
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
Typical AC Characteristics (continued)
TA = 25°C, CT = 1000 pF, CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VON = 5 V
VIN = 2.5 V
VBIAS = 2.5 V
VIN = 5 V
VBIAS = 5 V
Figure 26. Turnon Response Time
Figure 27. Turnon Response Time
VIN = 0.6 V
VBIAS = 2.5 V
VIN = 0.6 V
VBIAS = 5 V
Figure 28. Turnoff Response Time
Figure 29. Turnoff Response Time
VIN = 2.5 V
VBIAS = 2.5 V
VIN = 5 V
VBIAS = 5 V
Figure 30. Turnoff Response Time
Figure 31. Turnoff Response Time
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
8 Parameter Measurement Information
VIN
VOUT
CT1, 2
CIN = 1µF
VBIAS
CL
+
_
RL
ON
+
_
ON
GND
TPS22976
GND
GND
OFF
Single Channel Shown for Clarity
Figure 32. Test Circuit
VON
50%
50%
tf
tOFF
tr
tON
90%
90%
VOUT
VOUT
50%
10%
50%
10%
10%
tD
Figure 33. tON and tOFF Waveforms
14
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
9 Detailed Description
9.1 Overview
The TPS22976 is a 5.7-V, dual-channel, 14-mΩ (typical) RON load switch in a 14-pin WSON package. Each
channel can support a maximum continuous current of 6 A and is controlled by an on and off GPIO-compatible
input. To reduce the voltage drop in high current rails, the device implements N-channel MOSFETs. Note that the
ON pins must be connected and cannot be left floating. The device has a configurable slew rate for applications
that require specific rise-time, which controls the inrush current. By controlling the inrush current, power supply
sag can be reduced during turnon. Furthermore, the slew rate is proportional to the capacitor on the CT pin. See
the Adjustable Rise Time section to determine the correct CT value for a desired rise time.
The internal circuitry is powered by the VBIAS pin, which supports voltages from 2.5 V to 5.7 V. This circuitry
includes the charge pump, QOD (optional), and control logic. When a voltage is applied to VBIAS, and the ON1,2
pins transition to a low state, the QOD functionality is activated. This connects VOUT1 and VOUT2 to ground
through the on-chip resistor. The typical pulldown resistance (RPD) is 230 Ω.
During the off state, the device prevents downstream circuits from pulling high standby current from the supply.
The integrated control logic, driver, power supply, and output discharge FET eliminates the need for any external
components, reducing solution size and bill of materials (BOM) count.
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
9.2 Functional Block Diagram
VIN1
ON1
CT1
Control Logic
VOUT1
Not Present in
TPS22976N
GND
VBIAS
Charge Pump
Not Present in
TPS22976N
VOUT2
CT2
ON2
VIN2
Control Logic
Copyright © 2016, Texas Instruments Incorporated
Figure 34. TPS22976 Functional Block Diagram
9.3 Feature Description
9.3.1 ON and OFF Control
The ON pins control the state of the switch. Asserting ON high enables the switch. ON is active high with a low
threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO
logic threshold. It can be used with any microcontroller with 1.2 V or higher GPIO voltage. This pin cannot be left
floating and must be tied either high or low for proper functionality.
16
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
Feature Description (continued)
9.3.2 Input Capacitor (Optional)
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a
discharged load capacitor, a capacitor needs to be placed between VIN and GND. A 1-µF ceramic capacitor, CIN,
placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop
during high-current application. When switching heavy loads, it is recommended to have an input capacitor about
10 times higher than the output capacitor to avoid excessive voltage drop.
9.3.3 Output Capacitor (Optional)
Due to the integrated body diode in the NMOS switch, a CIN greater than CL is highly recommended. A CL
greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current
flow through the body diode from VOUT to VIN. A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN
dip caused by inrush currents during startup, however a 10 to 1 ratio for capacitance is not required for proper
functionality of the device. A ratio smaller than 10 to 1 (such as 1 to 1) could cause slightly more VIN dip upon
turnon due to inrush currents. This can be mitigated by increasing the capacitance on the CT pin for a longer rise
time. (See the Adjustable Rise Time section).
9.3.4 Quick Output Discharge (QOD) (Not Present in TPS22976N)
The TPS22976 includes a QOD feature. When the switch is disabled, an internal discharge resistance is
connected between VOUT and GND to remove the remaining charge from the output. This resistance prevents
the output from floating while the switch is disabled. For best results, it is recommended that the device gets
disabled before VBIAS falls below the minimum recommended voltage.
9.3.5 Thermal Shutdown
Thermal Shutdown protects the part from internally or externally generated excessive temperatures. When the
device temperature exceeds TSD (typical 160°C), the switch is turned off. The switch automatically turns on again
if the temperature of the die drops 20 degrees below the TSD threshold.
9.4 Device Functional Modes
Table 1 lists the TPS22976 functions.
Table 1. TPS22976 Functions Table
ON
L
VIN to VOUT
VOUT
GND
VIN
Off
On
H
Table 2 lists the TPS22976N functions.
Table 2. TPS22976N Functions Table
ON
VIN to VOUT
VOUT
L
Off
On
Floating
VIN
H
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
This section highlights some of the design considerations for implementing the device in various applications. A
PSPICE model for this device is also available on the product page for additional information.
10.1.1 Parallel Configuration
To increase current capabilities and to lower RON, both channels can be placed in parallel as seen in Figure 35.
With this configuration, the CT1 and CT2 pins can be tied together to use one capacitor, CT.
See the TPS22966 Dual-Channel Load Switch in Parallel Configuration application report and Parallel Load
Switches for Higher Output Current & Reduced ON-Resistance Design Guide for more information.
VBIAS
VOUT1
CT1
VIN1
ON1
System
Module
Power
Source
TPS22976
VOUT2
CT2
VIN2
ON2
µC GPIO
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 35. Parallel Configuration
10.1.2 Standby Power Reduction
Battery powered end equipments often have strict power budgets, in which there is a need to reduce current
consumption. The TPS22976 significantly reduces system current consumption by disabling the supply voltage to
subsystems in standby states. Alternatively, the TPS22976 reduces the leakage current overhead of the modules
in standby mode as achieved in Figure 36. Note that standby power reduction can be achieved on either
channel, as well as dual-channel operation.
18
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
Application Information (continued)
Always ON
Module
VBIAS
VIN1
VOUT1
Power
Source
TPS22976
GND
ON1
CT1
Standby
Module
µC GPIO
Single channel shown for clarity.
Copyright © 2016, Texas Instruments Incorporated
Figure 36. Standby Power Reduction
10.1.3 Power Supply Sequencing without GPIO Input
Sequential startup of several subsystems is often burdensome and adds complexity for several end equipments.
The TPS22976 provides a power sequencing solution that reduces the overall system complexity, as seen in
Figure 37.
µC GPIO
VBIAS
VOUT1
CT1
VIN1
ON1
Module 1
Power
Source
TPS22976
VOUT2
CT2
VIN2
ON2
Power
Source
Module 2
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 37. Power Sequencing without a GPIO Input
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
19
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
Application Information (continued)
10.1.4 Reverse Current Blocking
Reverse current blocking is often desired in specific applications, as it prevents current from flowing from the
output to the input of the load switch when the device is disabled. With the configuration illustrated in Figure 38,
the TPS22976 can be converted into a single-channel switch with reverse current blocking. VIN1 or VIN2 can be
used as the input and VIN2 or VIN1 as the output.
VBIAS
VOUT1
CT1
VIN1
ON1
Power
Source
TPS22976
VOUT2
CT2
VIN2
ON2
System
Module
GND
µC GPIO
Copyright © 2016, Texas Instruments Incorporated
Figure 38. Reverse Current Blocking
10.2 Typical Application
This application demonstrates how the TPS22976 can be used to limit the inrush current when powering on
downstream modules.
VIN1
ON1
VOUT1
CT1
ON
OFF
Dual
CL
RL
CIN
Power
Supply
CT2
VBIAS
VIN2
GND
or
VOUT2
Dual
DC-DC
ON
OFF
Converter
ON2
CL
RL
CIN
GND
TPS22976
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 39. Typical Application Circuit
20
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
Typical Application (continued)
10.2.1 Design Requirements
Table 3 shows the TPS22976 design parameters.
Table 3. Design Parameters
DESIGN PARAMETER
Input voltage
VALUE
3.3 V
Bias voltage
5 V
Load capacitance (CL)
Maximum acceptable inrush current
22 µF
400 mA
10.2.2 Detailed Design Procedure
10.2.2.1 Inrush Current
When the switch is enabled, the output capacitors must be charged up from 0 V to the set value (3.3 V in this
example). This charge arrives in the form of inrush current. Inrush current can be calculated using Equation 1.
Inrush Current = C × dV/dt
where
•
•
•
C is the output capacitance
dV is the output voltage
dt is the rise time
(1)
The TPS22976 offers adjustable rise time for VOUT. This feature allows the user to control the inrush current
during turnon. The appropriate rise time can be calculated using Table 3 and the inrush current equation. See
Equation 2 and Equation 3.
400 mA = 22 μF × 3.3 V/dt
dt = 181.5 μs
(2)
(3)
To ensure an inrush current of less than 400 mA, choose a CT value that yields a rise time of more than 181.5
μs. See the oscilloscope captures in the Application Curves section for an example of how the CT capacitor can
be used to reduce inrush current.
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
21
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
10.2.2.2 Adjustable Rise Time
A capacitor to GND on the CT pins sets the slew rate for each channel. To ensure desired performance, a
capacitor with a minimum voltage rating of 25 V must be used on either CT pins. An approximate formula for the
relationship between CT and slew rate is shown in Equation 4.
Equation 4 accounts for 10% to 90% measurement on VOUT and does not apply for CT < 100 pF. Use Table 4 to
determine rise times for when CT = 0 pF):
SR = 0.42 × CT + 66
where
•
•
•
SR is the slew rate (in µs/V)
CT is the capacitance value on the CT pin (in pF)
The units for the constant 66 is in µs/V.
(4)
Rise time can be calculated by multiplying the input voltage by the slew rate. Table 4 shows rise time values
measured on a typical device. Rise times shown below are only valid for the power-up sequence where VIN and
VBIAS are already in steady state condition, and the ON pin is asserted high.
Table 4. Rise Time Values
RISE TIME (µs) 10% - 90%, CL = 0.1 µF, CIN = 1 µF, RL = 10 Ω(1)
CT (pF)
5 V
149
3.3 V
112
1.8 V
77
1.5 V
70
1.2 V
60
1.05 V
56
0.6 V
42
0
220
548
388
236
206
173
154
103
169
286
627
1249
2526
470
968
673
401
342
289
256
1000
2200
4700
10000
1768
3916
8040
16520
1220
2678
5477
11150
711
608
505
445
1554
3179
6410
1332
2691
5401
1097
2240
4430
949
1964
3933
(1) TYPICAL VALUES at 25°C, VBIAS = 5 V, 25 V X7R 10% CERAMIC CAP
10.2.3 Application Curves
VBIAS = 5 V ; VIN = 3.3 V ; CL = 22 μF
Figure 40. Inrush Current With CT = 0 pF
Figure 41. Inrush Current With CT = 220 pF
22
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
TPS22976
www.ti.com
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
11 Power Supply Recommendations
The device is designed to operate from a VBIAS range of 2.5 V to 5.7 V and a VIN range of 0.6 V to VBIAS
.
12 Layout
12.1 Layout Guidelines
For best performance, all traces must be as short as possible. To be most effective, the input and output
capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects
along with minimizing the case to ambient thermal impedance.
12.2 Layout Example
Notice the thermal vias located under the exposed thermal pad of the device. This allows for thermal diffusion
away from the device.
VOUT1 capacitor
VIN1 capacitor
CT1 capacitor
Thermal
relief vias
VIN2 capacitor
CT2 capacitor
VOUT2 capacitor
Figure 42. PCB Layout Example
12.3 Power Dissipation
The maximum IC junction temperature must be restricted to 125°C under normal operating conditions. To
calculate the maximum allowable power dissipation, PD(max) for a given output current and ambient temperature,
use Equation 5.
TJ(max) - TA
=
P
D(max)
θJA
where
•
•
•
•
PD(max) is the maximum allowable power dissipation
TJ(max) is the maximum allowable junction temperature (125°C for the TPS22976)
TA is the ambient temperature of the device
θJA is the junction to air thermal impedance. See the Thermal Information section. This parameter is highly
dependent upon board layout.
(5)
23
Copyright © 2016–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS22976
TPS22976
SLVSDE7B –NOVEMBER 2016–REVISED SEPTEMBER 2017
www.ti.com
13 Device and Documentation Support
13.1 Device Support
13.1.1 Developmental Support
For the TPS22976N PSpice Transient Model, see SLVMBV5.
For the TPS22976 PSpice Transient Model, see SLVMBV6.
13.2 Documentation Support
13.2.1 Related Documentation
For related documentation see the following:
TPS22976 Evaluation Module User's Guide
13.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.5 Trademarks
E2E is a trademark of Texas Instruments.
Ultrabook is a trademark of Intel.
All other trademarks are the property of their respective owners.
13.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most-
current data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.
24
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TPS22976
PACKAGE OPTION ADDENDUM
www.ti.com
16-Sep-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
3000
3000
250
(1)
(2)
(3)
(4/5)
(6)
TPS22976ADPUR
TPS22976DPUR
TPS22976DPUT
TPS22976NDPUR
TPS22976NDPUT
PREVIEW
WSON
WSON
WSON
WSON
WSON
DPU
14
14
14
14
14
Green (RoHS
& no Sb/Br)
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
22976A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DPU
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
22976
DPU
Green (RoHS
& no Sb/Br)
22976
DPU
3000
250
Green (RoHS
& no Sb/Br)
22976N
22976N
DPU
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Sep-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Aug-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS22976DPUR
TPS22976DPUT
TPS22976NDPUR
TPS22976NDPUT
TPS22976NDPUT
WSON
WSON
WSON
WSON
WSON
DPU
DPU
DPU
DPU
DPU
14
14
14
14
14
3000
250
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
2.25
2.25
2.25
2.25
2.25
3.25
3.25
3.25
3.25
3.25
1.05
1.05
1.05
1.05
1.05
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
3000
250
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Aug-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS22976DPUR
TPS22976DPUT
TPS22976NDPUR
TPS22976NDPUT
TPS22976NDPUT
WSON
WSON
WSON
WSON
WSON
DPU
DPU
DPU
DPU
DPU
14
14
14
14
14
3000
250
210.0
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
3000
250
250
Pack Materials-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
相关型号：
TPS22976_V01
TPS22976 5.7-V, 6-A, 14-mΩ On-Resistance Dual-Channel Load SwitchWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22980
3.3V TO 18V MUX with Overcurrent LimitWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22980RGPR
3.3V TO 18V MUX with Overcurrent LimitWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22981
3.3V to 18V Thunderbolt Power MuxWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22981RGPR
3.3V to 18V Thunderbolt Power MuxWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22981RGPT
Thunderbolt Power MuxWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22985
Thunderbolt? SUPPLY SELECTION ICWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22985YFP
Thunderbolt? SUPPLY SELECTION ICWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22985YFPR
Thunderbolt? SUPPLY SELECTION ICWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22986
Thunderbolt Supply Selection ICWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22986YFPR
Thunderbolt Supply Selection ICWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
TPS22990
具有可调节上升时间、电源正常指示和可选输出放电功能的 5.5V、10A、3.9mΩ 负载开关Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
TI
©2020 ICPDF网 联系我们和版权申明