TPS2514AQDBVRQ1 [TI]

TPS2514A-Q1 USB 专用充电端口控制器 | DBV | 6 | -40 to 125;
TPS2514AQDBVRQ1
型号: TPS2514AQDBVRQ1
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

TPS2514A-Q1 USB 专用充电端口控制器 | DBV | 6 | -40 to 125

控制器 光电二极管
文件: 总23页 (文件大小:1401K)
中文:  中文翻译
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TPS2513A-Q1, TPS2514A-Q1  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
TPS2513A-Q1TPS2514A-Q1 USB 专用充电端口控制器  
1 特性  
3 说明  
1
符合 AEC-Q100 标准:  
TPS2513A-Q1 TPS2514A-Q1 USB 专用充电端  
(DCP) 控制器,用于为大多数常见手机和平板电脑  
充电。 一个自动检测特性监控 USB 数据线路电压,并  
在数据线路上自动提供正确的电气特征,以便在下列专  
用充电系统配置中为兼容器件充电:  
器件人体模型 (HBM) 静电放电 (ESD) 分类等级  
H2  
器件充电器件模型 (CDM) ESD 分类等级 C5  
自动选择充电模式  
D+ D- 分压器模式 2.7V 2.7V  
D+ D- 1.2V 模式  
1. 分压器 3 模式,需要分别在 D+ D- 线路上施加  
2.7V 2.7V 电压。  
依照 USB 电池充电技术规格,修订版本 1.2  
(BC1.2) D+ D- 短接模式  
2. BC1.2 短接模式,需要将 D+ 线路短接至 D- 线  
路。  
工作电压范围:4.5V 5.5V  
3. 1.2V 模式,需要在 D+ D- 线路上施加 1.2V 电  
双路 USB 充电端口控制器,  
TPS2513A-Q1  
单路 USB 充电端口控制器,  
TPS2514A-Q1  
搭配使用 TPS2561A-Q1 TPS2513A-Q1(双通  
道)、TPS2557-Q1 TPS2514A-Q1(单通道)可提  
供一套低损耗的汽车级 USB 充电端口解决方案,该解  
决方案能够为目前所有常见的手机和平板电脑充电。  
采用小外形尺寸晶体管 (SOT)23-6 封装  
2 应用范围  
中的封装尺寸(标称值)值  
器件信息 (1)  
车辆 USB 电源充电器  
汽车充电器  
部件号  
封装  
封装尺寸(标称值)  
TPS2513A-Q1  
TPS2514A-Q1  
SOT-23 (6)  
2.90mm x 1.60mm  
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。  
4 简化应用示意图  
USB  
Connector1  
5VOUT  
0.1­F  
VBUS  
OUT1  
OUT2  
IN  
IN  
D-  
D+  
100kŸ  
100kŸ  
TPS2561A-Q1  
RILIM  
GND  
FAULT2  
ILIM  
CUSB  
FAULT1  
EN1  
EN2  
Control Signal  
Control Signal  
DC to DC  
Controller or  
Converter  
(LM25117-Q1,  
TPS40170-Q1  
GND  
PowerPad  
USB  
Connector2  
VBUS  
COUT  
VIN  
DM1  
DP1  
D-  
D+  
TPS2513A-Q1  
DM2  
GND  
GND  
DP2  
CUSB  
典型应用诸如双端口车辆 USB 充电端口解决方案的 USB 专用充电端口控制器  
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.  
English Data Sheet: SLVSCC8  
 
 
 
 
 
 
 
 
TPS2513A-Q1, TPS2514A-Q1  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
www.ti.com.cn  
目录  
8.3 Feature Description................................................... 9  
8.4 Device Functional Modes........................................ 11  
Applications and Implementation ...................... 12  
9.1 Application Information............................................ 12  
9.2 Typical Application .................................................. 12  
1
2
3
4
5
6
7
特性.......................................................................... 1  
应用范围................................................................... 1  
说明.......................................................................... 1  
简化应用示意图........................................................ 1  
修订历史记录 ........................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
7.1 Absolute Maximum Ratings ...................................... 4  
7.2 ESD Ratings.............................................................. 4  
7.3 Recommended Operating Conditions....................... 4  
7.4 Thermal Information.................................................. 4  
7.5 Electrical Characteristics........................................... 5  
7.6 Typical Characteristics.............................................. 6  
Detailed Description .............................................. 7  
8.1 Overview ................................................................... 7  
8.2 Functional Block Diagram ......................................... 8  
9
10 Power Supply Recommendations ..................... 13  
11 Layout................................................................... 14  
11.1 Layout Guidelines ................................................. 14  
11.2 Layout Example .................................................... 14  
12 器件和文档支持 ..................................................... 15  
12.1 相关链接................................................................ 15  
12.2 ....................................................................... 15  
12.3 静电放电警告......................................................... 15  
12.4 术语表 ................................................................... 15  
13 机械封装和可订购信息 .......................................... 15  
8
5 修订历史记录  
Changes from Original (May 2014) to Revision A  
Page  
已将 TPA2514A-Q1 器件添加至数据表 ................................................................................................................................. 1  
已将特性从:双路 USB 端口控制器更改为:双路 USB 充电端口控制器,TPS2513A-Q1 ................................................... 1  
已添加特性单路 USB 充电端口控制器,TPS2514A-Q1”....................................................................................................... 1  
已将说明部分的文本从:利用 TPS2561A-Q1 可提供一套低损耗、..” 更改为:搭配使用 TPS2561A-Q1 与  
TPS2513A-Q1(双通道)、TPS2557-Q1 TPS2514A-Q1(单通道)可提供一套低损耗、..” ........................................... 1  
已更改器件信息................................................................................................................................................................... 1  
Added the TPS2514A-Q1 pin out image and table ................................................................................................................ 3  
Changed the Handling Ratings table to the ESD Ratings table............................................................................................. 4  
Added Figure 5 ...................................................................................................................................................................... 8  
Changed list item in Layout Guidelines "When USB power switch is used,.."..................................................................... 14  
Changed list item in Layout Guidelines "Regarding TPS2561A-Q1 layout guidelines,.." .................................................... 14  
2
Copyright © 2014, Texas Instruments Incorporated  
 
TPS2513A-Q1, TPS2514A-Q1  
www.ti.com.cn  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
6 Pin Configuration and Functions  
TPS2513A-Q1  
DBV (SOT23-6)  
(TOP VIEW)  
TPS2514A-Q1  
DBV (SOT23-6)  
(TOP VIEW)  
DP1  
GND  
DP2  
DM1  
IN  
6
5
1
2
3
DP1  
DM1  
IN  
6
5
1
2
3
GND  
N/C  
4
DM2  
4
N/C  
Pin Functions, TPS2513A-Q1  
NO.  
NAME TYPE(1)  
DESCRIPTION  
1
DP1  
I/O  
Connected to the D+ line of USB connector, provide the correct voltage with attached portable equipment for  
DCP detection.  
2
3
GND  
DP2  
G
Ground connection  
I/O  
Connected to the D+ line of USB connector, provide the correct voltage with attached portable equipment for  
DCP detection.  
4
5
6
DM2  
IN  
I/O  
P
Connected to the D– line of USB connector, provide the correct voltage with attached portable equipment for  
DCP detection.  
Power supply. Connect a ceramic capacitor with a value of 0.1-μF or greater from the IN pin to GND as close  
to the device as possible.  
DM1  
I/O  
Connected to the D– line of USB connector, provide the correct voltage with attached portable equipment for  
DCP detection.  
(1) G = Ground, I = Input, O = Output, P = Power  
Pin Functions, TPS2514A-Q1  
NO.  
NAME TYPE(1)  
DESCRIPTION  
1
DP1  
I/O  
Connected to the D+ line of USB connector, provide the correct voltage with attached portable equipment for  
DCP detection.  
2
3
4
5
GND  
N/C  
N/C  
IN  
G
Ground connection  
No connect pin, can be grounded or left floating.  
No connect pin, can be grounded or left floating  
P
Power supply. Connect a ceramic capacitor with a value of 0.1-μF or greater from the IN pin to GND as close  
to the device as possible.  
6
DM1  
I/O  
Connected to the D– line of USB connector, provide the correct voltage with attached portable equipment for  
DCP detection.  
(1) G = Ground, I = Input, O = Output, P = Power  
Copyright © 2014, Texas Instruments Incorporated  
3
TPS2513A-Q1, TPS2514A-Q1  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
www.ti.com.cn  
7 Specifications  
7.1 Absolute Maximum Ratings(1)  
Over recommended junction temperature range, voltages are referenced to GND (unless otherwise noted)  
MIN  
MAX  
UNIT  
IN  
–0.3  
–0.3  
–0.3  
7
5.8  
5.8  
35  
Voltage range  
DP1, DP2 output voltage, DM1, DM2 output voltage  
DP1, DP2 input voltage, DM1, DM2 input voltage  
DP1, DP2 input current, DM1, DM2 input current  
DP1, DP2 output current, DM1, DM2 output current  
V
Continuous output sink current  
Continuous output source current  
Operating Junction Temperature, TJ  
Storage temperature range, Tstg  
mA  
mA  
°C  
35  
–40  
–65  
125  
150  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
7.2 ESD Ratings  
VALUE  
±2000  
±750  
UNIT  
Human-body model (HBM), per AEC Q100-002(1)  
Charged-device model (CDM), per AEC Q100-011  
V(ESD)  
Electrostatic discharge  
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.  
7.3 Recommended Operating Conditions  
Voltages are referenced to GND (unless otherwise noted), positive current are into pins.  
MIN  
MAX  
5.5  
UNIT  
V
VIN  
Input voltage of IN  
4.5  
0
V(DP1)  
V(DM1)  
I(DP1)  
I(DM1)  
VDP2  
V(DM2)  
I(DP2)  
I(DM2)  
TJ  
DP1 data line input voltage  
DM1 data line input voltage  
Continuous sink or source current  
Continuous sink or source current  
DP2 data line input voltage  
DM2 data line input voltage  
Continuous sink or source current  
Continuous sink or source current  
Operating junction temperature  
5.5  
V
0
5.5  
V
±10  
±10  
5.5  
mA  
mA  
V
0
0
5.5  
V
±10  
±10  
125  
mA  
mA  
°C  
–40  
7.4 Thermal Information  
THERMAL METRIC(1)  
DBV (6 PINS)  
179.9  
117.5  
41.9  
UNITS  
RθJA  
RθJCtop  
RθJB  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
17.2  
ψJB  
41.5  
RθJCbot  
N/A  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
4
Copyright © 2014, Texas Instruments Incorporated  
TPS2513A-Q1, TPS2514A-Q1  
www.ti.com.cn  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
7.5 Electrical Characteristics  
Conditions are –40°C (TJ = TA) 125°C, 4.5 V VIN 5.5 V. Positive current are into pins. Typical values are at 25°C. All  
voltages are with respect to GND (unless otherwise noted).  
PARAMETER  
UNDERVOLTAGE LOCKOUT  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VUVLO  
IN rising UVLO threshold voltage  
Hysteresis(1)  
3.9  
4.1  
4.3  
V
100  
mV  
SUPPLY CURRENT  
IIN  
IN supply current  
4.5 V V IN 5.5 V  
155  
220  
µA  
BC 1.2 DCP MODE (SHORT MODE)  
R(DPM_SHORT1) DP1 and DM1 shorting resistance  
R(DCHG_SHORT1)  
VDP1 = 0.8 V, IDM1 = 1 mA  
VDP1 = 0.8 V  
157  
656  
200  
Ω
Resistance between DP1/DM1 and GND  
350  
310  
1150  
kΩ  
Voltage threshold on DP1 under which the  
device goes back to divider mode  
V(DPL_TH_DETACH1)  
330  
350  
mV  
V(DPL_TH_DETACH_HYS1) Hysteresis(1)  
R(DPM_SHORT2) DP2 and DM2 shorting resistance  
R(DCHG_SHORT2)  
50  
157  
656  
mV  
Ω
VDP2 = 0.8V, IDM2 = 1 mA  
VDP2 = 0.8 V  
200  
Resistance between DP2/DM2 and GND  
350  
310  
1150  
kΩ  
Voltage threshold on DP2 under which the  
device goes back to divider mode  
V(DPL_TH_DETACH2)  
330  
50  
350  
mV  
mV  
V(DPL_TH_DETACH_HYS2) Hysteresis(1)  
DIVIDER MODE  
V(DP1_2.7V)  
DP1 output voltage  
VIN = 5 V  
2.57  
2.57  
24  
2.7  
2.7  
30  
2.84  
2.84  
36  
V
V
V(DM1_2.7V)  
R(DP1_PAD1)  
R(DM1_PAD1)  
V(DP2_2.7V)  
DM1 output voltage  
VIN = 5 V  
DP1 output impedance  
DM1 output impedance  
DP2 output voltage  
IDP1 = –5 µA  
IDM1 = –5 µA  
VIN = 5 V  
kΩ  
kΩ  
V
24  
30  
36  
2.57  
2.57  
24  
2.7  
2.7  
30  
2.84  
2.84  
36  
V(DM2_2.7V)  
R(DP2_PAD1)  
R(DM2_PAD1)  
1.2 V / 1.2 V MODE  
V(DP1_1.2V)  
DM2 output voltage  
VIN = 5 V  
V
DP2 output impedance  
DM2 output impedance  
IDP2 = –5 µA  
IDM2 = –5 µA  
kΩ  
kΩ  
24  
30  
36  
DP1 output voltage  
VIN = 5 V  
1.12  
1.12  
80  
1.2  
1.2  
1.28  
1.28  
130  
130  
1.28  
1.28  
130  
130  
V
V
V(DM1_1.2V)  
R(DM1_PAD2)  
R(DP1_PAD2)  
V(DP2_1.2V)  
DM1 output voltage  
DP1 output impedance  
DM1 output impedance  
DP2 output voltage  
VIN = 5 V  
IDP1 = –5 µA  
IDM1 = –5 µA  
VIN = 5 V  
102  
102  
1.2  
kΩ  
kΩ  
V
80  
1.12  
1.12  
80  
V(DM2_1.2V)  
R(DP2_PAD2)  
R(DM2_PAD2)  
DM2 output voltage  
DP2 output impedance  
DM2 output impedance  
VIN = 5 V  
1.2  
V
IDP2 = –5 µA  
IDM2 = –5 µA  
102  
102  
kΩ  
kΩ  
80  
(1) Parameters provided for reference only, and do not constitute part of TI's published device specifications for purposes of TI's product  
warranty  
Copyright © 2014, Texas Instruments Incorporated  
5
TPS2513A-Q1, TPS2514A-Q1  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
www.ti.com.cn  
7.6 Typical Characteristics  
3.2  
3.2  
2.8  
2.4  
2.0  
1.6  
2.8  
2.4  
2.0  
1.6  
DP1  
DM1  
DP2  
DM2  
±40 ±20  
0
20  
40  
60  
80  
100 120 140  
±40 ±20  
0
20  
40  
60  
80  
100 120 140  
Junction Temperature (ƒC)  
C005  
Junction Temperature (ƒC)  
C006  
VIN = 5 V  
VIN = 5 V  
Figure 1. DP1 and DM1 Output Voltage vs Temperature  
Figure 2. DP2 and DM2 Output Voltage vs Temperature  
180  
170  
160  
150  
140  
130  
±40 ±20  
0
20  
40  
60  
80  
100 120 140  
Junction Temperature (ƒC)  
C007  
VIN = 5 V  
Figure 3. Supply Current vs Temperature  
6
Copyright © 2014, Texas Instruments Incorporated  
TPS2513A-Q1, TPS2514A-Q1  
www.ti.com.cn  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
8 Detailed Description  
8.1 Overview  
TPS2513A-Q1 and TPS2514A-Q1 are dedicated charging port controllers, used for the charging of most popular  
mobile phones and tablets.  
The following overview references various industry standards. It is always recommended to consult the latest  
standard to ensure the most recent and accurate information.  
Rechargeable portable equipment requires an external power source to charge its batteries. USB ports are  
convenient locations for charging because of an available 5-V power source. Universally accepted standards are  
required to ensure host and client-side devices meet the power management requirements. Traditionally, USB  
host ports following the USB 2.0 Specification must provide at least 500 mA to downstream client-side devices.  
Because multiple USB devices can be attached to a single USB port through a bus-powered hub, it is the  
responsibility of the client-side device to negotiate the power allotment from the host to guarantee the total  
current draw does not exceed 500 mA. In general, each USB device can subsequently request more current,  
which is granted in steps of 100 mA up 500 mA total. The host may grant or deny the request based on the  
available current.  
Additionally, the success of the USB technology makes the micro-USB connector a popular choice for wall  
adapter cables. This allows a portable device to charge from both a wall adapter and USB port with only one  
connector.  
One common difficulty has resulted from this. As USB charging has gained popularity, the 500-mA minimum  
defined by the USB 2.0 Specification or 900 mA defined in the USB 3.0 Specification, has become insufficient for  
many handsets, tablets and personal media players (PMP) which have a higher rated charging current. Wall  
adapters and car chargers can provide much more current than 500 mA or 900 mA to fast charge portable  
devices. Several new standards have been introduced defining protocol handshaking methods that allow host  
and client devices to acknowledge and draw additional current beyond the 500 mA (defined in the USB 2.0  
Specification) or 900 mA (defined in the USB 3.0 Specification) minimum while using a single micro-USB input  
connector.  
Copyright © 2014, Texas Instruments Incorporated  
7
TPS2513A-Q1, TPS2514A-Q1  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
www.ti.com.cn  
8.2 Functional Block Diagram  
S1  
DM1  
S2  
IN  
Auto-detect  
S4  
DP1  
S3  
2.7V  
2.7V  
1.2V  
UVLO  
S5  
DM2  
DP2  
DRIVER  
S6  
Auto-detect  
S8  
GND  
S7  
2.7V  
2.7V  
1.2V  
Figure 4. TPS2513A-Q1 Functional Block Diagram  
S1  
DM1  
DP1  
S2  
IN  
Auto-detect  
UVLO  
S4  
S3  
2.7V  
2.7V  
1.2V  
DRIVER  
N/C  
N/C  
GND  
Figure 5. TPS2514A-Q1 Functional Block Diagram  
8
Copyright © 2014, Texas Instruments Incorporated  
TPS2513A-Q1, TPS2514A-Q1  
www.ti.com.cn  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
8.3 Feature Description  
8.3.1 BC1.2  
TPS2513A-Q1 and TPS2514A-Q1 support four of the most common protocols:  
USB Battery Charging Specification, Revision 1.2 (BC1.2)  
Chinese Telecommunications Industry Standard YD/T 1591-2009  
Divider Mode  
1.2 V Mode  
YD/T 1591-2009 is a subset of the BC1.2 specification supported by the vast majority of devices that implement  
USB charging. Divider and 1.2-V charging schemes are supported in devices from specific yet popular device  
makers. BC1.2 has three different port types, listed as follows.  
Standard downstream port (SDP)  
Charging downstream port (CDP)  
Dedicated charging port (DCP)  
The BC1.2 Specification defines a charging port as a downstream facing USB port that provides power for  
charging portable equipment.  
Table 1 shows different port operating modes according to the BC1.2 Specification.  
Table 1. Operating Modes Table  
SUPPORTS USB2.0  
COMMUNICATION  
MAXIMUM ALLOWABLE CURRENT  
DRAWN BY PORTABLE EQUIPMENT (A)  
PORT TYPE  
SDP (USB 2.0)  
SDP (USB 3.0)  
CDP  
Yes  
Yes  
Yes  
No  
0.5  
0.9  
1.5  
1.5  
DCP  
The BC1.2 Specification defines the protocol necessary to allow portable equipment to determine what type of  
port it is connected to so that it can allot its maximum allowable current drawn. The hand-shaking process is two  
steps. During step one, the primary detection, the portable equipment outputs a nominal 0.6 V output on its D+  
line and reads the voltage input on its D– line. The portable device concludes it is connected to a SDP if the  
voltage is less than the nominal data detect voltage of 0.3 V. The portable device concludes that it is connected  
to a Charging Port if the D– voltage is greater than the nominal data detect voltage of 0.3V and less than 0.8 V.  
The second step, the secondary detection, is necessary for portable equipment to determine between a CDP and  
a DCP. The portable device outputs a nominal 0.6 V output on its D– line and reads the voltage input on its D+  
line. The portable device concludes it is connected to a CDP if the data line being remains is less than the  
nominal data detect voltage of 0.3 V. The portable device concludes it is connected to a DCP if the data line  
being read is greater than the nominal data detect voltage of 0.3 V and less than 0.8 V.  
8.3.2 Undervoltage Lockout (UVLO)  
The undervoltage lockout (UVLO) circuit disables DP1, DM1, DP2 and DM2 output voltage until the input voltage  
reaches the UVLO turn-on threshold. Built-in hysteresis prevents unwanted oscillations due to input voltage drop  
from large current surges.  
Copyright © 2014, Texas Instruments Incorporated  
9
 
TPS2513A-Q1, TPS2514A-Q1  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
www.ti.com.cn  
8.3.3 DCP Auto-Detect  
TPS2513A-Q1 and TPS2514A-Q1 integrate an auto-detect feature to support Divider 3 mode, shorted mode and  
1.2 V modes. If a divider device is attached, 2.7 V is applied to the DP pin and 2.7 V is applied to the DM pin. If a  
BC1.2-compliant device is attached, the TPS251xA-Q1 automatically switches into shorted mode. If a device  
compliant with the 1.2 V / 1.2 V charging scheme is attached, 1.2 V is applied on both the DP pin and the DM  
pin. The functional diagram of DCP auto-detect feature (DM1 and DP1) is shown in Figure 6. DCP auto-detect  
feature (DM2 and DP2) has the same functional configuration.  
5 V  
VBUS  
Divider 2  
S1, S2: ON  
S3, S4: OFF  
D-  
DM1  
DP1  
S1  
Short Mode  
S4 ON  
D+  
S2  
S4  
S1, S2, S3: OFF  
GND  
S3  
1.2V on DP1 and DM1  
S3, S4: ON  
S1, S2: OFF  
2.7V 2.7V  
1.2 V  
GND  
Figure 6. DCP Auto-Detect Functional Diagram  
10  
Copyright © 2014, Texas Instruments Incorporated  
 
TPS2513A-Q1, TPS2514A-Q1  
www.ti.com.cn  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
8.4 Device Functional Modes  
8.4.1 Shorted Mode  
The USB BC1.2 Specification and the Chinese Telecommunications Industry Standard YD/T 1591-2009 specify  
that the D+ and D– data lines should be shorted together with a maximum series impedance of 200 Ω. This is  
shown in Figure 7.  
VBUS  
5.0 V  
D-  
200 Ÿ (max)D+  
GND  
Figure 7. Shorted Mode  
8.4.2 Divider Mode  
There are three charging schemes for divider mode. They are named after Divider 1, Divider 2, and Divider 3 that  
are shown in Figure 8, Figure 9, and Figure 10. The Divider 1 charging scheme is used for 5-W adapters, and  
applies 2 V to the D+ line and 2.7 V to the D– data line. The Divider 2 charging scheme is used for 10-W  
adapters, and applies 2.7 V on the D+ line and 2 V is applied on the D– line. The Divider 3 charging scheme is  
used for 12-W adapters, and applies 2.7 V on D+ and D- lines. TPS2513A-Q1 and TPS2514A-Q1 only integrate  
Divider 3 charging scheme.  
VBUS  
VBUS  
VBUS  
5.0 V  
5.0 V  
5.0 V  
D-  
D-  
D-  
D+  
D+  
D+  
2.7 V  
2.0 V  
2.7 V  
2.7 V  
2.0 V  
2.7 V  
GND  
GND  
GND  
Figure 8. Divider 1  
8.4.3 1.2 V Mode  
Figure 9. Divider 2  
Figure 10. Divider 3  
As shown in Figure 11, some tablet USB chargers require 1.2 V on the shorted data lines of the USB connector.  
The maximum resistance between the D+ line and the D- line is 200 Ω.  
VBUS  
5.0 V  
D-  
200 Ÿ (max)D+  
1.2 V  
GND  
Figure 11. 1.2 V Mode  
The device is a USB dedicated charging port (DCP) controllers. Applications include vehicle power charger, wall  
adapters with USB DCP and other USB chargers. The device DCP controllers have the auto-detect feature that  
monitors the D+ and D– line voltages of the USB connector, providing the correct electrical signatures on the DP  
and DM pins for the correct detections of compliant portable devices to fast charge. These portable devices  
include smart phones, 5-V tablets and personal media players.  
Copyright © 2014, Texas Instruments Incorporated  
11  
 
 
 
TPS2513A-Q1, TPS2514A-Q1  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
www.ti.com.cn  
9 Applications and Implementation  
9.1 Application Information  
The device is a dual channel USB charging port controller. It can be used for automotive USB charging port to  
support universal charging.  
9.2 Typical Application  
VBUS  
D-  
OUT1  
OUT2  
TPS2561A-Q1  
Power  
D+  
ILIM  
Supply  
GND  
RILIM  
CUSB1  
TPS2513A-Q1  
DP2  
GND  
DP1  
DM2  
IN  
3
2
1
4
5
6
DM1  
VBUS  
D-  
0.1­F  
D+  
CUSB2  
GND  
Figure 12. Typical Application Schematic, Dual Ports Charger  
9.2.1 Design Requirements  
For dual USB ports, request that both ports support fast charge portable device compatible with divider 3, 1.2 V,  
and BC1.2 shorted mode.  
9.2.2 Detailed Design Procedure  
9.2.2.1 USB Power Switch  
Some chargers requests that the USB port have an overcurrent protection when short circuits are encountered,  
TPS2561A-Q1 (SLVSCC6) is recommended.  
The TPS2513A-Q1 divider 3 mode can support a maximum charging current up to 2.4 A.  
When set, the TPS2561A-Q1 current limit (RILIM) should keep each channel current limit above 2.4 A. For the  
correct current limit setting, refer to the TPS2561A-Q1 data sheet.  
12  
Copyright © 2014, Texas Instruments Incorporated  
TPS2513A-Q1, TPS2514A-Q1  
www.ti.com.cn  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
Typical Application (continued)  
9.2.3 Application Curves  
6
5
6
5
VIN  
DP1  
DM1  
4
4
3
3
2
2
1
1
VIN  
0
0
DP1  
DM1  
±1  
±1  
0.000  
0.004  
0.008  
0.00 0.01 0.02 0.03 0.04 0.05  
±0.05 ±0.04 ±0.03 ±0.02 ±0.01  
±0.008  
±0.004  
Time (s)  
Time (s)  
C001  
C002  
Figure 13. Power On (DM1 and DP1)  
Figure 14. Power Off (DM1 and DP1)  
6
5
4
3
2
1
0
6
5
VIN  
DP2  
DM2  
4
3
2
1
VIN  
0
DP2  
DM2  
±1  
±0.008  
±1  
0.000  
0.004  
0.008  
0.00 0.01 0.02 0.03 0.04 0.05  
±0.05 ±0.04 ±0.03 ±0.02 ±0.01  
±0.004  
Time (s)  
Time (s)  
C003  
C004  
Figure 15. Power On (DM2 and DP2)  
Figure 16. Power Off (DM2 and DP2)  
10 Power Supply Recommendations  
The devices only provide the correct electrical signatures on the data line of USB charger port and do not provide  
any power for the VBUS. If a USB power switch is needed as an overcurrent protector, the TPS2561A-Q1  
(SLVSCC6) is recommend.  
Copyright © 2014, Texas Instruments Incorporated  
13  
TPS2513A-Q1, TPS2514A-Q1  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
www.ti.com.cn  
11 Layout  
11.1 Layout Guidelines  
For all applications, a 0.1-µF or greater ceramic bypass capacitor between IN and GND is recommended as  
close to the device as possible for local noise decoupling.  
When USB power switch is used, recommend connect TPS2513A-Q1 and TPS2514A-Q1 IN pin together with  
USB power switch IN pin. For TPS2513A-Q1, Dual channel USB power switch recommend TPS2561A-Q1,  
for TPS2514A-Q1, single channel USB power switch recommend TPS2557-Q1.  
Regarding TPS2561A-Q1 layout guidelines, see the TPS2561A-Q1 data sheet (SLVSCC6). Regarding  
TPS2557-Q1 layout guidelines, see the TPS2557-Q1 data sheet (SLVSC97).  
DP1 and DM1 provide one charging port controller, DP2 and DM2 provide another one charging port  
controller, when routing the trace, need consider the matching between DP and DM.  
11.2 Layout Example  
VIA to Power Ground Plane  
DP2  
DM2  
VBUS2  
Power  
Ground  
FAULT1  
4
5
6
3
10  
9
1
2
3
4
5
TPS2513A-Q1  
2
1
High Frequency  
Bypass Capacitor  
IN  
8
ILIM  
7
DP1  
6
DM1  
FAULT2  
VBUS1  
14  
版权 © 2014, Texas Instruments Incorporated  
TPS2513A-Q1, TPS2514A-Q1  
www.ti.com.cn  
ZHCSCG6A MAY 2014REVISED DECEMBER 2014  
12 器件和文档支持  
12.1 相关链接  
以下表格列出了快速访问链接。 范围包括技术文档、支持与社区资源、工具和软件,并且可以快速访问样片或购买  
链接。  
2. 相关链接  
器件  
产品文件夹  
请单击此处  
请单击此处  
样片与购买  
请单击此处  
请单击此处  
技术文档  
请单击此处  
请单击此处  
工具与软件  
请单击此处  
请单击此处  
支持与社区  
请单击此处  
请单击此处  
TPS2513A-Q1  
TPS2514A-Q1  
12.2 商标  
All trademarks are the property of their respective owners.  
12.3 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
12.4 术语表  
SLYZ022 TI 术语表。  
这份术语表列出并解释术语、首字母缩略词和定义。  
13 机械封装和可订购信息  
以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对  
本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2014, Texas Instruments Incorporated  
15  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TPS2513AQDBVRQ1  
TPS2513AQDBVTQ1  
TPS2514AQDBVRQ1  
TPS2514AQDBVTQ1  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
6
6
6
6
3000 RoHS & Green  
250 RoHS & Green  
3000 RoHS & Green  
250 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
PB6Q  
PB6Q  
SN  
SN  
SN  
ZBAW  
ZBAW  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2020  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS2513AQDBVRQ1  
TPS2513AQDBVTQ1  
TPS2514AQDBVRQ1  
TPS2514AQDBVTQ1  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
6
6
6
6
3000  
250  
178.0  
178.0  
178.0  
178.0  
9.0  
9.0  
9.0  
9.0  
3.23  
3.23  
3.23  
3.23  
3.17  
3.17  
3.17  
3.17  
1.37  
1.37  
1.37  
1.37  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
3000  
250  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
24-Apr-2020  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS2513AQDBVRQ1  
TPS2513AQDBVTQ1  
TPS2514AQDBVRQ1  
TPS2514AQDBVTQ1  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
6
6
6
6
3000  
250  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
180.0  
18.0  
18.0  
18.0  
18.0  
3000  
250  
Pack Materials-Page 2  
PACKAGE OUTLINE  
DBV0006A  
SOT-23 - 1.45 mm max height  
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR  
C
3.0  
2.6  
0.1 C  
1.75  
1.45  
B
1.45 MAX  
A
PIN 1  
INDEX AREA  
1
2
6
5
2X 0.95  
1.9  
3.05  
2.75  
4
3
0.50  
6X  
0.25  
C A B  
0.15  
0.00  
0.2  
(1.1)  
TYP  
0.25  
GAGE PLANE  
0.22  
0.08  
TYP  
8
TYP  
0
0.6  
0.3  
TYP  
SEATING PLANE  
4214840/C 06/2021  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.  
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.  
5. Refernce JEDEC MO-178.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DBV0006A  
SOT-23 - 1.45 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
6X (1.1)  
1
6X (0.6)  
6
SYMM  
5
2
3
2X (0.95)  
4
(R0.05) TYP  
(2.6)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:15X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED METAL  
EXPOSED METAL  
0.07 MIN  
ARROUND  
0.07 MAX  
ARROUND  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4214840/C 06/2021  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DBV0006A  
SOT-23 - 1.45 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
6X (1.1)  
1
6X (0.6)  
6
SYMM  
5
2
3
2X(0.95)  
4
(R0.05) TYP  
(2.6)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
SCALE:15X  
4214840/C 06/2021  
NOTES: (continued)  
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
9. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
重要声明和免责声明  
TI 提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没  
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这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
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将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知  
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TPS2521

TPS2521xx, 2.7 - 5.7 V, 4 A, 31-mΩ True Reverse Current Blocking eFuse with Input Reverse Polarity Protection

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TI

TPS25210A

TPS2521xx, 2.7 - 5.7 V, 4 A, 31-mΩ True Reverse Current Blocking eFuse with Input Reverse Polarity Protection

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TI