TPS2330 [TI]

SINGLE HOT SWAP POWER CONTROLLER WITH CIRCUIT BREAKER AND POWER-GOOD REPORTING; 带断路器和电源良好报告单一热插拔电源控制器
TPS2330
型号: TPS2330
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SINGLE HOT SWAP POWER CONTROLLER WITH CIRCUIT BREAKER AND POWER-GOOD REPORTING
带断路器和电源良好报告单一热插拔电源控制器

断路器 功率控制 控制器
文件: 总20页 (文件大小:346K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
D OR PW PACKAGE  
(TOP VIEW)  
features  
Single-Channel High-Side MOSFET Driver  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
GATE  
DGND  
TIMER  
VREG  
VSENSE  
AGND  
ISENSE  
DISCH  
ENABLE  
PWRGD  
FAULT  
ISET  
Input Voltage: 3 V to 13 V  
Inrush Current Limiting With dv/dt Control  
Circuit-Breaker Control With Programmable  
Current Limit and Transient Timer  
AGND  
IN  
Power-Good Reporting With Transient  
Filter  
8
CMOS- and TTL-Compatible Enable Input  
NOTE: Terminal 13 is active high on TPS2331.  
Low 5-µA Standby Supply Current . . . Max  
typical application  
Available in 14-Pin SOIC and TSSOP  
Package  
V
O
+
VIN  
40°C to 85°C Ambient Temperature Range  
3 V – 13 V  
DISCH  
IN  
ISET  
GATE  
ISENSE  
Electrostatic Discharge Protection  
VSENSE  
VREG  
applications  
AGND  
DGND  
Hot-Swap/Plug/Dock Power Management  
Hot-Plug PCI, Device Bay  
TPS2330  
PWRGD  
FAULT  
TIMER  
Electronic Circuit Breaker  
ENABLE  
description  
The TPS2330 and TPS2331 are single-channel hot-swap controllers that use external N-channel MOSFETs  
as high-side switches in power applications. Features of these devices, such as overcurrent protection (OCP),  
inrush-current control, output-power status reporting, and separation of load transients from actual load  
increases, are critical requirements for hot-swap applications.  
The TPS2330/31 devices incorporate undervoltage lockout (UVLO) and power-good (PG) reporting to ensure  
the device is off at start-up and confirm the status of the output voltage rails during operation. An internal charge  
pump, capableofdrivingmultipleMOSFETs, providesenoughgate-drivevoltagetofullyenhancetheN-channel  
MOSFETs. The charge pump controls both the rise times and fall times (dv/dt) of the MOSFETs, reducing power  
transients during power up/down. The circuit-breaker functionality combines the ability to sense overcurrent  
conditions with a timer function; this allows designs such as DSPs, that may have high peak currents during  
power-state transitions, to disregard transients for a programmable period.  
AVAILABLE OPTIONS  
PACKAGES  
PIN  
COUNT  
T
A
HOT-SWAP CONTROLLER DESCRIPTION  
ENABLE  
ENABLE  
Dual-channel with independent OCP and adjustable PG  
Dual-channel with interdependent OCP and adjustable PG  
20  
20  
TPS2300IPW  
TPS2310IPW  
TPS2301IPW  
TPS2311IPW  
TPS2320ID  
TPS2320IPW  
TPS2321ID  
TPS2321IPW  
40°C to 85°C  
Dual-channel with independent OCP  
16  
14  
TPS2330ID  
TPS2330IPW  
TPS2331ID  
TPS2331IPW  
Single-channel with OCP and adjustable PG  
The packages are available left-end taped and reeled (indicated by the R suffix on the device type; e.g., TPS2331IPWR).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2000, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
functional block diagram  
IN  
PREREG  
ISET  
ISENSE  
GATE  
Clamp  
DISCH  
VREG  
dv/dt Rate  
Protection  
Charge  
Pump  
Circuit  
Breaker  
50 µA  
Pulldown FET  
Circuit Breaker  
UVLO and  
Power-Up  
VSENSE  
PWRGD  
AGND  
DGND  
75 µA  
20-µs Deglitch  
FAULT  
TIMER  
Logic  
ENABLE  
50-µs Deglitch  
Terminal Functions  
TERMINAL  
NAME  
I/O  
DESCRIPTION  
NO.  
AGND  
6,9  
2
I
I
Analog ground, connects to DGND as close as possible  
Digital ground  
DGND  
DISCH  
14  
13  
11  
1
O
I
Discharge transistor  
ENABLE/ ENABLE  
FAULT  
Active low (TPS2330) or active high enable (TPS2331)  
Overcurrent fault, open-drain output  
Connects to gate of high-side MOSFET  
Input voltage  
O
O
I
GATE  
IN  
8
ISENSE  
ISET  
7
I
Current-sense input  
10  
12  
3
I
Adjusts circuit-breaker threshold with resistor connected to IN  
PWRGD  
TIMER  
O
O
O
I
Open-drain output, asserted low when VSENSE voltage is less than reference.  
Adjusts circuit-breaker deglitch time  
VREG  
4
Connects to bypass capacitor, for stable operation  
Power-good sense input  
VSENSE  
5
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
detailed description  
DISCH – DISCH should be connected to the source of the external N-channel MOSFET transistor connected  
to GATE. This pin discharges the load when the MOSFET transistor is disabled. They also serve as  
reference-voltage connection for internal gate-voltage-clamp circuitry.  
ENABLE or ENABLE – ENABLE for TPS2330 is active low. ENABLE for TPS2331 is active high. When the  
controller is enabled, GATE voltage will power up to turn on the external MOSFETs. When the ENABLE pin is  
pulled high for TPS2330 or the ENABLE pin is pulled low for TPS2331 for more than 50 µs, the gate of the  
MOSFET is discharged at a controlled rate by a current source, and a transistor is enabled to discharge the  
output bulk capacitance. In addition, the device turns on the internal regulator PREREG (see VREG) when  
enabled and shuts down PREREG when disabled so that total supply current is much less than 5 µA.  
FAULT – FAULT is an open-drain overcurrent flag output. When an overcurrent condition is sustained long  
enough to charge TIMER to 0.5 V, the device latches off and pulls FAULT low.  
GATE – GATE connects to the gate of the external N-channel MOSFET transistor. When the device is enabled,  
internal charge-pump circuitry pulls this pin up by sourcing approximately 15 µA. The turnon slew rates depend  
upon the capacitance present at the GATE terminal. If desired, the turnon slew rates can be further reduced  
by connecting capacitors between this pin and ground. These capacitors also reduce inrush current and protect  
the device from false overcurrent triggering during powerup. The charge-pump circuitry will generate  
gate-to-source voltages of 9 V–12 V across the external MOSFET transistor.  
IN – IN should be connected to the power source driving the external N-channel MOSFET transistor connected  
toGATE. TheTPS2330/31drawsitsoperatingcurrentfromIN, andwillremaindisableduntiltheINpowersupply  
has been established. The device has been constructed to support 3-V, 5-V, or 12-V operation.  
ISENSE, ISET – ISENSE in combination with ISET implements overcurrent sensing for GATE. ISET sets the  
magnitude of the current that generates an overcurrent fault, through a external resistor connected to ISET. An  
internalcurrentsourcedraws50µAfromISET. WithasenseresistorfromINtoISENSE, whichisalsoconnected  
to the drain of the external MOSFET, the voltage on the sense resistor reflects the load current. An overcurrent  
condition is assumed to exist if ISENSE is pulled below ISET.  
PWRGD – PWRGD signals the presence of undervoltage conditions on VSENSE. The pin is an open-drain  
output and is pulled low during an undervoltage condition. To minimize erronous PWRGD responses from  
transients on the voltage rail, the voltage sense circuit incorporates a 20-µs deglitch filter. When VSENSE is  
lower than the reference voltage (about 1.23 V), PWRGD will be active low to indicate an undervoltage condition  
on the power-rail voltage.  
TIMER – A capacitor on TIMER sets the time during which the power switch can be in overcurrent before turning  
off. When the overcurrent protection circuits sense an excessive current, a current source is enabled which  
charges the capacitor on TIMER. Once the voltage on TIMER reaches approximately 0.5 V, the circuit-breaker  
latch is set and the power switch is latched off. Power must be recycled or the ENABLE pin must be toggled  
to restart the controller. In high-power or high-temperature applications, a minimum 50-pF capacitor is strongly  
recommended from TIMER to ground, to prevent any false triggering.  
VREG – The VREG pin is the output of an internal low-dropout voltage regulator. This regulator draws current  
from IN. A 0.1-µF ceramic capacitor should be connected between VREG and ground. VREG can be connected  
to IN or to a separated power supply through a low-resistance resistor. However, the voltage on VREG must  
be less than 5.5 V.  
VSENSE – VSENSE can be used to detect undervoltage conditions on external circuitry. If VSENSE senses  
a voltage below approximately 1.23 V, PWRGD is pulled low.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)  
Input voltage range: V  
Output voltage range:  
, V  
, V  
,V  
, V  
. . . . . . . . . . . . . . . –0.3 V to 15 V  
I(IN) I(ISENSE) I(VSENSE) I(ISET) I(ENABLE)  
V
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 30 V  
O(GATE)  
, V  
, V  
, V  
, V  
. . . . . . . –0.3 V to 15V  
O(DISCH) O(PWRGD) O(FAULT) O(VREG) O(TIMER)  
, I  
Sink current range:  
I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 mA to 100 mA  
, I  
GATE DISCH  
I
, I  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 mA to 10 mA  
PWRGD TIMER FAULT  
Operating virtual junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 100°C  
Storage temperature range, T  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: All voltages are respect to DGND.  
DISSIPATION RATING TABLE  
DERATING FACTOR  
T
25°C  
T
A
= 70°C  
T = 85°C  
A
A
PACKAGE  
POWER RATING  
ABOVE T = 25°C  
POWER RATING POWER RATING  
A
PW-14  
D-14  
755 mW  
10.07 mW/°C  
8.18 mW/°C  
302 mW  
245 mW  
151 mW  
123 mW  
613 mW  
recommended operating conditions  
MIN NOM  
MAX  
13  
UNIT  
V
Input voltage, V  
V
, V  
, V  
, V  
3
2.95  
–40  
I
I(IN) I(ISENSE) I(VSENSE) I(ISET)  
VREG voltage, V  
, when VREG is directly connected to IN  
O(VREG)  
5.5  
V
Operating virtual junction temperature, T  
100  
°C  
J
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
electrical characteristics over recommended operating temperature range (–40°C < T < 85°C),  
A
3 V V  
13 V (unless otherwise noted)  
I(IN)  
general  
PARAMETER  
TEST CONDITIONS  
= 5 V (TPS2331),  
MIN  
TYP  
0.5  
75  
MAX  
1
UNIT  
V
V
mA  
I(ENABLE)  
I
I
Input current, IN  
I(IN)  
= 0 V (TPS2330)  
200  
I(ENABLE)  
V
V
= 0 V (TPS2331),  
= 5 V (TPS2330)  
I(ENABLE)  
I(ENABLE)  
Standby current (sum of currents into IN ISENSE and ISET)  
5
µA  
I(stby)  
GATE  
PARAMETER  
TEST CONDITIONS  
MIN  
9
TYP  
11.5  
14.5  
21  
MAX  
UNIT  
V
V
V
V
I(IN)  
V
I(IN)  
V
I(IN)  
= 3 V  
G(GATE_3V)  
I
= 500 nA,  
I(GATE)  
DISCH open  
Gate voltage  
= 4.5 V  
= 10.8 V  
10.5  
16.8  
V
G(GATE_4.5V)  
G(GATE_10.8V)  
Clamping voltage, GATE to  
DISCH  
V
9
10  
50  
10  
14  
75  
12  
20  
V
C(GATE)  
S(GATE)  
3 V V  
13.2 V, 3 V V  
5.5 V,  
5.5 V,  
I(IN)  
I(IN)  
O(VREG)  
O(VREG)  
I
Source current, GATE  
Sink current, GATE  
µA  
µA  
V
= V  
+ 6 V  
I(GATE)  
I(IN)  
3 V V  
13.2 V, 3 V V  
100  
V
= V  
I(GATE)  
I(IN)  
V
I(IN)  
V
I(IN)  
V
I(IN)  
V
I(IN)  
V
I(IN)  
V
I(IN)  
= 3 V  
0.5  
0.6  
1
t
t
Rise time, GATE  
Fall time, GATE  
C
to GND = 1 nF (see Note 2)  
to GND = 1 nF (see Note 2)  
= 4.5 V  
= 10.8 V  
= 3 V  
ms  
ms  
r(GATE)  
g
g
0.1  
0.12  
0.2  
C
= 4.5 V  
= 10.8 V  
f(GATE)  
NOTE 2: Specified, but not production tested.  
TIMER  
PARAMETER  
TEST CONDITIONS  
MIN  
0.4  
35  
1
TYP  
0.5  
50  
MAX  
0.6  
UNIT  
V
V
Threshold voltage, TIMER  
Charge current, TIMER  
Discharge current, TIMER  
OT(TIMER)  
V
V
= 0 V  
= 1 V  
65  
µA  
I(TIMER)  
2.5  
mA  
I(TIMER)  
circuit breaker  
PARAMETER  
Undervoltage voltage, circuit breaker  
Input bias current, I  
TEST CONDITIONS  
MIN  
TYP  
50  
MAX  
60  
UNIT  
mV  
V
R
= 1 kΩ  
40  
IT(CB)  
ISET  
I
0.1  
5
µA  
IB(ISENSE)  
SENSE  
V
V
= 4 V  
= 1 V  
400  
25  
800  
150  
O(GATE)  
Discharge current, GATE  
mA  
O(GATE)  
Propagation (delay) time, comparator inputs to  
gate output  
C
= 50 pF,  
10 mV overdrive,  
C = 50 pF  
O(timer)  
g
t
1.3  
µs  
pd(CB)  
(50% to 10%)  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
electrical characteristics over recommended operating temperature range (–40°C < T < 85°C),  
A
3 V V  
13 V (unless otherwise noted) (continued)  
I(IN)  
ENABLE, active low (TPS2330)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
V
V
High-level input voltage, ENABLE  
Low-level input voltage, ENABLE  
2
IH(ENABLE)  
0.8  
V
IL(ENABLE)  
Input pullup resistance,  
ENABLE  
R
t
See Note 3  
100  
200  
60  
300  
kΩ  
µs  
µs  
I(ENABLE)  
V
increasingabovestopthreshold;100  
I(ENABLE)  
Turnoff delay time, ENABLE  
Turnon delay time, ENABLE  
d_off(ENABLE)  
ns rise time, 20 mV overdrive (see Note 2)  
V
decreasing below start threshold;  
I(ENABLE)  
t
125  
d_on(ENABLE)  
100 ns fall time, 20 mV overdrive (see Note 2)  
NOTES: 2. Specified, but not production tested.  
3. Test I of ENABLE at V  
1 V  
= 1 V and 0 V, then R =  
I(ENABLE)  
O
I(ENABLE)  
I
I
0V  
1V  
O_  
O_  
ENABLE, active high (TPS2331)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
V
V
V
High-level input voltage, ENABLE  
2
IH(ENABLE)  
Low-level input voltage, ENABLE  
0.7  
V
IL(ENABLE)  
Input pulldown resistance,  
ENABLE  
R
100  
150  
85  
300  
kΩ  
µs  
µs  
I(ENABLE)  
V
increasing above start threshold;  
I(ENABLE)  
100 ns rise time, 20 mV overdrive (see Note 2)  
t
t
Turnon delay time, ENABLE  
Turnoff delay time, ENABLE  
d_on(ENABLE)  
V
decreasing below stop threshold;  
I(ENABLE)  
100  
d_off(ENABLE)  
100 ns fall time, 20 mV overdrive (see Note 2)  
NOTE 2: Specified, but not production tested.  
PREREG  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
5.5  
UNIT  
V
VREG  
PREREG output voltage  
PREREG dropout voltage  
4.5 V  
13 V  
3.5  
4.1  
I(IN)  
= 3 V  
Vdrop_PREREG  
V
I(IN)  
0.1  
V
VREG UVLO  
PARAMETER  
TEST CONDITIONS  
MIN  
2.75  
2.65  
50  
TYP  
2.85  
2.78  
75  
MAX  
UNIT  
V
V
V
V
Output threshold voltage, start  
Output threshold voltage, stop  
Hysteresis  
2.95  
OT(UVLOstart)  
OT(UVLOstop)  
hys(UVLO)  
V
mV  
mA  
UVLO sink current, GATE  
V
= 2 V  
10  
I(GATE)  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
electrical characteristics over recommended operating temperature range (–40°C < T < 85°C),  
A
3 V V  
13 V, 3 V V  
5.5 V (unless otherwise noted) (continued)  
I(IN1)  
I(IN2)  
PWRGD  
PARAMETER  
TEST CONDITIONS  
decreasing  
I(VSENSE)  
MIN  
TYP  
MAX  
UNIT  
V
V
Trip threshold, VSENSE  
V
1.2 1.225  
1.25  
V
IT(ISENSE)  
Hysteresis voltage, power-good  
comparator  
20  
30  
40  
mV  
hys  
V
V
Output saturation voltage PWRGD  
I
I
= 2 mA  
0.2  
0.4  
1
V
V
O(sat)(PWRGD)  
O
Minimum V  
O(VREG)  
for valid power-good  
= 100 µA, V  
= 1 V  
O(PWRGD)  
O(VREGmin)  
O
I
Input bias current, power-good comparator  
Leakage current, PWRGD  
V
V
V
= 5.5 V  
1
µA  
µA  
IB  
I(VSENSE)  
O(PWRGD)  
I(VSENSE)  
I
= 13 V  
1
lkg(PWRGD)  
increasing,  
t
t
Delay time, rising edge, PWRGD  
Delay time, falling edge, PWRGD  
Overdrive = 20 mV, t = 100 ns,  
25  
2
µs  
µs  
dr  
r
See Note 2  
V
decreasing,  
I(VSENSE)  
Overdrive = 20 mV, t = 100 ns,  
r
df  
See Note 2  
NOTE 2: Specified, but not production tested.  
FAULT output  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
0.4  
1
UNIT  
V
V
Output saturation voltage, FAULT  
Leakage current, FAULT  
I
= 2 mA  
O(sat)(FAULT)  
O
I
V
= 13 V  
µA  
lkg(FAULT)  
O(FAULT)  
DISCH  
PARAMETER  
TEST CONDITIONS  
= 1.5 V, V = 5 V  
MIN  
5
TYP  
MAX  
UNIT  
mA  
V
I
Discharge current, DISCH  
V
10  
DISCH  
I(DISCH)  
I(VIN)  
V
Discharge on high-level input voltage  
Discharge on low-level input voltage  
2
IH(DISCH)  
IL(DISCH)  
V
1
V
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
PARAMETER MEASUREMENT INFORMATION  
Load 12 Ω  
Load 12 Ω  
V
I(ENABLE)  
5 V/div  
V
I(ENABLE)  
5 V/div  
V
O(GATE)  
10 V/div  
V
O(DISCH)  
5 V/div  
V
O(GATE)  
10 V/div  
V
O(DISCH)  
5 V/div  
t – Time – 10 ms/div  
t – Time – 10 ms/div  
Figure 1. Turnon Voltage Transition  
Figure 2. Turnoff Voltage Transition  
No Capacitor  
on Timer  
V
V
I(ENABLE)  
I(ENABLE)  
5 V/div  
5 V/div  
No Capacitor  
on Timer  
V
O(GATE)  
10 V/div  
V
O(GATE)  
10 V/div  
V
O(FAULT)  
10 V/div  
V
O(FAULT)  
10 V/div  
I
I
O(OUT)  
2 A/div  
O(OUT)  
2 A/div  
t – Time – 1 ms/div  
t – Time – 5 ms/div  
Figure 4. Overcurrent Response: an Overcurrent  
Load Plugged Into the Enabled Board  
Figure 3. Overcurrent Response: Enabled  
Into Overcurrent Load  
8
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SINGLE HOT SWAP POWER CONTROLLER WITH  
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SLVS277A – MARCH 2000– REVISED APRIL 2000  
PARAMETER MEASUREMENT INFORMATION  
No Capacitor  
on Timer  
No Capacitor  
on Timer  
V
I(ENABLE)  
5 V/div  
V
I(IN)  
10 V/div  
V
V
O(GATE)  
10 V/div  
O(GATE)  
10 V/div  
V
O(FAULT)  
10 V/div  
V
O(OUT)  
10 V/div  
I
O(IN)  
2 A/div  
I
O(OUT)  
1 A/div  
t – Time – 1 ms/div  
t – Time – 5 ms/div  
Figure 5. Enabled Into Short Circuit  
Figure 6. Hot Plug  
V
No Capacitor  
on Timer  
I(IN)  
10 V/div  
V
O(GATE)  
10 V/div  
V
O(OUT)  
10 V/div  
I
O(OUT)  
1 A/div  
t – Time – 1 ms/div  
Figure 7. Hot Removal  
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SLVS277A – MARCH 2000– REVISED APRIL 2000  
TYPICAL CHARACTERISTICS  
SUPPLY CURRENT (ENABLED)  
SUPPLY CURRENT (DISABLED)  
vs  
vs  
VOLTAGE  
VOLTAGE  
52  
51  
50  
49  
15  
14  
13  
12  
11  
10  
9
T
= 85°C  
A
IN = 5 V to 13 V  
IN = 5 V to 13 V  
T
= 85°C  
A
T
A
= 25°C  
T
A
= 25°C  
T
= –40°C  
A
T
A
= 0°C  
48  
47  
46  
45  
T
A
= 0°C  
T
A
= –40°C  
8
7
44  
43  
4
5
6
7
8
9
10 11 12 13 14  
4
5
6
7
8
9
10 11 12 13 14  
V – Input Voltage – V  
I
V – Input Voltage – V  
I
Figure 9  
Figure 8  
GATE VOLTAGE  
vs  
INPUT VOLTAGE  
GATE VOLTAGE RISE TIME  
vs  
GATE LOAD CAPACITANCE  
22  
20  
18  
18  
C
= 1000 pF  
L(GATE)  
IN = 12 V  
T
= 85°C  
A
T
= 25°C  
A
T
A
= 25°C  
15  
12  
T
A
= 0°C  
T
A
= –40°C  
16  
14  
9
6
12  
10  
3
0
2
3
4
5
6
7
8
9
10 11 12  
0
3
6
9
12  
V – Input Voltage – V  
I
C
– GATE Load Capacitance – nF  
L(GATE)  
Figure 10  
Figure 11  
10  
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SINGLE HOT SWAP POWER CONTROLLER WITH  
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SLVS277A – MARCH 2000– REVISED APRIL 2000  
TYPICAL CHARACTERISTICS  
GATE VOLTAGE FALL TIME  
GATE OUTPUT CURRENT  
vs  
vs  
GATE LOAD CAPACITANCE  
GATE VOLTAGE  
4
3
2
15  
14.5  
14  
IN = 12 V  
= 25°C  
T
A
T
A
= –40°C  
T
= 85°C  
A
13.5  
13  
T
A
= 25°C  
T
= 0°C  
A
12.5  
12  
1
0
IN = 13 V  
11.5  
11  
0
3
6
9
12  
14 15 16 17 18 19 20 21 22 23 24  
V – GATE Voltage  
C
– GATE Load Capacitance – nF  
L(GATE)  
Figure 12  
Figure 13  
CIRCUIT-BREAKER RESPONSE  
LOAD VOLTAGE DISCHARGE TIME  
vs  
vs  
TIMER CAPACITANCE  
LOAD CAPACITANCE  
12  
9
320  
280  
240  
200  
160  
120  
80  
IN = 12 V  
IN = 12 V  
T
A
= 25°C  
I
T
= 0 A  
= 25°C  
O
A
6
3
0
40  
0
0
0.2  
0.4  
0.6  
0.8  
1
0
100  
200  
300  
400  
500  
C
– TIMER Capacitance – nF  
(timer)  
C
– Load Capacitance – µF  
L
Figure 14  
Figure 15  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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SINGLE HOT SWAP POWER CONTROLLER WITH  
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SLVS277A – MARCH 2000– REVISED APRIL 2000  
TYPICAL CHARACTERISTICS  
UVLO START AND STOP THRESHOLDS  
PWRGD THRESHOLD  
vs  
vs  
TEMPERATURE  
TEMPERATURE  
2.9  
2.88  
2.86  
2.84  
2.82  
2.8  
1.27  
1.26  
Up  
Start  
Stop  
1.25  
1.24  
1.23  
1.22  
Down  
2.78  
2.76  
2.74  
1.21  
1.20  
2.72  
2.7  
–45–35–25–15 –5  
5
15 25 35 45 55 65 75 85 95  
–4535–25 –15 –5 5 15 25 35 45 55 65 75 85 95  
T
A
– Temperature – °C  
T
A
– Temperature – °C  
Figure 17  
Figure 16  
12  
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TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
APPLICATION INFORMATION  
typical application diagram  
This diagram shows a typical dual hot-swap application. The pullup resistors at PWRGD and Fault should be  
relatively large (e.g. 100 k) to reduce power loss unless they are required to drive a large load.  
System  
3 V 13 V IN  
Board  
R
SENSE  
V
O
1 µF 10 µF  
+
R
R
VSENSE_TOP  
R
ISET  
VSENSE_BOTTOM  
0.1 µF  
VREG IN ISET ISENSE GATE DISCH VSENSE  
ENABLE  
ENABLE  
DGND  
FAULT  
FAULT  
TPS2331  
PWRGD  
PWRGD  
AGND  
TIMER  
Figure 18. Typical Hot-Swap Application  
input capacitor  
A 0.1-µF ceramic capacitor in parallel with a 1-µF ceramic capacitor should be placed on the input power  
terminals near the connector on the hot-plug board to help stabilize the voltage rails on the cards. The  
TPS2330/31 does not need to be mounted near the connector or these input capacitors. For applications with  
more severe power environments, a 2.2-µF or higher ceramic capacitor is recommended near the input  
terminals of the hot-plug board. A bypass capacitor for IN should be placed close to the device.  
output capacitor  
A 0.1-µF ceramic capacitor is recommended per load on the TPS2330/31; these capacitors should be placed  
close to the external FETs and to TPS2330/31. A larger bulk capacitor on the load is also recommended. The  
value of the bulk capacitor should be selected based on the power requirements and the transients generated  
by the application.  
external FET  
To deliver power from the input sources to the loads, the controller needs an external N-channel MOSFET. A  
few widely used MOSFETs are shown in Table 1. But many other MOSFETs on the market can also be used  
with TPS23xx in hot-swap systems.  
13  
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TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
APPLICATION INFORMATION  
Table 1. Some Available N-Channel MOSFETs  
CURRENT RANGE  
PART NUMBER  
DESCRIPTION  
MANUFACTURER  
(A)  
IRF7601  
N-channel, r  
N-channel, r  
= 0.035 , 4.6 A, Micro-8  
= 0.040 , 4.6 A, Micro-8  
International Rectifier  
ON Semiconductor  
International Rectifier  
ON Semiconductor  
International Rectifier  
ON Semiconductor  
International Rectifier  
Vishay Dale  
DS(on)  
MTSF3N03HDR2  
IRF7101  
DS(on)  
0 to 2  
Dual N-channel, r  
= 0.1 , 2.3 A, SO-8  
= 0.04 , 5 A, SO-8  
DS(on)  
DS(on)  
MMSF5N02HDR2  
IRF7401  
Dual N-channel, r  
N-channel, r  
N-channel, r  
= 0.022 , 7 A, SO-8  
= 0.025 , 5 A, SO-8  
DS(on)  
MMSF5N02HDR2  
IRF7313  
DS(on)  
2 to 5  
Dual N-channel, r  
DS(on)  
= 0.029 , 5.2 A, SO-8  
SI4410  
N-channel, r  
N-channel, r  
N-channel, r  
= 0.020 , 8 A, SO-8  
= 0.019 , 29 A, d-Pak  
= 0.045 , 14 A, d-Pak  
DS(on)  
DS(on)  
DS(on)  
IRLR3103  
International Rectifier  
International Rectifier  
5 to 10  
IRLR2703  
timer  
For most applications, a minimum capacitance of 50 pF is recommended to prevent false triggering. This  
capacitor should be connected between TIMER and ground. The presence of an overcurrent condition on of  
the TPS2330/31 causes a 50-µA current source to begin charging this capacitor. If the overcurrent condition  
persists until the capacitor has been charged to approximately 0.5 V, the TPS2330/31 will latch off the transistor  
and will pull the FAULT pin low. The timer capacitor can be made as large as desired to provide additional time  
delay before registering a fault condition.  
output-voltage slew-rate control  
When enabled, the TPS2330/TPS2331 controllers supply the gate of an external MOSFET transistor with a  
current of approximately 15 µA. The slew rate of the MOSFET source voltage is thus limited by the gate-to-drain  
capacitance C of the external MOSFET capacitor to a value approximating:  
gd  
15  
C
A
dvs  
dt  
gd  
If a slower slew rate is desired, an additional capacitance can be connected between the gate of the external  
MOSFET and ground.  
VREG capacitor  
The internal voltage regulator connected to VREG requires an external capacitor to ensure stability. A 0.1-µF  
or 0.22-µF ceramic capacitor is recommended.  
14  
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SLVS277A – MARCH 2000– REVISED APRIL 2000  
APPLICATION INFORMATION  
gate drive circuitry  
The TPS2330/TPS2331 includes four separate features associated with each gate-drive terminal:  
A charging current of approximately 15 µA is applied to enable the external MOSFET transistor. This current  
is generated by an internal charge pump that can develop a gate-to-source potential (referenced to DISCH)  
of 9 V–12 V. DISCH must be connected to the external MOSFET source terminal to ensure proper operation  
of this circuitry.  
A discharge current of approximately 75 µA is applied to disable the external MOSFET transistor. Once the  
transistor gate voltage has dropped below approximately 1.5 V, this current is disabled and the UVLO  
discharge driver is enabled instead. This feature allows the part to enter a low-current shutdown mode while  
ensuring that the gate of the external MOSFET transistor remain at a low voltage.  
During a UVLO condition, the gate of the MOSFET transistor is pulled down by an internal PMOS transistor.  
This transistor continues to operate even if the voltage at IN is 0 V. This circuitry also helps hold the external  
MOSFET transistor off when power is suddenly applied to the system.  
During an overcurrent fault condition, the external MOSFET transistor that exhibited an over-current  
condition will be rapidly turned off by an internal pulldown circuit capable of pulling in excess of 400 mA (at  
4 V) from the pin. Once the gate has been pulled below approximately 1.5 V, this driver is disengaged and  
the UVLO driver is enabled instead.  
setting the current-limit circuit-breaker threshold  
The current sensing resistor R  
the channel, and can be calculated by the following equation:  
and the current limit setting resistor R  
determine the current limit of  
ISENSE  
ISET  
–6  
R
50 10  
ISET  
I
LMT  
R
ISENSE  
Typically R  
thejunctionofR  
is usually very small (0.001 to 0.1 ). If the trace and solder-junction resistances between  
ISENSE  
andISENSEandthejunctionofR  
andR  
aregreaterthan10%oftheR  
value used in the calculation above.  
ISENSE  
ISENSE  
ISET ISENSE  
value, then these resistance values should be added to the R  
ISENSE  
Table 2 shows some of the current sense resistors available in the market.  
Table 2. Some Current Sense Resistors  
CURRENT RANGE  
PART NUMBER  
DESCRIPTION  
MANUFACTURER  
(A)  
0 to 1  
1 to 2  
2 to 4  
4 to 6  
6 to 8  
8 to 10  
WSL-1206, 0.05 1%  
WSL-1206, 0.025 1%  
WSL-1206, 0.015 1%  
WSL-2010, 0.010 1%  
WSL-2010, 0.007 1%  
WSR-2, 0.005 1%  
0.05 , 0.25 W, 1% resistor  
0.025 , 0.25 W, 1% resistor  
0.015 , 0.25 W, 1% resistor  
0.010 , 0.5 W, 1% resistor  
0.007 , 0.5 W, 1% resistor  
0.005 , 0.5 W, 1% resistor  
Vishay Dale  
15  
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SLVS277A – MARCH 2000– REVISED APRIL 2000  
APPLICATION INFORMATION  
setting the power-good threshold voltage  
The two feedback resistors R  
resistor divider setting the voltage at the VSENSE pins. VSENSE voltage equals to  
and R  
connected between V and ground form a  
VSENSE_TOP  
VSENSE_BOT O  
V
= V × R /(R + R  
)
VSENSE_BOT  
I(SENSE)  
O
VSENSE_BOT VSENSE_TOP  
Thisvoltageiscomparedtoaninternalvoltagereference(1.225V±2%)todeterminewhethertheoutputvoltage  
level is within a specified tolerance. For example, given a nominal output voltage at V , and defining V  
as the minimum required output voltage, then the feedback resistors are defined by:  
O
O_min  
V
1.225  
1.225  
Start the process by selecting a large standard resistor value for R  
O_min  
R
R
VSENSE_TOP  
VSENSE_BOT  
to reduce power loss. Then  
VSENSE_BOT  
R
than V  
can be calculated by inserting all of the known values into the equation above. When V is lower  
, PWRGD will be low as long as the controller is enabled.  
VSENSE_TOP  
O
O_min  
undervoltage lockout (UVLO)  
The TPS2330/TPS2331 includes an undervoltage lockout (UVLO) feature that monitors the voltage present on  
the VREG pin. This feature will disable the external MOSFET if the voltage on VREG drops below 2.78 V  
(nominal) and will re-enable normal operation when it rises above 2.85 V (nominal). Since VREG is fed from  
IN through a low-dropout voltage regulator, the voltage on VREG will track the voltage on IN within 50 mV. While  
the undervoltage lockout is engaged, GATE is held low by an internal PMOS pulldown transistor, ensuring that  
the external MOSFET transistor remain off at the times, even if the power supply has fallen to 0 V.  
power-up control  
The TPS2330/TPS2331 includes a 500 µs (nominal) startup delay that ensures that internal circuitry has  
sufficient time to start before the device begins turning on the external MOSFETs. This delay is triggered only  
upon the rapid application of power to the circuit. If the power supply ramps up slowly, the undervoltage lockout  
circuitry will provide adequate protection against undervoltage operation.  
3-channel hot-swap application  
Some applications require hot-swap control of up to three voltage rails, but may not explicitly require the sensing  
of the status of the output power on all three of the voltage rails. One such application is device bay, where dv/dt  
control of 3.3 V, 5 V, and 12 V is required. By using TPS2330/TPS2331 to drive all three power rails, as is shown  
below, TPS2330/31 can deliver three different voltages to three loads while monitoring the status of one of the  
loads.  
16  
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SLVS277A – MARCH 2000– REVISED APRIL 2000  
APPLICATION INFORMATION  
System  
Board  
V
3.3 V IN2  
O2  
1 µF 10 µF  
+
R
g2  
R
g3  
V
V
5 V IN3  
O3  
1 µF 10 µF  
1 µF 10 µF  
+
+
R
SENSE  
12 V IN1  
O1  
R
R
VSENSE_TOP  
R
ISET  
VSENSE_BOTTOM  
R
g1  
0.1 µF  
V
IN ISET ISENSE GATE DISCH VSENSE  
reg  
ENABLE  
ENABLE  
DGND  
FAULT  
FAULT  
PWRGD  
PWRGD  
TPS2331  
AGND  
TIMER  
Figure 19. Three-Channel Application  
Figure 29 shows ramp-up waveforms of the three output voltages.  
V
O1  
V
V
O3  
O2  
t – Time – 2.5 ms/div  
Figure 20  
17  
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TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
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SLVS277A – MARCH 2000– REVISED APRIL 2000  
MECHANICAL DATA  
D (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0.050 (1,27)  
0.020 (0,51)  
0.010 (0,25)  
M
0.014 (0,35)  
14  
8
0.008 (0,20) NOM  
0.244 (6,20)  
0.228 (5,80)  
0.157 (4,00)  
0.150 (3,81)  
Gage Plane  
0.010 (0,25)  
1
7
0°8°  
0.044 (1,12)  
A
0.016 (0,40)  
Seating Plane  
0.004 (0,10)  
0.010 (0,25)  
0.004 (0,10)  
0.069 (1,75) MAX  
PINS **  
8
14  
16  
DIM  
0.197  
(5,00)  
0.344  
(8,75)  
0.394  
(10,00)  
A MAX  
0.189  
(4,80)  
0.337  
(8,55)  
0.386  
(9,80)  
A MIN  
4040047/D 10/96  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).  
D. Falls within JEDEC MS-012  
18  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPS2330, TPS2331  
SINGLE HOT SWAP POWER CONTROLLER WITH  
CIRCUIT BREAKER AND POWER-GOOD REPORTING  
SLVS277A – MARCH 2000– REVISED APRIL 2000  
MECHANICAL DATA  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
7,70  
9,80  
9,60  
A MAX  
A MIN  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
19  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
Customers are responsible for their applications using TI components.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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